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Development of an electrochemical depth
profiling method to optimize the corrosion
protection on aluminium cladded sheets for
automotive heat exchangers
L. Peguet, V. Lair, E. Mendez, H. Noui
C-TEC Constellium Technology Center, Voreppe, France
ASST 2015 - Madeira, May 20th
Electrochemical depth profiling method is a “must-have” tool to
optimize corrosion resistance of brazing sheets
Aleris
SAPA
Sumitomo LMI
Furukawa Sky
M2I Delft
Need for an electrochemical depth
profiling tool at Constellium C-TEC with
the best accuracy and robustness.
To design our new mono- & multi-clad innovative brazing sheets.
Choice of a method based on successive etching
4 steps:
Reach the relevant depth: Chemical
pickling in NaOH 2M.
Choice of a surface cleaning
procedure (chemical, mechanical,…)
Choice of the relevant environment for
electrochemical potential measurements
Application to mono or multiclad
brazing sheets to define their ID cards in
terms of potential profile.
Smut
Core
Clad 1
Clad 2
V
ref
V
ref
Potentiel
Depth
Experimental setup
Pickled area
Potential measurement area
cm
Solution : NaOH 2 mol/L
Temperature : ambiant→40°C
Surface cleaning performed in
acetone-ethanol mixture aided
by ultrasonic treatment in order
to remove the smut layer
Chemical pickling Electrochemical potential measurement
Pickling depth
Choice of the relevant environment to measure the electrochemical potential
- Example of the ASTM G69 standard -
ASTM G69 solution is widely used to measure the electrochemical potential of bulk
aluminium alloys but is very severe when considering electrochemical potentials at
a given depth on thin-gauge brazing sheets.
Top view - Binocular Microscope Cross section - Optical Microscope
Localized attack on a 10min-pickled as-rolled 3916-4045/270m/H24 specimen after
a 1h-exposure in NaCl 1M + H2O2 9ml/L (ASTM G69 standard).
Penetrating
pits
Choice of the relevant environment to measure the electrochemical potential
- Necessity of chloride-based solution -
As-rolled 3916-4045/270m/H24 specimen after a 10min pickling (etching depth not exceeding
the 4045 layer thickness).
3h-immersion time was carried out.
Chlorides are definitively required in order to pin a stable potential corresponding
to the so-called “pitting potential”.
(N2 deaerated solutions)
Po
ten
tia
l (m
V/S
CE
)
Time (h)
Choice of the relevant environment to measure the electrochemical potential
- Influence of aeration -
As-rolled 3916-4045/270m/H24 specimen after a 10min pickling (etching depth not exceeding
the 4045 layer thickness).
3h-immersion time was carried out.
Signal stability is improved by solution aeration as a stronger cathodic reaction
helps to pin the pitting potential.
Po
ten
tia
l (m
V/S
CE
)
Time (h)
NaCl 0,1M
aerated
NaCl 0,1M
deaerated
Choice of the relevant environment to measure the electrochemical potential
- Influence of acidification -
As-rolled 3916-4045/270m/H24 specimen after a 10min pickling (etching depth not exceeding
the 4045 layer thickness).
3h-immersion time was carried out.
Signal stability is again improved by using an acidic solution (HCl 0.1M) allowing a
fast depassivation. A 30 min measurement is then sufficient to get a stable potential.
Po
ten
tia
l (m
V/S
CE
)
Time (h)
(aerated conditions)
Choice of the relevant environment to measure the electrochemical potential
- The case of a Cu-free material -
3xxx(0%Cu)/4343/330m/O after brazing. Investigated pickling depth is 65m corresponding
to the free-Cu core alloy.
30min-immersion in HCl 0.1M + increasing additions of H2O2 .
When the core alloy to be investigated does not contain copper, adding H2O2 may be
necessary. A HCl 0.1M + 9mL/L H2O2 solution is to be chosen.
Choice of the relevant environment to measure the electrochemical potential
- Comparison with ASTM G69 solution -
3916-4343/400m/O after brazing:
Core alloy (after 60min etching at 40°C)
Clad (after 5min etching at 40°C)
Faster signal stabilization.
Better resolution in terms
of potential difference
between the core alloy and
the clad
30 min electrochemical potential measurement in HCl 0.1M + H2O2 9mL/L compared to ASTM G69
NaCl 1M + H2O2 9mL/L standard solution
ASTM G69 standard.
Examples of electrochemical depth profiling applications
- Brazing sheet including a Zn-containing clad: a “case study” -
3915-7072/270 m/H24 before / after brazing.
30 min electrochemical potential measurements
in HCl 0.1M after pickling for different durations.
(Each measurement is repeated twice)
Before brazing: 150mV difference is
evidenced between the zinc-containing
surface and the 3916 core alloy
60-min pickled surface after
electrochemical measurement
10-min pickled surface after
electrochemical measurement
Examples of electrochemical depth profiling applications
- Brazing sheet including a Zn-containing clad: a “case study” -
3915-7072/270 m/H24 before / after brazing.
30 min electrochemical potential measurements after pickling for different durations.
Before brazing:
=150mV.
EPMA analysis
After brazing:
=50mV.
Examples of electrochemical depth profiling applications
- Influence of the brazing treatment -
3916-4045/400m/H24 before / after brazing.
Electrochemical potential profile measurement in HCl 0.1M+H2O2
After brazing: A 40mV
difference is evidenced
between the surface and
the 3916 core alloy
Examples of electrochemical depth profiling applications
- Influence of the brazing treatment -
3916-4045/400m/H24 before / after brazing.
Electrochemical potential profile measurement
in HCl 0.1M+H2O2
Cu phases are re-solutionized during brazing
leading to a 70mV increase of the core potential.
EPMA profiles measured from surface to mid-thickness
V=70mV
Examples of electrochemical depth profiling applications
- Influence of Cu addition in the core alloy -
Cu-containing core alloy: 3xxx(0.6%Cu)/4343/330m/O after brazing.
Cu-free core alloy: 3xxx(0%Cu)/4343/330m/O after brazing.
Electrochemical potential profile measurement in HCl 0.1M+H2O2
V=40mV: “state-of-the-art” surface
sacrificial corrosion protection.
Cu-free core: Flat electrochemical
potential profile
After a 4 weeks SWAAT test
Cu-free sheet after brazing
Examples of electrochemical depth profiling applications
- Profiling on multilayer solutions -
3916-3xxx-4343/480m/O after brazing.
Electrochemical potential profile measurement in HCl 0.1M+H2O2
V=60mV: Optimized sacrificial
corrosion protection.
The additional interlayer leads to an extended Cu diffusion profile from the 3916 core to the
extreme surface resulting in a thicker low-Cu surface band which offers an optimized sacrificial
behavior of the top layers.
Clad + interlayer
A methodology to determine the depth-electrochemical potential profile by successiveetching of cladded aluminium sheets was optimized. The protocol includes threestages:
A chemical pickling in 2M sodium hydroxide in a dedicated flat cell.
A surface cleaning in order to remove the smut layer.
A 30min measurement of the electrochemical potential in 0.1M HCl (+H2O2)using a suitable electrochemical cell.
Conclusions
Examples of applications were given on state-of-the-art long life products as well ason a multilayer solution:
Dominant protection mechanism driven by copper gradient.
Optimizing this gradient (copper content/re-solutionizing of precipitates)is of first importance.
Sacrificial property of an additional interlayer in multilayer productsmakes it a reference material for more demanding applications.