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Service Manual
Model : G
T500
Internal Use Only
Service ManualGT500
Date: June, 2009 / Issue 1.0
- 3 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ............................................... 5
1.1 Purpose ......................................................................5
1.2 Regulatory Information .................................................5
2. PERFORMANCE ............................................... 7
2.1 System Overview .........................................................7
2.2 Usable environment .....................................................8
2.3 Radio Performance ......................................................8
2.4 Current Consumption .................................................16
2.5 RSSI .........................................................................16
2.6 Battery Bar ................................................................16
2.7 Sound Pressure Level ................................................17
2.8 Charging ...................................................................18
3. Technical Description .................................. 19
3.1 Digital Baseband (DBB) & Multimedia Processor ..........19
3.2 Visual part .................................................................39
3.3 Audio Part .................................................................47
3.4 GPADC (General Purpose ADC) and AUTOADC2 ...........54
3.5 Charger control .........................................................55
3.6 Voltage Regulation .....................................................61
3.7 RF Technical Description ............................................62
4. TROUBLE SHOOTING ..................................... 73
4.1 Power ON Trouble ......................................................73
4.2 USB Trouble ..............................................................74
4.3 SIM Detect Trouble ....................................................75
4.4 MicroSD card Trouble ................................................76
4.5 Key and Touch Screen Trouble ....................................77
4.6 Camera Trouble .........................................................81
4.7 Main LCD Trouble ......................................................87
4.8 Keypad Backlight Trouble ...........................................90
4.9 Audio Trouble Shooting ..............................................93
4.10 Charger Trouble Shooting .......................................108
4.11 Bluetooth Trouble ...................................................111
4.12 Wi-Fi Trouble .........................................................114
4.13 GPS Trouble ..........................................................116
4.14 RF Component ......................................................119
4.15 Procedure to check ...............................................120
4.16 Checking Common Power Source Block ..................121
4.17 Checking VCXO Block ............................................128
4.18 Checking Front End Module Block ..........................132
4.19 Checking Front End Module Block input logic ..........133
4.20 Checking WCDMA Block ........................................144
4.21 Checking GSM Block .............................................157
5. Download ................................................... 169
5.1 Requirements ..........................................................169
5.2 GT500 / GT505 Download .......................................170
6. Block Diagram ........................................... 178
7. CIRCUIT DIAGRAM ...................................... 179
8. BGA Pin Map .............................................. 189
9. PCB LAYOUT ............................................... 195
10. CALIBRATION ............................................ 203
10.1 General Description ...............................................203
10.2 Environment ..........................................................203
10.3 Calibration Environment .........................................204
10.4 Program Operation ................................................205
11. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................. 211
11.1 EXPLODED VIEW ...................................................211
11.2 Replacement Parts ................................................213
11.3 Accessory .............................................................243
- 4 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
- 6 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
Copyright © 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
- 7 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item Specification
Shape GSM850/900/1800/1900 & WCDMA Band 1, 8 Bar type - Dual Mode Handset
Size 107 x 54.5 x 11.8 mm
Weight 98g (with standard battery)
Power 1000mAh Li-ion
Over 200 Min (WCDMA, Tx=10 dBm, Voice)
Over 200 Min (GSM, Tx=Max, Voice)
Over 300 hrs (WCDMA, DRX=7)
Over 300 hrs (GSM, Paging period=5)
Antenna Intenna type
Main LCD 3"(400x240), 262K TFT Color LCD
Main LCD BL White LED Backlight
Vibrator Yes (Coin Type)
Speaker Yes
MIC Yes (SMD Type)
Receiver Yes
Earphone Jack Yes
SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V
Volume Key Push Type ( + , - )
Camera Key Push Type
External Memory Micro SD Socket
I/O Connect 5 Pins
Talk Time
Standby Time
- 8 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12~24V (DC)
2.3 Radio Performance
1) Transmitter – GSM Mode
Item Spec. Unit
Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.2) V
Operating Temp. -20 ~ + 60 °C
Storage Temp. -30 ~ + 85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac
No
9k ~ 1GHz -39dBm
1G ~ 1710MHz -33dBm
1710M ~ 1785MHz -39dBm
1785M ~ 12.75GHz -33dBm
100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm
880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm
915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm
1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm
1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm
1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm
Item
1
DCS/PCSGSM
ConductedSpuriousEmission
-39dBm
-33dBm
MS allocatedChannel
100k ~ 1GHz
Idle Mode
1G ~ 12.75GHz
- 9 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
No
30M ~ 1GHz -36dBm
MS allocated 1G ~ 1710MHz -30dBm
Channel 1710M ~ 1785MHz -36dBm
Radiated 1785M ~ 4GHz -30dBm
Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm
Idle Mode 915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm
1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm
1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm
1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm
2
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -31dB
Due to 400kHz -60dB 400kHz -33dB
Output RF modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
Spectrum 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -60dB
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
400kHz -19dB 400kHz -22dB
600kHz -21dB 600kHz -24dB
1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
1
DCS/PCSGSM
-36dBm
-30dBm
30M ~ 1GHz
1G ~ 4GHz
Item
Frequency Error ±0.1ppm ±0.1ppm
3 Phase Error ±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
Condition TU50: ±100Hz TU50: ±150Hz
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error Under RA250: ±200Hz RA250: ±250Hz
TU3: ±150Hz TU1.5: ±200Hz
5Due to
Switchingtransient
4
Multipath and Interference HT100: ±100Hz HT100: ±250Hz
- 10 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
No Item
800kHz
PowercontrolLevel
Power(dBm)
Tolerance(dB)
PowercontrolLevel
Power(dBm)
Tolerance(dB)
5 33 ±3 0 30 ±3
6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3
8 27 ±3 3 24 ±3
9 25 ±3 4 22 ±3
10 23 ±3 5 20 ±3
11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing
GSM DCS/PCS
Frequency offset
Intermodulation product shouldbe Less than 55dB below thelevel of Wanted signal
Mask IN
Intermodulationattenuation
–7
8Transmitter
Output Power
Mask IN
- 11 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2) Transmitter – WCDMA Mode
No Item Specification
1 Maximum Output Power Class3: +24dBm(+1/-3dB) Class4: +21dBm(±2dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
4 Inner Loop Power control in uplink
Adjust output (TPC command) cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4.5 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4.5 group(10equal command group) +1 +8/+12 +
5 Minimum Output Power -50dBm(3.84MHz)
6 Out-of-synchronization handling of output power Qin/Qout:DPCCH quality levels Toff@DPCCH/lor:-22->-28dB Ton@DPCCH/lor:-24->-18dB
7 Transmit OFF Power -56dBm(3.84M)
8 Transmit ON/OFF Time Mask ±25us PRACH, CPCH, uplink compressed mode
9 Change of TFC
±25us power varies according to the data rate DTX: DPCH off (minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
12 Spectrum emission Mask
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz, 30k -35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz, 1M -39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz, 1M -49 dBc@∆f=8.5~12.5MHz, 1M
- 12 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm
14 Spurious Emissions *: additional requirement
-36dBm@f=9~150KHz, 1k BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k -30dBm@f=1~12.75GHz, 1M -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc -41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude(EVM) 17.5% (>-20dBm) (@12.2k, 1DPDCH+1DPCCH)
17 Transmit OFF Power -15dB@SF=4, 768kbps, multi-code transmission
3) Receiver - GSM Mode
No GSM DCS/PCS
1 -105dBm -105dBm
2 C/Ic=7dB C/Ic=7dB
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
4 Wanted Signal: -98dBm 1’st interferer: -44dBm 2’st interferer: -45dBm
Wanted Signal: -96dBm1’st interferer: -44dBm2’st interferer: -44dBm
5Wanted Signal: -101dBm
Unwanted Signal: Depend on freq. Wanted Signal: -101dBm
Unwanted Signal: Depend on freq.Blocking Response
(TCH/FS Class II, RBER)
Item
Sensitivity (TCH/FS Class II)
Co-Channel Rejection(TCH/FS Class II, RBER,
TUhigh/FH)
Intermodulation Rejection
- 13 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
4) Receiver – WCDMA Mode
No Item Specification
1 Reference Sensivitivity Level -106.7dBm(3.84M)
2 Maximum Input Level -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3)
3 Adjacent Channel Selectivity(ACS) 33dB UE@+20dBm output power(class3)
-56dBm/3.84MHz@10MHz UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz UE@+20dBm output power(class3)
-44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 & 2230~2255MHz, band a) UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 & 2255~12500MHz, band a) UE@+20dBm output power(class3)
6 Spurious Response -44dBm CW UE@+20dBm output power(class3)
-46dBm CW@10MHz & -46dBm/3.84MHz@20MHz UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
-47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz
8 Spurious Emissions
4 In-band Blocking
5 Out-band Blocking
7 Intermodulation Characteristic
- 14 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
5) Bluetooth Mode
5.1) Transmitter
No Item
1 Out Power
2 Power Density
3 Power Control
4 TX Output Spectrum -Frequency range
5 TX Output Spectrum -20dB Bandwidth
6 Tx Output Spectrum -Adjacent channel Po
7 Modulation Characteristics
8 Init. Carrier Freq. Tolerance
9 Carrier Frequency Drift
Freq.Range Operating Standby
30MHz~1GHz -36dBm -57dBm
Above 1GHz~12.75GHz -30dBm -47dBm
1.8~1.9GHz -47dBm -47dBm
5.15~5.3GHz -47dBm -47dBm
Power density < 20dBm per 100kHz EIRP
Option 2dB ≤ step size ≤ 8dB
fmax & fmin @ below the level of -30dBm (100khz BW) within 2.4GHz~2.4835GHz
10
1 slot : ≤ ± 25kHz 3 slot : ≤ ± 40kHz 5 slot : ≤ ± 40kHz Maximum drift rate ≤ 20KHz/50usec
Specification
Out of Band Spurious Emissions
≤ 1MHz
≤ -20dBm @ C/I = 2MHz≤ -40dBm @ C/I ≥ 3MHz
140kHz ≤ delta f1 avg ≤175kHz delta f2max ≥115kHz at least 99.9% of alldeltaf2max delta f2avg/deata f1avg≥0.8
≤ ±75KHz
Class 2 : -6~4dBm
- 15 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
5.2) Receiver
No Item
1 Sensitivity single slot packets
2 Sensitivity multi slot packets
Interference Ratio
Co-Channel interference, C/I co-channel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB
Adjacent(≥3MHz)interference to in band -9dB
mirror frequency, C/I image ±1MHz -20dB
interfering Signal Frequency Power Level
30MHz~2000MHz -10dBm
2000MHz~2400MHz -27dBm
2500MHz~3000MHz -27dBm
3000MHz~12.75GHz -10dBm
5 Intermodluation Performance
6 Maximum Input Level
BER ≤ 0.1%@wanted signal -67dBm
BER ≤ 0.1%@wanted signal -64dBm static sinwave signal at f1=-39dBm a BT modulated signal f2=-39dBm(payload PRBS15)
BER ≤ 0.1%@-20dBm
Specification
BER≤0.1%@-70dBm
BER≤0.1%@-70dBm
BER ≤ 0.1%@ (Low,Mid,High Frequency) 2405MHz, 2441MHz, 2477MHz
C/I performance
Blocking Characteristic
3
4
- 16 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
GSM WCDMA
BAR 7 -92±2 =< RSSI -90±2 =< RSSI
BAR 5 -97±2 =< RSSI -105±2 =< RSSI
BAR 4 -100±2 =< RSSI -109±2 =< RSSI
BAR 2 -103±2 =< RSSI -111±2 =< RSSI
BAR 1 -105±2 =< RSSI -113±2 =< RSSI
BAR 0 -105±2 > RSSI -113±2 > RSSI
2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
Stand by Voice Call VT
310 Hours = 3.2mA 210 Min = 280 mA 150 Min = 400 mA
(DRX=7) (Tx=10dBm) (Tx=10dBm)
300 Hours = 3.3 mA 205 Min = 290 mA
(paging=5period) (Tx=Max)
WCDMA
GSM
2.5 RSSI
2.6 Battery Bar
Indication Voltage
BAR 3 (100%) : level full 4.17V ± 0.05V
BAR 3 (40%) -> 2 개 (12%) 3.72 ± 0.05V
BAR 2 (12%) -> 1 개 (3%) 3.62 ± 0.05V
BAR 1 (3%) -> Icon Blinking & Alerting Sound
3.53 ± 0.05V
POWER OFF 3.20 ± 0.05V
- 17 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
2.7 Sound Pressure Level
No
NOM
MAX
NOM -1±3dB
MAX -15±3dB
NOM
MAX
NOM
MAX
5
6
NOM
MAX
NOM -47dBPA under
MAX -36dBPA under
A NOM
C MAX
O NOM -1±3dB
U MAX -12±3dB
S NOM
T MAX
I NOM
C MAX
13
14
NOM
MAX
NOM -45dBPA under
MAX -40dBPA under
SEND
REV.
SEND
REV.
SEND
REV.
SEND
REV.
Specification
1 Sending Loudness Rating (SLR) 8±3dB
Test Item
3 Side Tone Masking Rating (STMR)
2 Receiving Loudness Rating (RLR)
4 Echo Loss (EL) 40dB over
refer to TABLE 30.3
Receiving Distortion (RD) refer to TABLE 30.4
17dB over
8±3dB
-64dBm0p under
8 Idle Noise-Receiving (INR)
MS
7 Idle Noise-Sending (INS)
Sending Distortion (SD)
40dB over
Sending Distortion (SD) refer to TABLE 30.3
25dB over
refer to TABLE 30.4
15 Idle Noise-Sending (INS) -55dBm0p under
16 Idle Noise-Receiving (INR)
HEADSET
Receiving Distortion (RD)
17
TDMA NOISEGSM: Power Level: 5DCS: Power Level: 0
(Cell Power: -90 ~ -105dBm)Acoustic(Max Vol.)
MS/HEADSET SLR: 8±3dBMS/HEADSET RLR: -13±1dB/-
15dB(SLR/RLR: mid-Value Setting)
MS
GSM
-62dBm under
DCS
Headset
GSM
DCS
9 Sending Loudness Rating (SLR)
10 Receiving Loudness Rating (RLR)
11 Side Tone Masking Rating (STMR)
12 Echo Loss (EL)
- 18 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
2.8 Charging
· Normal mode: Complete Voltage: 4.2V
Charging Current: 700mA
· Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
· Extend await mode: At Charging prohibited temperature(0°C under or 45°C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)
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LGE Internal Use Only
3. Technical Description
3.1 Digital Baseband (DBB) & Multimedia Processor
3.1.1 General DescriptionAccess subsystem
- Access Central Processing Unit (CPU) subsystem – ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM
- Access peripheral subsystems – Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial Bus(USB), Universal Asynchronous Receiver/Transmitter (UART), and so on
- Digital Signal Processor (DSP) subsystem – CEVA-X1620, JTAG, Static Random Access Memory (SRAM),and Program Data Read Only Memory (PDROM)
- EDGE/GSM/GPRS (EGG) subsystem – EGG hardware accelerators
-WCDMA subsystem – WCDMA hardware accelerators
-Application subsystem
- Application CPU subsystem – containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM
- Application peripheral subsystems – I2C™, keypad, UART, and so on
- Graphics subsystem – XGAM subsystem
- Audio Processing Execution (APEX) and video encoder subsystems In addition to the two subsystems above, there is also a test block, chip control block, and a pad multiplexing block residing at the top level
DSP
- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 KiB instruction RAM and a 64 KiB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.
- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.
Image Signal Processor(MV9319)
- MV9319 is high-end Image Signal Processor (ISP) supporting image sensors up to 5 mega pixels. Its powerful image processing fuctions such as edge enhancement, color correction, advance interpolation, Auto White Balancing increases the quality of sensor image. MV9319 also supports serial interfaces to Flash LED control.
WCDMA subsystem
- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem
- An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMAsubsystem has three AHB slave interfaces.
- The Ericsson DB 3200 also includes HSDPA class 6 functionality.
- The WCDMA subsystem is handled and provided by Ericsson.
XGAM subsystem
- The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video.
- The XGAM subsystem is handled and provided by Ericsson.
Operation and Services
- I2C™ Interface
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,
- JTAG
- RTC
- ETM9
3. Technical Description
- 20 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
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3. TECHNICAL DESCRIPTION
Figure 3-1-1 GT500 Block Diagram
GT500 Block Diagram
- 21 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.1.2 External memory interfaceRF calibration data, Audio parameters and battery calibration data etc are stored in flash memory area.
A. GT500
2Gb NAND flash memory + 1Gb SDRAM
Table 3- 1- 1. External Memory Interface Spec. of GT500
Figure 3- 1- 2. External Memory Configuration of GT500
Dev ice Part Name Maker Item Time Size Speed
Program speed 200µs 1 page = 528 Byte 2.64MByte/s
Erase speed 2ms 1 Block = 16K Byte 8MByte/s
NAND flash K5D1G12ACD-D075 Samsung
Data Communication- IrDA ® (SIR)- UARTs (ACB, EDB (RS232))- USBPackage- 12 by 12 mm 376 balls, 0.5mm pitch TFBGA Production Package
- 22 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.1.3 Hardware Architecture
A. Block Diagram
Figure 3-1-4. Application system of Ericsson DB3200
Figure 3-1-3. Access system of Ericsson DB3200
g
- 23 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
B. CPU Subsystem
- Access CPU subsystem
The digital baseband controller includes an access CPU subsystem, which includes the submodulesdescribed below. • 32 KiB I-cache • 32 KiB D-cache • Page table • Memory Management Unit (MMU) • JTAG • ETM9 • 26 KiB I-TCM • 8 KiB D-TCM
- Application CPU subsystem
The digital baseband controller includes an Application CPU subsystem, which includes the submodules described below. • 32 KiB I-cache • 32 KiB D-cache • Page table • MMU • JTAG • ETM9 • 8 KiB I-TCM • 8 KiB D-TCM
C. Peripheral Hardware Subsystem
The digital baseband controller includes hardware that supports mobile terminal peripheralssuch as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem.The functional blocks of the Peripheral subsystem connect to the peripheral bus through fourseparate bridges, which provide a simple interface to support different timing and memory access arrangements.
D. DSP Hardware Subsystem
The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kiBinstruction RAM and a 64 kiB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.
E. XGAM Subsystem
The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. The XGAM subsystem is handled and provided by Ericsson.
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3. TECHNICAL DESCRIPTION
F. System Control Subsystem
The SYSCON is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices.The digital baseband controller chip-ID number is readable from the SYSCON. The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.
3.1.4 RF Interface
A. GSM Radio Link Interface
DB3200 controls GSM RF part using these signals through GSM RF chip-RF3300.RF_DATA_ARF_DATA_B
RF_DATA_CRF_DATA_STRB
Figure 3-1- 5. Schematic of GSM RF Interface
B. WCDMA Radio Link Interface
RF_WCDMA_PA_0_ENRF_WCDMA_PA_1_ENRF_WCDMA_DCDC_ENRF_WCDMA_PWRDET_EN
Figure 3-1-6. Schematic of WCDMA RF Interface
TX_ADC_STRBD15
RF_DATA_AB15B16
RF_DATA_BC15
RF_DATA_C
A16RF_DATA_STRB
QDATA_AMP_MSBIDATA_FREQ_MSB
AMP_FREQ_LSB
DATA_STRTX_ADC_STRB
B14RF_WCDMA_PA_0_EN
D14RF_WCDMA_PA_1_EN
RF_WCDMA_PWRDET_EC13
B6TX_POW
B13RF_WCDMA_DCDC_EN
DAC_I_NEGE7D7
DAC_I_POSE6
DAC_Q_NEGDAC_Q_POS
D6
D9ADC_I_NEG
C9ADC_I_POS
ADC_Q_NEGC8D8
ADC_Q_POS
WTX_BAND_2_ENWTX_BAND_1_EN
WRX_Q_P
WPOW_DET_EN
WTX_BAND_8_5_EN
WTX_I_NWTX_I_PWTX_Q_NWTX_Q_P
WRX_I_NWRX_I_PWRX_Q_N
WPOW_DET
- 25 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.1.5 SIM Interface
SIM interface scheme is shown in Figure3-1-7.
SDAT, SCLK, SRST ports are used to communicate DBB(DB3200) with
ABB(AB3100) and filter.
Table 3-1-2. SIM Interface
Figure 3-1-7. SIM Interface
3.1.6 UART Interface
UART signals are connected to DB3200 GPIO through IO connector
Table 3-1-3. UART Interface
SIM (Interface between DBB and ABB)
SDAT SIM card bidirectional data line
SCLK SIM card reference clock
SRST SIM card async/sync reset
VDD
DAT
CLK CARD
RST
SIMVCC
AB3100
SDAT SIMDAT
SCLK SIMCLK
SRST SIMRST
DB3200
SDAT
SCLK
SRST
VDDE_1V8
10K10K
UART0
Resource Name Note
ACC_GPIO_2 ACC_UART0_RX ACC Receive Data
ACC_GPIO_3 ACC_UART0_TX ACC Transmit Data
UART1
APP_GPIO_0 APP_UART_RX APP Receive Data
APP_GPIO_1 APP_UART_TX APP Transmit Data
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3. TECHNICAL DESCRIPTION
3.1.7 GPIO (General Purpose Input/Output) map
In total 60 allowable resources. This model is using 35 resources.GPIO Map, describing application, I/O state are shown in below table.
Table 3-1-4. DB3200 ACC GPIO Map Table
OutputACC_GP_WLAN_RESETnACC_GPIO_30
OutputACC_GP_USB_CSACC_GPIO_27
InputACC_GP_SPI_WLAN_IRQnACC_GPIO_28
OutputACC_GP_GPS_RESETnACC_GPIO_29
OutputACC_GP_WLAN_ENACC_GPIO_31
Access GPIO
GPIO Assigned Name Init Status
ACC_GPIO_0 ACC_USB_HS_STP Output
ACC_GPIO_1 ACC_USB_HS_DIR Output
ACC_GPIO_2 ACC_UART0_RX Input
ACC_GPIO_3 ACC_UART0_TX Output
ACC_GPIO_4 ACC_USB_HS_IN_CLK Input
ACC_GPIO_5 ACC_USB_HS_NXT Input
ACC_GPIO_10 ACC_USB_HS_DATA(4) Input
ACC_GPIO_11 ACC_USB_HS_DATA(5) Input
ACC_GPIO_12 ACC_USB_HS_DATA(6) Input
ACC_GPIO_13 ACC_USB_HS_DATA(7) Input
ACC_GPIO_16 ACC_UART3_RX Input
ACC_GPIO_17 ACC_UART3_TX Output
ACC_GPIO_20 ACC_UART3_CTS Input
ACC_GPIO_21 ACC_UART3_RTS Output
ACC_GPIO_22 ACC_SPI_3AXIS_CSn Output
ACC_GPIO_26 Not used Output
ACC_GPIO_32 ACC_GP_WLAN_PWR_DOWNn Output
- 27 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.1.8 GPIO (General Purpose Input/Output) map
Table 3-1-5. DB3200 APP GPIO Map Table
Application GPIO
GPIO Assigned Name Init Status
APP_GPIO_0 APP_UART_RX Input
APP_GPIO_1 APP_UART_TX Output
APP_GPIO_2 APP_GP_ISP_FLASH_SET Output
APP_GPIO_4 APP_GP_VGA_SDN Output
APP_GPIO_7 APP_GP_TOUCH_SCL Output
APP_GPIO_8 APP_GP_TOUCH_SDA Output/
APP_GPIO_10 input Output
APP_GPIO_11 APP_GP_TOUCH_LDO_EN Output
APP_GPIO_12 APP_GP_ISP_LDO_EN Output
APP_GPIO_13 APP_GP_LCD_ID Input
APP_GPIO_14 Not used Output
APP_GPIO_16 APP_GP_MOTORLDO_EN Output
APP_GPIO_17 APP_MMC_FB_CLK Input
APP_GPIO_21 APP_GP_LCD_IF1 Output
APP_GPIO_22 APP_GP_USW_SCL Output
APP_GPIO_23 APP_GP_USW_SDA Output/
APP_GPIO_24 input Input/Output
APP_GPIO_25 DCON (Dedicated) Output
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3. TECHNICAL DESCRIPTION
3.1.9 USB
The USB block supports the implementation of a “High-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention.The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO register access.The USB block can request up to six DMA channels, three for IN endpoints and three for OUT endpoints.
Table 3-1-6. USB Signal Interface of DB3200
USB data7USB_DAT7
USB chip selectUSB_CS_PD
USB data0USB_DAT0
USB data1USB_DAT1
USB data2USB_DAT2
USB data3USB_DAT3
USB data4USB_DAT4
USB data5USB_DAT5
USB data6USB_DAT6
ULPI stop signalUSB_STP
ULPI direction signalUSB_DIR
USB clockUSB_CLK
ULPI next signalUSB_NXT
Power supply for Asta USB blockVBUS
NoteUSB Function
- 29 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-1-8. Schematic of DB3200 USB block
Figure 3-1-9. Schematic of USB Transceiver
J2USB_SE0_VMUSB_DAT_VP
K2
USB_OEL3
ACC_GPIO_4K8F1
ACC_GPIO_5ACC_GPIO_6
J8G3
ACC_GPIO_7H3
ACC_GPIO_8ACC_GPIO_9
G2
G4
L8ACC_GPIO_2
G1ACC_GPIO_3
J3ACC_GPIO_0ACC_GPIO_1
K3
ACC_GPIO_10H9E1
ACC_GPIO_11ACC_GPIO_12
H10D1
ACC_GPIO_13ACC_GPIO_14
F3D4
ACC_GPIO_15ACC_GPIO_16_USBPRB
C3G5
ACC_GPIO_17ACC_GPIO_18
E4
ACC_USB_HS_STP
USB_DATA(0)USB_DATA(1)USB_DATA(2)
ACC_USB_HS_IN_CLKACC_USB_HS_NXT
ACC_USB_HS_DATA(4)ACC_USB_HS_DATA(5)ACC_USB_HS_DATA(6)ACC_USB_HS_DATA(7)
ACC_USB_HS_DIR
ACC_UART3_RXACC_UART3_TX
ACC_UART3_CTSACC_UART3_RTS
ACC_GP_USB_CSACC_GPS_START
ACC_USB_HS_DATA(3)
ACC_UART0_RXACC_UART0_TX
USB Transceiver
10V
High Speed USB Interface
1%
TP501
TP502
0R
655
VDDE_1V8
R509
1K
51K
R50
0
C51
50.
1u
C51
40.
1u
R64
1
0
TP500
12K
R51
0
4.7u
C51
6
RREF
STPD6
TESTC4
F4VBUS
VC
CF
3
B5VCC_IO1VCC_IO2
B2
F5XTAL1XTAL2
F6
B6C6
DATA7
E5DIR
DMC1D1
DPFAULT
E2
GN
D1
C5
D2
GN
D2
GN
D3
E4
D3ID
NC
1F
1F
2N
C2
D5NXT PSW_N
D4
E6REF1V8
E3REG3V3
C2
CFG0E1
B4CFG1CFG2
B3
CHIP_SELC3A4
CLOCKDATA0
B1A1
DATA1DATA2
A2A3
DATA3DATA4
A5A6
DATA5DATA6
ISP1508AETU502
C5130.1u
2.2u
C51
7
0.1uC500
4.7uC501
4.7uC512
VBAT
ACC_USB_HS_NXTACC_USB_HS_STP
USB_XTAL1
VBUS
USB_DPUSB_DM
ACC_GP_USB_CSACC_USB_HS_IN_CLK
USB_DATA(0)USB_DATA(1)USB_DATA(2)
ACC_USB_HS_DATA(3)ACC_USB_HS_DATA(4)ACC_USB_HS_DATA(5)ACC_USB_HS_DATA(6)ACC_USB_HS_DATA(7)
ACC_USB_HS_DIR
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3. TECHNICAL DESCRIPTION
3.1.11 Bluetooth Interface
GT500 supports Bluetooth operation using ST’s STLC2593C Bluetooth module.
A. General Description
The Bluetooth interface utilizes the SPI interface for control signals going to and from the Bluetooth module. The SPI is also used for data transmissions.
It uses the PCM interface for transmitting audio to and from the Bluetooth module.
The Bluetooth module uses both the 26 MHz master clock signal and the 32,768 kHz low-frequency clock signal for internal timing within the Bluetooth module. The intention is to use the low-frequency clock as a low-power timing provider and to use the 26 MHz as a high precision timing reference used mainly by the Bluetooth radio during operation.
The clock request mechanism is used to minimize current consumption for the total system.
The intention is to use the CLKREQ signal to ask for the master clock when needed, for example, when the Bluetooth radio is operating.
B. SPI InterfaceThe physical SPI interface is made up of 5 signals : clock, chip select, data in, data out and interrupt. When the SPI mode is selected , these signals are available through the BT_UART/BT_SPI and BT_HOST_WAKEUP pins.The SPI interface is Master at the Host side, and Slave at the BT Controller side. It is designed to work with the H4 and enhanced H4 protocol.Also synchronous data packet transfer (sSCO) over HCI is supported.The SPI data length and endianness are configurable.The SPI interface can only operate in half duplex mode.
C. PCM Interface
The PCM interface is used to send audio to and from the Bluetooth module. The interface is a synchronous interface using a PCM clock and a PCM sync signal for synchronization. Two data signals are used for data, one in each direction.
The PCM clock signal operates at frequencies as high as 1 MHz. The word length of the audio data can be 8 or 16 bits. Furthermore, the PCM interface has a function known as MP-PCM, which is an addressing scheme, used to have more than two devices talking on the bus.
To add this function, the data pins have to be bi-directional. Additionally, the position of the audio data relative to the frame sync pulse must be selectable. During the periods within a frame that a device is not transmitting audio data, it must put both PCM data signals in a high-impedance state to allow other devices access.
D. Master Clock and Clock Request Interface
The master clock (MCLK) is a 26 MHz signal used as the high precision clock signal for the Bluetooth module. The signal can be switched on and off by the platform. The master clock request (CLKREQ) is used by the Bluetooth module to ask for the master clock.
If the Bluetooth module asserts the signal high, it gets the master clock. The other alternative for the Bluetooth module is to set the clock request output to high impedance state, indicating that it does not need the master clock. The Bluetooth module receives the master clock, if other parts of the chipset request it.
E. Low Frequency Clock Interface
The low-frequency clock signal (RTCCLK) is used by the Bluetooth module as a low-power clock. The clock is used in different Bluetooth modes, like sniff and park, to have a correct timing on the Bluetooth air interface without having the master clock running.
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3. TECHNICAL DESCRIPTION
The low-frequency clock is always present, in some applications even when the chipset ispowered down.
F. STLC2593C
Based on Ericsson Technology Licensing Baseband Core (EBC) Bluetooth™ specification compliance: V2.1 + EDR.(“Lisbon”)– Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability– Support ACL and SCO links– Entended SCO (eSCO) links– Faster Connection HW support for packet types– ACL: DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3,2-DH5,3-DH1,3-DH3, 3-DH5– SCO: HV1, HV3 and DV– eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5 Adaptive Frequency Hopping (AFH) Channel Quality Driven Data Rate (CQDDR) “Lisbon” Feature– Encryption Pause/Resume (EPR)– Entended Inquiry Response (EIR)– Link Supervision Time Out (LSTO)– Secure Simple Pairing– Sniff Subrating– Quality of Service (QoS) : Packet Boundary Flag, Erroneous Data Delivery Transmit Power– Power Class 2 and Power Class 1.5 (above 4 dBm)– Programmable output power– Power Class 1 compatible HCI– HCI H4 and enhanced H4 Transport Layer– HCI proprietary commands (e.g. peripherals control)– Single HCI command for patch/upgrade download– eSCO over HCI supported Supports Pitch-Period Error Concealment (PPEC) Efficient and flexible support for WLAN coexistence scenarios Low power consumption– Ultra low power architecture with 3 different low power levels– Deep Sleep modes, including Host-power saving feature– Dual Wake-up mechanism: initiated by the Host or by the Bluetooth device Communication interfaces– Fast UART up to 4 MHz– Flexible SPI interface up to 13 MHz– PCM interface– Up to 10 additional flexibly programmable GPIOs– External interrupts possible through the GPIOs– Fast I2C interface as master Clock support– System clock input (digital or sine wave) at 9.6, 10, 13, 16, 16.8, 19.2, 26, 33.6 or 38.4MHz– Low Power clock input at 3.2, 32 and 32.768 kHz ARM7TDMI CPU Memory organization– On chip RAM, including provision for patches– On chip ROM, preloaded with SW up to HCI Ciphering support up to 128 bits key11
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3. TECHNICAL DESCRIPTION
G. GT500 Bluetooth Schematic
Figure 3-1-11. Schematic of STLC2593C
Clock- Clock request
Connected to CLKREQ of DB3200 and AB3100, input to RF3300- Fast clock : 26MHz
Supplied MCLK from RF3300Frequency deviation : ±20ppm
- Low power clock : 32.768kHzSupplied RTCCLK from AB3100
Power- Supplied 2.75V, 1.8V from internal regulators of AB3100
Reset- RESOUT2n signal of DB3200 controls STLC2593C reset.
SPI- Connected to SPI of DB3200- HCI interface between DB3200 and STLC2593C
PCM- Audio signal interface between DB3200/AB3100 and STLC2593C
ANT- 2.4GHz, 50 ohm matching
Keep away from noise signals
on L1, L2 and L3
Common GND on L1, L2 and L3
Careful routing of BT_CLK
Analog GND must be Isolated from
RF GND: Isolate from Common GND
VDD_BT
R73
4
100K
C7340.1u
120p
C74
3
DEA212450BT-7043C15
BP1
4BP2 BP_DC
2
3G
16
G2
1U_BP
VDDE_1V8
FL730
VBAT
R739
110
0
R73
5
110
R741
VDDK_2V75
VSS_BT_ANA
10p
C74
2
100K
R73
2
A23 GND
5VCC
Y4
1 _OE
SN74LVC1G125DRLRU730
VDD_BT
C7390.1u
VDDK_2V75
FB73060
VDDE_1V8
100K
R73
8
DNIR733
C73
50.
1u
C7300.1u
C73
60.
1u
R74
0
0
22n
C74
1
VDDE_1V8
VDDE_1V8
VDDE_1V8
VDDE_1V8
4.7uC731
R730
33
R7370
1uC737
VSS_BT_ANA
VDDE_1V8
100pC732
VSS_BT_RF
VSS_BT_RF
1uC738
R73
1
100K
C74
022
n
VDDE_1V8
C7330.1u
L5L6
NC6
A5
FM_LOUTB5
FM_RCLKD7
C8FM_RFGND
C5FM_ROUT
C9FM_RSTB
E9FM_SCLK
FM_SDIOD8
FM_SENBD9
FM_VAA4
FM_VDB3
FM_VIOD6
D4NC1NC2
F7F8
NC3NC4
L4
NC5
H1L1
BT_VSSRF2BT_VSSRF3
J2K2
BT_VSSRF4
BT_WAKEUPL9
B8FM_FMIP
FM_GND1A3B4
FM_GND2FM_GND3
B6
FM_GND4B7C4
FM_GND5C6
FM_GND6C7
FM_GND7FM_GND8
D5
FM_GPIO1A7A6
FM_GPIO2FM_GPIO3
G4H3
BT_VSSANA11H4
BT_VSSANA12
D2BT_VSSANA2BT_VSSANA3
E3
BT_VSSANA4F1F2
BT_VSSANA5BT_VSSANA6
F3F4
BT_VSSANA7G1
BT_VSSANA8G3
BT_VSSANA9
H6BT_VSSDIG1
H7BT_VSSDIG2BT_VSSDIG3
H8K8
BT_VSSDIG4L8
BT_VSSDIG5
BT_VSSRF1
C1C2
BT_RSVR_NBT_RSVR_RF
M2
BT_TEST1H2G2
BT_TEST2
BT_UART_CTSK6
J6BT_UART_RTS
BT_UART_RXDH9
G7BT_UART_TXD
E6BT_VDD_CLD
M6BT_VIO_ABT_VIO_B
J9
BT_VIO_CN3N5
BT_VIO_DBT_VIO_E
G8
BT_VSSANA1D1
BT_VSSANA10
E2E4
BT_HVA5BT_HVD
N7
BT_LP_CLKK9
BT_PCM_AK5M5
BT_PCM_B
M4BT_PCM_CLK
N4BT_PCM_SYNC
BT_REF_CLK_INF6
BT_REG_CTRLJ4
K7BT_RESETN
J1BT_RFNBT_RFP
K1
BT_RSVR_CL1B2
BT_RSVR_CL2C3M8
BT_RSVR_DBT_RSVR_DSM
BT_CLK_REQ_IN_2
J7BT_CLK_REQ_OUT_1
J8BT_CLK_REQ_OUT_2
BT_CONFIG_1L7
BT_CONFIG_2M7N6
BT_CONFIG_3
BT_GPIO_0G9
K4BT_GPIO_10
K3BT_GPIO_11
BT_GPIO_16J3L3
BT_GPIO_8
BT_GPIO_9M3
BT_HOST_WAKEUPE8
BT_HVA1L2D3
BT_HVA2BT_HVA3
E1
BT_HVA4
STLC2593U731
BT_AF_PRGG6
BT_CLK_REQ_IN_1E7F9
VDD_BT
0R
742
RESOUT2_n
PCM_DLDPCM_ULD
PCM_CLKPCM_SYNC
BT_CLKREQ_n
BT_TXRX
RESOUT1_n
FM_LPFM_RP
PTA_BT_STATEPTA_BT_PRIO
BT_CLKREQ_n
BT_CLKMCLKSEC
ACC_GP_SPI_BT_CSn
RTCCLK
APP_I2C_SCL
APP_I2C_SDA
BT_CLK
FM_ANT
WLAN_SLEEPn
ACC_SPI_MOSI
PTA_WLAN_ACTIVE
ACC_GP_SPI_BT_IRQ
RTCCLK
ACC_SPI_CLK
ACC_SPI_MISO
APP_GP_FM_GPIO2
- 33 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.1.12 MicroSD Interface card
GT500 supports the MicroSD card interface as external memory card.
MicroSD card has 4-data line, so GT500 uses 4-data lines.
All control and data lines are connected to DB3200.
Cause of the difference between DB3200 and MicroSD card, a level shifter should be added.
Table 3-1-7. MicroSD card Interface
Card detection- When there are no card in MicroSD card socket, APP_GP_MMC_DETn pin is high cause of an external
pull-up.- If card is inserted in socket, APP_GP_MMC_DETn pin is changed to Low cause of the mechanical switch
in the socket.
- If card is removed, APP_GP_MMC_DETn pin changes high.
Figure 3-1-12. Micro SD card and Schematic of Micro SD card Interface
MicroSD card Interface
APP_GP_MMC_DETn Card detection, connected to GPIO of DB3200
MICROSD_CMD_2V7 Command/Response
MICROSD_CLK_2V7 Clock
MICROSD_DAT[3:0]_2V7 Data line
VDDG_2V85 Supply voltage from AB3100 internal LDO
VDDE_1V8
DAT1AA2 D1
DAT1BB4
DAT2A DAT2BC4
A4DAT3A
D4DAT3B
GND1B3
GND2C3
A5VCCA
D5VCCB
SN74AVCA406EZXYRU403
A3CLKA
D3CLKB
CLK_FA1
CMDAB1
C2CMDB
CMD_DIRB5
B2DAT0A DAT0B
D2DAT0_DIR
C5
DAT123_DIRC1
C4090.1u
2 4 6 8
1 3 5 7
C410
RA
400
100K
0.1u
VDDG_2V85
100K
R63
7
MICROSD_DAT3_2V85
MICROSD_CMD_2V85
MICROSD_DAT0_2V85
MICROSD_DAT1_2V85MICROSD_DAT2_2V85
MICROSD_CLK_2V85
APP_MMC_FB_CLKMICROSD_CLK
MICROSD_CMD_DIRMICROSD_CMD
MICROSD_DAT_DIRMICROSD_DAT0
MICROSD_DAT1MICROSD_DAT2MICROSD_DAT3
1608
Hirose ( Micro-SD Socket, Normal ,T= 1.68)
MICROSD SOCKET
ENSY0020901
220K
R41
9
EV
LC
18S
0201
5
VA40
3
VA40
2
EV
LC
18S
0201
5
VA40
5
EV
LC
18S
0201
5
SWA SWB
4
6
DM3AT-SF-PEJ
2
5
3
78
1
GND
S400
R416 2.2
EV
LC
18S
0201
5
VA40
1
EVLC18S02003VA406
EV
LC
18S
0201
5
VA40
4
VDDG_2V85
VDDE_1V8
VA40
0
EV
LC
18S
0201
5
10uC408
MICROSD_DAT0_2V85
MICROSD_CLK_2V85
MICROSD_DAT1_2V85
APP_GP_MMC_DETn
MICROSD_CMD_2V85
MICROSD_DAT2_2V85MICROSD_DAT3_2V85
- 34 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.1.13 Power On Sequence
User presses END key and then ONSWAn signal is changed to Low.
AB3100 initiates the internal oscillator and powers on the regulators.
AB3100 generates power for DB3200.
AB3100 releases the power reset signal (PWRRSTn) and generates an interrupt(IRQ0n) to DB3200.
Figure 3-1-13. Power On Sequence
DB3200
PWRRSTN
IRQ0_N
AB3100
PWRRST_N
IRQ
ONSWA_N
Power for DB3200
PWRRSTn
IRQ0nONSWAn
Press END key
- 35 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-1-14. Key Circuit
3.1.14 Key PadThere are 8 buttons in Figure 3-1-14/15. ‘END’ Key is connected ONSWAn for AB3100.
Table 3-1-8. Key Matrix Mapping Table
KEYOUT4
KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYIN5 GND
KEYOUT0 SEND
KEYOUT1 Clear camera
KEYOUT2 Lock AF
KEYOUT3
GNDVOLUME
DOWN
END
(ONSWA_n)
VOLUME
UP
SEND CLEAR KEY END KEY AUTO FOCUS KEY
HALF SHUTTER
FULL SHUTTER
SEND
A
B B_
C C_
D
EVPAHBD6ASW1000
RB521S-30
D1000
ENDCLR
ONSWA_n
KEYIN3
KEYIN0
KEYOUT1
KEYOUT0
ONSWA_n
KEYIN3
KEYOUT2
KEYOUT1
VOLUME KEYTOUCH LOCK KEY
VOLUME_UPVOLUME_DOWNLOCK
KEYIN0KEYIN2
KEYOUT2
KEYIN0
- 36 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.1.15 Touch Screen
When Touch button and Touch screen is touched, Interrupt is given to DB3200 than, it read the status register what coordinate is touched by I2C. I2C is realize by DB3200 GPIO..
Figure 3-1-15. Touch screen schematics
EUSY0337101
TOUCH SCREEN DRIVER IC
RS
B6.
8CS
T2R
ZD
402
ZD
403
RS
B6.
8CS
T2R
B2A0
A1C2
A1AUX
GNDD2
PENIRQ-B1 D1
SCL
C1SDA
VDD_REFA2A3
X+C3
X-
Y+B3 D3
Y-
TSC2007IYZGRU405
ZD
401
RS
B6.
8CS
T2R
VDD_TOUCH_2V8
DN
IR
424 2.7K
R42
2
R42
0
0
0.1u
C412
R42
12.
7K
C411
1u
RS
B6.
8CS
T2R
ZD
400
TOUCH_Y+
TOUCH_X-
TOUCH_Y-
APP_GP_TOUCH_PENIRQn_2V75 APP_GP_TOUCH_SCL_2V75
APP_GP_TOUCH_SDA_2V75
TOUCH_X+
TOUCH LEVEL SHIFTER
R42
5
51K
0R423
VDD_TOUCH_2V8VDDE_1V8
R426 0
C3
B4
C4
B4GND
B3OE V
CC
AB
2
B1
VC
CB
U404TXS0104EZXUR
A1A1
A2A2
A3A3
A4
A4
C1B1
C2
B2
B3
0
R64
2
APP_GP_TOUCH_SDA
APP_GP_TOUCH_SCL
APP_GP_TOUCH_SCL_2V75
APP_GP_TOUCH_PENIRQn
APP_GP_TOUCH_SDA_2V75
APP_GP_TOUCH_PENIRQn_2V75
- 37 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.1.16 A-GPS
GT500 supports A-GPS operation using Broadcom BCM4750 A-GPS module.
The BCM4750 is a single chip, single die AGPS receiver that combines a high-performance RF front end with an adaptive baseband processor. The BCM4750’s small footprint and minimal parts count provide significant reductions in the design, layout, manufacturing, and testing resources required to integrate AGPS technology with mobile handsets and portable devices.
The BCM4750 uses a host-based integration architecture that splits processing functions between the GPS chip and the CPU on the host system. Host-based architecture enables a simplified IC design that can be executed in a much smaller and less expensive package than competing System on Chip solutions which require an onchip CPU subsystem and flash memory in addition to the RF and baseband blocks. Demands on the host CPU are minimal and no real time requirements are imposed.
Feature
• Fully integrated GPS RF front-end and baseband processor on a single CMOS die
• Supports UART, I2C, and SPI host interfaces
• Industry-leading power consumption efficiency
• Synchronization input, PPS output
• Fractional-N Synthesizer supports reference frequencies from 10 to 40 MHz
• Companion software driver supports Assisted, Autonomous, and Enhanced Autonomous operating mode
Figure 3-1-16. Functional Block Diagram of BCM4750
- 38 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
GT500 A-GPS Schematic
Figure 3-1-16. Schematic of BCM4750
GP
S L
NA
blo
ck
100pC772
C771
0.1u
AL
M-1612
FIL
_OU
T4
3G
ND
RF
_IN2
1S_D
VD
D5
2.2u
U770
C770
TP
751
C757NA
L750
6.8nH
C764
1u
VD
DE
_1V8
C762
1u
VG
PS
_1V8
2.2nHL770
10nHL771
0R
772
VSSD1VSSD2
D3D7
VSSD3E4
VSSD4VSSD5
E5
VSSD6F4
VSSIFSUBB3C1
VSSRFSYNTH
TD
O
F1
TE
ST
MO
DE
TM
SA
5
TR
ST
_NA
6
G6
TX
_SD
A_M
ISO
D4
VD
DC
OR
E1
VD
DC
OR
E2
D6
E3
VD
DC
OR
E3
VD
DC
OR
E4
E6
VD
DIF
SY
NT
HD
1
VDDIO1B6G3
VDDIO2VDDIO3
G7
F6
VD
DL
P_L
PR
EG
OU
T
VD
DR
FD
2
VP
DD
5
B5CNTIN
G1
CT
S_N
_I2C_G
RP
1_SC
S_N
F7
INT
R_N
A3LPREGIN
RE
SE
T_N
G4
RF
INB
1
E2
RF
RE
GO
UT
E1
RF
SR
EG
OU
T
F5RTCCLK
RT
S_N
_I2C_G
RP
0_MO
SI
G5
RX
_SC
L_S
CK
G2
F3
STA
ND
BY
_N
SYNC_PPSE7
A7
TC
K
TCXOA2
TD
IC
7B
7
U751
AT
ES
T0
B2
AT
ES
T1
C3
BB
RE
GO
UT
A4
C4BBRFREGIN
BM
S0
C6
B4
BM
S1_I2C
_A0
BM
S2_U
AR
TC
S_N
C5
F2
BC
M4750
C755
2.2nH
100nH C758
100nH
L772
0 R750
C761
1u
VD
DE
_1V8
1u C763
TP
753
1C
N7501
CN
751
X750
1G
ND
1
GN
D2
3
NC
12
5N
C2
OU
T4
VC
C6
KT
2520F16369A
CW
18T100K
R756
TP
752
C751
0.1u
C760
1u
2.2uC
750
C752
1u
C756 0.5p
1u C759
VG
PS
_1V8
10
R770
R757
0
AC
C_G
P_G
PS
_PO
N
GP
S_C
NT
IN
AC
C_U
AR
T3_T
X
AC
C_G
P_G
PS
_PO
N
AC
C_G
PS
_STA
RT
RT
CC
LK
AC
C_U
AR
T3_C
TS
AC
C_G
P_G
PS
_RE
SE
Tn
AC
C_U
AR
T3_R
TS
AC
C_U
AR
T3_R
X
GP
S P
ow
er
0
R755
C766 1u
VG
PS
_1V8
VB
AT
1uC765
3C
E2
GN
D
5PGND
VD
D4
1V
OU
T
RP
101K182D
U752
AC
C_G
P_G
PS
_PO
N
GP
S C
lock B
uffer
R754
100K
0.1uC
753
R75210
33
R753
C754
2.2u
VD
DE
_1V8
AGN
D
OE
VC
CY
NL
17SZ
126XV
5T2G
U750
MC
LK
SE
C
GP
S_C
NT
IN
AC
C_G
P_G
PS
_PO
N
- 39 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.2.1 Camera & Camera Interface
Figure 3-2-1. Camera Interface (in DB3200)
Figure 3-2-2. 5M Camera Connector(24Pin – Main Board)
3.2 Visual part
TP
221
PD
I_D
6N
22
PD
I_D
7N
15
PD
I_R
ES
_NK
20K
23P
DI_
C0
PD
I_C
1J1
6
PD
I_C
2K
22
PD
I_C
3K
16L
22P
DI_
C4
L21
PD
I_C
5P
DI_
D0
L23
L20
PD
I_D
1P
DI_
D2
M22 J20
PD
I_D
3M
23P
DI_
D4
K15
PD
I_D
5
W23
CI_
D7_
CL
K1_
PC
I_D
8_D
AT
1_M
W22
CI_
D9_
DA
T1_
PV
22
U23
CI_
HS
YN
C
U21
CI_
PC
LK
CI_
RE
S_N
T21
R20
CI_
VS
YN
C
U19
CI_
D0
CI_
D1
V19
V20
CI_
D2_
CL
K0_
MC
I_D
3_C
LK
0_P
W20
CI_
D4_
DA
T0_
MU
20T
20C
I_D
5_D
AT
0_P
CI_
D6_
CL
K1_
MV
23
TP
222
TP
223
LC
D_V
SY
NC
LC
D_D
ATA
[4]
LC
D_D
ATA
[5]
LC
D_D
ATA
[6]
LC
D_D
ATA
[7]
LC
D_W
E_N
LC
D_R
SL
CD
_CS
_N
LC
D_R
ES
ET
_N
CI_
DA
TA[4
]C
I_D
ATA
[5]
CI_
PC
LK
CI_
VS
YN
CC
I_H
SY
NC
CI_
RE
S_n
CI_
DA
TA[7
]C
I_D
ATA
[6]
CI_
DA
TA[0
]
CI_
DA
TA[2
]
LC
D_D
ATA
[0]
LC
D_D
ATA
[1]
LC
D_D
ATA
[2]
LC
D_D
ATA
[3]
LC
D_R
D_N
CI_
DA
TA[1
]
CI_
DA
TA[3
]
LC Filter for power noise from GSM RF
0.1u
CAM_DVDD_1V8
C60
6
C60
70.
1u
R614 47
FB
600
1P1
P22
3P3
P44 5
P5
6P6
P77
8P8
ICMF214P101M
FL603
7.5p
7
8
9
C610
13
14
15
16
17
18
19
2
20
21
22
23
24
3
4
5
6
CN603
GB042-24S-H10-E3000ENBY0034201
1
10
11
12
P1
1 2P
23
P3
P4
45
P5
P6
6P
77
P8
8
D603PRSB6.8C
UL
CA
2114
C01
5FR
VA60
0
CAM_AVDD_2V8
CAM_AFVDD_2V8
PRSB6.8CD602
47nHL600
BLM15AG100PN1FB602
FB
601
C6222.2u
C621220p
ISP_SENS_I2C_SDA5MCAM_RESET_N
ISP_SENS_I2C_SCL
DATANCLKP
DATAP
CLKN ISP_SENS_MCLK
- 40 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
Figure 3-2-3. ISP Interface (MV9319)
Figure 3-2-4. Flash LED (Sub Board)
PRSB6.8C
D601
C6VDDA_2_8RXVDDA_2_8TX
A7
VDDCOD3
VDDCO_ED4
VDDIO_2_8VE5
C5VSSA_RX
B7VSSA_TX
F1VSYNCO
H4SDO4SDO5
G4SDO6
F4F5
SDO7
SEL1G8
H7SIMO_S_GPIO31
SMCKOF8
SOMI_S_GPIO30G7
D1SRESET
H6SS_S_SDO8
A8TCLKTCLKB
B8C7
TDATATDATAB
C8
A4TEST_0
F7TXD
PCLKOE1
RCLKA6B6
RCLKBA5
RDATARDATAB
B5
RGVDD_1_8VE4
RXDE7
SCLK_S_SDO9H8
SCL_M_SS_MA2
A3SCL_S
B2SDA_M_MISO_M
SDA_SB3
F2SDO0SDO1
H3G3
SDO2SDO3
F3
GPIO10_SCLK_MA1B1
GPIO11_MOSI_M
GPIO20_PWM0H1G2
GPIO21_PWM1H2
GPIO22_PWM2GPIO23_PWM3
D2
H5GPIO24_SCLK_M
GPIO25_SS_MF6G6
GPIO26_MISO_MG5
GPIO27_MOSI_M
GPIO28_SCL_MC1C2
GPIO29_SDA_M
HSYNCOE2
MCLKE8C3
NRESET
NSRESETG1
MV9319
D6AVDD
D5AVDDP
B4DGND1
C4DGND2
D7DGND3DGND4
D8
DGND5E3
DGND6E6
U602
ISP_DVDD_1V84.
3KR
619
FB603
1uC619
C6231u
R61
84.
3K
C6151u
0.1uC609
0.1uC616
TP601
ISP_DVDD_1V8
C6181u
ISP_AVDD_2V8
0R632
C6201u
1uC608
R617 100ohm
C6171u
0.1uC624
0R633
TP600
ISP_GP_FLASH_ENISP_GP_FLASH_SET
ISP_GP_FLASH_INH
ISP_SENS_I2C_SCL
CLKN
DATAN
ISP_SENS_I2C_SDA
CLKP
DATAP
APP_I2C_SCLAPP_I2C_SDA
CI_DATA[6]CI_DATA[5]CI_DATA[4]
CI_DATA[2]CI_DATA[3]
CI_DATA[7]SYSCLK0
CI_HSYNCCI_VSYNC
CI_RES_n
CI_PCLK
5MCAM_RESET_N
ISP_SENS_MCLK
CI_DATA[0]CI_DATA[1]
CAMERA FLASH LED
R80
610
0K
AGND4
1CT
2EN_SETFLEN
3 12FLGND
FLINH10
FLOUTA13
FLOUTB11
GND9
15G
_SL
UG
IN5
LX6
OUT87
PGND
14RSET
L8001u
U800 AAT1270IFO-T1
VA806EVLC14S02050
EVLC14S02050VA807
C8002.2u
VBAT
100K
R80
7
200K
R80
1
DNIC806
LD800
C80147n
2.2uC807
ISP_GP_FLASH_ENISP_GP_FLASH_SET
ISP_GP_FLASH_INH
- 41 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-2-5. VGA Camera (TCM9001MD)
(SMT type_VGA FPCB)
Figure 3-2-6. VGA Camera FPCB Interface with main board
51R904
CAM_DVDD_1V8
VDD15_1A5
VDD15_2E4
D2VSYNC
0.1uC913
DATA6C3D4
DATA7
A3DCLK
DVDDB6
B5EXTCLK
GND1A4
GND2C4
GND3E2E3
GND4
HSYNCD1
IOVDDA2
F1
PG
ND
C6PWRDWN
D3RESET
D6SCLSDA
C5
U901TCM9000MD
E5AVDD
B3DATA0
B1DATA1DATA2
B2
DATA3B4C1
DATA4DATA5
C2
C9000.1u
CAM_AVDD_2V8
0.1uC901
CI_PCLK
CI_RES_n
SYSCLK0
CI_DATA[0]CI_DATA[1]CI_DATA[2]CI_DATA[3]CI_DATA[4]CI_DATA[5]CI_DATA[6]CI_DATA[7]
CI_HSYNC
APP_GP_VGA_SDN
APP_I2C_SCLAPP_I2C_SDA
CI_VSYNC
PLUG
28
29
3
30
31
32
33
34
4
5
6
7
8
9
13
14
15
16
17 18
19
2
20
21
22
23
24
25
26
27
CN9011
10
11
12
CAM_DVDD_1V8
47R910
CAM_AVDD_2V8
CN9021
2
SPK_RCV-
SPK_RCV+
TOUCH_Y+
TOUCH_X+
TOUCH_X-
TOUCH_Y-
CI_DATA[1]
CI_DATA[5]
CI_DATA[3]
SPK_RCV-
SPK_RCV+
APP_I2C_SCL
APP_I2C_SDA
CI_RES_n
SYSCLK0
APP_GP_VGA_SDN
CI_DATA[0]
CI_DATA[7]
CI_DATA[6]
CI_VSYNC
CI_HSYNC
CI_PCLK
CI_DATA[2]
CI_DATA[4]
- 42 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
Table 3-2-1. Interface between Main board and 5M camera (in Main)
Table 3-2-2. Interface between VGA Camera FPCB and main board.
The 5M Camera modules are connected to 24-pin main board and VGA Camera module
is mounted to VGA FPCB and VGA FPCB is connected to 34-pin main board.
Its interface is dedicated camera interface port in DB3200. The camera port supply 24MHz master
clock to 5M ISP and 12Mhz Master clock to VGA module and receive 48MHz pixel clock(15fps) for ISP
and 9.5Mhz pixel clock(15fps) for VGA camera, vertical sync signal, horizontal sync signal, reset signal
and 8bits YUV data from camera module.
The camera module is controlled by I2C port.
Pin No. Symbol Description Pin No. Symbol Description
1 GND Ground 34 GND Ground
2 SYSCLK0 VGA MCLK 33 CAM_AVDD_2V8 Analog Voltage
3 GND Ground 32 GND Ground
4 TOUCH_X+ touch signal 31 CAM_DVDD_1V8 I/O & Digital Voltage
5 TOUCH_X- touch signal 30 CI_DATA[0] Parallel Data 0
6 TOUCH_Y+ touch signal 29 CI_DATA[1] Parallel Data 1
7 TOUCH_Y- touch signal 28 CI_DATA[2] Parallel Data 2
8 GND Ground 27 CI_DATA[3] Parallel Data 3
9 GND Ground 26 CI_DATA[4] Parallel Data 4
10 APP_GP_VGA_SDN VGA shutdown 25 CI_DATA[5] Parallel Data 5
11 APP_I2C_SDA I2C DATA 24 CI_DATA[6] Parallel Data 6
12 APP_I2C_SCL I2C Clock 23 CI_DATA[7] Parallel Data 7
13 CI_RES_n CAMERA RESET 22 CI_HSYNC horizontal sync
14 GND Ground 21 CI_VSYNC vertical sync
15 SPK_RCV+ speaker signal 20 GND Ground
16 SPK_RCV - speaker signal 19 CI_PCLK Camera Pixel clock
17 GND Ground 18 GND Ground
- 43 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-2-5. 1.8V and 2.8V Camera Regulator
APP_GP_ISP_LDO_EN enables 1.8V & 2.8V regulator for ISP. (ISP : 2.8V for anlalog, 1.8V for I/O and digital),
Figure 3-2-6. Camera Regulator for ISP
3.2.2 Camera Regulator
APP_GP_CAM_LDO_EN enables 1.8V & 2.8V Camera Regulator for both 5M and VGA Camera.
(5M : 2.8V for analog, 2.8V for AF VDD control, 1.8V for I/O, 1.8V for digital), (VGA : 2.8V for analog, 1.8V for I/O, digital)
CAM_AFVDD_2V8
5.6KR616
VBAT
C61
31u
0
R634
CAM_AVDD_2V8
1uC
611
NC1NC2
6
PG
ND
9
1VIN VOUT1
87
VOUT2
RT9011-MGPQWU601
EN12
EN23
GND54
CAM_DVDD_1V8C
612
1u 1uC
614
APP_GP_CAM_LDO_EN
VBAT
0
R635
R625
5.6K
ISP_DVDD_1V8
1uC6289
PG
ND
VIN1 8
VOUT1VOUT2
7
C6271u
U603 RT9011-MGPQW
2EN1
3EN2
5GNDNC1
46
NC2
1uC629
1uC630
ISP_AVDD_2V8
APP_GP_ISP_LDO_EN
- 44 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.2.3 Display & LCD FPC Interface LCD module include device in table 3-2
Device Type
Main LCD 240 RGB 400 262K Color TFT LCD
Main LCD Backlight 5 White LEDs
Table 3-2-3. Device in LCD Module
LCD Module is connected to Key FPCB with 40-pin Connector and key FPCB is connected to Main board with 50-pin connector.
The LCD is controlled by 8-bit PDI(Parallel Data Interface) in DB3200.
Table 3-2-4. LCD module Connector
Close to ABBR62
810
K
C625 47n
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
9
8INOUT_B2
INOUT_B37
6INOUT_B4
FL601
EVRC14S03Q030050R
5G
1
EVRC14S03Q030050R
FL602
5G
1
G2
10
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B1
R610 10K
R60
310
K
47nC626
LCD_AVDD_2V8
100ohmR627
INOUT_B37
6INOUT_B4
PRSB6.8C
D600
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B19
8INOUT_B2
EVRC14S03Q030050R
FL600
DN
IR
611 Z
D60
5R
SB
6.8C
ST
2R
PR
SB
6.8C
ZD
601
FB604FB605
1uC
604
R626 100ohm
0
R62
1
PR
SB
6.8C
ZD
600
4.7K
R60
9
100K
R62
2
10K
R60
4
RS
B6.
8CS
T2R
ZD
606
LCD_DVDD_1V8
R60
8D
NI
VDDE_1V8
VA60
3IC
VS
0514
X35
0FR
10K
R60
7
VBAT
C60
51u
414243444546474849
5
50
6789
272829
3
30313233343536373839
4
401213141516171819
2
202122232425 26
51 52
53 54
1
1011
CN604
LCD_DATA[7]
LCD_DATA[3]
LCD_DATA[1]LCD_DATA[2]
LCD_DATA[0]
ONSWA_nKEYIN2
LCD_DATA[4]
LCD_DATA[6]LCD_DATA[5]
WLED_PWR
WLED1
KEYIN0
CCO1
KEYOUT0
KEYOUT2
KEY_LED1
TRICKLE
LCD_VSYNC
LCD_RESET_N
APP_GP_LCD_IF1
WLED5WLED4WLED3WLED2
APP_GP_LCD_ID
KEYOUT1
KEYIN3
MIC1P
LCD_RD_N
LCD_RS
LCD_WE_N
LCD_CS_N
KEY_LED2
MIC1N
- 45 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.2.4 LCD Module Block diagram
Figure 3-2-9. LCD Module Block diagram
Data(0~7)
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3. TECHNICAL DESCRIPTION
3.2.5 LCD Backlight IlluminationThere are 5 white LEDs in LCD Backlight circuit which is driven Charge Pump(AAT3169).
APP_GP_BL_EN is used for Backlight brightness control.
3.2.6 Keypad IlluminationThere are 4 side view white LEDs in Main board backlight circuit, which are driven by LED1, LED2 port from
AB3100.
Figure 3-2-11. Keypad Backlight LED Interface and Backlight Circuit
Figure 3-2-10. SUB PMIC Circuit LCD Backlight
0R631
0
R62
9
100K
R63
0
C6351u
C63
31u
VBAT
1uC
632
C634
10GND
9IN
OUTCP6
PGND15
1u
U604 AAT3169IFO-T1
C1+4
5C1-
C2+7
C2-8
11D1D2
1213
D314
D41
D52
D6
EN_SET3
WLED2WLED3WLED4WLED5
APP_GP_BL_EN
WLED_PWR
WLED1
LD1003
SSC-TWH104-HL
VB
AT
SSC-TWH104-HL
LD1001
LD1002
SSC-TWH104-HL
LD1000
SSC-TWH104-HL
KEY_LED2
KEY_LED1
B4
LE
D1_
NA
4L
ED
2_N
D3
LE
D3_
NC
3
KE
Y_L
ED
2K
EY
_LE
D1
- 47 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.3. Audio Part
3.3.1 Audio Part Block Diagram
Figure 3-3-1. Audio Part Block Diagram
3.3.2 Audio Signal Processing & Interface
Audio signal processing is divided Uplink path and downlink path.
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmit it to DBB Chip (DB3200).
This transmitted signal is reformed to fit in GSM & WCDMA Frame format and delivered to RF Chip.
The downlink path amplifies the signal from DBB chip (DB3200) and outputs it to Receiver (or Speaker).
The audio interface consists of PCM encoding and decoding circuitry, microphone amplifiers and
earphone drivers.
The PCM encoder and decoder blocks are two-channel, 16-bit circuits with programmable gain
amplifiers (PGA).
The decoder has a receive volume control. The audio inputs and outputs can be switched to normal or auxiliary ports.
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3. TECHNICAL DESCRIPTION
Figure 3-3-2. Audio Interface Detailed Diagram(AB3100)
Figure 3-3-3 . Audio Section scheme
1%
Audio Subsystem
Audio Subsystem
1%
C343
B3
B1
VD
D
A3
VS
S
18000p
A4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDA
MAX9877AEWP_TG45U301
B2BIAS
C1N
C342 1u
C3340.1u
C3541u
C3331u
15R323
VA30
0IC
VL
0505
101V
150F
R
VBAT
15R322
C332
1u
C35
322
p
C33
61u
C35
222
p
C339 1u
VA30
1IC
VL
0505
101V
150F
R
18000pC344
C338 1u
HS_EAR_L
HS_EAR_R
SPK_RCV-
SPK_RCV+
AMP_I2C_SCLAMP_I2C_SDA
EAR_REAR_L
SPKRPSPKRN
BEARPBEARN
Main MIC
C100047p
3
O4
P1
MIC100
SPU0410HR5H-PB
G12
G2
CCO1
MIC1NMIC1P
- 49 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.3.3 Audio Mode
Audio Mode includes three states.( Voice call, Midi.MP3).
Each states is sorted by the total 7 Modes according to external Devices
(Receiver,Loud Speaker,Headset).
Video Telephony Mode Operate on state of the WCDMA CALL.
Table 3-3-1. Audio Mode
Voice call
MIDI
MP3
Receiver Mode
Loud Speaker Mode
Headset Mode
Video Telephony Mode
Only Loud Speaker
Loud Speaker Mode
Headset Mode
ModeAB3100 In /Out Port
OUTIN
MIC1P/MIC1N BEARP/BEARN
SPKRP/SPKRN
AUXO1/AUXO2
AUXO1/AUXO2
MIC1P/MIC1N
MIC1P/MIC1N
MIC2P/MIC2N
SPKRP/SPKRN
SPKRP/SPKRN
SPKR/SPKN
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3. TECHNICAL DESCRIPTION
3.3.4 Voice Call
A. Voice call Downlink Mode(Receiver, Speaker, Headset)
Figure 3-3-4. Voice call Downlink Scheme
This section provides a detailed description of the Voice Call RX functions.
The voice decoder accepts a serial input stream of linear PCM coded speech. The receive band-pass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path. The final step in the receive path is the auxiliary output. The auxiliary audio amplifier is intended to drive low impedance headphones. The earphone amplifier and the auxiliary audio outputs can be powered down (muted) via I2C. Both the earphone driver and one of the auxiliary drivers can simultaneously provide an output signal during voice decoding.
• Receiver Mode : BEARP/N Port Receiver(32Ω)
• Loud Speaker / Video Telephony Mode : AB3100 SPK Amp SPKR/N
AUDIO AMP(TPA6205) Speaker(8Ω)
•Headset Mode : Auxiliary audio amplifier AUXO1/2
AUDIO AMP(MAX9724D) Head Phone
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3. TECHNICAL DESCRIPTION
This section provides a detailed description of the Voice Call TX functions.
Figure 3-3-5. Voice call Uplink Scheme
B. Voice Call Uplink Mode (Receiver,Speaker,Headset)
From the audio path view point, voice call has the same structure as video telephony. The TXMIX connection enables insertion of audio into the uplink audio path. This can, for example, be used to play dictation recordings for the listener at the other party, in a voice call or video telephony call. The connection to TXMIX from the Audio Mixer must be performed in 8 kHz mono, since this is supported by the Voice mode. Due to performance reasons it may not be possible to decode every audio format during video telephony.
Each Voice Uplink Mode paths shown below.
Receiver Mode : C-MIC(SPM0410LR5H) AB3100 Input(MIC1N/1P)Loud Speaker Mode : C-MIC(SPM0410LR5H) AB3100 Input(SPK1N/1P)Video Telephony Mode : C-MIC(SPM0410LR5H) AB3100 Input(MIC1N/1P)Headset Mode : Headset MIC Analog Switch(FSA201) AB3100 Input(AUXI1N/1P)
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3. TECHNICAL DESCRIPTION
3.3.5 MIDI (Ring Tone Play)
This section provides a detailed description of the MIDI and WAV-file functions.
Figure 3-3-6 External MIDI path
3.3.6 MP3 (Audio Player)
This section provides a detailed description of the MP3 file functions.
Figure 3-3-7. MP3 Scheme
MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a audio amp and one speaker.
In Figure 2-4-6, External MIDI path is the same as Voice Loudspeaker downlink Mode ,
except source in DB3200 (DSP and Audio Mixer).
MIDI : DB3200 PCM Decoder Auxiliary audio amplifier SPKRP/N Port
AUDIO AMP(TPA6205A) Speaker(8Ω)
- 53 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.3.7 Video Telephony
This section provides a description of the Video Telephony functions.
Figure 3-3-8. Video Telephony Scheme
Video Telephony Mode has same paths with Loud Speaker Mode.
3.3.8 Audio Main Component
There are 4 components in GT500 schematic Diagram. Part Number marked on GT500 Schematic
Diagram.
Table 3-3-2. Audio Component List
MaximMAX9877AEWP_TG45Audio Amp3
I-soundSGEY0003741Ear-jack SET4
KNOWLES ACOUSTICSSPU0410HR5H-PBMIC2
Ki-RinSUSY0027506Speaker/Receiver1
MAKERPART NUMBERITEMNO
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3. TECHNICAL DESCRIPTION
3.4 GPADC (General Purpose ADC) and AUTOADC2
The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selectedwith the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention. The AUTOADC2 periodically measures the battery voltage or current. (Fig.2-4-1) shows the schematic of GPADC part. The GPADC channel spec is as following (Table 2-4-1).
Fig 3-4-1. Schematic of GPADC and AUTOADC2
ADC 2 channels
Resource Name Description
GPA3 PCB_VERSION HW PCB Version check
GPA7 VBACKUP Backup battery
Table 3-4-1. GPADC channel spec
Fig 3-4-2. GPADC and AUTOADC2 Block diagram
GPA
2C
9
B8
GPA
3A
8G
PA4
C8
GPA
5G
PA6
D8
GPA
7B
7
GPA
0A
9
GPA
1B
9
GPA
12C
7
TP
300
PC
B_V
ER
SIO
NT
ES
TOU
TR
TE
MP
VB
AC
KU
P
- 55 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Name Type Unused Description
CHS+ Analog VBAT Current sensing input positive
CHS- Analog VBAT Current sensing input negative
Table 3-5-1. Charger Control channel spec
Fig. 3-5-1. Battery charging circuit
3.5 Charger control
A programmable charger in AB3100 is used for battery charging. It is possible to set limits for the output voltage at CHS- and the output current from DCIO via the sense resistor to CHS-. The voltage at CHS- and the current feed to CHS- cannot be measured directly by the GPADC. Instead, the two measuring amplifiers translate these inputs to a voltage proportional to the input and within the range of the GPADC. (Fig.3-5-1) shows the schematic of charging control part.
Direction of BAT and GND
Charging
Route as a differential pair
Phone ground return path
USB charging path
Discharging
Route as a differential pair
Make an Area at 8, 9 Layer
Causion when PCB lLayout
Charging Circuit
22pC337
VDDC_2V65
VBUS
VDDE_1V8
2
C1
1
D302
KDS221E_RTK
A1_C2
3A2
0.1uC346 C347
1u
VBAT_H
1/4WR324
VBAT
2012
1% 0.025
VBAT
M7
VS
S_S
PK
RV
SS
_BE
AR
N5
VBUSE2
P13VDD_AUDIO
P3VDD_AUXO
VDD_BEARP6
VDD_IOA12
VDD_REFG1
VDD_SPKRP7
A13VREF
SRST_NM2
D12TEST
F2TRICKLE
VBAT_DG2
N3SDAT
B10
SPA
RE
1A
2S
PAR
E2
M1SCLK
IREFA14
H1CHSENSEP
DAC_CLKC4
DAC_DATC5
B5DAC_STR
F1DCIODCIO_INT
J2
J13FGSENSEN
J14FGSENSEP
BDATAA11
CHREGH3
H2CHSENSEND1
D2
D3
D4
G1
G2
S1
S2
Q300 SIA911DJ
0.1uC348
VA605varistor
C3490.1u
300KR320
C33022p
C33133u
D301 RSX101VA-30TR
C34
51u
1%1/4W2012
0.1R316
D1
D2
1 2 3
CN
300
1u
R317
VDD_REF
VBAT
R32
110
0K
R314
0 TRICKLE
FGS+
FGS-
VBUSCHS-
BDATA
FGS+
DCIO_INT
OTP
VBUS
CHREG
RF_CTRL_DATA
RF_CTRL_CLKRF_CTRL_STR_1
CHREG
DCIO_INT
FGS-
CHS+
CHS+
BDATA
CHS-
SRST_nSCLK
SDAT
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3. TECHNICAL DESCRIPTION
Name Type Unused Description
FGS+ Analog VBAT Fuel gauge current sensing input positive
FGS- Analog VBAT Fuel gauge current sensing input negative
Table 3-5-2. Fuel Gauge channel spec
Fig. 3-5-2. The analog front-end of the fuel gauge block
Fig. 3-5-3 The Schematic of the fuel gauge block
3.5.1 Fuel Gauge
AB3100 supports the measurement of the current consumption/charging current in the GT500 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in (Fig.3-5-3). A sense resistor R_FGSENSE is connected in series with the battery. The voltage across the resistor, equivalent to the current entering/leaving the battery, is integrated using an ADC block.
Route as a differential pair
Phone ground return path
1/4WR3242012
1% 0.025
FGS+
FGS-
SRST_NM2
VBAT_DG2
N3SDAT
M1SCLK
H1CHSENSEP
J13FGSENSEN
J14FGSENSEP
BDATAA11
CHREGH3
H2CHSENSEN
VA605varistor
VBAT
FGS+
FGS-
CHREG
CHS+
BDATA
CHS-
SRST_nSCLK
SDAT
- 57 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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3. TECHNICAL DESCRIPTION
3.5.2 Battery Temperature Measurement
The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. (Fig.3-5-5) shows the schematic of battery temperature measurement part.
Name Type Unused Description
BDATA Digital Input/Output Unconnected current output
Table 3-5-3 BDATA channel spec
Fig 3-5-4. Battery Temperature Measurement
Disch
22pC337
2
C1
1
D302
KDS221E_RTK
A1_C2
3A2
300KR320
D1
D2
1 2 3
CN
300
BDATASRST_N
M2
N3SDAT
M1SCLK
J13FGSENSEN
J14FGSENSEP
BDATAA11
VA605varistor
FGS+
FGS-
BDATA
SRST_nSCLK
SDAT
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3. TECHNICAL DESCRIPTION
3.5.3 Charging Part
The charging block in AB3100 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. (Fig.3-5-6) shows the schematic of charging part.
Fig. 3-5-6 Battery Block Indication
Fig. 3-5-5. Charging Part
When VBAT is below a certain value, 3.2V, a current generator take care of initial charging of the CHSENSE+ node and internal trickle charge signal is active. This part of the charging block is powered on and active when DCIO is asserted. The DCIO signal is asserted when its voltage is above the voltage at VBAT. As soon as generator is turned off and all parts of the charging block are functional and active.Battery block indication as shown in (Fig.3-5-7)
Fig. 3-5-6 Battery Block Indication
4.17 ~3.72 (V) 3.72 ~3.62 (V) 3.62 ~3.53 (V) 3.53 ~3.20 (V)
100~40 (%) 40~12 (%) 12~3 (%) 3~0(%)
Direction of BAT and GND
Charging
Route as a differential pair
Phone ground return path
USB charging path
Discharging
Route as a differential pair
Make an Area at 8, 9 Layer
Causion when PCB lLayout
Charging Circuit
22pC337
VDDC_2V65
VBUS
VDDE_1V8
2
C1
1
D302
KDS221E_RTK
A1_C2
3A2
0.1uC346 C347
1u
VBAT_H
1/4WR324
VBAT
2012
1% 0.025
VBAT
M7
VS
S_S
PK
RV
SS
_BE
AR
N5
VBUSE2
P13VDD_AUDIO
P3VDD_AUXO
VDD_BEARP6
VDD_IOA12
VDD_REFG1
VDD_SPKRP7
A13VREF
D12TEST
F2TRICKLE
VBAT_DG2
N3SDAT
B10
SPA
RE
1A
2S
PAR
E2
SCLK
IREFA14
H1CHSENSEP
DAC_CLKC4
DAC_DATC5
B5DAC_STR
F1DCIODCIO_INT
J2
J13FGSENSEN
J14FGSENSEP
BDATAA11
CHREGH3
H2CHSENSEND1
D2
D3
D4
G1
G2
S1
S2
Q300 SIA911DJ
0.1uC348
VA605varistor
C3490.1u
300KR320
C33022p
C33133u
D301 RSX101VA-30TR
C34
51u
1%1/4W2012
0.1R316
D1
D2
1 2 3
CN
300
1u
R317
VDD_REF
VBAT
R32
110
0K
R314
0 TRICKLE
FGS+
FGS-
VBUSCHS-
BDATA
FGS+
DCIO_INT
OTP
VBUS
CHREG
RF_CTRL_DATA
RF_CTRL_CLKRF_CTRL_STR_1
CHREG
DCIO_INT
FGS-
CHS+
CHS+
BDATA
CHS-
SCLKSDAT
- 59 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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3. TECHNICAL DESCRIPTION
Trickle charging
When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA.
Table. 3-5-4. Trickle charging spec
Parameter Min Typ Max Unit
Trickle current 30 40 60 mA
Normal charging
When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active. The charging method is ‘CCCV’. (Constant Current Constant Voltage)This charging method is used for Lithium chemistry battery packs. The CCCV method regulates the charge current and the VBAT voltage. This charging method prevents the battery voltage to go above the charge set in the CCCV algorithm. (Fig.3-5-8) shows the charging voltage and charging current change.
Fig. 3-5-7. CCCV charging method
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3. TECHNICAL DESCRIPTION
• Charging Method : CCCV (Constant Current Constant Voltage)• Maximum Charging Voltage : 4.2V• Maximum Charging Current : 700mA• Nominal Battery Capacity : 950 mAh• Charger Voltage : 5.1V• Charging time : Max 3.5h• Full charge indication current (icon stop current) : 80mA• Low battery POP UP : Idle - 3.43V, Dedicated – 3.43V• Low battery alarm interval : Idle - 3 min, Dedicated - 1 min• Cut-off voltage : standby : 3.25V, Call : 3.25V
Charging of Extended Temperature
When the battery temperature is outside the normal charging specification, the battery voltage, VBAT, is maintained at 3.7V.
• Under 0 °C : Extended temperature• From 0 °C to 45 °C : Normal charging temperature• Over 45 °C : Extended temperature
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3. TECHNICAL DESCRIPTION
3.6. Voltage Regulation
The LDO regulators and the BUCK converter generate a range of programmable voltages, each optimized for its load. When the analog baseband controller boots up or down, internal signals activate or deactivate the LDO regulators and the BUCK converter. In active mode, the LDO regulators and the BUCK converter are activated and deactivated through I2C. The low power regulator is on all the time and has extremely low power consumption with limited output current. It provides power for the 32 kHz oscillator and the real-time clock (RTC).
Table. 3-6-1. LDO and Buck
LDO Net Name Output Voltage Output Current UsageLDO_A VDDA_2V8 2.8V 150mA RF TranceiverLDO_D VDDD_2V65 2.65V 200mA AB3100 analog
VDDE_1V8 1.8V Memory, I/OVDIGRAD_1V8 1.8V RF3300 Digital
LDO_C VDDC_2V65 2.65V 200mA AB3100 Audio BlockLDO_H VDDH_2V75 2.75V 200mA 3Axis
LDO_F VDDF_2V5 2.5V 30mA DB3200 analogLDO_G VDDG_2V85 2.85V 100mA SD card, LCDLDO_K VDDK_2V75 2.75V 200mA BluetoothLDO_LP VBACKUP 2.2V 6.5mA Backup Battey
BUCK VCORE 1.2V 600mA DB3200 core
200mALDO_E
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3. TECHNICAL DESCRIPTION
Figure 3-7-1. Block diagram of RF part
3.7.1. General Description
The RF platform of GT500 supports two different communication modes (WCDMA/GSM modes) including four communication bands (WCDMA2100/WCDMA900/GSM850/900/1800/1900). The all the RF blocks can be divided into three main parts, which are a WCDMA part, a GSM, and a RF front-end. Different from other general solutions, the RF front-end of GT500 consists of an antenna switch and an EDGE power amplifier module (PAM). The simplified block diagram is shown in Figure 3-7-1.
3.7. RF Technical Description
3.7.2. WCDMA Part
The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces, that is an IQ-interface, both in the receiver and transmitter information path. The transceiver has the following general features: . Power class : Power class 3 (+24dBm) in Band I. Power class : Power class 3 (+24dBm) in Band VIII. Zero-IF Receiver.No IF filter needed . Direct IQ modulation transmitter
U330
GSM/EDGEPA + Ant Sw.
ANT
VAPC
RADCLK
RADDAT
RADSTR
VBAT
2.75 VVRAD
1.8 VVIO
PA
PA
GSM850/900 Input
DCS/PCSInput
ESD
2.75 VVRAD
LNA
LNA
LNA
LNA
LNA
AD
AD
090
LPF+ ChP PhD
÷N.M
VCO
LPF ChP PhD
÷N.M
+ 090
+
DAC
DAC
XO
DAC
VCO
VCO
LNA
LNA
WCDMA LB
WCDMA HB
WCDMA HB
WCDMA HB
CLK
DATA
STROBESerial
Control
WTxQB
WTxQA
WTxIB
WTxIA
GSM/EDGE
AM
DAC
RFCtrl1
RFCtrl2
RFCtrl1
RFCtrl2
GSM/EDGE HB
GSM/EDGE LB
WCDMA LB
WCDMA HB
WCDMA HB
GSM/EDGELB
GSM/EDGELB
GSM/EDGEHB
GSM/EDGEHB
WRxIA
WRxIB
WRxQB
WRxQA
EDataA
EDataB
EDataC
EDataStr
WCDMA/GSM/GPRS/EDGE TRX
MCLK
CLKREQ
MCLKSec
XOXOn
XOp
26MHzX-tal
VBAT
VccWPA
VccWPA
Powercoupler
Powercoupler
VccWPA
VccWPA
RF Pow det
DetEn
BiasDET En
BiasDET En
BiasDET En
UL: 1920 – 1980 MHzDL: 2110 – 2170 MHz
UL: 1749.9 – 1784.9 MHzDL: 1844.9 – 1879.9 MHz
UL: 830 – 840 MHzDL: 875 – 885 MHz
824 – 915 MHz
1710 – 1910 MHz
1930 – 1990 MHz
1805 – 1880 MHz
925 – 960 MHz
869 – 894 MHz
WDCDCREF
WPOW_DET_EN
FB
Switch
PWM/PFM
En
ControlLogic
RFCtrl1
- 63 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-7-2. WCDMA Transmitter Architecture
3.7.2.1. Transmitter Part
The W-CDMA transmitter architecture is an on frequency linear direct up-conversion IQ-modulator. The TX IQ modulator has differential voltage I and Q inputs. It converts input signals to RF output frequency and is designed to achieve LO and image suppression. The in-phase and quadrature-phase reconstruction filters are fully integrated and a programmable gain amplifier implements the gain control. The transmit output stage provides at least +5 dBm at maximum power control at the single-ended 50 Ωoutput. Gain is set through the 3-wire bus. An external SAW filter between the W-CDMA circuit and the power amplifier is used to improve noise performance. Two 10-bit DACs are used to control the DC/DC converter and the PA gain. After the power amplifier, the signal is sent through an isolator and through the duplex filter, which directs the transmit signal to the antenna connector through the antenna switch. The supply voltage and bias of the power amplifier are adapted depending on the output power to achieve high efficiency at every transmitter power level. A high efficiency DC/DC converter regulates the supply voltage and the bias operation point is controlled by a D/A-converter in the W-CDMA radio circuit. These DACs are controlled through the 3-wire-bus
GSM/EDGEPA + Ant Sw.
ANT
VAPC
RADCLK
RADDAT
RADSTR
VBAT
2.75 VVRAD
1.8 VVIO
PA
PA
GSM850/900 Input
DCS/PCSInput
ESD
2.75 VVRAD
LNA
LNA
LNA
LNA
LNA
AD
AD
090
LPF+ ChP PhD
÷N.M
VCO
LPF ChP PhD
÷N.M
+ 090
+
DAC
DAC
XO
DAC
VCO
VCO
LNA
LNA
WCDMA LB
WCDMA HB
WCDMA HB
WCDMA HB
CLK
DATA
STROBESerial
Control
WTxQB
WTxQA
WTxIB
WTxIA
GSM/EDGE
AM
DAC
RFCtrl1
RFCtrl2
RFCtrl1
RFCtrl2
GSM/EDGE HB
GSM/EDGE LB
WCDMA LB
WCDMA HB
WCDMA HB
GSM/EDGELB
GSM/EDGELB
GSM/EDGEHB
GSM/EDGEHB
WRxIA
WRxIB
WRxQB
WRxQA
EDataA
EDataB
EDataC
EDataStr
WCDMA/GSM/GPRS/EDGE TRX
MCLK
CLKREQ
MCLKSec
XOXOn
XOp
26MHzX-tal
VBAT
VccWPA
VccWPA
Powercoupler
Powercoupler
VccWPA
VccWPA
BiasDET En
DET
BiasDET En
UL: 1920 – 1980 MHzDL: 2110 – 2170 MHz
UL: 1749.9 – 1784.9 MHzDL: 1844.9 – 1879.9 MHz
UL: 830 – 840 MHzDL: 875 – 885 MHz
824 – 915 MHz
1710 – 1910 MHz
1930 – 1990 MHz
1805 – 1880 MHz
925 – 960 MHz
869 – 894 MHz
WDCDCREF
FB
Switch
PWM/PFM
En
ControlLogic
RFCtrl1
- 64 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
Figure 3-7-3. WCDMA Receiver Architecture
3.7.2.2. Receiver Part
The W-CDMA receiver architecture is a direct down-conversion Zero Intermediate Frequency (ZIF) receiver with integrated low-pass channel filter, i.e. the front-end receiver converts the aerial RF signal from W-CMDA band I down to a ZIF. The first stage consists of one single-ended low noise amplifier (LNA) with a 16 dB gain step. This LNA is followed through an external filter by an IQ down-mixer which consists of a mixer in parallel driven by quadrature out-of-phase LO signals. The In phase (I) and Quadrature phase (Q) ZIF signal are then low pass filtered to provide protection from high frequency offset interferer fed into the channel filter. The front-end zero IF I and Q outputs are applied to the integrated low-pass channel filter with a provision for 4 x 8 dB gain steps in front of the filter. The filter is a self-calibrated 6 pole, 2 zero filter with a cut-off frequency around 2.15 MHz and a second order group delay compensation (2 poles, 2 zeroes). Once filtered,the zero IF I and Q signals are further amplified with provision of 31 x 1 dB steps and DC offset compensation. The zero IF output buffer provides close rail-to-rail outputs signal.
GSM/EDGEPA + Ant Sw.
ANT
VAPC
RADCLK
RADDAT
RADSTR
VBAT
2.75 VVRAD
1.8 VVIO
PA
PA
GSM850/900 Input
DCS/PCSInput
ESD
2.75 VVRAD
LNA
LNA
LNA
LNA
LNA
AD
AD
090
LPF+ ChP PhD
÷N.M
VCO
LPF ChP PhD
÷N.M
+ 090
+
DAC
DAC
XO
DAC
VCO
VCO
LNA
LNA
WCDMA LB
WCDMA HB
WCDMA HB
WCDMA HB
CLK
DATA
STROBESerial
Control
WTxQB
WTxQA
WTxIB
WTxIA
GSM/EDGE
AM
DAC
RFCtrl1
RFCtrl2
RFCtrl1
RFCtrl2
GSM/EDGE HB
GSM/EDGE LB
WCDMA LB
WCDMA HB
WCDMA HB
GSM/EDGELB
GSM/EDGELB
GSM/EDGEHB
GSM/EDGEHB
WRxIA
WRxIB
WRxQB
WRxQA
EDataA
EDataB
EDataC
EDataStr
WCDMA/GSM/GPRS/EDGE TRX
MCLK
CLKREQ
MCLKSec
XOXOn
XOp
26MHzX-tal
VccWPA
VccWPA
Powercoupler
Powercoupler
VccWPA
VccWPA
BiasDET En
DET
BiasDET En
UL: 1920 – 1980 MHzDL: 2110 – 2170 MHz
UL: 1749.9 – 1784.9 MHzDL: 1844.9 – 1879.9 MHz
UL: 830 – 840 MHzDL: 875 – 885 MHz
824 – 915 MHz
1710 – 1910 MHz
1930 – 1990 MHz
1805 – 1880 MHz
925 – 960 MHz
869 – 894 MHz
WDCDCREF
FB
Switch
PWM/PFM
En
ControlLogic
RFCtrl1
- 65 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.7.2.3. Synthesizer
WCDMA Transmitter Synthesizer
All RF frequencies are generated in the WCDMA Tx 4 GHz VCO, subsequently divided by2 or 4 to arrive at the final frequency.The WCDMA Tx RF-VCO is locked to the XO in a fractional N PLL consisting of a prescaler, a phase frequency detector, a charge-pump, a sigma-delta modulator, and a fully integrated loop filter.Automatic trimming of the VCO center frequency and the RC constant ensures that the variation of the PLL dynamics is sufficiently low.
GSM/EDGE and WCDMA Receiver Synthesizer
All RF frequencies are generated in either of the two 4 GHz VCOs, subsequently divided by 2 or 4 (depending on final frequency). The selection of either of the two VCOs is done using the digital bus.The selected RF-VCO is locked to the XO in a fractional N PLL consisting of a prescaler, a phase-frequency detector, a charge-pump, a sigma-delta modulator, and a fully integrated loop filter.Automatic trimming of the VCO center frequency and the RC constant ensures that the variation of the PLL dynamics is sufficiently low.
Figure 3-7-4. WCDMA Transceiver schematic
RF TRANCEIVER
TEMP SENSOR
closed to RF3300
0R162
C178 33p
R16
8D
NI
R166 0
L120NA
VDDA_2V8
R1283.9nH
22p
C16
7
4.3nH R125
C164 15p
WTXHB129
WTXHB233
WTXHB331
WTXIN24
35WTXLB
23WTXLP
WTXQN2625
WTXQP
XON1718
XOP
MCLKSEC20
57PGND
37RFCTRL1RFCTRL2
36
STR10
13TESTOUT
27VCCA1VCCA2
51
VCCD21
WRXHB138
WRXHB242
3WRXINWRXIP
4
WRXLB40
1WRXQNWRXQP
2
16G
ND
1019
GN
D11
GN
D12
22
GN
D13
28 30G
ND
1432
GN
D15
34G
ND
16
GN
D2
53
GN
D3
49
GN
D4
47 45G
ND
543
GN
D6
41G
ND
739
GN
D8
5G
ND
9
MCLK15
CLK12
14CLKREQ
11DATA
52EAMMOD
8EDATAAEDATAB
9
EDATAC6
EDATASTR7
48ERXHB1
50ERXHB2
ERXLB144
ERXLB246
56ETXHB
54ETXLB
GN
D1
55
U111RF3300
0
R151
DN
IC
191
L118 10nH
DN
IR
139
1800FB100R124 390
33p
C16
0
R13
627
0
2.2nHL106
270
R13
1
DN
IR
148
OUT
FL107SAFEA1G88KB7F00
G1
2
G2
5
G33
IN1 4
R15
0D
NI
C18
110
0p
NAL114
L105NA
NAL109
DN
IC
187
PT
100
4.7K
C16
5D
NI
NAL112
DN
IC
189
R13
227
0
DNI
R145
27R134
VDIGRAD_1V8
C16
9D
NI
DN
IR
159
0 R133
DN
IR
158
3.9pC159
DN
IR
164
C179
10nH
2 GND1
GND24
1HOT1
HOT23
26MHzTN4-26562
X100
8.2nHL110
VRAD_2V8
DN
I
R12
7
2.7p
C17
0
10nHL113
GND5GND610
IN_881_51
IN_942_54
OUT_881_59
6OUT_942_5
FL104
SAWEN881MBA0F25
GND12
GND27
3GND3
8GND4
5
R14
9D
NI
DN
IC
188
L1155.6nH
R143560
0R130
22p
C16
3
VDDA_2V8R129 27
0.01
uC
162
270
R13
7
A23 GND
5VCC
Y4
1 _OE
SN74LVC1G125DRLR
U108
3.3pC177
0
R161
5
G33
IN1 4
OUT
0R144
G1
3
G2 G3
5
1IN OUT
4
FL106SAFEB1G95KA0F00
G1
2
G2
SAFEB897MAM0F00FL105
2
0R157
VRAD_2V8
R142 18p
L1043.3nH
R14
6
4.7K
GND12
GND27
3GND3
8GND4
5GND5GND6
10
IN_1842_51
IN_19604
OUT_1842_59
6OUT_1960
FL103
SAWEN1G84BC0F25
DN
IC
161
R14
1D
NI
DN
IC
185
DN
IR
155
R165
0
3.3pC172
0R152
C16
60.
01u
DN
IR
138
560R123
39nH L116
L1172.2nH
R140
C180
0
DNI
1.8pL119
DN
I
R15
3
R12
6
0
NAL107
L111NA
WRX_BAND_1
WRX_BAND_2
WRX_BAND_8_5
TX_ADC_STRB_2V8
WTX_BAND_2_TO_PA
WTX_BAND_1_TO_PA
TX_ADC_STRB
MCLKSEC
GRX_1800
GRX_850
GRX_900
GTX_1800_1900
GTX_850_900
MCLK
WTX_BAND_8_5_TO_PA
WTX_I_NWTX_I_P
WTX_Q_P
TX_ADC_STRB_2V8
GRX_1900
QDATA_AMP_MSBIDATA_FREQ_MSB
AMP_FREQ_LSBDATA_STR
WDCDC_EN
WRX_I_NWRX_I_P
WRX_Q_NWRX_Q_P
ADOUT
RTEMP
RF_CTRL_CLK
RF_CTRL_DATA
WTX_Q_N
RF_CTRL_STR_1
TESTOUTMCLKREQ
GTX_VAM
- 66 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.7.2.4. Power Amplifier Module
The SKY77182 Power Amplifier module is a fully matched 10-pad surface mount module developedfor Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient power amplifier packs full coverage of the 1920–1980 MHz bandwidth into a single compact package.
The SKY77181 Power Amplifier module is a fully matched 8-pad surface mount module developed forWideband Code Division Multiple Access (WCDMA) applications. This small and efficient poweramplifier packs full coverage of the 880–915 MHz bandwidth into a single compact package.
Figure 3-7-5. SKY77182 Functional Block Diagram
Figure 3-7-6. SKY77181 Functional Block Diagram
- 67 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
Figure 3-7-8. WCDMA PAM schematic
3.7.3. WCDMA/EDGE/GPRS/GSM RF block
The transceiver is a multi-mode transceiver for WCDMA/EGDE/GPRS/GSM.The EDGE/GPRS/GSM part of the transceiver use a digital baseband interface that is shared between received and transmitted data. The receive interface is based on I and Q data and the transmitter interface is based on envelope and frequency data.The WCDMA part of the transceiver use differential analog in-phase and quadraturephase interfaces, that is an IQ-interface, in the receiver and the transmitter data paths.The EDGE/GSM/GPRS part of the transceiver has the following general features:
• Power class
- GMSK low bands: Class 4 (33 dBm)- GMSK high bands: Class 1 (30 dBm)- 8PSK low bands: Class E2 (27 dBm)- 8PSK high bands: Class E2 (26 dBm)- WCDMA: class 3 (+24dBm)
WCDMA PA Block
R12
0
24
L100
18p
C12
222
p
C1581000p
NAC117
0.1u
7GND4
8GND5
9GND6
1RX
TX3
C101
1OUT
4TER
FL100 SAYFP1G95AA0B00
ANT6
GND12
GND24
GND35
U103 LDC151G8620Q-359
COU3
IN2
3.6nHC124
GND312
14GND4IN_BAND_2
2
6IN_BAND_5
13OUT_BAND_2
OUT_BAND_59
PGND15
10VBIAS
VC211
4VCC1
VCONT5
VEN_BAND_21
7VEN_BAND_5
SKY77175U105
3GND1
GND28
C13
8D
NI
22p
DN
IC
151
C12
1
C1430.5p
C1151000p 1000p
C116
C133 DNI
56
R11
7
0.1uC154
GND3GND4GND5GND6
RX
TX
ACMD-7407FL101
ANT
GND1GND2
DA
P7
4ENGND
3
OUT6
5REF
2RF_IN
VDD1
U100 LMV221
U104
3COU
2IN
OUT1
TER4
100pC135
LDC151G8620Q-359
1000
pC
137
8
VCONT3
VEN4
DN
I
R11
3
U107 SKY77181
GND15
GND26
PGND9
2RF_IN
7RF_OUT
VBIAS1
VCC
R12
1
56
GND2GND3GND4
GND5GND6
RX
TX
LT56BFL102
ANT
GND1
C10633nF
0.1uC149
C14
222
p
C1501000p
1.8nH
VBAT
100pC146
L101
VBAT
100pC145
L1038.2nH
DNIC156
C1526.8nH
C119 100p
R10
0
DN
I
1000pC102
C118NA
0.1u
C134 100p
C110
0.1u
FC
120
R103
120
C147 22p
VBAT
C1571000p
R116 DNI
R10
4
75
C10
522
p
10uC148
R11
80
R10
9
56
RFIN6
RFOUT
4VBIAS VCC
5
VCTRL2
VENB1
10uC155
U102 SKY77182
7GND1
GND28
PGND9
3
C10
422
p
1000pC153
1K
R102
1000
pC
141
C12
7
VRAD_2V8VDDA_2V8
L60
12.
2nH
DN
I
C10
30.
1uF
DN
IC
123
COU32
IN
OUT1
TER4
U106 LDC15874M19Q-360
R652
0
C10010u
R10
7
10
1.5p
C12
8
0
R10
1
C63
63.
3nH
C11122p
C14
422
pD
NI
C13
6
WRX_BAND_1WTX_BAND_2_EN
WTX_BAND_2_TO_PA
WRF_BAND_1
WRF_BAND_2
WRF_BAND_8_5
VCC_WPA
BIAS_CTRL
BIAS_CTRL
WTX_BAND_1_EN
WTX_BAND_1_TO_PA
WPOW_DET_EN
WRX_BAND_8_5
WRX_BAND_2
WPOW_DET
WTX_BAND_8_5_EN
WTX_BAND_8_5_TO_PA
BIAS_CTRL
- 68 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
Figure 3-7-9. GSM Transceiver Architecture
3.7.3.1. Transmitter Part
Transmitter
There are two transmitter blocks, one for GSM/EDGE and one for WCDMA.
GSM/EDGE Transmitter Block
• A separate block is used to convert the digital bit streams from the baseband into parallel words to be used in the DACs and Sigma Delta modulator. This block also includes programmable delays for optimizing timing between the different modulation paths. A separate output is generated for the auto-tuning block of the second FM path. The block also outputs a low-frequency square wave to the FM paths, to enhance the speed of the auto tuning for the second FM path.
GSM/EDGEPA + Ant Sw.
ANT
VAPC
RADCLK
RADDAT
RADSTR
VBAT
2.75 VVRAD
1.8 VVIO
PA
PA
GSM850/900 Input
DCS/PCSInput
ESD
2.75 VVRAD
LNA
LNA
LNA
LNA
LNA
AD
AD
090
LPF+ ChP PhD
÷N.M
VCO
LPF ChP PhD
÷N.M
+ 090
+
DAC
DAC
XO
DAC
VCO
VCO
LNA
LNA
WCDMA LB
WCDMA HB
WCDMA HB
WCDMA HB
CLK
DATA
STROBESerial
Control
WTxQB
WTxQA
WTxIB
WTxIA
GSM/EDGE
AM
DAC
RFCtrl1
RFCtrl2
RFCtrl1
RFCtrl2
GSM/EDGE HB
GSM/EDGE LB
WCDMA LB
WCDMA HB
WCDMA HB
GSM/EDGELB
GSM/EDGELB
GSM/EDGEHB
GSM/EDGEHB
WRxIA
WRxIB
WRxQB
WRxQA
EDataA
EDataB
EDataC
EDataStr
WCDMA/GSM/GPRS/EDGE TRX
MCLK
CLKREQ
MCLKSec
XOXOn
XOp
26MHzX-tal
VBAT
VccWPA
VccWPA
Powercoupler
Powercoupler
VccWPA
VccWPA
RF Pow det
DetEn
BiasDET En
BiasDET En
BiasDET En
UL: 1920 – 1980 MHzDL: 2110 – 2170 MHz
UL: 1749.9 – 1784.9 MHzDL: 1844.9 – 1879.9 MHz
UL: 830 – 840 MHzDL: 875 – 885 MHz
824 – 915 MHz
1710 – 1910 MHz
1930 – 1990 MHz
1805 – 1880 MHz
925 – 960 MHz
869 – 894 MHz
WDCDCREF
WPOW_DET_EN
FB
Switch
PWM/PFM
En
ControlLogic
RFCtrl1
- 69 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
• The combined DAC and LP filter is used to convert the digital words of the digital block into analog signals. The LP filters are 3rd order Bessel reconstruction filters.• The second FM path is used to add the high-frequency part of the FM to the VCO. It also includes an auto-tuning block that compensates for VCO gain variations.• The AM block converts the differential voltage from the DAC to a single-ended output that drives the PA. The output is scaled according to the desired output power, and an offset can be added for PA linearization.• The Tx-buffer is used to drive the PA with the correct power level. A divide by 2 or 4 block is used to generate the correct output frequency from the 4 GHz VCO.
WCDMA Transmitter Block
The transmitter has differential voltage I and Q inputs. The IQ signal is filtered in a second order LP filter before it is up-converted to the RF in the direct IQ mixer. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low.The signal path is split in one low and three high band paths. The RF signal is amplified in a PGA, which is controlled by the 3-wire control bus. The low band and two of the high band transmit output stages provide +5 dBm (minimum) and the last high band output stage provide +7 dBm (minimum) at maximum power control. The output power is setthrough the serial bus.
3.7.3.2. Receiver part
Receiver
The receiver is a homodyne receiver with direct conversion of the received radio channel to baseband I and Q channels.The receiver block consists of multi-band front ends with separate LNAs, a common mixer and a common LP filter with configurable bandwidth.
GSM/EDGE Receiver
The front end block is followed by a baseband block with active anti-aliasing filters that also suppress blocking signals and interferers. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low. The baseband block is followed by a fully integrated ADC of sigma delta structure with high dynamic range. The analog signals are converted to digital bit-streams in a sigma delta converter. The digital output signals are sent over a serial interface to the digital baseband controller for further processing and detection.
WCDMA Receiver
The front end block is followed by a baseband block with active anti-aliasing filters that suppress blocking signals and interferers. Automatic trimming of the filter RC constant ensures that the bandwidth variation is sufficiently low. The baseband signal is amplified in a PGA, which is controlled by the 3-wire control bus. The PGA has a built in second order loop for DC-offset cancellation. The output of the receiver is analog differential I, Q signals.
- 70 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.7.4. Front-End Module (FEM)
A single antenna is used for all bands. The single antenna is used for all transmission and reception. The Front End block connects the proper block in the radio system to the antenna. The Front End has two inputs for EDGE/GSM/GPRS, one for low band (850/900 MHz) and one for high band (1800/1900 MHz). The EDGE/GSM/GPRS power amplifier output is filtered by the low pass filter in the Front End and then connected to the antenna through a switch. In receive mode, the EDGE/GSM/GPRS signal from the antenna passes through the switch to one of the four receive SAW filters. The SAW filter provides receiveband selectivity.
In GSM/GRPS/EDGE systems, transmit and receive operations are divided in time and the switch connects the proper block in accordance with the mode of operation (that is, transmit or receive; one at a time).In WCDMA the transmit outputs from the WCDMA transceiver are filtered by an external SAW filter that cleans up the spectrum. The SAW filter output is connected to the power amplifier, one for each band. For power control, a sample of the transmit output is taken by a directional coupler and converted to a DC level by the power detection circuit. This signal is used to control the transmitter output power. The transmit signal passes through an isolator and then a duplexer. The duplexer output is selected by the switch in the Front End for connection to the antenna. In WCDMA receive mode the signal from the antenna is switched by the Front End to the correct duplexer. The output from the duplexer is connected to the LNA input in the WCDMA receiver.
Figure 3-7-10. Front-End Module
- 71 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL DESCRIPTION
3.7.4.1. Front End Part
SKY77521 is a transmit and receive Front End Module (FEM) designed in a very low profile (1 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation — a complete transmit VCO-to-Antenna and Antenna-to receive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.
Figure 3-7-12. Front End part schematic
Figure 3-7-11. SKY77521Functional Block Diagram
GSM PA WITH ASM
0R1140R115
0R112
33pC113
_TXEN8
LB_RF_IN3 9
MODE
PG
ND
131 32
PG
ND
2P
GN
D3
33 34P
GN
D4
RSVD10
RX11615
RX2RX3
1413
RX4
VAPC4
VBATT5
WCDMA11819
WCDMA2WCDMA3
20
BS176
BS2
GND12
27GND10GND11
2829
GND12GND13
30
11GND2GND3
1221
GND4GND5
22
GND623
GND72425
GND8GND9
26
1HB_RF_IN
SKY77521
U101
17ANT
C13
922
p
22pC112
VBAT
C14
022
p
DN
IR
106
R111 0 100pL102
KMS-518
SW100
AC G1
G2
C13
2D
NI
DN
IC
126
10u
C10
7
22pC114
47p
C10
9
C13
022
p
DNIR108
R105 0
22p
C12
9
22pC125ANT
G1G2
0.01
uC
108
SW101UFL-R-SMT10
WRF_BAND_2
WRF_BAND_1
GRX_1800GRX_1900
GTX_VAM
ANTSW3
ANTSW2
ANTSW0
ANTSW1
GTX_1800_1900GTX_850_900
WRF_BAND_8_5
GRX_850GRX_900
- 72 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL DESCRIPTION
3.7.5. Control Flow
The access side of the digital baseband controller controls the overall radio system. In both EDGE/GSM/GPRS and W-CDMA air interface mode, the digital baseband controller controls the radio system through a three-wire serial bus. The digital baseband controller also manages PA band control and the antenna switch mechanism in the front end module. The 26 MHz VCXO clock residing in the GSM/EDGE transceiver is turned on only when required, the digital baseband controller initiates this. The EDGE/GSM/GPRS RF system requires control, which is temperature dependent. The temperature within the RF system is estimated by a voltage measurement performed by the analog baseband controller. The control flow for the RF system is shown in Figure 3-7-11.
Figure 3-7-13. RF Control Flow
- 73 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 Power ON Trouble
START
No
Change main board
changemain battery
Yes
Yes
No
No
The voltage of main battery
is higher than 3.3V ?
END key operates well?
UART_TX(TP1) level is 1.8V
when END key pressed.
Follow thekeypad Troubleshooting guide
Check the voltage.
VDDA_2V8 (TP2) 2.8V
VDDD_2V65 (TP3) 1.5V
VDDE_1V8 (TP4) 1.8V
VDDC_2V65(TP5) 2.65V
VDDH_2V75(TP6) 2.75V
VDDF_2V5 (TP7) 2.5V
VDDG_2V85 (TP8) 2.75V
VDDK_2V75(TP9) 2.75V
VCORE(TP10) 1.2V
TP2TP3 TP4
TP5
TP6 TP7
TP8
TP9
TP10
< Main Board – Bottom side >
4.1 Power ON Trouble 4.1 Power ON Trouble
TP802
TP800
TP804
TP801
TP803
OTP_SUB
APP_ACC_UART_TX
CTS_ON
VPPFLASH_E
APP_ACC_UART_RX
BLM18PG121SN1J
to RF3300 digital
120ohm 1608 2A 50mohm Bead
to Hall Switch and AB3100 BEAR
to All I/O Supplies and Memory
to RF3300 Power Detector
to SD Card and LCD
to Bluetooth
to AB3100 CODECs/ADC/PLL
2.8*2.6*1.0 0.7A 240mohm 20%
to DB3210 CORE
Parallel with VCORE
1608
to DB3100 analog
to 3xis
Local ground plane
VDDA_2V8
4.7uHL300
C309
VDDH_2V75 VDDF_2V5
1u
0R303
R304 0
R305 0
0R310
VCOREVBAT_C
R307 0
VBAT
2.2uC303
C3104.7u
C3042.2u
RB521S-30
VDDC_2V65
D300
C3111u
R312 0
10uC315
2.2uC307
0R302
R309 0
1uC312
C3022.2u
C3190.1u10u
C317C3140.1u
0R306
10u
VDDK_2V75
C318
4.7K
R311
VDDD_2V65 VBAT
VDDG_2V85
1u
FB300
C308
VDDE_1V8 VDIGRAD_1V8
0R308
VDDC_2V65
VDDH_2V75
VDDG_2V85
VDDF_2V5
VBAT
EXT_LDO
VDDD_2V65
VDDA_2V8
VCORE
VDDK_2V75
VDDE_1V8
VDIGRAD_1V8
VBACKUP
TP1
TP2
TP3TP4
TP5
TP6
TP7
TP8
TP9 TP10
- 74 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START(Connect a USB Cable from a PC)
Change main board
Yes
NoChange main board
Yes
ACC_GP_USB_CS(TP3) is 1.8V?No
Yes
< Main Board – Bottom side >
TP1
TP2
Is it open statebetween USW_ID(TP1) & TP2?
Finish
TP3
4.2 USB Trouble 4.2 USB Trouble
If Maxim, then 4.7uF
TI : PD = USB,
MUIC
If TI, then 10nF
MAXIM : NA = U
C5094.7u
VBAT
DNIR507
ICC3
INT
B2
A2ISET
A1MIC
B1RES
SC
LC
2C
1S
DA
B3U1U2
A3B4
UID
VBD5
U501
D4AUD1
D3AUD2
D2BAT
CAPD1
COM1C5B5
COM2
A4DN1
A5DP2
GNDC4
MAX14526EEWP_TCC6
R508 DNI2
V
2.2K
R504
0R502USW_ID
USW_DMUSW_DP
10V
TP501
0R
655
51K
R50
0
TP500
RREF
STPD6
TESTC4
F4VBUS
VC
CF
3
B5VCC_IO1VCC_IO2
B2
F5XTAL1XTAL2
F6
B6C6
DATA7
E5DIR
DMC1D1
DPFAULT
E2
GN
D1
C5
D2
GN
D2
GN
D3
E4
D3ID
NC
1F
1F
2N
C2
D5NXT PSW_N
D4
E6REF1V8
E3REG3V3
C2
CFG0E1
B4CFG1CFG2
B3
CHIP_SELC3A4
CLOCKDATA0
B1A1
DATA1DATA2
A2A3
DATA3DATA4
A5A6
DATA5DATA6
ISP1508AETU502
C5130.1u
0.1uC500
4.7uC501
4.7uC512
VBAT
ACC_USB_HS_NXTACC_USB_HS_STP
ACC_GP_USB_CSACC_USB_HS_IN_CLK
USB_DATA(0)USB_DATA(1)USB_DATA(2)
ACC_USB_HS_DATA(3)ACC_USB_HS_DATA(4)ACC_USB_HS_DATA(5)ACC_USB_HS_DATA(6)ACC_USB_HS_DATA(7)
ACC_USB_HS_DIR
TP2
- 75 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
SIM control path
- DB3200 generates SIM interface signals(1.8V level) to AB3100.
- AB3100 converts SIM interface signals to 3V.
SIM works well? Finish
START
Yes
Reconnect SIM card
Resolder J800 on main PCBand check the contact
between J800 and SIM card
Change Sub board
SIM works well? FinishYes
No
No
SIM works well? FinishYes
No
Change SIM card
< Sub Board >
J800
4.3 SIM Detect Trouble
5VPP
J800
3CLK
GND4
7GND1GND2
86
I_ORST
2VCC
1
- 76 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
< Main Board - Top side >
S100
MicroSD works well?
START
Yes
Re-insert MicroSD card
Check operation of MicroSD card using other notebook or PDA
Change main board
MicroSD works well? FinishYes
No
No
MicroSD works well? Change the MicroSDNo
Yes
Re-insert MicroSD
Yes
No
Yes
VDDG_2V85 (TP1) is same to 2.85V?
Finish
Change Main board
Yes
NoAPP_GP_MMC_DETn(TP2) is same to 0 V? Change Main board
TP1 TP2
4.4 MicroSD card Trouble
HENSWA SWB
4
6
2
5
3
78
1
GND
R416 2.2
- 77 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5 Key and Touch Screen Trouble
4.5.1 Key Trouble
Key works well?
START
Yes
Press the key button
No
Change the key FPCB.
Finish
Change Main Board
Check key button.If Key button is pressed orappearance is abnormal,Change the key button.
works well?Yes
Finish
No
Check BtoB connector(CN2)Re-assemble CN2.
Check connector soldering.Re-solder CN2.
works well?Yes
Finish
No
works well?Yes
Finish
No
1
2
- 78 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check key button.If Key button is pressed orappearance is abnormal,Change the key button.
1
Check BtoB connector(CN2)Re-assemble CN2.
Check connector soldering.Re-solder CN2.
2
CN2
- 79 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.5.2 Touch Screen Trouble
Touch screen works well? Finish
START
Yes
Reboot the phone
Perform Touch Calibration
No
Touch screen works well? FinishYes
No
Check connector.CN400, CN901
Re-assemble or Re-solder.
Touch screen works well? FinishYes
No
1
Check U404, U405, U406 and peripheral circuit.
Re-solder U404, U405, U406 and peripheral circuit.
Touch screen works well? FinishYes
No
2
Change main board
Touch screen works well? FinishYes
No
Change touch window
- 80 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check connector.CN400, CN901
Re-assemble or Re-solder.
1
Check U404, U405, U406 and peripheral circuit.
Re-solder U404, U405, U406 and peripheral circuit.
2
CN400
CN901
U405
U404
U406
Peripheral circuit
- 81 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.6 Camera TroubleCamera control signals are generated by DB3200 with ISP
4.6.1 5M Camera
START
Press END Key
to turn on the power
Is the circuit powered?
Reconnect the 5M 24pin B to B connector
5M Camera’s Operation is OK?
Change 5M Camera
Follow the Power On Trouble
Shooting
YES
NO
YES
5M Camera Works
NO
Change U603
YES
NO
Pin8 of U603 or C627=2.8V?Pin7 of U603 or C628=1.8V?
1
2
Change Main Board
- 82 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
< Main Board – Bottom side >
CN600
U603
1 2
< Main Board – Top side >
C628
C627
pin8pin7
VBAT
0
R635
R625
5.6K
ISP_DVDD_1V8
1uC6289
PG
ND
VIN1 8
VOUT1VOUT2
7
C6271u
U603 RT9011-MGPQW
2EN1
3EN2
5GNDNC1
46
NC2
1uC629
1uC630
ISP_AVDD_2V8
APP_GP_ISP_LDO_EN
C627C628
- 83 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.6.2 VGA Camera
VGA Camera control signals are generated by DB3200.
START
Press END Key
to turn on the power
Is the circuit powered? Follow the Power On Trouble Shooting
YES
NO
YES
NO
NO
Pin31(TP3) of CN503) or pin 7 of U 601(TP4)=1.8V?Pin33(TP1) of CN503) or pin 8 of U 601(TP2) =2.8V?
2
C900(TP6)=1.8V?C901(TP5) =2.8V?
Reconnect the 34pin B to B connector
CN503 and VGA 34pin Camera Connector
VGA Camera Operation OK?
1
Change U601
Change VGA FPCBNO
YES
C913 (TP7) =1.5V?
NO
YES
Check the CN 901 soldering status And resolder the CN 901.
1
VGA Camera works well.
YES
- 84 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
CN 503
CN901
Main board (Bottom)VGA CAM FPCB (Top)
1
- 85 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
CN 503
1
34 18
17
TP1 (pin33) TP3(pin31)
Main board (Bottom)
2
TP2 (pin8)
TP4 (pin7)
U601
Main board (Top)
CAM_AFVDD_2V8
5.6KR616
VBAT
C61
31u
0
R634
CAM_AVDD_2V8
1uC
611
NC1NC2
6
PG
ND
9
1VIN VOUT1
87
VOUT2
RT9011-MGPQWU601
EN12
EN23
GND54
CAM_DVDD_1V8
C61
21u 1u
C61
4
APP_GP_CAM_LDO_EN
TP4
TP2
- 86 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP5
TP6
VGA CAM FPCB(Bottom)
TP7
51R904
CAM_DVDD_1V8
VDD15_1A5
VDD15_2E4
D2VSYNC
0.1uC913
DATA6C3D4
DATA7
A3DCLK
DVDDB6
B5EXTCLK
GND1A4
GND2C4
GND3E2E3
GND4
HSYNCD1
IOVDDA2
F1
PG
ND
C6PWRDWN
D3RESET
D6SCLSDA
C5
U901TCM9000MD
E5AVDD
B3DATA0
B1DATA1DATA2
B2
DATA3B4C1
DATA4DATA5
C2
C9000.1u
CAM_AVDD_2V8
0.1uC901
CI_PCLK
CI_RES_n
SYSCLK0
CI_DATA[0]CI_DATA[1]CI_DATA[2]CI_DATA[3]CI_DATA[4]CI_DATA[5]CI_DATA[6]CI_DATA[7]
CI_HSYNC
APP_GP_VGA_SDN
APP_I2C_SCLAPP_I2C_SDA
CI_VSYNC
TP5
TP6
TP7
- 87 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.7 Main LCD Trouble
LCD control signals are generated by DB3200.
START
Press END Keyto turn on the power.
Is the circuit powered?
Is the R600 (TP1) 1.8V?And
Is the R601(TP2) 2.8V?
YES
NOFollow the Power On Trouble Shooting
Reconnect the LCD FPCB 50pin(CN2) and 40pin (CN1) LCD connector.
OrChange Key FPCB.
1
No
No
Change the U604
Yes
LCD display OK?
YES
Yes
LCD display OK?
Is the backlight on?
Is the backlight on?
Reconnect the LCD FPCB 50pin(CN2) and 40pin (CN1) LCD connector.
OrChange Key FPCB.
NO
No
The LCD works
2
YesYes
The LCD works
NoChange the U600
3
Is the LCD ID High? (CN1 Pin3 (TP3))
No Change LCD
Yes
IS the CN1 Pin11(TP4) Low?And
Is the CN1 pin 19(TP5) high?
5
NoChange
the mainboard
Yes
1
6
- 88 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Main board (Bottom)
Key FPCB
U604U600
1 CN 2
CN 1
2 3
Key FPCB 40 pin B to B Connector Key FPCB 50 pin B to B Connector
- 89 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
CN 1
TP3 (pin3)
5
6
Key FPCB(Bottom)
U604
R600
R601
4
Main board (Bottom)
TP1
TP2
TP4 (pin11)
TP5 (pin19)
1
2021
40
LDO for LCD Power
C60
11u
0R
601
VOUT187
VOUT2
RT9011-MGPQWU600
EN12
EN23
GND54
NC1NC2
6
PG
ND
9
1VIN
1uC
603
R60
00
LCD_DVDD_1V8
R654 00R653
C60
21u
VBAT
LCD_AVDD_2V8
APP_GP_LCD_DLDO_ENAPP_GP_LCD_ALDO_EN
TP1
TP2
- 90 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.8 Keypad Backlight Trouble
START
Press END Key
to turn on the power
Keypad Backlight Works?
YES
NO
VBAT applied? (TP1) Change Main Board
NO
Check V at LD1000 or LD1001 or LD1002 or LD1003 is confirm
(TP2)
NOChange LD1000 or LD1001
Of LD1002 or LD 1003
YES
YES
YES
Keypad Backlight Works
Check V at R626(TP3)orR627(TP4) is confirm
NO
Change Key FPCB
1
1
2
Keypad Backlight Works
- 91 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TP1
Key FPCB(Top)
TP2
1
LD1003
SSC-TWH104-HL
VB
AT
SSC-TWH104-HL
LD1001
LD1002
SSC-TWH104-HL
LD1000
SSC-TWH104-HL
KEY_LED2
KEY_LED1TP1
TP1
- 92 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
CN604
2
TP3 TP4
Main board (Bottom)
- 93 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9.1. Receiver
4.9 Audio Trouble Shooting
• Signals to the receiver
– Receiver signals are generated at AB3100
• BEARP, BEARN
– Receiver path :
• AB3100 (BEARP, BEARN)
• R322, R323 on main board
• Camera FPCB
• Receiver
Note : It is recommended that engineer should check the soldering of R, L, C along the corresponding path before every step.
- 94 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Connect the phone to network
Equipment and setup call.
Setup 1KHz tone out.
Does the sine wave appear
at TP1, TP2 ?Change the main board
Does the sine wave appear
at Number TP3, TP4
in the main B’d CN503?
Change U301
Does the sine wave appear
at EAR(+) PAD(TP5) in LCD FPCB?Change the Camera FPCB
Is the soldering of the
receiver OK?Resolder the Receiver
Can you hear sine wave
out of the receiver ?Change the Receiver
END
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
1
2
3
3
The sine wave not appear
- 95 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TP2
1
Main PCB Bottom
3
2
1
18
17
34
CN503
Main PCB Bottom
Camera FPCB Bottom
TP1
TP3 TP4
TP5
U301
1%
Audio Subsystem
Audio Subsystem
1%
C343
B3
B1
VD
D
A3
VS
S
18000p
A4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDA
MAX9877AEWP_TG45U301
B2BIAS
C1N
C342 1u
C3340.1u
C3541u
C3331u
15R323
VA30
0IC
VL
0505
101V
150F
R
VBAT
15R322
C332
1u
C35
322
p
C33
61u
C35
222
p
C339 1u
VA30
1IC
VL
0505
101V
150F
R
18000pC344
C338 1u
HS_EAR_L
HS_EAR_R
SPK_RCV-
SPK_RCV+
AMP_I2C_SCLAMP_I2C_SDA
EAR_REAR_L
SPKRPSPKRN
BEARPBEARN
TP1
TP2
TOUCH_Y- : GND line shielding to CN
272829
3
3031323334
456789
1314151617 18
19
2
20212223242526
CAM_AVDD_2V8
ENBY0040301GB042-34S-H10-E3000
CN5031
101112
0.1uC525
CAM_DVDD_1V8
C5230.1u
TOUCH_Y+TOUCH_Y-
CI_RES_n
SYSCLK0
TOUCH_X+TOUCH_X-
APP_GP_VGA_SDNAPP_I2C_SDA
APP_I2C_SCL
CI_DATA[1]
CI_DATA[3]
CI_HSYNC
CI_DATA[6]
CI_DATA[0]
CI_DATA[2]
CI_DATA[4]
CI_VSYNCSPK_RCV+SPK_RCV- CI_PCLK
CI_DATA[7]
CI_DATA[5]
TP3
TP4
CN9021
2
SPK_RCV-
SPK_RCV+
TP5
- 96 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Measured 1khz Sine Wave Signal
1
3
2
Measured 1khz Sine Wave Signal
- 97 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9.2. Speaker (Voice Loud Speaker,Midi, MP3,Key Tone)
• Signals to the speaker
– Speaker signals are generated at AB3100
• SPKRP, SPKRN
– Speaker path :
• 1.AB3100 (SPKRP, SPKRN)
• 2. C343, C344 on the main board
• 3. U301(audio amp) on the main board
• 4. C352, C353 on the main board
• 5. Speaker
Note : It is recommanded that engineer should check the soldering of R, L, C along the corresponding path before every step.
- 98 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
Does the sine wave appear
at C343(TP1),C344(TP2)? Change the main board
Does the sine wave appear
at U301 ? Change the U301
Does the sine wave appear
at R352(TP3),R353(TP4) ?
YES
YES
YES
NO
NO
NO
Can you hear sine wave
out of a speaker ?Change each Speaker
END
YES
NO
Change the U301
1
3
2
The sine wave not appear
4
- 99 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
1 32
TP1
TP2
U301
TP3 TP4
< Main Board – Bottom side >
1%
Audio Subsystem
Audio Subsystem
1%
C343
B3
B1
VD
D
A3
VS
S
18000p
A4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDA
MAX9877AEWP_TG45U301
B2BIAS
C1N
C342 1u
C3340.1u
C3541u
C3331u
15R323
VA30
0IC
VL
0505
101V
150F
RVBAT
15R322
C332
1u
C35
322
p
C33
61u
C35
222
p
C339 1u
VA30
1IC
VL
0505
101V
150F
R
18000pC344
C338 1u
HS_EAR_L
HS_EAR_R
SPK_RCV-
SPK_RCV+
AMP_I2C_SCLAMP_I2C_SDA
EAR_REAR_L
SPKRPSPKRN
BEARPBEARN
TP1TP3
TP4
TP2
- 100 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Measured 1khz Sine Wave Signal
4
- 101 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9.3. Microphone (Voice call, Voice Recorder, Video Recorder)
• Microphone Signal Flow
– MIC is enable by MIC Bias
– CCO, MIC1P, MIC1N signals to AB3100
• Check Points
– Microphone bias
– Audio signal level of the microphone
– Soldering of components
• Signal from the mic
– MIC
– C625,C626 on main board
– AB3100
- 102 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
START
Change the MIC
Does it work properly ?
END
Yes
Yes
NoDoes not open Tx path about Mic?
No
Yes
1
- 103 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
1
MIC
- 104 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9.4. Headset Receiver (Voice call, Video Telephony,MP3 )
START
Connect the phone to network
Equipment and setup callSetup 1KHz tone out
Insert Headset.Does the Headset icon
display on the main LCD?
Can you hear sine waveout of the receiver ?
Change the main B’d
END
YES
YES
YES
NO
NO
NO
Does the level of R502(TP1) under 0.5Volt ?
NO
Resolder R502(TP1) And try again from the start
YES
Does the sine wave appearat R505(TP4),R506(TP5) ?
Resolder CN501 Pinsor change the Headset
1
5
7
Does the sine wave appearat R339(TP2),R342(TP3) ?4
YES
Change the U301
Change the main B,d
NO
Change the U501
Insert Headset.Does the Headset icon
display on the main LCD?
YES
NO
2
`
3
Does the sine wave appearat TP6, TP7 at CN501 ?
NOChange the U501
6
- 105 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.9.5. Headset MIC(Voice call, Video Telephony )
START
Connect the phone to network
Equipment and setup callSetup 1KHz tone out
Insert Headset.Does the Headset icon
display on the main LCD?
YES
NODoes the level of R502(TP1) under 0.5Volt ?
NO
Resolder R502(TP1) And try again from the start
YES
1
NO
Change the U501
Insert Headset.Does the Headset icon
display on the main LCD?
YES
2
`
3
Does it work properly ?? Try again from the start
END
YES
YES
NO
NO
Change the main B’d
Check the signal level
at C505(TP8) at the putting
Audio signal in MIC
Resolder C505(TP8)and try again.If fail again,
Change the main B’d
A few hundred of mV Of the signal measured at C505(TP8) ?
4
5
6
Change the main B,d
- 106 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9.6. Headset
If Maxim, then 4.7uF
TI : PD = USB, PU = UART
MUIC
If TI, then 10nFClose to MUIC
MAXIM : NA = USB, PU = UART
C5094.7u
C508
22p
2.2K
R51
1
VDDE_1V8
22p
C507
C50
31u
10R506
VBAT
VBAT
R505 10DNIR507
ICC3
INT
B2
A2ISET
A1MIC
B1RES
SC
LC
2C
1S
DA
B3U1U2
A3B4
UID
VBD5
U501
D4AUD1
D3AUD2
D2BAT
CAPD1
COM1C5B5
COM2
A4DN1
A5DP2
GNDC4
MAX14526EEWP_TCC6
C506
22p
FB502
FB500C505 0.1u
R508 DNI
R503 0
TP602
0R501
VBUS
2.2K
R504
FB501
C5041u
0R502
HS_EAR_RHS_EAR_L
USW_ID
MIC2P
APP_ACC_UART_RXAPP_ACC_UART_TX
USW_DMUSW_DPUSB_DP
APP_GP_USW_INT
APP_GP_USW_SCLAPP_GP_USW_SDA
USB_DM
1%
Audio Subsystem
Audio Subsystem
1%
C343
B3
B1
VD
D
A3
VS
S
18000p
A4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDA
MAX9877AEWP_TG45U301
B2BIAS
C1N
C342 1u
C3340.1u
C3541u
C3331u
15R323
VA30
0IC
VL
0505
101V
150F
R
VBAT
15R322
C332
1u
C35
322
p
C33
61u
C35
222
p
C339 1u
VA30
1IC
VL
0505
101V
150F
R
18000pC344
C338 1u
HS_EAR_L
HS_EAR_R
SPK_RCV-
SPK_RCV+
AMP_I2C_SCLAMP_I2C_SDA
EAR_REAR_L
SPKRPSPKRN
BEARPBEARN
6
7
8
9
CN501
1
10
11
12
13
14
15
2345
USW_IDUSW_DPUSW_DM
TP8
TP4
TP5
TP1
TP6TP7TP2
TP3
- 107 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TP7
U501
CN501
U301
TP1
TP2
TP3
TP4 TP5
TP6
TP8
- 108 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.10 Charger Trouble Shooting
Main Battery Charging Path
• Charging Procedure
- Connecting TA and Charger Detection
- Control the charging current by AB1000
- Charging current flows into the battery
• Check Point
- Connection of TA
- Charging current path
- Battery
• Trouble shooting setup
- Connect TA and battery to the phone
• Trouble Shooting Procedure
- Check the charger connector
- Check the Charging current Path
- Check the battery
Direction of BAT and GND
Charging
Route as a differential pair
Phone ground return path
USB charging pathDischarging
Route as a differential pair
Make an Area at 8, 9 Layer
Causion when PCB lLayout
Charging Circuit
22pC337
VBUS
2
C1
1
D302
KDS221E_RTK
A1_C2
3A2
VBAT_H
1/4WR324
VBAT
2012
1% 0.025
D1
D2
D3
D4
G1
G2
S1
S2
Q300 SIA911DJ
300KR320
C33022p
C33133u
1%1/4W2012
0.1R316
D1
D2
1 2 3
CN
300
R314
0 CHS-
BDATA
FGS+
CHREG
DCIO_INT
FGS-
CHS+
- 109 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
start
Check the pin(TP1) and batteryconnect terminals of I/O
connector
Connection OK? Change I/O connectorNO
YES
Change Main boardNO
YES
Is it charging properlyEND
YES
NO
Change Main board
1
2
3
start
connect terminals of I/Oconnector
Connection OK? Change I/O connectorNO
YES
Is the VBUS voltage(TP3) 5.1V?NO
YES
Is it charging properly
after changing Q400(TP4)?END
NO
2
3
Trouble Shooting - Charging
YESYES
Is the TA voltage(TP2) 5.1V? Change TANO
Change TANO
34
- 110 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Main Board ( Bottom side)
- I/O connector and FET
TP1
TP2
TP3
TP4
Charging
VBUS
D1
D2
D3
D4
G1
G2
S1
S2
Q300 SIA911DJ
CHREG
DCIO_INT
2012
Close by uUSB CONN
L500
82nHU500
NUS3065MUTAG
CNTRL3
4DRAIN
DRAIN_THERMAL9
GATE6
GND2
IN1
7OUT
5SRC
8VCC
G24
IN 1OUT2
22p
C511
FL500NFM21PC105B1A3
3G1
6
7
8
9
CN501
1
10
11
12
13
14
15
2345
ULCE0505C015FR
VA500
DNI
C502
SD
12T
1G
ZD
500
9
INS
TPA
R
CN5001
2
1 uF
C510
VBUS
USW_ID
FM_ANT
USW_DPUSW_DM
TP2
TP1
TP3
- 111 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.11 Bluetooth Trouble
Bluetooth IC (STLC2593) gets power from PMIC (AB3100) and clock (MCLK) from RFIC. (RF3300)After checking them, Bluetooth RF path should be examined.
4.11.1 Bluetooth Power path
TP2
TP1
start
1. Check
BT IC Block
TP1: 1.8V , TP2 : 2.75V
2. Check
Mainboard Connector
TP3: 1.8V , TP4 : 2.75V
1
1
2
Go to 4.11.2OK
NG
Replace Sub PCB
OK
NG
Check AB3100 (U300)
Sub PCB
Main PCB (Bottom side)
2
TP3(2nd pin from the end of the connector)
TP4(3rd pin from the end of the connector)
VDDK_2V75VDD_BT
C73
50.
1u
C73
60.
1u
D4NC1NC2
F7F8
NC3NC4
L4
C1C2
BT_RSVR_NBT_RSVR_RF
M2
E6BT_VDD_CLDBT_HVD
N7
BT_REG_CTRLJ4
BT_RSVR_CL1B2
BT_RSVR_CL2C3M8
BT_RSVR_DBT_RSVR_DSM
0R
742
TP1
TP2
5960
G1 G2
5 5657583
4
2
CN601
1
VDDE_1V8
R63
8
0
VDDK_2V75
TP3
TP4
- 112 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11.2 Bluetooth Clock path
TP2
TP1
start
1. Check BTCLK
(Buffered MCLKSEC)
TP1: 26MHz
2. Check
MCLKSEC
TP2: 26MHz
1
2
TP3(4th pin from the end of the connector)
1
2
Go to 4.11.3OK
NG
Replace U730OK
NG
3. Check
Mainboard Connector
TP3: 26MHz
Replace Sub PCB
OK
NG
Check RF3300 (U111)
Main PCB (Bottom side)
Sub PCB
A23 GND
5VCC
Y4
1 _OE
SN74LVC1G125DRLRU730
C7300.1u 4.7u
C731
R730
33
R73
1
100K
VDD_BT
BT_CLKREQ_n
BT_CLKMCLKSEC
TP1TP2
G3 G4
30 3132333435363724
2526272829
FM_ANT
MCLKSEC
RTCCLK
TP3
- 113 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.11.3 Bluetooth RF path
Check Power level
at BT IC Output (C732) with Spectrum Analyzer
TP1: Range
0 ~ 4dBm ?
No
Yes
Replace BT Chip (U731)
TP2: Range
0~4dBm ?
Check Power level
at RF SW Output (C701) with Spectrum Analyzer
Replace ANT780
No
Yes
Replace RF Switch (FL700)
start
TP2
TP1
DEA212450BT-7043C15
BP1
4BP2 BP_DC
2
3G
16
G2
1U_BP
FL730 100pC732
VSS_BT_RF
BT_TXRX
R78
1
0
WIFI_RF_GWIFI_RF_G
VSS_BT_RF
4.7n
H
R78
0
XM0830SK-TL1301TMP
ANT5
GND11
GND24
GND36
GND49
GND51113
PGND
8PORT1PORT2
2
RFGND13
RFGND27
12VCTL
10VDD
0 FL700
C707
R70
0
1u
4pC706C705
4pC704DNI
100pC701
R701 0
WIFI_RF_GWIFI_RF_G
C7021p
VDDK_2V75
C700
0DUMMY FEED
ANT780
BT_TXRXWIFI_TXRX
ANT_SEL_N
TP1
TP2
- 114 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12 Wi-Fi Trouble
Wi-Fi module (M710) gets power from 2 LDOs (U710, U711) and clock from oscillator inside the module.RF path is shared with Bluetooth RF.
4.12.1 Wi-Fi Power path
TP2
TP1
Sub PCB
TP3
start
1. Check VBAT
TP1: VBAT
2. Check 1.8V LDO
TP2: 1.8V
Change Sub PCB
No
Yes
Replace U710No
Yes
3. Check 3.3V LDO
TP3: 3.3V
Replace U711No
Yes
Go Next Step
POWER
VDD_WLAN_3V3
R71
7
0
0
R716
C722
3CE
2GND
5P
GN
DVDD4 1
VOUT
1u
RP101K182D U711
VDD_WLAN_1V8
VBAT
3CE
2GND
5P
GN
DVDD4 1
VOUT
RP101K332D U710
C7211u
C7231uC724
1u
ACC_GP_WLAN_EN
TP3
TP2TP1
- 115 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.12.2 Wi-Fi RF path
TP2
TP1
Check Power level
at Wi-Fi module Output (C717) with Spectrum Analyzer
TP1: Range
13 ~ 17dBm
at 802.11b?
No
Yes
Replace Wi-Fi module (M710)
TP2: Range
13~17dBm
at 802.11b ?
Check Power level
at RF SW Output (C701) with Spectrum Analyzer
Replace ANT780
No
Yes
Replace RF Switch (FL700)
start
R78
1
0
WIFI_RF_GWIFI_RF_G
VSS_BT_RF
4.7n
H
R78
0
XM0830SK-TL1301TMP
ANT5
GND11
GND24
GND36
GND49
GND51113
PGND
8PORT1PORT2
2
RFGND13
RFGND27
12VCTL
10VDD
0 FL700
C707
R70
0
1u
4pC706C705
4pC704DNI
100pC701
R701 0
WIFI_RF_GWIFI_RF_G
C7021p
VDDK_2V75
C700
0DUMMY FEED
ANT780
BT_TXRXWIFI_TXRX
ANT_SEL_N
TP2
C725DNI
WIFI_RF_G
6SCLK
5SPI_SDO_S
7ESCN
GND11
GND23
GND38
ANT2
4ANT_SEL_P
TP713
100p
WIFI_RF_G
C717
WIFI_TXRX
TP1
- 116 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13 GPS Trouble
GPS IC (U751; BCM4750) gets power from a single 1.8V LDO (U752). Clock comes from TCXO (X750) and RFIC. (RF3300)After checking them, GPS RF path should be examined.
4.13.1 GPS Power path
TP2
TP1
1
1
2
Check AB3100 (U300)
Sub PCB
TP3
TP4
start
1. Check Voltage at GPS IC
TP1: 1.8V, TP2: 1.8V
Power OKGo to 4.13.2
Yes
No
Change Sub PCB
Yes
No
3. Check
Mainboard Connector
TP5: VBAT
Change U752Yese
No
2. Check Voltage at LDO
TP3: 1.8V, TP4: VBAT
Main PCB (Bottom side)
2
TP5 (2nd and 3rd pin from the end of the connector)
VDDE_1V8
VD
DIO
1B
6G
3V
DD
IO2
VD
DIO
3G
7
VPDD5
CN
TIN
A3
LP
RE
GIN
F5
RT
CC
LK
YN
C_P
PS
E7
TC
XO
A2
C4
RF
RE
GIN
BMS0C6
F2
0R750
V8
5NC2
OUT4
VCC6
KT2520F16369ACW18T
C7510.1u2.2u
C750
C7521u
VGPS_1V8
R757
0
0
R755
C76
61u
VGPS_1V8
VBAT
1uC
765
3CE
2GND
5P
GN
DVDD4 1
VOUT
RP101K182D U752
TP2
TP3TP4
TP1
5960
G1 G2
5 5657583
4
2
CN601
1
VBAT
R64
4
100K
TP5
- 117 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TP2
4.13.2 GPS Clock path
start
2. Check Buffered MCLKSEC
TP2: 26MHz
3. Check
MCLKSEC
TP3: 26MHz
1
2
TP4(4th pin from the end of the connector)
2
Go to 4.11.3
No
Yes
Replace U750OK
NG
4. Check
Mainboard Connector
TP4: 26MHz
Replace Sub PCB
OK
NG
Check RF3300 (U111)
Main PCB (Bottom side)
TP1
Sub PCB
TP31. Check TCXO output
TP1: 16.369MHz
1
Replace X750No
Yes
4.13.2 GPS Clock path
NT
IN
F5
CC
LK
_PP
SE
7
TC
XO
A2
F2VDDE_1V8
X7501
GND1
GND23
NC12 5
NC2
OUT4
VCC6
KT2520F16369ACW18T
C7510.1u2.2u
C750
R757
0
GPS Clock Buffer
R75
4
100K
0.1uC753
R75210
33
R753
C7542.2u
VDDE_1V8
A
GND
OE VCC
Y
NL17SZ126XV5T2GU750
MCLKSEC
GPS_CNTIN
ACC_GP_GPS_PON
TP1
TP2TP3
G3 G4
30 3132333435363724
2526272829
FM_ANT
MCLKSEC
RTCCLK
TP4
- 118 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13.3 GPS RF path
start
1. Check GPS Antenna pad
contact
1
2. Change the LNA (U750)
Change the sub PCB
1
1
2
3
3. Change GPS IC (U751)
2
3
GPS LNA block
100p
C77
2
C7710.1u
ALM-1612
FIL_OUT4 3
GNDRF_IN
2
1S
_D
VDD5
2.2u
U770
C770
C75
7N
A
L750 6.8nH
VDDE_1V8
VGPS_1V8
2.2n
HL
770
10n
HL
771
0R772
F1TESTMODE
VDDIFSYNTHD1
F6_LPREGOUT
VDDRFD2
VPDD5
RFINB1
E2RFREGOUT
E1RFSREGOUT
C7552.2nH
100n
HC
758
100nHL772
0R750
1CN750
1CN751
C7601u
C7521u
C75
60.
5p
1uC759
10
R770
ACC_GP_GPS_PON3 2 1
- 119 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.14 RF Component
Main Board : Top side
U100
U109
U102
U107
FL104
FL103
U101
X100
U111
FL100
FL102
FL106
FL105
RF TransceiverU111RF Mobile SwitchSW100
DCDC ConverterU109WCDMA BC 1 Tx FilterFL106
WCDMA BC 8 PAMU107WCDMA BC 8 Tx FilterFL105
WCDMA BC 1 PAMU102GSM Low Band Rx FilterFL104
GSM PAM with ASMU101GSM High Band Rx FilterFL103
Power DetectorU100WCDMA BC 8 DuplexerFL102
X-talX100WCDMA BC 1 DuplexerFL100
DescriptionReferenceDescriptionReference
- 120 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.15 Procedure to check
start
Oscilloscope setting
1. CheckPower Source Block
2. CheckVCXO Block
Agilent 8960 : Test mode (WCDMA)Ch. 9750 (Uplink)Ch. 10700 (Downlink)
4. CheckWCDMA Block
Agilent 8960 : Test mode (GSM)Ch. 190, P.L. 7 level settingCh. 190, -60dBm setting
5. CheckGSM Block
Redownload SW, Cal
3. CheckAnt. SW Module
- 121 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.16 Checking Common Power Source Block
Step 2
GSM PAM Block
Step 3
WCDMA PAM Block
Main Board : Top side
- Common Source Block
GSM PA VBAT
WCDMA
DC/DC VBAT
Step 1
PAM VBAT Block
- 122 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16.1 Step 1 TP1
TP2
Main Board (bottom side)
- Power Source Block
Main Board (Top side)
- Step 1 : VBAT Block
TP5TP3
TP4
Direction of BAT and GND
USB charging path
Discharging
Route as a differential pair
Causion when PCB lLayout
22pC337
2
C1
1
D302
KDS221E_RTK
A1_C2
3A2
VBAT_H VBAT
300KR320
C33022p
C33133u
1%1/4W2012
0.1R316
D1
D2
1 2 3
CN
300
R314
0 CHS-
BDATA
CHS+
TP1
TP3
TP4
TP2
- 123 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
3.7V OK?Step 1
Check Point (TP1) in
Power Source Block
To Check Power source to Check if main power source input or not
Yes
No
Proceed to the Step 2
3.7V OK?No
Yes
Check the Power Supply
Short? No
Yes
Soldering Check Component(CN300)
In Power Source Block
Check Point (TP2)
in Power Source Block
To Check Power source
Change Board
Check (TP1 & TP2)
in Block
to check inner line connectionFrom TP4 to TP3
- 124 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16.2 Step 2
Figure 4-6. Step 2 : GSM PAM Block
(Bottom)
GSM PAM
TP3
TP5
TP4
TP1
TP2
Main Board (bottom side)
- Power Source Block
GSM PA WITH ASM
0R1140R115
0R112
33pC113
_TXEN8
LB_RF_IN3 9
MODE
PG
ND
131 32
PG
ND
2P
GN
D3
33 34P
GN
D4
RSVD10
RX11615
RX2RX3
1413
RX4
VAPC4
VBATT5
WCDMA11819
WCDMA2WCDMA3
20
BS176
BS2
GND12
27GND10GND11
2829
GND12GND13
30
11GND2GND3
1221
GND4GND5
22
GND623
GND72425
GND8GND9
26
1HB_RF_IN
SKY77521
U101
17ANT
C13
922
p
22pC112
VBAT
C14
022
p
DN
IR
106
R111 0 100pL102
KMS-518
SW100
AC G1
G2
C13
2D
NI
DN
IC
126
10u
C10
7
22pC114
47p
C10
9
C13
022
p
DNIR108
R105 0
22p
C12
9
22pC125ANT
G1G2
0.01
uC
108
SW101UFL-R-SMT10
WRF_BAND_2
WRF_BAND_1
GRX_1800GRX_1900
GTX_VAM
ANTSW3
ANTSW2
ANTSW0
ANTSW1
GTX_1800_1900GTX_850_900
WRF_BAND_8_5
GRX_850GRX_900
TP3 TP4 TP5
- 125 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Step 2Check VBATI (TP3,TP4,TP5)
in GSM PAM Block
to Check if main powersource input or not
Check (TP1&TP3,TP4,TP5)
in Block
to check inner line connectionFrom TP1 to TP3,TP4,TP5
Check Point (TP1)
in Power Source Block
To Check Power source
3.7V OK?
Yes
No
Proceed to the Step 3
3.7V OK?No
Yes
Check the Power Supply
Short? No
Yes
Soldering Check Component(CN300)
In Power Source Block
Change Board
- 126 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16.3 Step 3
TP1
TP2
Main Board (bottom side)
- Power Source Block
TP4
TP5
TP3
Step 3 :WCDMA PAM Block
3.7V OK?Step 3
Check VBAT (TP3)
in WCDMA PAM Block Yes
No
See the Next Page
3.7V OK?No
Yes
Check the Power Supply
Short ?
No
Yes
Soldering Check Component(CN300)
In Power Source Block
Check Point (TP1)
in Power Source Block
To Check Power source
Change Board
Check (TP1 & TP3)
in Block ,to check inner line connectionFrom TP3 to TP1
- 127 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Main Board (Bottom side) : Power for Radio ASIC
4.16.4 Checking VCC
AB3100
TP1
TP2
2.8V OK?
No
Yes
1.8V OK?
Yes
No
Check the AB31000
Check the AB31000
Check PointVDIGRAD_1V8
(TP2)
Common Input Power is OKSee The Next Part
Check Point VRADA_2V8
(TP1)
to RF3300 digital
to All I/O Supplies and Memory
to RF3300 Power Detector
to AB3100 CODECs/ADC/PLL
VDDA_2V8
VDDH_2V75 VDDF_2V5
0R303
R304 0
R305 0
2.2uC303 C304
2.2u
VDDC_2V65
OA_OUTK13
OD OUTL12
G14
C12EXT_LDO
0R302
C3022.2u
VDDK_2V75
VDDD_2V65 VBAT
VDDG_2V85
VDDE_1V8 VDIGRAD_1V8
VBAT
EXT_LDO
VDDD_2V65
VDDA_2V8
VDDE_1V8
VDIGRAD_1V8
TP1
TP2
AB3100
- 128 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.17 Checking VCXO Block
The reference frequency (26MHz) from U111(Transceiver RF3300) is used
WCDMA TX part and BB part, Bluetooth part. Therefore, 3 test points in the following figure should be checked.
Phone
Oscilloscope
Notebook to send TP command
Connection for Checking VCXO Block
Main board : bottom side
U111
Transceiver
U201
Digital Base Band
X100
CrystalDB3200RF3300
Main board : Top side
- 129 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check 1. Crystal and RF3300 (Transceiver) part
If you already check this crystal part, you can skip check 1
Test Point (Crystal Part)
Schematic (Crystal Part)
Figure 4-15. 26MHz at TP1
TP1
WTXIN2423
WTXLP
WTXQN2625
WTXQP
XON1718
XOP
MCLKSEC20
STR10
13TESTOUT
VCCD21
D9
MCLK15
CLK12
14CLKREQ
11DATA
DN
IR
148
R15
0D
NI
2 GND1
GND24
1HOT1
HOT23
26MHzTN4-26562
X100
R14
9D
NI
0R144MCLK
RF_CTRL_CLK
RF_CTRL_DATA
RF_CTRL_STR_1
TESTOUTMCLKREQ
TP1
RF3300
- 130 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Check 3. 26MHz at BB part
Figure 4-19. Schematic (26MHz at BB Part)
Figure 4-20. 26MHz at TP1
Figure 4-18. Test point (26MHz at BB part)
Test Point (Crystal Part)
Test Point (Crystal Part)
MCLK
TP1
WTXIN2423
WTXLP
WTXQN2625
WTXQP
XON1718
XOP
MCLKSEC20
STR10
13TESTOUT
VCCD21
ND
9
MCLK15
CLK12
14CLKREQ
11DATA
DN
IR
148
R15
0D
NI
2 GND1
GND24
1HOT1
HOT23
26MHzTN4-26562
X100
R14
9D
NI
0R144MCLK
RF_CTRL_CLK
RF_CTRL_DATA
RF_CTRL_STR_1
TESTOUTMCLKREQ
R200 3.3K
RTCCLKINA15
SYSCLK0A18A17
SYSCLK1SYSCLK2
A19
B18SYSCLKREQN
E17MCLK
MCLKREQB17
MSACCIRQNC19
MSAPPIRQNC20
BT_CLKREQ_n
MCLK
SYSCLK0SYSCLK1
USB_XTAL1
RTCCLK
ACC_IRQ_nAPP_IRQ_n
MCLKREQ
TP1
DB3200RF3300
- 131 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Check TP1 No
Refer to Figure 4-15
Yes
VCXO part has a problem.Changing XTAL or U111
Checking 1, 326MHz at VCXO
VCXO part is O.K.
Check next stage
- 132 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.18 Checking Front End Module Block
Figure 4-21. Front End Module Block
<Top>
Antenna Switch Module
(+ GSM/EDGE PA)
TP1
TP2
TP3
TP4
0R1140R115
0R112
_TXEN8
LB_RF_IN3 9
MODE
BS176
BS2
1HB_RF_IN
SKY77521
17ANT
C13
922
p
C14
022
p
R111 0
C13
022
p
22p
C12
9
ANTSW3
ANTSW2
ANTSW0
ANTSW1
GTX_1800_1900GTX_850_900
TP2TP1
TP3
TP4
- 133 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.19 Checking Front End Module Block input logic
4.19.1 Mode Logic by TP Command
GSM850/EGSM Tx
ANTSW3
ANTSW1
ANTSW0/2
WCDMA 2100
DCS/PCS Tx
DCS Rx PCS Rx
ANTSW0/1
ANTSW2
ANTSW3
ANTSW0
ANTSW2
ANTSW3
EGSM Rx
ANTSW0
ANTSW2
ANTSW3
GSM850 Rx
WCDMA 900
- 134 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Table 4-1. Front End module Logic
- 135 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.19.2 Checking Switch Block power source
※ Before Checking this part, must check common power source (through AB3100) part
TP Command
MODE=3
SWRX=190,3
Open?
High? OK? Resoldering
Check each modeBy TP command
Change the Board
No
No No
Yes
Yes Yes
Check soldering(C106)
Check Soldering
It is necessary to check short condition.
Using Tester. Check 3 capacitors
ANTSW0(TP2),ANTSW1(TP3)
ANTSW2(TP4)
Check ANTSW0(TP2)
To check Switch input power source
- 136 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
A. GSM850 Rx mode
GSM850 Rx
MODE=3
SWRX=190,3
GSM850 RxLogic OK?
See the Next mode(EGSM Rx Mode)
Change the Board
No No
Yes Yes
Figure 4-22-1. GSM850 Rx Mode
Try 4.17 part4.17 part Check
OK?
ANTSW0
ANTSW2
ANTSW3Low
High
Low
- 137 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
B. EGSM Rx mode
EGSM Rx
MODE=0
SWRX=49,3
EGSM RxLogic OK?
See the Next mode(GSM850/EGSM Tx Mode)
Change the Board
No No
Yes Yes
Figure 4-22-2. EGSM Rx Mode
Try 4.17 part4.17 part Check
OK?
ANTSW0
ANTSW2
ANTSW3 High
High
Low
- 138 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C. GSM850/EGSM Tx mode
GSM850/EGSM Tx
MODE=3
SWTX=190,64,7
GSM850/EGSM TxLogic OK?
See the Next mode(DCS Rx Mode)
No No
Yes Yes
Figure 4-23.GSM850/EGSM Tx Mode
Try 4.17 part4.17 part Check
OK?
ANTSW0/1:LowANTSW2:LowANTSW3:High
WON : Low
Change the Board
Change U101
ANTSW0/1
ANTSW2
ANTSW3
Low
High
Low
No
Yes
- 139 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
D. DCS Rx mode
DCS Rx
MODE=2
SWRX=699,3
DCS RxLogic OK?
See the Next mode(DCS Tx Mode)
Change the Board
No No
Yes Yes
Figure 4-24. DCS Rx Mode
Try 4.17 part4.17 part Check
OK?
ANTSW0
ANTSW2
ANTSW3Low
High
High
- 140 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
E. PCS Rx mode
PCS Rx
MODE=1
SWRX=661,3
PCS RxLogic OK?
See the Next mode(PCS Tx Mode)
Change the Board
No No
Yes Yes
Figure 4-25. PCS Rx Mode
Try 4.17 part4.17 part Check
OK?
ANTSW0
ANTSW2
ANTSW3High
High
High
- 141 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
F. DCS / PCS Tx mode
DCS / PCS Tx
MODE=2
SWTX=1,699,0
Figure 4-26. DCS / PCS Tx Mode
DCS TxLogic OK?
WCDMA1900 Mode Change the Board
No No
Yes Yes
Try 4.17 part4.17 part Check
OK?
ANTSW0/1
ANTSW2
ANTSW3
High
High
Low
- 142 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
G. WCDMA 2100 mode
WCDMA2100 Mode
MODE=4
WTXC=10700,1,890,903,542,557
Figure 4-27-1. WCDMA2100 Mode
WCDMA2100Logic OK?
Change the Board
No No
Yes Yes
Try 4.17 part4.17 part Check
OK?
ANTSW3
ANTSW1
ANTSW0/2
Low
High
Low
WCDMA900 Mode
- 143 -Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
4. TROUBLE SHOOTING
H. WCDMA 900 mode
WCDMA900 Mode
MODE=11
WTXC=3012,1,890,903,542,557
Figure 4-27-2. WCDMA900 Mode
WCDMA900Logic OK?
Input Signal and Power toFront End Module block is OK.
See the Next Page
Change the Board
No No
Yes Yes
Try 4.17 part4.17 part Check
OK?
ANTSW3
ANTSW1
ANTSW0/2
Low
High
Low
- 144 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.20 Checking WCDMA Block
start
1. CheckVCXO Block
4. CheckRF TX Level
3. CheckControl Signal
Re-download SW, Cal
2. CheckFront End Module
6. CheckRF RX Level
5. CheckPAM Block
①
②
③
⑤
⑥
④
- 145 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.20.1 Checking VCXO Block
Refer to 4.17
4.20.2 Checking Ant. SW module
Refer to 4.18
4.20.3 Checking Control Signal
First of all, control signal should be checked. (data, clk, strobe)
Figure 4-28-1. Test points (Control Signal)
Bottom View
TP3 [RF_CTRL_CLK]
TP2 [RF_CTRL_DATA]
TP1 [RF_CTRL_STR1]
- 146 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
RF3300
Phone
Oscilloscope
Notebook to send TP command
Figure 4-29. Connection for Checking Control Signal
Figure 4-28-2. Schematic (Control Signal)
TP1 [RF_CTRL_STR1]
TP2 [RF_CTRL_DATA]
TP3 [RF_CTRL_CLK]
STR10
CLK12
11DATA
8EDATAAEDATAB
9
EDATAC6
EDATASTR7
U1RF3
R14
1D
NI
RF_CTRL_CLK
RF_CTRL_DATA
RF_CTRL_STR_1
- 147 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Similar ?
Control Signal is O.K.
Check next stage
Download the SW
Check TP1, TP2, TP3. Check shape and pk-pk level Refer to Figure 4-30
Yes
No
If signal is not OK even after downloading, Change the U201
Figure 4-30. Control Signal
TP Command
MODE=4
WTXC=9750, 1,754,643,418,568
SYCT=9750
TP1 (RF_CTRL_STR1)
TP2 (RF_CTRL_DATA)
TP3 (RF_CTRL_CLK)
TP1 (RF_CTRL_STR1)
TP2 (RF_CTRL_DATA)
TP3 (RF_CTRL_CLK)
- 148 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.20.4 Checking RF TX Level
Figure 4-31. Test point (RF TX Level)
TP1
[WBAND 8
PAM Input]
TP2
[WBAND 1
PAM Input]
TP4
[RF3300 Output
BAND 1]
TP3
[RF3300 Output
BAND 8]
TP5
FEM Output
TP6
Ant. SW
TP7
Ant.
<Top side>
<Bottom side>
- 149 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
NCEIVER
0R162
R16
8D
NI
R166 0
WTXHB129
WTXHB233
WTXHB331
35WTXLB
57PGND
GN
D15
34G
ND
16
0
R151
DN
IC
191 OUT
FL107SAFEA1G88KB7F00
G1
2
G2
5
G33
IN1 4
DN
IC
187
DN
IR
158
DN
IR
164
0
R161
5
G33
IN1 4
OUT
G1
3
G2 G3
5
1IN OUT
4
FL106SAFEB1G95KA0F00
G1
2
G2
SAFEB897MAM0F00FL105
2
DN
IC
185
DN
IR
155
R165
0
0R152
WTX_BAND_2_TO_PA
WTX_BAND_1_TO_PA
WTX_BAND_8_5_TO_PA
_TXEN8
9MODE
RSVD10
521
17ANT
100pL102
KMS-518
SW100
AC G1
G2
C13
2D
NI
DN
IC
126
DNIR108
22pC125ANT
G1G2
SW101UFL-R-SMT10
TP3
[RF3300 Output
BAND 8]
TP1
[WBAND 8
PAM Input]
TP2
[WBAND 1
PAM Input]
TP4
[RF3300 Output
BAND 1]
TP6
Ant. SW
TP7
Ant.
TP5
FEM Output
- 150 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Phone
Spectrum Analyzer
Notebook to send TP command
Fig. 4-32 Connection for Checking RF TX Level
Fig. 4-33-2 Output Level at RF3300 Output
( TP3&TP4)
Fig. 4-33-1 Output Level at PAM Input
( TP1&TP2)
- 151 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Fig. 4-33-5 Output Level at TP7 .Ant
Fig. 4-33-4 Output Level at RF test connector
( TP6)
Fig. 4-33-3 Output Level at FEM Output
(TP5)
- 152 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
To verify that the phone fulfils requirements on maximum output power.
TP6
About 22~23dBm?RF TX Level is OKCheck next stage
Check output power at the TP6 with antenna Cable.
Refer to Figure 4-33-4
No
Yes
Set the FDD Test of the Agilent 8960Set the Maximum Power
Yes
The SW100 has any problem.
Change the SW100
TP5
About 15dBm?
Check the power at the TP5 with probe. Refer to Figure 4-33-3
No
Yes
The L102 will be broken.Change the L102
TP7
About 19dBm?
Check the power at the TP7.Ant with probe. Refer to Figure 4-33-5
No
Yes
The U102 has any problem.You have to check PAM block.
TP1&TP2About -6dBm?
Check the power at
the TP1/TP2 with probe. Refer to Figure 4-33-1
The U111 will be not operated.Change the board
No
TP Command
MODE=4
WTXC=9750, 1,754,643,418,568
SYCT=9750
TFTI=9750
- 153 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
WCDMA band1
PAM
VCC_PA
(C103, C155)
from DC/DC
WPAM
input
(R162, R152)
Duplexer Output
(L601, C152)
4.20.5 Checking PAM Block
Figure 4-34. Test points of WCDMA TX PAM block
Bias_CTRL
(C115, C157)
DC/DC
converter
WCDMA band8
PAM
- 154 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Yes
No
TP Command
-mode =5
- WTXC=9750, 1,754,643,418,568
22dBm ?
Check Duplex output(L601, C152)
To Check PAMoutput
WCDMA PAM is OKSee the Next page
Level
< -10dBm?
NoDownload the SW
& Calibrate
Level
>2dBmCheck R162, R152To Check PAM Input level
Check the WCDMA RF Tx Chip (RF3300)
Yes
Yes
1.1V at
Po_max?
Check C115, C157To Check PAM control signal from AB3100 (Bias_CTRL)
Check the RF3300to WCDMA PAM Signal line
3.4V ?Check C103, C155To Check PAM VCC BIASfrom DC/DC converter(VCC_WPA)
No
No
No
Change the DC/DC
Yes
Yes
Change The PAM
- 155 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.20.6 Checking RX I,Q
To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q.
Feed a CW signal at 2142MHz with a power level of –60dBm.
Figure 4-36-1. RX I,Q signal (CW:2142MHz)
Figure 4-35. RF3300, WCDMA Transceiver (Bottom)
About 2 MHz
Figure 4-36-2. RX I, Q signal
WRX_Q_P (PIN 2)
WRX_Q_N (PIN 1)
WRX_I_N (PIN 3)
WRX_I_P (PIN 4)
WRX_I_P (PIN 4)
WRX_I_N (PIN 3)
WRX_Q_P(PIN 2)
WRX_Q_N(
PIN 1)
- 156 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
About 130mVp-p? Change RF3300 (U111)
Check the pk-pk level at PIN 1, PIN 2, PIN 3, PIN 4With Oscilloscope.
Refer to Figure 4-36-1
Yes
No
Set the CW Mode of the Agillent 8960
Feed a CW signal at 1950MHzSet the RX Continuous mode
Check the Mean level at PIN 1, PIN 2, PIN 3, PIN 4With Oscilloscope.
Refer to Figure 4-36-1
Yes
No
Check the frequency at PIN 1, PIN 2, PIN 3, PIN 4With Oscilloscope.Refer to Figure 4-36-2
Yes
No
Verify whether the signal
was similar as Figure4-36-2 with Oscilloscope.
Yes
No
About 160mV?
About 2MHz?
Similar?
Check Next Stage
Change RF3300 (U111)
Change RF3300 (U111)
Change RF3300 (U111)
TP Command
MODE=4
WRXC=9750
- 157 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.21 Checking GSM Block
start
2. CheckVCXO Block
5. CheckRF TX Path
4. CheckControl Signal
Re-download SW, Cal
3. CheckFEM Module
6. CheckRF RX Path
1. CheckVRAD_2V8
Figure 4-37-1. GSM Block (Bottom)
③
⑥⑤
④
②①
- 158 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.21.1 Checking Regulator Circuit Refer to 4.16 Checking Power Source block
IF you already check this point while checking power source block (4.15), You can skip this test.
4.21.2 Checking VCXO Block Refer to 4.17 Checking VCXO block
IF you already check this point while checking VCXO block (4.17), You can skip this test.
4.21.3 Checking Front End Module Refer to 4.19.2 Checking Ant. SW Module
IF you already check this point while checking Ant. SW module (4.19.2), You can skip this test.
- 159 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.21.4 Checking Control Signal
Test Program Script
MODE=3
SWTX=190,7,1024,1
STRBSTRB
CLKCLK
DATADATA
Figure 4-39. GSM RF Control signal
Figure 4-38. Test points of RF control signals
RF_CTRL_STRB (PIN10)
RF_CTRL_CLK (PIN12)
RF_CTRL_DATA(PIN11)
GSM
PAM
RF3300
- 160 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Similar?
Check PIN10,PIN11,PIN12 of RF3300.
Check if there is any Major difference.
Refer to Figure 4-39
Yes
NoRe-download SWShort?
Yes
No
Change the board
Control signal is OK.See next page to check
- 161 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.21.5 Checking RF Tx Path
A. GSM Tx path Level
③
①
②
③′
GSM
/ED
GE
PA +
Ant
Sw
.
ANT
VA
PC
RA
DC
LK
RA
DD
AT
RA
DS
TR
VB
AT
2.75
VV
RA
D
1.8
VVI
O
PA
PA
GS
M85
0/90
0 In
put
DC
S/P
CS
Inpu
t
ES
D
2.75
VV
RA
D
LNA
LNA
LNA
LNA
LNA
AD
AD
0 90
LPF
+C
hPP
hD÷ N.M
VCO
LPF
ChP
PhD ÷ N.M
+0 90
+DA
C
DA
C
XO
DA
C
VCO
VCO
LNA
LNA
WC
DM
A L
B
WC
DM
A H
B
WC
DM
A H
B
WC
DM
A H
B
CLK
DA
TA
STR
OB
ES
eria
lC
ontro
l
WTx
QB
WTx
QA
WTx
IB
WTx
IA
GS
M/E
DG
E
AM
DA
C
RFC
trl1
RFC
trl2
RFC
trl1
RFC
trl2
GS
M/
ED
GE
HB
GS
M/
ED
GE
LB
WC
DM
A L
B
WC
DM
AH
B
WC
DM
A H
B
GS
M/E
DG
ELBG
SM
/ED
GE
LBGS
M/E
DG
EH
B
GS
M/E
DG
EH
BW
RxI
A
WR
xIB
WR
xQB
WR
xQA
EDat
aA
EDat
aB
ED
ataC
ED
ataS
tr
WC
DM
A/G
SM/G
PRS/
EDG
E TR
X
MC
LK
CLK
REQ
MC
LKS
ec
XO
XO
n
XO
p
26M
Hz
X-ta
l
VB
AT
Vcc
WP
A
Vcc
WP
A
Pow
erco
uple
r
Pow
erco
uple
r
Vcc
WP
A
Vcc
WP
A
RF
Pow
det
Det E
n
Bias
DE
TEn
Bias
DE
TE
n
Bias
DE
TE
n
UL:
192
0 –
1980
MH
zD
L: 2
110
–21
70 M
Hz
UL:
174
9.9
–17
84.9
MH
zD
L: 1
844.
9–
1879
.9 M
Hz
UL:
830
–84
0M
Hz
DL:
875
–88
5M
Hz
824
–91
5 M
Hz
1710
–19
10M
Hz
1930
–19
90M
Hz
1805
–18
80M
Hz
925
–96
0 M
Hz
869
–89
4 M
Hz
WD
CD
CR
EF
WP
OW
_DET
_EN
FB
Sw
itch
PWM
/PFM
En
Con
trol
Logi
c
RFC
trl1
③
①
②
③′
③
①
②
③′③
①
②
③′③
①
②
③′
- 162 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
Figure 4-41. Test Points of GSM850/EGSM/DCS/PCS Tx Path
③③′
①
(Bottom)
②PIN 6,7,8,9
(Top)
- 163 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
B. GSM Tx Output Level Check
Check GSM850/EGSM/DCS/PCS output power at ①.
Check if there is any Major difference.
Refer to Figure 4-42.
GSM850>32dBm
EGSM>32dBm
DCS>29dBm
PCS>29dBm
NoSee Next page to check Tx pathSimilar?
Yes
GSM850/EGSM/DCS/PCS Tx path OK. See Chapter 4.8.6 to check Rx path
v Agilent 8960 Setting: GSM BCH+TCH Mode
v Oscilloscope Setting
3. DCS TxMODE=2SWTX=699,0,1024,1
Test Program Script
1. GSM850 TxMODE=3SWTX=190,64,5,1024,1
4. PCS TxMODE=1SWTX=661,0,1024,1
Figure 4-42. GSM850/EGSM/DCS/PCS Tx Level at ①
2. EGSM TxMODE=0SWTX=49,5,1024,1
- 164 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
C. GSM RF Transceiver Check
GSM850/EGSM/DCS/PCS>5dBm
See Next page to check Tx path
Check GSM RF Transceiver Output power at ①.
No
Yes
Redownload SW
Figure 4-43. GSM850/EGSM/DCS/PCS Transceiver (RF3300)
RF3300
(U111)
Vapc(PIN 52)
DCS/PCS Tx(R129)
①`
GSM Tx(R134)
①
- 165 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
D. GSM PAM Check
GSM850/EGSM:32.0dBmDCS/PCS: 30.0dBm
Yes
Changing GSM PAM(U100)
Check GSM850/EGSM/DCS/PCS PAM output power at C111.
GSM Tx path OK. See Next page to check
Check Vapc level.
Check if there is any Major difference.
Refer to Figure 4-44-1
Yes
NoRedownload SW, CalGSM850/EGSM>1.5 V?
No
Figure 4-44-1. Test points of GSM850/EGSM/DCS/PCS Tx
DCS/PCS>1.3 V?
GSM/EDGE
PAM
(+Ant. SW)
U101
GSM850/EGSM/DCS/PCS Tx
(C125)
Vapc(PIN 52)
(Bottom)
(Top)
- 166 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.21.6 Checking RF Rx Path
A. GSM Rx path Level
①
②
②
Figure 4-45. GSM/DCS/PCS Rx Path Level
①
②
②
GSM
/ED
GE
PA +
Ant
Sw
.
ANT
VA
PC
RA
DC
LK
RA
DD
AT
RA
DS
TR
VB
AT
2.75
VV
RA
D
1.8
VVI
O
PA
PA
GS
M85
0/90
0 In
put
DC
S/P
CS
Inpu
t
ES
D
2.75
VV
RA
D
LNA
LNA
LNA
LNA
LNA
AD
AD
0 90
LPF
+C
hPP
hD÷ N.M
VCO
LPF
ChP
PhD ÷ N.M
+0 90
+DA
C
DA
C
XO
DA
C
VCO
VCO
LNA
LNA
WC
DM
A L
B
WC
DM
A H
B
WC
DM
A H
B
WC
DM
A H
B
CLK
DA
TA
STR
OB
ES
eria
lC
ontro
l
WTx
QB
WTx
QA
WTx
IB
WTx
IA
GS
M/E
DG
E
AM
DA
C
RFC
trl1
RFC
trl2
RFC
trl1
RFC
trl2
GS
M/
ED
GE
HB
GS
M/
ED
GE
LB
WC
DM
A L
B
WC
DM
AH
B
WC
DM
A H
B
GS
M/E
DG
ELBG
SM
/ED
GE
LBGS
M/E
DG
EH
B
GS
M/E
DG
EH
BW
RxI
A
WR
xIB
WR
xQB
WR
xQA
EDat
aA
EDat
aB
ED
ataC
ED
ataS
tr
WC
DM
A/G
SM/G
PRS/
EDG
E TR
X
MC
LK
CLK
REQ
MC
LKS
ec
XO
XO
n
XO
p
26M
Hz
X-ta
l
VB
AT
Vcc
WP
A
Vcc
WP
A
Pow
erco
uple
r
Pow
erco
uple
r
Vcc
WP
A
Vcc
WP
A
RF
Pow
det
Det E
n
Bias
DE
TEn
Bias
DE
TE
n
Bias
DE
TE
n
UL:
192
0 –
1980
MH
zD
L: 2
110
–21
70 M
Hz
UL:
174
9.9
–17
84.9
MH
zD
L: 1
844.
9–
1879
.9 M
Hz
UL:
830
–84
0M
Hz
DL:
875
–88
5M
Hz
824
–91
5 M
Hz
1710
–19
10M
Hz
1930
–19
90M
Hz
1805
–18
80M
Hz
925
–96
0 M
Hz
869
–89
4 M
Hz
WD
CD
CR
EF
WP
OW
_DET
_EN
FB
Sw
itch
PWM
/PFM
En
Con
trol
Logi
c
RFC
trl1
①
②
GSM850 : -50dBm
EGSM : -50dBm
DCS : -50dBm
PCS : -50dBM
②
①
②
GSM850/EGSM : -51.5dBm
②
①
②
DCS/PCS : -51.7dBm
②
①
②
②
①
②
②
①
②
②`
- 167 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
2. DCS/PCS RxSWRX=2,700,0,1024,1 (DCS)SWRX=1,700,0,1024,1 (PCS)
Test Program Script
1. GSM850/EGSM RxSWRX=3,190,5,1024,1 (GSM850)SWRX=0,65,5,1024,1 (EGSM)
v Agilent 8960 SettingCW ModeGSM850 : -50dBm@Ch190(881.6MHz)EGSM : -50dBm@Ch65(948MHz)DCS : -50dBm@Ch700(1842.8MHz)PCS : -50dBm@ch700(1967.8MHz)
v Oscilloscope Setting
Figure 4-46. Test Points of GSM/DCS/PCS Rx
GSM Transceiver
RF3300
U111
GSM/EDGE
PAM
U101
②DCS
Rx
PCS
Rx
EGSM
Rx
GSM8
50 Rx
①
(Bottom)
(Top)
- 168 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
B. GSM RF Level Check
GSM Rx path OK.
Check GSM850/EGSM/DCS/PCS Rx signal level at ②.
Yes
GSM850/EGSM:-51.5dBmDCS/PCS:-51.7dBm
Change Ant. SW module(U101)
No
Figure 4-47. GSM850/EGSM/DCS/PCS Rx path
v Agilent 8960 SettingCW ModeGSM850 : -50dBm@Ch190(881.6MHz)EGSM : -50dBm@Ch65(948MHz)DCS : -50dBm@Ch700(1842.8MHz)PCS : -50dBm@ch700(1967.8MHz)
GSM Transceiver
RF3300
U111
GSM/EDGE
PAM
U101
②DCS
Rx
PCS
Rx
EGSM
Rx
GSM8
50 Rx
①
(Bottom)
(Top)
- 169 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. Download
5. Download
The downloading purpose is described below:
1) To make a phone operate at the first manufacturingA phone = Hardware + SoftwareA phone cannot operate with hardware alone.
The hardware with the suitable software can operate properly.2) To upgrade the software of the phone
The software of the phone may be changed to enhance the performance of the phone.The older version software of the phone can be replaced to the newer version.
5.1 Requirements
5.1.1 Download ItemsItems needed to download SW images with LGEDP.
A. Micro-USB Cable
B. Target( GT500 / GT505 Phone )
C. PC and LGEDP Software
D. SW Images
5.1.2 System RequirementThe table below shows the requirements for setting up.
You should check the requirements below first to set up your PC.
USB Driver cannot support Windows 98, Windows Me, and Windows XP Service
Pack 1. Although it can do, it cannot be guaranteed. So, highly recommend OS
upgrade.
5.1.3 Required ToolLGEDP : Download tool for GT500 / GT505 software
BBAA
- 170 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Download
5.2 GT500 / GT505 DownloadInstall LGEDP USB Driver in the following order.
1) Go to the directory = ../LGEDP_U330_SVC_EURO_YYYYMMDD/wrapper_USBDriver
2) Click “installme.bat”
5.2.1. USB Driver Install* Please make sure that install this usb driver for download not for a pc sync driver.
There are two different type of usb driver. One for downloading , the other for PC sync.
If you use LGEDP Tool firstly, Error will happen because of USB Driver uninstalled.
If you see “Found New Hardware” when phone is connect after complete install,
and then follow as indicated blew.
when connect the phone, must be check that phone should be turn off and
battery should be full-gauge (At lease three(75%) more).
The installation procedure of LGEDP USB Driver is described below:
1) Push “the Next Button” in Found New Hardware Wizard
- 171 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. Download
2) Select “Search for the best driver in these locations” in Found New Hardware Wizard
3) Select “Include this location in the search” in Found New Hardware Wizard
4) Push “the Browse Button” , and then select “USB driver Information file”
This File is provided with LGEDP.
- 172 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Download
5) Select “Mobile Equipment USB Flash” in Found New Hardware Wizard
6) Continue Anyway
You must be select this..!
- 173 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. Download
7) Please wait while the wizard installs the software..
8) Push “the Finish Button” in Found New Hardware Wizard
- 174 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Download
6
5.2.2 Download Menu Selection.Download Menu Selection in the following order:
1) Click “Configuration” – “download” in Menu bar.
- 175 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. Download
5.2.3 LGEDP Configuration & SW & GDFS Image Selection.The installation procedure of Download Configuration is described below:
1) You must select “Window Size” 1 ~ 4. ( Defualt is 4 )
2) You must select “Chipset” U330 for GT500 / GT505.3) You can select SW image to download by clicking “Add…” button.
Select next two image files orderly. Order is important.
Main image : “cxc000000_APPLICATION_PHONE_SB_IAR-ARM-NAND.ssw”,
FileSystem image : “CXC_FS_CABS_LP_NAND.ssw”LGPXO image : “CXC_LGPXO_SYS_CABS_LP_NAND.ssw”
4) You can select GDFS map to download by clicking “Add…” button.
Select next two GDFS files.
Acc GDFS : “GT500 / GT505_Update_GDFS_Acc_XXXXXXXX.gdf”,App GDFS : “GT500 / GT505_Update_GDFS_App_XXXXXXXX.gdf”.
5) After choose all image to download, click “OK” button.
3)3)
4)4)
5)5)
1)1)
- 176 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Download
5.2.4 Starting DownloadFollow the procedure described below to start download.
You should follow the instruction below and be sure to follow in right order.
1) If you have not detached Battery from the phone yet, detach Battery from the phone.
2) Connect your phone with Micro-USB cable.
3) Insert the Battery into phone.
4) In case of GT500/GT505, press Side-Up-Key. Keep pressing until step 6.5) Press Power-Key. And then Downloading will be started.
6) Release both Side-Up-Key and Power-Key after start downloading in GT500
7) If Downloading has not started yet, Repeat procedure 1) ~ 6).
< Before phone is turned on >
- 177 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. Download
5. 2.5 Download is on going
< After phone is turned on >
- 178 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Block Diagram
6. Block Diagram
Figure 6-1 GT500 Block Diagram
- 179 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
D
5
E
12
A
E
G
C
D
G
107
9 10
4 5
F
7
Placement Notice:PGND must be isolated from Common GND on L1, L2 and L3
3
B
C
H
8
H
A
12
1 6 8 9
6
RF TRANCEIVER
DC-DC CONVERTER
EXTERNAL LDO
TEMP SENSOR
WCDMA PA Block
GSM PA WITH ASM
1 2
GT500 GND contact for ANT
B
4
closed to RF3300
11
3 11
F
2
0R162
C178
0R114
33p
0R115
R12
0
24
L100
18p
C12
2
R16
8D
NI
22p
R166 0
L120NA
C1581000p
0R112
NAC117
0.1u
VDDA_2V8
7GND4
8GND5
9GND6
1RX
TX3
C101
1OUT
4TER
FL100 SAYFP1G95AA0B00
ANT6
GND12
GND24
GND35
U103 LDC151G8620Q-359
COU3
IN2
R1283.9nH
3.6nHC124
22p
0
R156
C16
7
GND312
14GND4IN_BAND_2
2
6IN_BAND_5
13OUT_BAND_2
OUT_BAND_59
PGND15
10VBIAS
VC211
4VCC1
VCONT5
VEN_BAND_21
7VEN_BAND_5
SKY77175U105
3GND1
GND28
C13
8D
NI
4.3nH R125
C164 15p
WTXHB129
WTXHB233
WTXHB331
WTXIN24
35WTXLB
23WTXLP
WTXQN2625
WTXQP
XON1718
XOP
MCLKSEC20
57PGND
37RFCTRL1RFCTRL2
36
STR10
13TESTOUT
27VCCA1VCCA2
51
VCCD21
WRXHB138
WRXHB242
3WRXINWRXIP
4
WRXLB40
1WRXQNWRXQP
2
16G
ND
1019
GN
D11
GN
D12
22
GN
D13
28 30G
ND
1432
GN
D15
34G
ND
16
GN
D2
53
GN
D3
49
GN
D4
47 45G
ND
543
GN
D6
41G
ND
739
GN
D8
5G
ND
9
MCLK15
CLK12
14CLKREQ
11DATA
52EAMMOD
8EDATAAEDATAB
9
EDATAC6
EDATASTR7
48ERXHB1
50ERXHB2
ERXLB144
ERXLB246
56ETXHB
54ETXLB
GN
D1
55
U111RF3300
22p
DN
IC
151
C12
1
C1430.5p
0
R151
C1151000p 1000p
C116
DN
I
L108
C19
1
C133
3.3uH
DNI
L118 10nH
DN
IR
139
VRAD_2V8
1800FB100R124 390
33p
C16
0
R13
627
0
2.2nHL106
56
R11
7
33pC113
0.1uC154
GND3GND4GND5GND6
RX
TX
270
R13
1
ACMD-7407FL101
ANT
GND1GND2
DN
IR
148
OUT
10uC168
FL107SAFEA1G88KB7F00
G1
2
G2
5
G33
IN1 4
DA
P7
4ENGND
3
OUT6
5REF
2RF_IN
VDD1
U100 LMV221
DNI
R160
R15
0D
NI
U104
3COU
2IN
OUT1
TER4
100pC135
LDC151G8620Q-359
1000
pC
137
C1734.7u
C18
110
0p
8
VCONT3
VEN4
DN
I
R11
3
U107 SKY77181
GND15
GND26
PGND9
2RF_IN
7RF_OUT
VBIAS1
VCC
R12
1
56
GND2GND3GND4
GND5GND6
RX
TX
22pC175
LT56BFL102
ANT
GND1
NAL114
L105NA
NAL109
DN
IC
187
PT
100
C106
4.7K
C16
5D
NI
33nF
NAL112
DN
IC
189
0.1uC149
R13
227
0
DNI
R145
_TXEN8
27R134
LB_RF_IN3 9
MODE
PG
ND
131 32
PG
ND
2P
GN
D3
33 34P
GN
D4
RSVD10
RX11615
RX2RX3
1413
RX4
VAPC4
VBATT5
WCDMA11819
WCDMA2WCDMA3
20
BS176
BS2
GND12
27GND10GND11
2829
GND12GND13
30
11GND2GND3
1221
GND4GND5
22
GND623
GND72425
GND8GND9
26
1HB_RF_IN
SKY77521
U101
17ANT
VDIGRAD_1V8
C16
9D
NI
DN
IR
159
0 R133
C14
222
p C13
922
p
C1501000p
DN
IR
158
3.9pC159
1.8nH
VBAT
100pC146
L101
22pC112
DN
IR
164
VBAT
C14
022
p
C179
10nH
DN
IR
106
2 GND1
GND24
1HOT1
HOT23
VBAT
26MHzTN4-26562
X100
8.2nHL110
100p
VRAD_2V8
C145
L103
DN
I
R12
7
8.2nHDNIC156
C152
R111
6.8nH
2.7p
0
C17
0
R135
220
10nH
100pL102
L113
GND5GND610
IN_881_51
IN_942_54
OUT_881_59
6OUT_942_5
FL104
SAWEN881MBA0F25
GND12
GND27
3GND3
8GND4
5
C119 100p
KMS-518
SW100
AC G1
G2
R10
0
DN
I
1000pC102
R14
9D
NI
C118NA
1000pC174
DN
I
C13
2D
NI
C18
8
0.1u
C134 100p
C110
DN
IC
126
L1155.6nH
R143560
0R130
0.1u
FC
120
10u
C10
7
R103
120
22p
C16
3
VDDA_2V8
C147 22p
22p
VBAT
R129 27
C114
0.01
uC
162
1718
23456789
270
R13
7
SC1
1 10111213141516
C157
A23 GND
5VCC
Y4
1 _OE
1000p
SN74LVC1G125DRLR
U108
3.3pC177
0
R161
5
G33
IN1 4
OUT
0R144
G1
3
G2 G3
5
1IN OUT
4
FL106SAFEB1G95KA0F00
G1
2
G2
SAFEB897MAM0F00FL105
2
47p
C10
9
B1VDD
R116 DNI
U109 LM3208TL
ENC1
C3FB
PGNDA3
A1PVIN
SGNDB3
A2SW
VCONC2
R10
4
75
VBAT
C13
022
p
C10
522
p
10uC148
0R157
R11
80
R10
9
56
C183
VRAD_2V8
C1822.2u
DNI
1u
R108
RFIN6
RFOUT
4VBIAS VCC
5
VCTRL2
VENB1
10uC155
U102 SKY77182
7GND1
GND28
PGND9
3
R142 18p
L1043.3nH
C10
422
p1000pC153
R14
6
4.7K
GND12
GND27
3GND3
8GND4
5GND5GND6
10
IN_1842_51
IN_19604
OUT_1842_59
6OUT_1960
FL103
SAWEN1G84BC0F25
1K
R102
DN
IC
161
R14
1D
NI
DN
IC
185
DN
IR
155
2PG
ND
5
4VDD VOUT
1
R105 0
RP101K282D U110
CE3
GND
R165
0
1000
pC
141
C12
7
VRAD_2V8VDDA_2V8
L60
12.
2nH
3.3p
DN
I
C172
C10
30.
1uF
0R152
DN
IC
123
COU32
IN
OUT1
TER4
C16
60.
01u
U106 LDC15874M19Q-360
CN1981
R147
0
C17622p
R652
0
C10010u
DN
IR
138
C171
0.01u
R10
7
10
VBAT
560R123
39nH L116
22p
C12
9
1
22pC125
CN199
ANTG1G2
0.01
uC
108
SW101UFL-R-SMT10
1.5p
C12
8
0
R10
1
L1172.2nH
R140
C180
0
DNI
1.8pL119
C63
63.
3nH
DN
I
R15
3
R12
6
0
C11122p
NAL107
L111
C14
4
NA
22p
DN
IC
136
WRX_BAND_1WTX_BAND_2_EN
WTX_BAND_2_TO_PA
WRF_BAND_1
WRF_BAND_2
WRF_BAND_8_5
VCC_WPA
BIAS_CTRL
BIAS_CTRL
WTX_BAND_1_EN
WRX_BAND_1
WRX_BAND_2
WRX_BAND_8_5
TX_ADC_STRB_2V8
WTX_BAND_2_TO_PA
WTX_BAND_1_TO_PA
WPOW_DET_EN
WRF_BAND_2
WRF_BAND_1
WRX_BAND_8_5
WRX_BAND_2
WPOW_DET
GRX_1800GRX_1900
GTX_VAM
ANTSW3
ANTSW2
ANTSW0
ANTSW1
WTX_BAND_8_5_EN
WTX_BAND_8_5_TO_PA
BIAS_CTRL
GTX_1800_1900GTX_850_900
WRF_BAND_8_5
GRX_850GRX_900
VCC_WPA
DCDC_REF
VDDA_2V8
EXT_LDO
WTX_BAND_1_TO_PA
TX_ADC_STRB
MCLKSEC
WDCDC_EN
GRX_1800
GRX_850
GRX_900
GTX_1800_1900
GTX_850_900
MCLK
WTX_BAND_8_5_TO_PA
WTX_I_NWTX_I_P
WTX_Q_P
TX_ADC_STRB_2V8
GRX_1900
QDATA_AMP_MSBIDATA_FREQ_MSB
AMP_FREQ_LSBDATA_STR
WDCDC_EN
WRX_I_NWRX_I_P
WRX_Q_NWRX_Q_P
ADOUT
RTEMP
RF_CTRL_CLK
RF_CTRL_DATA
WTX_Q_N
RF_CTRL_STR_1
TESTOUTMCLKREQ
GTX_VAM
7. CIRCUIT DIAGRAM
- 180 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
GND
IN
OUT
9
7 96
H
I2C MAP
F
C
A
5
3
A
Added in the REV.D
2G v1.8 x8 NAND + 1G v1.8 x16 SDRAM(MCP)
10
E
12
1
C
5 8
DB3200 POWER
H
10
8
F
Service mode for WEB D/L
D
2
E
6
G
B
2
7
G
4 11
1 3 4
B
MCP 2G NAND 1G SDRAM
JTAG and ETM
12
11
D
C23
20.
1u
N4
B5VSS5
N5VSS6VSS7
N8
E2VSSQ1
J2VSSQ2
L2VSSQ3
_CASF7
_CEC6
E9_CS1_CS2
E8
E7_RAS
_REE5
D6_WE
F8_WED
_WPF5
NC
9
E6R__B
UDQMH3
VCC1B6N7
VCC2
VCCQN6
VDD1B4
VDD2G9
VDD3H2M2
VDD4
VDDQ1D2F2
VDDQ2K2
VDDQ3
C2VSS1VSS2
F9G2
VSS3VSS4
K6
NC
13K
7K
8N
C14
NC
15M
5M
6N
C16
NC
17M
7M
8N
C18
NC
19N
2
B7
NC
2
N9
NC
20
NC
3B
9F
3N
C4
NC
5J3
G4
NC
6G
5N
C7
NC
8G
6H
5
E3F4
DQ7J4
DQ8DQ9
K3
IO0J5
IO1L5J6
IO2L6
IO3IO4
J7
IO5L7J8
IO6L8
IO7
LDQMG3
NC
1B
2
NC
10H
6K
5N
C11
NC
12
N1
DN
U7
N10
P1
DN
U8
DN
U9
P2
B3DQ0
C4DQ1
K4DQ10DQ11
L3L4
DQ12DQ13
M3M4
DQ14N3
DQ15
DQ2C3D4
DQ3DQ4
D3E4
DQ5DQ6
H7H8
A9
ALED5
BA0D7D8
BA1
CKE1G8
CKE2F6
C5CLE
H4CLK
DN
U1
A2
P9
DN
U10
DN
U11
P10
DN
U2
A9
DN
U3
A10
B1
DN
U4
DN
U5
B10
DN
U6
KA100J00BA-AJYYU200
A0C7C8
A1
D9A10A11
H9
A12G7
A2C9B8
A3A4
M9
A5L9
A6K9
A7J9
A8
0.1u C227
0.1u
TP
221
C200
0.1u C224
3300
R20
9
R65
9D
NI
0.1u C239
RE
SIN
RT
CK
TC
K
TD
I
TD
O
TM
S
TR
ST
VC
C
C2370.1u
JTG
201
GN
D
PS
_HO
LD
C2310.1u
VDDE_1V8
VDDE_1V8
VDDF_2V5
R64
310
0K
0.1u
C23
3
R20
4
VDDE_1V8
TC
K
100K
R65
0D
NI
TM
U20
0
C212 33nF
VDDE_1V8
C23
40.
1u
0.1u C223
0.1uC207
0.1u C220
C2220.1u
R207 3300
R21
233
00
0.1u C218
KRC402E
Q200
B
C
E
R200 3.3K
C2061u
C2150.1u
J2USB_SE0_VM
B14
RF
_WC
DM
A_P
A_0
_EN
D14
RF
_WC
DM
A_P
A_1
_EN
RF
_WC
DM
A_P
WR
DE
T_E
C13
RTCCLKINA15
C2SCLK
B2SDAT
C18SERVICEN
SRSTNC4
SYSCLK0A18A17
SYSCLK1SYSCLK2
A19
B18SYSCLKREQN
TX
_AD
C_S
TR
BD
15
B6
TX
_PO
W
USB_DAT_VPK2
USB_OEL3
PD
I_D
6N
22
PD
I_D
7N
15
PD
I_R
ES
_NK
20
B10PWRRSTNRESOUT0N
J14B19
RESOUT1NE18
RESOUT2N
C16
RF
_CT
RL
_CL
KR
F_C
TR
L_D
AT
AC
17
D16
RF
_CT
RL
_ST
RB
1R
F_C
TR
L_S
TR
B2
C14
RF
_DA
TA
_AB
15B
16R
F_D
AT
A_B
C15
RF
_DA
TA
_C
A16
RF
_DA
TA
_ST
RB
B13
RF
_WC
DM
A_D
CD
C_E
N
E2PCMCLK
D3PCMDLD
PCMSYNE3
PCMULDD2
K23
PD
I_C
0P
DI_
C1
J16
PD
I_C
2K
22
PD
I_C
3K
16L
22P
DI_
C4
L21
PD
I_C
5P
DI_
D0
L23
L20
PD
I_D
1P
DI_
D2
M22 J20
PD
I_D
3M
23P
DI_
D4
K15
PD
I_D
5
J10
KE
YO
UT
1K
EY
OU
T2
K9
L9
KE
YO
UT
3J1
1K
EY
OU
T4
MC
CL
KT
22N
20M
CC
MD
P23
MC
CM
DD
IR
MC
DA
T0
R22
N21
MC
DA
T1
MC
DA
T2
P22
M21
MC
DA
T3
M20
MC
DA
TA
DIR
E17MCLK
MCLKREQB17
MSACCIRQNC19
MSAPPIRQNC20
D20
I2C
SD
A2
I2S0CLKG22
I2S0DLDF21G20
I2S0ULD
F22I2S0WS
G21I2S1CLK
I2S1DLDE22
I2S1ULDG19
I2S1WSE21
KE
YIN
0C
22D
22K
EY
IN1
D21
KE
YIN
2K
EY
IN3
F20
E20
KE
YIN
4F
19K
EY
IN5
KE
YO
UT
0J1
3
Y18EMIF2_D14EMIF2_D15
Y19
EMIF2_FBCLKT10
EMIF2_NFIF_READYY10
EMIF2_SDBS0_A14AA18AB19
EMIF2_SDBS1_A15
AC10EMIF2_SDCAS_RE_OEN
Y12EMIF2_SDCKEN0
AC9EMIF2_SDCKEN1
EMIF2_SDCLKY11
EMIF2_SDRAS_ADVNAC11
AB8EMIF2_WAITN
AB10EMIF2_WEN
I2C
SC
LB
20
B21
I2C
SC
L2
D19
I2C
SD
A
EMIF2_CS2NAC8AB9
EMIF2_CS3N
Y13EMIF2_D00EMIF2_D01
Y14T11
EMIF2_D02EMIF2_D03
AA12
EMIF2_D04AA13AA14
EMIF2_D05Y15
EMIF2_D06EMIF2_D07
AA16AA17
EMIF2_D08EMIF2_D09
Y16W17
EMIF2_D10EMIF2_D11
W18
EMIF2_D12Y17
EMIF2_D13Y20
EMIF2_A16AC19
AA20EMIF2_A19EMIF2_A20
AB21Y21
EMIF2_A21AA21
EMIF2_A22AB22
EMIF2_A23AA22
EMIF2_A24Y22
EMIF2_A25
EMIF2_ALE_A18AB20
EMIF2_BE0NAB12AB11
EMIF2_BE1N
EMIF2_CLE_A17AA19
AA10EMIF2_CLK
EMIF2_CRE_A26V21
EMIF2_CS0NAA7
EMIF2_CS1NAA9
EMIF1_SDCSNY2
EMIF1_SDRASNV2
EMIF1_WENW2
EMIF2_A01AC12AA11
EMIF2_A02EMIF2_A03
AB13
EMIF2_A04AC14
EMIF2_A05AB14AB15
EMIF2_A06EMIF2_A07
AA15AB16
EMIF2_A08EMIF2_A09
AC16AC17
EMIF2_A10EMIF2_A11
AB17
EMIF2_A12AB18AC18
EMIF2_A13
U5EMIF1_D13EMIF1_D14
U4
EMIF1_D15U3
EMIF1_D2L4K4
EMIF1_D3EMIF1_D4
M3
EMIF1_D5M4
EMIF1_D6P4P3
EMIF1_D7EMIF1_D8
R4N8
EMIF1_D9
EMIF1_SDBS0_A14U1V1
EMIF1_SDBS1_A15
Y3EMIF1_SDCASNEMIF1_SDCKEN
V4W3
EMIF1_SDCLK
U2EMIF1_A13
L2EMIF1_A2EMIF1_A3
M2
EMIF1_A4M1
EMIF1_A5N1N2
EMIF1_A6EMIF1_A7
P1
EMIF1_A8P2
EMIF1_A9R3
EMIF1_BE0NW1V3
EMIF1_BE1N
EMIF1_D0H4J4
EMIF1_D1
EMIF1_D10P8R8
EMIF1_D11EMIF1_D12
T4
W23
CI_
D7_
CL
K1_
PC
I_D
8_D
AT
1_M
W22
CI_
D9_
DA
T1_
PV
22
U23
CI_
HS
YN
C
U21
CI_
PC
LK
CI_
RE
S_N
T21
R20
CI_
VS
YN
C
DA
C_I
_NE
GE
7D
7D
AC
_I_P
OS
E6
DA
C_Q
_NE
GD
AC
_Q_P
OS
D6
C21DCON
EMIF1_A1L1
R2EMIF1_A10EMIF1_A11
T2T3
EMIF1_A12
APP_GPIO_24R23P20
APP_GPIO_25
H22APP_GPIO_3
J22APP_GPIO_4APP_GPIO_5
J21H23
APP_GPIO_6K21
APP_GPIO_7L16
APP_GPIO_8APP_GPIO_9
J23
U19
CI_
D0
CI_
D1
V19
V20
CI_
D2_
CL
K0_
MC
I_D
3_C
LK
0_P
W20
CI_
D4_
DA
T0_
MU
20T
20C
I_D
5_D
AT
0_P
CI_
D6_
CL
K1_
MV
23
APP_GPIO_0H20
APP_GPIO_1G23
APP_GPIO_10P15
APP_GPIO_11P16B22
APP_GPIO_12APP_GPIO_13
R14
APP_GPIO_14N16
APP_GPIO_16R21R16
APP_GPIO_17APP_GPIO_18
U22T13
APP_GPIO_19
H21APP_GPIO_2
APP_GPIO_20T14T15
APP_GPIO_21APP_GPIO_22
T23P21
APP_GPIO_23
Y5ACC_GPIO_33_A27
ACC_GPIO_4K8F1
ACC_GPIO_5ACC_GPIO_6
J8G3
ACC_GPIO_7H3
ACC_GPIO_8ACC_GPIO_9
G2D
9A
DC
_I_N
EG
C9
AD
C_I
_PO
SA
DC
_Q_N
EG
C8
D8
AD
C_Q
_PO
S
AN
T_S
W0
H11
H13
AN
T_S
W1
H14
AN
T_S
W2
AN
T_S
W3
H15
APPSLEEPD18
G4ACC_GPIO_19
L8ACC_GPIO_2
C1ACC_GPIO_20
F4ACC_GPIO_21ACC_GPIO_22
F2
ACC_GPIO_23H2V5
ACC_GPIO_24AB3
ACC_GPIO_25ACC_GPIO_26
AA4Y4
ACC_GPIO_27ACC_GPIO_28
P9AC4
ACC_GPIO_29
G1ACC_GPIO_3
ACC_GPIO_30T9
AA5ACC_GPIO_31ACC_GPIO_32
R10
DB3200_A
U201-1
D17ACCSLEEP
J3ACC_GPIO_0ACC_GPIO_1
K3
ACC_GPIO_10H9E1
ACC_GPIO_11ACC_GPIO_12
H10D1
ACC_GPIO_13ACC_GPIO_14
F3D4
ACC_GPIO_15ACC_GPIO_16_USBPRB
C3G5
ACC_GPIO_17ACC_GPIO_18
E4
0.1u C214
R295
R29
9
DN
I
0
R296 DNI
R298
DNI
C2050.1u
R21
433
00
R208 3300
0.1u
TP209
DN
IR
647
C202
C2090.1u
0.1u
C23
5
C2080.1u
0.1u C216
0.1uC201
C2040.1u
0 R216
10K
R20
2
3300
R21
0
1000pC203
R62
0
0
R206 3300
3300
R21
1
VDDE_1V8
VDDE_1V8
0.1u C229
VSS_PLLA8
M8
VS
S6
VS
S7
R11
R13
VS
S8
VS
S9
W19
B9VSSA_AD
VSSA_ADDAA5E5
VSSA_ADDA_ESDVSSA_ADDA_REF
B7B5
VSSA_ADGPVSSA_DA
C5
VSSA_PLL_13_208B11C11
VSSA_PLL_26_208VSSA_PLL_26_60
D11
VSSA_PLL_32_13A11D10
VSSA_PLL_ESD
B3VSS_ADDA_ESD
F5
VS
S10
VS
S11
T12 W5
VS
S12
R12
VS
S13
VS
S14
R9
M9
VS
S15
VS
S16
W21
L15
VS
S17
VS
S18
E19
M16
VS
S19
VS
S2
J9
VS
S20
J12
VS
S21
H12
VS
S3
N9
J15
VS
S4
VS
S5
M15
B4VDDC_ADDA_ESDVDDC_IO
D13A7
VDDC_PLL
VDDE1A3
E23VDDE10VDDE11
A20A13
VDDE12
H1VDDE2VDDE3
R1Y1
VDDE4AC5
VDDE5AC13
VDDE6VDDE7
AC20Y23
VDDE8VDDE9
F23
VS
S1
R15
VDDA_PLL_26_60D12A12
VDDA_PLL_32_13VDDA_PLL_ESD
C10
VDDC1J1
VDDC10C23A21
VDDC11VDDC12
A14A4
VDDC13
VDDC2K1T1
VDDC3AC3
VDDC4AC15
VDDC5VDDC6
AC21AA23
VDDC7VDDC8
N23D23
VDDC9
A9PLL_26_FILTVDD
PLL_26_VCONTA10
RT
CK
AA
1
TC
KA
A2
TD
IA
B4
AA
3T
DO
W4
TM
SA
B2
TR
ST
_N
VDDA_ADDAA6
VDDA_ADDA_ESDC7
VDDA_ADDA_REFB8
VDDA_ADGPC6
VD
DA
_AF
N4
D5VDDA_DA
C12VDDA_PLL_13_208VDDA_PLL_26_208
B12
EF
US
E_H
V4
N3
EM
U_M
OD
E_0
AC
1A
B1
EM
U_M
OD
E_1
ET
M_P
ST
AT
0A
B6
ET
M_P
ST
AT
1Y
7A
A6
ET
M_P
ST
AT
2
ET
M_T
CL
KA
B5
Y9
ET
M_T
PK
T0
ET
M_T
PK
T1
Y8
AB
7E
TM
_TP
KT
2A
A8
ET
M_T
PK
T3
AC
7E
TM
_TP
KT
4W
6E
TM
_TP
KT
5E
TM
_TP
KT
6A
C6
W7
ET
M_T
PK
T7
Y6
ET
M_T
SY
NC
DB3200_B
U201-2
AC
22D
U1
B23
DU
10A
C23
DU
2D
U3
B1
A1
DU
4D
U5
A2
A22
DU
6D
U7
A23
AB
23D
U8
DU
9A
C2
VD
DE
_1V
8
RB521CS-30D200
TP220
2.2K
R20
3
C2170.1u
VDDF_2V5
0.1u C226
R2150
1u C241
C2400.1u
0.1u C238
VCORE
0.1u
C21
0
C2130.1u
TC
KT
MU
201
C23
60.
1u
1uC
211
TP
222
3300R205
DNIR297
3
GND
1IN1
IN22
OUT4
VCC
5
DNI
R658
U202 NC7SZ08P5X
DN
IR
649
RB521CS-30D201
0
R63
9
C2190.1u
TP
223
0.1u
VDDE_1V8
C225
C2300.1u
R64
6D
NI
3300
R21
3
1uC
228
DNI
R657
R64
8D
NI
VDDE_1V8
VDDE_1V8
BT_CLKREQ_n
RESOUT2_n
SCLKSRST_n
SD_DATA(0) SD_ADDR(1)
0.1u C221
RT
CK
TC
K
TD
IT
MS
TC
K
RT
CK
TD
O
TD
IT
MS
TR
ST
_N
PW
RR
ST
_n
EM
U_M
OD
E_0
EM
U_M
OD
E_1
EM
U_M
OD
E_0
EM
U_M
OD
E_1
TD
O
TR
ST
_N
KE
YIN
3
MCLK
APP_GP_LCD_ID
WT
X_B
AN
D_2
_EN
APP_GP_TOUCH_LDO_ENAPP_GP_ISP_LDO_EN
SDAT
APP_GP_LCD_ALDO_EN
KEY_LED6
KEY_LED5
PWRRST_n
NF_READYNF_WE_N
NF_CS0_N
NF_OE_N
NF_ALENF_CLE
APP_GP_3AXIS_SDA
ACC_SPI_WLAN_CSn
ACC_GP_WLAN_RESETnACC_GP_WLAN_EN
ACC_GP_WLAN_PWR_DOWNn
LC
D_V
SY
NC
ACC_GP_GPS_RESETn
APP_GP_LCD_IF1
ACC_GP_SPI_WLAN_IRQn
APP_GP_FM_GPIO2
NF_IO(5)NF_IO(6)NF_IO(7)
NF_IO(0)NF_IO(1)NF_IO(2)NF_IO(3)NF_IO(4)NF_IO(5)NF_IO(6)NF_IO(7)
SD_CKE2
SD_CS2_nNF_OE_N
NF_CS0_N
NF_WE_N
NF_READY
SD_CKE2
RESOUT0_n
KE
YO
UT
0
APP_GP_MMC_DETn
APP_GP_TOUCH_PENIRQn
APP_GP_TOUCH_SDAAPP_GP_TOUCH_SCL
APP_GP_LCD_DLDO_ENAPP_GP_BL_EN
APP_GP_CAM_LDO_EN
NF_IO(0:7)
NF_IO(0)NF_IO(1)NF_IO(2)NF_IO(3)NF_IO(4)
ACC_GP_GPS_PON
APP_GP_USW_SDA
APP_GP_TOUCH_SDAAPP_GP_TOUCH_SCL
APP_GP_USW_SCL
APP_GP_3AXIS_SCL
AMP_I2C_SDAAMP_I2C_SCL
APP_GP_3AXIS_SDA
APP_GP_USW_INT
KEYIN2
APP_GP_3AXIS_SCL
VPPFLASH
WT
X_B
AN
D_1
_EN
AP
P_I
2C_S
CL
AP
P_I
2C_S
DA
WR
X_Q
_P
KE
YO
UT
1K
EY
OU
T2
KE
YIN
0
KE
YIN
2
APP_GP_VGA_SDN
APP_GP_MOTORLDO_EN
QD
AT
A_A
MP
_MS
BID
AT
A_F
RE
Q_M
SB
AM
P_F
RE
Q_L
SB
DA
TA
_ST
R
WP
OW
_DE
T_E
N
WT
X_B
AN
D_8
_5_E
N
WT
X_I
_NW
TX
_I_P
WT
X_Q
_NW
TX
_Q_P
WR
X_I
_NW
RX
_I_P
WR
X_Q
_N
SD_CS_n
SD_RAS_n
SD_WE_n
SD_CS2_n
AN
TS
W0
AN
TS
W1
AN
TS
W2
RF
_CT
RL
_CL
KR
F_C
TR
L_D
AT
A
RF
_CT
RL
_ST
R_1
TX
_AD
C_S
TR
B
AN
TS
W3
SD_DATA(11)SD_DATA(12)SD_DATA(13)SD_DATA(14)SD_DATA(15)
SD_DATA(2)SD_DATA(3)SD_DATA(4)SD_DATA(5)SD_DATA(6)SD_DATA(7)SD_DATA(8)SD_DATA(9)
SD_DQML_nSD_DQMU_n
SD_CAS_n
SD_ADDR(12)SD_ADDR(13)
SD_ADDR(3)SD_ADDR(4)SD_ADDR(5)SD_ADDR(6)SD_ADDR(7)SD_ADDR(8)SD_ADDR(9)
SD_ADDR(10)
SD_BA0SD_BA1
SD_CKESD_CLK
SD_DATA(1)
SD_DATA(10)
SD_ADDR(13)
SD_DATA(0:15)
SD_DATA(0)SD_DATA(1)SD_DATA(2)SD_DATA(3)SD_DATA(4)SD_DATA(5)SD_DATA(6)SD_DATA(7)SD_DATA(8)SD_DATA(9)
SD_DATA(10)SD_DATA(11)SD_DATA(12)SD_DATA(13)SD_DATA(14)SD_DATA(15)
NF_CLE
SD_CS_nSD_CLK
SD_CAS_n
SD_WE_n
SD_CKE
SD_RAS_n
SD_DQML_nSD_DQMU_n
NF_ALE
SD_ADDR(2)
SD_ADDR(11)
LC
D_D
AT
A[4
]L
CD
_DA
TA
[5]
LC
D_D
AT
A[6
]L
CD
_DA
TA
[7]
LC
D_W
E_N
LC
D_R
SL
CD
_CS
_N
LC
D_R
ES
ET
_N
SD_ADDR(1:13)
SD_ADDR(1)SD_ADDR(2)SD_ADDR(3)SD_ADDR(4)SD_ADDR(5)SD_ADDR(6)SD_ADDR(7)SD_ADDR(8)SD_ADDR(9)
SD_ADDR(10)SD_ADDR(11)SD_ADDR(12)
CI_
DA
TA
[4]
CI_
DA
TA
[5]
CI_
PC
LK
CI_
VS
YN
CC
I_H
SY
NC
CI_
RE
S_n
CI_
DA
TA
[7]
CI_
DA
TA
[6]
CI_
DA
TA
[0]
CI_
DA
TA
[2]
LC
D_D
AT
A[0
]L
CD
_DA
TA
[1]
LC
D_D
AT
A[2
]L
CD
_DA
TA
[3]
SYSCLK0SYSCLK1
USB_XTAL1
ACC_USB_HS_STP
SH
AR
ED
_I2C
_SC
LS
HA
RE
D_I
2C_S
DA
MIC
RO
SD
_CL
KM
ICR
OS
D_C
MD
MIC
RO
SD
_DA
T0
MIC
RO
SD
_DA
T1
MIC
RO
SD
_DA
T3
MIC
RO
SD
_CM
D_D
IRM
ICR
OS
D_D
AT
_DIR
DB_I2S0_CLK
DB_I2S0_DLD
DB_I2S0_WSDB_I2S0_ULD
DB_I2S1_CLK
DB_I2S1_DLD
DB_I2S1_WSDB_I2S1_ULD
USB_DATA(0)USB_DATA(1)USB_DATA(2)
RTCCLK
ACC_IRQ_nAPP_IRQ_n
MCLKREQ
SD_BA1
MIC
RO
SD
_DA
T2
PCM_CLK
PCM_DLD
PCM_SYNCPCM_ULD
LC
D_R
D_N
RESOUT0_nRESOUT1_n
WP
OW
_DE
T
ACC_USB_HS_IN_CLKACC_USB_HS_NXT
ACC_USB_HS_DATA(4)ACC_USB_HS_DATA(5)ACC_USB_HS_DATA(6)ACC_USB_HS_DATA(7)
APPSLEEP
APP_UART_RXAPP_UART_TX
APP_MMC_FB_CLK
APP_GP_USW_SCLAPP_GP_USW_SDA
APP_GP_3AXIS_INT
CI_
DA
TA
[1]
CI_
DA
TA
[3]
DCON
SD_BA0ACCSLEEP
ACC_USB_HS_DIR
ACC_UART3_RXACC_UART3_TX
ACC_UART3_CTSACC_UART3_RTS
ACC_GP_USB_CSACC_GPS_START
ACC_USB_HS_DATA(3)
ACC_UART0_RX
ACC_SPI_MISOACC_SPI_MOSIACC_SPI_CLK
ACC_GP_SPI_BT_CSnACC_GP_SPI_BT_IRQ
ACC_UART0_TX
- 181 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1%
B, I : 100K : 12.1K : 0.286V
D, K : 100K : 27.0K : 0.563V
BLM18PG121SN1J
E
G, N : 100K : 68.0K : 1.073V
6 10
to RF3300 digital
Direction of BAT and GND
120ohm 1608 2A 50mohm Bead
D
Charging
to Hall Switch and AB3100 BEAR
12
1.0 : 100K : 100K : 1.325V
5
Route as a differential pair
F, M : 100K : 51.0K : 0.895V
to All I/O Supplies and Memory
11
1.4 : 100K : 680K : 2.31V
1.2 : 100K : 215K : 1.809V
C, J : 100K : 20.0K : 0.442V
to RF3300 Power Detector
to SD Card and LCD
to Bluetooth
to AB3100 CODECs/ADC/PLL
3 4 10
Phone ground return path
2
2.8*2.6*1.0 0.7A 240mohm 20%
D
1 %
E
USB charging path
E, L : 100K : 39.0K : 0.744V
1
Discharging
A, H : 100K : 6.2K : 0.155V
to DB3210 CORE
1.1 : 100K : 150.0K : 1.59V
Parallel with VCORE
Audio Subsystem
4
A
6
C
Route as a differential pair
Route as a differential pair
1.3 : 100K : 390K : 2.109V
7 8
Close to ABB
8
Make an Area at 8, 9 Layer
B
GPA3:PCB_Rev_ADC
9
G
F
A
Use multiple via
C
7
Causion when PCB lLayout
5
LDO_C 2.65V 200mA
LDO_LP 2.20V
5%1.2VBUCK
Audio Subsystem
Audio Block
Audio BlockDigital Block
Audio Block
Audio Block
Charger Block
Charger Block
Charging Circuit
F
2
H
11
H
1608
G
3
to DB3100 analog
1%
to 3xis
B
12
1
9
Local ground plane
TP301
LDO_A 2.75V 150mA
LDO_D 2.65V 200mA
LDO_G 1.50~2.85V 100mA
LDO_E 1.80V 200mA
LDO_F 1.05~2.65V 30mA
LDO_H 1.20~1.80V 200mA
2.75V 100mA
LDO_K 1.80~2.75V 200mA
C343
B3
B1
VD
D
A3
VS
S
18000p
A4
C1PA5
D3
GN
D
HPLA2
HPRA1
INA1D2
INA2D1
C2INB1
C1INB2
D5OUT+
B5OUT-
C4
PG
ND
C5
PV
DD
RXIN+D4B4
RXIN-
SCLC3
SDA
VDDA_2V8
MAX9877AEWP_TG45U301
B2BIAS
C1N
C342
RTC_GND
1u
4.7uHL300
C3340.1u
C354
VBAT_H
C32
8
1u
22p
C333
TP304
C309
VDDH_2V75
1u
VDDF_2V5
1u
15R323
VA
300
ICV
L05
0510
1V15
0FR
R313
C323
27
1u
22pC337
24K
R31
9
VD
DD
_2V
65
VBAT
3300
pC
341
0R303
R304 0
15
VDDC_2V65
R305 0
VBUS
VDDE_1V8
R322
C63
122
p
C32
0
0R310
22p
C32
9
VBAT_C
2
C1
1
22p
D302
KDS221E_RTK
A1_C2
3A2
0.1uC346
C33522p
VDDD_2V65
R30
1
100K
C332
1u
VCORE
C35
322
p
TP303
VBAT_C
R307 0
VBAT
2.2uC303
C347
C33
6
1u
VBAT_H
1u
22p
C32
1
C3104.7u
VDD_REF
1/4WR324
C3042.2u
VBAT
2012
1% 0.025
0.1uC300
RB521S-30
VDDC_2V65
VBAT
D300
C305
4.7u
4.7u
VSS_BUCKB1
M7
VS
S_S
PK
RWS1
J3
WS2K1
XTAL1A10
XTAL2D11
B11XTAL_OUT
C301
VS
S57
L6
VS
S58
L7
L8
VS
S59
D10
VS
S6
L9
VS
S60
VS
S61
L10
VS
S62
L11
VS
S63
M6
VS
S64
M8
M9
VS
S65
M11
VS
S66
VS
S67
M12E
4V
SS
7E
5V
SS
8E
6V
SS
9
VS
S_B
EA
RN
5
VS
S42
J6 J7V
SS
43J8
VS
S44
J9V
SS
45J1
0V
SS
46J1
1V
SS
47V
SS
48K
5
VS
S49
K6
VS
S5
D9
K7
VS
S50
K8
VS
S51
K9
VS
S52
K10
VS
S53
VS
S54
K11
VS
S55
L4
VS
S56
L5
G10
VS
S28
G11
VS
S29
D6
VS
S3
G12
VS
S30
H4
VS
S31
VS
S32
H5
VS
S33
H6
VS
S34
H7
VS
S35
H8
VS
S36
H9
H10
VS
S37
H11
VS
S38
VS
S39
H12
VS
S4
D7
VS
S40
J4
VS
S41
J5
VS
S13
E10
VS
S14
F4
F5
VS
S15
F6
VS
S16
VS
S17
F7
VS
S18
F8
VS
S19
F9
D5
VS
S2
VS
S20
F10 G3
VS
S21
G4
VS
S22
G5
VS
S23
G6
VS
S24
G7
VS
S25
VS
S26
G8
VS
S27
G9
B2VBOOST
C1VBUCK
VBUSE2
C10
VD
D_A
DC
P13VDD_AUDIO
P3VDD_AUXO
VDD_BEARP6
VDD_IOA12
VDD_REFG1
VDD_SPKRP7
C14
VIB
R_O
UT
A13VREF
D4
VS
S1
VS
S10
E7
VS
S11
E8
VS
S12
E9
SRST_NM2
E3SW_BOOST
D12TEST
F2TRICKLE
A5
TX
ON
VBAT_AK12
K14VBAT_B
VBAT_CD1
VBAT_DG2
VBAT_EF14
VBAT_FM13
N14VBAT_G
VBAT_HF3
M3VBAT_K
B14VBAT_L
VBAT_MA1
N3SDAT
SDI1J1
K4SDI2
SDO1K2
L2SDO2
N2SIMCLKSIMDAT
P1
SIMLDO_OUTL1P2
SIMOFF_N
SIMRST_NN1
E11
SL
EE
P_A
D14
SL
EE
P_B
B10
SP
AR
E1
A2
SP
AR
E2
SPKRN_OUTN6
SPKRP_OUTN7
N8MIC3P
P10MIC4N
N11MIC4P
N4MIDR_OUT
B12MOD1
ON
SW
A_N
F13
ON
SW
B_N
F12
ON
SW
CF
11
PLL_DEC3H14
J12PLL_DEC4
E12
PW
RR
ST
_N
K3SCK1
L3SCK2
C13
SC
L
M1SCLK
SD
AB
13
M14LDOK_OUT
LDOLP_OUTD13
B4
LE
D1_
NA
4L
ED
2_N
D3
LE
D3_
NC
3L
ED
4_N
A3
LE
D5_
NB
3L
ED
6_N
P12LINEIN1
P11LINEIN2
MC
LK
H13
MIC1NM10
N10MIC1P
P9MIC2NMIC2P
N9
MIC3NP8
GP
A2
C9
B8
GP
A3
A8
GP
A4
C8
GP
A5
GP
A6
D8
GP
A7
B7
IREFA14
IRQ
A_N
E13
IRQ
B_N
E14
LDOA_OUTK13
LDOC_OUTN12
LDOD_OUTL12
G14LDOE_OUT
G13LDOF_OUTLDOG_OUT
L13
L14LDOH_OUT
H1CHSENSEP
A7DACO_0DACO_1
B6
A6DACO_2
C6DACO_3
DAC_CLKC4
DAC_DATC5
B5DAC_STR
F1DCIODCIO_INT
J2
C12EXT_LDO
J13FGSENSEN
J14FGSENSEP
GP
A0
A9
GP
A1
B9
GP
A12
C7
U300
C11
AD
_OU
T
AUXO1_OUTM4
AUXO2_OUTP4
BDATAA11
BEARN_OUTM5
BEARP_OUTP5
BOOST_ISND2
C2BOOST_ISP
E1BUCK_FB
CCO1N13
CCO2P14
CHREGH3
H2CHSENSEN
AB3100
C3111u
C34
047
n
D1
D2
D3
D4
G1
G2
S1
S2
R312
Q300 SIA911DJ
0
10u
TP302
0.1u
C315
C348
C35
222
p
2.2u
C339 1u
C307
C32
7
0.1u
C32
5
0R302
0.1u
R309 0
VA605varistor
0.1u
C32
6
1uC312
R30
0
100K
C3022.2u
C3190.1u10u
C317C3140.1u
VA
301
ICV
L05
0510
1V15
0FR
0R306
C3490.1u
300KR320
C33022p
C33133u
32.768KHz
X300
1 210u
VBAT
VDDK_2V75
C318
D301 RSX101VA-30TR
18000pC344
4.7K
R311
C34
51u
4.7u
VDDD_2V65 VBAT
C306
1%1/4W2012
0.1
TP305
VDDG_2V85
R316
D1
D2
1 2 3
CN
300
1u
FB300
C308
1u
R317
C338
VDD_REF
VBAT
VDDE_1V8 VDIGRAD_1V8
1u
R32
110
0K
R314
0
0
DNI
R308
TP
300
C322
SPKRPSPKRN
EAR_REAR_L
HS_EAR_L
HS_EAR_R
TRICKLE
FGS+
FGS-
VBUS
KE
Y_L
ED
6K
EY
_LE
D5
VDDC_2V65
VDDH_2V75
VDDG_2V85
CHS-
BDATA
FGS+
DCIO_INT
OTP
CCO1
VBUS
CHREG
RF_CTRL_DATA
RF_CTRL_CLKRF_CTRL_STR_1
VDDF_2V5
CHREG
DCIO_INT
FGS-
PCB_VERSION
FM_RP
SPK_RCV-
SPK_RCV+
AMP_I2C_SCLAMP_I2C_SDA
EAR_REAR_L
SPKRPSPKRN
BEARPBEARN
CHS+
MO
TO
R_P
WM
DB_I2S1_WS
VBAT
DB_I2S0_CLKDB_I2S0_WSDB_I2S0_ULDDB_I2S0_DLD
CHS+
DCDC_REFBIAS_CTRL
EXT_LDO
KE
Y_L
ED
2
FM_LP
DB_I2S1_CLK
DB_I2S1_ULDDB_I2S1_DLD
SIMRST_n
SY
SC
LK
1 PC
B_V
ER
SIO
N
BEARPBEARN
MIC1PMIC1NMIC2P
KE
Y_L
ED
1
BDATA
CHS-
VDDD_2V65
VDDA_2V8
VCORE
TE
ST
OU
TR
TE
MP
TX
_AD
C_S
TR
B
AD
OU
T
VB
AC
KU
P
SH
AR
ED
_I2C
_SD
AS
HA
RE
D_I
2C_S
CL
AC
CS
LE
EP
AP
PS
LE
EP
SIMVCC
SIMCLKSIMDAT
RTCCLK
ON
SW
A_n
VDDK_2V75
VDDE_1V8
VDIGRAD_1V8
VBACKUP
DC
ON
ON
SW
B_n
AC
C_I
RQ
_nA
PP
_IR
Q_n
PW
RR
ST
_n
SRST_nSCLK
SDAT
7. CIRCUIT DIAGRAM
- 182 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
E
11
5
LDO 3.3V For MOTOR150mA
6
10
1
F
H
1608
Hirose ( Micro-SD Socket, Normal ,T= 1.68)
C
MOTOR AMP
TOUCH LEVEL SHIFTER
64 7
C
D
B
7 8
EUSY0337101
MICROSD LEVEL SHIFTER
12
9
H
10
1 2
F
GG
TOUCH SCREEN DRIVER IC
12
9
11
2
Touchscreen Interface
Three-Axis Interface Motor Interface
Micro SD Card Interface
MICROSD SOCKET
54
D
E
B
Three-Axis Sensor
3
ENSY0020901
A
3
A
8
INT4
1NC1 NC2
10
NO
T1
11 12N
OT
2
6SCK
SDI8
SDO7
2VDD
9VDDIO
BMA150U401
5CSB
3GND
RS
B6.
8CS
T2R
ZD
402
ZD
403
RS
B6.
8CS
T2R
220K
R41
9
EV
LC
18S
0201
5
VA
403
B2A0
A1C2
A1AUX
GNDD2
PENIRQ-B1 D1
SCL
C1SDA
VDD_REFA2A3
X+C3
X-
Y+B3 D3
Y-
TSC2007IYZGRU405
150K
R402
390
R40
9
C4061u
VDDE_1V8
0
R65
6
RP103K281D-TR-F U406
3CE
2GND
5P
GN
DVDD4 1
VOUT
VA
402
EV
LC
18S
0201
5
0.01u
VBAT
R42
5
51K
C403
1uC414
ZD
401
RS
B6.
8CS
T2R
VA
405
VDD_TOUCH_2V8
DAT1AA2 D1
DAT1BB4
DAT2A DAT2BC4
A4DAT3A
D4DAT3B
GND1B3
GND2C3
A5VCCA
D5VCCB
EV
LC
18S
0201
5
SN74AVCA406EZXYRU403
A3CLKA
D3CLKB
CLK_FA1
CMDAB1
C2CMDB
CMD_DIRB5
B2DAT0A DAT0B
D2DAT0_DIR
C5
DAT123_DIRC1
SWA SWB
4
6
DM3AT-SF-PEJ
2
5
3
78
1
GND
0R423
S400
R416 2.2
VDDH_2V75
DN
IR
424 2.7K
R42
2
VDD_TOUCH_2V8
C40022n
R64
0
0
VDDE_1V8
R42
0
0
51KR411
0.1u
VDD_MOTOR_3V3
C412
R426 0
C409
EV
LC
18S
0201
5
VA
401
EVLC18S02003
VDD_MOTOR_3V3
0.1u
C3
B4
C4
B4GND
B3OE V
CC
AB
2
B1
VC
CB
VA406
U404TXS0104EZXUR
A1A1
A2A2
A3A3
A4
A4
C1B1
C2
B2
B3
EV
LC
18S
0201
5
VA
404
R42
12.
7K
C411
1u
1uC413
R408 51K
1u
VDDG_2V85
VDDE_1V8
RS
B6.
8CS
T2R
ZD
400
C407
TPA6205A1ZQVRU400
BYPASSC1
GNDB2
C2IN+
IN-C3 A3
VDD
VO+B3
VO-A1B1
_SHUTDOWN
R412
150K
VDD_TOUCH_2V8
VA
400
EV
LC
18S
0201
5
1u
C4010.1u
C404
2 4 6 8
1 3 5 7
C410
RA
400
100K
0.1u
1KR413
R414 1K
VDDE_1V8
0
R64
2
VDDG_2V85
VDD_MOTOR_3V3
10uC408
R42
9
100K
100K
R63
7
RP103K331D U402
3CE
2GND
5P
GN
DVDD4 1
VOUT
MOTOR_P
APP_GP_3AXIS_SDA
MICROSD_DAT3_2V85
MICROSD_CMD_2V85
MICROSD_DAT0_2V85
MICROSD_DAT1_2V85MICROSD_DAT2_2V85
VBAT
MOTOR_N
APP_GP_TOUCH_SDA
APP_GP_TOUCH_SCL
APP_GP_3AXIS_SCL
APP_GP_TOUCH_LDO_EN
MICROSD_DAT0_2V85
MICROSD_CLK_2V85
MICROSD_DAT1_2V85
MICROSD_CLK_2V85
APP_MMC_FB_CLKMICROSD_CLK
MICROSD_CMD_DIRMICROSD_CMD
MICROSD_DAT_DIRMICROSD_DAT0
MICROSD_DAT1MICROSD_DAT2MICROSD_DAT3
MOTOR_PWM
TOUCH_Y+
TOUCH_X-
TOUCH_Y-
APP_GP_TOUCH_PENIRQn_2V75 APP_GP_TOUCH_SCL_2V75
APP_GP_TOUCH_SDA_2V75
APP_GP_TOUCH_SCL_2V75
APP_GP_TOUCH_PENIRQn
APP_GP_TOUCH_SDA_2V75
APP_GP_TOUCH_PENIRQn_2V75
APP_GP_MMC_DETn
MICROSD_CMD_2V85
MICROSD_DAT2_2V85MICROSD_DAT3_2V85
APP_GP_3AXIS_INT
APP_GP_MOTORLDO_EN
TOUCH_X+
- 183 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PWRURXDUTXD
3G2.5G
GNDRXTX
VCHARON_SW
VBAT
TOUCH_Y- : GND line shielding to CN
B
1 2
If Maxim, then 4.7uF
TI : PD = USB, PU = UART
2012
8
USB Transceiver
D
3
D
A
8
Close by uUSB CONN
11
G
E
5 9
DOWNLOAD POINT
9
4
4
10V
6
If VBUS not used, then remove
A
12
H
C
MUIC
12
1 2
B
G
If TI, then 10nF
E
3 7
6
High Speed USB Interface
ESD / EMI Filter OJ
Download Point And TP Test Point
Backlight Charge Pump
34 pin connector To VGA FPCB
MUIC Circuit Micro USB Interface
Close to MUIC
MAXIM : NA = USB, PU = UART
C
F
10
Test Point
1%
5
F
H
7
If VBUS not used, then remove
1110
C5094.7u
L500
82nH
272829
3
3031323334
456789
1314151617 18
19
2
20212223242526
CAM_AVDD_2V8
ENBY0040301GB042-34S-H10-E3000
CN5031
101112
C508
22p
U500
NUS3065MUTAG
CNTRL3
4DRAIN
DRAIN_THERMAL9
GATE6
GND2
IN1
7OUT
5SRC
8VCC
TP501
TP502
0
R515 0
R65
5
2.2K
R51
1
VDDE_1V8
VDDE_1V8
22p
C507
R509
1K
51K
OJ500
R50
0
0R631C
515
0.1u
C50
31u
10R506
VBAT
VBAT
R505 10DNIR507
DNIR518
TP608
TP609
TP607
VBAT
TP605
TP606
C51
4
ICC3
INT
B2
A2ISET
A1MIC
B1RES
SC
LC
2C
1S
DA
B3U1U2
A3B4
UID
VBD5
0.1u
U501
D4AUD1
D3AUD2
D2BAT
CAPD1
COM1C5B5
COM2
A4DN1
A5DP2
GNDC4
6VBAT
VBAT
MAX14526EEWP_TCC6
URT500
12CTS
10DSR
GND1
4NC1
NC278
NC3
NC49
5ON_SW
RTS11
2RX
TX3
C506
22p
R64
1
0
G24
IN 1OUT2
22p
C511
FL500NFM21PC105B1A3
3G1
0
R62
9
100K
R63
0
C6351u
C63
31u
0R517
0.1uC525
FB502
6
7
8
9
CN501
1
10
11
12
13
14
15
2345
FB500
VDDE_1V8
C505 0.1u
R508 DNI
ULCE0505C015FR
VA500
DNI
C502
R503 0
TP500
OJ501
TP604
TP602
12K
R51
0
CTS_ON_ED1
CTS_ON_I
B5DCIO_EDCIO_I
C5
A2DFMS_E
D3DFMS_I
A1DTMS_EDTMS_I
D2
GN
D1
B2
B3
GN
D2
GN
D3
B4
GN
D4
C1
C2
GN
D5
C4
VC
C
VPPFLS_EA5D5
VPPFLS_I
KNATTE2-C2 FL501
A4CFMS_ECFMS_I
D4
CTMS_EA3
CTMS_IC3
B1
4.7u
C51
6
CAM_DVDD_1V8
0R501
RREF
STPD6
TESTC4
F4VBUS
VC
CF
3
B5VCC_IO1VCC_IO2
B2
F5XTAL1XTAL2
F6
B6C6
DATA7
E5DIR
DMC1D1
DPFAULT
E2
GN
D1
C5
D2
GN
D2
GN
D3
E4
D3ID
NC
1F
1F
2N
C2
D5NXT PSW_N
D4
E6REF1V8
E3REG3V3
C2
CFG0E1
B4CFG1CFG2
B3
CHIP_SELC3A4
CLOCKDATA0
B1A1
DATA1DATA2
A2A3
DATA3DATA4
A5A6
DATA5DATA6
ISP1508AETU502
C5130.1u
VBUS
2.2K
R504
VBAT
1uC
632
SD
12T
1G
ZD
500
9
2.2u
C51
7
INS
TP
AR
C634
10GND
9IN
OUTCP6
PGND15
1u
U604 AAT3169IFO-T1
C1+4
5C1-
C2+7
C2-8
11D1D2
1213
D314
D41
D52
D6
EN_SET3
0.1uC500
CN5001
2
FB501
4.7uC501
4.7u
1 uF
C512
C504
C510
C523
1u
TP6030.1u
0R502
VBAT
R513 DNI
TOUCH_Y+TOUCH_Y-
OTP_A
APP_ACC_UART_TX
APP_ACC_UART_RX
CTS_ON
VPPFLASH_E
VBUS
CI_RES_n
WLED2WLED3WLED4WLED5
APP_GP_BL_EN
WLED_PWR
WLED1
SYSCLK0
TOUCH_X+TOUCH_X-
APP_ACC_UART_TX
VPPFLASH_EVPPFLASH
CTS_ON
CTS_ON
ONSWB_n
HS_EAR_RHS_EAR_L
USW_ID
USW_ID
APP_GP_VGA_SDNAPP_I2C_SDA
APP_I2C_SCL
CI_DATA[1]
CI_DATA[3]
CI_HSYNC
CI_DATA[6]
CI_DATA[0]
CI_DATA[2]
CI_DATA[4]
CI_VSYNC
MIC2P
FM_ANT
APP_ACC_UART_RX
ACC_UART0_TX
APP_UART_TX
USW_DPUSW_DM
VPPFLASH_E
APP_ACC_UART_TXAPP_ACC_UART_RX
VBUS
VBUS
APP_ACC_UART_TX
SPK_RCV+
ACC_UART0_RX
APP_UART_RX
USW_DMUSW_DPUSB_DP
APP_GP_USW_INT
APP_GP_USW_SCLAPP_GP_USW_SDA
USB_DM
ACC_USB_HS_NXTACC_USB_HS_STP
USB_XTAL1
APP_ACC_UART_RX
SPK_RCV- CI_PCLK
CI_DATA[7]
CI_DATA[5]
VBUS
USB_DPUSB_DM
ACC_GP_USB_CSACC_USB_HS_IN_CLK
USB_DATA(0)USB_DATA(1)USB_DATA(2)
ACC_USB_HS_DATA(3)ACC_USB_HS_DATA(4)ACC_USB_HS_DATA(5)ACC_USB_HS_DATA(6)ACC_USB_HS_DATA(7)
ACC_USB_HS_DIR
7. CIRCUIT DIAGRAM
- 184 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6 8
1
9
F
G
BT
11
SIM
7
C
KEY ESD Protection
H
11
WLAN
SPI
D
10
TP
5
A
D
LC Filter for power noise from GSM RF
8
E
FM
GPS
FLASH
6
LDO for ISP
10
2 3
9
H
E
4
LDO for 5M & VGA Camera
Close to ABB
7
5M Camera Interface
60 Pin Connector To Sub PCB50 Pin Connector To KEY and LCD FPCB
B LDO for LCD Power
SOCKET
12
B
5M CAMERA Conector
F
G
5M camera ISP(MTEK vision)
A
5 12
C
3 42
1
59
6
60
789
G1 G2
G3 G4
EV
LC
14S
0205
0V
A60
4
4546474849
5
5051525354555657583
30 313233343536373839
4
4041424344
1516171819
2
20212223242526272829
CN601
1
1011121314
C60
11u
0.1u
CAM_DVDD_1V8
PRSB6.8C
D601
C60
6
R62
810
K
0R
601
C625 47n
G2
10
INOUT_A11
2INOUT_A2
INOUT_A33
4INOUT_A4
9INOUT_B1
INOUT_B28
7INOUT_B3
INOUT_B46
9
8INOUT_B2
INOUT_B37
6INOUT_B4
FL601
EVRC14S03Q030050R
5G
1
EVRC14S03Q030050R
FL602
5G
1
G2
10
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B1
CAM_AFVDD_2V8
5.6KR616
VOUT187
VOUT2
VDDE_1V8
R610 10K
RT9011-MGPQWU600
EN12
EN23
GND54
NC1NC2
6
PG
ND
9
1VIN
R60
310
K
C6VDDA_2_8RXVDDA_2_8TX
A7
VDDCOD3
VDDCO_ED4
VDDIO_2_8VE5
C5VSSA_RX
B7VSSA_TX
F1VSYNCO
47nC626
H4SDO4SDO5
G4SDO6
F4F5
SDO7
SEL1G8
H7SIMO_S_GPIO31
SMCKOF8
SOMI_S_GPIO30G7
D1SRESET
H6SS_S_SDO8
A8TCLKTCLKB
B8C7
TDATATDATAB
C8
A4TEST_0
F7TXD
PCLKOE1
RCLKA6B6
RCLKBA5
RDATARDATAB
B5
RGVDD_1_8VE4
RXDE7
SCLK_S_SDO9H8
SCL_M_SS_MA2
A3SCL_S
B2SDA_M_MISO_M
SDA_SB3
F2SDO0SDO1
H3G3
SDO2SDO3
F3
GPIO10_SCLK_MA1B1
GPIO11_MOSI_M
GPIO20_PWM0H1G2
GPIO21_PWM1H2
GPIO22_PWM2GPIO23_PWM3
D2
H5GPIO24_SCLK_M
GPIO25_SS_MF6G6
GPIO26_MISO_MG5
GPIO27_MOSI_M
GPIO28_SCL_MC1C2
GPIO29_SDA_M
HSYNCOE2
MCLKE8C3
NRESET
NSRESETG1
MV9319
D6AVDD
D5AVDDP
B4DGND1
C4DGND2
D7DGND3DGND4
D8
DGND5E3
DGND6E6
LCD_AVDD_2V8
U602
C60
70.
1u
VBAT
1u
ISP_DVDD_1V8
C60
3
4.3K
R61
9
FB603
100ohmR627
R614 47
1uC619
R60
00
FB
600
VA
602
RS
B6.
8CS
T2R
EV
LC
14S
0205
0V
A60
1
C6231u
INOUT_B37
6INOUT_B4
PRSB6.8C
D600
5G
110
G2
1INOUT_A1
INOUT_A22
3INOUT_A3
4INOUT_A4
INOUT_B19
8INOUT_B2
1P1
P22
3P3
P44 5
P5
6P6
P77
8P8
EVRC14S03Q030050R
FL600
ICMF214P101M
FL603
7.5p
R61
84.
3K
7
8
9
C610
13
14
15
16
17
18
19
2
20
21
22
23
24
3
4
5
6
CN603
GB042-24S-H10-E3000ENBY0034201
1
10
11
12
DN
IR
611
R645 10
R63
8
0
ZD
605
RS
B6.
8CS
T2R
C6151u
VBAT
VBAT
0.1uC609
LCD_DVDD_1V8
C61
31u
VDDK_2V75
PR
SB
6.8C
ZD
601
FB604FB605
R654 00R653
0.1uC616
1uC
604
TP601
ES
D9X
5.0S
T5G
ZD
603
INS
TP
AR
ZD
602
ES
D9X
5.0S
T5G
INS
TP
AR
P1
1 2P
23
P3
P4
45
P5
P6
6P
77
P8
8
D603PRSB6.8C
UL
CA
2114
C01
5FR
VA
600
CAM_AVDD_2V8
R626 100ohm
0
R635
0
R634
0
R62
1
PR
SB
6.8C
ZD
600
CAM_AFVDD_2V8
ISP_DVDD_1V8
C618
4.7K
R60
9
1u
PRSB6.8CD602
R625
5.6K
C60
21u
ISP_DVDD_1V8
CAM_AVDD_2V8
1uC628
1uC
611
NC1NC2
6
PG
ND
9
1VIN VOUT1
87
VOUT2
RT9011-MGPQWU601
EN12
EN23
GND54
47nH
ISP_AVDD_2V8
L600
BLM15AG100PN1FB602
0R632
R64
4
100K
2.2uC638
100K
R62
2
10K
R60
4
FB
601
VBAT
CAM_DVDD_1V8R
SB
6.8C
ST
2RZ
D60
6
C620
LCD_AVDD_2V8
1u
9P
GN
D
VIN1 8
VOUT1VOUT2
7
C6271u
U603 RT9011-MGPQW
2EN1
3EN2
5GNDNC1
46
NC2
1u
1uC608
C629
R617 100ohm
1uC630
C61
21u
C6171u
0.1uC624
LCD_DVDD_1V8
ISP_AVDD_2V8
R60
8D
NI
C622
VDDE_1V8
VA
603
ICV
S05
14X
350F
R
2.2u
ES
D9X
5.0S
T5G
ZD
604
INS
TP
AR
10K
R60
7
VBAT
1uC
614
C60
51u
414243444546474849
5
50
6789
272829
3
30313233343536373839
4
401213141516171819
2
202122232425 26
51 52
53 54
1
1011
0R633
CN604
TP600
OTP
ACC_GPS_START
ISP_GP_FLASH_EN
APP_GP_LCD_DLDO_ENAPP_GP_LCD_ALDO_EN
OTP_A
C621220p
LCD_DATA[7]
LCD_DATA[3]
LCD_DATA[1]LCD_DATA[2]
LCD_DATA[0]
ISP_GP_FLASH_SET
ISP_GP_FLASH_INH
SIMCLK
SIMDATSIMVCC
APP_GP_ISP_LDO_EN
ONSWA_nKEYIN2
KEYIN2
LCD_DATA[4]
LCD_DATA[6]LCD_DATA[5]
WLED_PWR
WLED1
KEYIN0
CCO1
KEYOUT0
KEYOUT2
KEY_LED1
TRICKLE
LCD_VSYNC
LCD_RESET_N
APP_GP_LCD_IF1
WLED5WLED4WLED3WLED2
APP_GP_LCD_ID
FM_RP
ACC_GP_GPS_RESETn
MOTOR_NMOTOR_P
KEYOUT1
KEYIN3
MIC1P
KEYOUT2KEYOUT1KEYOUT0
KEYIN0KEYIN3
ACC_SPI_MISOSIMRST_n
APP_ACC_UART_TXAPP_ACC_UART_RXVPPFLASH_ECTS_ON
ACC_SPI_WLAN_CSnACC_GP_SPI_WLAN_IRQn
ACC_GP_WLAN_PWR_DOWNn
ACC_GP_WLAN_EN
VBACKUP
LCD_RD_N
LCD_RS
APP_I2C_SDAAPP_I2C_SCL
FM_LP
FM_ANT
MCLKSEC
RTCCLK
ISP_SENS_I2C_SCL
CLKN
DATAN
ISP_SENS_I2C_SDA
CLKP
DATAP
APP_I2C_SCLAPP_I2C_SDA
ISP_GP_FLASH_SETISP_GP_FLASH_ENISP_GP_FLASH_INHACC_GP_WLAN_RESETn
ACC_SPI_MOSIACC_SPI_CLKACC_GP_SPI_BT_CSn
BT_CLKREQ_nRESOUT2_n
PCM_ULDPCM_DLD
PCM_SYNCPCM_CLK
ACC_GP_GPS_PONACC_UART3_RXACC_UART3_TX
ACC_UART3_RTSACC_UART3_CTS
ISP_SENS_I2C_SDA
APP_GP_CAM_LDO_EN
RESOUT1_nAPP_GP_FM_GPIO2
ACC_GP_SPI_BT_IRQ
CI_DATA[6]CI_DATA[5]CI_DATA[4]
5MCAM_RESET_N
ISP_SENS_I2C_SCL
DATANCLKP
DATAP
CLKN ISP_SENS_MCLK
CI_DATA[2]CI_DATA[3]
CI_DATA[7]SYSCLK0
CI_HSYNCCI_VSYNC
CI_RES_n
CI_PCLK
5MCAM_RESET_N
ISP_SENS_MCLK
LCD_WE_N
LCD_CS_N
KEY_LED2
MIC1N
CI_DATA[0]CI_DATA[1]
- 185 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2
Keep away from noise signals
H
10
B
D
C
9
10
GPS Power
11
E
3
D
6
on L1, L2 and L3
A A
5
7 93
1 2
12
4
70x: BT/WiFi RF path78x: BT/WiFi Antenna Pattern
71x~72x: WiFi
77x: GPS LNA
for WLAN-BT coexistenceB
11
1
G
8
C
73x~74x: Bluetooth
75x~76x: A-GPS
Reference Number
12
4
E
F
BT+FMWLAN
GPS Clock Buffer
GPS LNA block
A-GPS
Common GND on L1, L2 and L3
5
POWER
H
76
8
G
F
Careful routing of BT_CLK
Analog GND must be Isolated from
RF GND: Isolate from Common GND
C725
R75
4
100K
VDD_BT
DNI
C7181u
R73
4
100K
C7340.1u
100p
C77
2
C7710.1u
120p
C74
3
ALM-1612
FIL_OUT4 3
GNDRF_IN
2
1S
_D
VDD5
2.2u
U770
R78
1
0
C770
WIFI_RF_GWIFI_RF_G
10u
VDD_WLAN_3V3
DEA212450BT-7043C15
BP1
4BP2 BP_DC
2
3G
16
G2
1U_BP
C71
4VDDE_1V8
WIFI_RF_G
VDD_WLAN_1V8
FL730C71
01u
VBAT
TP751
R739
110
R71
7
0
0
R716
0
R73
5
VSS_BT_RF
SPI_SINTN_SD_DAT2
23T_R3_N
T_R
_N36
18V
DD
12
17V
DD
18
25VDD18A
27V
DD
30
VD
D_H
OS
T_I
O9
VD
D_P
A28
WL_
AC
TIV
E30
PGND2PGND3
3940
PGND4
41PGND5
42PGND6
43PGND7
44PGND8
45PGND9
RE
SE
TN
32
6SCLK
SD
_DA
T3
1235
SLE
EP
_CLK
14S
PI_
CL
K_S
D_C
LK
SPI_SCSN_SD_DAT021
SPI_SDI_SD_CMD20
5SPI_SDO_SD_DAT1
22
BT
_PR
IOR
ITY
29B
T_S
TA
TE
7ESCN
GND11
GND23
GND38
GND419
GND526
GP
IO0
34
GP
IO1
1613G
PIO
2
GP
IO4
15
GP
IO5
1110G
PIO
6
PD
N31
PGND13738
LBWA18HNVZ-305M710ANT
2
ANT_SEL_N244
ANT_SEL_P
33
4.7n
H
R78
0
C722
3CE
2GND
5P
GN
DVDD4 1
VOUT
1u
XM0830SK-TL1301TMP
ANT5
GND11
GND24
GND36
GND49
GND51113
PGND
8PORT1PORT2
2
RFGND13
RFGND27
12VCTL
10VDD
RP101K182D U711
0 FL700
C707
R70
0
1u
4pC706C705
4pC704
0
R755
DNI
110
R741
VDDK_2V75
VDD_WLAN_1V8
C75
7N
A
L750 6.8nH
VSS_BT_ANA
C7641u
10p
C74
2
VDDE_1V8
C76
61u
100K
R73
2
A23 GND
5VCC
Y4
1 _OE
SN74LVC1G125DRLRU730
C7621u
100pC701
VGPS_1V8
100K
R71
4
2.2n
HL
770
VDD_WLAN_1V8
VDD_BT
10n
HL
771
0R772
TP711
VBATVDD_WLAN_1V8
R701 0
1u
VDD_WLAN_1V8
C71
5
VGPS_1V8
10u
C71
6
C72
01u
C739
R71
010
0K
3CE
2GND
5P
GN
DVDD4 1
VOUT
0.1u
VS
SD
1V
SS
D2
D3
D7
VS
SD
3E
4V
SS
D4
VS
SD
5E
5
VS
SD
6F
4
VS
SIF
SU
BB
3C
1V
SS
RF
SY
NT
H
RP101K332D U710
TDO
F1TESTMODE
TMSA5
TRST_NA6
G6TX_SDA_MISO
D4VDDCORE1VDDCORE2
D6E3
VDDCORE3VDDCORE4
E6
VDDIFSYNTHD1
VD
DIO
1B
6G
3V
DD
IO2
VD
DIO
3G
7
F6VDDLP_LPREGOUT
VDDRFD2
VPDD5
B5
CN
TIN
G1CTS_N_I2C_GRP1_SCS_N
F7INTR_N
A3
LP
RE
GIN
RESET_NG4
RFINB1
E2RFREGOUT
E1RFSREGOUT
F5
RT
CC
LK
RTS_N_I2C_GRP0_MOSIG5
RX_SCL_SCKG2
F3STANDBY_N
SY
NC
_PP
SE
7
A7TCK
TC
XO
A2
TDIC7B7
U751
ATEST0B2
ATEST1C3
BBREGOUTA4
C4
BB
RF
RE
GIN
BMS0C6B4
BMS1_I2C_A0BMS2_UARTCS_N
C5
F2
VDDK_2V75
TP713
BCM4750
C7211u
FB730
VBAT
60
C7552.2nH
FB
710
100n
HC
758
VDDE_1V8
100K
R71
5
100K
R73
8
DNIR733
1uC
765
100nHL772
C73
50.
1u
C730
0.1uC753
0.1u
100K
R71
1
C7231u
C73
60.
1u
WIFI_RF_G
R74
0
0
22n
C74
1
100p
WIFI_RF_G
0R750
C717
C761
TP712
WIFI_RF_G
1u
VDDE_1V8
VDDE_1V8
C7021p
1uC763
VDDE_1V8
VDD_WLAN_3V3
VDDE_1V8
VDDE_1V8
TP753
4.7uC731
R730
33
C71
2
VDDK_2V75
1CN750
1
10u
R752
CN751
10
X7501
GND1
GND23
NC12 5
NC2
OUT4
VCC6
R7370
KT2520F16369ACW18T
FB
711
1uC737
100K
VSS_BT_ANA
VDDE_1V8
R75
6 TP752
33
R753
100pC732
C71
1
C7510.1u
VSS_BT_RF
1u
C7601u
VSS_BT_RF
VSS_BT_RF
1uC738
2.2uC750
R73
1
C7542.2u
100K
3CE
2GND
5P
GN
DVDD4 1
VOUT
WIFI_RF_GRP101K182D U752
C7521u
C75
60.
5p
TP710
VDDE_1V8
C700
C74
022
n
VSS_BT_ANA
0
VDDE_1V8
C7330.1u
1uC759
A
GND
OE VCC
Y
VGPS_1V8
VDD_WLAN_1V8
NL17SZ126XV5T2GU750
10
R770
L5L6
NC6
R757
0
A5
FM_LOUTB5
FM_RCLKD7
C8FM_RFGND
C5FM_ROUT
C9FM_RSTB
E9FM_SCLK
FM_SDIOD8
FM_SENBD9
FM_VAA4
FM_VDB3
FM_VIOD6
D4NC1NC2
F7F8
NC3NC4
L4
NC5
H1L1
BT_VSSRF2BT_VSSRF3
J2K2
BT_VSSRF4
BT_WAKEUPL9
B8FM_FMIP
FM_GND1A3B4
FM_GND2FM_GND3
B6
FM_GND4B7C4
FM_GND5C6
FM_GND6C7
FM_GND7FM_GND8
D5
FM_GPIO1A7A6
FM_GPIO2FM_GPIO3
G4H3
BT_VSSANA11H4
BT_VSSANA12
D2BT_VSSANA2BT_VSSANA3
E3
BT_VSSANA4F1F2
BT_VSSANA5BT_VSSANA6
F3F4
BT_VSSANA7G1
BT_VSSANA8G3
BT_VSSANA9
H6BT_VSSDIG1
H7BT_VSSDIG2BT_VSSDIG3
H8K8
BT_VSSDIG4L8
BT_VSSDIG5
BT_VSSRF1
C1C2
BT_RSVR_NBT_RSVR_RF
M2
BT_TEST1H2G2
BT_TEST2
BT_UART_CTSK6
J6BT_UART_RTS
BT_UART_RXDH9
G7BT_UART_TXD
E6BT_VDD_CLD
M6BT_VIO_ABT_VIO_B
J9
BT_VIO_CN3N5
BT_VIO_DBT_VIO_E
G8
BT_VSSANA1D1
BT_VSSANA10
E2E4
BT_HVA5BT_HVD
N7
BT_LP_CLKK9
BT_PCM_AK5M5
BT_PCM_B
M4BT_PCM_CLK
N4BT_PCM_SYNC
BT_REF_CLK_INF6
BT_REG_CTRLJ4
K7BT_RESETN
J1BT_RFNBT_RFP
K1
BT_RSVR_CL1B2
BT_RSVR_CL2C3M8
BT_RSVR_DBT_RSVR_DSM
BT_CLK_REQ_IN_2
J7BT_CLK_REQ_OUT_1
J8BT_CLK_REQ_OUT_2
BT_CONFIG_1L7
BT_CONFIG_2M7N6
BT_CONFIG_3
BT_GPIO_0G9
K4BT_GPIO_10
K3BT_GPIO_11
BT_GPIO_16J3L3
BT_GPIO_8
BT_GPIO_9M3
BT_HOST_WAKEUPE8
BT_HVA1L2D3
BT_HVA2BT_HVA3
E1
BT_HVA4
STLC2593U731
BT_AF_PRGG6
BT_CLK_REQ_IN_1E7F9
C71
322
p
C71
90.
1u
C724
100K
R71
3
1u
DUMMY FEED
VDD_BT
ANT780
0R
742
ACC_GP_GPS_PON
RESOUT2_n
PCM_DLDPCM_ULD
PCM_CLKPCM_SYNC
ACC_GP_WLAN_RESETn
BT_CLKREQ_n
ANT_SEL_N
BT_TXRX
PTA_BT_STATEPTA_BT_PRIO
WIFI_TXRX
WIFI_TXRX
BT_TXRX
RESOUT1_n
MCLKSEC
GPS_CNTIN
ACC_GP_GPS_PON
GPS_CNTIN
PTA_WLAN_ACTIVE
ACC_UART3_TX
ACC_SPI_WLAN_CSn
FM_LPFM_RP
ACC_GP_GPS_PON
ACC_GPS_STARTRTCCLK
ACC_UART3_CTS
ACC_GP_GPS_RESETn
ACC_UART3_RTS
ACC_UART3_RX
PTA_BT_STATEPTA_BT_PRIO
BT_CLKREQ_n
BT_CLKMCLKSEC
ACC_GP_GPS_PON
ACC_SPI_CLK
ACC_GP_SPI_BT_CSn
RTCCLK
APP_I2C_SCL
APP_I2C_SDA
BT_CLK
FM_ANT
WLAN_SLEEPn
ACC_SPI_MOSI
PTA_WLAN_ACTIVE
ACC_GP_SPI_BT_IRQ
RTCCLK
ACC_SPI_CLK
ACC_SPI_MISO
APP_GP_FM_GPIO2
WLAN_SLEEPn
ACC_GP_WLAN_PWR_DOWNn
ACC_SPI_MOSI
ACC_SPI_MISO
ACC_GP_SPI_WLAN_IRQn
RTCCLK
ACC_GP_WLAN_EN
ANT_SEL_N
7. CIRCUIT DIAGRAM
- 186 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8
BT
For Product inspection TP(7PIN)
B
10
D
7
8 9
PLUG
3 4 5
E
SIM
SPI
71
WLAN
FM
H
3 9
2
to be separated when routing
1 2
10
5
BACKUP BATTERY
6
A
G
CAMERA FLASH LED
A
GPS
F
11
11
12
B
6
H
F
G
4
C
FLASH
TP
12
SIM CONNECTOR
60 Pin Connector From Main PCB
SIM InterfaceBoost Converter for Camera Flash
Backup Battery
Motor
D
SIMDAT and SIMCLK Siganls
E
C
VBAT
R80
610
0K
AGND4
1CT
2EN_SETFLEN
3 12FLGND
FLINH10
FLOUTA13
FLOUTB11
GND9
15G
_SL
UG
IN5
LX6
OUT87
PGND
14RSET
L8001u
U800 AAT1270IFO-T1
53545556575859
6
60
789
G1 G2
G3 G4
39
4
40414243444546474849
5
505152
2526272829
3
30 3132333435363738
1
10111213141516171819
2
2021222324
1
2
CN800
VDDK_2V75
CN801
33p
VA806EVLC14S02050
C805
EV
LC
18S
0200
3V
A80
0
TP802
10K
R80
3
SIMVCCSIMVCC
22p
C803R805
5VPP
TP800
0
J800
3CLK
GND4
7GND1GND2
86
I_ORST
2VCC
1
0
TP804
R814
EVLC14S02050VA807
33p
C800
C802
2.2u
VBAT
TP801
100K
R80
7
1u
C804
TP803
200K
R80
1
DNIC806
VA
801
EV
LC
18S
0200
3
VDDE_1V8
EV
LC
18S
0200
3V
A80
2
LD800
C80147n
BAT800
2.2uC807
PCM_DLDPCM_SYNC
PCM_CLKACC_GP_GPS_PON
ACC_UART3_RXACC_UART3_TX
ACC_UART3_RTSACC_UART3_CTSACC_GPS_START
ACC_GP_GPS_RESETnFM_LPFM_RP
CTS_ON
APP_ACC_UART_TX
VPPFLASH_E
ISP_GP_FLASH_ENISP_GP_FLASH_SET
ISP_GP_FLASH_INH
MOTOR_N
RESOUT1_nAPP_GP_FM_GPIO2
APP_I2C_SCLAPP_I2C_SDA
VBACKUPOTP_SUBMOTOR_P
ACC_GP_SPI_BT_IRQACC_GP_SPI_BT_CSn
BT_CLKREQ_nRESOUT2_n
PCM_ULD
FM_ANT
RTCCLK
ACC_SPI_MOSIACC_SPI_CLKACC_SPI_MISO
ACC_GP_WLAN_ENACC_GP_SPI_WLAN_IRQnACC_SPI_WLAN_CSnACC_GP_WLAN_PWR_DOWNnACC_GP_WLAN_RESETn
SIMCLKSIMVCCSIMDATSIMRST_n
APP_ACC_UART_RX
ISP_GP_FLASH_ENISP_GP_FLASH_SET
ISP_GP_FLASH_INH
VBACKUP
OTP_SUB
APP_ACC_UART_TX
CTS_ON
VPPFLASH_E
APP_ACC_UART_RX
MOTOR_P
MOTOR_N
MCLKSEC
SIMDAT SIMCLKSIMRST_n
- 187 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4 5 6 7
7 8
SEND CLEAR KEY
12
C
D
E
F
D
11
9 1 0 11
GG
H
C
D
E
F
12
A
G
5
H
VOLUME KEY
5 12
B
C
END KEY
10
4
8
AUTO FOCUS KEY
11 12
A
C
1 2 3
2 3
HALF SHUTTER
6
4 5 6 9
TOUCH LOCK KEY
7 8
SOCKET
FULL SHUTTER
B
2 3 41
D
E
F
50 Pin Connector From Main PCB
Key Matrix Main Key LED ( 4ea)
ANT FeedingMain MIC
40 Pin Connector To LCD
6 7 8
E
F
1 2 3
G
H H
1 9 10
10
119
9
40
41
42
43
44
45
46
47
48
49
5
50
6
7
8
25 26
27
28
29
3
30
31
32
33
34
35
36
37
38
39
4
11
12
13
14
15
16
17
18
19
2
20
21
22
23
24
CN251 52
53 54
1
10
C1002DNI
VBAT
LCD_DVDD_1V8
OUT100
0
LCD_AVDD_2V8
LD1003
R3
SSC-TWH104-HL
LCD_AVDD_2V8
VB
AT
VOLUME_UP
R60
0R123
DNIC1004
LCD_DVDD_1V8
SW1001
ANTG1G2
OUT101
UFL-R-SMT10
SSC-TWH104-HL
LD1001
LD1002
SSC-TWH104-HL
LD1000
SSC-TWH104-HL
39
22
40
23242526272829
456789
21
303132333435363738
1
10111213141516171819
2
20
3
VOLUME_DOWN
CN1
SEND
C100047p
A
B B_
C C_
D
R4
EVPAHBD6ASW1000
LOCK
0
RB521S-30
D1000
3
O4
P1
ENDCLR
MIC100
SPU0410HR5H-PB
G12
G2
LCD_DATA[5]
LCD_IF0
LCD_RESET_N
APP_GP_LCD_IF1
KEYIN0KEYIN2
LCD_WE_N
LCD_CS_N
WLED1WLED_PWR
LCD_VSYNC
APP_GP_LCD_ID
WLED2WLED3WLED4WLED5
LCD_DATA[7]
KEYIN2
KEY_LED1
KEYOUT2
WLED1
WLED2
WLED3
WLED4
LCD_DATA[3]
LCD_DATA[1]
LCD_DATA[6]
LCD_RS
LCD_DATA[4]
LCD_DATA[2]
LCD_DATA[0]
LCD_RD_NLCD_DATA[5] KEYIN0
MIC1P
KEYOUT1
LCD_CS_N
LCD_DATA[6]
LCD_RS
LCD_DATA[4]
LCD_DATA[2]
LCD_DATA[0]
LCD_RESET_N
APP_GP_LCD_ID
APP_GP_LCD_IF1
WLED_PWR
LCD_VSYNC
LCD_WE_N
KEY_LED2
ONSWA_n
LCD_DATA[7]
LCD_RD_N
LCD_IF0
WLED5
KEYOUT0
KEY_LED2
ONSWA_n
KEYIN3
MIC1N
CCO1
LCD_DATA[1]
LCD_DATA[3]
KEY_LED1
KEYIN3
KEYIN0
KEYOUT1
KEYOUT0
ONSWA_n
KEYOUT2
KEYIN0
KEYIN3
KEYOUT2
KEYOUT1CCO1
MIC1NMIC1P
7. CIRCUIT DIAGRAM
- 188 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
C C
12
PLUG
B
6 7
E
F
E
F
G
5 7
11 12
A
B
H
1 2 3
D
8 9 10 11
1 2 3 4 5
4
8
6
34 Pin Connector From Main PCB
VGA Camera TOUCH CONNECTOR
G
H
A
D
9 1 0
51R904
28
29
3
30
31
32
33
34
4
5
6
7
8
9
13
14
15
16
17 18
19
2
20
21
22
23
24
25
26
27
CAM_DVDD_1V8
CN9011
10
11
12
G2
G3 G4
CAM_DVDD_1V8
conn_axk7l10225CN400
1 102345 6
789
G1
47R910
VDD15_1A5
VDD15_2E4
D2VSYNC
0.1uC913
DATA6C3D4
DATA7
A3DCLK
DVDDB6
B5EXTCLK
GND1A4
GND2C4
GND3E2E3
GND4
HSYNCD1
IOVDDA2
F1
PG
ND
C6PWRDWN
D3RESET
D6SCLSDA
C5
U901TCM9000MD
E5AVDD
B3DATA0
B1DATA1DATA2
B2
DATA3B4C1
DATA4DATA5
C2
C9000.1u
CAM_AVDD_2V8
CAM_AVDD_2V8
0.1uC901
CN9021
2
CI_PCLK
CI_RES_n
SPK_RCV-
SPK_RCV+
TOUCH_Y+
TOUCH_X+
TOUCH_X-
TOUCH_Y-
TOUCH_Y+
TOUCH_X+ TOUCH_Y-
TOUCH_X-
CI_DATA[1]
CI_DATA[5]
CI_DATA[3]
SYSCLK0
SPK_RCV-
SPK_RCV+
APP_I2C_SCL
APP_I2C_SDA
CI_RES_n
SYSCLK0
APP_GP_VGA_SDN
CI_DATA[0]
CI_DATA[7]
CI_DATA[6]
CI_VSYNC
CI_HSYNC
CI_DATA[0]CI_DATA[1]CI_DATA[2]CI_DATA[3]CI_DATA[4]CI_DATA[5]CI_DATA[6]CI_DATA[7]
CI_HSYNC
APP_GP_VGA_SDN
APP_I2C_SCLAPP_I2C_SDA
CI_VSYNC
CI_PCLK
CI_DATA[2]
CI_DATA[4]
- 189 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
8. BGA Pin Map
8. BGA Pin Map
DB3200 ( Digital BB)
: NC pin
- 190 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
AB3100 (Analog Baseband)
: NC pin
- 191 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
8. BGA Pin Map
MCP (2G NAND / 1G SDRAM)
- 192 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
RF3300
- 193 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
8. BGA Pin Map
Bluetooth
STLC2593
Top View
NC pin
- 194 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
GPS
BCM4750
Top View
BMS0
BMS1_I2C_A0
BMS2_UARTCS_N
TX_SDA_MISO
RX_SCL_SCK
CTS_N_I2C_GRP1_SCS_N
RTS_N_I2C_GRP0_MOSI
INTR_N
RESET_N
STANDBY_N
TCK TDO
ATEST0
VSSD1
VSSD2
VSSD3
VSSD4
VSSD5
VSSD6
VSSRFSYNTH
VSSIFSUB
VDDCORE4
VDDCORE3
VDDCORE2
VDDCORE1BBREGOUT
VDDLP_LPREGOUT
VDDIFSYNTH RFSREGOUT
VDDRF RFREGOUT
RFIN
LPREGIN
VDDIO3
VDDIO2
VDDIO1
BBRFREGIN
TCXO
RTCCLK
SYNC_PPS
CNTIN
Not use
TRST_N
TDI
TMS
ATEST1
TESTMODE
VPD
U602 ISP chipsetNo 5M camera
FL501 EMI/ESD filterNo UART communicationNo download
U404 Touch Level shifterNo touch operation
U405 Touch screen driver ICNo touch operation
U406 LDO for touchNo touch operation
U601 LDO for cameraNo VGA cameraNo 5M camera
U603 LDO for ISPNo 5M camera
U400 Motor Amp No motor operation
U402 LDO for MotorNo Motor operation
U403 MicroSD level shifterNo SD card operation
S400 SD card socketNo SD card operation
U401 3-Axis sensorNo 3-Axis sensor operation
X100 26M CrystalNo bootingNo service
U111 RFICNo service
U101 FEM + GSM PANo service
U102 WCDMA band I PANo service
U107 WCDMA band VIII PANo service
U109 DC/DC converterNo service
- 195 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
- 196 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CN500 5Pin Micro USB Con.No ChargingNo headsetNo download
U604 Backlight charge pumpNo display
CN603 5M camera Con.No 5M camera
U500 OVP ICNo charging
U501 MUICNo downloadNo headset
U502 USB transceiverNo downloadNo data service
CN503 VGA FPCB Con.No VGA cameraNo touch operationNo sound
CN601 60Pin Sub Con.No SIMNo GPS operationNo Wi-Fi operationNo BT operationNo FM radio operationNo Flash
U200 MemoryNo booting
U201 DBBNo bootingNo serviceNo display
U300 PMICNo power onNo serviceNo chargingNo sound
X300 crystalNo power on
U301 Audio Amp No Sound
U600 LDO for LCDNo display
SW100No service SW101
No service
CN604 50Pin Con.No displayNo keypad inputNo power onNo mic input
- 197 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CN801 Motor padNo motor operation
J800 SIM socketNo SIM
LD800No flash
U770 GPS LNANo GPS
U751 GPS ICNo GPS
X750 TCXO for GPSNo GPS
M710 Wi-Fi ModuleNo wi-fiservice
U731 BT+FM radio ICNo BT connectionNo FM radio
ANT780No BT connectionNo Wi-Fi service
U800 bust converterNo flash
CN800 60Pin Sub Con.No SIMNo GPS operationNo Wi-Fi operationNo BT operationNo FM radio operationNo Flash
CN750/CN751 GPS ant. padNo GPS
9. PCB LAYOUT
- 198 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
MIC100No mic
CN2 50Pin Con.No displayNo keypad inputNo power onNo mic input
SW100No service
LD1001No power on
- 199 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CN1 40Pin Con.No display
9. PCB LAYOUT
- 200 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CN400 touch con.No touch operation
U901 VGA cameraNo VGA operation
CN901 VGA FPCB Con.No VGA cameraNo touch operationNo sound
- 201 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CN902 speaker padNo sound
- 202 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 203 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. CALIBRATION
10. CALIBRATION
10.1 General DescriptionThis document describes the installation and software usage for the calibration of LG’s
GSM/GPRS/EDGE/WCDMA Multimedia Mobile Phone. The calibration menu and it’s result is displayed in PC
terminal by Mobile phone.
10.2 Environment
10.2.1 H/W Environment- PC with RS-232 Interface & GPIB card installed
- GSM/GPRS/EDGE/WCDMA Multimedia Mobile Set
- Agilent 8960 Series 10 E5515C Instrument (E1987A above version A.05.28)
- Tektronix PS2521G Power Supply or Agilent A66311B
- ETC (GPIB cable, Serial cable, RF cable, Power cable, Dummy battery)
10.2.2 S/W Environment- National Instrument GPIB & VISA (version 2.60 full) driver install
- Agilent 8960 VXI driver(E1960) install
- HotKimchi EXE files
- OS : Window98, Window2000, WindowXP
10.2.3 Configuration Diagram of Calibration Environment
Figure 10-1. Calibration Configuration
KF757
- 204 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. CALIBRATION
10.3 Calibration EnvironmentEnsure that the following conditions are maintained throughout the duration of the tests and calibrations
described within this document.
Parameter Min Typical Max Unit
Temperature 15 25 30 C
Relative
Humidity20 40 75 %
Vbatt 3.6 3.7 3.8 V
Supply current 0 3 A
Table 10-1. Nominal Environmental Test Conditions
- 205 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. CALIBRATION
10.4 Program Operation
10.4.1 HotKimchi Program OverviewWhen trying to calibrate the mobile phone, the service engineers make a configuration of calibration
environment like Figure10-1. And if you finish making configuration, please execute the HotKimchi
program.
See Figure 10-2.
HotKimchi supports following functions.
- Calibration of GSM850/900/1800/1900, WCDMA 2100/900
- Instrument (Agilent8960, Tektronix PS2521G) control
- UART communication with mobile phone
GT500
Figure 10-2. HotKimchi Window
- 206 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. CALIBRATION
10.4.2 SETTINGSelect a Ezlooks menu.
Select “OFF-LINE” in the EZLOOKS Mode.
- 207 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. CALIBRATION
Select a Line System menu.
Select “MANUAL” in the RUN MODE.
Select “NO” in the MULTI CAL SYSTEM.
GT500
- 208 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. CALIBRATION
Select a Logic Operation menu.
Select LOGIC MODE that you want.
1. CAL only
2. AUTO only
3. CAL + AUTO
Select UART Port for only S/B1 to communicate with mobile phone.
GT500
- 209 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. CALIBRATION
10.4.3 Calibration Procedure
Select a model name – GT500.
Click the START button.
※ RF Calibration steps as follow :
DCS → PCS → PCS → GSM850 → WCDMA2100 → WCDMA900
When RF calibration is finished, the result of judgment will be displayed.
GT500
GT500
- 210 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 211 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
65 2
1
5
4 9
1819
20 6325
26 27 28
3264
30
31
60
67
29
33
6314
59
317
16
1510
11
61
2221
38
3536
34
37
51
4547
48
46
49
666
50
3940
68
4142 43
4452
53
7
2413
585756
54
5512
8
ASS’Y EXPLODED VIEW
- 212 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
A
B
C
D
E
FEDCBA
F
- 213 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
2 AAAY00 ADDITION AAAY0395901WITHOUT
COLOR
3 AMBA00 MANUAL ASSY,OPERATION AMBA0155801 GT500 manual assy for TMUWITHOUT
COLOR
4 MCHZ00 COMPACT DISK MCHZ0078101 COMPLEX, (empty), , , , ,SILVERSNOW
4 MMBB00 MANUAL,OPERATION MMBB0343001 PRINTING, (empty), , , , ,WITHOUT
COLOR
3 APKA00 PEN ASSY,STYLUS APKA0001101 BLACK D, 12
3 MBAD00 BAG,VINYL(PE) MBAD0008404 COMPLEX, (empty), , , , ,WITHOUT
COLOR
3 MCJA00 COVER,BATTERY MCJA0082401 MOLD, PC LUPOY SC-1004A, , , , , BLACK F, 7
3 MPHY00 PROTECTOR MPHY0016901 COMPLEX, (empty), , , , ,WITHOUT
COLOR
2 APAY00 PACKAGE APAY0131205GT500 TMU(TR1/3018&4541 LB/WD-9501/Angle/P-LB2ea/Seal/Bag)
WITHOUTCOLOR
3 APLY00 PALLET ASSY APLY0002303 TR1 Angle Palletizing (Angle/WD-9501/400ea)WithoutColor
4 MCJZ00 COVER MCJZ0030520 COVER(for TR 1 Angle_COVER_GSM)WithoutColor
4 MPCY00 PALLET MPCY0009501 PALLET(G7100 for Orange UK_EUR) BLACK
3 BSEA00 SUPPLEMENTARY PART BSEA0003901 PACKING-LIST ENVELOPE
3 MBAD00 BAG,VINYL(PE) MBAD0005204 COMPLEX, (empty), , , , ,WithoutColor
3 MLAC00 LABEL,BARCODE MLAC0004541 PRINTING, (empty), , , , ,WithoutColor
3 MLAC01 LABEL,BARCODE MLAC0003018 PRINTING, (empty), , , , ,WithoutColor
3 MLAJ00 LABEL,MASTER BOX MLAJ0004402 LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)WithoutColor
3 MLAZ LABEL MLAZ0048203 PRINTING, (empty), , , , ,WITHOUT
COLOR
3 MLAZ00 LABEL MLAZ0050901 PRINTING, (empty), , , , ,WITHOUT
COLOR
3 MPAE00 PACKING,BLISTER MPAE0007803 COMPLEX, (empty), , , , , Red
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 214 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
2 APEY00 PHONE APEY0750101 BLACK
3 ACGM00 COVER ASSY,REAR ACGM0129501 BLACK C
4 MCCE00 CAP,RECEPTACLE MCCE0049201 MOLD, PC LUPOY SC-1004A, , , , , BLACK 54
4 MCCF00 CAP,MOBILE SWITCH MCCF0060901 COMPLEX, (empty), , , , ,WITHOUT
COLOR
4 MCCG00 CAP,MULTIMEDIA CARD MCCG0019101 MOLD, PC LUPOY SC-1004A, , , , , BLACK 52
4 MCJN00 COVER,REAR MCJN0098701 MOLD, PC LUPOY SC-1004A, , , , , BLACK 53
4 MDAD00 DECO,CAMERA MDAD0045101 ELECTROFORMING, Cu, , , , , BLACK 58
4 MGAD01 GASKET,SHIELD FORM MGAD0197801 COMPLEX, (empty), , , , ,WITHOUT
COLOR 46
4 MHCY00 HANGER MHCY0003101 MOLD, Urethane Rubber S195A, , , , , BLACK 44
4 MLAB03 LABEL,A/S MLAB0003601 COMPLEX, (empty), , , , ,WITHOUT
COLOR 6
4 MLCE00 LENS,FLASH MLCE0012701 MOLD, PMMA HI835M, , , , , BLACK 48
4 MPBF00 PAD,FLEXIBLE PCB MPBF0041401 COMPLEX, (empty), , , , ,WITHOUT
COLOR 41
4 MPBJ00 PAD,MOTOR MPBJ0062001 COMPLEX, (empty), , , , , BLACK 43
4 MPBT00 PAD,CAMERA MPBT0072101 COMPLEX, (empty), , , , , BLACK 49
4 MPBZ00 PAD MPBZ0225101 COMPLEX, (empty), , , , , BLACK 47
4 MPBZ01 PAD MPBZ0228201 COMPLEX, (empty), , , , , BLACK 45
4 MTAA00 TAPE,DECO MTAA0188101 COMPLEX, (empty), , , , ,WITHOUT
COLOR 57
4 MTAB00 TAPE,PROTECTION MTAB0332701 COMPLEX, (empty), , , , ,WITHOUT
COLOR 66
4 MTAK00 TAPE,CAMERA MTAK0024701 COMPLEX, (empty), , , , ,WITHOUT
COLOR 56
4 MWAE00 WINDOW,CAMERA MWAE0045001 CUTTING, PMMA MR 200, , , , , BLACK 13
3 ACGV00 COVER ASSY,BAR ACGV0004301 BLACK A
4 ABGF00 BUTTON ASSY,MAIN ABGF0012901 SILVER 3
4 ACGK00 COVER ASSY,FRONT ACGK0130701 BLACK
5 MBJL00 BUTTON,SIDE MBJL0081801 MOLD, PC LUPOY SC-1004A, , , , , BLACK 15
5 MBJL01 BUTTON,SIDE MBJL0081701 MOLD, PC LUPOY SC-1004A, , , , , BLACK 14
5 MCJK01 COVER,FRONT MCJK0102001 MOLD, PC LUPOY SC-1004A, , , , , BLACK 9
5 MDAG01 DECO,FRONT MDAG0046701 MOLD, PC LUPOY SC-1004A, , , , , SILVER 4
- 215 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
5 MDAK01 DECO,REAR MDAK0018001 MOLD, PC LUPOY SC-1004A, , , , , BLACK 11
5 MFBC01 FILTER,SPEAKER MFBC0048501 COMPLEX, (empty), , , , , BLACK 20
5 MFBD01 FILTER,MIKE MFBD0038201 COMPLEX, (empty), , , , ,WITHOUT
COLOR 17
5 MPBT01 PAD,CAMERA MPBT0075501 COMPLEX, (empty), , , , ,WITHOUT
COLOR 19
5 MPBU01 PAD,CONNECTOR MPBU0063501 COMPLEX, (empty), , , , ,WITHOUT
COLOR 18
5 MTAA01 TAPE,DECO MTAA0187401 COMPLEX, (empty), , , , ,WITHOUT
COLOR 10
5 MTAB01 TAPE,PROTECTION MTAB0299601 COMPLEX, (empty), , , , ,WITHOUT
COLOR
5 MTAB02 TAPE,PROTECTION MTAB0336001 COMPLEX, (empty), , , , ,WITHOUT
COLOR 68
5 MTAK01 TAPE,CAMERA MTAK0024601 COMPLEX, (empty), , , , ,WITHOUT
COLOR 63
4 ADBY00 DECO ASSY ADBY0015001WITHOUT
COLOR
5 MBFZ00 BRACKET MBFZ0035501 CUTTING, STS, , , , ,WITHOUT
COLOR 22
5 MTAD00 TAPE,WINDOW MTAD0109001 COMPLEX, (empty), , , , ,WITHOUT
COLOR 21
4 AFBZ00 FRAME ASSY AFBZ0012701 LCD BRACKET assyWITHOUT
COLOR
5 MBFF00 BRACKET,LCD MBFF0024501 PRESS, STS, , , , , BLACK 28
5 MGAD00 GASKET,SHIELD FORM MGAD0198601 COMPLEX, (empty), , , , ,WITHOUT
COLOR 64
5 MTAA00 TAPE,DECO MTAA0197401 COMPLEX, (empty), , , , ,WITHOUT
COLOR 62
5 MTAA01 TAPE,DECO MTAA0200001 COMPLEX, (empty), , , , ,WITHOUT
COLOR 32
4 AHCZ00 HOLDER ASSY AHCZ0002101 BLACK
5 MDAH00 DECO,RECEIVER MDAH0025801 MOLD, PC LUPOY SC-1004A, , , , , BLACK 31
5 MPBN00 PAD,SPEAKER MPBN0068601 COMPLEX, (empty), , , , , BLACK 30
4 GMEY00 SCREW MACHINE,BIND GMEY00192011.4 mm,1.8 mm,SWCH18A ,N ,+ , ,; ,[empty] ,+ , , ,CR-7,WHITE ,[empty] ,[empty]
WHITESILVER 29
4 MGAD00 GASKET,SHIELD FORM MGAD0196901 COMPLEX, (empty), , , , ,WITHOUT
COLOR 59
4 MPBG01 PAD,LCD MPBG0089501 COMPLEX, (empty), , , , , BLACK 5
- 216 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
4 MPBG02 PAD,LCD MPBG0096401 COMPLEX, (empty), , , , ,WITHOUT
COLOR 61
4 MTAA00 TAPE,DECO MTAA0202201 COMPLEX, (empty), , , , ,WITHOUT
COLOR 67
4 MTAB01 TAPE,PROTECTION MTAB0299901 COMPLEX, (empty), , , , ,WITHOUT
COLOR 2, 16
4 MTAB02 TAPE,PROTECTION MTAB0333101 COMPLEX, (empty), , , , ,WITHOUT
COLOR 65
4 MTAC01 TAPE,SHIELD MTAC0091301 COMPLEX, (empty), , , , ,WITHOUT
COLOR 60
4 MWAC01 WINDOW,LCD MWAC0114501 CUTTING, Tempered Glass, , , , , BLACK 1
3 GMEY SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOKWITHOUT
COLOR E, 24
3 MLAA00 LABEL,APPROVAL MLAA0062304 COMPLEX, (empty), , , , ,WITHOUT
COLOR
5 AFBA00 FRAME ASSY,SHIELD AFBA0012001 BLACK
6 MFEA00 FRAME,SHIELD MFEA0027701 MOLD, PC LUPOY SC-1004A, , , , , BLACK 38
6 MPBU00 PAD,CONNECTOR MPBU0063301 COMPLEX, (empty), , , , , BLACK 37
6 MTAF00 TAPE,MOTOR MTAF0025201 COMPLEX, (empty), , , , , BLACK
5 AFBA01 FRAME ASSY,SHIELD AFBA0013901 GT505 SHIELD CAN COVER ASSYWITHOUT
COLOR
6 MCBA00 CAN,SHIELD MCBA0043301 PRESS, STS, , , , ,WITHOUT
COLOR 34
6 MGAD00 GASKET,SHIELD FORM MGAD0200401 COMPLEX, (empty), , , , ,WITHOUT
COLOR
7 MPBU00 PAD,CONNECTOR MPBU0063201 COMPLEX, (empty), , , , ,WITHOUT
COLOR 50
7 MPBU01 PAD,CONNECTOR MPBU0063401 COMPLEX, (empty), , , , , BLACK
7 MTAC00 TAPE,SHIELD MTAC0087801 COMPLEX, (empty), , , , , BLACK
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 ArrayWITHOUT
COLOR
- 217 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
1 IMT,BAR/FLIP TIMT0005201 BLACK
4 SNGF00 ANTENNA,GSM,FIXED SNGF0046101 3.0 ,-2.0 dBd, ,GPS, FPCB ,; ,SINGLE ,-2.0 ,50 ,3.0
4 SNGF01 ANTENNA,GSM,FIXED SNGF0046203 3.0 ,-2.0 dBd, ,GSM850/GSM900/DCS/PCS/Band1/Band8,INTERNAL ,; ,MULTI ,-2.0 ,50 ,3.0
4 SACY00 PCB ASSY,FLEXIBLE SACY0090901
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0083501
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM SACC0058701
7 C900 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C901 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C913 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 R904 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
7 R910 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP SACD0071701
7 CN400CONNECTOR,BOARD TOBOARD ENBY0018601 10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET
7 CN901CONNECTOR,BOARD TOBOARD ENBY0040201 34 PIN,0.4 mm,ETC , ,H=1.0, Plug
7 U901 CAMERA SVCY0019901 CMOS ,VGA ,Toshiba(1/10"), 4x4x2.23t, Reflow Type
6 SPCY00 PCB,FLEXIBLE SPCY0175001 POLYI ,0.3 mm,MULTI-3 , ,; , , , , , , , , ,
4 SACY01 PCB ASSY,FLEXIBLE SACY0091001
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0083601
6 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM SACC0059001
7 CN1CONNECTOR,BOARD TOBOARD ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket
6 SACD00PCB ASSY,FLEXIBLE,SMTTOP SACD0071801
7 C1000 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
7 C1002 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
- 218 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
7 CN2CONNECTOR,BOARD TOBOARD ENBY0042001
50 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,MALE ,SMD ,P/TR , ,
7 D1000 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
7 LD1000 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 LD1001 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 LD1002 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 LD1003 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)
7 MIC100 MICROPHONE SUMY0010609UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI,[empty] , ,[empty]
7 R123 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R3 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 R4 INDUCTOR,CHIP ELCH0004726 1.5 nH,J ,1005 ,R/TP ,
7 R6 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
7 SW1000 SWITCH,TACT ESCY000610115 V,20 mA,HORIZONTAL ,1 G, ,; ,1C1P ,[empty] ,[empty],[empty] , ,[empty]
7 SW1001 CONN,RF SWITCH ENWY0003901 ,SMD , dB,
6 SPCY PCB,FLEXIBLE SPCY0174901 POLYI ,0.3 mm,MULTI-3 , ,; , , , , , , , , ,
4 SUSY00 SPEAKER SUSY0027506 ASSY ,8 ohm,90 dB,1812 mm,10mm ,; , , , , , , ,[empty]
4 SVLM00 LCD MODULE SVLM0035301Main ,3.0 inch ,240*400 ,74.9*44.88*2.0t ,262K ,TFT ,TM,NEC(uPD161710) , ,
4 SWCC00 CABLE,COAXIAL SWCC000650165 mm, LINE, ,; ,[empty] ,[empty] ,[empty] , ,[empty] ,,[empty]
3 SAFY00 PCB ASSY,MAIN SAFY0316001
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0103801
5 BRAH00 RESIN,PC BRAH0001301 ; , , , ,[empty] Black
5 SACY00 PCB ASSY,FLEXIBLE SACY0090801
6 SACB00PCBASSY,FLEXIBLE,INSERT SACB0056001
6 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0083401
7 SACC00PCB ASSY,FLEXIBLE,SMTBOTTOM SACC0058601
8 ANT780 ANTENNA,GSM,FIXED SNGF00465013.0 ,-2.0 dBd, ,BLUETOOTH, SMD, 3.2*1.6*1.2 ,; ,SINGLE,-2.0 ,50 ,3.0
- 219 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
8 BAT800 BATTERY,CELL,LITHIUM SBCL00017012 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi4.8, Pb-Free
8 C700 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 C701 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C702 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
8 C705 CAP,CERAMIC,CHIP ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
8 C706 CAP,CERAMIC,CHIP ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
8 C707 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C710 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C711 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C712 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C713 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C714 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C715 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C716 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C717 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C718 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C719 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C720 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C721 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C722 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C723 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C724 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C730 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C731 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
8 C732 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C733 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C734 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C735 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
- 220 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
8 C736 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C737 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C738 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C739 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C740 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
8 C741 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
8 C742 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
8 C743 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP
8 C750 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C751 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C752 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C753 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C754 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C755 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
8 C756 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
8 C758 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
8 C759 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C760 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C761 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C762 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C763 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C764 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C765 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C766 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C770 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C771 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C772 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C800 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
8 C801 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
8 C802 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
- 221 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
8 C803 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C804 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C805 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C807 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 CN750 CONNECTOR,ETC ENZY0018801 PIN, mm,ETC , ,RCS=1.35
8 CN751 CONNECTOR,ETC ENZY0018801 PIN, mm,ETC , ,RCS=1.35
8 CN800CONNECTOR,BOARD TOBOARD ENBY0045401
60 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,MALE ,SMD ,[empty] , ,
8 FB710 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
8 FB711 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
8 FB730 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 ,
8 FL700 FILTER,SEPERATOR,SPDT SFAC0002101800 , MHz,0.3 dB,30 dB,25000 , MHz,0.3 dB,32 dB,SMD,ETC ,2.5x2.5x0.75
8 FL730 FILTER,SAW SFSY0027301 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW
8 J800 CONN,SOCKET ENSY0018101 6 PIN,ETC , ,2.54 mm,H=1.5
8 L750 INDUCTOR,CHIP ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
8 L770 INDUCTOR,CHIP ELCH0005001 2.2 nH,S ,1005 ,R/TP ,
8 L771 INDUCTOR,CHIP ELCH0001041 10 nH,J ,1005 ,R/TP ,PBFREE
8 L772 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
8 L800 INDUCTOR,SMD,POWER ELCP00080091 uH,N ,2.5x2.0x1.2 ,R/TP ,MLCI,power inductor ,; ,1uH,30% ,; ,; ,; ,; ,; ,[empty] ,2.5X2MM ,[empty] ,[empty],Inductor,Wire Wound,Chip
8 LD800 DIODE,LED,MODULE EDLM0009401 WHITE ,1 LED,3.5X2.8X0.6T ,R/TP ,
8 M710 MODULE,ETC SMZY0022701 WiFi Module(Marvell8686), 8.2x8.4x1.0 ,; ,WLAN
8 R710 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R711 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R713 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R714 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R715 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R716 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R717 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP
8 R730 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
- 222 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
8 R731 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R732 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R734 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R735 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R737 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R738 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R739 RES,CHIP,MAKER ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
8 R740 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R741 RES,CHIP,MAKER ERHZ0000408 110 ohm,1/16W ,J ,1005 ,R/TP
8 R742 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R750 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R752 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
8 R753 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
8 R754 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R755 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R756 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R757 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R770 RES,CHIP,MAKER ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP
8 R772 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R780 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
8 R781 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R801 RES,CHIP,MAKER ERHZ0000238 200 Kohm,1/16W ,F ,1005 ,R/TP
8 R803 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
8 R805 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP
8 R806 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R807 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
8 R814 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP
8 U710 IC EUSY0367001DFN1612-4B ,4 ,R/TP ,300mA 3.3V LDO ,; ,IC,LDO VoltageRegulator
8 U711 IC EUSY0366901DFN1612-4B ,4 ,R/TP ,300mA 1.8V LDO ,; ,IC,LDO VoltageRegulator
- 223 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
8 U730 IC EUSY0245902 DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7
8 U731 IC EUSY0358701WFBGA ,100 PIN,R/TP ,Bluetooth+FM 5*7.5*0.8 ,;,IC,Bluetooth
8 U750 IC EUSY0149403SOT553-5 ,5 ,R/TP ,1.6X1.6 , SINGLE,BUFFER,Non-inverting,3STATE,High active ,; ,IC,Buffer
8 U751 IC EUSY0380101 WLBGA ,81 ,R/TP ,Pb-free_GPS IC ,; ,IC,GPS
8 U752 IC EUSY0366901DFN1612-4B ,4 ,R/TP ,300mA 1.8V LDO ,; ,IC,LDO VoltageRegulator
8 U770 MODULE,ETC SMZY0016502 LNA Module(GPS LNA+B/P Filter) ,; ,RF Module
8 U800 IC EUSY0264502DFN ,14 PIN,R/TP ,700mA Boost converter ,; ,IC,DC,DCConverter
8 VA800 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
8 VA801 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
8 VA802 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
8 VA806 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
8 VA807 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
8 X750 TCXO EXST000200116.369 MHz,0.5 PPM,10 pF,SMD ,25X20X0.8 ,Sirf GPSchip clock, 16.369MHz, 1.7~3.5V, Pb-Free ,; ,16.369MHz,[empty] ,1.8V , , , , ,SMD ,R/TP
7 SPCY PCB,FLEXIBLE SPCY0171401 POLYI ,0.33 mm,BUILD-UP 4 , ,; , , , , , , , , ,
5 SJMY00 VIBRATOR,MOTOR SJMY0007112 2 V,40 mA,10*3.0 ,Quick response 17mm ,; ,3V , , , , , , ,
5 SVCY00 CAMERA SVCY0017301CMOS ,MEGA ,5M AF [FPCB, Sony 5M 1/3.2"(IMX034),CCP2]
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0229201
5 SAFC00PCB ASSY,MAIN,SMTBOTTOM SAFC0125301
6 C125 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C200 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C201 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C202 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C203 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C204 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C205 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C206 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 224 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C207 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C208 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C209 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C210 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C211 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C212 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C213 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C214 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C215 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C216 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C217 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C218 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C219 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C220 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C221 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C222 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C223 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C224 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C225 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C226 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C227 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C228 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C229 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C230 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C231 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C232 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C233 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C234 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C235 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C236 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
- 225 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C237 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C238 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C239 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C240 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C241 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C300 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C301 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C302 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C303 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C304 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C305 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C306 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C307 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C308 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C309 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C310 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C311 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C312 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C314 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C315 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C317 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C318 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C319 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C320 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C321 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C323 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C325 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C326 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C327 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
- 226 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C328 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C329 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C330 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C331 CAP,TANTAL,CHIP ECTH000520333 uF,10V ,M ,STD ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6 C332 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C333 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C334 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C335 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C336 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C337 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C338 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C339 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C340 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6 C341 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP
6 C342 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C343 CAP,CHIP,MAKER ECZH0001102 18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
6 C344 CAP,CHIP,MAKER ECZH0001102 18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
6 C345 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C346 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C347 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C348 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C349 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C352 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C353 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C354 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C500 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C501 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
6 C503 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C504 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 227 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C505 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C506 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C507 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C508 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C509 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
6 C510 CAP,CERAMIC,CHIP ECCH00003911000000 pF,50V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
6 C511 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C512 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C513 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C514 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C515 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C516 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C517 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C523 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C525 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C601 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C602 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C603 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C604 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C605 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C607 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C621 CAP,CERAMIC,CHIP ECCH0000133 220 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 C622 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C625 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C626 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
6 C631 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C632 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C633 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C634 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
- 228 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C635 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 CN300 CONNECTOR,ETC ENZY0023701 3 ,2.5 mm,ETC ,- ,-
6 CN500 BRACKET MBFZ0033201 PRESS, STS, , , , , Silver
6 CN501 CONNECTOR,I/O ENRY00088015 , mm,ANGLE , , ,; , ,0.64MM ,ANGLE ,[empty] ,DIP,[empty] ,
6 CN503CONNECTOR,BOARD TOBOARD ENBY0040301 34 PIN,0.4 mm,ETC , ,H=1.0, Socket
6 CN601CONNECTOR,BOARD TOBOARD ENBY0045501
60 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT,FEMALE ,SMD ,[empty] , ,
6 CN603CONNECTOR,BOARD TOBOARD ENBY0034201 24 PIN,0.4 mm,ETC , ,GB042 H=1.0, Socket
6 CN604CONNECTOR,BOARD TOBOARD ENBY0041901
50 PIN,0.4 mm,STRAIGHT , ,H=1.0,SOCKET ,; , ,0.40MM,STRAIGHT ,FEMALE ,SMD ,P/TR , ,
6 D300 DIODE,SWITCHING EDSY0011901EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,IR=30uA(VR=10V)
6 D301 DIODE,SWITCHING EDSY0018401TUMD2 ,30 V,1 A,R/TP , ,; ,1A ,30V , ,5A , , ,[empty] ,[empty],2P ,1
6 D302 DIODE,SWITCHING EDSY0014001 SMT ,20 V,200 A,R/TP ,
6 D600 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 D603 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 FB300 FILTER,BEAD,CHIP SFBH0002302 120 ohm,1608 ,CHIP BEAD, 2000mA
6 FB500 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB501 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB502 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB601 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead
6 FB602 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead
6 FB604 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FB605 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
6 FL500 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER
6 FL600 FILTER,EMI/POWER SFEY0013101 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm
6 FL601 FILTER,EMI/POWER SFEY0013101 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm
6 FL602 FILTER,EMI/POWER SFEY0013101 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 50ohm
6 FL603 FILTER,EMI/POWER SFEY0015601 SMD ,Pb-free_Common mode filter ,; ,Filter,LCR
6 L102 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
- 229 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 L300 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP ,
6 L500 INDUCTOR,CHIP ELCH0004202 82 nH,J ,1608 ,R/TP ,
6 L600 INDUCTOR,CHIP ELCH0004722 47 nH,J ,1005 ,R/TP ,
6 Q300 TR,FET,P-CHANNEL EQFP0009101SC70-6 ,6.5 W,-20 V,-4.5 A,R/TP ,P channel FET ,; ,P-CHANNEL ,MOSFET ,-20 ,8 ,-4.5 ,0.153 ,6.5 ,SC70 ,R/TP,6P
6 Q501 TR,BJT,NPN EQBN0007601 SOT-23 ,0.15 W,R/TP ,EMT3
6 R200 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
6 R202 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R203 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R204 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R205 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R206 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R207 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R208 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R211 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R212 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R213 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R214 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R215PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R216PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R295PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R299 PCB ASSY,MAIN,PAD OPEN SAFO0000401 0OHM DNI
6 R300 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
6 R301 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R304PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R305PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R306PCB ASSY,MAIN,PADSHORT SAFP0000501
- 230 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R308PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R310PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R311 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
6 R312PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R313 RES,CHIP ERHY0000193 27 ohm,1/16W ,F ,1005 ,R/TP
6 R314PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R316 RES,CHIP,MAKER ERHZ0003901 0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012 ,R/TP
6 R317 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 R319 RES,CHIP,MAKER ERHZ0000449 24 Kohm,1/16W ,J ,1005 ,R/TP
6 R320 RES,CHIP,MAKER ERHZ0000265 300 Kohm,1/16W ,F ,1005 ,R/TP
6 R321 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R322 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP
6 R323 RES,CHIP ERHY0000181 15 ohm,1/16W ,F ,1005 ,R/TP
6 R324 RES,CHIP ERHY0017201 0.025 ohm,1/4W ,F ,2012 ,R/TP
6 R500 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R501PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R502PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R503PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R504 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R505 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R506 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R509 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R510 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
6 R511 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
6 R600PCB ASSY,MAIN,PADSHORT SAFP0000501
- 231 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R601PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R603 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R604 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R607 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R609 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP
6 R610 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R620PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R621PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R622 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R626 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R627 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R628 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
6 R629PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R630 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R631PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R638PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R639PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R641PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R643 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R644 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R653PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R654PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R655PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R657 PCB ASSY,MAIN,PAD OPEN SAFO0000501 0OHM_1005_DNI
- 232 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R658 PCB ASSY,MAIN,PAD OPEN SAFO0000501 0OHM_1005_DNI
6 SW100 CONN,RF SWITCH ENWY0005301,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER,SMD ,R/TP ,AU , ,
6 SW101 CONN,RF SWITCH ENWY0003901 ,SMD , dB,
6 U200 IC EUSY0316508FBGA ,107 ,ETC ,FULLY 1.8V 2G(LB/256Mx8)NAND+1G(2CS/16Mx4x16) SDRAM ,; ,IC,MCP
6 U201 IC EUSY0363001BGA ,323 ,R/TP ,HSDPA Digital Baseband ,; ,IC,DigitalBaseband Processor
6 U300 IC EUSY0331701 BGA ,196 PIN,R/TP ,8x8 EMP U360 ABB
6 U301 IC EUSY0360201CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,;,IC,Audio Sub System
6 U500 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP
6 U501 IC EUSY0371201WLP ,20 ,R/TP ,MUIC for 5Pin Micro USB ,; ,IC,AnalogSwitch
6 U502 IC EUSY0320201 TFBGA ,36 PIN,R/TP ,USB2.0 Transceiver, 3.5X3.5X0.8
6 U600 IC EUSY0319001 WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO
6 U604 IC EUSY0336502 , PIN,R/TP , ,; ,IC,Charge Pump
6 VA300 VARISTOR SEVY0003601 5.6 V, ,SMD ,100pF, 1005
6 VA301 VARISTOR SEVY0003601 5.6 V, ,SMD ,100pF, 1005
6 VA500 VARISTOR SEVY0007301 5 V,<0.5pF ,SMD ,
6 VA600 VARISTOR SEVY000880114 V, ,SMD ,2012055, LC 10uA, 0.5pF@1MHz, IL0.05@2GHz, Rt 1ns ,; ,14 , , ,2.0*1.2*0.55 ,[empty] ,SMD,R/TP
6 VA601 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 VA603 VARISTOR SEVY0004201 14 V, ,SMD ,120pF, 1005
6 X300 X-TAL EXXY002430132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 ,-40'C ~ +85'C, C0 1.05pF, C1 fF ,; ,32.768 ,20PPM ,12.5 , ,,SMD ,R/TP
6 ZD500 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,
6 ZD600 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 ZD601 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 ZD602 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4
6 ZD604 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4
6 ZD605 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
- 233 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 ZD606 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
5 SAFD01 PCB ASSY,MAIN,SMT TOP SAFD0123001
6 C100 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C101 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C102 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C103 CAP,CHIP,MAKER ECZH0004402100000 pF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
6 C104 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C105 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C106 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP
6 C107 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C108 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C109 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
6 C110 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C111 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C113 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C114 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C115 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C116 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C119 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C124 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP ,
6 C129 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C130 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C134 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C139 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C140 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C145 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C146 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C147 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
- 234 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C148 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C149 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C150 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C152 INDUCTOR,CHIP ELCH0001049 6.8 nH,J ,1005 ,R/TP ,PBFREE
6 C153 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C154 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C155 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C157 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C158 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C159 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C160 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C162 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C163 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C164 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
6 C166 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C167 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C168 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C170 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C171 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C172 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C173 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6 C174 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
6 C175 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C176 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
6 C177 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C178 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C179 INDUCTOR,CHIP ELCH0001048 10 nH,J ,1005 ,R/TP ,PBFREE
6 C180 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C182 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 235 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C183 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 C400 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6 C401 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C403 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
6 C404 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C406 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C407 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C408 CAP,CERAMIC,CHIP ECCH000560410000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
6 C409 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C410 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C411 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C412 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C413 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C414 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C606 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C608 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C609 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C610 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(No X7R),[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
6 C611 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C612 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C613 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C614 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C615 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C616 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C617 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C618 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C619 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C620 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C623 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 236 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 C624 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
6 C627 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C628 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C629 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C630 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6 C638 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6 CN198 CONNECTOR,ETC ENZY0018801 PIN, mm,ETC , ,RCS=1.35
6 D200 DIODE,SWITCHING EDSY0018101VMN2 ,30 V,100 mA,R/TP ,1.0x0.6 ,; , , , , , , ,[empty],[empty] ,2P ,1
6 D601 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 D602 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
6 FB100 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP
6 FB600 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead
6 FB603 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead
6 FL100 DUPLEXER,IMT SDMY0001901
1950 MHz,2140 MHz,1.8 dB,2.4 dB,52 dB,43dB,2.5*2.0*0.55 ,SMD ,Band1, 2520size, SAW, Rx unbal ,;,2140 ,2110 to 2170 ,1950 ,1920 to 1980 ,2.4 ,1.8,2.5x2.0x0.55 ,DUAL ,SMD ,R/TP
6 FL102 DUPLEXER,IMT SDMY0002001
897.5 MHz,942.5 MHz,3.1 dB,3.5 dB,52 dB,45dB,2.5*2.0*0.5 ,SMD ,SAW, Band8, Rx unbal ,; ,942.5,927.4 to 957.6 ,897.5 ,882.4 to 912.6 ,3.5 ,3.1 ,2.5x2.0x0.5,DUAL ,SMD ,R/TP
6 FL103 FILTER,SAW,DUAL SFSB0001901
1842.5 MHz,75 MHz,2.6 dB,12 dB,1960 MHz,60 MHz,2.6dB,12 dB,1.8*1.35*0.5 ,SMD,1805M~1880M,1930M~1990M,10p,U,50,50,LH,DCS+PCSRx ,; , ,1.8*1.35*0.5 ,SMD ,R/TP
6 FL104 FILTER,SAW,DUAL SFSB0001801
881.5 MHz,25 MHz,2.6 dB,30 dB,942.5 MHz,35 MHz,2.6dB,25 dB,1.8*1.35*0.5 ,SMD,869M~894M,925M~960M,10p,U,50,50,LH,GSM850+EGSM Rx ,; , ,1.8*1.35*0.5 ,SMD ,R/TP
6 FL105 FILTER,SAW SFSY0037501897.5 MHz,1.4*1.1*0.6 ,SMD ,880.48M~914.52M, IL 4.0,5pin, U-U, 50-50, W-BAND VIII Tx ,; ,897.5 ,1.4*1.1*0.6,SMD ,R/TP
6 FL106 FILTER,SAW SFSY0028101 1950 MHz,1.4*1.1*0.6 ,SMD ,1920M~1980M, IL 2.9, 5pin,U-U, 50-50, W-BAND I Tx , ,1950 ,1.4*1.1*0.6 ,SMD ,R/TP
6 FL501 IC EUSY0269001CSP ,20 PIN,R/TP ,ESD protection & Filtering for analogsignals, Pb-free
6 L100 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
6 L103 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,
- 237 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 L104 INDUCTOR,CHIP ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip
6 L106 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
6 L108 INDUCTOR,SMD,POWER ELCP0008003 3.3 uH,M ,2.5*2.0*1.0 ,R/TP ,Chip power
6 L110 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,
6 L113 INDUCTOR,CHIP ELCH0001041 10 nH,J ,1005 ,R/TP ,PBFREE
6 L115 INDUCTOR,CHIP ELCH0004718 5.6 nH,S ,1005 ,R/TP ,
6 L116 INDUCTOR,CHIP ELCH0004716 39 nH,J ,1005 ,R/TP ,
6 L118 INDUCTOR,CHIP ELCH0001048 10 nH,J ,1005 ,R/TP ,PBFREE
6 L119 CAP,CERAMIC,CHIP ECCH0000183 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 L601 INDUCTOR,CHIP ELCH0004709 3.3 nH,S ,1005 ,R/TP ,
6 PT100 THERMISTOR SETY0007101 NTC ,4700 ohm,SMD ,1005 J B:3500K
6 Q200 TR,BJT,NPN EQBN0012401 ESM ,100 mW,R/TP ,NPN TRANSISTOR
6 R101PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R102 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
6 R103 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
6 R104 RES,CHIP,MAKER ERHZ0000509 75 ohm,1/16W ,J ,1005 ,R/TP
6 R105PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R107 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R109 RES,CHIP,MAKER ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP
6 R111PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R112PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R114PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R115PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R116 PCB ASSY,MAIN,PAD OPEN SAFO0000501 0OHM_1005_DNI
6 R118PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R120 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP
- 238 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R121 RES,CHIP,MAKER ERHZ0000495 56 ohm,1/16W ,J ,1005 ,R/TP
6 R123 RES,CHIP,MAKER ERHZ0000496 560 ohm,1/16W ,J ,1005 ,R/TP
6 R124 RES,CHIP ERHY0000170 390 ohm,1/16W ,F ,1005 ,R/TP
6 R125 INDUCTOR,CHIP ELCH0004733 4.3 nH,S ,1005 ,R/TP ,Coil
6 R126PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R128 INDUCTOR,CHIP ELCH0001057 3.9 nH,S ,1005 ,R/TP ,PBFREE
6 R129 RES,CHIP,MAKER ERHZ0000451 27 ohm,1/16W ,J ,1005 ,R/TP
6 R130PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R131 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP
6 R132 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP
6 R133PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R134 RES,CHIP,MAKER ERHZ0000451 27 ohm,1/16W ,J ,1005 ,R/TP
6 R135 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP
6 R136 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP
6 R137 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP
6 R140PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R142 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
6 R143 RES,CHIP,MAKER ERHZ0000496 560 ohm,1/16W ,J ,1005 ,R/TP
6 R144PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R146 RES,CHIP,MAKER ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP
6 R147PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R151PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R152PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R156PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R157PCB ASSY,MAIN,PADSHORT SAFP0000501
- 239 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R161PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R162PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R165PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R166PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R209 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R210 RES,CHIP,MAKER ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
6 R302PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R303PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R307PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R309PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R402 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
6 R408 RES,CHIP,MAKER ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP
6 R409 RES,CHIP,MAKER ERHZ0000474 390 ohm,1/16W ,J ,1005 ,R/TP
6 R411 RES,CHIP,MAKER ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP
6 R412 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
6 R413 RES,CHIP,MAKER ERHZ0000236 2000 ohm,1/16W ,F ,1005 ,R/TP
6 R414 RES,CHIP,MAKER ERHZ0000229 1800 ohm,1/16W ,F ,1005 ,R/TP
6 R416 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
6 R419 RES,CHIP,MAKER ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP
6 R420PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R421 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
6 R422 RES,CHIP ERHY0003601 2700 ohm,1/16W ,J ,1005 ,R/TP
6 R423PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R425 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP
6 R426PCB ASSY,MAIN,PADSHORT SAFP0000501
- 240 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 R429 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R513 PCB ASSY,MAIN,PAD OPEN SAFO0000501 0OHM_1005_DNI
6 R515PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R517PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R518 PCB ASSY,MAIN,PAD OPEN SAFO0000501 0OHM_1005_DNI
6 R614 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
6 R616 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP
6 R617 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
6 R618 RES,CHIP ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP
6 R619 RES,CHIP ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP
6 R625 RES,CHIP,MAKER ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP
6 R632PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R633PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R634PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R635PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R637 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
6 R640PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R642PCB ASSY,MAIN,PADSHORT SAFP0000401
6 R645 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
6 R652PCB ASSY,MAIN,PADSHORT SAFP0000501
6 R656PCB ASSY,MAIN,PADSHORT SAFP0000401
6 RA400 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
6 S400 CONN,SOCKET ENSY0020901 8 PIN,STRAIGHT , , mm,
6 SC1 FRAME,SHIELD MFEA0027901 PRESS, STS, , , , , BLACK
6 SPFY PCB,MAIN SPFY0197201 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,
- 241 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 U100 IC EUSY0299401 ,6 PIN,R/TP ,0.3_2v
6 U101 RF MODULE,HANDSET SMRH0004901 MHz, MHz, ,Tx Module(ASM + PAM) - WCDMA TriMode
6 U102 PAM SMPY001860128 dBm, %, A, dBc, dB,3x3x1 ,SMD ,EMP U330 Band 1PAM ,; ,3.6 , , , , , , ,R/TP ,R/TP ,8
6 U103 COUPLER,RFDIRECTIONAL
SCDY000430120.5 dB,0.22 dB,34 dB,1.0*0.5*0.4 ,SMD,Pb_free_KPCS+USPCS+WCDMA ,; ,[empty] ,1865MHz,230MHz ,SMD ,R/TP
6 U106 COUPLER,RFDIRECTIONAL
SCDY000440119.4 dB,0.25 dB,32 dB,1.0*0.5*0.4 ,SMD ,Pb-free_DCN+JCDMA ,; ,[empty] ,874.5MHz ,101MHz ,SMD,R/TP
6 U107 PAM SMPY001850128 dBm, %, A, dBc, dB,3x3 ,SMD ,EMP U300 ,; , , , , , , ,,R/TP ,R/TP ,
6 U108 IC EUSY0245902 DRL ,5 PIN,R/TP ,SINGLE,BUFFER,3STATE,1.7X1.7
6 U109 IC EUSY0222103 MicroSMD ,8 PIN,R/TP ,DCDC for PAM 650mA, ~3.4V
6 U110 IC EUSY0365901DFN1612-4B ,4 ,R/TP ,300mA 2.8V LDO ,; ,IC,LDO VoltageRegulator
6 U111 IC EUSY0357401HVQFN ,56 PIN,R/TP ,GSM,EDGE,WCDMA Transceiver,7X7 mm. ,; ,IC,CMOS
6 U400 IC EUSY0349001 BGA ,8 PIN,R/TP ,Class AB SPK AMP ,; ,IC,Audio Amplifier
6 U401 IC EUSY03452013*3 QFN ,10 PIN,R/TP ,3xis Accelerometer ,; ,IC,A/DConverter
6 U402 IC EUSY0353801PLP1010-4 ,4 PIN,R/TP ,1x1 LDO, 3.3V , 150mA ,; ,IC,LDOVoltage Regulator
6 U403 IC EUSY0334202BGA ,20 PIN,R/TP ,Levelshifter,sdcard,6ch ,; ,IC,BusController
6 U404 IC EUSY0334201BGA ,12 PIN,R/TP ,4-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR (ZXU type)
6 U405 IC EUSY0337101CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/DConverter
6 U406 IC EUSY0355701PLP1010-4 ,4 PIN,R/TP ,150mA 2.8V Single LDO ,;,IC,Voltage Regulator
6 U601 IC EUSY0319001 WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO
6 U602 IC EUSY0321201 BGA ,64 PIN,R/TP ,6*6 ISP
6 U603 IC EUSY0319001 WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO
6 VA400 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA401 VARISTOR SEVY0003801 18 V, ,SMD ,
- 242 -LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
LevelLocation
No.Description Part Number Spec Color Remark
6 VA402 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA403 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA404 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA405 VARISTOR SEVY0003801 18 V, ,SMD ,
6 VA406 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005
6 VA602 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 X100 X-TAL EXXY002610126 MHz,10 PPM,14 pF,25 ohm,SMD ,32*25*0.6 ,EMPReference X-Tal, CF360, Pb-Free ,; ,26MHz ,10PPM ,14 , ,,SMD ,R/TP
6 ZD400 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 ZD401 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 ZD402 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 ZD403 DIODE,TVS EDTY0009401VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW,[empty] ,[empty] ,2P ,1
6 ZD603 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4
- 243 -Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
LevelLocation
No.Description Part Number Spec Color Remark
3 SBPL00 BATTERY PACK,LI-ION SBPL00987013.7 V,1000 mAh,1 CELL,PRISMATIC,553446,INNERPACK,WW ,; ,3.7 ,1000 ,200 ,PRISMATIC,5.5X34X46 ,6.1X47X36.5 ,BLACK ,INNERPACK ,
BLACK
BATTERY PACK,LI-ION SBPL00980013.7 V,1000 mAh,1 CELL,PRISMATIC ,553446, INNERPACK,; ,3.7 ,1000 ,200 ,PRISMATIC ,5.5X34X46 ,6.1X37X47,BLACK ,INNERPACK ,
3 SGDY00 DATA CABLE SGDY0014302; ,[empty] ,[empty] ,1.2M , ,BLACK ,1.2m, 4, Shield caseMicroUSB, ID resistor open ,N
3 SGEY00 EAR PHONE/EAR MIKE SET SGEY0003741
; ,RMS 20mW(0.56V,RMS) ,16Ohm+-2.4Ohm 1KHZ,116dB+-3dB 1KHZ,3mW ,116dB 1KHZ ,96dB 100HZ,[empty] ,BLACK ,5P MICRO USB CONNECTOR , MICROUSB 5P ,Earphone,Stereo
3 SSAD00 ADAPTOR,AC-DC SSAD0032901100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;,90Vac~264Vac ,4.75Vdc~5.25Vdc ,700mA ,5060 , ,WALL3P ,USB ,
ADAPTOR,AC-DC SSAD0032902100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;,90Vac~264Vac ,4.75Vdc~5.25Vdc ,700mA ,5060 , ,WALL2P ,USB ,
11.3 Accessory Note: This Chapter is used for reference, Part order is ordered
Recommended