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US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 1
US CMS Silicon Tracker Project
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 2
5.4 m
End Caps (TEC 1&2)
2,4
m
Inner Barrel & Disks
(TIB & TID)
Outer Barrel (TOB)
volume 24.4 m3
running temperature – 10 0C
210 m2 of Silicon Strips
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 3
Blue = double sided
Red = single sided
Strip lengths 10 cm (innermost) to 20 cm (outermost)
Strip pitches 80mm (innermost) to 200mm (outermost)
500
mm
hig
h
resi
stiv
ity
320
mm
th
ick
low
res
isti
vity
Silicon Strips
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 4
Kapton-bias circuit
Carbon Fiber Frame Silicon Sensors
Front-End Hybrid: Flex-ceramic laminate w/integral Kapton cable
Pitch Adapter
Kapton cable
Pins
Module Components
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 5
Single sided p/n • Industry standard
• Mass producible at low cost
Surface radiation damage• Increases strip capacitance (noise)
• p/n ok after inversion if adequately over-depleted
High Breakdown Voltages• Specific design and processing rules for guard & strip geometries
• Al strip layer acts as a field plate to remove high field region from Si bulk to Oxide
Technology
ROD INTEGRATION
AachenKarlsruheStrasbourgZurichWien
PETALS INTEGRATIONAachen
Brussels Karlsruhe
Louvain
Lyon Strasbourg
BrusselsWien Lyon
TEC assemblyTEC assembly
CERN
Frames:
BrusselsSensors:factories
Hybrids:Strasbourg
Pitch adapter:Brussels
Hybrid:CF carrier
TK ASSEMBLYAt CERN
LouvainStrasbourg
Pisa Perugia Wien
BariPerugia
Bari FirenzeTorinoPisaPadova
TIB-TID INTEGRATION
FNAL
UCSB
TOB assembly TIB-ID assemblyAt CERN Pisa Aachen Karlsruhe. --> Lyon
Karlsruhe
Pisa
Sensor QAC
Moduleassembly
Bonding &testing
Sub-assemblies
FNAL
US in the tracker
Integrationinto mechanics
RU
FNAL UCSB
UCSB
UCSB
UCSB
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 7
Covered in this talk
Status of Production parts• For Modules – Sensors, Hybrids and Module Frames
• For Rods – Rod Frames
US Readiness• US Group Evolution past year and upcoming year
• Status of all production equipment and manpower
Cost Performance and Schedule
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 8
Components Overview
Stockpiling Parts Now ↔ but with some caveats• Sensors (500 m thick)
• SGS Thomson (ST) ↔ Many problems. Production stopped
• Hamamatsu (HPK) ↔ Excellent quality. Deliveries behind expected
• Sensor Frames from Belgium/Pakistan: on track• Problems over the past few years appear to all be worked out for now
• Hybrids from Cicorel/Hybrid SA/CERN ↔ critical path• Several design flaws and processing quality issues uncovered.
• Last one now being resolved
• Rod Frames from Helsinki/CERN ↔ recent mistake found on some• Various residual problems have mostly been found and addressed.
• One found this week but not expected to cause any delays
• More may arise with experience..
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 9
• August ‘03 • US uncovered a problem with ST sensors
• December ‘03 (3 day sensor workshop at CERN) • Re-probing ~1000 sensors in US and EU indicates quality has degraded from
original• US group conclusion: degradation in time – possible chemical deterioration.
• January ’04: • Place orders with HPK for masks and prototypes
• February ’04: • ST agrees to significant changes in QC and stable processing with the aim of
being re-qualified at July ‘04 tracker week. Also agrees to cut order from 18,000 to 11,000. CMS places order with HPK for 7000 sensors
• May-July ’04: • ST delivers 1000 qualification sensors. US builds 177 modules. Sees time
evolution in at least 2 modules. Sensor groups see time evolution in 5% of sensors probed.
• Tracker week - July ’04: • probing groups together with ST uncover definitive evidence of corrosion
resulting from large phosphorous content in surface oxide. • ST is not qualified by CMS.
Timeline of ST Sensor Issue
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 10
CMN effect features: • Group of noisy strips with a “turn-on”
voltage at which all 128 channels show high noise
• can appear after thermal cycles
• often accompanied by other types of degradation such as pinhole development, more CMN
• Often correlated with high current
Later: a second chip develops a high noise channel which causes common mode noise
Channel previously only had a slightly higher noise (0.3 ADC)
Situation as of early‘04
1. Common Mode Noise (CMN)
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 11
100 200 300 400 500 6000,0
5,0x10-6
1,0x10-5
1,5x10-5
2,0x10-5
2,5x10-5
3,0x10-5
30210934875819 30210934875819novac
Leak
age
Cur
rent
[A
]
Voltage [V]
Strip 420 & 421 (4µA 15µA).Switching probe chuck vacuum on and off switches these strips on and off.Effect is reproducible.No visible defect seen.
without vacuum
with vacuum As of early‘04
2. Vacuum effect ↔ single strips !
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 12
OB2 sensors
“It’s like no diode I’ve ever seen Gromit” - Wallace
late ’03 early ’04
3. Peculiar IV Curves
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 13
As of early‘04
30211334388607
4. Long term instability
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 14
Good sensor
As of early‘04
5. Structure in leakage current
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 15
initial
3 hrs, no hum.nothing more
1h30, 40% RH Þnew stains on bias(not always visible on video, see later)
30 min, 40% RH Þ stainson guard first usually
As of July ’04 tracker week
6."Dots and Stains" development
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 16
Investigation by Strasbourg and Karlsruhe (with help of the Fraunhofer Institute Chemische Technologie)
The ratio of elements in white areas of stainsindicates the existence of Aluminum-oxide
Corrosion !
As of July ’04
"Dots and Stains" origin
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 17
Confirmation by ST
Passivation (1 µm)
Aluminum (2 µm)
Triple oxide layer (1.5 µm)
Aluminum corrosion
As of July ’04
Both dots and stains are micro-corrosions of the aluminum surface. The mechanism that drives this phenomenon can be the following:
Humidity reacts with Phosphorus (present in a 4% concentration into the passivation oxide) and forms an acid (probably H3PO4), that corrodes a superficial layer of Aluminum.
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 18As of July ’04
Failure rate of qualification sensors in 72 h period is 5%
233 sensors tested 72h (room temeperature, r.h.=25-30%)
7a. Long term sensor tests
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 19
7b. Long term TOB module tests
sec
Maxed out ADCBits at this pointnA After 7 hours, bias
current started to increase
New high noise channels seen in subsequent tests
Dark marks on bias ring occur near high noise channels
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 20
22 modules tested1 module with current increase during LT test
As of July ’04
7c. Long term TEC module tests
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 21
The Current Situation
Need 18,200 thick sensors installed in CMS tracker• 20,000 total (10% spares) originally all ST
• Shifted orders to HPK: • Winter ’04: 7,000
• Summer ’04: 4,500
• Autumn ’04: 5,200
• TOTAL of 16,700: (1,500 short of installation requirement)
• Agree to accept ~3,000 sensors from ST • Installation of at least 1,500
HPK Shipments • Started on schedule in June ’04
• Did not yet reach levels expected
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 22
Original Schedule
Jan-04 Feb-04 Mar-04 Apr-04 May-04 Jun-04 Jul-04 Aug-04 Sep-04 Oct-04
Mask Production
Sensor Pre-Production
Sensor Qualification 240
Sensor Production 540 1000 1500 1500 1500 1500
Cumulative Production 540 1540 3040 4540 6040 7540
Sensor Acceptance 500 1000 1500 1500 1500
Initial plan showed 1st 7000 sensors delivered by November Current: ~4000 delivered. Met with Yamamoto (v.pres.HPK) Oct. 11 at CERN (JI on video:
• 3 problems identified: (One month lost while analyzing problems)1. Poly Silicon – operator error caused over-etching2. Backside SiO2 too thin – caused high leakage currents3. Scratches – due to a problem with automated handling devices
• Recent batches have ~75% yield allowing ~1300/mo. rate• If achieve 85-90% then will deliver ~1500/mo.
Agreed: if order placed by Jan. HPK can deliver all 16,700 by Oct. 2005• Also discussed option to extend quantity by 3,000
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 23
Summer 2003 US finds broken cable traces• US reviews handling and studies alternative handling schemes• CERN finds breaks are widespread• Vendor says design is fatally flawed
• New design implemented after only 2 months delay
Winter 2004 US finds strange failure mode in modules• US traces the problem to the hybrid• CERN responds instantaneously – halts all hybrid production
• Find vias are not properly plated, with breaks occurring at unknown rate• US Halts production of TOB and TEC modules except for ST qualification• Many TEC & TIB modules already done in EU (small radius HPK thin sensor
modules)• EU continues building
Summer 2004: Vendor bought out. • Management serious about solving this problem, with better resources. • 4 variations of design processed
Autumn 2004: QC Engineer at vendor - all trials are highly successful!• Week October 15 2004 CMS qualifies substrate• Week October 22 – CMS to qualify fully loaded hybrids
Timeline of Hybrid Issues
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 24
Flex cable fragility
• Problem was quickly solved • Good US/CERN relationship
• CERN relationship with vendor
1.Hybrid Cable Problem
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 25
CuExample of a good via
Example of a bad via
2.Good Vias and Bad Vias
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 26
US Hybrids Delivery Schedule
Oct. ’04: 200 TB hybrids • old processing, known via prob. – hesitant to use with HPK sensors
Nov.’04: 270 TOB hybrids • not the most recent design but all passed the testing, and fraction
was test with all passing extreme thermal testing
Jan.’05: 200 TOB + 100 TEC hybridsRamping up to Apr. ’05
• Monthly rates ~700 TOB, ~500 TEC• Half of the TEC will be sent back to Europe after they are wire-bonded
and tested at FNAL/UCSB/MEX
• Each of the 3 North American hybrid processing centers has a minimum sustainable capacity of > 24/d > 1600/mo
• We can lose a hybrid processing center at any time without loss of hybrid throughput
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 27
Winter-Spring ’03: CERN reports that modules arriving from US have huge numbers of damaged wirebonds
• US proposes a successful solution (encapsulate joints)
• CERN confirms
Winter-Spring ’04: Rochester studies find flexible mother cable in rod can damage module wirebonds in transport
• CERN/US engineers study problem and design Al stabilizers.
Autumn ’04: US Discovered error in cross-bar placement on roughly 50% of rod frames (type-H).
• Helsinki developing the repair method.
• US will ship back ~40 type H rod frames for repair
Large numbers of rods will be stockpiled in advance of full production of modules
Module and Rod Transportation
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 28
US CMS Tracker Group
• Brown University• R. Hooper, G. Landsberg, C. Nguyen, H. Nguyen
• University of California, Riverside (UCR)• P. Gartung, G. Hanson, G.Y. Jeng, G. Pasztor
• University of California, Santa Barbara (UCSB)• A. Affolder, S. Burke, C. Campagnari, F. Garberson, D. Hale, J. Incandela, • P. Kalavase, S. Kyre, J. Lamb, R. Taylor, D. White + technicians
• University of Illinois, Chicago (UIC)• E. Chabalina, C. Gerber, L. Nigra, T. Ten
• Fermilab (FNAL)• M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians
• University of Kansas (KU)• P. Baringer, A. Bean, L. Christofek, D. Coppage
• Mexican Consortium: • Cinvestav: H. Castilla, R. Perez, A. Sanchez• Puebla: E. Medel, H. Salazar• San Luis Potosi: A. Morelos
• University of Rochester (UR)• R.Demina, R. Eusebi, E. Halkiadakis, A. Hocker, S. Korjenevski, P. Tipton
19 joined group this past year (includes 3 UCSB technicians)- now adding a few more post-docs & students
9 left the group (includes KSU plus several from UCSB)
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 29
Preparations
Good parts in large quantities are coming in• Deliveries will not be smooth• Meeting the schedule will require
• Higher than expected peak production rates• Extremely robust and stable production lines• Well trained personnel
Previous proven capacity in US is 15 modules/day/site• Further capacity expansions
• Almost no further fabrication equipment needed and no expansion in test equipment required
• UCSB and FNAL have already completed these changes
• Achieve by extending work day (split shifts) and/or adding support personnel to major production tasks
Rates now possible:• FNAL: 18/day sustainable and 21-24/d peak• UCSB: 21/d sustainable and 27-30/d peak
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 30
Assembly Plates
UCSB Plates # Fabricated (parts made)
# Commissioned (ready to be used)
plates used in module production so far
TOB R-phi 7 7 7
TOB Stereo 3 3 3
TEC R5 R-phi 2 2 2
TEC R5 Stereo 2 2 2
TEC R6 5 5 5
TEC R7* 2 2 2
FNAL Plates
TOB R-phi 5 5 5
TOB Stereo 3 3 3
Total 29 29 29
Total of 29 plates in the US (capacity of 3 modules per plate)UCSB setup to do TEC.OR.TOB in any given day
All have been exercised and are ready for use.
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 31
US Production Steps/Status
Task Capacity Manpower issues Software
Issues?
Hardware
IssuesHybrid Bonding & Thermal Cycle
84/d Mexico not yet online No No
Module Assembly >50/d None No No
Module Bonding >50/d None No No
ARC Testing >50/d None No No
LT Testing 200/wk UCR post-doc search No No
ARC LED >50/d None No No
Module Reinforcing
>50/d None No No
Rod Assembly >6/d None No No
Single rod test >6/d UCSB post-doc search Yes Possibly
Multi-rod burn-in 32/wk
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 32
97% modules meet the current stringent geometric specs• Few failures are just outside the
relative angular requirement
US now applies 2nd order corrections • No new modules outside specs
Production quality excellent!• Single Sensor Modules
• 0.20% Faulty strips• Introduced faults < 0.1% rate
• Two Sensor Modules• 0.55% Faulty Strips
• Introduced faults < 0.1% rate
• Will be much lower w/HPK
Dx(Frame-Sensor) (mm)
Dx(Sensor-Sensor) (mm)
Dq(Frame-Sensor) (mdeg)
Dq(Sensor-Sensor) (mdeg)
Module Mechanical Precision
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 33
MC Study of effect of misalignments
on pt resolution:
single sample, pT=100 GeV
Recent US modules
Mean 0.0RMS 3.5 mMin -7 mMax +7 m
Misalignments and PT Resolution
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 34
Hybrid Thermal Cycler/ARCS Status
Recently upgraded code• PLL forcing
• Drifting pedestal check
• Added xml file auto-upload
UCSB, FNAL and Mexico City test stands are commissioned and ready
SetSet--up in Clean Roomup in Clean Room
SetSet--up in Clean Roomup in Clean Room
ChillerChiller
Cold BoxCold Box
PC for MonitoringPC for Monitoring+ Controlling+ Controlling
ElectronicsElectronics
Gas/Water Flow ControlGas/Water Flow Control
We have all ARCS equipment+spares we need
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 35
DAQ Equipment Status
2 fully equipped Vienna boxes at UCSB and FNALUCR Vienna box has enough DAQ equipment for 4 slot stand
• TPO needed for 6 slots2 single-rod stands
• Just received enough oMUX cards so re-cabling between rod types unnecessary
2 multi-rod thermal cyclers
• Both MUXs have been used to test 5 rods tested simultaneously
• Have enough equipment to fully commission system
• Only 5 MUX cards + DAQ spares missing
To instrument UCR Repair Center & have all critical spare components required in the US we need:
• 2 TSC – in production?
• 3 TPO – in production?
• 2 eMUX boards – “ “
• 7 oMUX boards – “ “
• 5 VUTRI - in production
• 10 PAACB – half are built, half being assembled now
• 10 hybrid-to-utri adaptors – in production
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 36
DAQ Equipment Status II
With current TPOs :• With 1 failure we lose either:
• 70% capacity of a Vienna box• 1 single rod system • 1 multi-rod system
• Cannot run more than 16 APVs in UCR stand
Without the additional MUX, VUTRI, PAACB, hybrid-to-utri adapter boards
• Can’t run UCR LT at full capacity which is crucial to ops of US Repair center
With current TSC complement:• With 1 failure we lose either:
• 1 Vienna box• 1 single rod stand, or• 1 rod thermal cycler
Component shortages and failures ↔ potential to severely limit production testing capacity
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 37
Backup Equipment
Spare sensor and hybrid tools were produced at UCSB for UCSB, FNAL and Brussels.
Upgraded OGP computer OS and OGP software• Automated routine occasionally missed fiducial marks. The new
software fixes this problem.
Set up back-up gantry computers with spare U600 controllers and expansion cards already installed.
We purchased backup components for every piece of production equipment or tooling that, if it were to fail, would cause a reduction in production rates.
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 38
US Module Types
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 39
6 R6 modules built using new HPK sensors
All 6 modules are perfect• Not a single flaw
IV profile as expected• Turn-on at low voltage
• Plateau bias current ~ 600-700 nA
HPK R6 Module I-V
0
100
200
300
400
500
600
700
800
0 50 100
150
200
250
300
350
400
450
Bias Voltage (V)
Bia
s C
urr
ent
(nA
) 29587
29589
29592
27627
27628
27629
First HPK Module Results From UCSB
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 40
UCSB TEC Production
Miscellaneous info• Have built all required types successfully: R5S, R5N, R6, R7• 25 shipping boxes (20 modules each) built • All carrier plates (100 per type) and all wirebond fixtures complete
Capacity • Could saturate UCSB production capacity with TEC modules
• Will depend on need and availability of parts as well as TOB production parts availability and schedule
• Another step higher in production capacity (by extending work day via overlapped shifts):
• Bonding and Testing capacity adequate• LT testing capacity limit is ~100 per week • Eventually will be mostly TEC (TOB burn-in shifted to rods) or sampled
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 41
Outstanding problems/issues
DB stability• For our production rates, we must automate all DB queries.
• Need to standardize and maintain stable all data structures
• We rely on data to be accurate and complete from all preceding processing of components and structures.
• Successfully collaborating with our int’l colleagues
Old or un-installable components• Prefer to remove them physically from our production sites and to
have them properly marked in DB
Rods• We have recently achieved major milestones with rods but we are
not out of the woods. See below
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 42
Rods
Rod assembly understoodRod Testing
• Single rod testing is under control
• Multi-rod• Had many problems with software and hardware
• Recently achieved major milestone at FNAL• Can now run maximum at capacity (8 SS rods or 6 DS rods – i.e. up to 72
modules) for 3 days with thermal cycles!
Remaining• Get UCSB multi-rod test stand operational at same level as FNAL
• Had problems with some hardware- now fixed
• To finalize fault finding tests
• Finalize Database info and transfer methods
Need experience with many rods to determine if there are issues with components.
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 43
Mechanics:Tracker Outer Barrel
0.9 m0.9 m
Full Prototype Wheel(for MSGCs)
Final Cylinders at CERN
Rods before/after modules installed
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 44
Support mechanics : Support mechanics : CF space frames CF space frames
and/or Honeycomb and/or Honeycomb structuresstructures
Mechanics: Tracker Inner Barrel
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 45
Digital Optical Hybrid
Interconnect Board
Analogue Optical Hybrid
Frontend Hybrid R#2
R#4
R#6
Mechanics:Tracker End Caps
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 46
May 2003 Beam Test (Bunched 25 ns beams of muons and pions)
• Systems of 6-10 TIB, TEC, TOB modules
Detector performance as expected!
May 2004 Beam Test• Multiple rods, petals, and shells
• Larger system integration tests
• Tracking tests• Position resolution, hit efficiency
Beam Direction
Substructures in Test Beams
Michael Eppard Test General Meeting 23.07.2004
The TOB Cosmic rack
in the test beamin June 2004
Michael Eppard (CERN)on behalf of TOB CERN
23rd July 2004
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 48
S/N > 32
S/N Module 4 @ 300V (PEAK)
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 49
Ivan Reid
ORCA reconstruction of tracks
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 50
Cost Performance
Delays have cost us• Recently extended production to Jan. 2006
• Net increase of 600k$ in project
Other US costs• Paid for Masks (NRE) at Hamamatsu to be able to transfer sensor
order from ST• 290k$
• Misc. equipment for higher/more robust production• ~100K$
Anticipated costs • US Tech. to work at CERN on hybrids for 6 months
• 50k$ (?)
Currently schedule has no contingency…
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 51
SST Schedule
Completion: Jan. 2006
An aggressive schedule
Will be revised:
Assumes 500 hybrids/wk
Actual 400 hybrids/wk
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 52
Summary
No longer have a manpower shortage• In process of adding some personnel at UCSB
Have studied all possible threats to production stability• Purchased or manufactured spares
Further increased capacity to ~50 modules/d• Requires manpower (~ 4-5 FTE total)
Systems• All stages of production have been exercised and are near to final
except rod testing
• Multi-rod stands rapidly converging
US CMS Si Tracker Project presentation to the Program Management Group at Fermilab; 22 October 2004, J. Incandela (UCSB) 53
Strips have been at war with poor components• ST sensors have too many uncertainties
• Switched to HPK!
• Hybrids problem is solved – large deliveries starting early ‘05
US Role has been extremely importantWe are doing everything we can do
Conclusion
Recommended