Ther High Performance and High Reliable Solution · 2020. 3. 3. · TEHC1-12714...

High Performance and Highly Reliable Solutionfor Cooling and Heating Application

Creative technology with fine manufacturing processes provides you the reliable and quality productsTel: +86-791-88198288 Fax: +86-791-88198308 Email: sales@thermonamic.com.cn Web Site: www.thermonamic.com.cn

Thermonamic Module

Specification of Thermoelectric ModuleTEHC1-12714

DescriptionThe 127 couples, 50 mm × 50 mm size single module which is made of our high performance ingot to achieve superior

cooling performance and 74 ºC or larger delta Tmax, is designed for superior cooling and heating applications. Beyond thestandard below, we can design and manufacture the custom made module according to your special requirements.

Features Application● High effective cooling and efficiency ● Food and beverage service refrigerator● No moving parts, no noise, and solid-state ● Portable cooler box for cars● Compact structure, small in size, light in weight ● Temperature stabilizer● Environmental friendly, RoHS compliant ● Liquid cooling● Precise temperature control ● CPU cooler and scientific instrument● Exceptionally reliable in quality, high performance ● Photonic and medical systems

Performance Specification SheetTh (ºC) 27 50 Hot side temperature at environment: dry air, N2

DTmax (ºC) 74 83Temperature Difference between cold and hot side of the modulewhen cooling capacity is zero at cold side

Umax (Voltage) 16.8 18.06 Voltage applied to the module at DTmaxImax (Amps) 14 14 DC current through the modules at DTmaxQCmax (Watts) 146 164 Cooling capacity at cold side of the module under DT=0 ºC

AC resistance (Ohms) 0.93 1.02 The module resistance is tested under AC

Tolerance (%) ± 10 For thermal and electricity parameters

Geometric Characteristics Dimensions in millimeters Manufacturing Options

A. Solder: C. Ceramics:

1. T100: BiSn (Melting Point=138ºC) 1. Alumina (Al2O3, white 96%)(AlO)

2. T200: CuSn (Melting Point= 227 °C) 2. Aluminum Nitride (AlN)

B. Sealant: D. Ceramics Surface Options:

1. NS: No sealing (Standard) 1. Blank ceramics (not metalized)

2. SS: Silicone sealant 2. Metalized (Copper-Nickel plating)

3. EPS: Epoxy sealant

4. Customer specify sealing

SuffixThicknessH / (mm)

Flatness/Parallelism (mm)

Lead wire length (mm)Standard/Optional length

TF 0:4.3±0.1 0:0.05/0.05 150±3/Specify

TF 1:4.3±0.05 1:0.025/0.025 150±3/Specify

Eg. TF00: Thickness 4.3±0.1(mm) and Flatness 0.05/0.05(mm)

Naming for the ModuleOrdering Option

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mailto:sales@thermonamic.com.cn



Thermonamic Module

Specification of Thermoelectric Module

TEHC1-12714

Performance Curves at Th=27 ºC Performance Curves at Th=50 ºC

Standard Performance Graph Qc= f(DT)

Standard Performance Graph V= f(DT)

Standard Performance Graph Qc= f(V)

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mailto:sales@thermonamic.com.cnmailto:info@thermonamic.com



Thermonamic Module

Specification of Thermoelectric ModuleTEHC1-12714

Performance Curves at Th=27 ºC Performance Curves at Th=50 ºC

0 2 4 6 8 10 12 14 160

1

2

3

4

5

6

Voltage(V)

C.O

.P

DT=30C DT=20C DT=10C DT=0C

0 2 4 6 8 10 12 14 160

1

2

3

4

5

6

Voltage(V)

C.O

.P


Standard Performance Graph COP = f(V) of DT ranged from 0 to 30 ˚C

5 6 7 8 9 10 11 12 13 14 15 16 170.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Voltage(V)

C.O

.P

DT=60C DT=50C DT=40C

4 6 8 10 12 14 16 180.0

0.2

0.4

0.6

0.8

Voltage(V)

C.O

.P


Standard Performance Graph COP = f(V) of DT ranged from 40 to 60/70 ˚C

Remark: The coefficient of performance (COP) is the cooling power Qc/Input power (V × I).

Operation Cautions

● Attach the cold side of module to the object to be cooled

● Attach the hot side of module to a heat radiator for heat dissipating

● Operation below Imax or Vmax

● Work under DC

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Ther High Performance and High Reliable Solution · 2020. 3. 3. · TEHC1-12714...

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