Introduction to Semiconductor Industry & Experiences Sharingpre.tir.tw/099/FJU/May29.pdf ·...

Confidential

Introduction to Semiconductor

Industry & Experiences Sharing

S R Sheu

VP of Engineering Services, UMC

May 29, 2018

Confidential 2

Outline:

1. History & Prospect of Semiconductor Industry

2. Semiconductor Applications

3. Semiconductor Supply Chain Eco-System

4. Introduction to UMC

5. Working Experience Sharing & Suggestions

6. Q&A

2

History of Human Civilization

Stone Age Bronze Age

Iron Age

Silicon Age

Machine Age

Source: M. Sze

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(IC Chronology)

1823

Silicon was Discovered

1904

Diode Vacuum Tube was Invented

1947

Bipolar Transistor was Invented

1958 發明積體電路

Integrated Circuit was Invented

1959 發展小型積體電路

SSI was Developed(RTL)

1964 P

P MOS IC was Developed

1967 TTL ,

TTL MSI and C MOS IC were Introduced

1968 P

P MOS LSI was Introduced By Intel

1979 64K DRAM ( VLSI )

64K DRAM was Introduced By IBM

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First Transistor: Point Contact Transistor

• 1st Transistor

(Ge) was

invented by:

William Shockley,

Walter Brattain &

John Bardeen (1947)

Award: Nobel Prize in 1956

~ 50 µm

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First IC

6

• First IC by Jack Kilby (Feb, 1958) at TI

1 transistor, 1 capacitor and 3 resistors on Ge bar. Awards: Nobel Prize in Physics (2000)

U.S. Patent 3,138,743

"Miniaturized Electronic Circuits",

the first integrated circuit, was filed

on February 6, 1959

From Wikipedia, the free

encyclopedia

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First Monolithic Silicon IC Chip

7

• First planar commercial IC made on Si by Robert

Noyce (1961) at Fairchild Company

For NASA and camera control.

10mm silicon wafer

4 transistors:

From Wikipedia

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The Integrated Circuit

P. 8

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IC v.s. Wafer

P. 9

Die

Wafer (42 millions transistors)

Wafer Diameter: 2 inch -> 4 inch/ 5 inch -> 6 inch -> 8 inch -> 12 inch ->..

Yield Model: Bose-Einstein Model, Murphy’s, Poison’s… for Defect

Density & Yield prediction

The Growth of Single Crystal Silicon

Seed Holder

-

Silicon Seed

(100), (111)..

Ingot

Melt

Silica Crucible

Czochralski Process:

* Floating Zone Process for Higher Resistance

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12

2” , 4” , 6” , 8” Wafer

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12” Wafer

Confidential 13

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IC Integration level

14

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Moore's law

15

Moore's law: Intel

Founder: Gordon

Moore: Integrated

Circuit 上可容納的Transistor 數目，約每隔兩年便會增加一倍；經常被參照的「18個月」，是由英特爾 CEO

David House所說：預計18個月會將晶片的效能提高一倍（即更多的電晶體使其更快）。[1]

L=5nm

L=5000 nm

From Wikipedia, the free encyclopedia

Shrinkage

Confidential 16

IC Design:

CMOS Inverter

Metal 1, AlCu

P-Epi P-Wafer

N-Well P-Well

PMD

p + p + n + n +

W

Metal 1 Contact

P-well N-well Polycide gate and local

interconnection

N-channel active region

N-channel S/D

P-channel active region

P-channel S/D

Shallow trench isolation (STI)

Vss

Vdd

NMOS PMOS

Vin

Vout

STI

• Schematics

Inverter

• Layout

IC Device Structure

• Cross-

section

L: Channel Length

Confidential 17

P. 17

Brief Process Flow - First Layer (Diffusion)

P-sub

(Silicon wafer)

SiN (Nitrid)

Pad oxide

1.1. Wafer Start

1.2. PAD Oxidation (stress buffer)

1.7. SiN (Nitrid) Deposition

1.8. Diffusion Lithography :

1.8.1 P.R. coating

1.8.2 Lithographic Exposure

1.8.3 Development

Photo Resistor coating

Diffusion mask Lithographic Exposure

Diffusion P.R.

P-sub

(Silicon wafer)

SiN (Nitrid)

Pad oxide

P. 18

Diffusion P.R.

P-sub

(Silicon wafer)

SiN (Nitrid)

Pad oxide STI STI

Brief Process Flow - First Layer (Diffusion)

1.7. Trench (STI) Plasma Etching

1.7.1 SiN Etching

1.7.2 Silicon Etching

1.8. Photo Resistor remove

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P. 19

Brief Process Flow - Backend Flow (Aluminum line)

P-sub

NWELL STI

PWELL

Poly PR coating

Poly Mask NLDD

N-LDD

N-PKT N-LDD

N-PKT

P-LDD PR

P-LDD P-PKT

N+ PR

N+ N+

P+ PR

P+

SAB

PSG

USG

PR Coating

Contact Mask

PR coating Contact PR Metal 1

Contact plug

PR Coating

Metal 1 mask

Metal 1 PR

Metal 1

HDP-1

PEOX

Cap Oxide

PR Coating

MVIA1 mask

MVIA1 PR Metal 2 Stepper Exposure

Stepper Exposure

12. IMD deposition

12.1 HDP-Oxide deposition

( Gap filling)

12.2 PE-Oxide Deposition

( Planarization and uniformity)

12.3 IMD CMP

12.4 Cap PE-Oxide

13. MVIA plug formation

13.1 MVIA Lithography cycle

13.2 MVIA Etching and PR strip

13.3 Glue Layer deposition

(Ti + TiN for plug adhesion)

13.4 WCVD filling

13.5 WCMP

13.6 Metal Liner deposition

(Ti + TiN for Metal adhesion)

13.7 Metal Sputter

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Applications with New Innovations

Every 2 yrs: Feature size 0.7x shrinkage, Area ~50% scale-down

New technology for device performance and power

Technology Challenges & Opportunities

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Scanner machine type (Light source / l )

Pro

cess ge

ne

ration

Immersion Scanner

K-SCANNER (KrF / 248nm)

A-SCANNER (ArF / 193nm)

0.13m

90nm

65nm

40nm

28nm

14nm

IA-SCANNER (ArF / 193nm)

Scanner Light Source Application for Process Generation

Patterning resolution can be enhanced by wavelength reduction

R = k1 * l / NA 0.35m

I-STEPPER (I-Line / 356nm)

0.25m

0.18m

0.15m

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(1972~ now)

28nm

Confidential 23

IC Process Scaling Down Gate length: scaling from 10um (1971) to 10nm (2017) Moore’s Law

Transistor: 2D (Planar) to 3D (FinFet)

Planar FinFet

Frederic Boeuf, Device challenges and opportunities for 10nm and below CMOS nodes, IEDM Short Course, 2013

Technology Challenges & Opportunities

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WW Semiconductor Market Outlook

High growth of WW semiconductor market to ~$500B in 2019 with

CAGR(‘11~’19) ~5.2%

Source : Gartner

2011-2019 CAGR : 5.2%

308 300 315

343 335 346

420

470

502

0

100

200

300

400

500

600

2011 2012 2013 2014 2015 2016 2017 2018 2019

USD

$B

WW Semiconductor revenue & forecast

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Semiconductor Market Revenue (devices & applications)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Non-Optical

DSP

8-Bit

16-

Bit

32-

Bit

22

MCU/DSP

Compute

Embedded

47

MPU

Automotive

Communications

Consumer

Data Processing

Industrial

Application-Specific

150

Data

Co

nve

rter/

Sw

itc

h/M

ult

iple

xe

r O

ther

An

alo

g

Vo

ltag

e R

eg

ula

tor/

Re

fere

nce

26

Analog

Image

Sensor

LED

Other

Optoelectronics

Photosensor

37

Optoelectronics

Dio

des

Other

Discrete

Tra

nsis

tors

23

Discrete

Dis

pla

y D

rive

r F

PG

A/P

LD

O

ther

Lo

gic

14

General

Purpose

Logic

No

no

pti

ca

l S

en

so

rs

13

Microcomponent Logic OSD Analog

Military/Civil Aerospace (US$B)

<0% 0~5% 5~10% >10% CAGR(‘17~’20) Note: exclude memory

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Outline:

27

1. History & Prospect of Semiconductor Industry

2. Semiconductor Applications

3. Semiconductor Supply Chain Eco-System

4. Introduction to UMC

5. Working Experience Sharing & Suggestions

6. Q&A

Confidential 28

Semiconductor Market Shift –

Application Diversification

Yole, 2017 Semicon Taiwan

Confidential 29

Industrial Segments & Applications

• Industrial 5-Segment : Mobility, IoT, Automotive, HPC & Memory

• 5G* Modem / Antenna

• RF* / FEM*

• Networking Switch

• AP / BB

• PMIC* / Sensors* / MEMS*

• Touch Driver / Touch ID

Mobility

• MCU

• Sensors (CIS* / MEMS*)

• PMIC*

• Memory (eFlash*)

• RF* (Connectivity)

IoT

• ADAS / AI

• Infotainment

• Body Electronic

• Power / Micro Control

• Sensors* / MEMS*

Automotive

• Crypto Currency

• Networking (Router /

Switch)

• AI Cloud

• GPU / CPU / FPGA

HPC

• DRAM (DDR4/5)

• Flash (Universal Flash

Storage)

• HBM / HMC

Memory

Confidential 30

Mobile Phone -> Smart Phone

30

1994 2017 2000 2007 2009 2013 2013 2011

Smartphone

AR/VR Market Innovation

Epson

Moverio BT-200

$699.99

Oculus

Rift

$599

Smartphone

HTC

Vive

$799(

Microsoft

HoloLens

$3,000

Vuzix

M100

$999.99

Timeline

Virtual Reality (VR) Augmented Reality (AR) Mixed Reality (MR)

Message on glasses lens Contents on display Contents on display or lens

Developing

(Magic Leap’s patent)

AR/VR/MR drives the demands on head mounted display (HMD)

Q4, 2016 Q1, 2016 2015

Pokemon Go

Plus (2016/9)

Google Glass

($1,500)

[Cancelled]

2013

Ma

in E

qu

ip.

2n

d D

evic

es

/

Ac

ce

ss

ori

es

Game

Console PC/NB Game

Console PC/NB

In near future

Pokemon Go

Smartphone

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Q1, 2018

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Automotive Products– Another Carrier of IC

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Automotive Package Types & Requirement

• Automotive package must endure extreme stress in harsh conditions

• Various categories apply different package type with different Grades

• AEC-Q100 Grade 0~3 packaging solutions are ready in major OSATs

* AEC: Automotive Electronics Council

Engine Control

Driving Control

Comfort

Infotainment

Motor Driver, PMIC

Safety

• HSOP • HQFP

Grade 0 ~ 1

• HSOP • HQFP

• TQFP • QFN

Grade 0 ~ 1

• HSOP • HQFP

• TQFP • QFN

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

• PBGA • FCBGA

• SiP / MCP

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

• PBGA • FCBGA

• SiP / MCP

Grade 1 ~ 3

• HSOP • HQFP

• TQFP • QFN

Grade 0 ~ 1

33

IoT Applications & Key Technologies

Smart Home

Smart Energy

Smart Logistics

Smart Health Smart Transport Smart City

Wearable

LP MCU

HP AP

RFID/NFC

GPS

WIFI

PLC

BT/BLE

ZigBee

2G/3G/4G

Display

Charger,

PMIC,

Energy

Harvest

Sensors

: eNVM : Advanced Logic/MM : RFCMOS : CIS, MEMS : eHV : BCD

IoT

Confidential 34

IoT: Sensing + Big Data + App/Service

Sensing device Big data - Data capture

- Data storage

- Data analysis

Application

Confidential 35

Confidential 36

IoT Solutions

• MCU (8/32-bit), sensor (light/humidity/temp), & wireless products are developed for IoT

• Connected home, wearables, IIoT, & smart meters are the arenas targeted

36

Wearables

Smart Sport

Watch

“HoT”

Smart Watch Baby

Monitor

Smart Meters

MCU

IIoT

Sensing

Motor

Control

MCU

Interconnect

Wireless & RF Sensors

MCU Products

Zigbee/Thread

Wi-Fi/Ethernet

Gateway

Zigbee/Thread

Dimmable

Light Switch Zigbee/Thread

Contact/Temp

Sensor

Connected Home

Confidential 37

Key IoT Applications & 2019 Market Forecast

37

Confidential 38

Drone ‒ IC Detail

• Auto-Return-to-Home

• Support fly-path programming

• No-Fly-Zone feature

• Camera tilt & stable control

DJI Phantom II Quadcopter

Weight 1Kg

Battery 5200mAH

(25min flying time)

Main Board

MCU

NXP LPC1765 Cortex-M3

@ 100MHz, 256KeFlash,

64KB SRAM

CAN

Network

TI SN65HVD23x 3.3V CAN

transceiver

GPS

Board

Receiver Ublox GPS chipset

Processor Freescale 8-bit MCU

Wireless 2.4G Hz WiFi

(300m remote control)

Motor

Control

MCU

Silicon Labs C8051 @

25MHz, 32/64KB eFlash,

4.25KB SRAM

MOSFET AOS mosfet

Sensor

Inertial 6-axis accelerator/gyro

Environment barometer

range

Camera

module

Video FHD 1920 x 1080

Stabilizer 3-axis gimbal (gyro)

(brushless motors)

Price

USD1229

(UAV + Battery + 3-axis

gimbal + Camera)

Myriad Things for Data

Confidential 39

World Is Running on Data

1.4B+ websites

2.4B+smartphone users

3.3B+ internet users

22.5B+ internet searches per day

3.5x1018 byte data generated per day

Cloud

Infrastructure

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Confidential 41

Healthcare

BFSIs

Retail

Manufacturing

Automotive Utilities & Telcos

Government &

Education MEMS

AI

CPU

(HPC+HBM)

Chips on

Interposer

NAND

CNTL

HPC

(GPU/

CPU/

ASIC)

CIS MEMS

MCU /

DSP AP

RF

Cloud

Edge Computing

End Devices

AI

Semiconductor technology will enable critical

applications across end devices, edge and cloud

Audio

Codec

ASIC

HBM

Confidential 42

New era: artificial intelligence will kick start the

next IT revolution before 2025

Computing

Mobility

Internet of Things

Artificial Intelligence

1995 2005 2015 2025

AI is everywhere: a set of disruptive technologies that are revolutionizing the speed

and accuracy of problem-solving and decision-assistance

AI revolution has been driven by a manifold increase in processing power, improved

algorithms, lower-cost hardware, and the exploding creation and availability of data

1 billion

PC users

2.5 billion

mobile

users

100s billion

connected

devices

46 billion spending

2100+ startups

Data Source: IDC, Gartner, Market Research

Confidential 43

Automotive ecosystem and value chain will face dramatic change

43

Confidential 44

AI is shaking up the entire value chain while semi -

conductor plays a critical role as key accelerator

Semiconductor Algorithm Systems Service/

Application

FPGA

CPU

GPU

TPU

Memory

Sensors

Machine/deep

learning

Reasoning

Software

Platform

UI

System Integration

Finance

Manufacturing

Retail

Healthcare

Confidential 45

Outline:

45

1. History & Prospect of Semiconductor Industry

2. Semiconductor Applications

3. Semiconductor Supply Chain Eco-System

4. Introduction to UMC

5. Working Experience Sharing & Suggestions

6. Q&A

Confidential 46

System

Architecture

Knowledge

IP and Design

Methodology

SoC Process

Platform

World Class

Manufacturing Fast Yield Ramp/

Package

Solution

•90/65/45/28/14nm

• Mixed Signal

• RF

• e-Memories

• High Voltage

• CIS

•RFSOI

Expensive Advanced Process Cost

High cost on advanced chip development Unit: US$ M

Confidential 47

Confidential 48

10,000 Times

IC Design

Confidential 49

( )

( )

( )

1995 2018 2018

8" 晶圓 8" 晶圓 12" 晶圓

300

steps

700

steps

1000

steps

製程步驟

15~50

Wafer Manufacturing

Confidential 50

Assembly & Test

Processed Wafer Wafer Sort, Dicing Wire bonding

Assembly

Shipping

IC Testing

Confidential 51

聯電

Manufacturing

(Consumer to Auto)

Process Qual

(AEC-Q100)

Device Qual

(AEC-Q100)

IC晶圓製造

生產製程

&

檢測設備

Semiconductor Supply Chain

光罩

化

學

品

IC封裝測試

IP設計/

IC設計代工服務

IC

設計

IC

模組

IC

通路 導線架

基

板

生產製程

&

檢測設備

Foundry:

tsmc, UMC, Global

Foundries, SMIC ..

Design

House:

Ali,

AMD,

Broadcom,

Mediatek,

Qualcomm

,

Realtek…

IP:

ARM,

Cadence,

eMemory,

Synopsys,

…

ASIC:

Faraday,

GUC,

…

日月光,矽品,京元電.

華泰電,菱生,超豐電,

力成,同欣電

崇越科,

致茂電,

漢科,

PDMC,

Toppan

,

Hoya,

TMC

永光,

華立,

三福化,

致茂電.

蔚華科,

漢科

欣興,

景碩,

長華電材.

同欣電,

順德,

百容,

健策,

台達電,

宇瞻科,

福懋科,

創見,

聯強國際,禾伸堂.

益登,

Design Wafer Manufacturing OSAT: Packaging & Test

Advance Process

New materials (HK/MG)

New device schemes (FinFET)

& Char. methodology

New design methodology

(DPT)

Today’s Designers Face Challenges

Customer Growing design complexity &

challenging PPA target

Peak time design resource

shortage

Time-to-market pressure

IP

Portfolio completeness

Time to market readiness

ARM core & POP solution

Design Support Reference design flow

FDK

Adv. process effect ( DFM, 2nd

order effect, DPT, FinFET)

On-site FAE support and APR

service

Confidential 52

Design & Manufacturing Ecosystem

Customer’s

ONE Stop Solution

Design

Flow

Foundry

UMC

Design

Service

IP

Solution

Confidential 53

Digital Design Flow

Confidential 54

EDA Platform Reference

FDK Cadence Platform

(IC6.X & IC 5.X)

Schematic

Entry Tool

Virtuoso Schematic

Editor / Composer

Simulation

Tool

HSPICE

Spectre

Layout

Editor Virtuoso Layout Editor

Verification

Tool

DRC : Calibre

LVS : Calibre

RCX : QRC/StarRC/XRC

Process

Technology

Information

Netlisting Info &

Views

Pcells / Routing /

Connectivity /

Symbolic VIAs

Verification /

Parasitic

Extraction Rules

Cell View &

Symbols

Confidential 55

Mask (Photomask)

Confidential 56

• Blank

Pellicle is used to prevent the particles in environment from falling onto the

photomask and assure the defect free exposure process.

Cr/CrOx

photoresist

quartz

A substrate consisted of a quartz plate sputtered with a chrome thin film and

coated with a light sensitive polymer (photoresist) onto the chrome film.

• Pellicle

MoSi

Binary PSM

Materials for Photomask

Confidential 57

QZ

MoSiON

Cr/CrOx

photoresist

Resist coating

Alignment exposure

Cr border HTPSM

Cross-section of Mask -PSM flow

Confidential 58

General Mask Process Flow

Confidential 59

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Challenge of Adv. Mask Technology

Difficulty (Cost) increases significantly for new material, tool and new

technology by generation.

1985 1990 1995 2000 2005 2010

Design Rule 90nm 65nm 45nm 130nm 180nm

Laser Writer

D

ifficulty

of m

ask m

akin

g

28nm 14nm…

EB Writer

MoSi Cr

MoSi Cr Cr

BIM

(Binary)

KrF

HTPSM

ArF

HTPSM

ArF

MoSi-BIM

…

2018

50kV EB Writer

EUV

Mask

Isolation

(前段)

Device

(中段)

Interconnect

(後段)

Passivation

(護層)

Wafer start

Wafer out

Inte

gra

tion 前段製程

From: IEMN -High performance SOI-CMOS flexible electronics

後段製程

From: IEDM 2002, Intel

Process Flow Structure

Confidential 61

Diffusion

(擴散)

Lithography

(黃光) Etch

(蝕刻)

Thin film

(薄膜)

Module Engineering ( Process & Equipment Engineer )

Isolation

(前段)

Device

(中段)

Interconnect

(後段)

Passivation

(護層)

Wafer start

Wafer out

照像專家

印製元件圖

案

地基專家

鋪下元件材

質

熱處理,活化

雕刻專家

刻出元件圖

案

架橋專家

連接元件線

路

隔絕層

Function: Function: Function: Function:

Fab Organization — Four Modules

Confidential 62

Module Integration

STI

Well/VT implant

Gate oxide

POLY

S/D implant

ILD/ Contact/ M1

IMD1/ VIA1/ M2

Passivation

PAD

~

PHOTO- STI

ETCH- STI

DIFF- PAD Oxide

T/F- M1 Cu Sputter

PHOTO- M1

ETCH- M1

T/F- IMD1 CVD

Process Flow Layer (Route) Module (Step)

Recipe control

Equipment

Facility

Metrology/ Inspection

Recipe control

Equipment

Facility

Metrology/ Inspection

Confidential 63

Module - Diffusion

In the diffusion, two methods

deliver the dopant into Si wafer :

. Implant : Accelerate the isotope

and direct bombard the wafer

. Furnace : Use thermal diffusion

potential

Deliver the dopant into right

depth with right concentration.

Diffusion

Raw material :

Chemical Gas, Isotope gas

Equipment :

Implanter , Furnace

Confidential 64

Module - Photolithography

Optics lithography to reproduce the

specific patterns.

Today, UV Excimer laser provides

the wavelength of the light less

than one tenth of half pitch.

Technology shrink exposure

light into deeply UV zone.

I-line

(365 nm)

0.35um

DUV

(248 nm)

0.25um

DUV

(193 nm)

65 nm

DUV

(immersion)

28 nm

EUV

(13.5 nm)

<7 nm

Photo:

Raw material :

Reticle, Photo Resist

Equipment :

I-Line(MUV), DUV, EUV

(Stepper, SCANNER)

Confidential 65

Module - Etch

In general, RIE is in the term of

Dry etching, dominated by

Physical Ion bombard &

Chemical reaction

with the surface to evaporated the

byproducts.

Reactive ion bombard

Etch

Raw material :

Solvent, Reactive gas

Equipment :

Dry Etch (RIE), Wet Bench (Chemical Station)

Confidential 66

Module - Thin Film

Thin-Film: Chemical dominated

(CVD) and Physics dominated

(PVD)

CVD: Chemical reaction to deposit

a film on wafer surface

PVD: No chemical reaction.

Accelerated Ar bombard/ evaporate

the target & deposit on wafer, such

as Sputter

CVD PVD

Chemical reaction

Thin-Film:

Raw material :

Metal Target, Chemical

Equipment :

Sputter, RTP, CVD (AP, PE, LP, SP, MO), Scrubber

Confidential 67

Module – CMP (Chemical-Mechanical Polishing)

Polish films with chemical-

mechanical assistant.

Two factors dominated CMP:

First is chemical hydrolysis slurry

to hydrolyze the surface

Second is the slurry abrasive to

remove the hydrolyte which under

the mechanical dominated.

CMP

Raw material :

Slurry, polish pad

Equipment :

CMP (W, Oxide, Cu)

Confidential 68

Confidential 69

Testing Development & Services

• Work with Customers for Cost Effective Test Solution Development

• Production Yield Monitoring & Improvement by Bin Limit Control Mechanism

• Proactive Product Yield Improvement and FA as Value-added Services

69

Customized Service

Cost-Driven Testing Evaluation

Testing Hardware Design

Program Development &

Validation

Multi-DUT Migration / TTR

Yield Analysis & Diagnosis

Remote Assess Engineering

Analysis

Probing Optimization DOE

Best-in-Class FA Capability

Real-Time Data Feedback

Production Yield Monitor

Customized Yield Report

SBC* Implementation

*SBC : Statistical Bin Control

Volume Production Test Solution Development

Package Technology Evolution Technology node (nm)

1980 2020 1990 2000 2010

Leadframe

PDIP

SOJ

SOP

QFP

QFN

90 65 40 28 14 / 7

Perf

orm

an

ce

FC / WLP / PoP

PoP

WLCSP

FCBGA

FOWLP

Stacked die

2.5D / 3DIC / SiP

3D IC

FO-SiP

Logic

TSI

2.5D TSI

BGA

TFBGA

LGA

PBGA

Stacked die

Confidential 70

Confidential 71

Advanced Package Trend & Solutions

• Advanced SiP package: 2.5D / 3DIC & Low Cost Option : FOWLP

71

Cost

Package Size(Length)

FO-POP • AP + BB

• Networking

PKG = 8 ~ 25 mm

Memory

AP BB

2.5D TSI

• FPGA

• GPU + HBM

• Networking

PKG = 40 ~ 60 mm

GPU HBM

3DIC • Stacked memories

• Wide IO DRAM + Logic

PKG = 15 ~ 30 mm

AP

Wide IO Memory

SIP (System in Package)

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• Diversified Packaging Solutions for Mobile, IoT, Automotive, HPC &

Memory Applications Including:

Wire Bond, Bump, Stacked Die, WLP, 2.5D, 3DIC, FO-WLP

Diversified Packaging Solutions

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PoP

FO-PoP

Wire Bond

WLP

FO-WLP

Flip Chip

SiP / MCP

3DIC /

2.5D TSI

FCBGA HS-FCBGA

Stack Die TFBGA Stack Die QFP Stack Die QFN

3DIC 2.5D TSI

PoP FO-PoP

WLP FO-WLP Panel PoP Packaging Solutions

QFN QFP/LQFP TFBGA LGA SOP

Thank You!

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