· Nov. 3, 1992 (Career) May. 25, 1978 (Pucka) - Career merged Pucka in April 2003

www.careergroups.com

Location of Career

(40 min.)Taipei 101 Mall(35 min.)

Taipei Station

(40 min.)Taoyuan International Airport

East

-Wes

t Exp

ress

National Freeway No.3

Tucheng Interchange

National Freeway No.1

(5 min.)Shulin Train Station

To Taipei

To Hsinchu

(20 min.)Banciao Station

High Speed Rail

Taiwan Railways

(45 min.)Taoyuan Station

Management Philosophy

Company Overview

EstablishedNov. 3, 1992 (Career)May. 25, 1978 (Pucka)- Career merged Pucka in April 2003.- Pucka was the 1st FPC manufacturer

in Taiwan.

LocationTaipei, Taiwan (H.Q.)Kunshan, ChinaSuzhou, ChinaShenzhen, ChinaNorthridge-CA, USAOulu, Finland

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Pad-in CapitalUS$ 107 Million(NT$3,246 Million, Mar. 2012)Stock public listed since 2002

Manpower Taipei 2,042Kunshan 4,272 Suzhou 2,679Shenzhen 1,347Northridge 100Oulu 55

Year

1978

2003

2002

1993

1992

1997

1998

2004

2008

2007

2010

2012

Milestone

Set up Shu-Lin Plant (Taipei).

Set up Hsin-Chuang Plant (Taipei).

Set up Suzhou Plant (China).

Set up Kunshan Plant (China).

Established Career Technology.

Established Pucka Industrial Co., Ltd.

Stock first traded over the counter as publicly-held company.

Career and Pucka was merged.

Complete the Headquarters Building inShu-Lin Tatung Tech. Park, Taipei .

Set up Shenzhen Plant (China).

Approved and listed in TSEC (TW 6153).

Consolidated sales revenue broke the NT$10 billion mark in 2010.

Career 20th Anniversary

Product Development CentreMr. Richard Wu, Sr. Manager Mr. Tony Chuang, Manager Technology R & D CentreMr. James Chang, DirectorProduction Planning CentreMr. Richard Chuo, DirectorTaipei PlantMr. Stanley Lin, DirectorKunshan PlantSuzhou PlantShenzhen Plant

Group Organization

Internal Auditing

Supervisor

President

Mr. Rick Wu

President Office

Directorate

Stockholders

Group Sales Div.Mr. James Tseng,

Sr. V.P.Financial CentreAccountingInvestment ManagementChina Regional Finance

General AffairsInformation TechnologyMaterials SupportHuman ResourceRisk ManagementChina RegionalMaterials SupportChina Regional IT

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Group Financial Div.Ms. Winnie Cheng,

C.F.O.

Group Admin. Div.Ms. Amy Hsu,

Sr. V.P.

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Quality Assurance Quality ControlQuality SystemQuality EngineeringChina Regional Q.A.

Taiwan Regional SalesMs. Sandy Liang, DirectorChina Regional SalesMr.Hans Ko, DirectorMarket DevelopmentMr.C. C. Lee, Director

Group RD & Manufacturing Div.Mr. Will Li, Executive V.P.

Mr. Jake Yeh, Sr. V.P.Mr. Richard Chuo, Director

Mr. Xavier Chiu, Sr. Manager

Q.A. Centre

Digital CameraHandset / Smartphone

LCD / LED Display

Multiplicity of Applications

Notebook & Light Bar

Touch Panel

Storage DeviceGPS & Wireless Power

Auto Tronics Flexible Electronics

Tablet PC / E-Paper

Application Mix

ConsumerElectronics

NB & Tablet Handset &

Smartphone

36%

45%

Others

3%

16%

Kunshan Plant

Suzhou Plant

Product Mix

35%8%

57%

Single Side

Double Side

Multi-layersMulti-layers

27% 25%

Single Side

48%

Double Side

50 27 12 4 93

260 274 192 117 843

247 303 209 56 815

1,485 3,668 2,266 1,170 8,589

2,042 4,272 2,679 1,347 10,340Current

Operator

Function

Management

Admin.

Suzhou Shenzhen Total

Engineering

Taipei Kunshan Site

Educational Level(TPE)

Human Resource

Working Experience(TPE)

Employee Age(TPE)

Master &Doctoral

2%

Senior High& VocationalHigh School

51%

JuniorCollege

15%

University24%

Others9%

below 1 yrs.28%

1~2 yrs.18%

10 yrs. over23%

5~9 yrs.22%

3~4 yrs.9%

30~39 yrs.42%

40 yrs. over19%

20~29 yrs.31%

below 20yrs.8%

Taipei Kunshan Suzhou Shenzhen

Sheet by Sheet ● ● ●

Roll to Roll ● ● ●

Sheet by Sheet ● ● ●

Sheet to Roll ● ● ●

Roll to Roll ● ● ●

● ● ●

● ● ●

● ● ●

● ● ● ●

● ● ● ●

Single Side Double Access

Structure

S/S

D/S

Multi-layers

Backend Process + SMT

Module Assembly

S/S + S/S with Air Gap

Manufacturing Capability

Capacity Allocation

Unit： K M2 / month

100KK pcs / month → 120KK pcs / month(panel size 250×300mm, 40pcs / panel)

Taipei Kunshan Suzhou Subtotal2012

15 19 18 52

Single SideDouble Access

Multi-layers & Others

Structure

Subtotal

Single Side

Double Side

2012 2012 2012

59 81 112 252

7 8 5 20

54 81 9 144

135 189 144 468

Worldwide Service

Manufacturing SiteSales R&D Center

JapanSeoul Northrig, CA

Singapore

HK

Oulu, Finland

Proto, RFIDLarge ScaleArea 4K M2

Quickturn ProtoSmall-Medium

Area 3K M2

Mass ProductionArea 43K M2



Backend ProcessArea 8K M2

XiamenDongguan

Suzhou Kunshan

Shenzhen

25% 75%

20% 80%

20% 80%2013

Taipei ChinaYear

2011

2012

Production Distribution

Group Sales

Amount

Group-wise Quality Assurance

System

Plant

Hazardous Substance Free Management

2006/7/1 Beginning of RoHS 2008/6/27 Beginning of PFOS2009 Q1 Beginning of REACH_ SVHC12009/5/1 Beginning of DMF

‧GP Mutual Database in Three Overseas Plants

‧Set up Environment Resource Section in Group

‧Trends of RoHS Insurance Policy‧Set up Full Material Declaration

System for Suppliers

2013 Q1~

2011 Q1‧Trends of Halogen-free

Factory‧Beginning of REACH_

SVHC4

2011 Q3

2011 Q2

Beginning of REACH_ SVHC5

‧Set up Green Product Management System

‧Beginning of REACH_SVHC6

2012 Q1

‧Green Product Supplier Conference‧Trends of Paperless Documents‧Career GP Guideline / Declaration‧Beginning of REACH_SVHC7

2012 Q2

2012 Q32010 Q2~

2011 Q4 Beginning of RoHS 2.0

‧Beginning of REACH_ SVHC2/3

‧GP Document Check List‧GP Mutual Database in TPE Plant

Trends of GPM with Subcontractor2012 Q4

Set up Hazardous Substance Crosscheck System

Laboratory Category

Reliability Lab.Reliability Lab.

Environment Storage / Shock

Mechanical StrengthElectric Measured

Chemical Resistance

GP/GP/RoHSRoHS Lab.Lab.

(IC) F、Cl、Br、I(ICP) Pb、Cd、Hg

(UV) Cr6+

(XRF)IQC/FQC Control

Failure Analysis Lab. Failure Analysis Lab.

Electric Failure

PCB Pollution of Process

RA Test Failure

Chemical Lab.Chemical Lab.

Chemical Solution Analysis

Copper Thickness Measured

IT Infrastructure

KPI( Key Performance Indicators )

ERP

VOIP(Voice Over IP)

VPN(Virtual Private Network)

TCP / IP DBMS(Database Management System)

Windows2003

PLM HRM KM GPM APS

‧Consolidated sales revenue broke the NT$10 billion mark in 2010.

Consolidated Sales Revenue

US$ Million 14％

FPC FPC+PCB1 Nippon Mektron Japan 2,314 2,314

2 Sumitomo Denko Japan 927 927

3 MFLEX USA 832 832

4 Fujikura Japan 601 601

5 Nitto Denko Japan 546 546

6 Zhen Ding Taiwan 544 1,512

7 Young Poong Group (Interflex) Korea 470 1,204

8 Career Technology Taiwan 390 390

9 SI Flex Korea 344 344

10 Flexium Taiwan 258 258

11 Ichia Taiwan 212 212

12 Flexcom Korea 159 159

13 MFS Singapore 125 125

Rank FPC Maker CountryRevenue ($M)

World TOP 13 FPC Makers in 2011

Performance Ranking

(N.T. Information Ltd, July, 2012)

Competitive Advantage

Experienced Management Team and Efficient Operating Decision

Owning a management team with rich experience and professional knowledge in FPC business more than twenty years. We make decisions efficiently to meet business requirements.We have built effective management systems of material support, technical engineering, production, quality and risk control.

Specialized Production Technology and Capability

We have multiplicity of production application to meet various custoemr requirements.Constantly Cooperate with research institutes to develop advanced technologies.

Respond to Customer’s requirements promptly

Set up worldwide facilities to serve customers locally.Build global logistic management system to save customers’ time of procurement. Keep long-term partnerships with alliance suppliers for acquisition of key materials.

Competitive Advantage

Solid Financial Strength and Good Risk Management

Maintaining a lower debit ratio.Simplify capital structure.Focus on our core business (FPC).

Pay Attention to Green Management and Provide Customers with Environmental Friendly Products

Establish a green supplier management platform and work together with our suppliers and customers to comply with the environmental protection rules.Promote aggressively various waste reduction, recycle and energy saving projects to improve efficiency in resource utilization and reduce pollution.

Technical CapabilityReliability

Material Spec.

General Special General Special General SpecialCoverlay ± 0.20mm ± 0.10mm ± 0.20mm ± 0.10mm ± 0.20mm ± 0.10mmStiffener ± 0.15mm ± 0.05mm ± 0.05mm ± 0.05mm ± 0.05mm ± 0.05mmCircuit ± 0.05mm ± 0.04mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm

LPI ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.30mm ± 0.20mm ± 0.30mm ± 0.20mm ± 0.30mm ± 0.20mm± 0.07mm ± 0.05mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.07mm ± 0.05mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.07mm ± 0.05mm ± 0.07mm ± 0.05mm ± 0.07mm ± 0.05mm

Hole to Hole ± 0.05mm ±0.04mm ± 0.04mm ± 0.03mm ± 0.04mm ± 0.03mmHole to Outline Edge ± 0.07mm ± 0.05mm ± 0.05mm ± 0.04mm ± 0.05mm ± 0.04mm

Center of Conductor toOutline Edge (Finger) ± 0.07mm ± 0.05mm ± 0.05mm ± 0.04mm ± 0.05mm ± 0.04mm

PitchBallSize

DimensionTolerances

Min. 0.1005Connector

Single SideDouble Side

CNC (Mechanical / Laser)

SMTCapability

Passive ComponentMin. Pitch Under 0.35mm

Specification

Current StatusItem

Min HoleDiameter

22um / 22um40um / 40um

Min. TraceWidth & Space

0.1mm / 0.07mm

Min. 0.1005

2014Under 20um / 20um

30um / 30um

0.075mm / 0.06mm

201320um / 20um35um / 35um

Min. Pitch 0.35mm0.2mm

Min. 3*3 Max. 74*74mmMin. Pitch Under 0.30mm

Min. Pitch 0.4mm

0.075mm / 0.05mm

0.25mmMin. 3*3 Max. 74*74mm

Assy.

EXP.

Printing ProcessPunching Hole

Outline DimensionAccumulated Pitch

Punching

BGASMTType

FPC Structure 8 Layers 10 Layers 12 Layers

Mechanical 0.15mm 0.15mm 0.15mm

Laser 0.07mm 0.06mm 0.05mm

Inner Layer 40um / 40um 35um / 35um 30um / 30um

Outer Layer 50um / 50um 45um / 45um 45um / 45um

Blind 0.07mm 0.07~0.06mm Under 0.05mm

Buried Available Available Available

2013 2014Year

H D I Tech.

Line Width /Space

Min. Drill

Current Items

Multi-layer Structure and Capability

CMOS Module / Mobile Device• Micro via process study• Via filling process evaluate• Half etching technology extended• Relative raw material development• Vacuum metallization process study

S/S 35um 30um Under 30um

D/S 35um 30um Under 30um

S/S 9um 9um 5um

D/S 9um 5um 5um

S/S Available Available Available

D/S Available Available Available

0.05mmMin. Blind Via forD/S Structure

Raw Material

Min. Line /Space

2013

R. t. R. Equipment forM/P Stage

0.07mm 0.06mm

2014Year Items Current

Fine Line / LCM Structure and Capability

COF / LCD Module / E-Ink Display• R. t. R. equipment advance• R. t. R. D/S blind hole evaluate• Direct gold apply• E-Ink COF product trial• Attack automobile market

FPC Structure 2 Layers 2 Layers 2 Layers

Mechanical 0.1mm 0.075mm 0.075mm

Laser 0.07mm 0.06mm 0.05mm

Inner Layer 40um / 40um 35um / 35um 30um / 30um

Outer Layer 50um / 50um 45um / 45um 45um / 45um

PI Base 9um 9um 9um

FR4 Base 12um 12um 12um

2013 2014Year

0.07mm 0.06mm 0.05mm

Raw Material

Line Width /Space

Min. Drill

Current Items

H D I Tech. Blind

E-Paper Structure and Capability

ESL / Smart Card / Watch / Mobile• Production process improvement• Patent applied• Strategic alliance• Attack mobile market

Thinner Material Development

2011 2012 2013 2014

Copper Foil

Base Film

FCCL

Shield Film

1/3oz (12um) 1/4oz (9um) <1/4oz (9um)<5um

Semi-additive Process

2mil (50um)0.5mil (12um) 0.4mil (10um) 0.3mil (7.5um) <0.3mil (7.5um)

3Layer S/S D/S2Layer S/S D/S

3Layer D/S2Layer S/S D/S 2Layer S/S D/S 2Layer S/S D/S

Ag-Shield Shield Film(8um) Shield Film Thinner (<8um)

Ultra bookTablet

Multi-layer (HDI) Capability

2011 2012 2013 2014

Inner:40um/40um Outer:55um/55um

4-6 Layer


6-8 Layer


8-10 Layer

Stack Via(N)

Stack Via

Anylayer

Solid Via


10-12 Layer

TH：ψ0.15mmBH：ψ0.07mm




Layer Count & Thickness

Min. Thickness 220um

2011 2012 2013 2014




6 Layer

8 Layer

10 Layer

12 Layer

Expansion and Integration

Complete our new building constructionat Tatung Technology Park, Shulin City, Taipei in May 2007.

9 floors (B1~F8) with total area =43,000 square meters.

25M USD investment for the building20M USD for the facilities.

eadquarters, R&D Center igh-end Production FacilityH

High-end products：D/S Roll to Roll Fine Line

Allocation of H.Q. Building

H.Q. andR&D Center

Strategic ProductAlliance

Automate Manufacturing

ProcessRoll to Roll

Capital Expenditure

Total Investment USD 35M in Taipei, Kunshan and Suzhou Fab expansion (2012) Total Investment USD 35M in Taipei, Kunshan and Suzhou Fab expansion (2012)

Unit：US$ Million

Facility Shulin Kunshan Suzhou

Outlook

Building 1 4

Capability Upgrade 12 4 5

Capacity Expansion 2 2 2

Others 1 1 1

Subtotal 15 8 12

Floor Guide - Taipei H.Q. Building

Prod. Staff Office, Reliability Lab IQC, Cutting, Punch, Warehouse

Coverlay Assembly, Lamination, NC, Screen Print, SMT, Test, Inspection, FQC, Assembly

Sales, RD, QA, Admin. Staff Office, Conference Room

Assembly, Test, Inspection, FQC, RTR D/S Process

Reception, Conference Room, Shoes Change Area, Parking

Assembly Process, FQC Restaurant, Staff Leisure Room

IQC, CNC, Plasma, Wet Process Subcontract Affairs Educational Room

Exposure, LPI, Wet Process

Vision and Commitment

Maintain Technological Leadership.

Implement Customer Satisfaction.

The Whole Member Management and Profit Sharing.

Enhance Shareholder Value.

Fulfil Social Responsibility.

www.careergroups.com

FacilitySize

Manpower

Overview - Kunshan Plant

Return

Established Oct. 1998

Location Shanghai

Paid-inCapital

US$ 31.8 Million(NT$963 Million, Mar. 2012)

4,272

43,000 square meters

Overview - Suzhou Plant

Established Feb. 2002

Location Suzhou

Paid-inCapital


Return

FacilitySize

Manpower 2,679

28,000 square meters

Established

Location

Overview - Shenzhen Plant

Return

Jul. 2004

Shenzhen

Paid-inCapital


FacilitySize

Manpower 1,347

8,000 square meters

Organization - Kunshan Plant

Financial Div.

Product Development.EngineeringTechnologyDevelopmentMass ProductionTechnologyPrototypeEngineeringDocument Control

Prod. Dept. 1Prod. Dept. 2Prod. Dept. 3Prod. Dept. 4P.C.P.E.

AccountingCustoms Clearance Affairs

Return

General AffairsH.R.Environmental Mgt.Maintenance

Mr. Sam Wang,Director

R&D Div.

Mr. Richard Wu,Director

Mr. Eric Lin, Sr. Manager

Prod. Div.

Mr. Richard Chen,Plant Director

Admin. Div.

Mr. Sanny Hsieh,Manager

Material Support Div.

Ms. Letitia Lei,Sr. Manager

Q.A. Div.

Mr. David Liu, Sr. Manager

Kunshan Plant

Mr. Henry Su,Vice President

China Regional Sales Div.

Mr. Hans Ko,Director

ProcurementMaterial ControlWarehouse Mgt.

‧Sales and Financial Div designated in different color function-wise cover all plants in Mainland China.

Quality Assurance Quality ControlQuality SystemQuality Engineering

Organization - Suzhou Plant

Product DevelopmentTechnology Research & DevelopmentMass Production Tech.Prototype Engineering

Production DivisionMr. Jason Wu Plant Manager

Admin. DivisionMr. Eric HsiaoSr. Manager

Return

Production TechnologyProduction ControlProd. Dept. 1 Prod. Dept. 2Project Office

Suzhou Plant

Mr. Roger Chiang, Vice President

Quality Assurance Quality ControlQuality SystemQuality Engineering

R&D DivisionMr. Sinsien LinSr. Manager

Q.A. DivisionMr. Peter Tu

Manager

Financial DivisionMr. Sam Wang

Director

AccountingCustoms Clearance Affairs

General AffairsH.R.Environmental Mgt.MaintenanceMaterial Support

Product Mix - Kunshan Plant

Return

37% 27%

36%

Single Side

Double Side

Multi-layers

Product Mix - Suzhou Plant

Return

5%38%

57%

Single Side

Double Side

Multi-layers

Floor Guide – Kunshan Plant

Exposure, Screen Print, LPI, Instrument Room

CNC, Punch, NC, Laminate, Scrubbing, Electroplate, Chemical Lab. SQA, Subcontract

SMT, Assembly, Test, Inspection, Cutting, Warehouse, Instrument Room R&D Sample Preparation, PE

Assembly, O/S Test, Inspection, Pre-laminate, RTR UV Laser , RTR Shadow, RVCP, DES Line, RTR AOI, Nickel-palladium-gold Wire, Horizontal Brown Line, Blind Hole Check, PD Admin.

Chemical Lab, Copper Plating, Black Hole, Shadow, DES Line, PTH, Plasma, AOI

RTR NC, RTR Pre-laminate, RTR Laminate, RTR Hot Press, RTR CuttingAdmin., Sales, PC, QA, R&D Staff Office Reception

Floor Guide – Suzhou Plant

Staff Office, Conference Room

Punch, O/S TestReception

Conference Room

Inspection, Assembly, IQC, FQC, Warehouse

Lamination, RA Lab.

Chemical Lab, Exposure, PTH, ENIG, Gold Planting, Lamination

CNC, Screen Print & LPI, RTR Process

Subcontract Affairs, Educational Room

Assembly Process, Final Inspection

SMT、FT / ICT

Floor Guide – Shenzhen Plant

Screen Print, O/S Test, Punch, Tooling Room, Assembly, Lamination, Plasma, Tool Making Room

SMT, Assembly, Functional Test, Inspection, Parts Warehouse

Inspection Process

Reception Instrument Room, Warehouse

Manufacturing, QE, Admin., PE, Financial Dept., Educational Room, Conference Room, Instrument Room

Laboratory Category

Surface CopperFilm Thickness

Working Instruction for Micro Hardness

IC

Moisture /Resistance

Thermal Shock Salt Spray

Peeling Strength

BendingFlexibility Endurance

Free Fall

Surface Resistance

Dielectric Withstanding

Voltage

SEM / EDS Wetting Balance

UV

AA

GW-C220512

GFG-8219A

OSC LCR

Chemical Lab. GP/RoHS Lab.

Failure Analysis Lab. Reliability Lab.

ASTM D-2176

IEC-68-2-32

IPC-TM-650

IEC-68-2-11IEC62321

US EPA3060A

US EPA7196A

ASTM D3359-02

J-STD-003B

IEC-6013A

ICP

Micro Wave

MicroPeeling

Strength

Auto Wire Bond

Oxygen Bomb Combustion

For Halogens

For RoHS(Hg,Pb,Cd)

Spec.

FPC PI PET LCP 0.3 0.5 1 2 3 5 RACopper

EDCopper

1/4 1/3 1/2 1

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Base Film Thickness (mil)Base Film (mil) Copper Characteristic Copper Thickness (oz)

AdhesivelessDouble Side

Coverlay

AdhesiveSingle Side

AdhesiveDouble Side

Copper Foil

AdhesivelessSingle Side

Material Specification