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Encyclopedia of Microfluidics and Nanofluidics
Dongqing Li (Ed.)
Encyclopedia ofMicrofluidics and Nanofluidics
With 1636 Figures and 152 Tables
123
Prof. Dongqing LiDepartment of Mechanical EngineeringVanderbilt UniversityVU Station B 3515922301 Vanderbilt PlaceNashville, TN. 37235-1592USAdongqing.li@vanderbilt.edu
Library of Congress Control Number: 2008927465
ISBN: 978-0-387-48998-8
The print version of the whole set will be available under ISBN 978-0-387-32468-5.The print and electronic bundle of the whole set will be available under ISBN 978-0-387-49000-7.
© 2008 Springer Science+Business Media, LLC.
All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (SpringerScience+Business Media, LLC., 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarlyanalysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilarmethodology now known or hereafter developed is forbidden.
The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as anexpression of opinion as to whether or not they are subject to proprietary rights.
springer.com
Editor: Steven Elliot, Norwell / Kerstin Kindler, HeidelbergDevelopment Editor: Sylvia Blago, HeidelbergTypesetting and Production: le-tex publishing services oHG, LeipzigCover Design: Frido Steinen-Broo, Spain
Printed on acid-free paper SPIN: 11601296 2109 — 5 4 3 2 1 0
Preface
Microfluidics and nanofluidics are among the most rapidly growing fields of scientific research and technology develop-ment. Over the past 15 years, the research activities in these fields have been increasing exponentially as evidenced bythe number of published papers in the literature. Microfluidics and nanofluidics not only bring exciting opportunities tostudy the new phenomena unique to these small scales, but also enable the development of many new and high-impacttechnologies from handheld biomedical laboratory (Lab-on-a-Chip) to detection and manipulation of single molecules.While these exciting and inter-disciplinary research fields attract more and more researchers, one major challenge isthe lack of a single reference resource providing up-to-date reviews and overviews of various directions in the fieldof microfluidics and nanofluidics. This is the motivation behind the development of the Encyclopedia of Microfluidicsand Nanofluidics. As a comprehensive resource, no single review paper or several books focused on specific topics canreplace the role of an Encyclopedia.This is the first Encyclopedia of Microfluidics and Nanofluidics for the scientific community. It covers the fundamentals,latest developments and cutting-edge experimental techniques, including electrical double-layers; optofluidics; DNAlab-on-a-chip; nanosensors; and much more. The high technical quality of the Encyclopedia has been ensured by ourInternational Editorial Board consisting of leading scientists in these fields, and the over 250 experts in microfluidicsand nanofluidics. The carefully selected entries deliver relevant and comprehensive information, and are fully illustratedwith thousands of diagrams, photos, line art, many in full color.The Encyclopedia provides basic information on all fundamental and applied aspects of microfluidics and nanofluidicsby covering two decades of research. It is the only scientific work of its kind in the field of microfluidics and nanofluidicsbringing together core knowledge and the very latest advances. Written for a wide audience with different levels ofexperience, it provides valuable information to graduate students and scientists who may be new to these fields ofmicrofluidics and nanofluidics while providing up-to-date information to active scientists and experts in the field. Thisoutstanding encyclopedia is an indispensable source for research professionals, technology investors and developersseeking the most up-to-date information on microfluidics and nanofluidics among a wide range of disciplines fromscience to engineering to medicine.It takes two years of hard work of many people for this Encyclopedia to come to live. I would like to give my sincerethanks the Editorial Board members and many specially invited experts for helping me to review so many manuscriptsto ensure the highest quality. I would like to thank and congratulate all contributing authors. This is your Encyclopediaand you made the great contribution to these fields. Finally, my heartfelt appreciation goes to the colleagues at Springer,Steven Elliot, Oona Schmid, Sylvia Blago, and Simone Giesler-Güllich; without their persistent efforts and hard workeveryday, it is not possible to complete this Encyclopedia.
Dongqing Li Nashville, March 2008(Editor-in-Chief)
Editor-in-Chief
DONGQING LI
Department of Mechanical EngineeringVanderbilt UniversityVU Station B 3515922301 Vanderbilt PlaceNashville, TN. 37235-1592USAdongqing.li@vanderbilt.edu
Section Editors
CHONG H. AHN
Department of Electrical and Computer EngineeringUniversity of CincinnatiCincinnati, OH, USAchong.ahn@uc.edu
MARTIN GIJS
Swiss Federal Institute of Technology (EPFL)Institute of Microelectronic & Microsystems (IMM)Lausanne, Switzerlandmartin.gijs@epfl.ch
STEFFEN HARDT
Institute for Nano- and Micro Process TechnologyUniversity of HannoverHannover, Germanyhardt@nmp.uni-hannover.de
SATISH G. KANDLIKAR
Mechanical Engineering DepartmentRochester Institute of TechnologyRochester, NY, USAsgkeme@rit.edu
JAMES P. LANDERS
Department of ChemistryUniversity of VirginiaCharlottesville, VA, USAlanders@virginia.edu
YUEHE LIN
Environmental Molecular Sciences LaboratoryPacific Northwest National LaboratoryRichland, WA, USAYuehe.Lin@pnl.gov
ANDREW DE MELLO
Department of ChemistryImperial College of Science, Technology and MedicineLondon, UKa.demello@ic.ac.uk
HYWEL MORGAN
School of Electronics and Computer ScienceUniversity of SouthamptonSouthampton, UKhm@ecs.soton.ac.uk
NICO F. DE ROOIJ
The Institute of MicrotechnologyUniversity of NeuchâtelNeuchâtel, SwitzerlandNico.deRooij@unine.ch
STEVE WERELEY
School of Mechanical EngineeringPurdue UniversityWest Lafayette, IN, USAwereley@purdue.edu
RUEY-JEN YANG
Department of Engineering ScienceNational Cheng Kung UniversityTainan City, Taiwanrjyang@mail.ncku.edu.tw
Contributors
ABRAHAM, JOHN
Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSAjabraham@ecn.purdue.edu
AGARWAL, RAMESH
Aerospace Research and Education Center (AeREC)and Aerospace Engineering ProgramWashington UniversitySt. Louis, MOUSArka@me.wustl.edu
AI, LISONG
Department of Biomedical Engineering& Cardiovascular MedicineSchool of Engineering & School of MedicineUniversity of Southern CaliforniaLos Angles, CAUSA
AKHMECHET, ROMAN
Sibley School of Mechanical EngineeringCornell UniversityIthaca, NYUSAra224@cornell.edu
ANGELI, PANAGIOTA
Department of Chemical EngineeringUniversity College LondonLondonUKp.angeli@ucl.ac.uk
ANNA, SHELLEY L.Department of Mechanical EngineeringCarnegie Mellon UniversityPittsburgh, PAUSAsanna@cmu.edu
ARNOLD, MARKUS
HSG-IMAT, Hahn-Schickard-GesellschaftInstitute for Microassembly TechnologyStuttgartGermanyarnold@hsg-imat.de
ASFER, MOHAMMED
Department of Mechanical EngineeringIIT KanpurKanpurIndia
ASHGRIZ, NASSER
Department of Mechanical and Industrial EngineeringUniversity of TorontoToronto, ONCanadaashgriz@mie.utoronto.ca
AUERSWALD, JANKO
Division MicroroboticsCentre Suisse d’Electronique et de Microtechnique(CSEM S.A.)AlpnachSwitzerlandjanko.auerswald@csem.ch
BAKAJIN, OLGICA
Lawrence Livermore National LaboratoryLivermore, CAUSAbakajin1@llnl.gov
BALDWIN, RICHARD P.Department of ChemistryUniversity of LouisvilleLouisville, KYUSArick.baldwin@louisville.edu
XII Contributors
BAMIRO, OLUYINKA O.Western Michigan UniversityKalamazoo, MIUSAoluyinka.o.bamiro@wmich.edu
BARBULOVIC-NAD, IRENA
Terrence Donnelly Centre for Cellularand Biomolecular ResearchUniversity of TorontoToronto, ONCanada
BAROUD, CHARLES N.LadHyX and Departement de MécaniqueEcole PolytechniquePalaiseauFrancebaroud@ladhyx.polytechnique.fr
BARRETT, LOUISE M.Sandia National LaboratoriesLivermore, CAUSAlmbarre@sandia.gov
BAYAZITOGLU, YILDIZ
Rice UniversityHouston, TXUSAbayaz@rice.edu
BAZANT, MARTIN Z.Department of Mathematics and Institute for SoldierNanotechnologiesMassachusetts Institute of TechnologyCambridge, MAUSAbazant@math.mit.edu
BEDEAUX, DICK
Department of ChemistryNorwegian University of Science and TechnologyTrondheimNorway
BEDEKAR, ADITYA S.CFD Research CorporationHuntsville, ALUSA
BERG, JORDAN M.Nano Tech Center & Department of MechanicalEngineeringTexas Tech UniversityLubbock, TXUSA
BHAGAT, ALI ASGAR S.Department of Electrical and Computer EngineeringUniversity of CincinnatiCincinnati, OHUSA
BHATTACHARYA, SMITI
C. Eugene Bennett Department of ChemistryWest Virginia UniversityMorgantown, WVUSA
BHATTACHARYYA, ARPITA
Biomedical Engineering DepartmentBoston UniversityBoston, MAUSAabhatta@bu.edu
BINDER, KURT
Institut für PhysikJohannes Gutenberg Universität MainzMainzGermanykurt.binder@uni-mainz.de
BREUER, KENNETH S.Division of EngineeringBrown UniversityProvidence, RIUSAkbreuer@brown.edu
BRUTIN, DAVID
IUSTI LaboratoryPoytech’MarseilleMarseilleFrancedavid.brutin@polytech.univ-mrs.fr
BUTLER, DAVID LEE
School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemdlbutler@ntu.edu.sg
BÜTTNER, LARS
Professorship of Measuring and Testing TechniquesDresden University of TechnologyDresdenGermany
Contributors XIII
CAO, JINHUA
Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSA
CETIN, BARBAROS
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAbarbaros.cetin@vanderbilt.edu
CHAI, JOHN C.School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
CHAKRABORTY, SUMAN
Department of Mechanical EngineeringIndian Institute of TechnologyKharagpurIndiasuman@mech.iitkgp.ernet.in
CHAMARTHY, PRAMOD
Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSApramodc@purdue.edu
CHANG, CHIH-CHANG
Department of Engineering ScienceNational Cheng Kung UniversityTainanTaiwan
CHANG, HSUEH-CHIA
Department of Chemical and Biomolecular EngineeringCenter for Microfluidic and Medical DiagnosticsUniversity of Notre DameNotre Dame, INUSAhchang@nd.edu
CHANG, JUN KEUN
NanoEnTek Inc. & Digital Bio Technology Co., Inc.SeoulKoreajkchang@digital-bio.com
CHARON, LUC
Department of Medical BiophysicsUniversity of TorontoToronto, ONCanada
CHEN, GANG
School of PharmacyFudan UniversityShanghaiChinagangchen@fudan.edu.cn
CHEN, JIA-KUN
Department of Engineering ScienceNational Cheng Kung UniversityTainanTaiwan
CHEN, RONGSHENG
Department of Biology and ChemistryCity University of Hong KongKowloonHong Kong
CHEN, XIAOHONG
School of PharmacyFudan UniversityShanghaiChina
CHEN, ZHONGPING
Department of Biomedical EngineeringUniversity of CaliforniaIrvine, CAUSAz2chen@uci.edu
CHEN, ZILIN
Department of Chemical and Biomolecular EngineeringCenter for Microfluidic and Medical DiagnosticsUniversity of Notre DameNotre Dame, INUSAzchen@nd.edu
CHENG, JI-YEN
Research Center for Applied SciencesAcademia SinicaTaipeiTaiwanjycheng@gate.sinica.edu.tw
XIV Contributors
CHENG, PING
School of Mechanical and Power EngineeringShanghai Jiaotong UniversityShanghaiChinapingcheng@sjtu.edu.cn
CHEREMISIN, FELIX G.Russian Academy of ScienceMoscowRussiacherem@ocas.ru
CHIAO, MU
Department of Mechanical EngineeringUniversity of British ColumbiaVancouver, British ColumbiaCanadamuchiao@mech.ubc.ca
CHON, CHAN HEE
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAChanhee.chon@vanderbilt.edu
CHOO, JAEBUM
Department of Applied ChemistryHanyang UniversityAnsan, Kyunggi-doSouth Koreajbchoo@hanyang.ac.kr
CHRISTENSEN, KENNETH T.Department of Mechanical Science and EngineeringUniversity of IllinoisUrbana, ILUSAktc@uiuc.edu
CHUN, YANG
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
CHUNG, CHEN-KUEI
Department of Mechanical EngineeringNational Cheng Kung UniversityTainan CityTaiwan (R.O.C.)ckchung@mail.ncku.edu.tw
CLICQ, DAVID
Transport Modeling & (Bio)analytical Separation ScienceGroup (TMAS2)Vrije Universiteit BrusselBrusselBelgium
COLIN, STÉPHANE
National Institute of Applied Sciences of Toulouse(INSAT)Toulouse Cedex 4Francestephane.colin@insa-toulouse.fr
COLLINS, JOHN
Maxwell Sensors Inc.Fullerton, CAUSACollins.biomint@gmail.com
CROSS, MICHAEL
Electrical & Computer Engineering ProgramSchool of EngineeringThe University of VermontBurlington, VTUSAmcross@cems.uvm.edu
CUI, ZHENG
Rutherford Appleton LaboratoryOxfordUKz.cui@rl.ac.uk
CZARSKE, JÜRGEN
Professorship of Measuring and Testing TechniquesDresden University of TechnologyDresdenGermanyjuergen.czarske@tu-dresden.de
DALLAS, TIM
Nano Tech Center & Department of Electrical& Computer EngineeringTexas Tech UniversityLubbock, TXUSA
DAMES, CHRIS
Department of Mechanical EngineeringUniversity of CaliforniaRiverside, CAUSAcdames@engr.ucr.edu
Contributors XV
DANG, KHANH
Harvard-MIT Division of Health Sciencesand TechnologyMassachusetts Institute of TechnologyCambridge, MAUSA
DAUB, MARTINA
Laboratory for MEMS ApplicationsDepartment of Microsystems Engineering (IMTEK)University of FreiburgFreiburgGermanydaub@imtek.de
DE SILVA, MAURIS
Bascom Palmer Eye InstituteUniversity of MiamiMiami, FLUSAmdesilva@med.miami.edu
DEMIRCI, UTKAN
Harvard-MIT Division of Health Sciencesand TechnologyMassachusetts Institute of TechnologyCambridge, MAUSA
DENG, PEIGANG
MEMS DepartmentChina Resources Semiconductor (HK) Co., Ltd.Hong KongChina
DERMICI, DENIZ
Department of EconomicsBogazici UniversityIstanbulTurkey
DESMET, GERT
Transport Modeling & (Bio)analytical Separation ScienceGroup (TMAS2)Vrije Universiteit BrusselBrusselBelgium
DIAS, FRANCISCO
HE-ArcInstitut des MicrotechnologiesLa Chaux-de-FondsSwitzerland
DJILALI, NED
Institute for Integrated Energy Systems (IESVic)and Department of Mechanical EngineeringUniversity of VictoriaVictoria, BCCanada
DORFMAN, KEVIN D.Department of Chemical Engineering and MaterialsScienceUniversity of MinnesotaMinneapolis, MNUSAdorfman@umn.edu
DUCRÉE, JENS
HSG-IMIT, c/o IMTEKUniversity of FreiburgFreiburgGermanyjens.ducree@hsg-imit.de
DURMUS, N. GOZDE
Department of Molecular Biology and GeneticsMiddle East Technical UniversityAnkaraTurkey
DUTTA, DEBASHIS
Department of ChemistryUniversity of WyomingLaramie, WYUSAddutta@uwyo.edu
DUTTA, PRASHANTA
School of Mechanical and Materials EngineeringWashington State UniversityPullman, WAUSAdutta@mail.wsu.edu
ERICKSON, DAVID
Sibley School of Mechanical and Aerospace EngineeringCornell UniversityIthaca, New YorkUSAde54@cornell.edu
EWING, ANDREW H.Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSA
XVI Contributors
EIJKEL, JAN C. T.BIOS, Lab-on-a-Chip GroupMESA+ Institute for NanotechnologyEnschedeNetherlands
FAN, TONGXIANG
State Key Lab of Metal Matrix CompositesShanghai Jiaotong UniversityShanghaiChinatxfan@sjtu.edu.cn
FANG, JI
Institute for MicromanufacturingLouisiana Tech UniversityRuston, LAUSAjfang@latech.edu
FEKETE, VERONIKA
Transport Modeling & (Bio)analytical Separation ScienceGroup (TMAS2)Vrije Universiteit BrusselBrusselBelgium
FRANSSILA, SAMI
Helsinki University of TechnologyHelsinkiFinlandsami.franssila@tkk.fi
FREIRE, SERGIO
Department of ChemistryUniversity of TorontoToronto, ONCanada
FRIEND, JAMES
Micro/Nanophysics Research LaboratoryMonash UniversityClayton, VICAustraliajames.friend@eng.monash.edu.au
FRÉCHETTE, LUC G.Department of Mechanical EngineeringUniversité de SherbrookeSherbrooke, QCCanadaLuc.Frechette@USherbrooke.ca
FU, JIANPING
Department of Mechanical EngineeringMassachusetts Institute of TechnologyCambridge, MAUSAjpfu@mit.edu
FU, LUNG-MING
Department of Materials EngineeringNational Pingtung University of Science and TechnologyPingtungTaiwan, ROCloudyfu@mail.npust.edu.tw
GAN, HIONG YAP
Division of Manufacturing Engineering Schoolof Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporeganh0002@ntu.edu.sg
GAO, YANDONG
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAyandong.gao@vanderbilt.edu
GARCIA-CORDERO, JOSE L.Biomedical Diagnostics InstituteNational Centre for Sensor ResearchDublin City UniversityDublinIreland
GARRELL, ROBIN L.Department of Chemistry & BiochemistryUniversity of CaliforniaLos Angeles, CAUSA
GAVRIILIDIS, ASTERIOS
Department of Chemical EngineeringUniversity College LondonLondonUKa.gavriilidis@ucl.ac.uk
GEELHOED, PETER
Laboratory for Aero- & HydrodynamicsDelft University of TechnologyDelftNetherlandsp.f.geelhoed@tudelft.nl
Contributors XVII
GHEBER, LEVI A.Department of Biotechnology EngineeringBen-GurionUniversity of the NegevBeer-ShevaIsraelglevi@bgu.ac.il
GHOSAL, SANDIP
Department of Mechanical EngineeringNorthwestern UniversityEvanston, ILUSAs-ghosal@northwestern.edu
GLAWDEL, TOM
Department of Mechanical and Mechatronics EngineeringUniversity of WaterlooWaterloo, ONCanadatglawdel@engmail.uwaterloo.ca
GRAY, BONNIE
School of Engineering ScienceSimon Fraser UniversityBurnaby, BCCanadabgray@sfu.ca
GREEN, NICOLAS
School of Electronics and Computer ScienceUniversity of SouthamptonSouthamptonUK
GUASTO, JEFFREY S.Division of EngineeringBrown UniversityProvidence, RIUSAjguasto@brown.edu
GUI, LIN
Department of Mechanical and Mechatronics EngineeringUniversity of WaterlooWaterloo, ONCanada
GUISEPPI-ELIE, ANTHONY
Center for Bioelectronics, Biosensors, and Biochips (C3B)Department of Chemical and Biomolecular Engineering,and Department of BioengineeringClemson UniversityClemson, SCUSAguiseppi@clemson.edu
HALL, JEREMIAH
Department of Aerospace Engineering SciencesUniversity of ColoradoBoulder, COUSA
HAN, JONGYOON
Department of Electrical Engineering and ComputerScience and Department of Biological EngineeringMassachusetts Institute of TechnologyCambridge, MAUSAjyhan@mit.edu
HAQUETTE, HENRI
HE-ArcInstitut des MicrotechnologiesLa Chaux-de-FondsSwitzerland
HARRIS, NICK R.School of Electronics and Computer ScienceUniversity of SouthamptonHighfield, SouthamptonUKnrh@ecs.soton.ac.uk
HASHIM, AHMAD YUSAIRI BANI
Faculty of Manufacturing EngineeringUniversiti Teknikal Malaysia MelakaMelakaMalaysiayusairi@utem.edu.my
HAU, WINKY L. W.IMTEKUniversity of FreiburgFreiburgGermanywinky.hau@imtek.de
HENDERSON, CLIFFORD L.School of Chemical and Biomolecular EngineeringGeorgia Institute of TechnologyAtlanta, GAUSAcliff.henderson@chbe.gatech.edu
HEO, CHUL-JOON
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKorea
XVIII Contributors
HILL, MARTYN
School of Engineering SciencesUniversity of SouthamptonHighfield, SouthamptonUK
HILL JR., HERBERT H.Department of ChemistryWashington State UniversityPullman, WAUSA
HINRICHS, KARSTEN
ISAS - Institute for Analytical SciencesBerlinGermanyhinrichs@isas.de
HITT, DARREN L.Mechanical Engineering Program, School of EngineeringThe University of VermontBurlington, VTUSAdarren.hitt@uvm.edu
HONG, JONGIN
Department of ChemistryImperial College London, South Kensington CampusLondonUKhong.jongin@gmail.com
HORIUCHI, KEISUKE
Mechanical Engineering Research LaboratoryHitachi, Ltd.Hitachinaka, IbarakiJapan
HOUSE, DUSTIN
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAdustin.l.house@vanderbilt.edu
HSIAI, TZUNG K.Department of Biomedical Engineering& Cardiovascular MedicineSchool of Engineering & School of MedicineUniversity of Southern CaliforniaLos Angles, CAUSA
HSIEH, CHENG-CHIEH
Intel CorporationChandler, AZUSAcheng-chieh.hsieh@intel.com
HSIEH, YI-CHENG
Department of Biomedical EngineeringRutgers, The State University of New JerseyPiscataway, NJUSA
HU, GUOQING
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSA
HUANG, PETER
Department of Biomedical EngineeringTufts UniversityMedford, MAUSA
HUANG, XIAOYANG
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
HWANG, EUN-SOO
Microsystems LaboratorySchool of Mechanical EngineeringYonsei UniversitySeoulRepublic of Korea
IANCU, FLORIN
Michigan State UniversityEast Lansing, MIUSAihuin@egr.msu.edu
ILES, ALEXANDER
Department of ChemistryThe University of HullHullUKn.pamme@hull.ac.uk
IRIMIA, DANIEL
Massachusetts General HospitalHarvard Medical SchoolBoston, VAUSAdirimia@partners.org
Contributors XIX
IYER, SRINIVAS
Bioscience DivisionLos Alamos National LaboratoryLos Alamos, NMUSAsiyer@lanl.gov
JACKSON, DOUGLAS J.Department of Electrical and Computer EngineeringUniversity of LouisvilleLouisville, KYUSAdoug.jackson@louisville.edu
JAFARI, ALI
Department of Mechanical and Industrial EngineeringUniversity of TorontoToronto, ONCanada
JANG, SE GYU
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKorea
JEON, NOO LI
Department of Biomedical EngineeringUniversity of CaliforniaIrvine, CAUSA
JIANG, HONG
GraceFlow TechnologyColumbia, SCUSAajiangca2@yahoo.com
JIAO, ZHENJUN
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
JO, KYOO DONG
C. Eugene Bennett Department of ChemistryWest Virginia UniversityMorgantown, WVUSAatimperm@wvu.edu
JUBERY, TALUKDER Z.School of Mechanical and Materials EngineeringWashington State UniversityPullman, WAUSA
KANDLIKAR, SATISH G.Department of Mechanical EngineeringRochester Institute of TechnologyRochester, NYUSAsgkeme@rit.edu
KANG, KWAN HYOUNG
Department of Mechanical EngineeringPohang University of Science and TechnologyPohangSouth Koreakhkang@postech.edu
KANG, SANGMO
Dong-A UniversityBusanKorea
KANG, YUEJUN
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAyuejun.kang@vanderbilt.edu
KARNIK, ROHIT
Department of Mechanical EngineeringMassachusetts Institute of TechnologyCambridge, MAUSAkarnik@mit.edu
KASSEGNE, SAMUEL K.MEMS Research LaboratoryDepartment of Mechanical EngineeringCollege of EngineeringSan Diego State UniversitySan Diego, CAUSAkassegne@mail.sdsu.edu
KEH, HUAN J.Department of Chemical EngineeringNational Taiwan UniversityTaipeiTaiwanhuan@ntu.edu.tw
XX Contributors
KELLY, KATHLEEN
C. Eugene Bennett Department of ChemistryWest Virginia UniversityMorgantown, WVUSA
KEPPNER, HERBERT
HE-ArcInstitut des MicrotechnologiesLa Chaux-de-FondsSwitzerland
KEYNTON, ROBERT S.Department of BioengineeringUniversity of LouisvilleLouisville, KYUSArob.keynton@louisville.edu
KHADEMHOSSEINI, ALI
Harvard-MIT Division of Health Sciencesand TechnologyMassachusetts Institute of TechnologyCambridge, MAUSAalik@mit.edu
KIM, HYUNG JOON
Department of Biomedical EngineeringUniversity of CaliforniaIrvine, CAUSA
KIM, SE-HEON
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKorea
KIM, YONG-HO
Microsystems LaboratorySchool of Mechanical EngineeringYonsei UniversitySeoulRepublic of Korea
KIM, YONG-JUN
Microsystems LaboratorySchool of Mechanical EngineeringYonsei UniversitySeoulRepublic of Koreayjk@yonsei.ac.kr
KIM, YOUNG JO
Department of Chemical EngineeringCenter for Surface Science and Plasma TechnologyUniversity of Missouri-ColumbiaColumbia, MOUSAyuq@missouri.edu
KING, MICHAEL R.University of RochesterRochester, NYUSAmike_king@urmc.rochester.edu
KITAMORI, TAKEHIKO
Department of Applied ChemistrySchool of EngineeringThe University of TokyoTokyoJapankitamori@icl.t.u-tokyo.ac.jp
KJEANG, ERIK
Institute for Integrated Energy Systems (IESVic)and Department of Mechanical EngineeringUniversity of VictoriaVictoria, BCCanada
KJELSTRUP, SIGNE
Department of ChemistryNorwegian University of Science and TechnologyTrondheimNorway
KLAPPERICH, CATHERINE M.Biomedical and Manufacturing Engineering DepartmentsBoston UniversityBoston, MAUSAcatherin@bu.edu
KLEINSTREUER, CLEMENT
Mechanical and Aerospace EngineeringNorth Carolina State UniversityRaleigh, NCUSAck@eos.ncsu.edu
KNAPP, HELMUT F.Division MicroroboticsCentre Suisse d’Electronique et de Microtechnique(CSEM S.A.)AlpnachSwitzerland
Contributors XXI
KOCKMANN, NORBERT
Laboratory for Design of MicrosystemsDepartment of Microsystems Engineering – IMTEKAlbert-Ludwig University of FreiburgFreiburgGermanykockmann@imtek.de
KONG, LINGXUE
Center for Material and Fiber InnovationDeakin UniversityGeelong, VICAustralialingxue.kong@deakin.edu.au
KOZBERG, MARIEL
Department of Chemical EngineeringMassachusetts Institute of TechnologyCambridge, MAUSA
KRISHNAMOORTHY, SIVA
Baxter Healthcare CorporationRound Lake, ILUSA
KUMAR, ALOKE
Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSA
KUMAR, HARIBALAN
Seamans Center for the Engineering Arts and SciencesUniversity of IowaIowa City, IAUSAharibalan-kumar@uiowa.edu
KWOK, DANIEL Y.Department of Mechanical EngineeringSchulich School of EngineeringUniversity of CalgaryCalgary, ABCanadadaniel.kwok@ucalgary.ca
KÖHLER, MICHAEL
Stiftungslehrstuhl der Deutschen Bundesstiftung Umwelt,Institut für PhysikTechnische Universität IlmenauIlmenauGermanymichael.koehler@tu-ilmenau.de
KÜCK, HEINZ
HSG-IMAT, Hahn-Schickard-GesellschaftInstitute for Microassembly TechnologyStuttgartGermanykueck@hsg-imat.de
LAM, YEE CHEONG
Division of Manufacturing Engineering Schoolof Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
LEE, ABRAHAM P.Department of Biomedical Engineering and Departmentof Mechanical AerospaceUniversity of CaliforniaIrvine, CAUSAaplee@uci.edu
LEE, CHIA-YEN
Department of Mechanical and Automation EngineeringDa-Yeh UniversityChung-HuaTaiwan, ROC
LEE, JAESUNG
LG Material & Parts R&D CenterLG MicronKoreajaesung@lgmicron.com
LEE, SEUNG-KON
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKorea
LEE, YI-KUEN
Department of Mechanical EngineeringHong Kong University of Science and TechnologyHong KongChina
LI, CHEUK-WING
Department of Biology and ChemistryCity University of Hong KongHong KongChina
XXII Contributors
LI, DEYU
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAdeyu.li@vanderbilt.edu
LI, DONGQING
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSA
LI, JIE
Mechanical and Aerospace EngineeringNorth Carolina State UniversityRaleigh, NCUSA
LI, ZHIXIN
Department of Engineering MechanicsTsinghua UniversityBeijingChina
LILGE, LOTHAR
Department of Medical BiophysicsUniversity of TorontoToronto, ONCanada
LIM, JONG-MIN
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKorea
LIM, TEIK-CHENG
School of Science and TechnologySIM UniversitySingaporeSingaporetclim@unisim.edu.sg
LIN, BINGCHENG
Dalian Institute of Chemical PhysicsChinese Academy of SciencesDalianChinabclin@dicp.ac.cn
LIN, CHE-HSIN
Department of Mechanical and ElectromechanicalEngineeringNational Sun Yat-sen UniversityKaohsiungTaiwanchehsin@mail.nsysu.edu.tw
LIN, RICHARD L.Department of Materials Science and EngineeringMassachusetts Institute of TechnologyCambridge, MAUSA
LIN, YUEHE
Pacific Northwest National LaboratoryRichland, WAUSAyuehe.lin@pnl.gov
LINDEMANN, TIMO
Laboratory for MEMS ApplicationsDepartment of Microsystems EngineeringUniversity of FreiburgFreiburgGermany
LIOU, WILLIAM W.Western Michigan UniversityKalamazoo, MIUSAWilliam.liou@wmich.edu
LIU, CHENG-HSIEN
Department of Power Mechanical EngineeringNational Tsing Hua UniversityHsinchuTaiwanLiuch@pme.nthu.edu.tw
LIU, JING
Cryogenic Lab, Technical Institute of Physicsand ChemistryChinese Academy of SciencesBeijingChinajliu@cl.cryo.ac.cn
LIU, XIN
Dalian Institute of Chemical PhysicsChinese Academy of SciencesDalianChina
Contributors XXIII
LO, WIN-JET
Department of Refrigeration and Air-ConditioningNational Chin-Yi University of TechnologyTaichungTaiwan
LOUISOS, WILLIAM F.Mechanical Engineering Program, School of EngineeringUniversity of VermontBurlington, VTUSA
LUCAS, LONNIE J.Department of Agricultural & Biosystems EngineeringThe University of ArizonaTucson, AZUSA
LUKES, JENNIFER R.Department of ChemistryImperial College London, South Kensington CampusLondonUKjrlukes@seas.upenn.edu
LUO, HAOXIANG
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAhaoxiang.luo@vanderbilt.edu
MA, HONGBIN
Department of Mechanical & Aerospace EngineeringUniversity of Missouri-ColumbiaColumbia, MOUSA
MAEDA, HIDEAKI
Nanotechnology Research InstituteNational Institute of Advanced Industrial Scienceand Technology (AIST)Tosu, SagaJapanmaeda-h@aist.go.jp
MANDAL, SUDEEP
Sibley School of Mechanical and Aerospace EngineeringCornell UniversityIthaca, NYUSAsm445@cornell.edu
MANN, J. ADIN
Department of Chemical EngineeringCase Western Reserve UniversityCleveland, OHUSA
MANZARI, MEHRDAD T.Sharif University of TechnologyTehranIranmtmanzari@sharif.edu
MAO, XIAOLE
Department of BioengineeringThe Pennsylvania State UniversityUniversity Park, PAUSA
MAWATARI, KAZUMA
Microchemistry GroupKanagawa Academy of Science and Technology (KAST)KanagawaJapankmawatari@world.odn.ne.jp
MIAO, JIANMIN
Micromachines Centre, School of Mechanicaland Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemjmmiao@ntu.edu.sg
MILLER, ELIZABETH M.Terrence Donnelly Centre for Cellularand Biomolecular ResearchUniversity of TorontoToronto, ONCanada
MINAS, GRACA
Department of Industrial ElectronicsUniversity of MinhoGuimaraesPortugalgminas@dei.uminho.pt
MINC, NICOLAS
Department of MicrobiologyColumbia UniversityNYC, NYUSAnm2268@columbia.edu
XXIV Contributors
MINERICK, ADRIENNE R.Dave C Swalm School of Chemical EngineeringMississippi State UniversityStarkville, MSUSAminerick@che.msstate.edu
MINTEER, SHELLEY D.Department of ChemistrySaint Louis UniversitySt. Louis, MissouriUSAminteers@slu.edu
MIRAGHAIE, REZA
Keck Graduate InstituteClaremont, CAUSAreza_miraghaie@kgi.edu
MITRA, SUSHANTA K.Department of Mechanical EngineeringIndian Institute of Technology BombayMumbaiIndiaskmitra@me.iitb.ac.in
MIYAZAKI, MASAYA
Nanotechnology Research InstituteNational Institute of Advanced Industrial Scienceand Technology (AIST)Tosu, SagaJapanm.miyazaki@aist.go.jp
MOHSENI, KAMRAN
Department of Aerospace Engineering SciencesUniversity of ColoradoBoulder, COUSAmohseni@colorado.edu
MORGAN, HYWEL
School of Electronics and Computer ScienceUniversity of SouthamptonSouthamptonUKhm@ecs.soton.ac.uk
MORINI, GIAN LUCA
Institute of PhysicsDIENCA Università di BolognaBolognaItalygianluca.morini@mail.ing.unibo.it
MORRISON, DAVID W. G.Harvard-MIT Division of Health Sciencesand TechnologyMassachusetts Institute of TechnologyCambridge, MAUSA
MURTHY, SHASHI K.Department of Chemical EngineeringNortheastern UniversityBoston, MAUSAsmurthy@coe.neu.edu
MÜLLER, NORBERT
Michigan State UniversityEast Lansing, MIUSA
NADIM, ALI
Keck Graduate InstituteClaremont, CAUSAnadim@kgi.edu
NAKAMURA, HIROYUKI
Nanotechnology Research InstituteNational Institute of Advanced Industrial Scienceand Technology (AIST)TosuJapannakamura-hiroyuki@aist.go.jp
NAM-TRUNG, NGUYEN
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemntnguyen@ntu.edu.sg
NASAREK, R.Technical ThermodynamicsMechanical Engineering FacultyDarmstadt University of TechnologyDarmstadtGermanynasarek@ttd.tu-darmstadt.de
NATRAJAN, VINAY K.Department of Mechanical Science and EngineeringUniversity of IllinoisUrbana, ILUSA
Contributors XXV
NGUYEN, BAO
MEMS Research Laboratory Department of MechanicalEngineeringCollege of EngineeringSan Diego State UniversitySan Diego, CAUSAmntnguyen@ntu.edu.sg
NGUYEN, NAM-TRUNG
School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemntnguyen@ntu.edu.sg
NIEDERMANN, PHILIPPE
Division MicroroboticsCentre Suisse d’Electronique et de Microtechnique(CSEM S.A.)AlpnachSwitzerland
O’KENNEDY, RICHARD
Applied Biochemistry GroupSchool of Biotechnology and Biomedical DiagnosticsInstitute National Centre for Sensor ResearchDublin City UniversityDublinIrelandrichard.okennedy@dcu.ie
OLSEN, MICHAEL G.Department of Mechanical EngineeringIowa State UniversityAmes, IAUSAmgolsen@iastate.edu
OOI, KIM TIOW
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
PAIS, ANDREA
Department of Electrical and Computer EngineeringUniversity of CincinnatiCincinnati, OHUSA
PAMME, NICOLE
Department of ChemistryThe University of HullHullUK
PAN, YU-JEN
Department of Engineering ScienceNational Cheng Kung UniversityTainanTaiwan
PANDA, SIDDHARTHA
Department of Chemical EngineeringIIT KanpurKanpurIndiaspanda@iitk.ac.in
PANIGRAHI, PRADIPTA KUMAR
Department of Mechanical EngineeringIIT KanpurKanpurIndiapanig@iitk.ac.in
PAPAUTSKY, IAN
Department of Electrical and Computer EngineeringUniversity of CincinnatiCincinnati, OHUSAIan.Papautsky@uc.edu
PAPPAERT, KRIS
Transport Modeling & (Bio)analytical Separation ScienceGroup (TMAS2)Vrije Universiteit BrusselBrusselBelgiumkris.pappaert@gmail.com
PARIKESIT, GEA O. F.Quantitative Imaging GroupDelft University of TechnologyDelftThe Netherlandsg.o.f.parikesit@tudelft.nl
PARK, HYUNG GYU
Lawrence Livermore National LaboratoryLivermore, CAUSA
PARK, JEONG WON
Department of Biomedical EngineeringUniversity of CaliforniaIrvine, CAUSAnjeon@uci.edu
XXVI Contributors
PARK, SECHUL
Microsystems LaboratorySchool of Mechanical EngineeringYonsei UniversitySeoulRepublic of Korea
PELES, YOAV
Department of Mechanical, Aerospace and NuclearEngineeringRensselaer Polytechnic InstituteTroy, NYUSApelesy@rpi.edu
PETERSON, DOMINIC S.Chemistry DivisionLos Alamos National LaboratoryLos Alamos, NMUSADominicP@lanl.gov
PETERSON, ERIK T. K.Department of Electrical and Computer EngineeringUniversity of CincinnatiCincinnati, OHUSA
POPA, DAN
Automation & Robotics Research InstituteThe University of Texas at ArlingtonFort Worth, TXUSApopa@uta.edu
PYARAJAN, SAIJU
Department of Pathology and NYU Cancer InstituteNew York University School of MedicineNew York, NYUSASaiju.Pyarajan@med.nyu.edu
QI, SUIJIAN
Department of Biology and ChemistryCity University of Hong KongKowloon TongHong Kong SAR
QIN, JIANHUA
Department of BiotechnologyDalian Institute of Chemical PhysicsChinese Academy of SciencesDalianChinajhqin@dicp.ac.cn
QUAN, XIAOJUN
School of Mechanical and Power EngineeringShanghai Jiaotong UniversityShanghaiChina
RADADIA, ADARSH D.University of Illinois at Urbana-ChampaignUrbana, ILUSAradadia@uiuc.edu
RADISIC, MILICA
Department of Chemical Engineering and AppliedChemistryInstitute of Biomaterials and Biomedical EngineeringUniversity of TorontoToronto, ONCanada
RAUSCHER, MARKUS
Max-Planck-Institut für MetallforschungStuttgartGermanyrauscher@mf.mpg.de
REDDY, VARUN
Department of BioengineeringThe Pennsylvania State UniversityUniversity Park, PAUSA
REN, CAROLYN
Department of Mechanical and Mechatronics EngineeringUniversity of WaterlooWaterloo, ONCanadac3ren@mecheng1.uwaterloo.ca
RESCHKE, BRENT
C. Eugene Bennett Department of ChemistryWest Virginia UniversityMorgantown, WVUSA
RICCO, ANTONIO J.Biomedical Diagnostics Institute National Centrefor Sensor ResearchDublin City UniversityDublinIrelandajricco@alum.mit.edu
Contributors XXVII
ROUHANIZADEH, MAHSA
Department of Biomedical Engineering& Cardiovascular MedicineSchool of Engineering & School of MedicineUniversity of Southern CaliforniaLos Angles, CAUSArouhaniz@usc.edu
ROUSSEL, THOMAS J.Department of BioengineeringUniversity of LouisvilleLouisville, KYUSAthomas.roussel@louisville.edu
ROY, SUBRATA
Department of Mechanical and Aerospace EngineeringUniversity of FloridaGainesville, IAUSAroy@ufl.edu
SAGGERE, LAXMAN
University of Illinois at ChicagoChicago, ILUSAsaggere@uic.edu
SAHA, AURO ASHISH
Department of Mechanical EngineeringIndian Institute of Technology BombayMumbaiIndia
SAINIEMI, LAURI
Helsinki University of TechnologyHelsinkiFinlandlauri.sainiemi@tkk.fi
SCHAEFER, LAURA
Mechanical Engineering and Materials ScienceDepartmentUniversity of PittsburghPittsburgh, PAUSAlas149@pitt.edu
SCHMIDT, HOLGER
University of CaliforniaSanta Cruz, CAUSAhschmidt@soe.ucsc.edu
SCHÖNFELD, FRIEDHELM
Institut für Mikrotechnik Mainz GmbHMainzGermanySchoenfeld@imm-mainz.de
SENGUPTA, SHRAMIK
Department of Chemical and Biomolecular EngineeringUniversity of Notre DameNotre Dame, INUSA
SETHU, PALANIAPPAN
Department of BioengineeringUniversity of LouisvilleLouisville, KYUSAp.sethu@louisville.edu
SHAPIRO, BENJAMIN
Aerospace Engineering; joint appointments withBio-engineering, Institute of Systems Research; affiliatedwith Applied Mathematics and Scientific ComputationprogramUniversity of MarylandCollege Park, MDUSAbenshap@eng.umd.edu
SHARIPOV, FELIX
Departamento de FísicaUniversidade Federal do ParanáCuritibaBrazilsharipov@fisica.ufpr.br
SHIN, HWA SUNG
Department of Biomedical EngineeringUniversity of CaliforniaIrvine, CAUSA
SHUI, LINGLING
BIOS, Lab-on-a-Chip GroupMESA+ Institute for NanotechnologyEnschedeNetherlandsL.shui@ewi.utwente.nl
SILBER-LI, ZHANHUA
LNM, Institute of MechanicsChinese Academy of SciencesBeijingChinalili@imech.ac.cn
XXVIII Contributors
SIMMONS, BLAKE A.Sandia National LaboratoriesLivermore, CAUSA
SINGH, ANUP K.Sandia National LaboratoriesLivermore, CAUSAaksingh@sandia.gov
SINGHAL, ASHOK K.CFD Research CorporationHuntsville, ALUSA
SINTON, DAVID
Department of Mechanical EngineeringUniversity of VictoriaVictoria, BCCanadadongqing.li@vanderbilt.edudsinton@me.uvic.ca
SONG, YONG-AK
Department of Mechanical EngineeringMassachusetts Institute of TechnologyCambridge, MAUSAyongak@mit.edu
STAROV, VICTOR M.Department of Chemical EngineeringLoughborough UniversityLoughborough, LeicestershireUKV.M.Starov@lboro.ac.uk
STEPHAN, PETER
Technical ThermodynamicsMechanical Engineering FacultyDarmstadt University of TechnologyDarmstadtGermanypstephan@ttd.tu-darmstadt.de
STERLING, JAMES D.Keck Graduate InstituteClaremont, CAUSA
STREMLER, MARK A.Department of Engineering Science and MechanicsVirginia Polytechnic Institute and State UniversityBlacksburg, VAUSAmark.stremler@vt.edu
SU, CHUN-MIN
Flow Measurement LaboratoryCenter for Measurement StandardsIndustrial Technology Research InstituteHsinchuTaiwan
SUGUMAR, DHARMALINGAM
Faculty of Manufacturing EngineeringUniversiti Teknikal Malaysia MelakaMelakaMalaysiasugumar@utem.edu.my
SUH, YONG KWEON
Dong-A UniversityBusanKoreayksuh@dau.ac.kr
SUN, TAO
Nanoscale Systems Integration GroupSchool of Electronics and Computer ScienceUniversity of SouthamptonHighfield, SouthamptonUKts5@ecs.soton.ac.uk
SUNDARAM, SHIVSHANKAR
CFD Research CorporationHuntsville, ALUSA
SWICKRATH, MICHAEL J.Department of Chemical EngineeringCase Western Reserve UniversityCleveland, OHUSAmichael.swickrath@case.edu
SYMS, RICHARD R. A.Electrical and Electronic Engineering DepartmentImperial College LondonLondonUKr.syms@imperial.ac.uk
TAM, MAGGIE
Department of ChemistryWashington State UniversityPullman, WAUSA
Contributors XXIX
TANG, GONGYUE
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
TATSUMA, TETSU
Institute of Industrial ScienceUniversity of TokyoTokyoJapantatsuma@iis.u-tokyo.ac.jp
TESAR, VÁCLAV
Department of Thermodynamics,Institute of ThermomechanicsAcademy of Sciences of the Czech RepublicPragueCzech Republictesar@it.cas.cz
THIBAUDEAU, GISELLE
Electron Microscopy CenterMississippi State UniversityMississippi State, MSUSAgiselle@emcenter.msstate.edu
TIMPERMAN, AARON T.C. Eugene Bennett Department of ChemistryWest Virginia UniversityMorgantown, WVUSAatimperm@wvu.edu
TSAI, CHIEN-HSIUNG
Department of Vehicle EngineeringNational Pingtung University of Science and TechnologyPingtungTaiwanchtsai@mail.npust.edu.tw
TULLY, ELIZABETH
Applied Biochemistry GroupSchool of Biotechnology and Biomedical DiagnosticsInstituteNational Centre for Sensor ResearchDublin City UniversityDublinIreland
VAN DEN BERG, ALBERT
BIOS, Lab-on-a-Chip GroupMESA+ Institute for NanotechnologyEnschedeNetherlands
VAN DER LINDEN, HEIKO
Laboratory for Aero- and HydrodynamicsFaculty of Mechanical, Maritime and MaterialsEngineeringTU DelftDelftNetherlandsheiko.vanderlinden@tudelft.nl
VARHUE, W.J.Electrical & Computer Engineering ProgramSchool of EngineeringThe University of VermontBurlington, VTUSAvarhue@cems.uvm.edu
VENDITTI, ROBERTO
Department of Mechanical and Industrial EngineeringUniversity of TorontoToronto, ONCanadaroberto.venditti@gmail.com
WAGNER, E.Technical ThermodynamicsMechanical Engineering FacultyDarmstadt University of TechnologyDarmstadtGermany
WALKER, GREG
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAgreg.walker@vanderbilt.edu
WAN, WEIJIE
Department of Systems Design EngineeringUniversity of WaterlooWaterloo, ONCanadawwan@engmail.uwaterloo.ca
WANG, CHENG
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
XXX Contributors
WANG, GUIREN
Department of Mechanical EngineeringUniversity of South CarolinaColumbia, SCUSAwanggu@engr.sc.edu
WANG, MORAN
NEAT, Department of Biological & AgriculturalEngineeringUniversity of California DavisDavis, CAUSAmmwang@ucdavis.edu
WANG, WEISONG
Department of AstronomyUniversity of Texas at AustinAustin, TXUSAweisong@astro.as.utexas.edu
WANG, YI
CFD Research CorporationHuntsville, ALUSAyxw@cfdrc.com
WANG, YING-CHIH
Department of Mechanical EngineeringMassachusetts Institute of TechnologyCambridge, MAUSAycwang@mit.edu
WERELEY, STEVEN T.Department of Mechanical EngineeringPurdue UniversityWest Lafayette, INUSAwereley@purdue.edu
WESTERWEEL, JERRY
Laboratory for Aero- & HydrodynamicsDelft University of TechnologyDelftNetherlands
WHEELER, AARON R.Department of ChemistryUniversity of TorontoToronto, ONCanadaawheeler@chem.utoronto.ca
WILLIAMS, STUART
Mechanical EngineeringPurdue UniversityWest Lafayette, INUSAswilliams@purdue.edu
WNEK, GARY E.Department of Macromolecular Science and EngineeringCase Western Reserve UniversityCleveland, OHUSA
WONG, STEVEN
MEMS Research Laboratory Department of MechanicalEngineering College of EngineeringSan Diego State UniversitySan Diego, CAUSA
WONG, TECK NENG
School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemtnwong@ntu.edu.sg
WU, HONGKAI
Department of ChemistryTsinghua UniversityBeijingP. R. Chinahkwu@mail.tsinghua.edu.cn
WU, HUIYING
School of Mechanical and Power EngineeringShanghai Jiaotong UniversityShanghaiChina
WU, JIE
Department of Electrical Engineering and ComputerScienceThe University of TennesseeKnoxville, TNUSAjaynewu@utk.edu
WU, ZHEMIN
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAzhemin.wu@vanderbilt.edu
Contributors XXXI
XU, DONGYAN
Department of Mechanical EngineeringVanderbilt UniversityNashville, TNUSAdongyan.xu@vanderbilt.edu
XU, JENNIFER
Department of Biomedical Engineering& Cardiovascular MedicineSchool of Engineering & School of MedicineUniversity of Southern CaliforniaLos Angles, CAUSA
XUAN, XIANGCHUN
Department of Mechanical EngineeringClemson UniversityClemson, SCUSAxchxuan@mie.utoronto.ca
YAN, DEGUANG
Nanyang Technological UniversitySingaporeSingapore
YAN, HUI
Department of ChemistryTsinghua UniversityBeijingP. R. China
YANDONG, GAO
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
YANG, ALLEN
Sibley School of Mechanical EngineeringCornell UniversityIthaca, NYUSAay38@cornell.edu
YANG, CHENG-TSAIR
Flow Measurement LaboratoryCenter for Measurement StandardsIndustrial Technology Research InstituteHsinchuTaiwanctyang@itri.org.tw
YANG, CHUN
School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingaporemcyang@ntu.edu.sg
YANG, EUI-HYEOK
Department of Mechanical EngineeringStevens Institute of TechnologyHoboken, NJUSAeyang@stevens.edu
YANG, JUN
Bioengineering CollegeChongqing UniversityChongqingChinayjun1999@hotmail.com
YANG, LIJU
Biomanufacturing Research Institute & TechnologyEnterprise, and Department of Pharmaceutical SciencesNorth Carolina Central UniversityDurham, NCUSAlyang@nccu.edu
YANG, MENGSU
Department of Biology and ChemistryCity University of Hong KongKowloon TongHong Kong SARbhmyang@cityu.edu.hk
YANG, RUEY-JEN
Department of Engineering ScienceNational Cheng Kung UniversityTainanTaiwanriyang@mail.ncku.edu.tw
YANG, SEUNG-MAN
National CRI Center for Integrated Optofluidic Systemsand Department of Chemical and BiomolecularEngineeringKorea Advanced Institute of Science and TechnologyDaejeonKoreasmyang@kaist.ac.kr
XXXII Contributors
YANG, SHU
Materials Science and EngineeringUniversity of PennsylvaniaPhiladelphia, PAUSA
YANG, SUNG
Department of Mechatronics, School of Informationand MechatronicsGwangju Institute of Science and Technology (GIST)Gwangju, Buk-guRepublic of Koreasyang@gist.ac.kr
YAP, Y. F.School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
YASUDA, KENJI
Department of Biomedical Information, Divisionof BiosystemsInstitute of Biomaterials and BioengineeringTokyo Medical and Dental UniversityTokyoJapanyasuda.bmi@tmd.ac.jp
YE, NANNAN
Department of BiotechnologyDalian Institute of Chemical PhysicsChinese Academy of SciencesDalianChina
YE, WENJING
Department of Mechanical EngineeringHong Kong University of Science and TechnologyHong KongChinamewye@ust.hk
YEO, LESLIE
Micro/Nanophysics Research LaboratoryMonash UniversityClayton, VICAustralia
YEOW, JOHN T.W.Department of Systems Design EngineeringUniversity of WaterlooWaterloo, ONCanadajyeow@engmail.uwaterloo.ca
YI, CHANGQING
Department of Biology and ChemistryCity University of Hong KongKowloon TongHong Kong SAR
YOON, JEONG-YEOL
Department of Agricultural & Biosystems EngineeringThe University of ArizonaTucson, AZUSAjyyoon@email.arizona.edu
YOON, SEUNG-IL
Microsystems LaboratorySchool of Mechanical EngineeringYonsei UniversitySeoulRepublic of Korea
YU, HONGYU
Department of Biomedical Engineering& Cardiovascular MedicineSchool of Engineering & School of MedicineUniversity of Southern CaliforniaLos Angles, CAUSA
YU, QINGSONG
Department of Chemical EngineeringCenter for Surface Science and Plasma TechnologyUniversity of Missouri-ColumbiaColumbia, MOUSA
ZAHN, JEFFREY D.Department of Biomedical EngineeringRutgers, The State University of New JerseyPiscataway, NJUSAjdzahn@rci.rutgers.edu
ZENGERLE, ROLAND
Laboratory for MEMS ApplicationsDepartment of Microsystems EngineeringUniversity of FreiburgFreiburgGermanyzengerle@imtek.uni-freiburg.de
Contributors XXXIII
ZHANG, DI
State Key Lab of Metal Matrix CompositesShanghai Jiaotong UniversityShanghaiChina
ZHANG, JUNFENG
School of EngineeringLaurentian UniverstiySudbury, ONCanadajzhang@laurentian.ca
ZHANG, YALI
School of Mechanical & Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
ZHAO, SHIHUAI
Center for Microfibrous Materials ManufacturingChemical EngineeringAuburn UniversityAuburn, ALUSAszhao@auburn.edu
ZHENG, XIAOLIN
Bioengineering CollegeChongqing UniversityChongqingChina
ZHOU, HAN
State Key Lab of Metal Matrix CompositesShanghai Jiaotong UniversityShanghaiChina
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