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Interconnect by Optics Project Presentation. IMEC, Alcatel Bell, Avalon Photonics, Opto Speed, Helix, FCI, Nexans, RCI, PPC Electronics, LETI. Contents. Introduction Goals of the project Critical issues Partner List Study of optical interconnections in systems - PowerPoint PPT Presentation
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© intec 2000
Interconnect by OpticsProject Presentation
IMEC, Alcatel Bell, Avalon Photonics, Opto Speed, Helix, FCI, Nexans, RCI, PPC Electronics, LETI
http://www.intec.rug.ac.be/IO
Contents Introduction Goals of the project Critical issues Partner List Study of optical interconnections in systems
The router demonstrator The hardware for the proposed optical interconnection family
Electrical interface circuits Plastic Optical Fibre Glass sheet Pathway Opto-electronic components: VCSELs and photodetectors Hybridisation and packaging
Conclusion
http://www.intec.rug.ac.be/IO
Introduction
IO (interconnects by Optics) is a European project, co-funded by the EC, in the framework of the
Information Society Technology (IST) programmeContract number is IST-2000-28358
In this project, parallel optical interconnections are developed.
The project runs from September 1, 2001, to August 31, 2004
http://www.intec.rug.ac.be/IO
Rationale for optical interconnections
Current (and future) electronic systems need a vast amount of data transfer inside the system.
Metallic interconnections cannot deliver the required bandwidth, due to:
• increased cross-talk• losses (and increased noise sensitivity)• physical limitation (dimensions of connectors etc…)
Parallel optical interconnections are proposed as the solution to these problems
This happens at various levels in the electronic system:• chip access• on the board• at the connector level• at the backplane level
Interconnection bottleneck
http://www.intec.rug.ac.be/IO
Goals of the project
To demonstrate a complete optical interconnect technology family in a major application area, being that of core IP routers. This
family is based on 2-dimensional interconnects,
with a direct integration of the optics on the digital CMOS IC.
To identify (in an early stage of the project) the critical issues and the missing knowledge and/or technologies
for this technology family and do research towards a solution of these issues/gaps.
To ensure that the project generates direct opportunities for exploitation.
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http://www.intec.rug.ac.be/IO
Critical issues (1)
• to develop optical interconnect design methodologies that can be integrated into E-cad environments
• to develop a Plastic Optical Fibre with small core diameter, low loss, (<1dB/m) and high thermal stability (>100°C)
• to develop cabling and connectorisation methods for 2D arrays of such POFs (single-ended 90° and dual ended 90° optical blocks)
• to develop a POF-based technology for realising an optical layer as PCB-build up extension, allowing for complex interconnection patterns
http://www.intec.rug.ac.be/IO
Critical issues (2)
• to develop solutions for the use of glass sheet waveguides in PCB, as post solder build-up extension or pre-solder build-in PCB-layer.
• to seek solutions for compactly integrated modules, consisting of a small-form-factor package for the CMOS IC, opto-electronics and an optical window, together with
a passively aligned optical pathway interface.
• to optimise driver and receiver circuitry for low power dissipation, small area and tolerance to non-uniformities in the electronic, opto-electronic and optical devices
• to seek solutions that allow for testability and repairability
http://www.intec.rug.ac.be/IO
Target parameters:
Key target parameters aimed for in this project are:
number of channels (at optical interfaces) ranging from 64 (first generation), to 256 (second generation)
IC-access channel density from 16/mm2 (first generation) to 64/mm2 (second generation)
data rate between 1.25 Gb/s (first generation) and 2.5 Gb/s per channel or higher (second generation)
This creates a solution with a huge aggregate interconnect bandwidth, scalable to 5 and 10 Gbit/s per channel and higher, as the required performance goes up.
http://www.intec.rug.ac.be/IO
Partner List
IMEC (prime) Belgium
Alcatel Bell N.V. Belgium
Avalon Photonics Ltd Switzerland
Opto Speed SA Switzerland
Helix AG Switzerland
FCI 's Hertogenbosch The Netherlands
Nexans France
R.C.I France
PPC Electronic AG Switzerland
CEA (LETI) France
http://www.intec.rug.ac.be/IO
System study
Top level analysis: Study of the nature of the expected bottlenecks in the next-generation high-performance electronic systems
Set-up of a design methodology, and integrate in EDA tools
Definition, development, prototyping and qualification of
a high-performance electronic system: an optically interconnected IP router
http://www.intec.rug.ac.be/IO
The router demonstrator
Optical
Electrical
Power,Clock
IP trafficin and out
Dataprocessing IP traffic
in and out
Digital CMOS IC with directlyintegrated opto-electronics
and electronic interface circuits
http://www.intec.rug.ac.be/IO
The hardware
The electrical interface circuits driver circuits receiver circuits
The opto-electronic components emitters: VCSELs detectors : InP photodiodes
The optical pathway Plastic Optical Fibre (POF) Glass sheets
The integration and hybridisation A digital system: the IP router
For use in the :1. Technology demonstrators2. IP router demonstrator
http://www.intec.rug.ac.be/IO
Electrical interface circuits
CMOS driver and receiver requirements:
250x250-125x125 µm2 cell size 10 mW to 15 mW per channel power dissipation (complete link) 1.25-2.5 Gbit/s per channel bit rate 20 µApp receiver sensitivity 5% drive current and sensitivity uniformity Minimized electrical cross-talk (between analogue and digital circuit blocks)
http://www.intec.rug.ac.be/IO
Plastic Optical Fibre
POF-related work in the IO project :
• Development of plastic optical fibres • Development of POF ribbons and POF connectors• Development of POF in flex
Plastic optical fibre is the choice for the optical pathway, due to its flexibility, high numerical aperture, low cost and (potential) low loss.
http://www.intec.rug.ac.be/IO
Connectorisation & Optical interface
Novel concepts for multi-fibre connectors, using overmoulding of the POF’s
Realisation of Plastic Optical Fibre:
Wiring of POF on flex foils:
http://www.intec.rug.ac.be/IO
Glass sheet
80 µm
Roughness sidewall 50 nm
etched
Roughness topsideand bottomside 6 nm
2 mm
8 x 8 VCSEL/ReceiverdiodeCopper
2 mm
Four Thinglasslayers
An alternative pathway is based onwaveguides in glass sheets
This pathway is directly integrated in the PCB
http://www.intec.rug.ac.be/IO
The opto-electronic components
Optical emitters: 2-D arrays of VCSELs
Optical emitters: 2-D arrays of detectorsThe target performance parameters for the PDs (at 25°C and 2.5V reverse bias are:)· Diameter of light sensitive area: 80 µm· Responsivity @ l = 960 nm: 0.5 A/W· Total capacitance: 600fF· Bandwidth: 5GHz· Optical cross-talk between neighbouring channels: 30dB
The target performance parameters of the VCSEL arrays :· Threshold current: 1-2 mA. Emission wavelength 960 nm· Operating voltage: 1.6-1.7 V· Slope efficiency: 0.2-0.3 W/A· Beam divergence (FWHM): 16-20 °· Bandwidth @ 5 mA: > 10 GHz (third generation)
http://www.intec.rug.ac.be/IO
Hybridisation and packaging
Packaging must take care of• optical coupling: the optical interface determines the alignment.• electrical connections: a flip-chip package.• protection of the CMOS and opto dies: a (quasi)-hermetic interface.
Printed circuit board
BGA (standardBGA,cavity down)
Opto-chips
Optical connetor
Alignment plate
CMOSAlignmentfiducials
A proposed approach:
http://www.intec.rug.ac.be/IO
Conclusion
IO is a large project on optical interconnections :
development of high-performance components for 2-dimensional parallel optical interconnections, directly integrated on the CMOS development of technology demonstrator and a system demonstrator
For more information, news and latest status of the work, visit the IO web site at http://www.intec.rug.ac.be/IO
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