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March 2014 DocID023150 Rev 3 1/14
STL6N2VH5
N-channel 20 V, 0.025 Ω typ., 6 A STripFET™ V
Power MOSFET in a PowerFLAT™ 2x2 package
Datasheet — production data
Figure 1. Internal schematic diagram
Features
• Very low switching gate charge
• Very low thermal resistance
• Conduction losses reduced
• Switching losses reduced
• 2.5 V gate drive
• Very low threshold device
Applications• Switching applications
DescriptionThis device is an N-channel Power MOSFET
developed using STMicroelectronics’
STripFET™V technology. The device has been
optimized to achieve very low on-state resistance,
contributing to a FOM that is among the best in its
class.
PowerFLAT™ 2x2
12
3
65
4
12
3
1(D) 2(D) 3(G)
6(D) 5(D) 4(S)
D S
AM11269v1
Order code VDS RDS(on) max. ID PTOT
STL6N2VH5 20 V
0.03 Ω (VGS
=4.5 V)
6 A 2.4 W
0.04 Ω (VGS
=2.5 V)
Table 1. Device summary
Order code Marking Packages Packaging
STL6N2VH5 STD1 PowerFLAT™ 2x2 Tape and reel
www.st.com
Contents STL6N2VH5
2/14 DocID023150 Rev 3
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
DocID023150 Rev 3 3/14
STL6N2VH5 Electrical ratings
14
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
VDS
Drain-source voltage 20 V
VGS
Gate-source voltage ± 8 V
ID
(1)
1. The value is rated according Rthj-pcb
Drain current (continuous) at Tpcb
= 25 °C 6 A
ID
(1)Drain current (continuous) at T
pcb = 100 °C 3.75 A
IDM
(1),(2)
2. Pulse width limited by safe operating area.
Drain current (pulsed) 24 A
PTOT
(1)Total dissipation at T
pcb = 25 °C 2.4 W
TJ Operating junction temperature
-55 to 150
°C
Tstg Storage temperature °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rthj-pcb
(1)
1. When mounted on FR-4 board of 1inch², 2oz Cu, t < 10 sec
Thermal resistance junction-pcb 52 °C/W
Electrical characteristics STL6N2VH5
4/14 DocID023150 Rev 3
2 Electrical characteristics
(TCASE
= 25 °C unless otherwise specified)
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSS
Drain-source breakdown
voltage
ID
= 250 μA, VGS
= 0 20 V
IDSS
Zero gate voltage drain
current (VGS
= 0)
VDS
= 20 V, 1 μA
VDS
= 20 V, TJ
= 125 °C 10 μA
IGSS
Gate body leakage current
(VDS
= 0)
VGS
= ±8 V ±100 nA
VGS(th)
Gate threshold voltage VDS
= VGS
, ID
= 250 μA 0.7 V
RDS(on)
Static drain-source on-
resistance
VGS
= 4.5 V, ID
= 3 A 0.025 0.03 Ω
VGS
=2.5 V, ID
= 3 A 0.031 0.04 Ω
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss
Input capacitance
VDS
= 16 V, f=1 MHz,
VGS
=0
- 367 - pF
Coss
Output capacitance - 92 - pF
Crss
Reverse transfer
capacitance
- 16 - pF
Qg
Total gate chargeV
DD = 10 V, I
D = 2 A
VGS
= 4.5 V
(see Figure 14)
- 4.6 - nC
Qgs
Gate-source charge - 0.9 - nC
Qgd
Gate-drain charge - 1 - nC
DocID023150 Rev 3 5/14
STL6N2VH5 Electrical characteristics
14
Table 6. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on)
Turn-on delay time
VDD
= 10 V, ID
= 2 A,
RG
= 4.7 Ω, VGS
= 4.5 V
(see Figure 13)
- 4.8 - ns
tr
Rise time - 14.4 - ns
td(off)
Turn-off delay time - 17 - ns
tf
Fall time - 4 - ns
Table 7. Source drain diode
Symbol Parameter Test conditions Min Typ. Max Unit
ISD
Source-drain current - 6 A
ISDM
(1)
1. Pulse width limited by safe operating area
Source-drain current (pulsed) - 24 A
VSD
(2)
2. Pulsed: pulse duration=300μs, duty cycle 1.5%
Forward on voltage ISD
= 2 A, VGS
= 0 - 1.1 V
trr
Reverse recovery timeISD
= 2 A,
di/dt = 100 A/μs,
VDD
= 16 V, TJ
= 150 °C
- 10 ns
Qrr
Reverse recovery charge - 24 nC
IRRM
Reverse recovery current - 4.8 A
Electrical characteristics STL6N2VH5
6/14 DocID023150 Rev 3
2.1 Electrical characteristics (curves)
Figure 2. Safe operating area Figure 3. Thermal impedance
Figure 4. Output characteristics Figure 5. Transfer characteristics
Figure 6. Gate charge vs gate-source voltage Figure 7. Static drain-source on-resistance
ID
1
0.1 1 VDS(V)10
(A)
Operat
ion in
this
area i
s
Limite
d by m
ax R
DS(on)
1ms
100µs
0.1
Tj=150°CTc=25°CSingle pulse
10
10ms
AM18126v1
Single pulse
δ=0.5
0.05
0.02
0.01
0.1
0.2
K
10 tp(s)-4 10-3
10-2
10-1
10-510-3
10-2 10-1 100
pcb
AM18127v1
ID
20
12
4
00 1 VDS(V)2
(A)
3
0.5V
1.5V
VGS=2.5, 3.5, 4.5, 5.5, 6.5 V
8
16
4
AM18128v1ID
16
8
00 0.4 VGS(V)0.8
(A)
0.2 0.6 1
4
12
20
VDS=4V
1.2
AM18129v1
VGS
6
4
2
00 4 Qg(nC)
(V) VDD=10VID=2A
2 6
AM18130v1 RDS(on)
24.8
24.4
241 2 ID(A)
(mΩ)
1.5 2.5
25.2
VGS=4.5V
3 3.5
25.6
26
AM18132v1
DocID023150 Rev 3 7/14
STL6N2VH5 Electrical characteristics
14
Figure 8. Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature
Figure 10. Normalized on-resistance vs temperature
Figure 11. Normalized V(BR)DSS vs temperature
Figure 12. Source-drain diode forward characteristics
C
100
100 8 VDS(V)
(pF)
4 12
Ciss
Coss
Crss
16
AM18133v1 VGS(th)
0.6
0.4
0.2
0-55 -5 TJ(°C)
(norm)
-30
0.8
7020 45 95
ID=250µA
120
1
1.2
AM18134v1
RDS(on)
1.4
0.8
0.4
0TJ(°C)
(norm)
0.2
0.6
1
1.2
1.6
ID=2AVGS=10V
-55 -5-30 7020 45 95 120
AM18135v1 V(BR)DSS
TJ(°C)
(norm)
0.9
0.95
1
1.05
1.1ID=1mA
-55 -5-30 7020 45 95 120
AM18136v1
VSD
0.5 2.5 ISD(A)
(V)
1.5 3.5 4.50.3
0.4
0.5
0.6
TJ=-55°C
TJ=150°C
TJ=25°C
0.7
0.8
0.9
AM18137v1
Test circuits STL6N2VH5
8/14 DocID023150 Rev 3
3 Test circuits
Figure 13. Switching times test circuit for resistive load
Figure 14. Gate charge test circuit
Figure 15. Test circuit for inductive load switching and diode recovery times
Figure 16. Unclamped inductive load test circuit
Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform
AM01468v1
VGS
PW
VD
RG
RL
D.U.T.
2200
μF3.3μF
VDD
AM01469v1
VDD
47kΩ 1kΩ
47kΩ
2.7kΩ
1kΩ
12V
Vi=20V=VGMAX
2200μF
PW
IG=CONST100Ω
100nF
D.U.T.
VG
AM01470v1
AD
D.U.T.
SB
G
25 Ω
A A
BB
RG
G
FASTDIODE
D
S
L=100μH
μF3.3 1000
μF VDD
AM01471v1
Vi
Pw
VD
ID
D.U.T.
L
2200μF
3.3μF VDD
AM01472v1
V(BR)DSS
VDDVDD
VD
IDM
ID
AM01473v1
VDS
ton
tdon tdoff
toff
tftr
90%
10%
10%
0
0
90%
90%
10%
VGS
DocID023150 Rev 3 9/14
STL6N2VH5 Package mechanical data
14
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK®
is an ST trademark.
Package mechanical data STL6N2VH5
10/14 DocID023150 Rev 3
Figure 19. PowerFLAT™ 2 x 2 drawing
8368575_REV_C
DocID023150 Rev 3 11/14
STL6N2VH5 Package mechanical data
14
Table 8. PowerFLAT™ 2x2 mechanical data
Dim.mm.
Min. Typ. Max.
A 0.70 0.75 0.80
A1 0.00 0.02 0.05
A3 0.20
b 0.25 0.30 0.35
D 1.90 2.00 2.10
E 1.90 2.00 2.10
D2 0.90 1.00 1.10
E2 0.80 0.90 1.00
e 0.55 0.65 0.75
K 0.15 0.25 0.35
K1 0.20 0.30 0.40
K2 0.25 0.35 0.45
L 0.20 0.25 0.30
L1 0.65 0.75 0.85
Package mechanical data STL6N2VH5
12/14 DocID023150 Rev 3
Figure 20. PowerFLAT™ 2 x 2 recommended footprint (dimensions in millimeters)
Footprint
DocID023150 Rev 3 13/14
STL6N2VH5 Revision history
14
5 Revision history
Table 9. Document revision history
Date Revision Changes
24-Apr-2012 1 First release.
10-Jan-2013 2
– Modified: RDS(on)
values
– Document status promoted from target data to preliminary data
19-Mar-2014 3
– Modified: the entire typical values in Table 5, 6 and 7– Added: Section 2.1: Electrical characteristics (curves)– Minor text changes
STL6N2VH5
14/14 DocID023150 Rev 3
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