Surface Analysis Dr. Lynn Fullergnusha.org › ~nmz787 › mems › unorganized › surface.pdf ·...

Surface Analysis

Dr. Lynn FullerDr. Fuller’s Webpage: http://people.rit.edu/lffeee

ROCHESTER INSTITUTE OF TECHNOLOGYMICROELECTRONIC ENGINEERING

Rochester Institute of Technology

Microelectronic Engineering

1-31-2011 Surface.ppt

Dr. Fuller’s Webpage: http://people.rit.edu/lffeeeMicroelectronic Engineering

Rochester Institute of Technology82 Lomb Memorial DriveRochester, NY 14623-5604

Tel (585) 475-2035Fax (585) 475-5041

Email: Lynn.Fuller@rit.eduMicroE webpage: http://www.microe.rit.edu

Surface Analysis

OUTLINE

IntroductionScanning Electron Microscopy (SEM)Transmission Electron Microscopy (TEM)Atomic Force Microscopy (AFM)Energy Dispersive Analysis of x-rays (EDAX)Auger Electron Spectroscopy

Auger Electron SpectroscopyX-ray Fluorescence Spectroscopy (XPS)Secondary Ion Mass Spectroscopy (SIMS)Capacitance Voltage MeasurementsSurface Charge Analyzer

Surface Analysis

INTRODUCTION

Surface analysis refers to a collection of techniques to get information

about the chemical or physical nature of a surface. (few µm)

Surface Analysis

LEO EVO 50

Surface Analysis

AMRAY 1830 1 & 2

Surface Analysis

PrimaryElectronBeam

SecondaryElectrons, 20Å

AugerElectrons10Å Sintillator

(Phosphor Coated)

+200 V

-2000 V

-3000 V

-4000 V

hv-1000 V

Photo multiplier

SCANNING ELECTRON MICROSCOPE (SEM)

Characteristic X-rays

Back scatteredElectrons

X-RayContinuum

(Phosphor Coated) Photo multiplierTube (low work Function)

Specimen Current Detector

Surface Analysis

PrimaryElectron

Very ThinSpecimen< 1 µm

SpecimenSupportGrid

TRANSMISSION ELECTRON MICROSCOPE

< 1 µmSintillator(Phosphor Coated)

Photo multiplierTube (low work Function)

+200 V

-2000 V

-3000 V

-4000 V

-1000 V

Surface Analysis

TEM OF MOS STRUCTURE

Surface Analysis

LEO EVO 50 SEM & EDAX

Surface Analysis

SEM EXAMPLES

Surface Analysis

SEM EXAMPLES

Surface Analysis

SEM WITH FOCUSED ION BEAM (FIB)

Surface Analysis

SEM WITH FOCUSED ION BEAM (FIB)

FIB allows crossection SEM images to be made at any point

by cutting a trench with a focused beam of argon ions.

Surface Analysis

Surface~ 100 Å Gap

SCANNING TUNNELING MICROSCOPE (STM)

Piezoelectric Motors Scan Tip in X and Y, Electronics control Z such that the Tunneling Current I is Constant. The Control Voltage for Z is a Measure of Surface Topology

Surface Analysis

ATOMIC FORCE MICROSCOPE (AFM)

Surface Analysis

ATOMIC FORCE MICROSCOPE (AFM)

� Standard Sharp Apex Slender Long Used in Contact mode

� CD Mode (Conical and Flared)

Flared tip able to measure undercut sidewalls

Used in non-contact mode

Surface Analysis

PrimaryElectron

CharacteristicX-rays

AugerElectrons10Å

ENERGY DISPERSIVE ANALYSIS OF XRAYS (EDAX)

X-rays

1 µmX-RayContinuum

Surface Analysis

PRIMARYELECTRON

En = -13.6 Z2/n2IRON

Atomic Number26

E1 = -9194 eVE2 = -2298 eVE3 = -1022 eV

ENERGY DISPERSIVE ANALYSIS OF XRAYS (EDAX)

E3 = -1022 eV

E =h ν ν ν ν or λ= λ= λ= λ=h c //// E

KΒ x-ray

Notation: K x-rays are associated with

transitions to 1st shell, L x-rays to the 2nd

shell. α x-rays are between adjacent shells, Β

x-rays are two shells apart, etc.

Surface Analysis

Crystal Detector

Liquid Nitrogen Cooled

Semiconductor DetectorCryogenic Semiconductor Detector

Surface Analysis

EDAX ANALYSIS OF FAILED RF PIN

Failed RF Pin: 40XFailed RF Pin: 320X

Point A & B Analyzed using EDAX

20.48KEV 20.48KEV

MLK MODE SELECT ELEMENT

LK Z=30 ZN

PR=S 319 SEC 0 INT

V=4096 H=20KEV 1:1 AQ=20KEV 1H

ML Z=80 HG

PR=S 150 SEC 0 INT

V=4096 H=20KEV 1:1 AQ=20KEV 1H

ENERGY KEV ENERGY KEV

POINT APOINT B

20.48KEV20.48KEV

LK Z=29 CU

PR=S 319 SEC 0 INT

V=4096 H=20KEV 1:1 AQ=20KEV 1H

MLK Z=41 NB

PR=S 150 SEC 0 INT

V=4096 H=20KEV 1:1 AQ=20KEV 1H

ENERGY KEV

ENERGY KEV ENERGY KEV

ENERGY KEV

POINT APOINT B

Surface Analysis

PrimaryElectron

CharacteristicX-rays

AugerElectrons10Å

AUGER ELECTRON SPECTROSCOPY

X-rays

1 µmX-RayContinuum

Surface Analysis

Auger analysis showed an aluminum

particle contaminated the wafer.

Surface Analysis

� Simultaneous Process� Ionization of Core Electron� Upper level electron falls into

lower energy state� Energy release from second

� Energy release from second electron allows Auger electron to escape

� The illustrated LMM Auger electron energy is ~423 eV (EAuger = EL2 - EM4 - EM3)

http://www.cea.com/cai/augtheo/process.htm

Surface Analysis

� Chart of principal Auger electron energies

� Dots indicate electron energies for principal Auger peaks for each element

element

http://www.cea.com/cai/augtheo/energies.htm

Surface Analysis

ESCA or XPS

Electron Spectroscopy for ChemicalAnalysis (ESCA) or X-ray PhotoElectron Spectroscopy (XPS)

X-raySource

Electrons

Sample

Surface Analysis

Ion BeamGun

MassSpectrometer

SECONDARY ION MASS SPECTROSCOPY (SIMS)

Sample

Surface Analysis

Quadrupole FilterGas Sample

The Quadrupole Filter has voltages such that down the center there is a zero potential equipotential surface. Only ions of a certain mass make it all the wayto the photomultiplier tube. The voltage applied to the filter at radio frequencyand DC selects the mass.

RESIDUAL GAS ANALYZER (RGA)

Quadrupole Filter +2000+4000

Filiment

PhotomultiplierTube

Surface Analysis

silicon

εεεε εεεε

Oxide, XoxMetal

CAPACITANCE VOLTAGE MEASUREMENTS

-10 < V < +10

Cox= εεεεo εεεεr Area/Xox

Apply a DC voltage (V) to the capacitor and measure

the capacitance. High frequency and low frequency

capacitance measurement techniques are available.

Surface Analysis

CV MEASUREMENTS

High Frequency

Low Frequency

Accumulation

Depletion

Inversion

CFBN-Type Silicon

High Frequency

Low Frequency

Accumulation

Depletion

Inversion

VFB VT

CFBP-Type Silicon

Surface Analysis

LED Light SourceCapacitive

Pickup

Signal AmplifierHigh Voltage AmplifierLight Controller and ModulatorData AcquisitionComputer

Electrode

Pickup

Silicon

Surface Analysis

Accumulation

Inversion

WFB+ -

Wmid gap

WTP-type Wafer

Accumulation

Inversion

WFB +-

Wmid gap

Qind 0

N-type Wafer

Surface Analysis

Login: FACTORYPassword: OPER<F1> Operate<F1> Test Place the blank spot in middle of wafer on center of the stageSelect (use arrow keys, space bar, page up, etc)

PROGRAM = FAC-P or FAC-NLOT ID = F990909WAFER NO. = D1TOX = 463 (from nanospec)

SCA-2500 SETUP

WAFER NO. = D1TOX = 463 (from nanospec)

<F12> start test and wait for measurement<Print Screen> print results<F8> exit and log off<ESC> can be used anytime, but wait for

current test to be completed

Surface Analysis

EXAMPLE OF SCA OUTPUT MEASURED AT RIT

Surface Analysis

EXAMPLE OF SCA OUTPUT MEASURED AT RIT

Surface Analysis

REFERENCES

1. Scanning Electron Microscopy, Michael T. Postek, et, al., Ladd Research Industries, Inc., 1980.

2. Micro-X7000 Operating Manual, Kevex Corporation, 1101 Chess Drive, Foster City, CA 94404, 1982.

3. EDAX Inc., 91 McKee Drive, Mahwah, NJ 07430-9978, Tel (201) 529-3156

4. AFM see, http://spm.phy.bris.ac.uk/techniques/AFM/, and http://www.fys.kuleuven.ac.be/vsm/spm/images/introduction/afm.html

Surface Analysis

HOMEWORK: SURFACE

1. Calculate the wavelength of the Kα and LΒ x-ray for copper.]

2. Explain how SIMS gives doping profiles.

3. Why can’t Auger and a ESCA give doping profiles.

Surface Analysis Dr. Lynn Fullergnusha.org › ~nmz787 › mems › unorganized › surface.pdf ·...

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