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Modules assembly plan. 19/09/2013. Detector layout. Layout -TDR-5 Baseline for TDR. Inner Barrel (IB) The Inner Barrel consists of the three innermost layers: Inner Layers layer 0, layer 1 and layer 2. Stave. Flexible Printed Circuit (FPC) or Flex. Inner Barrel (IB): 3 layers pixels - PowerPoint PPT Presentation
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Modules assembly plan
19/09/2013
Detector layout
3
Inner Barrel (IB)The Inner Barrel consists of the three innermost layers:
Inner Layerslayer 0, layer 1 and layer 2.
Flexible Printed Circuit (FPC) or Flex.
Pixel Chip
Stave
ColdplateSpaceframe
Inner Barrel (IB): 3 layers pixels
Radial position (mm): 23.4, 31.5, 39.3
Length in z (mm): 270
Nr. of staves: 12, 16, 20
Nr. of chip/stave: 1x9
Nr. of chip: 108, 144, 180
Layout -TDR-5 Baseline for TDR
Outer Barrel (OB): 4 layers pixels
Radial position (mm): 194, 247, 353, 405
Length in z (mm): 843, 1475
Nr. of staves: 22, 28, 40, 46
Nr. of modules: 176, 224, 560, 644
Nr. of chip: 2464, 3136, 7840, 9016
Nr. of chip/module: 2x7
Nr. of modules /half stave: 4, 4, 7, 7
Nr. of modules/stave: 8, 8, 14, 14
Nr. of chips/stave: 112, 112, 196, 196
Spaceframe
Pixel chip
(15mmx30mmx0,05mm)
Module
Layout -TDR-5 Baseline for TDR
Stave
Half-Stave
Cold PlateCold Plate
Quantity of modules and solderings
• Inner barrel– 48 modules x 2 + 10% ~ 110 staves– 990 chips, 49500 solderings
• Outer barrel– 1602 modules +10% ~ 1800 modules– 25200 chips, 1260000 solderings
Total time for production ~ 2 y
Goals of automatic system- achieve placement of chips and position (x,y,z) with 5-10 mm accuracy
- produce ~ 1 module/day with 100% working contacts
Module assembly procedure by laser soldering
1) Placement of chips on vacuum table and position check2) Placement of flex on support and alignment with macor
grid (included in support)3) Placement of flex on chip and alignment4) SnAg balls deposition and check5) Soldering of one chip6) Repeat steps 5 and 6 for all chips7) Soldering check8) Final check of chips position
Additional info:• Fluxless laser soldering might need further tool
and/or steps in the procedure as we are studying:
• Heating of chips (T~ 50-100 C)• Plasma treatment of chips and flex just before soldering• Soldering under N2/H2 (95/5) atmosphere
Module assembly procedure by laser soldering
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