MFT WG5: ladder disk and global assembly Stéphane BOUVIER & Sébastian HERLANT MFT WG7:...

MFT WG5: ladder disk and global assembly

Stéphane BOUVIER & Sébastian HERLANT

MFT WG7: Mechanics and Thermal studies

Jean-Michel BUHOUR & Emili SCHIBLER

ALICE ITS, MFT and O2 Asian Workshop 20151

Assembly, mechanics and

cooling of the MFT

2ALICE ITS, MFT and O2 Asian Workshop

2015

MFT ladder and disk assembly and ongoing

thermal studies

Sensor+FPC Hybrid Integrated Circuit (HIC) with 1 to 5 sensors each.

Carbon plastic CFRP stiffener/protector.

3 Alice Muon meeting - Chia - 26th May 2015

MFT ladder

ALICE ITS, MFT and O2 Asian Workshop 20154

Cold plateFoam

Disk support

Cooling pipes

Manyfold

Water cooling

5

Simplified ladder modelWater velocity in pipes 1 m/sPower distribution 85%(dig)+ 15%(ana)Influence of the water pipe diameter

Cooling Studies (I)

X

Z40 mW/cm2

50 mW/cm2

6

Disks 0, 1 & 2

Alice Muon meeting - Chia - 26th May 2015

stephane.bouvier@subatech.in2p3.fr

Cooling Studies (II)

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Pipe diameter

Ø1=> Ø2 : Tmax -1.5 / -2°C

Composite material

- Tmax > 50°C !!

- Non cooled sensor impossible with ‘standard’ composite

High thermal conductivity composite required (K13D2U) for ‘straight pipes’ configuration

Non cooled sensors

8

Analog part

Digital part

ALICE ITS, MFT and O2 Asian Workshop 2015

WG5 weekly meeting - 12th Mayl 2015

Stiffener in carbone fiber material = cold plate

467MP

Heater

Dummy sensors

FPC

Glue467MP

467MP

Constantan

Dummy ladder for thermal test

constantan wire, 100 µm diameter, 62.4 W/m

Heater, 28 , W 13 x 140 mm, 170 µm thickness

Thermal dissipation of a sensor

Digital part :1 mm width,85 % of the power dissipation2 lenghts of constantan wiresAnalog part :14 mm width, 15 % of the power dissipation

ALICE ITS, MFT and O2 Asian Workshop 2015

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Thermal tests, general diagram

Thermal cameraTc recorder

Power unit

Pomp and chiller

HIC

Cold plate

Water pipe

ThermoCouple

10ALICE ITS, MFT and O2 Asian Workshop

2015

Ladder Assembly

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Micrometric tools toPlace sensors (ITS)

ALICE ITS, MFT and O2 Asian Workshop 2015

Vacuum table(ITS)• To keep sensor in position• To optimize laser soldering

Worktable MFTTo align

sensors/Flex circuit/laser soldering mask

Sensors Laser Soldering: MFT worktable principle

12ALICE ITS, MFT and O2 Asian Workshop

2015

Procedure:• Sensors alignment • Add Flex and Soldering grid.• Check alignment of pads sensors and holes• Install balls (200µm) on the special tool• Put the balls on the soldering grid• Install the vacuum box/ make vacuum• Soldering the balls

Sensors Laser Soldering: Operations

13ALICE ITS, MFT and O2 Asian Workshop

2015

Features for laser soldering operation: Quality of the FPC

Perfect Ni/Au finishing in the hole. Accurate position of the hole. High cleanness (Washing Workshop).

Good precision for alignment and stacking of Sensors/Flex/Soldering grid/balls. Clean worktable and sensors

BallFPC hole

Soldering grid hole

Sensors Laser Soldering: Requirements

14ALICE ITS, MFT and O2 Asian Workshop

2015

TerminalTo monitor laser solderingResults:

• Worktable to be redesign to improve mechanical tolerance• A new production of FPC with better quality

Sensors Laser Soldering: First results

First HIC (5 chips with just connections soldered)

15ALICE ITS, MFT and O2 Asian Workshop

2015

FPC :

*Several prototypes in copper for mechanical purposes and first soldering,

*Final version with traces in aluminum Very expensive, try to reduce the surface

Flexible Printed Circuit design

16ALICE ITS, MFT and O2 Asian Workshop

2015

*Allowed temperature for FPC integrity: up to 140 °C

*Technical choice: Gluing components with conductive glue : H20E

*Produced by Epoxy Technology

*Provided by FTPolymer in France

*Can be cured at 80°C for a minimum of 3 hours

*Commonly used for HEP.

*Specific SMD components : Pd/Ag plating for gluing curing.

*Under discussion with a company for trial

SMD & Connector soldering/gluing

17ALICE ITS, MFT and O2 Asian Workshop

2015

Tools for MFT Ladder

*Laser soldering worktable

*FPC ears cutting system

*Worktable gluing support

*Tools to handle and store the ladders

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First MFT ladder (5 sensors) by November 2015.

Production 2016-2019 at CERN.

504 MFT ladders (2 to 5 sensors). This includes half MFT as spare and 20% of spares ladders.

2 technicians and 1 physicist

10 months

Ladder production

ALICE ITS, MFT and O2 Asian Workshop 2015

19ALICE ITS, MFT and O2 Asian Workshop

2015

Disk Assembly

20ALICE ITS, MFT and O2 Asian Workshop

2015

Design of the prototype done and fabricated for disk 0

Disk assembly tool prototype

Disk support

Ladder positioning reference

FPC tail cutting tool

Dummy cold plate

Disk support positioning referenceDisk support reference plane

ALICE ITS, MFT and O2 Asian Workshop 201521

First assembly of FPCs on a disk :• Position of one FPC defined by 2 pins and the connector => risk of overconstrain

Tests done, assembling work, => design validated (pins, screw, lenght of FPC)

Disk Prototype + ladders

22ALICE ITS, MFT and O2 Asian Workshop

2015

On going gluing tests

HICGlue

Cold plate

Kapton adhesive

HICGlue

Cold plate

Ladder removable mechanically

Removability in whole or in part of the ladder insured by pulling the kapton adhesive

Case 2 : Glue only

Case 1 : kapton adhesive + glue

1-a

HIC

Glue

Cold plate

Kapton adhesive

1-b

Others cases...

Interface Ladder-Disk

Glue Type

Eccobond 45(ITS)

Epoxy

Adhesive tape 467MP

(used in STAR)

Transfert adhesive

LEDPAD SFH52-sided

adhesive, acrylic film

APTEK 2724 A/B(used in STAR)

Silicone

Dow CorningSE 4445

(used in ATLAS)Silicone

Several glue tested

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Disk assembly process, design and specific tooling by April 2016.

Production 2017-2019.

30 half-disks.

One week per half-disk assembly, one week for the survey and one week for qualification.

Global assembly 4 months on surface and 6 months in the cavern (october 2019).

Half-disk production

24ALICE ITS, MFT and O2 Asian Workshop

2015

Thank you