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REVISED HISTORY
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
13/MAY/2003 ISSUE 0.1 Initial Release
01/Sep./2003 ISSUE 0.2
The information in this manual is subject to change without notice and should not be construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the G5500/7050.
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Table of Contents1. INTRODUCTION.................................. 5
1.1 Purpose ............................................….
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. General Performance .....................… 8
2.1 Product Name ................................…….
2.2 Supporting Standard ……………………..
2.3 Main Parts …………………………………
2.4 H/W Features …………………………….
2.5 S/W Features …………………………….
3. H/W Circuit Description ....................13
3.1 RF Transceiver General Description ……
3.2 Receiver Part …………………………….
3.3 Digital Baseband (DBB) Processor ………
3.4 Analog Baseband (ABB) Processor …...…
3.5 Camera Circuit ……..………………………
5
5
7
8
8
8
9
11
13
13
20
25
44
4. TROUBLE SHOOTING ................… 514.1 Main Components Placement(G5500) ...
Main Components Placement(G7050) ...
4.2 Main Components .....................…..........
4.3 Keypad Components Placement ............
4.4 Baseband Components ..……………..…
4.5 Power On Trouble …..........…………..….
4.6 Charging Trouble ........................…..…..
4.7 LCD Display Trouble ………....................
4.8 Receiver Trouble ………….....................
4.9 Microphone Trouble ………………………
4.10 Vibrator Trouble ……….…………………
4.11 Keypad Backlight Trouble …….…………
4.12 Slide Open/Close Trouble ……….………
4.13 SIM Detect Trouble …….....……………..
51
52
53
54
55
56
57
59
61
65
68
70
72
74
5. ASSEMBLY INSTRUCTION ………....102
5.1 Disassembly (G5500) .............................
5.2 Disassembly (G7050) …........………….
102
108
8. CIRCUIT DIAGRAM .............………... 129
8.1 BB ………..…………….........................
8.2 MEMORY, etc. …………………………….
8.3 MIDI, AUDIO ………….………………….8.4 I/O, Connector ……….…………….……
8.5 RF ………………………..….……..…….
8.6 CAMERA ………………………………...
8.7 KEYPAD ………………………………….
129
130
131
132
133
134
135
6. DOWNLOAD ……………………...……114
6.1 Download Setup .....................................
6.2 Download Procedure ………...….……….
114
115
7. SERVICE AND CALIBRATION …….. 122
4.14 Earphone Trouble ……….……………….
4.15 Infrared Data Association Trouble ……
4.16 Camera Trouble ………………………….
76
81
84
7.1 Service S/W ……....................................
7.2 Calibration ……………….…...….……….
122
125
9. PCB LAYOUT .............……………..... 137
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Table of Contents10. ENGINEERING MODE ................... 141
11.1 Setting Method .................................….142
11. STANDALONE TEST ..................... 142
12.1 Exploded View .................................….
12.2 Accessory ………………………………..
12.3 Replacement Parts
<Mechanic components> ………………..
Replacement Parts
<Main components>………………………
143
145
146
148
12. EXPLODED VIEW & REPLACEMENT PART LIST.......... 143
1. Introduction
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of the G5500/7050.
1.2 Regulatory Information
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.
A. Security
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
B. Incidence of Harm
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the G5500/7050 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
C. Changes in Service
Maintenance limitations on the G5500/7050 must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
D. Maintenance Limitations
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The G5500/7050 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
E. Notice of Radiated Emissions
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
F. Pictures
An G5500/7050 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
G. Interference and Attenuation
H. Electrostatic Sensitive Devices
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.• Keep sensitive parts in these protective packages until these are used.• When returning system boards or parts like EEPROM to the factory, use the protectivepackage as described.
ATTENTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
APC Automatic Power ControlBB Baseband
BER Bit Error RatioCC-CV Constant Current – Constant VoltageDAC Digital to Analog ConverterDCS Digital Communication SystemdBm dB relative to 1 milliwattDSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only MemoryEL Electroluminescence
ESD Electrostatic DischargeFPCB Flexible Printed Circuit BoardGMSK Gaussian Minimum Shift KeyingGPIB General Purpose Interface BusGSM Global System for Mobile CommunicationsIPUI International Portable User IdentityIF Intermediate Frequency
LCD Liquid Crystal DisplayLDO Low Drop OutputLED Light Emitting Diode
OPLL Offset Phase Locked LoopPAM Power Amplifier ModulePCB Printed Circuit BoardPGA Programmable Gain AmplifierPLL Phase Locked Loop
PSTN Public Switched Telephone NetworkRF Radio Frequency
RLR Receiving Loudness RatingRMS Root Mean SquareRTC Real Time ClockSAW Surface Acoustic WaveSIM Subscriber Identity ModuleSLR Sending Loudness Rating
SRAM Static Random Access MemorySTMR Side Tone Masking Rating
TA Travel AdapterTDD Time Division Duplex
TDMA Time Division Multiple AccessUART Universal Asynchronous Receiver/TransmitterVCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal OscillatorWAP Wireless Application Protocol
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2. General Performance2.1 Product Name
Item Feature Comment
Supporting Standard
E-GSM/ DCS Dual Bandwith seamless handoverPhase 2+SIM Toolkit : Class 1,2,3,A~E
Frequency Range
E-GSM TX : 880 – 915 MHzE-GSM RX : 925 – 960 MHzDCS 1800 TX : 1710 – 1785 MHzDCS 1800 RX : 1805 – 1880 MHz
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G5500/7050: Support GPRS (Class 10)
2.2 Supporting Standard
ApplicationStandard
WAP 2.0 : YesMMS : YesJAVA : MIDP v1.0.3IrDA 1.3
G5500/7050
2.3 Main Parts: GSM Solution
Digital Baseband CALYPSO @39MHz (D751992GHH)
Analog Baseband IOTA (TWL3014CGGM)
RF Chip Aero (Multi slot) (Si4200-BM, Si4201-BM, Si4133T-BM)
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2.4 H/W Features
Item Feature Comment
Form Factor Slide Down LCD (65K Color)
Battery
CapacityStandard: Li-Ion, 860mAh
Packing Type: Hard Pack
Cell Size: Standard55(L)×33.7(W)×49.5(H)mm
Size Standard: 94×44×21.5mm L×W×H
Weight 89g With Battery
PCB Main PCB: 8Layers, 1tKeypad PCB: 2Layers, 0.6t
AVG TCVR current (mA)
Max : 260 mA (Power Level 5)Max : 120 mA (Power Level 19) Estimated
Standby Current 4.6mA @ Paging Period 9
Standby time Up to 150 hours @ Paging Period 9
Charging time Below 3 hr. @ Power Off / 860mAh
Talk time Min : 4hr @Power Level 7Min : 6hr @Power Level 12 @ 860mAh
RX sensitivity GSM 900 : -105 dBmDCS 1800 : -105 dBm
TX output power GSM 900 : 32 dBmDCS 1800 : 29 dBm
Class4 (GSM)Class1 (DCS)
GPRS compatibility GPRS Class 10
SIM card type Plug-In SIM - 3V
Display
- LCD : 65K Color-STN (128 X160)- Pixels : 0.219 x 0.219 mm- View Area : 30.54 x 36.04 mm - Active Area : 28.02 x 35.028 mm- Backlight : White LED
Status Indicator Yes (Red, Green)
Keypad
Alphanumeric Key : 12Function Key : 12Side Key : 2Total Number of Keys : 26
Function Key:4 Key Navigation & OK,F1, F2, SND, END/PWR,Clear, Book Mark (Camera), Voice Recording
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Item Feature Comment
Antenna Fixed Type
System connector 24 Pin
Ear Phone Jack 3 Pole (φ2.5mm)
PC synchronization Yes CDROM
Memory Flash : 128Mbit / SRAM : 64Mbit AMD
Speech coding FR, EFR, HR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
IrDA Built in IrDA PC sync support
MIDI (for BuzzerFunction) 40 Poly Buzzer Function By Using
MIDI IC
Voice Recording up to 90 sec 30sec x 3
Travel Adapter Yes
Camera Sensor VGA / CIS G7050 only
Options
Travel AdapterEar-MicrophoneHand StrapCigarette Lighter AdapterData CableHandsfree Car KitSimple Hands Free kit
TBDTBD
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2.5 S/W Features
Item Feature Comment
RSSI 0~5 level Antenna
Quick Access Mode Schedule/Ring Tone/PhonebookCamera/GPRS/Phonebook(G7050)
Battery Charging 0~3 level
Key Volume 0~5 level
Keypad Volume 0~5 level
Effect sound volume 0~5 level
Ring Volume 1~5 level
Time/Date Display Yes
Text Input T9
Multi-language Yes
PC Sync Schedule/Phonebook/SMS MS Scheduler & Outlook
Speed Dial Yes (2~9) Voice mail center → 1 key
Profile Yes
CLIP/CLR Yes
Phonebook 3 Number + 1 Memo + 1 e-mail Phone (Up to 255 entries)
Last Dial Number Yes (20)
Last Received Number Yes (20)
Last Missed Number Yes (10)
Search Number/Name Yes
Group 7 / User Editor
Fixed Dial Number Yes
Voice Memo 30 secs * 3
Call Remainder Yes
Network Selection Automatic / Manual
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Item Feature Comment
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge Yes
Call Duration Yes
SMS (EMS) 100
EMSSend/Receive/Save Yes Melody/Picture/Animation
MMS Yes
WAP Browser WAP 2.0
Java CLDC v1.0.3 / MIDP v1.0.3
Wall Paper Yes Max. 10 preset
Download Melody/Wallpaper (MMS) Over the WAP
Long Message Mac. 918 Character(6page*153)
Cell Broadcast Yes
Calendar Yes
Memo 20
World Clock Yes
Unit Convert Length/Surface/Volume/Weight
Fax & Data Yes
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1,2,3
Camera
Image resolution : 640 x 480300 KB dynamic memory forimages : Max 100 photos (128 x 96)Max 4x zoom
G7050 only
Phone lock/Key lock Yes
Security DRM (Forward-lock only)
CPHS Yes
IM Yes G7050 for T-Mobile only
3. H/W Circuit Description3.1 RF Transceiver General Description
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VC-TCXO part.The Aero transceiver is composed of three RF chipsets, Si4200-BM[U502], Si4133T-BM[U505] and Si4201-BM[U503] which is a dual and triple-band GSM/GPRS wireless communications. This device integrated a receiver based on a low IF (100KHz) architecture and a transmitter based on modulation loop architecture. And, the synthesizer[U505] part employed the Silicon Labs Si4133T-BM, a complete dual band synthesizer with built in VCOs.The transceiver employed a 3 wire serial interface to allow an external system controller to write the control registers for dividers, receive path gain, power down setting, and other controls.
3.2 Receiver Part
The receiver part uses a low-IF receiver architecture that allows for the on-chip integration of thechannel selection filters, eliminating the external RF image reject filters and the IF SAW filterrequired in conventional super-heterodyne architecture. The Si4200-BM[U502] integrates threedifferential input LNAs that are matched to the 200 Ohm balanced-output SAW filters throughexternal LC matching networks. A quadrature image-rejection mixer downconverts the RF signalto a 100kHz intermediate frequency (IF) with the RFLO from the Si4133T-BM[U505]. The mixeroutput is amplified with an analog programmable gain amplifier (PGA) and quadrature IF signal isdigitized with high resolution A/D converters (ADCs). The Si4201-BM[U503] downconverts the ADCoutput to baseband with a digital 100kHz quadrature LO signal. Digital decimation and IIR filtersperform channel selection to remove blocking and reference interference signals. After channelselection, the digital output is scaled with digital PGA, which is controlled with the DGAIN[5:0] bitsin register 05h.The amplified digital output signal go through with DACs that drive a differentialanalog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADCinput baseband ICs.
Antenna Bar Number
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Power (dBm)
Antenna Display
5 ≥ -85
4 ≥ -90
3 ≥ -95
2 ≥ -100
2 ≥ -105
1 < -105
Figure 1. RF Receiver Block
3.2.1. RF Front End
RF front end consists of Antenna Switch(FL501), dual band LNAs integrated in transceiver(U502).The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile switch. The Antenna Switch(FL501) is used for control the Rx and TX paths. And, the input signals VC1 and VC2 of a FL501 are directly connected to baseband controller to switch either TX or RX path on. Ant S/W module(FL501) is an antenna switch module for dual band phone. The logic and current is given below Table 3-1.
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Table 3-1. The Logic and Current
VC1
EGSM TX 0 V
DCS TX 2.5~3.0 V
EGSM/DCS RX 0 V
VC2
2.5~3.0 V
0 V
0 V
Current
10.0 mA max
10.0 mA max
< 0.1 mA
The receiver part uses a low-IF receiver architecture that allows for the on-chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional super-heterodyne architecture. The Si4200-BM[U502] integrates three differential input LNAs that are matched to the 200 ohm balanced-output SAW filters through external LC matching networks.
ADCADC
ADCADC
RF
PLL
RF
PLL
IF
PLL
IF
PLL
Cha
nnel
Filt
erC
hann
el F
ilter DACDAC
DACDAC
100KHz100KHz
DIP
DIP
EGSM
DCS
PAMU504
RF3133
FL501Antenna Switch
13MHz
I
Q
U502/Si4200 U503/Si4201
U505/Si4133T÷2:GSM÷2:GSM
÷1:DCS÷1:DCS
0˚/90˚
0˚/90˚
RF1
RF2 IF
PGA PGA
U506VC-TCXO
EGSM
DCS
PCS
LNAFL502
FL503
Baseband(TI)
U102IOTA
+
U101Calypso(CO35)
Baseband(TI)
U102IOTA
+
U101Calypso(CO35)
A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF) with the RFLO from the Si4133T-BM[U505]. The RFLO frequency is between 1849.8 and 1918.8 MHz, and is divided by two in the Si4200 for EGSM modes. The RFLO frequency is between 1804.9 and 1879.9 MHz, and is divided by one in the Si4200 for DCS modes. The mixer output is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h.The quadrate IF signal is digitized with high resolution A/D converters (ADCs). The Si4201-BM[U503] down-converts the ADC output to baseband with a digital 100kHz quadrate LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interference signals. The response of the IIR filter is programmable to a high selectivity setting(CSEL=0) or a low selectivity setting (CSEL=1). After channel selection, the digital output is scaled with digital PGA, which is controlled with the DGAIN[5:0] bits in register 05h.
3.2.2. IF
The amplified digital output signal go through with DACs that drive a differential analog signal onto the RXIP, RXIN, RXQP and RXQN pins to interface to standard analog ADC input baseband ICs.No special processing is required in the baseband for offset compensation or extended dynamic range.Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of blockers, and device 1/f noise.
3.2.3. Demodulator and Baseband Processing
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3.2.4. Synthesizer Part
The synthesizer IC, the Si4133T-BM[U505] is a monolithic CMOS integrated circuit that performs IF and RF synthesis. Two complete PLLs are integrated including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. Differential outputs for the IF and RF PLLsare provided for direct connection to the Si4200-BM[U502] transceiver IC. The RF PLL uses two multiplexed VCOs.The RF1 VCO is used for Receive mode, and the RF2 VCO is used for Transmit mode. The IF PLL is used only during Transmit mode and uses a single VCO. The center frequency of each of the three VCOs on the Si4133T is set by connection of an external inductance(Lext). The IF and RF output frequencies are set by programming the N-Divider registers, N[RF1], N[RF2] and N[IF]. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper VCO. The output frequency of each PLL is as follows:
fout = N * fø
A programmable divider at the XIN pin allows either a 13 or 26MHz from the external applied crystal oscillator. The RF PLL phase detector update rate(fø) can be programmed with the RFUP bit in register 31h to either fø = 100kHz or fø= 200kHz. The IF PLL always uses fø = 200kHz. Receive mode should use fø = 100kHz in DCS1800 and PCS1900 bands, and fø = 200kHz in the GSM850 and E-GSM 900 bands.
Transmit modes should always use fø = 200kHz. The IF and RF output frequencies are set by programming the N-Divider registers and also programmed via 3-wire interface with external system controller.
Figure 2. Synthesizer Block
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3.2.5. Transmitter Part
The Transmitter part contains Si4200-BM[U502] active parts, Power Amp Module[U504] and Antennaswitch[FL501].The transmit section of Si4200-BM [U502] consists of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two 50 ohm output buffers that can drive external power amplifiers.The RF GMSK outputs from the transmit VCO are fed directly to the RF power amplifiers.The peak output power and the profile of the transmitted burst are controlled by means of incorporated power control circuits inside of PA and DAC output. from the Baseband Controller. The PA outputs pass to the antenna connector via Antenna Switch.
IF
PLL
IF
PLL
Baseband(TI)
U102IOTA
+U101
Calypso(CO35)
Baseband(TI)
U102IOTA
+U101
Calypso(CO35)
13MHz
U505/Si4133TRF1
RF2 IF
U506VC-TCXO
IF_Lo(Tx)RF_Lo(Tx)
RF_Lo(Rx)
Figure 3. RF Transmit Block
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side-band. Rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.The TX-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential I/Q signals with the IFLO to generate a SSB IF signal, which is filtered and used as the reference input to the OPLL. The Si4133T[U706] generates the IFLO frequency. The IFLO is divided by two to generate the quadrature LO signals for the quadrature modulator.
3.2.6. IF Modulator
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3.2.7. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2for the GSM 850 and E-GSM 900 bands. The Si4133T generates the RFLO frequency between 1327and 1402 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadraturemodulator and feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in register 04h. The OPLL requires no external duplexer to attenuate transmitter noise and spurious signals in the receive band. Additionally, the output of the transmit VCO (TXVCO) is a constant-envelope signal which reduces the problem of spectral spreading caused by non-linearity in the PA.
ΦDETΦ
DET
÷2÷2
DIP
DIP
PAMU504
RF3133
EGSM
DCS
I
Q
FL501Antenna Switch
Baseband(TI)
U102IOTA
+U101
Calypso(CO35)
Baseband(TI)
U102IOTA
+U101
Calypso(CO35)÷1÷1
÷2÷2
RF_Lo(Tx) IF_Lo(Tx)
PA_BAND
GATE_VC1
GATE_VC2
3.2.8. Power Amplifier
-18-
The RF3133 [U504] is a triple-band GSM/DCS/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the basebandcircuit. On-board power control provides over 37 dB of control range with an analog voltage input(Vramp). Efficiency is 55% at GSM and 52% at DCS.
Figure 4. Power Amp
3.2.9. 13MHz Clock
The 13 MHz clock(U506) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4133T/Si4201 RF Main Chip, BB Analog chip-set(IOTA), Digital chip-set(Calypso G2).
Figure 5. VC-TCXO Circuit
3.2.10. Power Supplies and Control Signals
An external regulator(U508) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator.
Figure 6 External regulator Circuit
-19-
3.3 Digital Baseband (DBB) Processor
Figure 7. Top level block diagram of the Calypso G2(HERCROM400G2)
CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- -Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG boundary-SCAN).
3.3.1. General Description
-20-
CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals.CALYPSO is composed from the following blocks:• ARM7TDMIE : ARM7TDMI CPU core• DSP subchip• ARM peripherals:
3.3.2. Block Description
General purpose peripherals
• ARM Memory Interface for external RAM, Flash or ROM• 4 Mbit Static RAM with write-buffer
Application peripherals
• ARM General purposes I/O with keyboard interface and two PWM modulation signals • UART 16C750 interface (UART_IRDA) with
→ IRDA control capabilities (SIR)→ Software flow control (UART mode).
• UART 16C750 interface (UART_MODEM) with→ Hardware flow protocol (DCD, CTS/RTS)→ Autobaud function
• SIM Interface.• TPU(Time Processing Unit) : Processing for GSM time base• TSP(Time Serial Port) : GSM data interface with RF and ABB
Memory Interface : External/Internal Memory InterfacenCS0 : FLASH1, 16bit access, 3 wait statenCS1 : FLAHS2, 16bit access, 3 wait statenCS2 : Ext SRAM, 16bit access, 3 wait statenCS3 : Main LCD(16bit access), OEL(8bit access) addressing, 3 wait state nCS4 : MIDI(8bit access), USB(8bit access) addressing, 3 wait statenCS6 : Int SRAM, 32bit access, 0 wait state
* Calypso is internally 39MHz machine (25ns machine cycle), so it requires 3 wait-state for 80ns access(25*4 = 100 ns).
-21-
3.3.3. External Devices connected to memory interface
Table 3-2. Memory interface
Device Name Maker WriteAccess Time
Read Access Time
FLASH1 AM50DL128CG70I AMD 70ns 70ns
SRAM AM50DL128CG70I AMD 70ns 70ns
LCD S6B33B0A SDI 50ns 50ns
Melody IC YMU762 Yamaha 50ns 80ns
Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base
3.3.4. RF Interface (TPU, TSP Block)
Table 3-3. RF Interface Spec.
TSP (Time Serial Port)
Resource Interconnection Description
TSPDO ABB & RF main Chip Control Data
TSPEN0 ABB ABB Control Data Enable Signal
TSPEN1 RF main Chip RF Control Data Enable Signal
TSP (Time Serial Port)
TSPACT00 PDNB RF main Chip Reset Signal
TSPACT01 PA_ON Power Amp ON signal
-22-
FLASH2 AM50DL128CG70I AMD 70ns 70ns
3.3.5. SIM Interface
SIM interface scheme is shown in (Figure 8). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 1.8V/3V SIM operation.
SIM Interface
SIM_CLK SIM card reference clockSIM_RST SIM card async/sync resetSIM_IO SIM card bidirectional data lineSIM_PWCTRL SIM card power activationSIM_CD SIM card presence detection
Figure 8. SIM Interface
3.3.6. UART Interface
G5500/7050 has two UART Drivers as follow :
UART1 : Hardware Flow Control / Fax & Data ModemUART2 : Handsfree Control / SW trace or IrDA Modem
-23-
SIM_IOSIM_CLKSIM_RST
SIM_PWRCTRLSIM_CD
DBB ABB
VRSIM
DBBSIODBBSCKDBBSRST
SIMCLKSIMIO
SIMRST
SIM
VPPCLKIORST
V_IO
150p 22p
10k
V_SIM
1u
10kSIM_IO
SIM_CLKSIM_RST
SIM_PWRCTRLSIM_CD
DBB ABB
VRSIM
DBBSIODBBSCKDBBSRST
SIMCLKSIMIO
SIMRST
SIM
VPPCLKIORST
V_IO
150p 22p
10k
V_SIM
1u
10k
Figure 3-4. UART Interface spec.
UART MODEM (UART1)
Resource Name Description
TX_MODEM TXD Transmit Data
RX_MODEM RXD Receive Data
CTS_MODEM CTS Clear To Send
RTS_MODEM RTS Request To Send
GPIO 3 DSR Data Set Ready
-24-
UART IrDA (UART2)
Resource Name Description
TXIR_IRDA TX_IRDA Infra-Red Transmit Pulse
TX_IRDA TX Transmit Data(UART2)
RXIR_IRDA RX_IRDA Infra-Red Receive Pulse
RX_IRDA RX Receive Data(UART2)
SD_IRDA SD_IRDA IRDA transceiver Shutdown Mode
3.3.7. GPIO Map
In total 16 allowable resources, G5500/7050 is using 13 resources except 3 resources dedicated to SIM and Memory. G5500/7050 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
Table 5. GPIO Map Table
I/O # Application I/O ResourceState
InactiveState
ActiveState
I/O (0) FLIP I GPIO HIGH (Open) LOW (Closed)
I/O (1) MIDI_INT I GPIO HIGH LOW
I/O (2) CAM_INT I GPIO HIGH LOW
I/O (3) DSR I GPIO HIGH LOW
I/O (4) LCD_ID I GPIO LOW HIGH
I/O (5) SIM_PWRCTRL O SIM HIGH HIGH
I/O (6) JACK_DETECT I GPIO LOW HIGH
I/O (7) LCD_RESET O GPIO HIGH LOW
I/O (8) SPK_EN O GPIO LOW(REC) HIGH(SPK)
I/O (9) CAM_HOLD O GPIO LOW HIGH
I/O (10) INDLED_R O GPIO LOW HIGH
I/O (11) INDLED_G O GPIO LOW HIGH
I/O (12) STROBE O GPIO RESERVED
I/O (13) HANDSFREE I GPIO HIGH LOW
I/O (14) NBHE O MEMORY
I/O (15) NBLE O MEMORY
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3.4 Analog Baseband (ABB) Processor
IOTA is Analog Baseband (ABB) Chip supports GSM900, DCS1800, PCS1900, GPRS Class 10 withDigital Basband Chip (Calypso G2).IOTA processes GSM modulation/demodulation and power management operations.
Block Description• Audio Signal Processing & Interface• Baseband in-phase(I), quadrature(Q) Signal Processing• RF interface with DBB (time serial port) • Supply voltage regulation
3.4.1. General Description
-26-
• Battery charging control• Switch ON/OFF • 1.8V/3V SIM card Interface• 4 internal & 4external ADC channels
Figure 9. Top level block diagram of the IOTA(TWL3014CGGM)
The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
3.4.2. Audio Signal Processing & Interface
-27-
Figure 10. Audio Interface Block Diagram
-28-
Figure 11. Uplink Path
The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB (±1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS). The auxiliary audio input can be used as an alternative source for higher level speech signals. This stage performs single-ended-to differential conversion and provides a programmable gain of 4.6 dB or 28.2 dB. The third stage is a headset microphone amplifier, compatible with electret microphones. The headset microphone amplifier has a gain of typically 18 dB and provides an external voltage of 2.0 V or 2.5 V to bias the headset microphone (HSMICBIAS). When one of the input stages (MICI, AUXI, HSMICP) is in use, the two other input stages are disabled and powered down. The resulting fully differential signal is fed to the analog-to-digital converter (ADC). The ADC conversion slope depends on the value of the internal voltage reference. Analog-to-digital conversion is performed by a third-order Σ-Δ modulator with a sampling rate of 1 MHz. Output of the ADC is fed to a speech digital filter, which performs the decimation down to 8 kHz and band-limits the signal with both low-pass and high-pass transfer functions. Programmable gain can be set digitally from -12 dB to +12 dB in 1-dB steps and is programmed with bits 4-0 (VULPG(4:0)) of the voicebanduplink register. The speech samples are then transmitted to the DSP via the VSP at a rate of 8 kHz. There are 15 meaningful output bits. Programmable functions of the VUL path, power-up, input selection, and gain are controlled by the BSP or the USP via the serial interfaces. The VUL path can be powered down by bit 0 (VULON) of the power down register.
3.4.3. Audio uplink processing
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The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions. The first function is to interpolate the input signal and to increase the sampling rate from 8 kHz up to 40 kHz to allow the digital-to-analog conversion to be performed by an oversampling digital modulator. The second function is to band-limit the speech signal with both low-pass and high-pass transfer functions. The filter, the PGA gain, and the volume gain can be bypassed by programming bit 9 (VFBYP) in the voiceband control register 1. The interpolated and band-limited signal is fed to a second order Σ-Δ digital modulator sampled at 1 MHz to generate a 4-bit (9 levels) oversampled signal. This signal is then passed through a dynamic element matching block and then to a 4-bit digital-to-analog converter (DAC). The volume control and the programmable gain are performed in the voiceband digital filter. Volume control is performed in steps of 6 dB from 0 dB to -24 dB. In mute state, attenuation is higher than 40 dB. A fine adjustment of gain is possible from -6 dB to +6 dB in 1-dB steps to calibrate the system depending on the earphone characteristics. This configuration is programmed with the voiceband downlink control register.
3.4.4. Audio downlink processing
Figure 12. Downlink Path
Baseband codec is composed of baseband uplink path (BUL) and baseband downlink path (BDL).BUL makes GMSK (Gaussian Minimum Shift Keying) modulated signal which has In-phase (I) component and quadrature (Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air.BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with input analog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270.833kHz data rate through BSP.
3.4.5. Baseband Codec (BBC)
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Figure 13. Baseband Codec Block Diagram
There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in G5500/7050.
3.4.6. Voltage Regulation (VREG)
-31-
Figure 14. Power Supply Scheme
-32-
Table 3-6. LDO Output Table
Output Voltage Usage
VRDBB 1.5V Digital Core of DBB
VRIO 2.8V Peripheral devices
VRMEM 2.8V External memory
VRRAM 2.8V LCD & peripheral devices
VRABB 2.8V Analog Block of ABB
VRSIM 2.85V SIM card driver
VRRTC 1.5V RTC & 32kHz-crystal
ABB ADC block is composed of 4 internal ADC (Analog to Digital Converter) channels and 4 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.
3.4.7. ADC Channels
Table 3-7. ADC Channel Spec
ADC 8 Channels
Resource Name DescriptionVCHG VCHG
Charging ManagementVBAT VBAT
ICHG ICHG
VBACKUP VBACKUP Backup Battery
ADIN1 ADIN1 Not Used
ADIN2 BATT_TEMP Battery Detect
ADIN3 TEMPSENSE Temperature Sensing
ADIN4 HOOK_DETECT HOOK_DETECT
Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of G5500/7050 is as follow.
3.4.8. Charging
Figure 15. Battery Block Indication
4.2V~3.82V 3.82V~3.73V 3.73V~3.62V 3.62V~3.35V
1. Charging method: CC-CV2. Charger detect voltage: 4.0V3. Charging time: 3h4. Icon stop current: 100mA5. Charging current: 420mA6. CV voltage: 4.2V7. Cutoff current: 50mA8. Full charge indication current (icon stop current) : 100mA9. Recharge voltage: 4.16V10. Low battery alarm
a. Idle: 3.62Vb. Dedicated: 3.50V
11. Low battery alarm interval :a. Idle: 3minb. Dedicated:1min
12. Switch-off voltage: 3.35V13. Charging temperature ADC range
a. ~ -5 : not charging operation.b. -5 ~ 50 : charging.c. 50~ : not charging operation.
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G5500/7050 Power State : Defined 4cases as follow
Power-ON : mobile is powered by main battery or backup battery. Power-OFF : mobile isn’t any battery. Switch-ON : mobile is powered and waken up from switch-off state. Switch-OFF : mobile is powered to maintain only the permanent function (ULPD).
To enter into Switch-ON state, one of followinf 4 condition is satisfied.
PWR-ON pushed after a debouncing time of 30ms. ON_REMOTE : After debouncing, when a falling edge is detected on RPWON pin. IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG.
3.4.9. Switch On/Off
G5500/7050 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22.
3.4.10. Memories
LCD module include: LCD: 128*160, 65,000 Color STN LCD LCD Backlight: White LED illumination and DC/DC converter Module
LCD module is connected to main board thru 26 pins FPCB.
3.4.11. Display & FPCB Interface
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LCD connector Interface Spec.
Table 3-8 LCD connector Interface Spec.
No Pin Name Pin Description1 Backlight LCD Back Light
2 VBAT Battery Voltage
3 L_LCD_CS LCD Chip Select
4 LCD_RESET LCD Reset
5 L_A(1) Address Data Selection
6 L_WR LCD Write Control7 L_D(0) Data input
8 L_D(1) Data input
9 L_D(2) Data input
10 L_D(3) Data input
11 L_D(4) Data input
12 L_D(5) Data input
13 L_D(6) Data input
14 L_D(7) Data input
15 L_D(8) Data input
16 L_D(9) Data input
17 L_D(10) Data input
18 L_D(11) Data input
19 L_D(12) Data input
20 L_D(13) Data input
21 L_D(14) Data input
22 L_D(15) Data input
23 GND Data input
24 V_SRAM Power Supply (2.8V)
25 NC Reserved
26 LCD_ID LCD ID
-35-
3.4.12. Keypad Switching & Scanning
Table 3-9. Keypad Map
KBC0 KBC1 KBC2 KBC3 KBC4KBR0 [Vol_Down] [Vol_Up] [OK] [REC] [CAM]
KBR1 [1] [2] [3] [F2] []
KBR2 [4] [5] [6] [SEND] []KBR3 [7] [8] [9] [F1] []
KBR4 [*] [0] [#] [C] []
DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ).
Figure 16. Keypad Scanning Scheme
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3.4.13. Keypad back-light Illumination
There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA .
Figure 17. Keypad Back-light Scheme
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3.4.14. LCD Illumination
There are 3 LEDs in the LCD module for LCD backlighting. DC-DC converter is mounted in LCD module.
Figure 18. LCD Back-light (LED_EN) Scheme
3.4.15. Audio Circuit
Figure 19. Microphone system
-38-
Microphone circuits
Main PCB
-39-
Keypad PCB
When a call is established, MICBIAS signal goes up to ‘2.5V’ in the G5500/7050. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA102, VA103 are employed to enhance ESD immunity.
Figure 20. Ear-Jack interface
-40-
Head set Jack Interface
When ear-mic set or head set plug is inserted into the receptacle, JACK_DETECT signal change from ‘L’ to ‘H’. If hook button is pushed for a second to make a call, then HOOK_DETECT signal goes from ‘H’ to ‘L’. Also call end has same mechanism by pushing hook button on the Ear- microphone strap. Ordinarily detection of pushing hook button is established by signal de-bouncing for about 20ms.
-41-
Figure 21. Dual mode speaker system switch
Speaker Circuits
Single package dual analog switches are employed to support both voice and MIDI sound mode with one speaker. The speaker is designed to support both receiver and loud speaker characteristics. If the SPK_EN port sets ‘H’, then the speaker will operate as loud speaker. The other case, the SPK_EN port will remain ‘L’ state.
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Figure 22. MIDI sound Circuit
MIDI SOUND circuit description
Midi synthesizer circuit includes YMU762B, external regulator(3.3V output)
-43-
The YMU762 has features as described below.
• Simultaneous generation of up to 40 tones:• Polyphonic synthesizer specification• Has built-in default tones for FM and Waveform table synthesizers in the ROM, and the tones can be downloaded to RAM.
• Stream replay with ADPCM/PCM• Software interrupt mechanism for external synchronization• Equipped with 8 bit parallel I/F for control from CPU• Equipped with speaker amplifier and equalizer circuit• Has built-in PLL to support inputting of master clock up to 20 MHz.• Contains a 16-bit stereophonic D/A converter.
3.5. Camera Circuit (G7050 only)
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Under camera action mode, CLC344E wholly controls LCD by itself to execute camera functions, while, under bypass mode, CLC344E lets all LCD driver-related signals bypass it, as if it does not exist at all in the system.
Figure 23. Camera Circuit Block Diagram
Sensor Camera ASIC(CLC344E) LCD
C_SD[7:0]
C_HSC_VS
C_PCLKC_MCLK
C_RESET
C_SDAC_SCK
L_DA[17:0]
L_CS
L_WR
L_RD
L_ADS
DBB
M_S
D[5
:0]
M_S
D[1
5:0]
M_C
S[1:
0]
M_R
D
M_W
R
M_A
DS
M_H
OLD
M_I
NTR
3.5.1. Camera Chipset
General description of CLC344E Camera chipset.
• External Clock Source Up to 27 MHz• Internal Clock Divider 1/2, 1/3, 1/4 for Sensor Clock Output• Support Standard SRAM Interface (6bit Address & 16bit Data) for CPU Interface• 4 Mbit Stacked SRAM• Support LCD Signal By-pass Mode• Fully Hardwired JPEG and Motion-JPEG Codec• Support three General Port IO• 8 x 8 100pin BGA Package
-45-
Figure 24. CLC344E, Camera Chip Block Diagram
The camera IC, CLC344E, is controlled through _RD, _WR, CAM_INT, CAM_HOLD, CAM_RST, ADD[1-6], DATA[0-15] by PD751992GHH(DBB). In by-pass mode, CLC344E bypasses all LCD control signal from PD751992GHH(DBB) to LCD module. In operating mode, CLC344E samples the image data from camera sensor connected on CN601 through C_CD[0-7], C_MCLK, C_PCLK, C_HS, C_VS, C_SDA, C_SCK, C_RST signals and controls the LCD module through L_A(1), L_D[0-15], L_WR, L_LCD_CS.The camera power is provided by U602 ADP3330. It converts VBAT from battery to 2.85V
-46-
Table 3-10. CLC344E Interface
Port Name Description
_WR Write control to CLC344E or LCD module
_RD Read control. The phone do not read data from LCD chip
CAM_INT Interrupt to DBB. It can be set to level or edge interrupt
CAM_HOLD This signal determines the camera operation mode. Making high, disable all CLC344E functions
CAM_RST This signal resets the CLC344E
ADD[1-6] Address lines from DBB
DATA[0-15] Parallel data lines from DBB
V_CAM 2.8V power supply to CLC344E
C_D[0-7] Sensor Data bus
C_RST Sensor reset
C_PCLK Sensor input data sampling clock
C_MCLK Sensor clock
C_SDA IIC bus data line
C_SCK IIC bus clock line
C_PWDN Sensor power down control pin
L_D[0-15] Parallel data lines to LCD module
L_A[1] Address control LCD module
L_LCD_CS LCD chip select
L_WR Write control LCD data line
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Figure 25. CLC344E, Camera Chip Circuit
-48-
Figure 26. LCD Connection Thru CLC344E, Camera chip
3.5.2. CMOS Image Sensor
General description of CIS Camera Module
• Optical Size: 1/4 inch • Unit Pixel: 5.6 μm X 5.6 μm• Effective Resolution: 640X480, VGA • 8.5mm X 9.5mm X 6.6mm module size • 8-bit CCIR656 (YCrCb) Video Output • VGA Output Capability • Programmable Gamma Correction • Auto White Balance and Auto Exposure Control • Horizontal and/or Vertical Mirror Output • Standby-Mode for Power Saving • Maximum 30 Frame per Second • Single Power Supply Voltage: 2.8V • I2C Type Control Interface
-49-
Figure 27. Camera Module Block Diagram
The Camera module is fully functional camera module with embedded lens. A low-noise low-power color CMOS image sensor, and an image signal processor, produce high-quality digital video output including CCIR656 format with maximum 30 frames per second for full frame readout. The CMOS image sensor, fabricated by SAMSUNG 0.35μm CMOS image sensor process technology which is dedicated to higher-sensitivity and lower-dark level compared to standard CMOS process technology and on-chip CDS and 10-bit column ADC circuit makes high signal-to-noise ratio with low power consumption. The image sensor, signal processor and some passive components are packed with IR-cut filter and lens units to have very small volume of whole camera system. It needs only 2.8V single power supply and a main clock supplied to operate. All the function can be controlled by control register setting through the standard 2-wire serial interface.
Pixel Array640(H)×480(V)
TimingController
10-b
it A
DC
Line Buffer
Pre Processor
LuminanceSignal
Processor
Post Processor
ChromaSignal
Processor
RISC Processor OutputFormatter
(AE,AWB Processor)
S5K433LA03CMOS Image Sensor
GN
DC
VDD
AC
VDD
DC
GN
DI
VDD
DI
S5C7322XImage Signal Processor
Lens Unit
I2C Bus
MCLK
VSYNCHSYNCPCLKDATA0-7
SDASCLSTBYRST
-50-
Figure 28. Camera Module Circuit
4. TROUBLE SHOOTING4.1 Main Components Placement (G5500)
-51-
CN602(LCD)
LED201
CN402(KEYPAD)
LCD AREA
VIB
J301
U504 SW202
SW201
U301
U302
CN403
U401CN401
U102
U101
U201U202
U503U502
U508
FL503FL502
U510
U303
SW501
FL501
U507U506
Q201
U203
U204
SPK
Q203
U505
BAT101
X101
4.1 Main Components Placement (G7050)
-52-
VIB
J301
U504 SW202
SW201
U301
U302
CN403
U401CN401
U102
U101
U201U202
X101
U507U506U503
U502U508
U505
FL503FL502
U510
FL501
SW501
U303
U601U602
Q601
LCD AREA
LED201
CN602(LCD)
CN402(KEYPAD)
CN601
Q201
U203
U204
SPK
Q203
BAT101
4.2 Main Components (Description)
-53-
LED201 Indicator LED U201 Memory(128M Flash+64M SRAM)
BAT101 Backup battery (3V) U202 IrDA port
CN401 IO connector U203 Indicate LED control switch
CN402 FPCB connector (Keypad) U204 Vibrator control TR
X101 Crystal (24MHz oscillator) U301 MIDI chipset (YMU762)
CN403 SIM card connector U302 Audio power source
CN602 Connector (LCD) U303 Receiver/Ear-mic select switch
FL501 Mobile switch U401 Charging current control TR
FL502 EGSM SAW Filter U502 Synthesizer IC (Si4200)
FL503 DCS SAW Filter U503 Synthesizer IC (Si4201)
J301 Ear-mic connector U504 PAM
Q201 Indicate LED control TR U505 Synthesizer IC(Si4133)
Q203 Power/slide control TR U506 AFC control VCXO(13MHz)
SPK Cable connector (Speaker) U507 PLL control OP-AMP
SW201 Side Key (down) U508 RF power source
SW202 Side Key (up) U510 Antenna Control
SW501 Antenna Switch VIB Cable connector (vibrator)
U101 Digital Baseband Chipset (Calypso) U102 Analog Baseband Chipset (IOTA)
LED201 Indicator LED U201 Memory(128M Flash+64M SRAM)
BAT101 Backup battery (3V) U202 IrDA port
CN401 IO connector U203 Indicate LED control switch
CN402 FPCB connector (Keypad) U204 Vibrator control TR
X101 Crystal (24MHz oscillator) U301 MIDI chipset (YMU762)
CN403 SIM card connector U302 Audio power source
CN601 Connector (Camera Sensor) U303 Receiver/Ear-mic select switch
FL501 Mobile switch U401 Charging current control TR
FL502 EGSM SAW Filter U502 Synthesizer IC (Si4200)
FL503 DCS SAW Filter U503 Synthesizer IC (Si4201)
J301 Ear-mic connector U504 PAM
Q201 Indicate LED control TR U505 Synthesizer IC(Si4133)
Q203 Power/slide control TR U506 AFC control VCXO(13MHz)
SPK Cable connector (Speaker) U507 PLL control OP-AMP
SW201 Side Key (down) U508 RF power source
SW202 Side Key (up) U510 Antenna Control
SW501 Antenna Switch VIB Cable connector (vibrator)
U101 Digital Baseband Chipset (Calypso) U102 Analog Baseband Chipset (IOTA)
G5500
G7050
U601 Camera chipset (CLL344E) U602 Camera block power source
4.3 Keypad Components Placement (Common)
-54-
KEYPADLED
KEYPADLED
KEYPADLED
KEYPADLED
(Hall Effect Switch)MICU101
CN101
4.4 Baseband Components
-55-
LCD FRONT PART LCD REAR PART
RECEIVER/SPK VIBTATOR
4.5 Power On Trouble
-56-
4.5.1 Power On Sequence
Connecting Battery
• Power-On Key Detection• PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal• ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso
4.5.2 Check Points
• Battery Voltage• Power-On Key Detection (PWON signal)• Outputs of LDOs
4.5.3 Trouble Shooting Setup
• Connect PIF-UNION to the phone• Set the TI-remote switch PIF-UNION off
4.5.4 Trouble Shooting Procedure
• Check Battery voltage• END_KEY Dome Switch condition• Check the output voltages of all LDOs
4.6 Charging Trouble
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• Charging method : CC-CV• Charger detect voltage : Over 4.0V• Charging time : About 3hours • Charging current : 420mA • Cutoff current : 50mA• Low battery alarm
-. Idle : 3.62V-. Dedicated : 3.50V
4.2V~3.82V 3.82V~3.71V 3.71V~3.62V 3.62V~3.35V
• Switch-off voltage : 3.35V• Charging temperature adc range
-. ~ -5 : not charging operation. -. -5 ~ 50 : charging.-. 50~ : not charging operation.
Block Diagram
Charging Current
-58-
Charging Procedure
• Connecting TA & Charger Detection• Control the charging Current by ABB• Charging Current flows into the Battery
Check Points
• Connection of TA• Charging Current Path• Battery
Trouble Shooting Setup
Trouble Shooting Procedure
• Check the charger connector.• Check the charging current path.• Check the battery
START
I/O Connector(CN401)Is well-soldered?
Voltage at pin 4,6 of U401= 5.2V ?
U401, D401, R410Is well-soldered?
Voltage across R410 Is about 10~100mV ?
Resolder the CN401
Battery ok?
Charge is operating properly
The TA is out of orderChange the TA
Resolder U401, D401,R410
Replace U401, D401
Change the battery
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No
• Connect Battery & TA to the handset.
4.7 LCD Display Trouble
-59-
Check soldering around connector
LCD Control Signals From Main Board
• Backlight, L_LCD_CS, LCD_RESET, L_WR, LCD_ID, L_A(1), L_D(0)~L_D(15)
Check Points
• The Assembly status of the LCD Module.• The Soldering of connectors• The FPCB which connects the LCD module with the main board.
Trouble Shooting Setup
• Connect PIF, and power on
-60-
START
NoPower is supplied tothe board?
Yes
Refer to Power On Trouble
Connection betweenModule and board is OK?
No Reconnect LCDModule
Yes
CN602 is soldered well?No
Resolder the CN602
Yes
Paths of LCD controlsignals are OK?
No ResolderR658, R619-R638
After changing the board,LCD Display is OK?
No The board is broken.Change the board.
LCD Module is out of order.Change the LCD Module.
Yes
Yes
4.8 Receiver Trouble
-61-
Block Diagram
Melody Generation
• U301(YMU762,MIDI) is controlled by DBB.• U301 generates 40poly MIDI sound and it is delivered to the speaker via U303 (analog SW) & connector socket.
Signals to the receiver
• RCV_P,RCV_N From ABB• SPK_RCVN, SPK_RCVP to Receiver via U303 (analog SW) & connector socket
Calypso(U101)
IOTA(U102)
YMU762(U301)
Control
RCV_P/RCV_N
RC filter
SPKP/SPKN
EAR_P/EAR_N
Analog SW(U303)
SPK_RCVP/SPK_RCVN
RECEIVER(SPK)
Check Points
• Audio signals from ABB• Audio signals to the receiver• Audio signal path• Check the sound level to the speaker.• Soldering of connector & speaker/receiver• Speaker/Receiver
-62-
Receiver Trouble Shooting Setup
• Initialize GSM MS test equipment.• Connect PIF-UNION and power on. • Make a test call to 112.• Set audio part at test equipment as PRBS or continuous wave, not echo.• Set the audio volume max.
Check the statesthese points !
Trouble shooting Procedure
• Check the audio signal levels at each point.• Check the soldering of the connector.• Check the soldering of the receiver.• Check the receiver.• Check the connection of socket.• Check receiver socket and cable states.
Speaker Trouble Shooting Setup
• Connect PIF to the phone, and power on. • Enter the engineering mode, and go to menu“Baseband → Alert → Ring”
Trouble Shooting Procedure
• Check the voltage levels of power supplies.• Check all sound path.• Check the sound level to the speaker.• Check the speaker and the soldering and socket.
-63-
START
No
Yes
ABB is out of order.Change the board.
SPK_EN signal is low?No Resolder the U303.
Otherwise change it.
Yes
NoReconnect the cable
Does sine wave appearat R308, R309?
Connection betweencable and board is OK?
Twist pair cable of receiverIs OK?
Change the receiver
No Trouble
4.8.1. Receiver Trouble
No
Yes
Yes
Set audio part at test equipment as PRBS or continuous wave, not echo. Set the
audio volume max.
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4.8.2. Speaker Trouble
START
No
Yes
No Reconnect receiver
Yes
Soldering of SPKis OK?
No Resolderthe SPK
Yes
Yes
Does sine wave appearat C306, C307?
Melody IC is out of order.Change the U301.
Connection betweenreceiver and board
is OK?
Speaker OK
SPK_EN signal is high?No Resolder the U303
otherwise Change it.
Yes
V_SRAM & V_IOis 2.8V?
No Resolder the U301otherwise Change it.
Enter into Engineering Mode andgo to menu “Baseband → Alert → Ring”
4.9 Microphone Trouble
-65-
Block Diagram
IOTA
Main Board
Keypad
-66-
Microphone Signal Flow
• MIC is enable by MICBIAS• MICBIAS, MICP, MICN signals to ABB
Check Points
• Microphone bias• Audio signal level of the microphone• Soldering of components• Connection of FPCB
Trouble Shooting Setup
• Initialize GSM MS test equipment.• Connect PIF-UNION to the phone, and power on.• Make a test call to 112. • Make a sound in front of the microphone
MIC BiasC325
MICNMICP
Trouble Shooting Procedure
• Check the bias of the microphone.• Check the audio signal path. • Check the soldering.• Check the microphone.• Check the operation of FPCB
MIC BiasR116
MICN
MICP
MICP
MICN
The waveforms at MICP and MICN
AC voltages of the signals
-67-
START
No Resolder the R330, R321
A few hundredsof mV of signals are
measured ?
Yes
The soldering of R330, R321 is OK?
Yes
The voltage of R116is 2.5V?
The MIC is out of order.Change the MIC.
No
ABB is out of order.Change the board.
YESResolder the
L301, L302, C327, C330, C326, C331
and C328
The soldering of L301, L302, C327,C330, C326, C331
and C328 is OK?
Yes
The soldering of C105 is OK?
No
Resolderthe C105
No
Connection is between FPCB and
CN402 is OK?Connection is between FPCB and
CN101 is OK?Reconnection ofFPCB and Keypad
YesYes
No
Yes
No Reconnection ofFPCB and Keypad
No
Connect the handset to network equipment and
setup call.
Check the signal level at pin 1,2 of the MIC after putting audio signal into the MIC.
4.10 Vibrator Trouble
-68-
Block Diagram
Vibrator Operation
• Vibrator is controlled by MIDI chip• When vibrator signal is high, vibrator is enabled
Check Points
• VCC lines (V_IO) of MIDI chip• Vibrator signal path• The connection between the main board and vibrator module• The soldering of socket• The Vibrator (PORON t=2.5mm)
Trouble Shooting Setup
• Connect PIF to the phone, and power on. • Enter the engineering mode. • Go to menu “Baseband → Alert → Vibrator”
Trouble Shooting Procedure
• Check vibrator signal• Check soldering of components• Check connection of cable-to-socket • Check vibrator PORON thickness
Vibrator
CheckPORON t=2.5mm
Vibrator Signal
Checksoldering !
-69-
START
No
Yes
Change the board
U204, R222, L201 aresoldered well ?
No Resolder the U204,R222, L201
Yes
Connection between cable and
socket is OK?
No Reconnection betweencable and socket
Yes
Cable of vibrator is OK? No
Signal of pin1 of U204 is OK?
Vibrator is out of order.Change the Vibrator.
Voltage of C308 is 2.8V
No
YesU301 is out of order
Not connectionChange the Vibrator.
Yes
Enter into Engineering Modeand select Vibrator
4.11 Keypad Backlight Trouble
-70-
Block Diagram
Backlight Operation
• The keypad LED backlight is controlled with KEY_LED signal.• KEY_LED signal from ABB.• The LEDs are forward biased and turned on.
Check Points
• KEY_LED signal• LEDs• Operation of FPCB
Trouble Shooting Setup
• Connect PIF-UNION to the phone, and power on. • Enter the engineering mode. • Go to menu “Baseband → Backlight → Keypad on”
Trouble Shooting Procedure
• Check the soldering of components• Check the KEY_LED signal • Check LEDs
Check KEY_LED signal
R113,R114
Checksoldering !
-71-
Operation of FPCB is OK?
START
No
Yes
ABB is out of order.Change the Board.
Yes Replace the ALL LED.It is out of order.
No
Resolder the path of LED and Resistor.
The Voltage of KEY_LED signal
is about 0V?
Is there anything that resistor value across LED
is under 10Ω?
No
Yes
The path is OK?
The LED is out of order.Change the LED.
Yes
ABB is out of order.Change the Board.
Enter into Engineering Modeand select Keypad On
Power off and Measure the Resistor Value of all LEDs.
No
4.12 Slide Open/Close Trouble
-72-
Block Diagram
Flip Operation
• There is a magnet to detect the Flip status, opened or closed.• If a magnet is close to the hall-effect switch(U101), the voltage at pin 2 of U101 goes to 0V. Otherwise, VBAT.
• This Flip signal is delivered to DBB, and the status of Flip is reported.
Main Board
Flip Signal Status
L : Close (Magnetized)
H : Open (Not magnetized)
Keypad
-73-
START
No
Yes
Resolder the C102,C103, C204,R411
The VBAT is over 3.35V? No Refer to Power On Trouble.
Yes
The Flip signal is lowon magnetizing into U101?
No Replace the U101.U101 is broken.
Yes
The all paths connected to U101 are OK?
The DBB(Calypso) is broken.Change the board.
Operation of FPCB is OK? NO Change FPCB
Yes
4.13 SIM Detect Trouble
-74-
Block Diagram
Connection between SIM and DBB
• SIM_CLK, SIM_IO, SIM_RST
SIM_IOSIM_CLKSIM_RST
SIM_PWRCTRLSIM_CD
DBB ABB
VRSIMDBBSIODBBSCKDBBSRST
SIMCLKS IMIO
SIMRST
SIM
VPPCLKIORST
V_IO
150p 22p
10k
V_SIM
1u
10k
①
③⑥
Check Points
• Contact between SIM and socket-. Soldering of SIM socket
Trouble Shooting Setup
• Insert the SIM into socket -. Connect PIF to the phone, and power on.
Trouble Shooting Procedure
• Check the power supply.-. Check the soldering of SIM socket.-. Check the SIM.
④
-75-
START
No
Yes
Resolder the CN403.
No Resolder theC403,C410,C402,R401
Yes
The SIM Card is OK?No SIM card is broken.
Change the SIM Card.
Yes
The soldering of SIM connectoris OK?
The ABB(IOTA) is broken.Change the board.
The all paths connected to CN403 are OK?
Insert the SIM Card
To U102(IOTA)
From U102(IOTA)
The direction of the audioSignal from ear-mic
4.14 Earphone Trouble
-76-
Block Diagram
Earphone Detecting Operation
• The DBB read JACK_DETECT port periodically and if the voltage of Pin1 of U304 goes to High and the voltage at “JACK_DETECT” 2.8V, it detects ear-jack inserted.
• The ABB operates A/D conversion continuously and if the voltage of “HOOK_DETECT” node goes to 0V, it detects hook switch is pushed.
DPSOUND
GNDGND
VCCMIC
EAR_JACK SPEC
CAM
EAR
Vcc
HSMICP N,C GND
D+ D- GND
HSO
Earphone Sending Path
• HSMICP is the audio signal from the microphone of the earphone.• L305, L303 and C318 make the path of the audio signal from the microphone of the earphone.• This audio signal is delivered to ABB(IOTA).
Earphone Receiving Path
• HSO is the audio signal from ABB(IOTA).
-77-
“HOOK_DETECT”signal(R319,C323)
The audio Signal to ear-mic (L316, C319)
The audio Signal from ear-mic (L303,L305,C318)
The audio Signal to ear-mic(L304)
“JACK_DETECT”signal (Pin1 of U304)
-78-
START
No1. Earphone detection problem
Can you hear the sound
from the earphone?
Yes
Soldering of C319,L304,L306
is OK?
No Resolder theC319,L304,L306
Does the Audio profile change
to the earphone mode?
The ABB is out of order.Change the board.
2. Sending Path problem
Yes
Soldering of J301is OK?
Resolder theJ301
Yes
The earphone is OK? Change the Earphone.
Yes
cf) PRBS : Pseudo Random Bit Sequence
Insert the earphone into the headset.
Set the audio part of test equipment to PRBS or continuous wave mode
No
No
No
-79-
No
Yes
Resolder theC687,R311, R665.
Yes
The Voltage at Pin1 of U304
is 0V?
The voltage at R316,R312
is 0.02V ~ 0.25V?
The soldering of C687,R311,
R665 is OK?
No
Yes
NoResolder the J301.The soldering of J301
is OK?
Yes
The ABB is out of order.Change the board.
Resolderthe R316,R312
The soldering of R316,R312
is OK?
Yes
The ABB is out of order.Change the board.
No Resolderthe U304
The soldering of U304is OK?
Yes
1. Earphone detection problem
No No
-80-
2. Sending Path problem
No Resolder theL303,L305
Yes
Yes
No Resolderthe C318
The soldering of C318
is OK?
The ABB is out of order.Change the board.
The voltage at L303is 1.1V ~ 1.3V?
A few tens or hundreds
of mV of signals at C318are measured ?
No Resolderthe J301
The soldering of J301
is OK?
Yes
No
Yes
The earphone is OK? Change the Earphone.
Yes
The ABB is out of order.Change the board.
Set audio part of the testequipment to the echo mode.
No
4.15 Infrared Data Association Trouble
-81-
Block Diagram
Infrared Signal Flow
• Infrared is enable by SD• TX_IRDA,RX_IRDA,SD_IRDA signals from DBB
Check Points
• Check the power supply.• Check the soldering of Components• Check the IrDA Transceiver
-82-
Trouble Shooting Setup
• Enter the engineering mode. • Go to menu ‘Baseband → IrDA Test’
Trouble Shooting Procedure
• Check the SD,TX, RX signal.• Check the soldering.• Check the IrDA Transceiver.
Tx_IrDA
Rx_IrDA
SD_IrDA
Tx_IrDA
Rx_IrDA
Searching… Enabled (TX_IrDA)
Enabled(RX_IrDA)
-83-
START
No
Yes
Resolder the C202
NoChange the U201.
The soldering of U201 is OK?No
Resolder the U201.
Yes
The power is supplied to U202?
The DBB is broken.Change the board.
The signal “TX_IrDA, RX_IrDA”are measured?
Yes
Set configuration like Fig 1.Execute PCSync program
(ContentsBank.exe)
Figure 1.
Phone
PC IlluminationCone
30 Cm
4.16 Camera Trouble (G7050 only)
-84-
SETTING : Connect PIF, and set remote switch ON at PIF
Checking Flow
START
NoDoes the LCDitself has no trouble Go to the LCD trouble
Set the camera button ON
Check the voltage of Pin3 of Q601 is
2.85V
Check the voltage of Pin1 of
Q601 is 0V
No NoChange the main board
Is the connection of FPCB
with CN601 connector on PCB OK?
Check the voltage of Pin2 of
Q601 is 2.85V
No No NoCheck the voltage of Pin6 of
U602 is 2.8VChange
U602
Check the voltage of Pin2 of
U602 is >3.35V
NoCharge or
change battery
U602Check the soldering of CN601
on PCB
Check the soldering of serial resisters
of CN601
Does the image appears on LCD?
Camera will work properly
NoResolder CN601
NoResolder the resisters
NoChange the camera module
Yes
Yes
Yes
Yes
Yes
Yes
Yes
-85-
U602
FB616
CN601
Q601
C686
C633 19 1
20 2
1 3
U601
6 4
Test Points
RF Rx pass Trouble Shooting
-86-
CheckRegulator Circuit
CheckVCTCXO Circuit
CheckPLL Control
Signal
CheckANT SW & Mobile SW
CheckSAW Filter
Circuit
CheckRx I/Q
Re-download SW & Cal
E5515C : Test ModeCH62, 7 level setting (TCH)CH62, -60 dBm setting (BCCH)
Spectrum Analyzer settingOscilloscope setting
START
Checking Regulator Circuit (Rx pass continued)
-87-
2.85V?
Check Pin 1
Pin 6 High?
Check U101
No
No
Regulator circuit is OK See next page to check
VCTCXO circuit
Replace U508
Yes
Yes
Pin 1
Pin 6
U508
Ch1 : Pin 1
Ch2 : Pin 6
Checking VCTCXO Circuit (Rx pass continued)
-88-
13MHz ?
Check Pin 3 of X3
Pin 4 2.85V ?
Check U508
No
No
VCTCXO circuit is OKSee next page to checkANT SW & Mobile SW
Replace U506
Yes
Yes
Pin 3 Pin 4
Pin3 Pin4
Checking PLL Circuit (Rx pass continued)
-89-
Signal is normal?
Check S_CLK, S_EN, S_DATA
PLL circuit is OK.See nest page to check ANT SW & Mobile SW
Download SWNo
Yes S_ENS_DATA
S_CLK
S_EN S_DATAS_CLK S_EN S_DATA S_CLK
Checking ANT SW & Mobile SW (1) (Rx pass continued)
-90-
NoShort ?
No
Yes
Yes
Check SW501 Pin 1,2 withno RF cable connected
Check SW501 Pin 1,2 withRF cable connected
Open ?
Check VC1, VC2 of FL501
VC1=LowVC2=Low
Yes
Replace SW510
Replace SW501
No Replacethe board
Check RF Level FL501 Pin1,10
≥ -63dBm
ANT SW & Mobile SW is OK.See next page to check SAW
Yes
No ReplaceFL501
Rx standalone mode is needed
Checking ANT SW & Mobile SW (2) (Rx pass continued)
-91-
SW501 pin1
SW501 pin2
FL501 VC2
FL501 VC1
Checking SAW Filter Circuit (Rx pass continued)
-92-
≥ -65dBm
Check RF LevelFL502 Pin 4FL503 Pin 4
SAW Filter circuit is OK.See next page to check Rx I/Q
ReplaceFL502/FL503
No
Yes
FL502 pin4 FL503 pin4
Checking Rx I/Q (Rx pass continued)
-93-
I/Q is normal?
Check I/Q
Redownload the software& Calibration
Replace U503No
Yes
RXQPRXQN
RXIP
RXIN
RXQP RXIP
RF Tx pass Trouble Shooting
-94-
CheckRegulator Circuit
CheckVCTCXO Circuit
CheckPLL Control
Signal
CheckTx I/Q
CheckPAM Control
Signal
CheckANT SW &Mobile SW
Re-download SW & Cal
E5515C : Test ModeCH62, 7 level setting (TCH)CH62, -60 dBm setting (BCCH)
Spectrum Analyzer settingOscilloscope setting
START
Checking Regulator Circuit (Tx pass continued)
-95-
2.85V ?
Check Pin 1
Check U101
Regulator circuit is OK.
See next page to check
VCTCXO circuit
Yes
No
Pin 6 High ?
No
Replace U508Yes
U508Ch1 : Pin 1
Ch2 : Pin 6
Pin 6
Pin 1
Checking VCTCXO Circuit (Tx pass continued)
-96-
13MHz ?
Check Pin 3 of X3
Check U508
VCTCXO circuit is OK.
See next page to check
ANT SW & Mobile SW
Yes
No
Pin 4 2.85V ?
No
Replace U506Yes
Pin 3 Pin 4
파일
Pin3 Pin4
Checking PLL Circuit (Tx pass continued)
-97-
Signal is normal?
Check S_CLK, S_EN, S_DATA
PLL circuit is OK.See nest page to check ANT SW & Mobile SW
Download SWNo
YesS_ENS_DATA
S_CLK
S_EN S_DATAS_CLK S_EN S_DATA S_CLK
Checking Tx I/Q (Tx pass continued)
-98-
Normal?
Check I/Q
Redownload the software and calibration
Replace U102No
Yes
TXQN
TXQP TXIP
TXIN
TXIP TXQP
Checking PAM Control Signal (Tx pass continued)
-99-
Normal?
Check APC, RF2.85V,PA_ON, PA_BAND
Control signal is OK. See next page to Check ANT SW & Mobile SW
Download the SWNo
Yes
APC
PA_BAND
RF2.85V
PA_ON
PA_BAND PA_ON RF2.85V APC
Checking ANT SW & Mobile SW (1) (Tx pass continued)
-100-
No≥ -63dBm
No
Yes
Yes
Check RF Level FL501 Pin 3,5
Check VC1, VC2 of FL501
VC1=Low & VC2=High orVC1=High & VC2=Low ?
Check FL501 Pin 8
Replace U504
Replacethe board
≥ 20dBm
Check SW501 Pin 1,2 with no RF cable connected
Yes
Tx standalone mode is needed
Short ?
Check SW501 Pin 1,2 withRF cable connected
Yes
Open ?
ANT SW & Mobile SW is OK.Change the board
Yes
No ReplaceFL501
No ReplaceSW501
No ReplaceSW501
Checking ANT SW & Mobile SW (2) (Tx pass continued)
-101-
SW501 pin1
SW501 pin2
FL501 VC2
FL501 VC1
5.1 Disassembly (G5500)
5. ASSEMBLY INSTRUCTION
-102-
-103-
-104-
-105-
-106-
-107-
5.2 Disassembly (G7050)
-108-
-109-
-110-
-111-
-112-
-113-
6. DOWNLOAD6.1 Download Setup
Figure 6-1 Describes Download Setup
Preparation• Target Handset (G5500/7050)• Data kit• Battery• IBM compatible PC supporting RS-232 with Windows 98 or newer
If you use data kit, you should have a battery with the voltage above 3.7V.
6.1.1 In case of using the Data kit
6.1.2 In case of using the PIF
Preparation• Target Handset (G5500/7050)
• PIF • RS-232 Cable and PIF-to-Phone interface Cable • TA/Power Supply or Battery
• BM compatible PC supporting RS-232 with Windows 98 or newer
If you use battery, you should have a battery with the voltage above 3.7V.
-114-
6.2 Download Procedure
1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu.
-115-
2. Click the “Add” button. Then, choose m0 file which is going to download.
-116-
3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader. It is recommended not to erase bootloader. The third is to decide whether you take delta-download, or not. If you use delta-download, You can save download time through comparing m0 and flash block, and not downloading flash block same with m0 file.
-117-
4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below.
-118-
5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program”button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started.
-119-
6. Wait for downloading to be finished.
-120-
7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.
-121-
7. SERVICE AND CALIBRATION7.1 Service S/W
7.1.1 Overview
This service S/W is used for Calibration and Standalone test.
7.1.2 Hardware and Software Environment
• More than 486 computer• 16Mbyte RAM• Remained more than 10Mbyte in Hard Disk Memory• Under Microsoft window 98 or more than
7.1.3 Software Installation
Unzip the phones service software provided where slide you want there are some files extracted in that slide. Start Setup.exe in Service software setup slide. RampTable.dat, default transmit ramping table, and rf_original_L300.epm, default calibration data, are located in window system slide so that these files are loaded automatically, if you execute LaputaService.exe.
7.1.4 Common Properties of Service Software
When you execute this program, you’ll see the below user interface window titledLAPUTA_Service Tool in figure 7-1. The LAPUTA_Service Tool has five main frames.
-122-
A. Target System Frame
This is for initializing the target phone. When you use this program to test G5500 phone, you have to initialize target at first. To initialize target phone, select target (G5500 is default) and COM port used at your computer and then click the Initialize button. If target initializing is ended successfully, the box in red below the initialize button will turn into green.
B. RX AGC Test Frame
At this part, you can control receiver path of target phone.
Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel. You can change thevalue by clicking arrow button by one step or just entering the number directly.
Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
AGC Value Setting
You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.
Power Measurement
The number means channel index according to pre-defined ARFCN. There are 12 pre-defined ARFCNswithin Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button to change number, you can see TCH and BCH ARFCN changed automatically. PM window displays the power level measured in baseband chip. PM value is useful to calculate the received absolute power. The unit of PM is dBd.
PM Start
You can measure Rx power that target received from test equipment. When you click this buttonthe result of power measurement displayed at PM blank in Power Measurement frame. You canmeasure PM for all 12-channel indexes by changing Number and clicking PM Start.Calculate
You have to do this work after measuring PM for all 12-channel indexes. When you click this button, service software calculate the calibration data from measured 12 PM data.
Standalone
This button makes target operate in Rx mode continuously. Target will be operated under the condition that you set. During continuous receiving mode, label of Standalone button is changed to Stop.If you want stop receiving mode operating, click this button one more.
-123-
C. TX APC Test Frame
At this part, you can control transmit path of target phone.
Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel.
Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
Power Level Setting
First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequencythat you selected before. Then select the Level and adjust the DAC value. Level means GSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value is a factor to determine output power. Its variable range is 0 to 1023.
Uplink Normal Burst test
You can also control the traffic slot number be using by changing TCS value. Because GSM has8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. You cansend all data 0, or 1 or repeating of 1010. But it is good to you to using the default value because data format doesn’t affect to RF characteristics.
Test
Transmitting is started when you click this button. During Transmitting, label of Test button is changed to Stop. If you want stop transmitting, click this button one more.
D. RF Parameter Download Frame
Saving epm file into Flash
When you have a epm file, contains calibrated data, and you want to download into target Flash,check Flash and click File Download button. Then you can see RF parameters Save window.Select epm file you want to save into Flash then click Open. During saving file into Flash, Thestatement bar indicating download process is displayed under the RF Parameter Download frame. As successfully ending download, information box will be appeared. Click Ok.
Saving Cal. Data to Flash
After Rx or Tx calibration, you can save the calibration results into Flash and epm file. Check Flash and click Calib Save button. Then you can see RF parameters Save window. Write the file name and click Save button.
-124-
E. User Command and Results Frame
Whenever you click button or make some event in service software, every ordered event is displayed in this frame. You can also see calibration results here.
F. Ramp shape button
This button is for burst shape table. But it is deactivated in service software.
7.2 Calibration
7.2.1 Overview
The calibration values of the phone reside on the Flash. The contents of the Flash can be read by the service software and saved as a file. This is advisable when there is need to retain that information, e.g. in view of replacement of the circuit. The program also enables writing the default parameters on the Flash, in which case all calibration steps should be carried out. The service software can’t control the equipment, so only manual calibration process is possible.
7.2.2 Equipment List
Table 7-1. Calibration Equipment List
Equipment for Calibration Type / Model Brand
Wireless Communication Test Set HP-8960,HP8922,CMU200, any other call equipment
RS-232 Cable and Test JIG
RF Cable
Power SupplyService S/W Laputa
PC (For Software Installation) Pentium Ⅱ class above 300MHz
-125-
7.2.3 Equipment Setup
Mobile Switch Cable
Power Supply GPIBCable
PCBattery Simulator
Jig
TA
Figure 7-1 Calibration Equipment List
GSM Test Set(8960)
GPIB Cable
7.2.4 Calibration steps
In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary. Also, due to AGC implementation, some AGC specific constants need calibration. In total, three calibrations are required per receive band, AGC calibration, channel compensation and temperature compensation. Of these, temperature compensation is not needed in replacement of the circuit. In AGC calibration the reference power fed into the phone via permanent antenna connector is –74dBm. In channel compensation, the channel numbers in Rx band are;
A. RX Calibration
E-GSM band : 0, 40, 124, 975, and 1023.DCS band : 512, 574, 636, 700, 760, 822 and 885.
Procedure
a) Initialize phone by clicking Initialize button.b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, same with
phone.c) Set the power of GSM test equipment ‘–74dBm’.d) Click the PM Start button, then the value, received power by phone, is displayed in PM measurement
window at service software.e) Change the BCH and TCH of phone by clicking the Number button and set the channel
(BCH & TCH) of equipment to be same.
-126-
f) Click the PM Start button.g) Repeat above procedure until the displayed number in Power Measurement window is 12.h) Click the Calculate button, then the service software calculate the channel compensation parameters.i) Saving updated calibration data into phone by clicking Calib Saving button.
NOTE
If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels forDCS1800, the service software reports, “Please execute after measuring the PM”.
B. TX Calibration
In order for the Tx power to be within the GSM specifications for each Tx level, some calibration is necessary. In total, four calibrations are required per transmit band, power calibration, channel compensation, temperature compensation and low voltage compensation. Of these, temperature compensation and low voltage compensation are not needed in replacement of the circuit and channel compensation is not needed because the transmit power is in GSM specification with enough margin In power compensation, the channel numbers used in Tx band are;
E-GSM band : 62.DCS band : 699.
And the target powers in dBm for each power level are;
Table 6-2 TX Target Powers
Power Level GSM DCS0 291 282 263 244 225 32 206 31 187 29 168 27 149 25 1210 23 1011 21 812 19 613 17 414 15 215 13 016 1117 918 719 5
-127-
Procedure
a) Initialize phone by clicking Initialize button.b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you have to
match test equipment’s BCH and TCH ARFCN with this value. For each power level, adjust the DAC value to get target power and click Test button. Then you can see the output power displayed on test equipment.
c) Saving updated calibration data into phone by clicking Calib Saving button.
7.2.5 Test JIG Operation
JIG Power
Equipment DescriptionPower Supply Usually 4.0V
DC Adaptor 9.5V, 500mA
JIG DIP Switch
Switch Number Name DescriptionSwitch 1 ADI_REMOTE In On state phone is awaked. Not used OFF state
Switch 2 TI_REMOTE In On state phone is awaked.Switch 3 VBAT Power is provided for phone from Power supply
Switch 4 PS Power is provided for phone from DC adaptor
JIG LED
LED Number Name DescriptionLED 1 POWER Power is provided for test JIG
LED 2 TA Indicate charging state of the phone battery with travel chargerLED 3 MON STATUS Indicate date transfer state through the UART IrDA
LED 4 UART STATUS Indicate date transfer state through the UART MODEM
Operation
1) Connect the RS232 serial cable between COM port of notebook and MON port of test JIG in general2) Set the power supply 4.0V3) set the 3rd of DIP SW ON state.4) set the 4th of DIP SW ON state.
DIP SW
ONOFF
1 2 3 4
5) Press the phone power key. If the remote power on is used, switch the 1st of DIP SWITCH ON.
-128-
- 129 -
MODEL
LG Electronics Inc.
NAME
Date
Notice No.
LG Electronics Inc.
Approved
BBDRAWING
Sheet/
7/8
V1.4
G5500/70501/6
Date
Checked
DRAWING
NO.
Sign & Name
Designer
Section
Name
Sheets
Iss.
V_RTC
2003
C1101u
R11610
V_ABB
10K
C10310p
R113
10K
R112
C124NA
0R117
_BSCAN
C1204.7u
20p
C104
0R104
R10610K
R103
100K
R11510K
TDO_0
TDO_1
TMS
VBAT
_F_WE
JTAG1
GND
JTAGEN
RPWON
TCK
TDI
10K
R110
1u
VBAT
C122
BAT101
100K
R102
R114NA
UPR
C1110.1u
V_SRAM
UPR
V_DBB
1uC109
C1194.7u
C1120.1u
220KR101
0.1u
TDO
C108V
SS
AN
G
A14
VS
SO
VS
SP
LLE
14
VS
SR
TC
C14
F11
VDRN13P14
VDX
M13VSFRX
VS
S1
B1
A10
VS
S10
VS
S11
A7
A2
VS
S12
F1
VS
S2
VS
S3
K1
P2
VS
S4
VS
S5
P4
N8
VS
S6
VS
S7
P10
P13
VS
S8
VS
S9
G14
E12
VD
D1
VD
D2
M1
P7
VD
D3
VD
D4
N14
VD
D5
B12 A
5V
DD
6
E11
VD
DA
NG
D14
VD
DR
TC
N5
VD
DS
_1_1
VD
DS
_1_2
L14
VD
DS
_2A
11D1
VD
DS
_MIF
1V
DD
S_M
IF2
G1
B6
VD
DS
_MIF
3V
DD
S_M
IF4
A4
VD
DS
_RT
CD
13
VD
D_P
LL
TSPACT5TSPACT6
K13K12
TSPACT7TSPACT8
K14
TSPACT9J11
J14TSPCLKX
H10TSPDI_IO4TSPDO
H11
TSPEN0H13H12
TSPEN1TSPEN2
H14G12
TSPEN3
C7
TX
IR_I
RD
A
C8
TX
_IR
DA
B9
TX
_MO
DE
M
VCLKRXN12
E1
SIM_CLKSIM_IO
G13
SIM_PWRCTRLF14
SIM_RSTG10
B10TCK
TC
SO
EN
A12
D10TDI
TDOC10
TMSE9
M12TSPACT0
M14TSPACT1
J12TSPACT10
J13TSPACT11
TSPACT2L12L13
TSPACT3TSPACT4
J10K11
NS
CS
1
F10ON_OFF
OS
C32
K_I
NC
13
OS
C32
K_O
UT
B13
RESPWRONZD12
A13
RF
EN
B2
RN
W
E8
RT
S_M
OD
EM
RX
IR_I
RD
AA
8
RX
_IR
DA
D8
RX
_MO
DE
MA
9
P9
SC
LKSD
IM
9K
8S
DO
B8
SD
_IR
DA
SIM_CDG11
F13
L8
NB
HE
F5
NB
LEE
4D11
NBSCAN
NC
S0
C2
C3
NC
S1
NC
S2
C1
D3
NC
S3
NC
S4
C11
B11NEMU0NEMU1
E10
E2
NF
OE
NF
WE
E3
N1NIBOOT
N2
NR
ES
ET
_OU
T_I
O7
NS
CS
0L9 N
9
KB
C3
KB
C4
M5
KB
R0
K6
KB
R1
M6
P6
KB
R2
N6
KB
R3
L6K
BR
4
LTL7N
10M
CS
I_C
LK_I
O11
MC
SI_
FS
YN
CH
_IO
12K
9
MC
SI_
RX
D_I
O10
M10
L10
MC
SI_
TX
D_I
O9
MCUDIN7M7
MCUDOMCUEN0
M8P8
MCUEN1_IO8MCUEN2_IO13
C5B5
DATA8
D5DATA9
D9
DS
R_M
OD
EM
EXT_FIQP1
EXT_IRQM3
F4
FD
P
M2
IDD
Q
IO0
N3
P3
IO1
IO2
L4 M4
IO3
B14IT_WAKEUP
KB
C0
N4
K5
KB
C1
KB
C2
L5P5
C12
CLK
TC
XO
E13
C9
CT
S_M
OD
EM
DATA0B7D7
DATA1
E5DATA10DATA11
B4C4
DATA12
D4DATA13DATA14
A3B3
DATA15
DATA2E7D6
DATA3DATA4
A6DATA5
C6E6
DATA6DATA7
D2
ADD3G4G2
ADD4
G3ADD5
H1ADD6ADD7
H3H2
ADD8ADD9
H4
P11
BC
LKR
BC
LKX
N11
K10BDR
BFSRL11
P12BFSX
M11BOX
K7
BU
F12
CLK
13M
_OU
TC
LK32
K_O
UT
F3ADD0ADD1
F2
ADD10H5
ADD11J1J2
ADD12ADD13
J3J4
ADD14ADD15
K3K2
ADD16ADD17
K4J5
ADD18ADD19
L1
G5ADD2
L2ADD20ADD21
L3ADD22
U101
C1070.1u
0.1uC113
TDO_ARM
100KR105
TP101
UPR1000pC101
_WR
4.7uC118
V_IO
V_IO
VBAT
0.1uC117C115
C10220p
0.1u 4.7uC121
V_RTC
0.1uC116
VIR
O2
B1
VLM
EM
F3
VLR
TC
C3
H10
VR
AB
B
VR
DB
BJ1
VR
EF
A8
VR
IO1
B2
VR
ME
MG
1F
1V
RR
AM
D1
VR
RT
C
VRSIMB4
H2
VS
DB
B
VX
RT
CC
1
C2
UP
R
E1VBACKUP
VB
AT
A4
C5
VB
AT
S
G9
VC
AB
B
VC
CS
D5
K1
VC
DB
B
VC
HG
A5
A2
VC
IO1
A1
VC
IO2
VCKK3
G2
VC
ME
M
F2
VC
RA
M
VDRF5H5
VDXVFS
G5
SIMCKC4B3
SIMIOSIMRST
D4
D8TCK
D7TDITDO
E7
TDRG3
TENH1J6
TEST3F6
TEST4
H8
TE
ST
RE
SE
TZ
TESTVG8
TMSE8
UDRK5J5
UDX
K6UEN
INT1H6
INT2E6D2
ITWAKEUP
LEDAB8
B10LEDB1
A10LEDB2LEDC
C8
MICBIASJ8H7
MICIN
J7MICIP
E3ONNOFF
PC
HG
B5
F8
PW
ON
RE
FG
ND
A7
RESPWONZD3
F7
RP
WO
N
H4DAC
F4DBBSCKDBBSIO
E5
DBBSRSTG4
EARNJ10
EARPJ9
G10
GN
DA
G6GNDAV
GN
DD
A3
GNDL1B9
GNDL2A9
K8HSMICBIAS
K7HSMICP
HSOH9
B7
IBIA
S
ICT
LD
6
K10AUXONAUXOP
K9
F10BDLIM
F9BDLIP
E9BDLQM
E10BDLQP
J3BDR
BDXJ2H3
BFSR
K2BFSX
D10BULIM
D9BULIP
BULQMC9
BULQPC10
CK
13M
E4
E2
CK
32K
TWL3014
U102
B6ADIN1ADIN2
A6
ADIN3C7C6
ADIN4
AFCJ4K4
APC
AUXIG7
MC-146X101
32.768KHz
12
3 4
R111100K
C1234.7u
GND
V_SIM
V_FLASH
TDI
UPR
C105 0.1u
C1060.1u
0.1uC114
TCK
R10910K
RPWONTMS
_WR
PC
M_S
YN
CS
TR
OB
IND
LED
_G
LEDC
LEDA
LCD_ID
A(12)A(11)A(10)
A(1)
CAM_HOLDPCM_TX
_CS1
_BSCANTDIVBATRPWONTDO_ARMTMSTCKTDO_WR
A(7)A(6)A(5)A(4)A(3)
A(22)A(21)A(20)
A(2)
A(19)A(18)A(17)A(16)A(15)A(14)A(13)
D(14)D(13)D(12)D(11)D(10)
D(1)D(0)
CTS
MCLK
JAC
K_D
ET
EC
T
A(9)A(8)
KB
C(0
)
DS
RC
AM
_IN
T
MIDI_INTFLIP
FDP
D(9)D(8)D(7)D(6)D(5)D(4)D(3)D(2)
D(15)
_BLE_BHE
HANDSFREESPK_EN
IND
LED
_R
BACKLIGHT
KB
R(4
)K
BR
(3)
KB
R(2
)K
BR
(1)
KB
R(0
)KB
C(4
)K
BC
(3)
KB
C(2
)K
BC
(1)
SD_IRDA
RXD
RX
RX_IRDA
RTS
_WR
RF_EN
ONNOFF
LCD_RESET
_RD
MIDI_CS_LCD_CS_RAM_CS
_CS0
_BSCAN
TXD
TX
TX_IRDA
S_EN
S_DATAS_CLK
ANTSW_BANDANTSW_TXRX
ANT_SWPA_BAND
PA_ONPDNB
TMS
TDO_ARMTDI
XO_EN
TCK
TDO
_BSCANTDI
VBATRPWON
PWON
PC
M_R
XP
CM
_CLK
TXINTXIP
TXQPTXQN
RXIN
RXQNRXQP
13MHz
TDO_ARMTMSTCK
VCHG
KBR(0:4)
D(0:15)
A(1:22)
KBC(0:4)
KEY_LED
MICP
SIM_CLKSIM_IOSIM_RST
TDO
PCHG
ICTL
RPWON
VCCSVBATS
BATT_TEMPTEMPSENSEHOOK_DETECT
AFCAPC
AUXIAUXONAUXOP
RXIP
RCV_NRCV_P
HSMICBIASHSMICPHSO
MICBIASMICN
8.CIRCUIT DIAGRAM
8.1 BB
- 130 -
8.2 MEMORY, etc.
VOL_DOWN
5
NO.
Designer
Iss. Notice No. Name
7/8Sheets
Memory, etc
LG Electronics Inc.
LG Electronics Inc.
MODEL
NAME
Sign & Name
2003
Approved
Checked
Date
R210
V1.4
2/6G5500/7050
DateSection
VOL_UP
DRAWING
DRAWING
Sheet/
100K
SI1304DL
D
G
S
VR205
4.7K
R21
7
Q203
L201
100nH
VIB 1
2
1uC204
2LEDK
RXD4
5SD
SHIELD8
3TXD
6VCC
R221 0
U202CIM-80S7B-T
GND7
LEDA1
V_IO
C21127p
R215
10K
68
R21
1
R219
10K
25
6
3
1
4
IMX9T110 Q201
0.1u
C209
0
R204R203
0
0.1uC201
R222
18
U204MDC3105LT1
GND2
1 VIN
VOUT3
10KR208
V_FLASH
4
VBAT
LED201SML-521MUWT86
12
3
VR203
5
10K
R21
4
VR202
5
V_FLASH
_RESET2
_UBD4
C6_WE
_WP_ACCC5
SP
625
E5B4
RY__BY2
VCCF1J5L5
VCCF2H9
VCCF3VCCPS
J6
VSS1B3
VSS2G3
VSS3J9L4
VSS4
J2_CE1FPS
H2_CEF1_CEF2
B5
C4_LB
H3_OE
D5_RESET1
L3
L2NC22
M10M9
NC23NC24
M2M1
NC25NC26
L9L8
NC27NC28
L7L6
NC29
A9NC3NC4
A10B2
NC5B6
NC6NC7
B7B8
NC8NC9
B9
RY__BY1
DQ7DQ8
K3
DQ9H4
A1NC1
NC10C2C9
NC11F5
NC12F6
NC13NC14
F9
NC15G5
NC16G6
NC17G8
NC18K2K6
NC19
NC2A2
NC20K9
NC21
C7
A9E7
CE2PSD6
J3DQ0
G4DQ1
DQ10J4
DQ11K5J7
DQ12DQ13
H7
DQ14K8H8
DQ15
K4DQ2
H5DQ3DQ4
H6
DQ5K7
DQ6G7J8
D8E8
A13A14
F8D9
A15G9
A16F4
A17E4
A18D7
A19
A2E2
E6A20
E9A21
D2A3A4
F3
A5E3
A6D3C3
A7A8
U201 AM50DL128CG70IG2
A0F2
A1
A10F7C8
A11A12
SP
624
47K
R22
0
47
R21
2
VR201
47K
R21
6
C210
0.1u
C202
VR204
1u
R207
0
33
R201
R20
9
NA
VBAT
0.1uC203
KBC(0)
KBR(0)
KBC(1)
INDLED_G
FLIP
RPWON
_RAM_CS
D(0)D(1)
D(4)D(5)
D(8)
D(10)
D(12)
D(14)
_CS1
LCD_RESET
VIBRATOR
A(4)
A(6)
A(8)
A(10)
D(11)
D(13)
D(15)
D(2)D(3)
D(6)D(7)
D(9)
_BLE
FDP
_WR
A(1)
A(3)
A(5)
A(7)
A(9)
A(11)
A(13)
A(15)
A(17)
A(19)
A(21)
_CS0
_RD
_BHE
RX_IRDA
SD_IRDA
TX_IRDA
INDLED_R
ONNOFF
A(2)
A(12)
A(14)
A(16)
A(18)
A(20)
A(22)
- 131 -
NO.
7/8
LG Electronics Inc.
Sheets
Iss.
NAME
DRAWING
MODEL
2003
Date
(2012)
Notice No.
Checked
Approved
G5500/70503/6
V1.4
(1608)
Date
Name
MIDI, Audio
Sign & Name
SPK_RCVN
SPK_RCVP
LG Electronics Inc.
Designer
Sheet/Section
DRAWING
1
2
34
5
C305
KJA-PH-3-0028
J301
V_SRAM
1u
510K
R31
2
VA
301
SP
304
5
7NC2
2NO1
10NO2
1V+
C319 10u
MAX4684EUBU303
COM13
COM29
GND6
4IN1
8IN2
NC1
C332NA
NAC329
NA
R331
C331
29
3_IRQ
31_RD
4_RST
28_WR
10p
13
EQ3 14
HPOUT_L10
HPOUT_R11
IOVDD32
2LEDMTR 19
NC5
6 PLLC
SPOUT117
SPOUT2 18
SPVDD 15
16SPVSS
VDD7
VREF9
8 VSS
_CS
U301
30A0
1CLK1
D027
D126
D225
D324
D42322
D521
D620
D7
12EQ1
EQ2
YMU762
R319
100
R31
3
10K
150pC328
SP
303
L302100nH
C_NOISE1
2DELAY
GND3 6
SENSE_ADJ
VIN4 5
VOUT
_ERROR7
8_SD
SI9182DH-33-T1U302
C3041000p
C32227p
100nHL304
C31
110
0p
C3091000p
C330
C339
0.1u
C33810p 10p
C32447p
C333NA
VBAT
47p
R308
27
C306
10pC313
C3362p
C3372p
1MR31
6
SP
301
0.1uC310
V_MIDI
1K
R321
R302
NC
0
R330
C323
C320
47p
47p
R301
39K
V_MIDI
R305
0
R66
5
3K
10pC312
100nHL306
100nHL305
0.01u
C301
0
R307
C32610p
VA
304
100nHL301
C327
0.1u
10uC315
R322
NA
15K
R31
1
R304 150K
10K
R31
4
10u
47p
C325
C316
C32127p
10pC334
C33510p
82KR303
390p
C302
100nHL303
C303
R310
1K
220n
SP
302
R306 3.3K
SPK1
2
GND
2
OUT
15
VCC
3 VIN+
4 VIN-MAX9075EXK-T
U304
C30747p
VA
303
4.7uC687
0.1uC318
VA
302
27
R309
0.1uC314
V_IO
0.1u
MIC_P
MIC_N
C308
D(0:7)
RCV_P
RCV_N
MICN
MIC_BIAS
VIBRATOR
D(0)D(1)D(2)D(3)D(4)D(5)D(6)D(7)
EAR_P
EAR_N
SPKP
SPKN
SPK_EN
EAR_N
EAR_P
LCD_RESET
SPKNSPKP
MCLK
MIDI_INT
LCD_RESET
_WR
MIDI_CS
A(1)_RD
MICBIAS
MICP
HSMICP
HSO
HSMICBIAS
HOOK_DETECT
JACK_DETECT
8.3 MMI, AUDIO
NO.Date
I/O, Connector
Sheet/
Name
Checked
Designer
Approved
LG Electronics Inc.
Sheets
DRAWING
Iss.
2003
Section
7/8
Notice No.
NAME
Date
V1.4
4/6G5500/7050
LG Electronics Inc.
MODEL
Sign & Name
DRAWING
R4100.2
FB401
C40710p
SP
408
10K
R40
4
R405
SP
401
1K
10uC404
VA
404
0.1u
SP
418
C402
2 4 6 8
1 3 5 7
RA
401
10K
220K
R412
C412 47p
57
VA
402
472468
13
SP
420
RA404
R401
10K
C41022p
SP
410
VA
416
FB402
VBAT
SP
402
2
20
21
22
23
24
3
4
5
6
7
8
9
SP
414
CN4021
10
11
12 13
14
15
16
17
18
19
VA
407
R409 51
SP
405
220K
R408
SP
411
C413100p
456789
VA
405
16171819
2
2021222324
25
262728
29
3
CN401
1
101112131415
2468
1357
47RA403
VA
413
D1 52D2
D3 1G
3S1
4
S26
SP
409
U401NDC652P
SP
404
VA
412
0
20K
R402
R407
C409
VA
401 1u
SP
412 0R406
2468
1357
RA402
47
33K
R40
3
SP
415
22n
C405
10uC408
VA
417
C411
VA
409
0.1u
150pC403
10KR411
VA
403
VA
411
VA
415
SP
416
2468
1357
CLK3
5GND
7IO2
RST
VCC1
VPP 6
47RA405
V_SIM
CN403
SIM_SOCKET
C40147p
CUS02
10p
D401
C406
SP
406
SP
419
VA
408
V_SIM
SP
417
SP
413
VA
414
SP
407
VA
410
SP
403
KBC(0)
FLIP
MIC_N
MIC_P
KEY_LED
MIC_BIAS
SIM_IO
AUXONAUXOP
VA
406
ICTL
VCHG
VCCS
VBATS
PCHG
PWON
KBR(0)
KBR(1)
KBR(2)
KBR(3)
KBR(4)
KBC(3)
KBC(4)
KBC(1)
KBC(2)
PCM_SYNCPCM_TX
PCM_CLKPCM_RX
BATT_TEMP
SIM_CLKSIM_RST
TDO_ARM
DSR
RPWON
TDITCKTMS
RXRXD
TXD
RTSCTS
HANDSFREE
TX
AUXI
8.4 I/O, Connector
- 132 -
- 133 -
H KANG
LG Electronics Inc.
Section
Approved
BY YANGDRAWING
Checked
Date
RF
Iss. Notice No.
MODEL
DRAWING
NO.
Designer
Sign & Name
Date
7/82003
LG Electronics Inc.Name
SheetsSheet/
NAME
0R503
MS YEOG5500/7050
5/6
V1.4
NAC504
R5071K
C53610p
C531
VBATT 4
8VCC1
VCC212
10VCC_OUT
6VRAMP
5VREG
560p
22G
ND
10
GN
D11
2324G
ND
1225
GN
D13
GN
D14
26
GN
D2
1415G
ND
3
GN
D4
16G
ND
51718
GN
D6
GN
D7
19
GN
D8
2021G
ND
9
7GSM_IN
GSM_OUT9
TX_ENABLE 3
VC
1
2
VC
2
11
U504TQM7M4014
2BAND_SELECT
DCS_IN 1
11DCS_OUT
GN
D1
13
LMSP54AA-097
FL501
8
AN
T
DCS_RX 1
DCS_TX 3
EGSM_RX 10
EGSM_TX 5GND1
4
GND26
GND37
GND49
GND512
GND613
820R512
NA
L50127nH
SE
NB
16
VD
DA
206
VD
DC
13XEN
XIN
71
9X
OU
T
C503
CK
N10 9
CK
P
1GND1
GN
D2
8
21G
ND
3
12ION
11IOP
14PDNB
5RXIN
4RXIP
3RXQN
2RXQP
SC
LK17 18
SD
I
15SDO
U503SI4201-BM
R530680
R518
200
C51122n
0
R50
2
470pC551
U508ADP3330
GND4
IN2
NR5
1OUT
3_ERR
_SD6
RF2.85V
C52122n
R520
1.5K
R501 0
R526 100
L5027.5nH
C50922n
RF2.85V
2.2uC544
C53822n
13MHzU506
1CTL
2GND
3OUT
VCC4
R533
4.7K
130R516
NAC518
10pC507
820R510
1000pC540
10pC542
C514
RF2.85V
0
1p
R534
C50
1
R524 15K
1.5p
33u
RF2.85V
C533
R523150
C506NA
RF2.85V 1MR517
1.2nHL507
100pC545
10pC543
VBAT
600FB501
C5471000p
10uC549
RF2.85V
RF2.85V
RF2.85V
RF2.85V
1
G13
G2
5G3
IN
2O1
4O2
6
22nC510
SAFSD1G84FA0T00R00FL503
NAC505
C50822n
C5521.8p
RFLB
17RFLC
16RFLD
RF
LON
23 24R
FLO
PS
CLK
1213S
DI
SD
O1011
SE
NB
5VDDD
VD
DI
28
VD
DR
25
7XIN
1
29G
ND
10
4GND2
6GND3
8G
ND
4
14G
ND
5
15GND6
18GND7
21GND8
GN
D9
22
3IFLAIFLB
2
26IF
LON
27IF
LOP
PD
NB
9
20RFLA
192
OUT
45
VCC
U505SI4133T-BM
GND1
SN74AHC1GU04DCKRU507
GND
3
IN
33pC527
R515130
100pC539
R513 820
ANT
RF2.85V
C516NA
150R522
100pC541
22nC520
C53422p
22nC529
R514
47
R505
RF2.85V
0
NAC524
R531
NA
1KR509
C522 1p
C51227p
L5054.7nH
R521
39
R529
270K
C523560p
L504
100p
NA
Y2
C546
NC7WZ08K8X
1A
1
5A
2
2B
16
B2
4G
ND
8V
CC
7Y
13
L508
U510
82nH
C517 1p
100R519
SW501
MHC-173
ANTG1 G2
G3 G4RF
22p
C519 1p
C548
L50627nH
R528
R504 0
C53547p
R511 820
NA
100R527
RF2.85V
C532
6
RF2.85V
FL502SAFSD942MFM0T00
G1
1
G2
3
G3
5
IN
2O1 4
O2
0
R508
10pC528
8TXQP
7
VDD123
VD
D2
14
32V
DD
3
26V
DD
4
IOP
28N
C1
29N
C2
PD
NB
31
RFIDN20
RFIDP19
RFIGN22
RFIGP21
RFIPN18
RFIPP17
13R
FLO
NR
FLO
P12
RFOD24
25R
FO
G
TXIN6
TXIP5
TXQN
3CKNCKP
4
16D
IAG
1D
IAG
215 11
GN
D1
27G
ND
2
GN
D3
30
GN
D4
33
10IF
LON
IFLO
P9
ION12
RF2.85V
SI4200-BMU502
L5034.7nH
100p
C515
22pC513
VBAT
R506
0
R532
0
1.5p
2.2u
C526
C550
RXIN
RXQP
RXIP
RXQN
ANTSW_BAND
ANTSW_TXRX
ANT_SW
XO_ENTEMPSENSE
APC
S_CLK
S_EN
AFC
RF_EN
PDNB
13MHz
S_DATA
TXQN
TXIP
TXQP
TXIN
PA_ON
PA_BAND
8.5 RF
Approved
Designer7/8
Checked
6/6
NO.
Sheet/
V1.4
LG Electronics Inc.
Section
DRAWINGDate
(1608)
Iss.
NAME
nobody
CAMERADRAWING
Sheets
LG Electronics Inc.
Date
(1608)
Name
Sign & Name
G5500/7050
(1608)
2003
Notice No.
MODEL
NC
C67
2
R61
2
27p
33p
C60
8
10K
R614
R663 680
0R
617
C67
627
p
1uC635
27p
C68
1
27p
C68
2
33p
C62
5
U602ADP3330
GND4
IN2
NR5
1OUT
3_ERR
_SD6
R61
8N
C
C_PWR
4.7KR607
R60
40
0.01uC602
NCR646
R60
1N
A
FB607
C66
827
p
C66
727
p
27p
C65
9
R641 NC
C639
LED601
A1
A2
K1
K22.2u
0R
606
C6340.1u
R640
FB
616
NC
C68
027
p
27p
C64
9
C61
17p
F6G6VDDI4
FB609
M_S
D7
M_S
D8
D10
M_S
D9
D9
A8
M_W
R_N
E2
SC
AN
_EN
B6
ST
RO
BE
TE
ST
_EN
E1
T_M
OD
E0
G1
VDDC1 D5E4VDDC2E5VDDC3
VDDC4 F4F5VDDC5
VDDC6 G5
D6VDDI1VDDI2 E6
VDDI3H
8J1
0M
_SA
4M
_SA
5H
9
G10
M_S
D0
G9
M_S
D1
D8
M_S
D10
M_S
D11
C10
M_S
D12
C8
A10
M_S
D13
M_S
D14
B10
M_S
D15
A9
F8
M_S
D2
M_S
D3
F10
F9
M_S
D4
M_S
D5
E10
E9
M_S
D6
E8
K5J5 L_DA9
A4 L_RD_N
A1 L_RESET
L_WR_NB3 C9MSM_CLK
G8
MS
_CS
M_A
DS
G7
B9
M_C
S_N
A7
M_H
OL
DM
_IN
TR
C7
B8
M_R
D_N
B7
M_R
ES
ET
M_S
A0
K9
K10
M_S
A1
J9M
_SA
2M
_SA
3
L_DA0L_DA1G3
L_DA10J6K6 L_DA11
L_DA12K7J7 L_DA13
L_DA14K8J8 L_DA15
L_DA16A5L_DA17A6
H3 L_DA2L_DA3J3
L_DA4K3H4 L_DA5
L_DA6K4J4 L_DA7
L_DA8
C_V
S
GND1 C5
GND2 C6D4GND3
GND4 D7E7GND5F7GND6
GND7 G4H5GND8
GND9 H6
B4
GP
IO_0
GP
IO_1
B5
C4
GP
IO_2
J2 LS_CS
A3 L_ADSL_CS_NA2
K2
CIS
_TY
PE
2
F1
C_D
0C
_D1
E3
F2
C_D
2C
_D3
F3
G2
C_D
4C
_D5
H1
H2
C_D
6
J1C
_D7
D3
C_H
S
C_M
CL
KB
2
C_P
CL
KC
1
C_P
WD
NC
3
C2
C_R
ST
D1
C_S
CK
D2
C_S
DA
B1
CLC344E
U601K
1C
IS_T
YP
E0
CIS
_TY
PE
1H
7H
10
C60
97p
27p
C64
4
680R637
C636470p
1uC640
27p
C65
4
C_PWR
0R
602
680R635
C65
527
p
2.2uC637
NCR648
C68610u
R642 NCR644 NC
C62
37p
TP602
10uC633
680R630R
613
10K
R649
33p
NC
C60
7
C61
933
p
TP603
V_FLASH
680R627
R625 680
27p
C65
0
C61
533
p
NC
V_CAM
R652
33p
C61
6 SI1305
D1
G
S
NCR639
Q601
C61
77p
R60810K
27p
C66
3
33p
C63
0C
631
33p
C62
2
R622
33p
680
27p
C66
9
R621
27p
680
C65
8
FB606
680R633
27p
C60
5
C67
1
33p
33p
C62
7
33p
C62
1
VOUT1VOUT2
2
_SD4
R650 NC
LM2750LDX-5.0U603
C+10
7C-
3GND1GND2
5
GND36
11GND4
VIN189
VIN2
1
VBAT
V_SRAM
NAR662
R623
39R615
680
C67
727
p
27p
C66
1
27p
VBAT
R631
C66
4
VBAT
680
R634 680
R624
C64
7
680
27p
27p
C65
2
R628 680
SP623
C66
627
p
C68
327
p
C67
327
p
C66
227
p
27p
C67
0
27p
R658
C66
5
V_CAM
680
27p
C67
4
FB605
C68
4
33p
27p
C61
2
C63
2
7p
C60
633
p
1314
1516
1718
19
220
34
56
78
9
CN601
1
10
1112
27p
C67
9
C67
8
V_CAM
7
8
9
27p
17
18
19
2
20
21
22
23
24
25
26
3
4
5
6
CN6021
10
11
12
1314
15
16
R616
V_CAM
NA
C61
333
p
NCR656
0.1uC601
FB601
NCR651
C61
07p
R653 NC
27p
C64
8
TP
601
FB614
33p
C61
4
680R620
R647 NC
R654 NC
27p
C65
1
7pC
604
C60
37p
NA
R60
3 C_PWR
27p
C_PWR
C62
0
V_CAM
C64
2
33p
R657 NC
C65
627
p
NCR655
C66
027
p
FB611
R60
5N
A
R609NA
FB603
FB615
FB602
680R619
C64
527
p
FB604
27p
C64
3
C63810u
7pC
628
R664NA
V_CAM
R643 NC
C62
633
p
C65
727
p
NCR645
R629 680
FB608
680
C62
933
p
R626
R632
R638
680
680
C6850.1u
33p
R636
C62
4
680
C65
327
p
7pC
618
27p
FB612
C64
6
FB613
FB610
C67
5
STROBE
27p
L_D(6)
L_D(15)L_D(14)
L_D(13)
L_D(10)
L_D(12)
L_D(11)
L_D(9)L_D(8)
LCD_ID
STROB
BACKLIGHT
L_LCD_CS
L_WR
LCD_RESET
L_D(1)
L_A(1)
L_D(0)
L_D(4)
L_D(2) L_D(3)
L_D(7)
L_D(5)
CA
M_H
OL
DL
CD
_RE
SE
T
C_SCK C_SDAC_RST
C_VSCD(6)CD(4)CD(2)CD(0)
13MHz
C_MCLKC_PCLK
CD(1)CD(3)CD(5)CD(7)C_HS
L_D(4)
L_D(9)
L_D(5)
A(2
)A
(1)
A(4
)A
(3)
A(5
)
A(1
)A
(6)
A(1)
STROBE
C_PWON
L_D(3)
L_D(7)
D(10)D(11)D(12)D(13)D(14)D(15)
_LCD_CS
_WRD(9)D(8)D(7)D(6)D(5)D(4)D(3)D(2)D(1)D(0) L_D(10)
L_D(11)L_D(12)L_D(13)
L_D(15)L_D(14)
L_LCD_CS
L_WRL_A(1)
L_D(8)
L_D(6)
D(3
)D
(4)
D(5
)D
(6)
D(7
)D
(8)
D(9
)D
(10)
D(1
1)D
(12)
D(1
3)D
(14)
D(1
5)_L
CD
_CS
_RD
_WR
CA
M_I
NT
L_LCD_CS
L_WRL_A(1)
C_HSC_RSTC_PCLKC_SDAC_SCK
C_MCLKC_VS
L_D(0)L_D(1)L_D(2)
CD(0)CD(1)CD(2)CD(3)CD(4)CD(5)CD(6)CD(7)
C_PWON
L_D(0)L_D(1)
L_D(10)L_D(11)L_D(12)L_D(13)L_D(14)L_D(15)
L_D(2)L_D(3)L_D(4)L_D(5)L_D(6)L_D(7)L_D(8)L_D(9)
D(0
)D
(1)
D(2
)
8.6 CAMERA
- 134 -
- 135 -
C108
2.4K
R11
6
Date
Sheet/
NO.
DRAWING
LG Electronics Inc.
Sheets
Designer
Approved
LG Electronics Inc.
Checked
NAME
DRAWING
MODEL
Sign & NameDateSection
Name
G5500/7050
KEYPAD
1/1
03/08/09 SMT (V1.1)
7/82003
nobody
Notice No.Iss.
47
0.1uC102
R10
9
MIC
1
8
SP
102
SP
103
UP
9
0.1u
C107
LD
105
5
VA
103
6
17
18
19
2
20
21
22
23
24
3
4
5
6
7
8
9
1
10
11
12 13
14
15
16
C10533p
CN101
47
R10
6
SP
106
47
R10
5
VA101
SP
109
RIGHT
2
SP
114
R10
2
4747
R10
1
LD
110
LD
109
LD
108
LD
106
47
R10
7
R10
8
47
SP
104
SP
101
F1
47
R10
3
OK
SHARP0 DOWN
7
LD
102
VBAT
3
SP
110
END
SP
108
4.7uC109
LD
107
LD
101
LD
103
4
VA
102
R10
4
47
R114
1KR118
VBAT
120
120
R113
LEFT
SP
105
F2
SP
107
SP
113C106
NA
NA
C103
C104
NA
0.1u
3G
ND
2O
UT
1V
DD
R115
U10
1
A32
12E
LH
STAR
10u
R11
0
47
SEND
CAMRECS
P11
2
SP
111
C
LD
104
MIC_P
KEY_LED
KBR(4) KBC(2)
KBC(3)
MIC_BIAS
MIC_N
MIC_P
MIC_BIAS
KBC(1)
KBC(2)
KBR(4)
KBR(3)
KBR(2)
KBC(3)
KBR(1)
KBC(4)
FLIP
MIC_N
FLIP
KBR(0)
KBC(0)
KBR(1)
KBC(4)
PWON
KBR(2)
KBC(1)KBR(3)
KEY_LED
KBR(0)
PWON
KBC(0)
8.7 KEYPAD
- 137 -
9. PCB LAYOUT
9. PCB LAYOUT
- 138 -
- 139 -
9. PCB LAYOUT
9. PCB LAYOUT
- 140 -
10. ENGINEERING MODEEngineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.
[1] All auto test
[2] Baseband test
[2-1] BACKLIGHT
[2-1-1] MAIN LCD ON/OFF
[2-1-2] SUB LCD ON/OFF
[2-1-3] KEYPAD ON/OFF
[2-2] LCD
[2-2-1] LCD AUTO
[2-2-2] LCD COLOR
[2-2-3] LCD CONTRAST
[2-2-4] 65K LCD TEST
[2-3] CAMERA (G7050 only)
[2-3-1] PREVIEW
[2-3-2] SETTING
[2-4] FONT
[2-4-1] FONT 8×10
[2-4-2] FONT 8×10 I
[2-4-3] FONT 8×16
[2-4-4] FONT 8×16 I
[2-4-5] FONT 8×16 B
[2-4-6] FONT 10×19
[2-4-7] FONT 13×20
[2-5] ALERT
[2-5-1] VIBRATOR
[2-5-2] RING
[2-5-3] EFFECT SOUND
[2-5-4] IMELODY TEST
[2-5-5] EMS SOUND
[2-5-6] VOLUME
[2-6] SERIAL PORT
[2-6-1] MODEM
[2-6-2] IrDA
[2-7] BATTERY INFO1
[2-8] AUDIO GAIN
[2-8-1] RECEIVER
[2-8-2] EAR MIC
[2-8-3] LOUD SPEAKER
[2-8-4] HANDSFREE
[2-8-5] DEFAULT VALUE
[2-9] IrDA TEST
[3] S/W VERS
[4] ENG MODE
[4-1] CELL ENVIRON
[4-2] LOCATION INFO
[4-3] LAYER1 INFO
[5] CALL TIMER
[6] FACTORY DEFAULT
-141-
11. STANDALONE TEST11.1 Setting Method
11.1.1 COM Port
In the “Dialog Menu”, select the values as explained below.• Port : select a correct COM port• Baudrate : 38400• Leave the rest as default values
11.1.2 Tx Test
• Select one of GSM or DCS Band and input appropriate channel.
1. Selecting Channel
a. Select either Power level or DAC value.b. Power level• Input appropriate value GSM (between 5~19) or DCS (between 0~15)c. DAC value• You may adjust directly the power level with DAC values.
2. Selecting APC
-142-
11.1.3 Rx Test
• Select one of GSM or DCS Band and input appropriate channel.
1. Selecting Channel
See if the value of RSSI is close to -60dBm when setting the value 40 AGC Value Setting.• Normal phone should indicate the value of RSSI close to -60dBm.
2. Automatic Gain Control and Instrument Power level
- 143 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 Exploded View
12.2 Accessory
Level LocationNo. Description Part No. Specification SVC Color Remark
2 MHBY00 HANDSTRAP MHBY0001101 Neck Strap 400mm (CDMA,common use) Y Gray
2 SBPL00 BATTERY PACK,LI-ION SBPL0065889 3.7 V,850 mAh,1 CELL,PRISMATIC ,G5500 BATTERY(SV) Y Silver
2 SGDY00 DATA CABLE SGDY0004401 DK-20G, G7000 ,Cable bulk Y
2 SGEY00 EAR PHONE/EAR MIKE SET SGEY0003203 G4050 G4010 For USA ,3 POLE Design change Y
2 SRCY00 CDROM SRCY0001310 S/W ,NONE ,. ,650 MB,TMUK CD Y
2 SSAD00 ADAPTOR,AC-DC SSAD0007812 100-240V ,50 Hz,5.2 V,850 mA,CE ,AS-0496,UK PLUG,24P Y
2 SSAD00 ADAPTOR,AC-DC SSAD0007828 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EUPLUG(24P),STD Y
-145-
12.3 Replacement Parts<Mechanic components>
Level LocationNo. Description Part No. Specification SVC Color Remark
1 GSM,BAR/FILP TGSM0014301 G7050 TMUSV SILVER N Silver
1 GSM,BAR/FILP TGSM0014801 G7050 TMDSV N Silver
2 APEY00 PHONE APEY0106201 G7050 TMUSV SILVER N Silver
2 APEY00 PHONE APEY0108201 G7050 TMDSV N Silver
3 ACGM00 COVER ASSY,REAR ACGM0025901 Y Silver
4 GMZZ00 SCREW MACHINE GMZZ0001901 1.4 mm,3.5 mm,MSWR3(BK) ,N ,STR ,- , t OFHEAD=1.0,DIA OF HEAD=3.1 Y 23
4 MCCC00 CAP,EARPHONE JACK MCCC0010601 G5500 Y Gray 20
4 MCIA00 CONTACT,ANTENNA MCIA0008501 G5500 Y Gold 21
4 MCJN00 COVER,REAR MCJN0015501 G5500 Y Silver 31
4 MDAK00 DECO,REAR MDAK0001901 G7050 Y Silver 24
4 MLEA00 LOCKER,BATTERY MLEA0011601 G5500 Y Silver 29
4 MPBZ00 PAD MPBZ0032701 G5500 Y Black 32
4 MSDB00 SPRING,COIL MSDB0001701 G7000 Y Pearl White 30
4 MTAB00 TAPE,PROTECTION MTAB0024301 G7050 N Silver
4 MTAZ00 TAPE MTAZ0020901 G7050 Y Silver 25
4 MTAZ01 TAPE MTAZ0022001 G7050 BG Y Bluish
Green34
4 MWAE00 WINDOW,CAMERA MWAE0000901 G7050 Y Silver 26
4 SNGF00 ANTENNA,GSM,FIXED SNGF0002302 3.0 ,-2 dBd,SILVER ,GSM+DCS Y 22
3 ACGQ00 COVER ASSY,SLIDE ACGQ0000401 Y Silver
4 ABGZ00 BUTTON ASSY ABGZ0001101 G7050 ENGLISH Y Silver 2
4 ACGK00 COVER ASSY,FRONT ACGK0028201 G7050 Y Silver 39
5 MBJL00 BUTTON,SIDE MBJL0009401 G5500 Y Silver 6
5 MCJK00 COVER,FRONT MCJK0018701 G5500 (SILVER) N Silver
5 MDAC00 DECO,SIDE MDAC0007301 Y Silver 8
5 MDAC01 DECO,SIDE MDAC0007501 Y Silver 37
5 MDAH00 DECO,RECEIVER MDAH0004301 G5500 N Silver
5 MFBB00 FILTER,RECEIVER MFBB0003401 G5500 Y Black 13
5 MGAD00 GASKET,SHIELD FORM MGAD0039401 G7050 Y Gold 41
5 MIAA00 INDICATOR,LED MIAA0009601 G5500 Y White 10
5 MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Y Silver 42
5 MPBG00 PAD,LCD MPBG0014701 G5500 Y Black 15
5 MPBR00 PAD,BUTTON MPBR0001001 G5500 , ATTACHED (BUTTON,SIDE) Y Black 7
5 MPBZ00 PAD MPBZ0034201 G5500 Y Black 40
-146-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 MTDA00 TUBE,LED MTDA0001901 G7050 EAUSV Y Black 11
5 MWAG00 WINDOW,IRDA MWAG0004201 G7050 EAUSV, BR Y 갈색 36
4 ACGR00 COVER ASSY,SLIDE(LOWER) ACGR0000301 G5500 (SILVER) Y Silver
5 MCJV00 COVER,SLIDE(LOWER) MCJV0000301 G5500 (SILVER) N Silver 44
5 MPBF00 PAD,FLEXIBLE PCB MPBF0003701 G5500 Y Black 46
5 MPBZ00 PAD MPBZ0034001 G5500, ATTACHED (SLIDE LOWER) Y Black 45
4 ACGS00 COVER ASSY,SLIDE(UPPER) ACGS0000301 G5500 (SILVER) Y Silver
5 MCJW00 COVER,SLIDE(UPPER) MCJW0000301 G5500 (SILVER) N Silver
5 MDAY00 DECO MDAY0006101 G5500 (SILVER) N Silver
5 MGAD00 GASKET,SHIELD FORM MGAD0039301 G7050 Y Gold 50
5 MPBH00 PAD,MIKE MPBH0005901 G5500 (SILVER) Y Black 49
4 ACGZ00 COVER ASSY ACGZ0009901 G7050 SILVER (LG LOGO) N Silver
5 MCJZ00 COVER MCJZ0027701 G7050 Y Silver 12
5 MTAB00 TAPE,PROTECTION MTAB0029301 G7050 N
4 ADCA00 DOME ASSY,METAL ADCA0014401 G5500 Y 3
4 GMZZ00 SCREW MACHINE GMZZ0011201 1.4 mm,2.0 mm,MSWR3(FNM) ,N ,STR ,- , G5500 Y 43
4 GMZZ01 SCREW MACHINE GMZZ0011601 1.7 mm,3.0 mm,MSWR3(FN) ,N ,STR ,- , Y Silver 28
4 MPBZ00 PAD MPBZ0035001 G7050 F-PCB ATTACH Y Black 48
4 MPFE00 PLATE,INSULATE MPFE0004301 G5500 Y 5
4 MSDD00 SPRING,PLATE MSDD0003401 G5500 Y Silver 38
3 SBCL00 BATTERY,CELL,LITHIUM SBCL0001002 3 V,1.2 mAh,COIN ,HOLDER TYPE (1.4t) Y
3 SVCY00 CAMERA SVCY0000201 CMOS ,VGA ,8.5*9.5*6.9, backward fixed Y 19
3 SVLM00 LCD MODULE SVLM0006401 128*160 ,37.2*48.9 ,65K CSTN, 28.02*35.028(AA),TM Y 35
3 GMZZ00 SCREW MACHINE GMZZ0011601 1.7 mm,3.0 mm,MSWR3(FN) ,N ,STR ,- , Y Silver
3 MCCF00 CAP,MOBILE SWITCH MCCF0011401 G5500 Y Gray 33
3 MCCH00 CAP,SCREW MCCH0017801 G5500 Y Gray 27
3 MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) N Pearl White
3 MPBZ00 PAD MPBZ0032601 G5500 , BK Y Black 17
3 MTAB00 TAPE,PROTECTION MTAB0024201 G5500 N
3 MWAC00 WINDOW,LCD MWAC0030701 G5500 Y 9
-147-
12.3 Replacement Parts<Main components>
Level LocationNo. Description Part No. Specification SVC Color Remark
4 SACY00 PCB ASSY,FLEXIBLE SACY0011401 G5500/7050 MAIN TO KEYPAD FPCB Y 47
5 CN101 CONNECTOR,BOARD TO BOARD ENBY0013501 24 PIN,0.4 mm,ETC ,AU , N
5 CN102 CONNECTOR,BOARD TO BOARD ENBY0002107 24 PIN,0.5 mm,ETC ,AU ,HEADER N
5 SPCY00 PCB,FLEXIBLE SPCY0018501 POLYI ,0.19 mm,DOUBLE , N
4 SAEY00 PCB ASSY,KEYPAD SAEY0022801 G5500 KEYPAD Y 4
5 SAEA00 PCB ASSY,KEYPAD,AUTO SAEA0008701 N
6 C102 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
6 C103 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
6 C105 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
6 C107 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
6 C108 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Y
6 C109 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
6 CN101 CONNECTOR,BOARD TO BOARD ENBY0013101 24 PIN,0.4 mm,ETC ,AU , N
6 LD101 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD102 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD103 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD104 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD105 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD106 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD107 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD108 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD109 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 LD110 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T N
6 R101 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R102 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R103 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R104 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R105 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R106 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R107 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R108 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R109 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R110 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
6 R113 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP N
6 R114 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP N
-148-
Level LocationNo. Description Part No. Specification SVC Color Remark
6 R116 RES,CHIP ERHY0000248 2.4K ohm,1/16W,J,1005,R/TP N
6 R118 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
6 SPEY00 PCB,KEYPAD SPEY0017101 FR-4 ,0.6 mm,DOUBLE , Revision 1.1 N
6 U101 IC EUSY0129501 SC-74A FIT ,3 PIN,R/TP ,HALL EFFECT SWITCH N
6 VA101 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
6 VA102 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
6 VA103 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
4 SJMY00 VIBRATOR,MOTOR SJMY0006101 3 V,.09 A,12*18 ,G5500 VIBRATOR Y 14
4 SUMY00 MICROPHONE SUMY0003802 FPCB ,-42 dB,4*1.5 , Y
4 SUSY00 SPEAKER SUSY0006204 ASSY ,8 ohm,87 dB,17 mm, Y 16
3 SAFY00 PCB ASSY,MAIN SAFY0075901 G7050 EUA, GPRS Phone Y 18
4 MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER N
4 SAFA00 PCB ASSY,MAIN,AUTO SAFA0027601 N
5 BAT101 CONN,JACK/PLUG,EARPHONE ENJE0003001 2 ,2 PIN,W3000 Back Up Battery Holder Y
5 C101 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C102 CAP,CERAMIC,CHIP ECCH0000114 20 pF,50V,J,NP0,TC,1005,R/TP Y
5 C103 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C104 CAP,CERAMIC,CHIP ECCH0000114 20 pF,50V,J,NP0,TC,1005,R/TP Y
5 C105 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C106 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C107 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C108 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C109 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C110 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C111 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C113 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C114 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C115 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C116 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C118 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 C119 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 C120 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 C121 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 C122 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C123 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 C201 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
-149-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 C202 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C203 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C204 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C209 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C210 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C211 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C301 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP Y
5 C302 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP Y
5 C303 CAP,CERAMIC,CHIP ECCH0004902 220 nF,10V ,Z ,Y5V ,TC ,1005 ,R/TP Y
5 C304 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C305 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C306 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C307 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C308 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C309 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C310 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C311 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C312 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C313 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C314 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C315 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Y
5 C316 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C319 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y
5 C322 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C323 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C324 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C326 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C327 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C328 CAP,CERAMIC,CHIP ECCH0000130 150 pF,50V,J,SL,TC,1005,R/TP Y
5 C330 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C331 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C334 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C335 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C337 CAP,CERAMIC,CHIP ECCH0000174 2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y
5 C338 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C401 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C402 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
-150-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 C403 CAP,CERAMIC,CHIP ECCH0000130 150 pF,50V,J,SL,TC,1005,R/TP Y
5 C404 CAP,TANTAL,CHIP ECTH0000121 10 uF,10V,K,STD,3216,TP Y
5 C405 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C406 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C407 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C408 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y
5 C409 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C410 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP N
5 C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C412 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C413 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C501 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP Y
5 C507 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C508 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C509 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C510 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C511 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C512 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C513 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP N
5 C514 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP N
5 C515 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C517 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP N
5 C519 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP N
5 C520 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C521 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C522 CAP,CERAMIC,CHIP ECCH0000102 1 pF,50V,C,NP0,TC,1005,R/TP N
5 C523 CAP,CERAMIC,CHIP ECCH0000140 560 pF,50V,K,X7R,HD,1005,R/TP Y
5 C526 CAP,CERAMIC,CHIP ECCH0000103 1.5 pF,50V,C,NP0,TC,1005,R/TP Y
5 C527 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C528 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C529 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C531 CAP,CERAMIC,CHIP ECCH0000140 560 pF,50V,K,X7R,HD,1005,R/TP Y
5 C533 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,L_ESR ,ETC ,R/TP Y
5 C534 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP N
5 C535 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C536 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C538 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C539 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
-151-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 C540 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C541 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C542 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C543 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 C544 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y
5 C545 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C546 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP Y
5 C547 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C548 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP N
5 C549 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y
5 C550 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y
5 C551 CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP Y
5 C552 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP Y
5 C601 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C602 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP Y
5 C603 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C604 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C605 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C606 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C607 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C608 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C609 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C610 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C611 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C612 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C613 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C614 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C615 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C616 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C617 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C618 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C619 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C620 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C621 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C622 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C623 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C624 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C625 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
-152-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 C626 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C627 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C628 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C629 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C630 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C631 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C632 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C633 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Y
5 C634 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C636 CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP Y
5 C638 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Y
5 C640 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C642 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C643 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C644 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C645 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C646 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C647 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C648 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C649 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C650 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C651 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C652 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C653 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C654 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C655 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C656 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C657 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C658 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C659 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C660 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C661 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C662 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C663 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C664 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C665 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C666 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C667 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
-153-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 C668 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C669 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C670 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C671 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C672 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C673 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C674 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C675 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C676 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C677 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C678 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C679 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C680 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C681 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C682 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C683 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C684 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP Y
5 C685 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C686 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP Y
5 C687 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP Y
5 CN401 CONNECTOR,I/O ENRY0000901 24 PIN,0.5 mm,ETC , , Y
5 CN402 CONNECTOR,BOARD TO BOARD ENBY0002102 24 PIN,0.5 mm,ETC ,AU , Y
5 CN403 CONN,SOCKET ENSY0007602 6 PIN,ETC , , mm,Height 2.7mm Y
5 CN601 CONNECTOR,BOARD TO BOARD ENBY0013409 20 PIN,0.4 mm,ETC ,AU , Y
5 CN602 CONNECTOR,BOARD TO BOARD ENBY0011002 26 PIN,0.5 mm,ETC ,AU ,G5500 Y
5 D401 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) Y
5 FB401 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead Y
5 FB402 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead Y
5 FB501 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , Y
5 FB601 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB602 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB603 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB604 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB605 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB606 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB607 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB608 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB609 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
-154-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 FB610 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB611 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB612 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB613 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB614 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB615 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 FB616 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead Y
5 FL501 FILTER,SEPERATOR SFAY0001901 880/960 ,1710/1880 ,1.3 dB,1.5 dB,30 dB,25 dB,ETC,5.4*4.0*1.8 Y
5 FL502 FILTER,SAW SFSY0012202 942.5 MHz,2.0*2.5*1.0 ,SMD , Y
5 FL503 FILTER,SAW SFSY0012302 1842.5 MHz,2.0*2.5*1.0 ,SMD , Y
5 J301 CONN,JACK/PLUG,EARPHONE ENJE0002301 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD Y
5 L201 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP Y
5 L301 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L302 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L303 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L304 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L305 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L306 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 L501 INDUCTOR,CHIP ELCH0009302 27 nH,S ,1005 ,R/TP ,COIL Y
5 L502 INDUCTOR,CHIP ELCH0009301 7.5 nH,S ,1005 ,R/TP ,COIL Y
5 L503 INDUCTOR,CHIP ELCH0001406 4.7 nH,S,1005,R/TP Y
5 L505 INDUCTOR,CHIP ELCH0005013 4.7 nH,S ,1005 ,R/TP , Y
5 L506 INDUCTOR,CHIP ELCH0005005 27 nH,J ,1005 ,R/TP , Y
5 L507 INDUCTOR,CHIP ELCH0001009 1.2 nH,S ,1005 ,R/TP , Y
5 L508 INDUCTOR,CHIP ELCH0001425 82 nH,J ,1005 ,R/TP , Y
5 LED201 DIODE,LED,CHIP EDLH0003401 RED, GREEN ,ETC ,R/TP ,SIZE 1315 , GSM DUALLED Y
5 Q201 TR,BJT,NPN EQBN0004801 SMT6 ,0.2 W,R/TP , Y
5 Q203 TR,FET,N-CHANNEL EQFN0005201 SOT-323 ,0.29 W,25 V,0.70 A,R/TP ,N-ChannelMOSFET Y
5 Q601 TR,FET,P-CHANNEL EQFP0004501 SOT-323 ,0.29 W,1.8 V,0.86 A,R/TP ,P-ChanelMOSFET Y
5 R101 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP Y
5 R102 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP Y
5 R103 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP Y
5 R104 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R105 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP Y
5 R106 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R109 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
-155-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 R110 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R111 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP Y
5 R112 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R113 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R115 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R116 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP Y
5 R117 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R201 RES,CHIP ERHY0000211 33 ohm,1/16W,J,1005,R/TP Y
5 R203 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R204 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R207 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R208 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R210 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP Y
5 R211 RES,CHIP ERHY0000216 68 ohm,1/16W,J,1005,R/TP Y
5 R212 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
5 R214 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R215 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R216 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP Y
5 R217 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP Y
5 R219 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R220 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP Y
5 R221 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R222 RES,CHIP ERHY0000206 18 ohm,1/16W,J,1005,R/TP Y
5 R301 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP Y
5 R303 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP Y
5 R304 RES,CHIP ERHY0000284 150K ohm,1/16W,J,1005,R/TP Y
5 R305 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R306 RES,CHIP ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP Y
5 R307 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R308 RES,CHIP ERHY0000209 27 ohm,1/16W,J,1005,R/TP Y
5 R309 RES,CHIP ERHY0000209 27 ohm,1/16W,J,1005,R/TP Y
5 R310 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
5 R311 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP Y
5 R312 RES,CHIP ERHY0000293 510K ohm,1/16W,J,1005,R/TP Y
5 R313 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R314 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R316 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP Y
5 R319 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP Y
-156-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 R321 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
5 R330 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R401 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R402 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP Y
5 R403 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP Y
5 R404 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R405 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
5 R406 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R407 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R408 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP Y
5 R409 RES,CHIP ERHY0000214 51 ohm,1/16W,J,1005,R/TP Y
5 R410 RES,CHIP ERHY0001102 0.2 ohm,1/4W ,F ,2012 ,R/TP Y
5 R411 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R412 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP Y
5 R501 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R502 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R503 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R504 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R505 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R506 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R507 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
5 R508 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R509 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP Y
5 R510 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP Y
5 R511 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP Y
5 R512 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP Y
5 R513 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP Y
5 R514 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP Y
5 R515 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP Y
5 R516 RES,CHIP ERHY0004301 130 ohm,1/16W ,J ,1005 ,R/TP Y
5 R517 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP Y
5 R518 RES,CHIP ERHY0000225 200 ohm,1/16W,J,1005,R/TP Y
5 R519 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP Y
5 R520 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP Y
5 R521 RES,CHIP ERHY0000212 39 ohm,1/16W,J,1005,R/TP Y
5 R522 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP Y
5 R523 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP Y
5 R524 RES,CHIP ERHY0000128 15K ohm,1/16W,F,1005,R/TP Y
-157-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 R526 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP Y
5 R527 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP Y
5 R528 THERMISTOR SETY0001201 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES Y
5 R529 RES,CHIP ERHY0000289 270K ohm,1/16W,J,1005,R/TP Y
5 R530 RES,CHIP ERHY0000111 680 ohm,1/16W,F,1005,R/TP Y
5 R532 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R533 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP Y
5 R534 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R602 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R604 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R606 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R607 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP Y
5 R608 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R613 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R614 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP Y
5 R617 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP Y
5 R619 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R620 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R621 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R622 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R623 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R624 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R625 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R626 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R627 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R628 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R629 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R630 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R631 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R632 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R633 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R634 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R635 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R636 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R637 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead Y
5 R638 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
5 R658 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , Y
5 R663 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP Y
-158-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 R665 RES,CHIP ERHY0008203 3 Kohm,1/16W ,J ,1005 ,R/TP Y
5 RA401 RES,ARRAY,R ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y
5 RA402 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y
5 RA403 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y
5 RA404 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y
5 SPFY00 PCB,MAIN SPFY0050001 FR-4 ,0.95 mm,BUILD-UP 8 , FR4, 0.95 mm, SBL 8Layer, Revision 1.4 N
5 SPK CONNECTOR,BOARD TO BOARD ENBY0001802 2 PIN,1.27 mm,STRAIGHT ,SILVER , Y
5 SW201 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W Y
5 SW202 SWITCH,TACT ESCY0002501 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W Y
5 SW501 CONN,RF SWITCH ENWY0000101 ANGLE ,SMD ,0.5 dB, Y
5 U101 IC EUSY0155201 179GHH PBGA ,179 PIN,R/TP ,CALYPSO / DIGITALBB CHIP Y
5 U102 IC EUSY0148001 100GGM PBGA ,100 PIN,BK ,ANALOG BB CHIP Y
5 U201 IC EUSY0160502 88-BALL FBGA ,88 PIN,R/TP ,128M (64M * 2) FLASH64M PSRAM N
5 U202 IC EUSY0122301 SURFACE MOUNT ,7 PIN,R/TP ,IRDA DATA 1.3LOW POWER TRANSCEIVER / 115.2kb/s Y
5 U203 IC EUSY0077301 SC70-6/SOT23-6 ,6 PIN,R/TP , Y
5 U204 IC EUSY0160401 SOT-23 ,3 PIN,R/TP ,DC MOTOR DRIVER /INTEGERATED RELAY Y
5 U301 IC EUSY0111601 32-PIN QFN ,32 PIN,R/TP ,MA-3 / 40 TONES / FM +WAVEFORM TABLE Y
5 U302 IC EUSY0077602 MSOP-8 ,8 PIN,R/TP ,250mA CMOS LDO WIHTERROR FLAG / 3.3V Y
5 U303 IC EUSY0119001 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOGSWITCHES Y
5 U304 IC EUSY0077701 SC70-5 ,5 PIN,R/TP , Y
5 U401 TR,FET,P-CHANNEL EQFP0003301 SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P-CHANNEL FET Y
5 U502 IC EUSY0144804 5*5 MLP32 ,32 PIN,R/TP , Y
5 U503 IC EUSY0144801 5*5 ,32 PIN,R/TP , Y
5 U504 PAM SMPY0004001 35 dBm,55 %,2 A,-50 dBc,25 dB,10.0 * 7.0 * 1.4 ,SMD , Y
5 U505 IC EUSY0144802 5*5 MLP28 ,28 PIN,R/TP , Y
5 U506 VCTCXO EXSK0000801 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 , Y
5 U507 IC EUSY0077201 SOT(DCK) ,5 PIN,R/TP , Y
5 U508 IC EUSY0076701 SOT-23-6 ,6 PIN,R/TP , Y
5 U510 IC EUSY0100502 8-LEAD US8 ,8 PIN,R/TP ,UHS DUAL 2-INPUT ANDGATE Y
5 U601 IC EUSY0156701 CSP (8mm*8mm) ,100 PIN,R/TP ,LCDCONTROLLER, JPEG ENCODER / DECODER Y
5 U602 IC EUSY0076701 SOT-23-6 ,6 PIN,R/TP , Y
5 VA301 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
-159-
Level LocationNo. Description Part No. Specification SVC Color Remark
5 VA302 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA303 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA304 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA401 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA402 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA403 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA404 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA405 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA406 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA407 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA408 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA409 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA410 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA411 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA412 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA413 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA414 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA415 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA416 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VA417 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR Y
5 VIB CONNECTOR,BOARD TO BOARD ENBY0001802 2 PIN,1.27 mm,STRAIGHT ,SILVER , Y
5 VR201 VARISTOR SEVY0000702 14 V,10% ,SMD , Y
5 VR202 VARISTOR SEVY0000702 14 V,10% ,SMD , Y
5 VR203 VARISTOR SEVY0000702 14 V,10% ,SMD , Y
5 VR204 VARISTOR SEVY0000702 14 V,10% ,SMD , Y
5 VR205 VARISTOR SEVY0000702 14 V,10% ,SMD , Y
5 X101 X-TAL EXXY0015601 32.768 KHz,20 PPM,6 pF,65 Kohm,SMD ,6.9*1.4*1.3 , Y
-160-
Recommended