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Microprocessor
Lecture 1: 마이크로프로세서 소개 및 설명
Hong Jong-Phil
School of Electrical Engineering
Chungbuk National University
1
Course Administration
2
담당교수 : 홍종필 jphong@chungbuk.ac.kr
교수연구실 : 46-362
수업자료 : http://icat.cbnu.ac.kr
학점 : :20%
:10%
:40%
:30%
출석 및 태도
설계레포트
기말시험
프로젝트
프로젝트 제안서
작품시현 및 발표
:10%
:20%
3
Course Contents
주차 내용 주차 내용
1주 마이크로 프로세서 강의 소개 8주 제11장 시리얼 인터페이스
2주
HBE-AVR-ISP v3.0(MK ll) 설치
제1장 AVR 마이크로컨트롤러
제2장 AVR 마이크로컨트롤러 개발환경
제3장 GPIO 입출력 제어
9주 제12장 AD 컨버터, DA 컨버터
3주
제4장 Internal Memory의 이해
제5장 외부 인터럽트
작품초안, 재료 리스트 보고서 제출
10주제13장 Buck 컨버터 제어
제14장 Boost 컨버터 제어
4주 제6장 TC를 이용한 타이머 11주 제15장 인버터의 구형파 제어
5주제7장 TC를 이용한 PWM
제8장 TC를 이용한 외부 입력 받기12주 제16장 인버터의 PWM 제어
6주제9장 UART 통신
제10장 외부메모리 인터페이스13주 과제 발표 및 시현 (1조당 20분)
7주과제 중간 발표
추가 재료 구매
14주 과제 발표 및 시현 (1조당 20분)
15주 기말시험
The Computer Revolution
• Progress in computer technology
– Underpinned by Moore’s Law
• Makes novel applications feasible
– Computers in automobiles
– Cell phones
– Human genome project
– World Wide Web
– Search Engines
• Computers are pervasive
4
Classes of Computers
• Desktop computers
– General purpose, variety of software
– Subject to cost/performance tradeoff
• Server computers
– Network based
– High capacity, performance, reliability
– Range from small servers to building sized
• Embedded computers
– Hidden as components of systems
– Stringent power/performance/cost constraints
5
Growth in Cell Phone Sales (Embedded)
From 2012, Mobile SOC (Smartphone) > PC (Notebook +Desktop)
* IDL (Gartner, Morgan Stanley Research estimates]
6
Where else are embedded processors found?
Below Your Program
• Application software
– Written in high-level language
• System software
– Compiler: translates HLL code to
machine code
– Operating System: service code
• Handling input/output
• Managing memory and storage
• Scheduling tasks & sharing resources
• Hardware
– Processor, memory, I/O controllers
7
Levels of Program Code
• High-level language program (in C)swap (int v[], int k)
(int temp;
temp = v[k];
v[k] = v[k+1];
v[k+1] = temp;
)
• Assembly language program (for MIPS)swap: sll $2, $5, 2
add $2, $4, $2
lw $15, 0($2)
lw $16, 4($2)
sw $16, 0($2)
sw $15, 4($2)
jr $31
• Machine (object, binary) code (for MIPS)000000 00000 00101 0001000010000000000000 00100 00010 0001000000100000
. . .
C compiler
assembler
one-to-many
one-to-one
8
Components of a Computer
Same components for
all kinds of computer
Desktop, server,
embedded
Input/output includes
User-interface devices
Display, keyboard, mouse
Storage devices
Hard disk, CD/DVD, flash
Network adapters
For communicating with
other computers
9
Inside the Processor (CPU)
Datapath: performs operations on data
Control: sequences datapath, memory, ...
Cache memory
Small fast SRAM memory for immediate
access to data
10
Anatomy of a Computer
Output
device
Input
device
Input
device
Network
cable
11
Opening the Box
12
AMD’s Barcelona Multicore Chip
Core 1 Core 2
Core 3 Core 4
Northbridge
512K
B L
2
512K
B L
2
51
2K
B L
2
51
2K
B L
2
2M
B s
hare
d L
3 C
ach
e
Four out-of-order cores on one chip
1.9 GHz clock rate
65nm technology
Three levels of caches (L1, L2, L3) on chip
Integrated Northbridge
13
A Safe Place for Data
Volatile main memory
Loses instructions and data when power off
Non-volatile secondary memory
Magnetic disk
Flash memory
Optical disk (CDROM, DVD)
14
Networks
Communication and resource sharing
Local area network (LAN): Ethernet
Within a building
Wide area network (WAN: the Internet
Wireless network: WiFi, Bluetooth
15
Abstractions
Abstraction helps us deal with complexity
Hide lower-level detail
Instruction set architecture (ISA)
The hardware/software interface
Application binary interface
The ISA plus system software interface
Implementation
The details underlying and interface
16
Technology Scaling Road Map (ITRS)
Year 2004 2006 2008 2010 2012
Feature size (nm) 90 65 45 32 22
Intg. Capacity (BT) 2 4 6 16 32
Fun facts about 45nm transistors
30 million can fit on the head of a pin
You could fit more than 2,000 across the width of a human hair
If car prices had fallen at the same rate as the price of a single transistor has since 1968, a new car today would cost about 1 cent
17
Technology Trends
Electronics
technology
continues to evolve
Increased capacity
and performance
Reduced cost
Year Technology Relative performance/cost
1951 Vacuum tube 1
1965 Transistor 35
1975 Integrated circuit (IC) 900
1995 Very large scale IC (VLSI) 2,400,000
2005 Ultra large scale IC 6,200,000,000
DRAM capacity
18
Power Trends
In CMOS IC technology
FrequencyVoltageload CapacitivePower 2
×1000×30 5V → 1V
19
Uniprocessor Performance
Constrained by power, instruction-level parallelism,
memory latency20
Multiprocessors
▪ The power challenge has forced a change in the design
of microprocessors
▪ Multicore microprocessors
– More than one processor per chip
Product AMD Barc
elona
Intel Nehale
m
IBM Power 6 Sun Niagara
2
Cores per chip 4 4 2 8
Clock rate 2.5 GHz ~2.5 GHz? 4.7 GHz 1.4 GHz
Power 120 W ~100 W? ~100 W? 94 W
▪ Hard to do
Programming for performance
Load balancing
Optimizing communication and synchronization21
Manufacturing ICs
Yield: proportion of working dies per wafer
22
23
AMD Opteron X2 Wafer
• X2: 300mm wafer, 117 chips, 90nm technology
• X4: 45nm technology
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