© 2014 IBM Corporation Modular X6 Rack Systems Randy Lundin – X6 Product Manager Randy Kolvick – Senior Technical Staff Member

© 2014 IBM Corporation

Modular X6 Rack Systems

Randy Lundin – X6 Product ManagerRandy Kolvick – Senior Technical Staff Member


To keep pace: infrastructure must execute quickly and efficiently, minimize costs, foster innovation and stay up and running

To keep pace: infrastructure must execute quickly and efficiently, minimize costs, foster innovation and stay up and running

<1% of enterprise data is analyzed

Additional sources continue to net more data: Smartphones,

mobiles,

sensors

Of LOB and IT leaders –

70% are planning big data implementations or already

leveraging them

Of LOB and IT leaders –

80% are building new apps for cloud

Spendingon market

analytics is up

by 60%

90% of all data on planet

Earth is > 2 years old

There are

1billion+ Facebook users

1Data from IBM Annual Survey of IT and line-of-business leaders for 2013.

1Data from IBM Annual Survey of IT and line-of-business leaders for 2013.

Trends signal why infrastructure matters

2

© 2014 IBM Corporation3

High-end systems

Broad portfolio to meet a wide range of client needs from infrastructure to technical computing

4 socket+ enterprise-class x86 performance, agility and resilience

Integration across IBM assets in systems and SW for maximum client optimization and value

Optimize space-constrained data centers with extreme performance and energy efficiency

IBM PureSystemsIBM PureSystemsIBM X6 SystemsIBM X6 Systems

IBM System x iDataPlex IBM NeXtScaleIBM System x iDataPlex IBM NeXtScale

IBM System x Rack & TowerIBM System x Rack & Tower

IBM Flex SystemIBM Flex SystemIBM BladeCenterIBM BladeCenter

IBM System x delivers a leadership x86 systems portfolio

Blades/Integrated systems

Volume systems Dense systems


For more than a decade, IBM has delivered innovation above and beyond industry standards

4

X6

X4

EXA2

EXA

X3

eX5

X6

X4

EXA2

EXA

X3

eX5

X6

X4

EXA2

EXA

X3

eX5

business-critical workloads

foundation for virtualization

facilitates private or hybrid cloud model

business-critical workloads

foundation for virtualization

facilitates private or hybrid cloud model

Largest SAP HANA system in the worldLargest SAP HANA system in the world

100+ number one benchmarks100+ number one benchmarks

>$1B invested in EXA Technology>$1B invested in EXA Technology

1st VMware joint development partner1st VMware joint development partner

#1 market share#1 market share

1st >8 way scalable solution1st >8 way scalable solution

Generations of innovation in IBM Enterprise X Architecture (EXA) have delivered superior performance & availability in scale-up x86 servers


X6 delivers

5

Quicker to your goals, quicker to value

Get what you need today, build as you

grow tomorrow

Create a reliable, mission-critical system

for your enterprise


Pe

rfo

rma

nc

e

OLTP

Business Intelligence

ERP

Scale Out HPC

In-Memory Analytics

Virtualization Consolidation

CRM

Data Warehousing/Mart

Memory and Scalability – Single System

Small Apps &Scale-out workloads

Big Apps & Scale-up workloads

* Other names and brands may be claimed as the property of others. Copyright © 2010, Intel Corporation.

X6 Workloads Require Performance, Memory, Scalability and a High Level of RAS

6


The next generation of leadership for mission critical application deployment

on x86 systems

Optimized performance

Enterprise-level availability

Investment protection

Simple, proven solutions

Optimized performance

Enterprise-level availability

Investment protection

Simple, proven solutions

7


3X more memory2

Enterprise scalability to support 8 CPUs, with 50% more cores

FlashCache Storage Accelerator

New eXFlash memory-channel storage

Scaling for new workloads and business demands

Actionable information— delivered faster

Higher solution performance with lower cost

Make look right, Make look right,

X6 enables you to shift your business services into high gear

2 6TB maximum memory vs. 2TB or less for previous-generation competitive 4-socket servers. 2 6TB maximum memory vs. 2TB or less for previous-generation competitive 4-socket servers.

8


Leadership Performance with IBM System x3850 X6

RECORD PERFORMANCE

At X6 Announcement 01/16/2014Three #1 Benchmarks1

RECORD PERFORMANCE

At X6 Announcement 01/16/2014Three #1 Benchmarks1

X6 servers show leadership across many workloads that client deployX6 servers show leadership across many workloads that client deploy

NEWPERFORMANCEBENCHMARKS

TPC-H using Microsoft SQL Server 201404/16/20141

SPECjbb2013 using E7-4890v2 CPUs05/06/20141

NEWPERFORMANCEBENCHMARKS

TPC-H using Microsoft SQL Server 201404/16/20141

SPECjbb2013 using E7-4890v2 CPUs05/06/20141

CONTINUED MOMENTUMCONTINUED MOMENTUM

SPECVirtSPECVirt

TPC-ETPC-E

SAP SD two-tier

(4-socket)

SAP SD two-tier

(4-socket)

#1

#1

#1

7X OLTP Performance Improvement on

Microsoft SQL Server 2014

7X OLTP Performance Improvement on

Microsoft SQL Server 2014

TPC-HTPC-H

#1

SPECjbb2013SPECjbb2013

#1

9


Client Challenges Driving 2 Socket Consolidation

Reducing Software cost Need to reduce systems & core courts

that drive software cost.

Managing Acquisition Cost Less systems and racks can results in

acquisition cost savings.

Managing Data Center Floor Space Need to reduce overall server footprint Doing more with less space

Reducing Energy Cost Reduce power and cooling

construction Reducing ongoing power cost

Reducing Administrative Cost The need to reduce the number and

complexity of systems to manage.

Need for Flexibility To better handles demand spikes Enough memory to handle large

workloads

10


Backup

Where the Consolidation Savings Come From?

Hardware Acquisition Cost

• Fewer servers can result in a lower HW acquisition cost

• X6 servers can outperform 2 socket servers by up to 10X

Software Cost

• Less total processors and core count results in significantly lower software cost

• Fewer cores generates savings for operating, database and application software licensing.

Data Center Floor Space & Admin

• Fewer servers results in fewer racks taking up valuable floor space

• Eliminating racks of servers generates savings and minimizes data center physical expansion and reduces the systems administration labor cost.

Energy Cost

• Fewer servers significantly saves power cost and postpones expensive power/cooling expansion.

• 70% of data center construction cost come from power and cooling equipment and build out

11


The industry’s first modular design enables easy configuration and support

X6 scales-up to meet business needs 2 to 8 way (Rack) Ability to scale up to 8-way

Modular design delivers fit-for-purpose solutions

Front/back access system access facilitate easy servicing and upgrading

Fast Setup and Configuration Patterns enable automated provisioning

Significantly reduce acquisition costs

Optimize workload configuration, maximize performance, simplify deployment

Accommodate multiple generations of technology in the same server1

Make look right, Make look right,

X6 gives you the flexibility to evolve as your business does: pay-as-you-grow and change course when needed

1Accommodate multiple generations of processor and memory technology in the same server. Slide out the old Compute Books and slide in the new. The chassis doesn’t change, and neither do the I/O Books, Storage Book, power supplies, fans, or anything else. In fact, you don’t even have to remove the server from the rack. These easy, fast, inexpensive upgrades, can be done several times -- not just once. Older Compute Books can be used in other X6 servers that you are not yet ready to upgrade.


12


The modular design concept: X6 adapts to business needs

Storage Book4 Compute Books

Each compute book includes 1 processor and 24 DIMMs

Deliver up to 6TB of memory or 12.8TB of eXFlash memory – channel storage

Each x3850 X6 contains 4 Compute books

Ability to swap out Compute books as memory or processor generations change

The Storage book delivers up to 6.4TB of eXFlash 1.8” SSD or 12.8TB of SAS 2.5”

Ability to host 2 storage controllers for maximum bandwidth

13


Create the fit-for-purpose solution, whether clients need to support typical HBAs or specialty GPGPU cards

Primary I/O Book

Up to 2 types of IO Books, Half-Length and Full-Length

Each IO Book delivers an additional 3 PCIe slots

Mezz-LOM solution gives clients the ability to select the networking technology that fits their requirements

Hosts the IMM, PCIe slots, and the dedicated Mezz-LOM solution

The modular “book” design also provides clients front and rear access to modular components

14


Capitalize on your investment – “no more rip and replace.”

Gen1 Gen3

X6 ApproachInnovation…Upgrade in the same chassis Gen2

Traditional ApproachMore Servers. More Cost. More Overhead.

With X6 rack systems, multiple generations of technology can be accommodated in the same server1

Gen1 Gen3Gen2



15


x3850 X5 8-Way x3950 X6 Client Benefit

Scalability Implementation Two servers via Scalability Kit Single 8U internal mid-plane • Higher QPI performance• Higher Reliability• Lower Complexity

Asset Management Two serial numbers Single serial number • Single asset for tracking and accounting

Server Management Dual management modules, independent and localized

Primary IMM with secondary IMM for backup

• Single point of control• Higher management availability

The new x3950 X6 8U design drives easier management, higher performance and capacity, and advanced reliability

16


• Grow from a 4-socket system to an 8-socket system and reuse system modules: modules are interchangeable between a 4-socket and an 8-socket chassis

Fit for Purpose Scenarios…

4-socket chassis

8-socket chassis

x3850 X6

x3950 X6

17


FlexNode multiple x3950 X6 servers into a cluster of 4-way servers

Or FlexNode x3950 X6 servers into scale-up 8-way servers

Leveraging FlexNode capability, configure between scale-up workloads & clustered applications easily

18


1

2

3

19

Intel Run Sure Technology: Enterprise RAS on the Intel Xeon processor family

Memory rank sparing Memory mirroring and

page retire MCA consumed error PCIe live error

recovery

IBM platform innovation:Higher availability, more platform-level RAS

Automated processor failover Automated firmware backup Automated memory

page sorting Advanced transaction

recovery

IBM management innovation:Greater solution-level RAS management with X6 software stack integration

For VMware and Microsoft virtualization

Industry standard

X6 innovation

X6 delivers mainframe-like RAS because it integrates across the hardware & software stack


X6 delivers mainframe-like RAS because it integrates across the hardware & software stack

Self Healing – 3X Memory with Higher Availability (vs eX5)Page Retire – The ability to proactively identify and quarantine memory page failures from affecting system or application availabilityMemory Page Sorting – Real-time sorting of memory pages based on the level of integrity – keeping the most resilient memory pages available for applicationsAutomated Backup of system management during a failure -- maintains system integrity and availability

Self Healing – 50% More Cores with Stronger Reliability (vs eX5)MCA Core Recovery – The ability for the OS to isolate MCA uncorrectable errors to a single VM or application rather than affecting the entire serverFault Resilient Boot – Allows the server to disable cores or processors and continue to boot if a failure is detected at startup, maintaining access to networking, storage, and system management

Most Robust DesignModular Design – delivers the fastest serviceability through a “lid-less book design”Hot-swap – Supports hot-swap Half-length and Full-length I/O Books, power supplies, fans, hard drives

Resilient StackUpward Integrated Module for Rolling Firmware Updates -- allows clients to update all of a virtualized cluster of servers without affecting application availabilityUpward Integrated Module for RAS -- allows clients to proactively manage policies in responding to PFAs

20


Bas

ic

12-15 CoresQPI: 8.0 GT/sUp to 37.5M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2666 MT/s2:1 DDR3:1333 MHz (max)1:1 DDR3:1600 MHz (max)

8-12 CoresQPI: 7.2 GT/sUp to 24M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1600 MHz (max)

8S/Scalable* 4S/Scalable* 2S/Scalable*

Frequency Optimized : HPC

Stan

dard

Adv

ance

d

*Scaling capability refers to maximum supported number of CPUs in a “glueless” platform (e.g.8S means that this SKU can be used to populate up to 8 sockets in a single system).. Above skus may be used in even larger than 8S systems through the use of 3RD party node -controllers (not available from Intel).++ Please refer to the memory population matrix table for detailed information on POR Slots-per-Channel (SPC) & DIMMS-per-Channel (DPC) combinations

Frequency Optimized : Enterprise/DB

6 CoresQPI: Up to 6.4 GT/sUp to 12M cacheIntel® HT TechnologySMI Gen2: Up to 2132 MT/s2:1 DDR3: 1066 MHz (max)1:1 DDR3: 1333 MHz (max)

8S/Scalable*QPI: 8.0 GT/sUp to 30M cacheIntel® Turbo Boost TechnologySMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)

Segment Optimized

8S/Scalable*QPI: 8.0 GT/sUp to 37.5M cacheIntel® HT TechnologyIntel® Turbo Boost TechnologySMI Gen2: Up to 2666 MT/s2:1 DDR3: 1333 MHz (max)1:1 DDR3:1600 MHz (max)

15C 130W2.5GHz 37.5M

15C 130W2.5 GHz 37.5M

15C 130W2.5GHz 37.5M

12C 105W2.3GHz 24M

12C 105W2.3GHz 24M

12C 105W2.3GHz 24M

15C 130W2.3GHz 30M

15C 130W2.3 GHz 30M

15C 130W2.3GHz 30M

10C 105W2.2GHz 20M

15C 155W2.8GHz 37.5M

15C 155W2.8 GHz 37.5M

15C 155W2.8 GHz 37.5M

12C 130W2.6 GHz 30M

8C 105W2.0GHz 16M

6C 105W1.9GHz 12M

E7-4890 v2

E7-4870 v2

E7-4880 v2

E7-4860 v2

E7-4850 v2

E7-4830 v2

E7-4820 v2

E7-4809 v2

E7-8890 v2

E7-8870 v2

E7-8880 v2

E7-8850 v2

E7-2890 v2

E7-2870 v2

E7-2880 v2

E7-2850 v2

10C 155W3.2GHz 37.5M

6C 155W3.4GHz 37.5M

E7-8891 v2

E7-8893 v2

15C 105W105W2.2 GHz 37.5M

High Performance,Low Power

E7-8880 L v2

12C 130W130W3.0GHz 30M

E7-8857 v2

21


x3850 X6 Server Walk Through

22


8x 2.5-in. or 16x 1.8-in. hot-swap drive bays

LCDpanel

4x Compute Books eachwith 2x dual motor fans

Videoport

USB 2.0port

Powerbutton

StatusLEDs

2x USB 3.0ports

x3850 X6 Front View - Overview

23


4x hot-swappower supplies

Videoport

Serialport

4x USBports

IMM2port

3x PCIe slots(PrimaryI/O Book)

3x PCIe slots(I/O Book 1)(optional)

2x hot-swapdual-motor

fansMezz LOM(ML2) slot

3x PCIe slots(I/O Book 2)(optional)

x3850 X6 Back View - Overview

24


Compute Book Details

x3850 X6 and x3950 X6 Compute Books are front accessible For technology refreshes you only need to update the Compute Book

Intel Xeon E7-4800 v2 or E7-8800 v2 processor

12x DIMM slots on right side of the Compute Book

12x DIMM slots on left side of the Compute Book

Two hot-swap dual-motor fans

25


Storage Book Details

x3850 X6 and x3950 X6 supports 12Gb SAS through the use of adapters The SAS cards plug into the two PCIe slot located in the Storage Book Up to 8 2.5” HDD/SSD or 16 1.8” SSD

LCDpanel

Front USB 3.0 & Video port

2 PCIe slots for internal storage

controllers

Hot-swap drives – 1 or 2 of 4x 2.5” HDD/SSD bays 8x1.8” SSD bays

26


Primary I/O Book Details

Contains the minimum set of I/O components to form a complete server.

USB port for hypervisor

Mezz LOMPCIe 3.0 x8 slot

PCIe 3.0 x16

PCIe 3.0 x16 (x8 wired)

PCIe 3.0 x16

Two hot-swap fans at rear

Top View with Air Baffle in place

27


Half-Length I/O Book Details

28

The Half-Length I/O Book provides up to 3 PCIe slots each Up to 2 of these Books can be added to the 4-Socket configuration Each Half-Length I/O Book is Hot-Swappable

PCIe 3.0 x16 slot (x16 wired) (75W max power)

Two PCIe 3.0 x8 slot (x8 wired) 75W max power


Full-Length I/O Book Details

The Full-Length I/O Book provides up to 3 PCIe slots each Up to 2 of these Books can be added to the 4-Socket configuration Each Full-Length I/O Book is Hot-Swappable The Full-Length I/O Book supports one high power PCIe card (GPU/Accelerators) with

a max power of 300W Two AUX power connectors provided to support 225W and 300W support

PCIe 3.0 x16 slot supporting double-wide adapters requiring up to 300W of power

PCIe 2.0 x8 slot (x4 wired)

2x4 aux power connector for 150W additional power

PCIe 3.0 x16 slot

2x3 aux power connector for 75W additional power

29


The next generation of leadership for mission critical application deployment

on x86 systems

30


AppendixeX5 to X6 Comparisons

31


X6 Performance Compared to eX5 (SPEC CINT2006 Rates Baseline)

Basic

Ad

van

ced

Sta

nd

ard

SPECint*_rate_base 2006 scores

2238

2091

1959

1763

1511

1254

940

582

1100

1030

923

805

740

507

15C 130W2.5 GHz 37.5M

12C 105W2.3GHz 24M

15C 130W2.3 GHz 30M

10C 105W2.2GHz 20M

15C 155W2.8 GHz 37.5M

12C 130W2.6 GHz 30M

8C 105W2.0GHz 16M

6C 105W1.9GHz 12M

E7-4809 v2

E7-4860 v2

E7-4820 v2

E7-4830 v2

E7-4850 v2

E7-4870 v2

E7-4880 v2

E7-4890 v2

32

10C 130W2.0 GHz 24M

8C 105W 2.13 GHz 24M

6C 95W1.86 GHz 18M

10C 130W2.26 GHz 24M

E7-4830

E7-4807

E7-4850

E7-4860

10C 130W2.4 GHz 30M

E7-4870

8C 105W 2.0 GHz 18M

E7-4820

Up to 2x performance on typical general purpose high compute apps

Projections have been estimated with memory speed at 1333MHz for Advanced CPU category, 1066MHz for Standard CPU category, and QPI link at 7.2 GT/S for 8 sockets CPU

Intel® Xeon®

processor E7 family(WSM-EX)

32


x3850 X5 x3850 X6 Benefits

Processor

Intel® Xeon® E7-4800/8800 v1 95W, 105W, 130W 6C, 8C, 10C

Intel® Xeon® E7-4800/8800 v2 105W, 130W, 155W 6C, 8C, 10C, 12C, 15C

2X higher performance from previous generation

Memory

64 / 96* DIMM slots 2 TB max memory 3 TB with MAX5 Memory

Drawer

96 DIMM slots 6 TB max memory 4GB/8GB/16GB RDIMM 32GB/64GB LRDIMM

Host larger In-Memory Databases

Host larger virtual machines

Internal

Storage

2.5” HDD – 8 SAS/SATA/SSD 1.8” SSD – 16 eXFlash

2.5” HDD – 8 SAS/SATA/SSD 1.8” SSD – 16 eXFlash Up to 32 eXFlash DIMMs (up to 12.8TB)

• 2X Higher I/Os per second – delivering higher throughput

• 3X Lower Latencies – delivering higher speed

Ethernet

Two 1 Gb Ethernet Dual 10 Gb Ethernet adapter

(fiber)

One 1GbE Management Port Mezz LOM Dedicated Socket with choice of ML2

cards: 4 x 1GbE Copper 2 x 10GbE SFP+ 2 x 10GbE 10BaseT

Selectable LOM technology to allow flexibility and choice as networking requirements change or grow

PCIe 7 PCIe slots 3 FH/HL 4 FH/FL

11 PCIe slots (2 front, 9 rear) Primary IO Book with two x16 and one x8 FH/HL Half-Length IO Book with one x16 and two x8 FH/HL Full-Length IO Book with two x16 and one x4 FH/FL Support up to two 300W cards

Flexibility and choice to deliver the right networking infrastructure

Ability to support the most demanding virtual desktop or graphics capabilities

Power 1975W Redundant Power Up to four 1400W/900W AC, 750W DC Flexibility to meet power and

cost requirements

Other

Ability to scale from 4-way to 8-way leveraging QPI Scalability Kit

Ability to scale from 4-way to 8-way cable-free Modular rack design

Ability to host multiple generations of technology in a single package

33


x3850 X5 8-Way x3950 X6 Benefits

Processor

Intel® Xeon® E7-4800/8800 v1 95W, 105W, 130W 6C, 8C, 10C

Intel® Xeon® E7-4800/8800 v2 105W, 130W, 155W 6C, 8C, 10C, 12C, 15C

Single chassis, pay-as-you-grow capability from 4-way to 8-way

Memory

128 DIMM slots 4 TB max memory 6 TB with MAX5 Memory Drawer

192 DIMM slots 12 TB max memory 4GB/8GB/16GB RDIMM 32GB/64GB LRDIMM

Host larger In-Memory Databases Host larger virtual machines

Internal

Storage

2.5” HDD – 16 SAS/SATA/SSD 1.8” SSD – 32 eXFlash

2.5” HDD – 16 SAS/SATA/SSD 1.8” SSD – 32 eXFlash Up to 32 DIMM based Flash (up to

12.8TB)

• 2X Higher I/Os per second – delivering higher throughput

• 3X Lower Latencies – delivering higher speed

Ethernet Four 1 Gb Ethernet Two Dual 10 Gb Ethernet adapter (fiber)

Two 1GbE Management Port Mezz LOM Dedicated Socket with choice

of ML2 cards (2): 4 x 1GbE Copper 2 x 10GbE SFP+ 2 x 10GbE 10BaseT

Selectable LOM technology to allow flexibility and choice as networking requirements change or grow

PCIe 14 PCIe slots 6 FH/HL 8 FH/FL

22 PCIe slots (4 front, 18 rear) Two Primary IO Books with two x16 and

one x8 FH/HL Up to two Half-Length IO Book with one

x16 and two x8 FH/HL Up to two Full-Length IO Book with two

x16 and one x4 FH/FL Support up to four 300W cards

Immense IO capability with 22 PCIe slots and PCI Gen3 speeds and bandwidth

Ability to support the most demanding virtual desktop or graphics capabilities

Power 1975W Redundant Power Up to 8 x 1400W/900W AC, 750W DC Flexibility to meet power and cost

requirements

Other Scalability through QPI Cables Multi-asset management

Cable-Free, Glue-less scalability Single Chassis, Single point of control,

Single Serial

Scalable performance Ease of management34

Documents

© 2014 IBM Corporation Modular X6 Rack Systems Randy Lundin – X6 Product Manager Randy Kolvick – Senior Technical Staff Member