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DVD PLAYERDVD-739
SERVICE 1. Precautions
2. Reference Information
3. Product Specification
4. Operating Instructions
5. Disassembly and Reassembly
6. Circuit Descriptions
7. Troubleshooting
8. Exploded Views and Parts List
9. Electrical Parts List
10. Block Diagram
11. PCB Diagrams
12. Wiring Diagram
13. Schematic Diagrams
Manual
DVD PLAYER CONTENTS
SERVICE MA
NU
AL
DVD
-739OPEN/CLOSE
STANDBY
OPEN/CLOSE
24bit 96kHz AUDIO D/A CONVERTERDIGITAL VIDEO
SPATIALIZERN-2-2
POWER
SKIP
ELECTRONICS
© Samsung Electronics Co., Ltd. JUN. 1999Printed in KoreaAH68-00180A
Samsung Electronics 1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,always make a safety check of the entire instrument,including, but not limited to, the following items:
(1) Be sure that no built-in protective devices aredefective or have been defeated during servicing.(1)Protective shields are provided to protect boththe technician and the customer. Correctly replaceall missing protective shields, including anyremove for servicing convenience. (2)When reinstalling the chassis and/or other as-sembly in the cabinet, be sure to put back in placeall protective devices, including, but not limited to,nonmetallic control knobs, insulating fish papers,adjustment and compartment covers/shields, andisolation resistor/capacitor networks. Do not oper-ate this instrument or permit it to be operated with-out all protective devices correctly installed andfunctioning.
(2) Be sure that there are no cabinet openings throughwhich adults or children might be able to inserttheir fingers and contact a hazardous voltage. Suchopenings include, but are not limited to, excessive-ly wide cabinet ventilation slots, and an improper-ly fitted and/or incorrectly secured cabinet backcover.
(3) Leakage Current Hot Check-With the instrumentcompletely reassembled, plug the AC line corddirectly into a 120V AC outlet. (Do not use a isola-tion transformer during this test.) Use a leakagecurrent tester or a metering system that complieswith American National Standards institute (ANSI)C101.1 Leakage Current for Appliances andUnderwriters Laboratories (UL) 1270 (40.7). Withthe instrumentÕs AC switch first in the ON positionand then in the OFF position, measure from aknown earth ground (metal water pipe, conduit,etc.) to all exposed metal parts of the instrument(antennas, handle brackets, metal cabinets, screw-heads, metallic overlays, control shafts, etc.), espe-cially any exposed metal parts that offer an electri-cal return path to the chassis. Any current measured must not exceed 0.5mA.Reverse the instrument power cord plug in the out-let and repeat the test. See Fig. 1-1.
Any measurements not within the limits specifiedherein indicate a potential shock hazard that mustbe eliminated before returning the instrument tothe customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplugthe power supply cord and connect a jumper wirebetween the two prongs of the plug. (2) Turn on thepower switch of the instrument. (3) Measure theresistance with an ohmmeter between thejumpered AC plug and all exposed metallic cabinetparts on the instrument, such as screwheads,antenna, control shafts, handle brackets, etc. Whenan exposed metallic part has a return path to thechassis, the reading should be between 1 and 5.2megohm. When there is no return path to the chas-sis, the reading must be infinite. If the reading isnot within the limits specified, there is the possibil-ity of a shock hazard, and the instrument must bere-pared and rechecked before it is returned to thecustomer. See Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
DEVICEUNDERTEST
(READING SHOULDNOT BE ABOVE
0.5mA)LEAKAGECURRENTTESTER
EARTHGROUND
TEST ALLEXPOSED METER
SURFACES
ALSO TEST WITHPLUG REVERSED
(USING AC ADAPTERPLUG AS REQUIRED)
2-WIRE CORD
AntennaTerminal
ExposedMelal Part
ohmohmmeter
Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety re-lated notes non or inside the cabinet, or on the chas-sis.
3) Design Alteration Warning-Do not alter of add tothe mechanical or electrical design of this instru-ment. Design alterations and additions, includingbut not limited to, circuit modifications and theaddition of items such as auxiliary audio outputconnections, might alter the safety characteristics ofthis instrument and create a hazard to the user. Anydesign alterations or additions will make you, theservice, responsible for personal injury or propertydamage resulting therefrom.
4) Observe original lead dress. Take extra care toassure correct lead dress in the following areas:(1) near sharp edges, (2) near thermally hot parts (besure that leads and components do not touch ther-mally hot parts), (3) the AC supply, (4) high voltage,and (5) antenna wiring. Always inspect in all areasfor pinched, out-of-place, or frayed wiring, Do notchange spacing between a component and theprinted-circuit board. Check the AC power cord fordamage.
5) Components, parts, and/or wiring that appear tohave overheated or that are otherwise damagedshould be replaced with components, parts and/ orwiring that meet original specifications. Additionally, determine the cause of overheatingand/or damage and, if necessary, take correctiveaction to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechani-cal parts have special safety-related characteristicswhich are often not evident from visual inspection,nor can the protection they give necessarily beobtained by replacing them with components ratedfor higher voltage, wattage, etc. Parts that have spe-cial safety characteristics are identified by shading,an ( )or a ( )on schematics and parts lists. Useof a substitute replacement that does not have thesame safety characteristics as the recommendedreplacement part might created shock, fire and/orother hazards. Product safety is under review con-tinuously and new instructions are issued whenev-er appropriate.
Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing Instruments coveredby this service manual and its supplements, read andfollow the Safety Precautions section of this manual.
Note : If unforseen circument create conflict betweenthe following servicing precautions and any of thesafety precautions, always follow the safety precau-tions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrumentÕs AC power cordfrom the AC power source before (1) re-movingor reinstalling any component, circuit board,module or any other instrument assembly, (2)disconnecting any instrument electrical plug orother electrical connection, (3) connecting a testsubstitute in parallel with an electrolytic capaci-tor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-locks with which instruments covered by thisservice manual might be equipped.
c. Do not apply AC power to this instrument and/or any of its electrical assemblies unless allsolid-state device heat sinks are correctly in-stalled.
d. Always connect a test instrumentÕs ground leadto the instrument chassis ground before connect-ing the test instrument positive lead. Alwaysremove the test instrument ground lead last.
Note : Refer to the Safety Precautions section groundlead last.
(2) The service precautions are indicated or printed onthe cabinet, chassis or components. When servic-ing, follow the printed or indicated service precau-tions and service materials.
(3) The components used in the unit have a specifiedflame resistance and dielectric strength.When replacing components, use componentswhich have the same ratings. Components i-enti-fied by shading, by( ) or by ( ) in the circuit dia-gram are important for safety or for the characteris-tics of the unit. Always replace them with the exactreplacement components.
(4) An insulation tube or tape is sometimes used andsome components are raised above the printedwiring board for safety. The internal wiring issometimes clamped to prevent contact with heat-ing components. Install such elements as theywere.
(5) After servicing, always check that the removedscrews, components, and wiring have been in-stalled correctly and that the portion around theserviced part has not been damaged and so on.Further, check the insulation between the blades ofthe attachment plug and accessible conductiveparts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outletand turn the power ON. Connect the insulation resi-stance meter (500V) to the blades of the attachmentplug. The insulation resistance between each blade ofthe attachment plug and accessible conductiveparts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal pan-els, input terminals, earphone jacks, etc.
Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be dam-aged easily by static electricity.Such components commonly are called Electrostati-cally Sensitive Devices(ESD). Examples of typical ESDdevices are integrated circuits and some field-effecttransistors and semiconductor chip components. Thefollowing techniques should be used to help reducethe incidence of component damage caused by staticelectricity.
(1) Immediately before handling any semiconductorcomponent or semiconductor-equipped assembly,drain off any electrostatic charge on your body bytouching a known earth ground. Alternatively,obtain and wear a commercially available dis-charging wrist strap device, which should beremoved for potential shock reasons prior to apply-ing power to the unit under test.
(2) After removing an electrical assembly equippedwith ESD devices, place the assembly on a conduc-tive surface such as aluminum foil, to prevent elec-trostatic charge buildup or exposure of the assem-bly.
(3) Use only a grounded-tip soldering iron to solder orunsolder ESD devices.
(4) Use only an anti-static solder removal devices.Some solder removal devices not classified asÒanti-staticÓ can generate electrical charges suffi-cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These cangenerate electrical charges sufficient to damageESD devices.
(6) Do not remove a replacement ESD device from itsprotective package until immediately before yourare ready to install it.(Most replacement ESDdevices are packaged with leads electrically short-ed together by conductive foam, aluminum foil orcomparable conductive materials).
(7) Immediately before removing the protective ma-terials from the leads of a replacement ESD device,touch the protective material to the chassis or cir-cuit assembly into which the device will beinstalled.
CAUTION : Be sure no power is applied to the ch-assis or circuit, and observe all other safety precau-tions.
(8) Minimize bodily motions when handling unpack-aged replacement ESD devices. (Otherwise harm-less motion such as the brushing together of yourclothes fabric or the lifting of your foot from a car-peted floor can generate static electricity sufficientto damage an ESD device).
Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec-trostatic breakdown because of potential static elec-tricity from clothing and your body.
The following method is recommended.(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that thechassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(Thisgives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Becareful not to let your clothes or any other staticsources to touch the unit.
3 Be sure to put on a wrist strap grounded to thesheet.
3 Be sure to lay a conductive sheet made of copper etc.Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-side the Pick-Up ASSÕY, before replacing the Pick-Up. (The short terminal is shorted when the Pick-Up AssÕy is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-nal on the PCB.
THE UNIT
WRIST-STRAPFOR GROUNDING
1M
1MCONDUCTIVE SHEET
Precautions
1-6 Samsung Electronics
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1) Remove the power cable.2) Switch LD SW3 on deck PCB to ÒOFFÓ before
removing the FPC ( Inserted into Main PCB CN6. See Fig. 1-4)
3) Disassemble the deck.4) Disassemble the deck PCB.
1-5-2 Assembly
1) Replace the Pick-up.2) Assemble the deck PCB.3) Reassemble the deck.4) Switch LD SW3 on Deck PCB to ÒONÓ and insert
FPC into Main PCB CN6 (See Fig 1-4).
SW3
ONOFF
FPC
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
Fig. 1-4
Samsung Electronics 2-1
2. Reference Information
2-1 IC Dsecriptions
2-1-1 AIC1 (AK4324 ; Digital-to-Analog Converter)
Serial InputInterface
De-emphasisControl
8XInterpolator
8XInterpolator
∆ ∑Modulator
SCF
SCF∆ ∑Modulator
Clock Divider
DIF0 DIF1 DIF2 DEM0 DEM1 AVDD AVSS
VREFDVSSDVDDCKSMCLK
LRCKBICK
SDATA
SMUTE
DFS
DZFL
AOUTL+
AOUTL-
AOUTR+
AOUTR-
DZFR
PD
NAME
DVSS
DVDD
CKS
MCLK
BICK
SDATA
PD
I / O
I
I
I
I
I
PIN
1
2
3
4
5
6
I7
LRCKI8
FUNCTION NAMEI / OPIN FUNCTIONDigital ground pin
Digital power supply
Master clock select pin (Internal pull-down pin)Nomal speed "L":MCLK = 256fs, "H":MCLK = 384fsDouble speed "L":MCLK = 128fs, "H":MCLK = 192fs
Master clock input pin
Power-Down mode pin. When at "L", the AK4324 is in power-down and is held in rest.The AK4324 should always be reset upon power-pin
I SMUTE9
I DFS10
I DEM011
Soft mute pinWhen this pin goes "H", soft mute cycle is initiatedWhen returning "L", the output mute releases.
Audio serial data input pin64fs clock is recommended to be input on this pin
Audio serial data input pin2's complement MSB-first data is input on this pin.
Double speed sampling mode pin (Internal pull-down pin)"L":normal speed, "H":double speed
L/R clock pin.
De-emphasis frequency select pin
I DEM112 De-emphasis frequency select pin
Note : Allinput pins except internal pull-down pins should not be left floating.
-
DZFLO
Lch positive analog output pin
Analog ground pin
Voltage reference input pin
Analog power supply pin.
Rch zero input detect pin
Lch zero input detect pin
I DIF013 Digital input format pin
I DIF114 Digital input format pin
I DIF215 Digital input format pin
0 AOUTR-16 Rch negative analog output pin
O AOUTR+17 Rch positive analog output pin
O AOUTL-
AOUTL+
18
O19
AVSS-20
VREFO21
AVDDO22
DZFRO23
24
Lch negative analog output pin
Reference Information
2-2 Samsung Electronics
2-1-2 RIC1 (KS1461 ; RF)
100 99 98 97 96 95 94 93 92 91 90
VZO
CTL
PLLG
F
EQ
F
EQ
G
RD
PF
AG
CP
AG
CB
AG
CLE
VE
L
EQ
GN
D
AG
CI
AG
CC
89
RFA
GC
O
88
EQ
IN
87
BC
ATH
86
RFE
QO
85
EQ
VC
C
84
MIR
RI
83
CP
1
81M
RO
FST
80
RFR
PN
82
CB
1
78
CP
2
77
CB
2
76
RFC
T
79
RFR
P
75 BCAO
74 BCAI
73 RESET
72 OSC
71 STB
70 CLOCK
69 DATA
68 RREFDLY
67 VREFDPD
66 DPDGND
65 TE1RES
64 PLLCTL
63 DPDMUTE
62 FAUL TOUT
61 DPDEQ2
60 DPDEQ1
59 TE30FST
58 BCA
56 DPDVCC
55 DFCT2
54 DFCT1
53 DFCTTH1
52 DFCTTH2
51 DVCC
50
CC
2
49
CC
1
48
DFC
T_CP
2
47
DFC
T_CP
1
46
FOK
B
45
FOK
TH
44
DG
ND
43
EN
V
42
EN
VB
41
EN
VP
40
AB
CD
I
39
AB
CD
38
AB
CD
N
37
PD
LIMITR
ES
36
TE
35
TEN
34
FEN
33
FE
32
AG
ND
31
PD
CD
30
LDO
CD
29
PD
VD
28
LDO
DV
D
27
VR
EFLP
_BG
I
26
OFS
THO
LD
25FOFST
24VREFA
23AVCC
22DCD1
21CCD1
20BCD1
19ACD1
18DDVD1
17CDVD1
16BDVD1
15ADVD1
14F
13E
12VREFEQ
11RREF
10RREFEQ
9RREFBF
8DDVD
7CDVD
6BDVD
5ADVD
4DCD
3CCD
2BCD
1ACD
to RF EQTUNING BLOCK AGC-HOLD(OOH)
MUX
AGC_DET
RFMUX
VREFGENERATOR
CDRSEL(00H)
EQVC AMP
D
D
D
D
MUX3
GAIN_TE3(02H)
GCA
OFSTHOLD
TEOFST(04H)TBAL(01H)
TE38
SUBRF
MUX
D1B1C1A1
FE
GAIN_FE(03H)
FE_0FST(05H)
CDRSEL(00H)
ANALOGVC AMP
ALPC
LDONB(00H)
FOFST
OFS
THO
LD
MUXTESEL(OOH)
OFSTHOLD
ABCD_OFST(O6H)
ENVELOPE FOK DEFECT
MUX
ENV_SEL(02H)
EQIN
CDRSEL(OOH)
ABCDSUM
GAIN_ABCD(OOH)
DELAY_SEL(00H)PLLCTL
FAULTOUT
PDLIMITRES
TEOPST(04H)
PD,LPFDELAY
TE1_LIMIT
DELAY_SEL(OOH)PLLCTLTBAL(O1H)
HOLD_CTL(O8H)DPDMUTEDPD_MUTE(O2H)SEOFHOLDFLT_CTL(OOH)CAL_ENDB(O2H)
COM
COM
DPDEQ2
DPDEQ1
GCA
GCA
EQ
EQ
CD1S12DVD1DVD2LDONBFLT_CTLCDRSELTESELAGC-HOLDTBALGAIN_TE3ENV_SELDVCTL_SELDPD_MUTEGAIN_EQGAIN_FEGAIN_ABCDTE_OFSTFE_OFSTABCD_OFSTDELAY_CDDELAY_ABPDLIMITga_RFSUMHOLD_CTLga_PLLDPga_PLLDN
to DPDBLOCK
DPDBLOCK
S/IFBLOCK
AUTOOFSTCTL
BCABLOCK
BCA
RFCT&
MIRR
RFRP
TE1RES
CD1 S12 DVD1.2
RFEqualizer
RF SLM& AGC
A
B
C
D
GAIN_EQ(02H)
MIRR57
Reference Information
Samsung Electronics 2-3
171615141312111098765432
CD op
tical
main
beam
A A
C co
uplin
g inp
ut po
rt fo
r RF
CD op
tical
main
beam
B A
C co
uplin
g inp
ut po
rt fo
r RF
CD op
tical
main
beam
C A
C co
uplin
g inp
ut po
rt fo
r RF
CD op
tical
main
beam
D A
C co
uplin
g inp
ut po
rt fo
r RF
DVD
optic
al ma
in be
am A
AC
coup
ling i
nput
port
for R
F
DVD
optic
al ma
in be
am B
AC
coup
ling i
nput
port
for R
F
DVD
optic
al ma
in be
am C
AC
coup
ling i
nput
port
for R
F
DVD
optic
al ma
in be
am D
AC
coup
ling i
nput
port
for R
F
RF A
MP
I/O b
uffe
r bias
resis
tanc
e co
nnec
tion
port
RF E
Q bia
s res
istan
ce co
nnec
tion
port
Analo
g blo
ck b
ias re
sista
nce
conn
ectio
n po
rt
CAP
conn
ectio
n po
rt fo
r RF E
Q ce
nter
volta
ge
CD o
ptica
l sub
bea
m E
input
por
t for
SER
VO
CD o
ptica
l sub
bea
m F i
nput
por
t for
SER
VO
DVD
optic
al ma
in be
am A
inpu
t por
t for
SER
VO
DVD
optic
al ma
in be
am B
inpu
t por
t for
SER
VO
DVD
optic
al ma
in be
am C
inpu
t por
t for
SER
VO
1AC
D
BCD
CCD
DCD
ADVD
BDVD
CDVD
DDVD
RREF
BF
RREF
EQ
RREF
VREF
EQ E F
ADVD
1
BDVD
1
CDVD
1
FUNC
TION
PIN
NAM
EI/O I I I I I I I I - - O I I I I I-
3837363534FE
Inpu
t por
t for
AM
P GA
IN se
tting
Input
por
t for
TE
AMP
GAIN
setti
ng
TE A
MP
outp
ut p
ort
Bias
resis
tanc
e po
rt fo
r PDL
IMIT
Input
por
t for
ABC
D AM
P GA
IN se
tting
FEN
TEN TE
PDLIM
TRES
ABCD
N
FUNC
TION
PIN
NAM
EI/O I I O - I
28272625242322212019
DVD
optic
al ma
in be
am D
inpu
t por
t for
SER
VO
CD o
ptica
l main
bea
m F i
nput
por
t for
SER
VO
CD o
ptica
l main
bea
m F i
nput
por
t for
SER
VO
CD o
ptica
l main
bea
m F i
nput
por
t for
SER
VO
CD o
ptica
l main
bea
m F i
nput
por
t for
SER
VO
Powe
r volt
age
input
por
t for
ana
log p
art
CAP
conn
ectio
n po
rt fo
r ana
log p
art
cent
er vo
ltage
, Use
at o
ther
bloc
k
CAP
conn
ectio
n po
rt fo
r foc
us a
uto
offse
t (OP
EN)
ON/O
FF co
nnec
tion
port
for a
uto
offse
t bloc
k (L :
auto
offs
et a
djustm
ent H
: se
rial o
ffset
adju
stmen
t)
BAND
GAP
volta
ge in
put p
ort f
or A
LPC
DVD
optic
al las
er d
iode
drivi
ng vo
ltage
out
put p
ort
18DD
VD1
ACD1
BCD1
CCD1
DCD1
AVCC
VREF
A
FOFS
T
OFST
HOLD
VREF
LP_B
GI
LDOD
VD
I I I I I -/O O I OIP
32313029DV
D op
tical
laser
mon
itor d
iode
volta
ge in
put p
ort
CD o
ptica
l las
er d
iode
drivi
ng vo
ltage
out
put p
ort
CD o
ptica
l las
er m
onito
r diod
e vo
ltage
inpu
t por
t
Powe
r GND
por
t for
ana
log p
art
PDDV
D
LDOC
D
PDCD
AGND
I O I P
33FE
AM
P ou
tput
por
tFE
O
ABCD
AC
coup
ling
input
por
t for
SER
VO m
onito
rAB
CDI
I
484746454443424140
ABCD
AM
P ou
tput
por
t
Peak
hold
time
cons
tant
setti
ng R
C co
nnec
tion
port
for R
F env
elope
det
ect
Botto
m ho
ld tim
e co
nsta
nt se
tting
RC
conn
ectio
n po
rt fo
r RF e
nvelo
pe d
etec
t
RF e
nvelo
pe d
etec
t out
put p
ort
Powe
r GND
inpu
t por
t for
digi
tal c
ircuit
Focu
s OK
comp
aring
leve
l inp
ut p
ort
Focu
s OK
comp
arat
or o
utpu
t por
t (L:
FOCU
S OK
)Pe
ak h
old ti
me co
nsta
nt co
nnec
tion
port
SERV
Ode
fect
max.
time
setti
ngPe
ak h
old ti
me co
nsta
nt co
nnec
tion
port
PLL d
efec
tmi
n. tim
e se
tting
39AB
CD
ENVP
ENVB
ENV
DGND
FOKT
H
FOKB
DFCT
_CP1
DFCT
_CP2
O - - O I O - -P
6261605958575655545352515049Ou
tput
por
t of p
eak d
etec
tor f
or d
efec
t
AC co
uplin
g inp
ut p
ort f
or d
efec
t
Powe
r volt
age
input
por
t for
digi
tal c
ircuit
Resis
tanc
e co
nnec
tion
port
for P
LL d
efec
t com
para
t-ing
leve
l set
ting
Resis
tanc
e co
nnec
tion
port
for S
ERVO
def
ect c
om-
para
ting
level
setti
ng
Defe
ct ou
tput
por
t for
SER
VO
Defe
ct ou
tput
por
t for
PLL
Powe
r volt
age
input
por
t for
DPD
TE
Mirr
or o
utpu
t por
t
BCA
outp
ut p
ort
Resis
tanc
e co
nnec
tion
port
for 3
BTE
offse
t
DPD
EQ (A
+C) o
utpu
t por
t
DPD
EQ (B
+D) o
utpu
t por
t
DPD
defe
ct wa
vefo
rm o
utpu
t por
t (M
ONITO
R)
CC1
CC2
DVCC
DVCT
TH2
DFCT
TH1
DFCT
1
DFCT
2
DPDV
CC
MIR
R
BCA
TE3O
FST
DPDE
Q1
DPDE
Q2
FAUL
TOUT
O P - -I O O P O O - O O O
64
DPD
TE M
UTE
cont
rol p
ort (
H : M
UTE)
DPD
TE P
LL va
riable
inpu
t por
t
63DP
DMUT
E
PLLC
TL
I I
FUNC
TION
PIN
NAM
EI/O
FUNC
TION
PIN
NAM
EI/O
8786858483828180797877767574737271706968676665DP
D TE
PLL
varia
ble b
ias re
sista
nce
Powe
r GND
inpu
t por
t for
DPD
TE
CAP
conn
ectio
n po
rt fo
r DPD
TE
cent
er
Bias
resis
tanc
e co
nnec
tion
port
for d
elta
block
Data
inpu
t por
t
Cloc
k inp
ut p
ort
Data
ena
ble in
put p
ort
OSC
time
cons
tant
inpu
t por
t for
aut
o of
fset b
lock
Rese
t inp
ut p
ort f
or a
uto
offse
t bloc
k (L :
RES
ET)
BCA
FILTE
R1
BCA
FILTE
R2
RF ri
pple
cent
er vo
ltage
out
put p
ort f
or m
irror
Botto
m ho
ld tim
e co
nsta
nt R
C co
nnec
tion
port
for
RFCT
gen
erat
ionPe
ak h
old ti
me co
nsta
nt R
C co
nnec
tion
port
for
RFCT
gen
erat
ion
RF ri
pple
AMP
outp
ut p
ort f
or m
irror
RF ri
pple
AMP
GAIN
inpu
t por
t for
mirr
or
RF ri
pple
offse
t con
trol p
ort f
or m
irror
Botto
m ho
ld tim
e co
nsta
nt R
C co
nnec
tion
port
for
RFCT
gen
erat
ion
Peak
hold
time
cons
tant
RC
conn
ectio
n po
rt fo
rRF
CT g
ener
ation
Input
por
t for
MIR
R sig
nal g
ener
ation
Powe
r volt
age
input
por
t for
RF E
Q
RF E
Q ou
tput
por
t
BCA
comp
arat
ing le
vel c
ontro
l por
t
TE1R
ES
DPDG
ND
VREF
DPD
RREF
DLY
DATA
CLOC
K
STB
OSC
RESE
T
BCAI
BCAO
RFCT
CB2
CP2
RFRP
RFRP
N
MRO
FST
CB1
CP1
MIR
RI
EQVC
C
RFEQ
O
BCAT
H
I P O - I I I I I O O - - O I I - - I P O I
919089
RFAG
CO in
put p
ort f
or R
F EQ
RF A
GC A
MP
outp
ut p
ort
AGC
time
cons
tant
CAP
conn
ectio
n po
rt
Whe
n AG
C is
“HOL
D”, A
GC vo
ltage
inpu
t por
t
88EQ
IN
RFAG
CO
AGCC
AGCI
I O - I
95949392Po
wer G
ND in
put p
ort f
or R
F EQ
AGC
level
cont
rol v
oltag
e inp
ut p
ort
RF bo
ttom
hold
time c
onsta
nt RC
conn
ectio
n port
for R
F AGC
RF pe
ak ho
ld tim
e con
stant
RC co
nnec
tion p
ort fo
r RF A
GC
EQGN
D
AGCL
EVEL
AGCB
AGCP
P I - -
10099989796
Bias r
esist
ance
conn
ectio
n port
for R
F EQ f
reque
ncy s
etting
RF E
Q bo
ost g
ain co
ntro
l volt
age
input
por
t
RF E
Q pe
ak fr
eque
ncy c
ontro
l volt
age
input
por
t
RF E
Q bo
ost,
peak
freq
uenc
y gain
cont
rol p
ort c
orre
-sp
ondin
g to
wide
band
PLL
(PLL
G. P
LLF r
esist
ance
inter
nal d
esign
)RF
EQ
cont
rol p
ort (
Whe
n No
. PLL
G isn
’t ad
juste
d,ap
ply D
C CT
L volt
age.)
RDPF
EQG
EQF
PLLG
F
VZOC
TL
- I I I I
Reference Information
2-4 Samsung Electronics
2-1-3 SIC1 (KS1452 ; Digital Servo)
A/D
CO
NV
ER
TER
BLO
CK
D/A
CO
NV
ER
TER
BLO
CK
TRA
CK
CO
UN
TER
EFM
AS
YM
ETR
Y
VR
EF
EN
V
TZC
O
SM
E TE FE
CO
UT
FOD
TRD
SLD
SP
D
FBA
L
TBA
L
DV
CTL
EFM
I
RFI
AS
YD
VD
AS
YC
D
EFM
EFM
OA
PLL
HD
INTO
_224
FDC
TL
MA
GIC
O
EQ
CTL
VC
TRL
RV
CO
PLC
K
EFM
RTD
RP
D
RFD
PLL
LOC
K
MD
OU
T[3:
0]
PS
B
SE
NS
E
MD
ATA
[7:0
]
MR
DB
MW
RB
CS
B
DA
B
SC
OR
SQ
SI
SQ
CK
LDO
NB
TLK
B
FLK
B
DIRC
PS1
SSTOP/PSO
SMON
LOCK
DFCT
FOKB
MIRR
TZCA
PHI1
XOUT
XO
XI
TEST
RSTB
TILTO
TILTI
RO
M
DS
P C
OR
EFO
RD
IGIT
AL
SE
RV
O
TIM
ING
GE
NE
RAT
OR
I/O IN
TER
FAC
EB
LOC
K SU
B C
OD
ER
EA
D B
LOC
K
SY
SC
ON
INTE
RFA
CE
BLO
CK
WID
EC
AP
TUR
ER
AN
GE
PLL
Reference Information
Samsung Electronics 2-5
33323130292827262524232221201918171615141312111098765432
Mod
e da
ta3
out c
ontro
lled
by m
icom
Limit
switc
h/sle
d po
sition
sens
or in
put p
in0
Sled
mot
or p
ositi
on se
nsor
inpu
t pin
1
Test
pin (L
: no
rmal
H : t
est)
Coun
ter c
lock
Focu
s ser
vo lo
ck si
gnal
outp
ut p
in
Track
ing se
rvo lo
ck si
gnal
outp
ut p
in
0 : 1
BIT
1 :
8BIT
Syste
m re
set s
ignal
input
pin
Mico
m ch
ip se
lect p
in
Mico
m da
ta/a
ddre
ss se
lect p
in
Mico
m wr
ite cl
ock s
ignal
input
pin
Mico
m re
ad cl
ock s
ignal
input
pin
Mico
m da
ta p
in 0
Mico
m da
ta p
in 1
Mico
m da
ta p
in 2
Mico
m da
ta p
in 3
Mico
m da
ta p
in 4
Mico
m da
ta p
in 5
Mico
m da
ta p
in 6
Mico
m da
ta p
in 7
Inter
nal s
tatu
s mon
itor p
in
Servo
logic
& R
OM V
DD p
ower
supp
ly pin
Syste
m clo
ck si
gnal
input
pin
Syste
m clo
ck si
gnal
outp
ut p
in
Cloc
k out
(33.9
688M
Hz) t
o DS
P
Servo
logic
& R
OM V
SS p
ower
supp
ly pin
Cloc
k out
put p
in fo
r sub
code
dat
a re
ad
Subc
ode
data
inpu
t pin
Timing
detec
tion i
nput
pin fo
r sub
code
data
read
Mot
or O
N sig
nal i
nput
pin
Lock
sign
al inp
ut p
in
Dire
ct jum
p co
ntro
l (fo
r 1 tr
ack j
ump)
1M
DOUT
3
SSTO
P/PS
O
PS1
TEST
COUT
FLKB
TLKB PSB
RSTB
CSB
DAB
MW
RB
MRD
B
MDA
TA0
MDA
TA1
MDA
TA2
MDA
TA3
MDA
TA4
MDA
TA5
MDA
TA6
MDA
TA7
SENS
E
DVDD XI XO XOUT
DVSS
SQCK
SQSI
SCOR
SMON
LOCK
DIRC
FUNC
TION
PIN
NAM
EI/O O I I I O O O I I I I I I I/O I/O I/O I/O I/O I/O I/O I/O O P I O O P O I I I I I
646362616059585756555453525150494847464544434241403938373635
Focu
s OK
signa
l inp
ut p
in
PLL f
requ
ency
det
ect c
ontro
l inp
ut p
in
Lase
r diod
e ON
sign
al ou
tput
pin
Defe
ct De
tecti
on si
gnal
input
pin
Mirr
or si
gnal
input
pin
PLL h
old si
gnal
from
mico
m
Servo
inte
rrupt
mon
itor p
in
PLL l
ogic
block
VDD
pow
er su
pply
pin
PLCK
Frequ
ency
lock
det
ect o
utpu
t (H
: Lo
ck L
: Unlo
ck)
Latch
ed E
FM o
utpu
t sign
al
PLL l
ogic
block
VSS
pow
er su
pply
pin
Resis
tor p
in fo
r VCO
GAI
N
Gain
adjus
t res
ister
for f
requ
ence
det
ecto
r
Gain
adjus
t res
ister
for p
hase
det
ecto
r
Cont
rol v
oltag
e fo
r VCO
Input
for h
yste
resis
cont
rol o
f FD
outp
ut (f
or te
st)
EFM
offs
et a
djustm
ent p
in
Track
ing ze
ro cr
oss o
utpu
t pin
Servo
CPU
VDD
pow
er su
pply
pin
EQ co
ntro
l sign
al
EFM
sign
al fo
r tes
t
EFM
sign
al
Asym
metri
c inp
ut si
gnal
for D
VD
Asym
metri
c inp
ut si
gnal
for C
D
RF in
put s
ignal
Servo
CPU
VSS
pow
er su
pply
pin
Analo
g blo
ck V
SS p
ower
supp
ly pin
Spind
le er
ror i
nput
pin
Refe
renc
e vo
ltage
inpu
t pin
Track
ing e
rror s
ignal
input
pin
34FO
KB
FDCT
L
LDON
B
DFCT
MIR
R
PLLH
D
INTO
_224
PVDD
PLCK
PLLL
OCK
EFM
RTD
PVSS
RVCO
RFD
RPD
VCTL
MAG
ICO
EFM
OA
TZCO
SVDD
EQCT
L
EFM
I
EFM
O
LPFD
VD
LPFC
D
RFI
SVSS
AVSS
SME
VREF TE
FUNC
TION
PIN
NAM
EI/O I I O I I I O P O O O P I I I I I I O P O I O I I I P P I I I
72717069686766
Focu
s erro
r sign
al inp
ut p
in
RF e
nvelo
pe in
put p
in
Tilt i
n (re
serve
d)
Analo
g blo
ck V
DD p
ower
supp
ly pin
Tilt o
ut (r
eser
ved)
Dept
h va
riatio
n co
ntro
l sign
al ou
tput
pin
Track
ing b
alanc
e sig
nal o
utpu
t pin
Focu
s bala
nce
signa
l out
put p
in
65FE EN
V
TILTI
AVDD
TILTO
DVCT
L
TBAL
FBAL
FUNC
TION
PIN
NAM
EI/O I I I P O O O O
8079787776757473Sl
ed m
otor
driv
e sig
nal o
utpu
t pin
Spind
le mo
tor d
rive
signa
l out
put p
in
Focu
s actu
ator
driv
e sig
nal o
utpu
t pin
Track
ing a
ctuat
or d
rive
signa
l out
put p
in
TE si
gnal
for t
rack
ing ze
ro cr
oss i
nput
pin
Mod
e da
ta 0
out
cont
rolle
d by
mico
m
Mod
e da
ta 1
out
cont
rolle
d by
mico
m
Mod
e da
ta 2
out
cont
rolle
d by
mico
m
SLD
SPD
FOD
TRD
TZCA
MDO
UT0
MDO
UT1
MDO
UT2
FUNC
TION
PIN
NAM
EI/O O O O O I O O O
Reference Information
2-6 Samsung Electronics
2-1-4 DIC1 (KS1453 ; DVD Data Processor)
X'T
AL
&TI
MIN
G G
EN
RFC
K 1
7.58
/7.3
5KH
z
DV
D C
LV/C
AV
CD
CLV
/CAV
M
23B
IT S
R
26.1
6MH
z
32B
IT S
R16
-8 D
EM
OD
EC
SY
FRA
ME
SY
NC
DE
T/P
RO
T/IN
S
(17.
57K
Hz)
(
6, 4
, 3)
efm
wr I
D E
CC
WFC
K 1
7.58
/7.3
5KH
z
M
VC
O T
IMIN
GG
EN
ER
ATO
R
17.5
8KH
z =
26.1
6M/1
488
676.
08H
z
(208
, 192
, 17)
(182
, 172
, 11)
EC
C
VC
O T
IMIN
GG
EN
ER
ATO
R
7.35
KH
z =
4.32
18M
/588
75
Hz
(32,
28,
5)
(28,
24,
5)
CIR
C
FRA
ME
SY
NC
DE
T/P
RO
T/IN
S
(7.3
5KH
z)E
FM D
EM
OD
SU
BC
OD
E I/
FC
D-GV-
CD
, CD
-DA
SQ
-VC
D
DV
DP,
DE
INTE
RLE
AVE
&R
AM
CO
NTR
OL
(6, 4
, 3)
trans
ID E
CC
ED
C
DE
SC
RA
MB
LER
MIC
OM
I/F
MM
TO M
ICO
M (1
5)M
DAT
(7:0
), M
RZA
, ZC
S, M
WR
, M
RD
, ZIR
QZD
, ZW
AIT
, ZR
ST
TO D
RA
M25
6K*1
6(3
2)D
D(1
5:0)
DA
DR
(8:0
)ZR
AS
ZUC
AS
ZLC
AS
ZOE
(1:0
)ZW
E(1
:0)
TO A
V (1
3)S
DAT
A[0
] / C
DAT
AS
DAT
A[1
] / L
RC
KS
DAT
A[2
] / B
CLK
SD
ATA
[3] /
C2P
OS
DAT
A[4
] / S
QD
TS
DAT
A[5
] / W
FSY
SD
ATA
[6] /
SO
S1
SD
ATA
[7] /
SQ
CK
DAT
RE
QC
STR
OB
ED
TER
DAT
AC
KTO
S
TO (1
2)X
TI1
XTO
1C
K33
MI
CK
33M
O FGM
ON
MD
PM
DS
FSW
PLL
_LO
CK
CLV
_LO
CK
SE
RV
O_L
OC
K
FRO
M R
/F,
PLL
(3)
EFM
IP
LCK
BC
AR
Z
TO D
-EQ
(8)
PW
MO
(7:0
)
Mon
itor(
8) G
FS, F
RS
YZ,
TX
, EFM
O, W
FCK
, RFC
K, C
K 1
6M, D
EM
PH
A
P
ower
(34)
=VD
D(1
1)+G
ND
(23)
Te
st P
in(3
) TE
ST0
, TE
ST1
, TE
ST2
Reference Information
Samsung Electronics 2-7
DRAM
dat
a bu
s32
DD9_
BI
Digit
al GN
D (0V
)31
DVSS
DRAM
dat
a bu
s30
DD5_
BI
DRAM
dat
a bu
s29
DD10
_BI
DRAM
dat
a bu
s28
DD4_
BI
DRAM
dat
a bu
s27
DD11
_BI
Digit
al po
wer (
+5V)
26DV
DD
DRAM
dat
a bu
s25
DD3_
BI
DRAM
dat
a bu
s24
DD12
_BI
DRAM
dat
a bu
s23
DD2_
BI
DRAM
dat
a bu
s22
DD13
_BI
Digit
al GN
D (0V
)21
DVSS
DRAM
dat
a bu
s20
DD1_
BI
DRAM
dat
a bu
s19
DD14
_BI
DRAM
dat
a bu
s18
DD0_
BI
DRAM
dat
a bu
s17
DD15
_BI
Digit
al GN
D (0V
)16
DVSS
Syste
m clo
ck o
utpu
t for
26.1
6 M
Hz15
XTO_
OUT
Syste
m clo
ck in
put f
or 2
6.16
MHz
14XT
I_IN
Digit
al po
wer (
+5V)
13DV
DD
Mico
m da
ta b
us12
MDA
T0_B
I
Mico
m da
ta b
us11
MDA
T1_B
I
Mico
m da
ta b
us10
MDA
T2_B
I
Mico
m da
ta b
us9
MDA
T3_B
I
Mico
m da
ta b
us8
MDA
T4_B
I
Mico
m da
ta b
us7
MDA
T5_B
I
Mico
m da
ta b
us6
MDA
T6_B
I
Mico
m da
ta b
us5
MDA
T7_B
I
Digit
al GN
D (0V
)4
DVSS
Mico
m re
giste
r sele
ct (L
-> R
egist
er H
-> D
ata)
3M
RZA_
IN
Chip
selec
t (Ac
tive
Low)
2ZC
S_IN
Digit
al GN
D (0V
)1
DVSS
FUN
CTIO
NPI
NN
AM
E
DVD
data
/Sub
code
fram
e sin
k (W
FSY)
65SD
ATA5
_OUT
DVD
data
/Sub
code
seria
l dat
a (S
QDT)
64SD
ATA4
_OUT
DVD
data
/CD
data
erro
r flag
(C2P
0)63
SDAT
A3_O
UT
DVD
data
/CD
data
bit
clock
(BLC
K)62
SDAT
A2_O
UT
DVD
data
/CD
data
L/R
clock
(LRC
K)61
SDAT
A1_O
UT
DVD
data
/CD
data
bits
tream
out
put
60SD
ATA0
_OUT
Digit
al po
wer (
+5V)
59DV
DD
Data
ack
nowl
edge
sign
al ou
tput
58DA
TACK
_OUT
Top
of se
ctor
57TO
S_OU
T
Digit
al GN
D (0V
)56
DVSS
Digit
al GN
D (0V
)55
DVSS
DRAM
add
ress
bus
54DA
DR3_
OUT
DRAM
add
ress
bus
53DA
DR4_
OUT
DRAM
add
ress
bus
52DA
DR2_
OUT
DRAM
add
ress
bus
51DA
DR5_
OUT
DRAM
add
ress
bus
50DA
DR1_
OUT
DRAM
add
ress
bus
49DA
DR6_
OUT
DRAM
add
ress
bus
48DA
DR0_
OUT
Digit
al GN
D (0V
)47
DVSS
DRAM
add
ress
bus
46DA
DR7_
OUT
DRAM
add
ress
bus
45DA
DR8_
OUT
DRAM
row
addr
ess s
trobe
44ZR
AS_O
UT
DRAM
out
put e
nable
043
ZOEO
_OUT
Digit
al po
wer (
+5V)
42DV
DD
DRAM
out
put e
nable
1 (1
6M, -
------
-, 16
M)
41ZO
E1_O
UT
DRAM
writ
e en
able
0 (4M
, 8M
, 16M
)40
ZWE0
_OUT
DRAM
writ
e en
able
1 (8M
ONL
Y)39
ZWE1
_OUT
DRAM
upp
er co
lumn
addr
ess s
trobe
38ZU
CAS_
OUT
DRAM
row
colum
n ad
dres
s stro
be37
ZLCA
S_OU
T
Digit
al GN
D (0V
)36
DVSS
DRAM
dat
a bu
s35
DD7_
BI
DRAM
dat
a bu
s34
DD8_
BI
DRAM
dat
a bu
s33
DD6_
BI
FUN
CTIO
NPI
NN
AM
E
Digit
al GN
D (+5
V)97
DVSS
Syste
m clo
ck o
utpu
t for
33.8
688M
Hz96
CK33
MO_
OUT
Syste
m clo
ck in
put f
or 3
3.868
8MHz
95CK
33M
I_IN
Digit
al ou
t92
TX_O
UT
Good
fram
e sy
nc d
etec
tion
resu
lt ou
tput
(“H”
activ
e)93
GFS_
OUT
Frame
sync
out
91FR
SYZ_
OUT
Digit
al GN
D (0V
)90
DVSS
Digit
al GN
D (0V
)89
DVSS
Digit
al GN
D (0V
)88
DVSS
Digit
al GN
D (0V
)87
DVSS
Digit
al po
wer (
+5V)
86DV
DD
Digit
al po
wer (
+5V)
85DV
DD
Digit
al GN
D (0V
)84
DVSS
Digit
al GN
D (0V
)83
DVSS
Digit
al GN
D (0V
)82
DVSS
PWM
out
put s
ignal
81PW
M00
_OUT
PWM
out
put s
ignal
80PW
M01
_OUT
PWM
out
put s
ignal
79PW
M02
_OUT
PWM
out
put s
ignal
78PW
M03
_OUT
Digit
al po
wer (
+5V)
77DV
DD
PWM
out
put s
ignal
76PW
M04
_OUT
PWM
out
put s
ignal
75PW
M05
_OUT
PWM
out
put s
ignal
74PW
M06
_OUT
PWM
out
put s
ignal
73PW
M07
_OUT
Digit
al GN
D (0V
)72
DVSS
DVD
data
erro
r out
put
71DT
ER_O
UT
Data
requ
est f
rom
A/V
deco
der o
r ROM
dec
oder
70DA
TREQ
_IN
Data
stro
be (c
lock)
outp
ut69
CSTR
OBE_
OUT
Digit
al GN
D (0V
)68
DVSS
DVD
data
/Sub
code
seria
l cloc
k (SQ
CK)
67SD
ATA7
_BI
DVD
data
/Sub
code
bloc
k sink
(S0S
1)66
SDAT
A6_O
UT
FUN
CTIO
NPI
NN
AM
E
Mico
m wr
ite st
robe
(sch
midt
trigg
er)
128
MW
R_IN
Mico
m re
ad st
robe
(sch
midt
trigg
er)
127
MRD
_IN
Inter
rupt
requ
est f
rom
mico
m12
6ZIR
QZD_
OUT
Mico
m re
ad/w
rite
acce
ss w
ait (“
L” w
ait)
125
ZWAI
T_OU
T
Hard
ware
rese
t acti
ve lo
w12
4ZR
ST_I
N
Digit
al GN
D (0V
)12
3DV
SS
BCA
input
sign
al12
2BC
ARZ_
IN
Whe
n DE
EMPH
ASIS
is O
N, “H
IGH”
.12
1DE
MPH
A_OU
T
2∫–¡÷
clock
of C
K33M
/16.9
34M
Hz12
0CK
16M
_OUT
Digit
al po
wer (
+5V)
119
DVDD
Digit
al po
wer (
+5V)
118
DVDD
Spind
le mo
tor o
utpu
t filt
er co
nver
sion
outp
ut (3
-sta
te)
115
FSW
_OUT
Digit
al po
wer (
+5V)
117
DVDD
EFM
/EFM
+ sig
nal i
nput
116
EFM
I_IN
Refe
renc
e sig
nal f
or C
AV11
4FG
_IN
Spind
le mo
tor O
N/OF
F con
trol o
utpu
t11
3M
ON_O
UT
Spind
le mo
tor s
peed
cont
rol s
ignal
(3-sta
te)
110
MDS
_OUT
Spind
le mo
tor p
hase
cont
rol s
ignal
(3-sta
te)
109
MDP
_OUT
Digit
al GN
D (0V
)11
2DV
SS
Digit
al GN
D (0V
)11
1DV
SS
Lock
sign
al fo
r SER
VO10
8SE
RLOC
K_OU
T
Lock
sign
al fo
r CLV
107
CLVL
OCK_
OUT
Lock
sign
al fo
r PLL
106
PLLL
OCK_
OUT
Digit
al GN
D (0V
)10
5DV
SS
Phas
e loc
ked
clock
104
PLCK
_IN
Refe
renc
e fra
me p
ulse
103
RFCK
_OUT
Writ
e fra
me p
ulse
102
WFC
K_OU
T
EFM
out
101
EFM
O_OU
T
Test
mode
setti
ng p
ort
100
TEST
2_IN
Test
mode
setti
ng p
ort
99TE
ST1_
IN
Test
mode
setti
ng p
ort
98TE
ST0_
IN
FUN
CTIO
NPI
NN
AM
E
Digit
al GN
D (0V
)94
DVSS
Reference Information
2-8 Samsung Electronics
2-1-5 DIC2 (KM416C254BJ-6 ; CMOS DRAM)
NAME
A 0 - A 8
D Q 0 - 1 5
VSS
RAS
UCAS
L C A S
W
O E
V CC
N .C
BLOCK DIAGRAM
Control
ClocksVBB Generator
Lower
Data in
BufferDQ0
to
DQ7
OE
DQ8
to
DQ15
Lower
Data out
Buffer
Upper
Data in
Buffer
Upper
Data out
Buffer
Vcc
Vss
RAS
UCAS
LCAS
W
FUNCTION
Address Inputs
D a t a i n / O u t
Ground
Row Address Strobe
Upper Column Address Strobe
Lower Column Address Strobe
Read/Wr i te Input
Data Output Enab le
P o w e r ( + 5 V )
P o w e r ( + 3 . 3 V )
No Connection
Refresh Timer
Refresh Control
AO..
A8
Refresh Counter
Row Address Buffer
Col. Address Buffer
Row Decoder
Column Decoder
Memory Array
262,144 x 16
Cells
Reference Information
Samsung Electronics 2-9
2-1-6 VIC1 (ZiVA-3 ; Audio/Video Decoder)
MemoryController
OSDDecoder
VideoInterface
AudioIn ter face
SubpictureDecoder
MPEGVideo
Decoder
CD-DA andLPCM Decoder
Dolby DigitalAudio
Decoder
MPEGAudio
Decoder
HostInterface
Control Logic
Secure ViewCSS
Descrambling
Bus KeyAuthentication
(Optional)
SDRAM/EDO/ROM
Interface
HostInterface
DVD/CDInterface
BLOCK DIAGRAM
VideoMixer
ZiVA-3 Decoder
Stream
Program
DecoderAudio
DSPAudio
Interface
Digital
Scrambled, Compressed Content
Descrambled, Compressed Content
Decompressed Content
Display Content
LOGIC DIAGRAM
HADDR[2:0]
RD
H D A T A [ 7 : 0 ]
WAIT/DTACK
INT
HOST8SEL
Host
In ter face
Signals
Video
In ter face
Signals
DVD/CD
Inter face
Signals
Audio
In ter face
Signals
SDRAM/EDO
Inter face
Signals
Global
In ter face
Signals
D A - D A T A [ 0 : 3 ]
DA-LRCK
DA-BCK
DA-XCK
DA-IEC
EDO-CAS
EDO-RAS
LDQM
M D A T A [ 1 5 : 0 ]
MADDR[20 :0 ]
MWE
R O M - C S
SD-CLK
SD-CAS[1:0]
UDQM
SYSCLK
VDD
VSS
A_VSS
A_VDD
P10[10:0]
RESET
V D A T A [ 7 : 0 ]
VCLK
DVD-DATA0/CD-DATA
DVD-DATA1/CD-LRCK
DVD-DATA2/CD-BCK
DVD-DATA3/CD-C2PO
DVD-DATA4/CDG-SDATA
DVD-DATA5/CDG-VFSY
DVD-DATA6/CDG-SOS1
DVD-DATA7/CDG-SCLK
VREQUEST
VSTROBE
ERROR
V-DACK/ASTROBE
AREQUEST
A-DACK
DTACKSEL
CS
R/W
VSYNC
HSYNC
SD-CAS
SD-RAS
ZiVA Decoder
Reference Information
2-10 Samsung Electronics
2-1-7 VIC50 (SAA7128 ; Digital Video Encoder)
I2 C-
INTERFACE
SYNC/
CLOCK
MP
MP
9..16
44
20
21
I2 C-Control I2 C-Control I2 C-Control
I2 C-Control
I2 C-Control
Clock&Timing
RE
SN
40
42 41
35 34 7 8 43 37 4 25,28,31,36
SD
A
SC
L
XT
ALI
XT
AL
RC
V1
RC
V2
TT
XR
Q
XC
LK
LLC1
VD
DA
VDD I2C
SA
MP(7:0)
TTX
FADER ENCODEROUTPUT-
INTERFACE
D
A
RGB-
PROCESSOR
D
22,32,33
23
26
29
30
27
Y
C
Y
5,18,38
6,17,39 2 3
VS
S
VD
D
SP
AP
19R
TC
1
CbCr
Y
CbCr
24
R(Cr)
VSSA
G(Y)
B(Cb)
CVBS(CSYNC)
VBS(CVBS)
C(CVBS)
A
BLOCK DIAGRAM
NAME
r e s .
SP
A P
L L C 1
V SS1
V DD1
RCV1
RCV2
I / O
I
I
I
I
I
I / O
I / O
PIN
1
2
3
4
5
6
7
8
FUNCTION
Reserved pin, do not connect
Test Pin;connected to digital ground for normal operation
Test Pin;connected to digital ground for normal operation
Line-Locked Clock input;this is the 27 MHz master clock
Digital supply ground 1
Digital supply 1
Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal.
Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives an HS pulse.
Reference Information
Samsung Electronics 2-11
NAME
MP7
MP6
MP5
MP4
MP3
MP2
MP1
MP0
V DD2
V SS2
RTCI
VDD 1 2 C
S A
V SSA1
R (C r )
C
V DDA1
G ( Y )
VBS
V DDA2
B ( C b )
CVBS
V DDA3
V SSA2
V SSA3
X T A L
X T A L 1
I / O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
O
O
I
O
O
I
O
O
I
I
I
O
I
PIN
9
1 0
1 1
1 2
1 3
1 4
1 5
1 6
1 7
1 8
1 9
2 0
2 1
2 2
2 3
2 4
2 5
2 6
2 7
2 8
2 9
3 0
3 1
3 2
3 3
3 4
3 5
FUNCTION
Digital supply voltage 2
Digital ground 2
Real Time Control input. If the LLC1 clock is provided by an SAA7111 or SAA7151B, RTCI should be connected to the RTCO pin of the respective decoder to improve the signal quality.
Sense input for 12C bus voltage;connect to 12C bus supply
Select 12C address; low selects slave address 88h, high selects slave address 8Ch.
Analog ground 1 for Red (Cr), C(CVBS), Green(Y) outputs
Analog ground 3 for the DAC reference ladder and the oscillator
Crystal oscillator output
Crystal oscillator input; if the oscillator is not used, this pin should be connected to ground.
Analog output of Red (Cr)signal
Analog output of Chrominance (CVBS) signal
Analog supply voltage 1 for R(Cr), C(CVBS) outputs
Analog output of Green(Y) signal
Analog output of VBS (CVBS) signal
Analog supply voltage 2 for VBS(CVBS), Green(Y) outputs
Analog output of Blue(Cb) signal
Analog output of CVBS(CSYNC) signal
Analog supply voltage 3 for Blue(Cb)and CVBS(CSYNC), outputs
Analog ground 2 for VBS (CVBS), Blue(Cb), CVBS(CSYNC)outputs
Double speed 54 MHzMPEG port. It is an input for "CCIR 656" sty le mult ip lexed Cb, Y, Cr data. Data are sampled on the rising and falling clock edge;data sampled on the risting edge then are sent to the encoding part of the device, data sampled on the falling edge are sent to the RGB part of the device. (or vice verse, depending on programming)
V DDA4
XCLK
V SS3
V DD3
RESN
SCL
SDA
TTXRQ
T T X
I
O
I
I
I
I
I / O
O
I
3 6
3 7
3 8
3 9
4 0
4 1
4 2
4 3
4 4
Analog supply voltage 4 for the DAC reference ladder and the oscillator
Clock output of the crystal oscillator
Digital supply ground 3
Digital supply 3
12C serial clock input
12C serial data input/output
Teletext Request output, indicating when text bits are requested
Teletext bit stream input
Reset input, active LOW. After reset is applied, all digital I/Os are in input mode; PAL-Blackburst on CVBS, VBS and C;RGB outputs set to lowest voltage.The 12C-bus receiver waits for the START condition.
Reference Information
2-12 Samsung Electronics
2-1-8 MIC1 (TMP93CM41F ; Main Micom)
PAO~PA6 PA7(SCOUT)
P50 to P57(ANO to AN7)
AVCCAVSS
VREFHVREFL
(TXD0)P90(RXD0)P91
(SCLK0/CTS0)P92
(TXD1)P93(RXD1)P94
(SCLK1)P95
(PG 00)P60(PG 01)P61(PG 02)P62(PG 03)P63(PG 10)P64(PG 11)P65(PG 12)P66(PG 13)P67
(T10)P70
(T01)P71
(T02)P72
(T03)P73
(INT4/T14)P80(INT5/T15)P81
(T04)P82(T05)P83
(INT6/T16)P84(INT7/T17)P85
(T06)P86
(INTO)P87
VCC[3]VSS[3]
X1X2
CLK
XT1XT2AM8/16EARESETALETEST2,1
NMI
WDTOUT
P00 to P07(AD0 to AC7)
P10 to P17(AD8 to AD15/A8 toA15
P20 to P27(A0 to A7/A16 to A23)
P30(RD)P31(WR)P32(HWR)P33(WAIT)P34(BUSRQ)P35(BUSAK)P36(R/W)P37(RAS)
P40(CS0/CAS0)P41(CS1/CAS1)P42(CX2/CAS2)
PORT A
High
Frequency
OSC
Low
Frequency
OSC
INTERRUPT
CONTROLLER
WATCH-DOG
TIMER
PORT 0
PORT 2
PORT 3
CS/WAIT
CONTROLLER
(3-BLOCK)
PORT 1
10-BIT 8CH
A/D
CONVERTER
SERIAL I/O
(CH,0)
SERIAL I/O
(CH,1)
PATTERN
GENERATOR
(CH,0)
PATTERN
GENERATOR
(CH,1)
16BIT TIMER
(TIMER 4)
16BIT TIMER
(TIMER 5)
8BIT TIMER
(TIMER 0)
8BIT TIMER
(TIMER 1)
8BIT PWM
(TIMER 2)
8BIT PWM
(TIMER 3)
900L-CPU
2KB RAM
XWAXBCADEXHLXIXXIYXIZXSP
WBDH
IXIYIZSP
ACEL
32bit
FSR
P C
Reference Information
Samsung Electronics 2-13
6059585756555453525150494847464544434241403938373635343332
-31
XT1
P96
-XT
2P9
7
Test
pin. c
onne
ct to
TES
T2TE
ST1
TEST
1
Test
pin. c
onne
ct to
TES
T1TE
ST2
TEST
2
EEPR
OM C
LOCK
ECK
PA0
EEPR
OM D
ATA
I/OED
TPA
1
EEPR
OM W
RITE
PRO
TECT
EWC
PA2
-PA
3
-PA
4
-PA
5
-PA
6
-PA
7
Addr
ess l
atch
ena
bleAL
EAL
E
VCC
Vcc
Addr
ess/
Data
0HA
D0AD
0
Addr
ess/
Data
1HA
D1AD
1
Addr
ess/
Data
2HA
D2AD
2
Addr
ess/
Data
3HA
D3AD
3
Addr
ess/
Data
4HA
D4AD
4
Addr
ess/
Data
5HA
D5AD
5
Addr
ess/
Data
6HA
D6AD
6
Addr
ess/
Data
7HA
D7AD
7
Addr
ess 8
HA8
A8
Addr
ess 9
HA9
A9
Addr
ess 1
0HA
10A1
0
Addr
ess 1
1HA
11A1
1
Addr
ess 1
2HA
12A1
2
Addr
ess 1
3HA
13A1
3
Addr
ess 1
4HA
14A1
4
Addr
ess 1
5HA
15A1
5
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O O - - O I/O O O O O O O O - I/O I/O I/O I/O I/O I/O I/O I/O O O O O O O O O30292827262524232221201918171615141312111098765432
A/D
Ref i
nput
(L)
1GN
DVR
EFL
A/D
GND
input
AGND
AVss
A/D
VCC
input
AVCC
AVcc
Non-
mask
able
inter
rupt
-/N
MI
DSP
H/W
rese
tZR
STP7
0
Mas
ter c
lock s
elect
MCK
_SEL
P71
AV-D
EC H
/W re
set
ZIVA_
RST
P72
Open
/clos
e bli
nking
LED
P73
Inter
rupt
from
AV-
DEC
DVDI
NT/IN
T4
Inter
rupt
from
fron
t mico
mSR
QIN
T5
Open
switc
hOP
ENP8
2
Clos
e sw
itch
CLOS
EP8
3
Inter
rupt
from
spind
le mo
tor F
GFG
INT
/INT6
-IN
T7
Requ
est t
o fro
nt m
icom
RRQ
P86
Inter
rupt
from
DSP
ZINT
INTO
Seria
l dat
a ou
tput
RXD
TXDO
Seria
l dat
a inp
utTX
DRX
DO
Seria
l dat
a clo
ckSC
LKSC
LKO
RF co
ntro
l dat
aM
DTX
D1
RF d
ata
latch
STB
094
RF co
ntro
l cloc
kM
CSC
LK1
Addr
ess m
ode
(H: 8
bit
mode
)AM
8AM
8/16
Cloc
k out
put (
Syste
m clo
ck÷2
)CL
KCL
K
VCC
Vcc
GND
GND
Vss
High
freq
uenc
y OSC
inX1
X1
High
freq
uenc
y OSC
out
X2X2
Exte
rnal
acce
ss C
S41/
CS40
/EA
/EA
Mas
ter r
eset
from
FRON
T/M
RST
/RES
ET
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O I - - I O O O O I I I I I I O I O I I O I/O O I O - - I O I I
80 81797877767574737271706968676665646362
Wat
ch d
og ti
mer o
utpu
t61
WDT
OUT
/WDT
OUT
GND
VSS
VCC
Vcc
Addr
ess 1
6HA
16A1
6
Addr
ess 1
7 (A
V-DE
CODE
R)HA
17A1
7
Addr
ess 1
8 (D
ata
proc
esso
r)HA
18A1
8
Addr
ess 1
9HA
19A1
9
Addr
ess 2
0 (D
. SER
VO)
HA20
A20
Addr
ess 2
1HA
21A2
1
Addr
ess 2
2HA
22A2
2
Addr
ess 2
3HA
23A2
3
/Rea
d str
obe
/RD
/RD
/Writ
e str
obe
/WR
/WR
-P3
2
/Wait
/MW
AIT
/WAI
T
RCOD
EP3
4
-P3
5
-P3
6
-P3
7
Chip
selec
t 1
(SRA
M, 1
M B
it, 1
28KB
)/C
S1/C
S1
-P4
0/CS
0
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O - - O O O O O O O O O O I/O I I/O I/O O I/O -O
99989796959493
LOCK
mon
itor f
rom
DSP
92SL
OCK
P50
Mon
itor s
ignal
TILTO
P51
Spind
le dir
ectio
n fro
m SP
driv
erFR
P52
SENS
E mo
nitor
from
SER
VOSE
NSE
P53
Focu
s loc
k mon
itor f
rom
RFFO
KBP5
4
Track
ing lo
ck m
onito
r from
SER
VORF
RP1
P55
RF su
m sig
nal
RFO
P56
VREF
OP5
7
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O I I I I I I I
100
A/D
Ref i
nput
(H)
AVCC
VREF
HIO I/O O O O I/O O O O -
91908988878685848382Ch
ip sle
ct 2
(EPRO
M, 4
M B
it, 5
12KB
)/C
S2/C
S2
-P6
0
Tray i
n co
ntro
l out
put
TRAY
-INP6
1
Tray o
ut co
ntro
l out
put
TRAY
-OUT
P62
IIC cl
ock (
VIDE
O EN
CODE
R)SC
LP6
3
IIC cl
ock (
VIDE
O EN
CODE
R)SD
AP6
4
D.Se
rvo IC
dat
a/Ad
dres
s sele
ctDA
BP6
5
D.Se
rvo IC
chip
selec
tCS
BP6
6
D.Se
rvo IC
rese
tRS
TBP6
7
GND
Vss
Reference Information
2-14 Samsung Electronics
2-1-9 MIC8 (M27C801 ; 8MB (1M x 8-bit) CMOS EPROM)
NAME
A0-A19
CE
DQ0-DQ7
OE
Vcc
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
Vss
Vcc
A17
A14
A13
A8
A9
A11
OE/VPP
A10
CE
DQ7
DQ6
DQ4
DQ4
DQ3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
TOP VIEW
Output EnableChip Enable and
Prog LogicOutput Buffers
YGating
2,097,152-BitCell Matrix
YDecoder
A0-A19Address
Inputs
OE/VPP
.
.
.
.
.
.
.
XDecoder
Data OutputsDQ0-DQ7
CE
VccVss
BLOCK DIAGRAM
FUNCTION
Address Inputs
Chip Enable Input
Data Input/Outputs
Output Enable Input
Vcc Syply Voltage
Ground
A19
A18
Reference Information
Samsung Electronics 2-15
2-1-10 FIC2 (LC866232 ; Front Micom)
6059585756555453525150494847464544434241403938373635343332
FLT
GRID
CON
TROL
31GR
ID8
S0/T
0
FLT
GRID
CON
TROL
GRID
7S1
/T1
FLT
GRID
CON
TROL
GRID
6S2
/T2
FLT
GRID
CON
TROL
GRID
5S3
/T3
FLT
GRID
CON
TROL
GRID
4S4
/T4
FLT
GRID
CON
TROL
GRID
3S5
/T5
FLT
GRID
CON
TROL
GRID
2S6
/T6
FLT
GRID
CON
TROL
GRID
1S7
/T7
-S8
/T8
-S9
/T9
-S1
0/T1
0
FLT
SEGM
ENT
CONT
ROL
SEG2
1S1
1/T1
1
FLT
SEGM
ENT
CONT
ROL
SEG2
0S1
2/T1
2
FLT
SEGM
ENT
CONT
ROL
SEG1
9S1
3/T1
3
FLT
SEGM
ENT
CONT
ROL
SEG1
8S1
4/T1
4
FLT
SEGM
ENT
CONT
ROL
SEG1
7S1
5/T1
5
+5V
VDD
-28V
VP
FLT
SEGM
ENT
CONT
ROL
SEG1
6S1
6
FLT
SEGM
ENT
CONT
ROL
SEG1
5S1
7
FLT
SEGM
ENT
CONT
ROL
SEG1
4S1
8
FLT
SEGM
ENT
CONT
ROL
SEG1
3S1
9
FLT
SEGM
ENT
CONT
ROL
SEG1
2S2
0
FLT
SEGM
ENT
CONT
ROL
SEG1
1S2
1
FLT
SEGM
ENT
CONT
ROL
SEG1
0S2
2
FLT
SEGM
ENT
CONT
ROL
SEG9
S23
FLT
SEGM
ENT
CONT
ROL
SEG8
S24
FLT
SEGM
ENT
CONT
ROL
SEG7
S25
FLT
SEGM
ENT
CONT
ROL
SEG6
S26
FLT
SEGM
ENT
CONT
ROL
SEG5
S27
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O O O O O O O O O O O O O O O O - - O O O O O O O O O O O O30292827262524232221201918171615141312111098765432
Front
end
rese
t1
MRS
TP5
2
-PW
M1
D/A
Cont
rol
DFS
P20
D/A
Cont
rol
DEM
O0P2
1
D/A
Cont
rol
DEM
O1P2
2
D/A
Cont
rol
DARS
TP2
3
D/A
Cont
rol
DIF0
P24
D/A
Cont
rol
DIF1
P25
D/A
Cont
rol
DIF2
P26
D/A
Cont
rol
DARS
T1P2
7
-TE
ST1
Rese
t*R
ES
Low
frequ
ency
OSC
inGN
DXT
1
Low
frequ
ency
OSC
out
-XT
2
GND
VSS
High
freq
uenc
y OSC
in-
CF1
High
freq
uenc
y OSC
out
-CF
2
VDD
VDD
ECHO
volum
e A/
D inp
utEC
HO_V
RAN
0/P8
0
MIC
det
ect
MIC
_DET
AN1/
P81
-AN
2/P8
2
HARD
WAR
E M
ODE
SELE
CTM
ODE0
AN3/
P83
HARD
WAR
E M
ODE
SELE
CTM
ODE1
AN4/
P84
HARD
WAR
E M
ODE
SELE
CTM
ODE2
AN5/
P85
HARD
WAR
E M
ODE
SELE
CTM
ODE3
AN6/
P86
HARD
WAR
E M
ODE
SELE
CTM
ODE4
AN7/
P87
Requ
est t
o fro
nt m
icom
RRQ
P70/
INT0
-P7
1/IN
T1
-P7
2/IN
T2
REM
OCON
dat
a in
REM
OCON
P73/
INT3
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O - O O O O O O O O - I I I I I I I I I I I I I
80797877767574737271706968676665646362
FLT
SEGM
ENT
CONT
ROL
61SE
G4S2
8
FLT
SEGM
ENT
CONT
ROL
SEG3
S29
FLT
SEGM
ENT
CONT
ROL
SEG2
S30
FLT
SEGM
ENT
CONT
ROL
SEG1
S31
KEY
SCAN
KEY0
P00
KEY
SCAN
KEY1
P01
KEY
SCAN
KEY2
P02
GND
P03
-P0
4
-P0
5
-P0
6
Requ
est t
o M
AIN
Mico
mSR
QP0
7
SERI
AL D
ATA
OUT
TXD
P10/
S00
SERI
AL D
ATA
INRX
DP1
1/S1
0
SERI
AL C
LOCK
SCLK
P12/
SCK0
-P1
3/S0
1
-P1
4/S1
1
-P1
5/SC
K1
-P1
6/BU
Z
P17/
PWM
O
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O O O O I I I I O O O O O I O
1009998979695
SCAR
T CO
NTRO
L94
WID
EP4
3
SUB
WOO
PER
MUT
EAM
UTE3
P44
CENT
ER M
UTE
AMUT
E2P4
5
REAR
MUT
EAM
UTE1
P46
FRON
T M
UTE
AMUT
E0P4
7
STAN
DBY
LED
LED
P50
POW
ER O
N/OF
F CON
TROL
ON/O
FFP5
1
FUNC
TION
ASSI
GNED
NAM
EPO
RT
NAM
ENo
I/O O O O O O O O
93929190898887868584838281SH
UTTL
E DA
TAS1
P30
SHUT
TLE
DATA
S2P3
1
SHUT
TLE
DATA
S3P3
2
SHUT
TLE
DATA
S4P3
3
JOG
DATA
J1P3
4
JOG
DATA
J2P3
5
TV T
YPE
ATP3
6
TV T
YPE
ADP3
7
+5 V
VSS
GND
VDD
SCAR
T CO
NTRO
LRG
BCTL
P40
SCAR
T CO
NTRO
LSC
ON_B
P41
-P4
2
I I I I I I I I - - O O O
Reference Information
2-16 Samsung Electronics
MEMO
Samsung Electronics 3-1
3. Product Specifications
Power Requirements AC 120V, 60Hz
Power Consumption 18W
GENERALWeight 7.5lbs
Dimensions W 16.9 in X D 11.0 in X H 3.5 in
Operating Temperature Range +41°F ~ +95°F
Operating Humidity Range 10% to 75%
DVD Reading Speed : 11.45 ft/sec.
(Digital Versatile Disc) Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
CD : 5 inches Reading Speed : 3.9 to 4.6 ft/sec.
DISC(Compact Disc) Maximum Play Time : 74min.
CD : 31/2 inches Reading Speed : 3.9 to 4.6 ft/sec.
(Compact Disc) Maximum Play Time : 20min.
VCD : 5 inchesReading Speed : 3.9 to 4.6 ft/sec.
Maximum Play Time : 74min. (Video + Audio)
Component Video 1 channel : 1.0Vp-p (75ohm load)
Y : 1.0Vp-p (75ohm load)
Video OutputComponent Video Pr : 0.70Vp-p (75ohm load)
Pb : 0.70Vp-p (75ohm load)
S-VideoLuminance Signal : 1Vp-p (75ohm load)
Color Signal : 0.286Vp-p (75ohm load)
2 channel L, R
Output LevelAnalog : 2Vrms (1KHz)
Digital : 0.50Vp-p
Audio Output * Frequency Response48KHz Sampling : 4Hz to 22 KHz
96KHz Sampling : 4Hz to 44KHz
* S/N Ratio 110dB
* Dynamic Range 96dB
* Total Harmonic Distortion 0.003%
* : Nominal specification
Product Specification
3-2 Samsung Electronics
MEMO
Samsung Electronics 4-1
4. Operating InstructionsD
escr
iptio
n-Fr
ont P
anel
Fro
nt
Pan
el C
on
tro
ls
Fro
nt
Dis
pla
y
STA
ND
BY
LA
MP
• W
hen
the
unit
is f
irst
plug
ged
in,
the
indi
-ca
tor
light
s. W
hen
pow
er is
pre
ssed
on,
the
lam
p go
es o
ut.
PO
WE
R•
Use
to
turn
the
pow
er o
n an
d of
f.
DIS
PL
AY
(See
bel
ow)
• O
pera
tion
indi
cato
rs a
re d
ispl
ayed
her
e.
DIS
C T
RA
Y•
Pre
ss O
PE
N/C
LOS
E t
o op
en a
nd c
lose
the
disc
tra
y.
GR
EE
N L
AM
P
SK
IP/S
EA
RC
H
• U
se t
o sk
ip o
r se
arch
a s
cene
or
mus
ic.
OP
EN
/CL
OS
E•
Pre
ss t
o op
en a
nd c
lose
the
dis
c tr
ay.
PL
AY
/PA
US
E•
Beg
in o
r pa
use
disc
pla
y.
STO
P•
Sto
ps d
isc
play
.
OP
EN
/C
LO
SE
STA
ND
BY
OP
EN
/C
LO
SE
24b
it 9
6kH
z A
UD
IO D
/A C
ON
VE
RT
ER
DIG
ITA
L V
IDE
O
SPAT
IALI
ZER
N-2
-2
DV
D/V
IDE
O-C
D/C
D P
LA
YE
R
DV
D-7
09
PO
WE
R
SK
IP
DIS
C O
PE
RA
TIO
N R
OTA
RY
IND
ICA
TOR
OP
ER
AT
ION
IND
ICA
TOR
DIS
C T
YP
E IN
DIC
ATO
RT
RA
CK
IND
ICA
TOR
3D S
OU
ND
IND
ICA
TOR
AN
GL
E IN
DIC
ATO
RC
HA
PT
ER
IND
ICA
TOR
RE
PE
AT
IND
ICA
TOR
CH
AP
TE
R, T
ITL
E, T
RA
CK
& M
ES
SA
GE
IND
ICA
TOR
AL
LR
EP
EA
T IN
DIC
ATO
RA
-B R
EP
EA
T IN
DIC
ATO
RP
RO
GR
AM
PL
AY
IND
ICA
TOR
MP
EG
IND
ICA
TOR
DO
LB
YD
IGIT
AL
IND
ICA
TOR
LIN
EA
R P
CM
IND
ICA
TOR
DT
S IN
DIC
ATO
R
DIG
ITAL
AU
DIO
OU
TA
NA
LOG
AU
DIO
OU
T
RL
VID
EO
OU
TS
-VID
EO
OU
TC
OM
PO
NE
NT
VID
EO
OU
T
YP
b
Pr
Des
crip
tion-
Rear
Pan
el
DIG
ITA
LA
UD
IO O
UT
JAC
K•
Use
a c
oaxi
al d
igita
l cab
le t
o co
nnec
t to
an
A/V
Am
plifi
er t
hat
cont
ains
a D
olby
Dig
ital d
ecod
er o
r D
TS
dec
oder
.
AN
ALO
G A
UD
IO O
UT
JAC
KS
• C
onne
ct t
o th
e A
udio
inpu
t ja
cks
of y
our
tele
visi
on,
audi
o/vi
deo
rece
iver
, or
VC
R.
VID
EO
OU
TJA
CK
• U
se a
vid
eo c
able
to
conn
ect
this
jack
to
the
Vid
eo in
put
onyo
ur t
elev
isio
n.
S-V
IDE
O O
UT
JAC
K•
Use
the
S-V
ideo
cab
le t
o co
nnec
t th
is ja
ck t
o th
e S
-Vid
eo ja
ckon
you
r te
levi
sion
for
a h
ighe
r qu
ality
pic
ture
.
CO
MP
ON
EN
TV
IDE
O O
UT
JAC
KS
• U
se t
hese
jack
s if
you
have
a T
V w
ith c
ompo
nent
vid
eo in
jack
s. T
hese
jack
s pr
ovid
e P
r, P
b an
d Y
vide
o. A
long
with
S-
Vid
eo,
Com
pone
nt V
ideo
pro
vide
s th
e be
st p
ictu
re q
ualit
y.
Rea
r P
anel
Operating Instructions
4-2 Samsung Electronics
ATo
ur o
f the
Rem
ote
Cont
rol
DV
D F
un
ctio
n B
utt
on
s
DV
D P
OW
ER
Bu
tto
n
NU
MB
ER
Bu
tto
ns
OP
EN
/CL
OS
E B
utt
on
SE
TU
PB
utt
on
• B
rings
up
the
DV
D p
laye
r’s S
etup
men
u.
ZO
OM
Bu
tto
n
SE
AR
CH
Bu
tto
ns
• A
llow
s yo
u to
sea
rch
forw
ard/
back
war
dth
roug
h a
disc
.S
TOP
Bu
tto
n
ST
EP
Bu
tto
n•
Adv
ance
s pl
ayba
ck o
ne f
ram
e at
a t
ime.
RE
TU
RN
Bu
tto
n•
Ret
urns
to
a pr
evio
us m
enu.
TOP
ME
NU
Bu
tto
n•
Acc
esse
s a
mus
ic o
r vi
deo
disp
lay
dire
ctly
.
AU
DIO
Bu
tto
n•
Use
thi
s bu
tton
to a
cces
s va
rious
aud
iofu
nctio
ns o
n a
disc
.
RE
PE
AT
Bu
tto
n•
Allo
ws
you
to r
epea
t pl
ay a
titl
e, c
hapt
er,
trac
k, o
r di
sc.
TV
PO
WE
R B
utt
on
• U
se t
o se
t th
e re
mot
e to
con
trol
a c
ompa
ti-bl
e T
V.
VO
LU
ME
CO
N. B
utt
on
• To
con
trol
the
mas
ter
volu
me
of t
he p
laye
r.
3D S
OU
ND
Bu
tto
n
BO
OK
MA
RK
Bu
tto
n
PL
AY
/PA
US
E B
utt
on
• B
egin
/Pau
se d
isc
play
.
SK
IPB
utt
on
s•
Use
to
skip
the
titl
e, c
hapt
er,
or t
rack
.
CL
EA
R B
utt
on
• U
se t
o re
mov
e m
enus
or
stat
us d
ispl
ays
from
the
scr
een.
MO
DE
Bu
tto
n•
Allo
ws
you
to p
rogr
am a
spe
cific
ord
er.
DIS
PL
AY
Bu
tto
n•
Dis
play
s th
e cu
rren
t di
sc m
ode.
ME
NU
Bu
tto
n•
Brin
gs u
p th
e D
isc
men
u.
EN
TE
R/D
IRE
CT
ION
Bu
tto
n(U
P/D
OW
N o
r L
EF
T/R
IGH
T B
utt
on
)•
Thi
s bu
tton
func
tions
as
a to
ggle
sw
itch.
AN
GL
E B
utt
on
• U
se t
o ac
cess
var
ious
cam
era
angl
es o
n a
DV
D.
SU
BT
ITL
E B
utt
on
A-B
RE
PE
AT
Bu
tto
n•
Use
to
mar
k a
segm
ent
to r
epea
t be
twee
nA
and
B.
ATo
ur o
f the
Rem
ote
Cont
rol (
Cont
’d)
TV
Fu
nct
ion
Bu
tto
ns
TV
PO
WE
R B
utt
on
TV
/VID
EO
Sel
ecti
on
Bu
tto
n
CH
AN
NE
LU
P/D
OW
N B
utt
on
s
VO
LU
ME
UP
/DO
WN
Bu
tto
ns
NO
TE
Thi
s
icon
indi
cate
s an
inva
lid b
utto
n pr
ess.
If r
emo
te d
oes
n’t
op
erat
e p
rop
erly
:
1.O
pen
the
batte
ry c
over
on
the
back
of
the
rem
ote.
2.In
sert
tw
o A
Aba
tterie
s.M
ake
sure
tha
t th
e po
lari-
ties
(+ a
nd -
) ar
e al
igne
dco
rrec
tly.
3.R
epla
ce t
he b
atte
ry c
over
.
• C
heck
the
pol
arity
+ -
of
the
batte
ries
(Dry
-Cel
l)
• C
heck
if t
he b
atte
ries
are
drai
ned.
• C
heck
if r
emot
e se
nsor
isbl
ocke
d by
obs
tacl
es.
• C
heck
if t
here
is a
ny f
luor
es-
cent
ligh
ting
near
by.
Inst
all B
atte
ries
in t
he
Rem
ote
Operating Instructions
Samsung Electronics 4-3
Choo
sing
a C
onne
ctio
nT
he f
ollo
win
g sh
ow e
xam
ples
of
conn
ectio
ns c
omm
only
use
d to
con
nect
the
DV
D p
laye
r w
ith a
TV
and
oth
erco
mpo
nent
s.
Bef
ore
Co
nn
ecti
ng
th
e D
VD
Pla
yer
Co
nn
ecti
ng
to
a T
V (
Fo
r V
ideo
)
MIX
ED
AU
DIO
OU
T
RL
RL
CO
MP
ON
EN
T V
IDE
O O
UT
Y
Y
Pb
Pb
Pr
Pr
VID
EO
OU
TS
-VID
EO
OU
T
TV
DV
DP
LA
YE
RCo
nn
ecti
ng
to
a T
V
• M
eth
od
1
DV
D P
laye
r +
TV
with
Vid
eo I
nput
Jac
k
• M
eth
od
2
DV
D P
laye
r +
TV
with
S-V
ideo
Inp
ut J
ack
• M
eth
od
3
DV
D P
laye
r +
TV
with
Com
pone
nt V
ideo
Jac
ks
• A
lway
s tu
rn o
ff th
e D
VD
pla
yer,
TV,
and
oth
erco
mpo
nent
s be
fore
you
con
nect
or
disc
onne
ct a
nyca
bles
.
• R
efer
to
owne
r’s m
anua
l of
the
com
pone
nts
you
are
conn
ectin
g fo
r m
ore
info
rmat
ion
on t
hose
par
-tic
ular
com
pone
nts.
TV
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Operating Instructions
4-4 Samsung Electronics
MEMO
Samsung Electronics 5-1
5. Disassembly and Reassembly
5-1 Cabinet and PCB
5-1-1 Door-Tray Removal
1) Supply power and open Tray Œ. 2) Disassemble the Door-Tray ´ in direction of arrow ÒAÓ.3) Close Tray Œ and power off.
Note : If Tray Œ doesnÕt open, insert a Screw driver ¨ into the Emergency hole ˇ(as shown in detailed draw-ing) and then turn it in the direction of arrow ÒBÓ. Open Tray manually.
ˇ EMERGENCY HOLE
<Bottom View>
Œ TRAY
´ DOOR-TRAY
"A"
"B"
¨ SCREW DRIVER
Fig. 5-1 Door-Tray Removal
5-2 Samsung Electronics
Disassembly/Reaasembly
5-1-2 Top Cabinet Removal
1) Remove 3 Screws Œ on the back Top Cabinet.2) Remove 2 Screws ´, ˇ on the left and right side.3) Lift up the Top Cabinet in direction of arrow.
Œ 3 SCREWS
´ 1 SCREW
ˇ 1 SCREW
Fig. 5-2 Top Cabinet Removal
Disassembly/Reaasembly
Samsung Electronics 5-3
Œ 2 SCREWS
ˇ 2 SCREWS
ˆ 3 SCREWS
´ ASS'Y FRONT-PANEL
¨ POWER PCB
Ø PLAY PCB
Fig. 5-3 Ass’y Front-Panel, Power PCB, Play PCB Removal
5-1-3 Ass’y Front-Panel, Power PCB, Play PCB Removal
1) Remove 2 Screws Œ and AssÕy Front Panel ´.2) Remove 2 Screws ˇ and Power PCB ¨.3) Remove 3 Screws ˆ and Play PCB Ø.
5-4 Samsung Electronics
Disassembly/Reaasembly
Œ 4 SCREWS
ˇ JACK PCB
ˆ MAIN PCB
´ 1 SCREW
¨ 3 SCREWS
Fig. 5-4 Main PCB, Jack PCB Removal
5-1-4 Main PCB, Jack PCB Removal
1) Remove 4 Screws Œ and 1 Screw ´.2) Lift up the Jack PCB ˇ.3) Remove 3 Screws ¨ and lift up the Main PCB ˆ.
Disassembly/Reaasembly
Samsung Electronics 5-5
Œ 4 SCREWS
5-1-5 Ass’y Deck Removal
1) Remove 4 Screws Œ from the AssÕy Deck and lift it up.
Fig. 5-5 Ass’y Deck Removal
5-6 Samsung Electronics
Disassembly/Reaasembly
JACK PCB
MAIN PCBPOWER PCB
PLAY PCB
5-2 PCB Location
Fig. 5-6 PCB Location
Disassembly/Reaasembly
Samsung Electronics 5-7
NO. CONNECTOR NO. DIRECTION CONNECTOR NO.
Œ KCN2 POWER PCB JACK PCB CN18
´ CN18 JACK PCB POWER PCB KCN2
ˇ CON22 PLAY PCB JACK PCB CN16
¨ CN16 JACK PCB PLAY PCB CON22
ˆ CN12 JACK PCB MAIN PCB CN7
Ø CN7 MAIN PCB JACK PCB CN12
∏ CN11 JACK PCB MAIN PCB CN8
” CN8 MAIN PCB JACK PCB CN11
’ CN5 DECK PCB MAIN PCB CN6
˝ CN6 MAIN PCB DECK PCB CN5
CT1
CT1
CT2
CT2
CT3
CT3
CT4
CT4
CT5
CT5
Œ
´
ˆ
¨
∏
ˇ
Ø
”’
˝
POWER PCB
JACK PCB
PLAY PCB
MAIN PCB
CT1
CT3
CT2
CT4
CT5
5-3 Connector Diagram
Fig. 5-7 Connector Diagram
5-8 Samsung Electronics
Disassembly/Reaasembly
5-4 Deck
5-4-1 Tray Removal
1) Remove 2 Screws Œ and lift up the Cover Sheet ´, AssÕy-Deck Clamper ˇ.2) Insert a Screw driver ˆ into Emergency hole ¨ and push it in the direction of arrow ÒAÓ.
When the Tray Ø comes out a little, pull it in the direction of arrow ÒBÓ by hand.3) Pull the Tray Ø to disassemble, while simultaneously pushing the Hook ∏, ” in direction of arrow ÒAÓ, ÒBÓ.
Fig. 5-8 Tray Removal
ˇ ASS'Y - DECK CLAMPER
"C"
"B"
Ø TRAY
∏ HOOK
Œ 2 SCREWS
´ COVER SHEET
"D"” HOOK
¨ EMERGENCY HOLE
<Bottom View>
"A"
ˆ SCREW DRIVER
Disassembly/Reaasembly
Samsung Electronics 5-9
5-4-2 Ass’y-Deck Sub Removal
1) Remove 2 Screws Œ and disassemble the AssÕy-PCB deck ´.2) Disassemble the AssÕy-Deck Sub ¨ in direction of arrow ÒBÓ, while simultaneously pushing the Hook ˇ in
direction of arrow ÒAÓ.
Fig. 5-9 Ass’y-Deck Sub Removal
¨ ASS'Y - DECK SUB
"B"
"A"
ˇ HOOK
´ ASS'Y - PCB DECK
Œ 2 SCREWS
5-10 Samsung Electronics
Disassembly/Reaasembly
5-4-3 Chassis-Main Parts Removal
1) Lift up the Gear-Tray Œ, remove 1 Screw ´ and lift up the Gear-Cam Center ˇ.2) Lift up the Belt-Pulley ¨, remove 1 Screw ˆ and lift up the Pulley-Gear Ø.3) Remove 1 Screw ∏ and lift up the Gear-Tray A ” and Gear-Cam Sub ’.4) Remove 2 Screws ˝ and disassemble the AssÕy-Motor Load Ô.5) Remove 1 Screw and disassemble the Lever-Open S/W Ò.6) Lift up the Shaft-Syncro Ú and remove the 2 Gear-Syncro Æ in both directions.
Fig. 5-10 Chassis-Main Parts Removal
¨ BELT - PULLEY
ˆ 1 SCREW
” GEAR - TRAY A∏ 1 SCREW
Ø PULLEY - GEAR
˝ 2 SCREWS
´ 1 SCREWˇ GEAR - CAM CENTER
ˇ GEAR - CAM CENTER
Ô ASS'Y - MOTOR LOAD
Ú SHAFT - SYNCRO
Æ GEAR - SYNCRO
Æ GEAR - SYNCRO
Ò LEVER - OPEN S/W
Œ GEAR - TRAY ’ GEAR - CAM SUB
’ GEAR - CAM SUB
1 SCREW
TIMINGALIGN TWO ARROWS
Disassembly/Reaasembly
Samsung Electronics 5-11
5-4-4 Ass’y-Brkt Deck Removal
1) Remove 4 Screws Œ.2) Lift up the AssÕy-Brkt Deck ´.
Fig. 5-11 Ass’y-Brkt Deck Removal
Œ 4 SCREWS
´ ASS'Y - BRKT DECK
5-12 Samsung Electronics
Disassembly/Reaasembly
5-4-5 Ass’y-Deck Parts Removal
1) Remove 3 Screws Œ and disassemble 3 Holder-Cams ´. 2) Disassemble the Rack-Slide ˆ and AssÕy-Pickup Ø, 2 Screws ¨ while simultaneously removing the
Shaft-P/U ˇ.3) Remove 3 Screws ∏ and disassemble the AssÕy-Motor Spindle ”. 4) Remove the Washer-Plain ’ and disassemble the AssÕy-Gear Feed AU/AL ˝.5) Remove the Washer-Plain Ô and disassemble the Gear-Feed B .6) Remove the Washer-Plain Ò and disassemble the AssÕy-Gear Feed CU/CL Ú.
Fig. 5-12 Ass’y- Deck Parts Removal
Œ 2 SCREWS
” ASS'Y - MOTOR SPINDLE
∏ 3 SCREWS
´ HOLDER - CAM
ˇ SHAFT - P/U
ˇ SHAFT - P/U
Ø ASS'Y - PICK UP
ˆ RACK - SLIDE
¨ 2 SCREWS
˝ ASS'Y - GEAR FEED AU/AL
’ WASHER - PLAIN
GEAR - FEED B
Ô WASHER - PLAIN
Ú ASS'Y GEAR - FEED CU/CL
Ò WASHER - PLAIN
Samsung Electronics 6-1
6. Circuit Descriptions
6-1 S.M.P.S.
6-1-1 Comparsion between Linear Power Supply and S.M.P.S.
6-1-1 (a) Linear
VregVout
+
–+
+
–Vs
(Ns)Vp
(Np)
REGULATOR
Common power(Ex.120/220V 50/60Hz)
Fig. 6-1 Linear Power Supply
3 Waveform/Description
Vs
t0
Fig. 6-2
Vs
t0
Fig. 6-3
Vout
t0
Fig. 6-4
Input : Common power to transformer (Vp).
The output Vs of transformer is determined by the ratioof 1st Np and 2nd Ns.Vs = (Ns/Np) x Vp
Vout is output (DC) by diode and condensor.
Circuit Descriptions
6-2 Samsung Electronics
3 Advantages and disadvantages of linear power supply
1) Advantages : Little noise because the output waveform of transformer is sine wave.
2) Disadvantages :Œ Additional margin is required because Vs is chan-
ged (depending on power source). (The regulator loss is caused by margin design).
´ Greater core size and condensor capacity are ne-eded, because the transformer works on a single power frequency.
6-1-1 (b) S.M.P.S. (Pulse width modulation method)
v
Vreg
Vout
0 t
Change by common power
Regulator loss
Fig. 6-5
3 Terms
1) 1st : Common power input to 1st winding. 2) 2nd : Circuit followings output winding of transformer.3) f (Frequency) : Switching frequency (T : Switching cycle)4) Duty : (Ton/T) x 100
Transformer Vout
(Np)
(Vp)
Switch
Vs switch
I switch
Vin
ON/OFF Control
+
–
+
–
++
+
–
(Vs)
(Ns)REGULATOR
Fig. 6-6
Circuit Descriptions
Samsung Electronics 6-3
6-1-2 Circuit description (FLY-Back PWM (Plise Width Modulation) Control)
6-1-2 (a) AC Power Rectification/Smoothing Terminal
1) PD01,PD02,PD03,PD04 : Convert AC power to DC(Wave rectification)2) PE3 : Smooth the voltage converted to DC(Refer to VIN of Fig. 6-7) 3) PC01, PC02, PC10, PC11, PC12, PC13, PL01, PL02, PL03 : Noise removal at power input/output4) PVA1 : SMPS protection at power surge input (PVA1 pattern open is to remove noise)5) PR10 : Rush current limit resistance at the moment of power cord insertion.
Œ Rush current = (AC input voltage x 1.414 - Diode drop voltage) / Pattern resistance + PL02,01 resis-tance + PC10 resistance + PR10) (AC230V based : approx. 26A)
´ Without PR10, the bridge diode might be damaged as the rush current increases.
6-1-2 (b) SNUBBER Circuit : PR15, PR16, PC04, PC05, PD11, PR17
0
Vswitch
dt
Toff
t
Inverted power by leakage inductance
Fig. 6-7
1) Prevent residual high voltage at the terminals of switch during switch off/Suppress noise.High inverted power occurs at switch (PIC1) off, because of the 1st winding of transformer : (V= LI xdi/dt. LI : Leakage Induction)A very high residual voltage exists on both terminals of PIC1 because dt is a very short.
2) SNUBBER circuit protects PIC1 from damage through leakage voltage suppression by RC, (Charges the leakage voltage to PD11 and PC04, and discharges to PR15 and PR16).
3) PC05, PR17 : For noise removal
6-1-2 (c) PIC1 Vcc circuit
1) PR11, PR12, PR13, PR14 : PIC1 driving resistance (PIC1 works through driving resistance at power cord in)2) PIC1 Vcc : PR18, PD12, PE6
Œ Use the output of transformer as Vcc, because the current starts to flow into transformer while PIC1 is active.´ Rectify to PD12 and smooth to PE6.ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving.
(Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.)
Circuit Descriptions
6-4 Samsung Electronics
1) F/B terminal of PIC1 determines output duty cycle.2) C-E(Collector-Emitter) of PIC2 and F/B potential of PIC1 are same.
3 Operation descriptions
1) Internal OP-Amp Ô+Õ base potential of PIC3 is 2.5V and external Ò-Ó input potential is connected with PR38 and PR39 to maintain Vout of 5.8V. (Vout = ((PR36 x PR39) / PR39) x 2.5V)
2) If load of 5.8 V terminal increases(or AC input voltage decreases) and Vout decreases below 5.8V, then :PIC3 ÔPÕ potential down below 2.5V --> PIC3 A-K of base current down --> PIC3 of A-K current down -->PIC2 Diode current down --> PIC2 C-E current down --> PIC2 C-E voltage up --> PIC1 F/B voltage up --> Out Duty up --> Transformer 1st current up --> Transformer 1st power up --> Vout up --> Maintain Vout 5.8V
3) If load of 5.8 V terminal decreases(or AC input voltage rises) and Vout rises above 5.8V, then :Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedbackto maintains 5.8V).Œ PR35, PR36 : Reduce 5.8V overshoot´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction) ˇ PC09 : Adjust feedback response rate
6-1-2 (d) Feedback Control Circuit
PIC1STR-G6153T
OCP
DRAIN
F/B
PC09PIC2
C
E
1st GND
A
K
PIC3
A
2.5V
K
P
PR36PR37 PC44
2nd GND
PR38
PR39
PR35
PC34
5.8VPL34PD33
PE33
Trans
GND
%
! @
#
$
VCC
Fig. 6-8
Circuit Descriptions
Samsung Electronics 6-5
6-1-3 Internal Block Diagram
6-1-3 (a) Internal Block Diagram of S.M.P.S. Circuit
SmoothingCircuit
Rectified Circuit
Line Filter
Power IN(85~265V)
NoiseRemoval
(SNUBBER)
PWM ControlCircuit
(1L0380)
Converter
VoltageDetection
Circuit
FLT DrivingCircuit
3.3V RectifiedSmoothing Circuit
5V RectifiedSmoothing Circuit
8V RectifiedSmoothing Circuit
-8V RectifiedSmoothing Circuit
3.3V RectifiedVoltageCircuit
5V RectifiedVoltageCircuit (x2)
Motor 8V1 Port
8V RectifiedVoltageCircuit
-8V RectifiedVoltageCircuit
OUTPUT
Fig. 6-9
6-1-3 (b) PIC1 (STR-G6153T) Internal Block Diagram
VoltageRef.UVLO
V c c
Drain
SourceGND
Sense
SQ
R
SQ
R
OSC.
Vck
32V
Feedback
LEB
Reset7.5V
5v
Reset
ThermalProtection
OVP
2uA
6.3V Sync.
2.5R
Voffset
Rsense
R
+_
+_
1mA
Control IC
SenseFET
5
O C P
2
41
3
Fig. 6-10
Circuit Descriptions
6-6 Samsung Electronics
6-2 RF
6-2-1 RIC1 (KS1461)
KS1461 is combined with KS1452 and KS1453 as bipolar IC developed for DVD SERVO system.Main features include DVD waveform equalizing, CD waveform equalizing, focus error signal generation, 3-beamtracking error signal generation, DPD 1-beam tracking error, defect, envelope, MIRR output, etc. after receiving thepick-up output converted into I/V.
6-2-1 (a) Basic Potentiometer
KS1461 uses a single power method and each circuit is based on V of 2.5V.V (Pin 12, 20, 24, 67) terminal is needed for IC, which uses the peripheral V.
6-2-1(b) RF signal
Fig. 6-11 shows the flow of signal generated by the pick-up.A, B, C, D signals detected from pick-up are converted in to RF signal(A+B+C+D) via RF summing AMP.
Fig. 6-12 shows the waveform-equalizing block diagram for the RF signal.It outputs to EQout (Pin 86) terminal by initially changing switching AMP gain of DVD and CD, and then adjust-ing the level in RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWMsignal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency. EQout terminal is connected with EQin (Pin 86).
PICK-UP RE SUM & AGC
RF EG
DPDTE
Mhx
ENV
FOK
DEFECT
TESEL
TE
ABCDSUM
FE
ALPC
MIRR%
^
&
*
5
6
7
8
34
104
104
104
104
? . m474
104
RFAGCO EQIN MIRRI
G
,
y
I
i
T
F
P[
d
MIRR
TE
RFEQO
A
BC
DEFLDPD
wE
ABCD
FEDFCT1DFCT2FOKBENV
103
ABCDI
Fig. 6-11
Circuit Descriptions
Samsung Electronics 6-7
REAGCO RFEQOEQIN
474
RF EQ
PWM
1EQ
G
EQF
PLLG
F
VZOC
TL
PWM
2
VREF
EQ
RFDV
CC
? . ,
‡ ° · ‚Fig. 6-12
The control parameters of DVD EQ and CD EQ are as follows.
1) DVD CD EQ control parameterŒ EQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal,
output from KS1453, into DC via low-pass filter. ´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output
from KS1453, into DVD via low-pass filter.
Circuit Descriptions
6-8 Samsung Electronics
6-3 System Control
6-3-1 Outline
The main micom peripheral circuit is composed of 16bit Micom (MIC1 ; TMP93CM41F), 8M EPROM (MIC8 ; AM27-C080) for Microcode and data save, 512 byte EE-PROM (MIC5 ; KS24C020) for permanent storage of data needed atpower off, MIC4 (74AC573) to latch only address in the bus where address and data are mixed, address decoder(MIC7 ; 74HC00) for selection of ex-ternal device chip and 20MHz clock oscillator for micom operation. The Micom(MIC1 ; TMP93CM41F) mounted in main board analizes the key commands of front panel or instructions of remotecontrol through communication with Micom (FIC1 ; LC86P6232) of front and controls the devices on board to exe-cute the corresponding commands after initializing the devices connected with micom on board at power on.
6-3-2 Block Diagram
RIC1RF AMPKS1461
SIC1DIGITAL SERVO
KS1452
VIC1A/V DECODER
ZIVA-3
VIC50VIDEO ENCODERSAA7128/7120
AIC1,2,3,4D/A CONVERTER
AK4324
DIC1DATA PROCESSOR
KS1453
MIC2ADDR LATCH
74AC573
MIC1MAIN MICOMTMP93CM41F
MIC8EPROM
AT27C080
MIC5EEPROM
KS24C020MICOMBLOCK HIGH ADDRESS LOW ADDRESS
DATA BUS
FIC1FRONT MICOM
LC86P6232
MIC7ADDR DECODER
74HC00
Fig. 6-13
Circuit Descriptions
Samsung Electronics 6-9
6-3-3 Waveform Description
When micom accesses each device sharing bus, it falls the chip select signal of corresponding chip to (CS2:MIC8-22,/DSPCS:DIC1-2, /DVDCS:VIC1-206/SRVCS:SIC1-10) 0 (Low) before trial. So to speak, the bus is used by time-division as shown in Fig 6-14, 6-15, 6-16. Two and more devices can't be accessed simultaneously.
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVDCS
/SRVCS
/RD
/WR
Fig. 6-14
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVDCS
/SRVCS
/RD
/WR
Fig. 6-15
Circuit Descriptions
6-10 Samsung Electronics
• CH1 : CS2 (MIC8-22, EPROM CHIP SELECT)• CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT)• CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT)• CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT)• CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL)• CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL)
/CS2
/DSPCS
/DVDCS
/SRVCS
/RD
/WR
Fig. 6-16
Circuit Descriptions
Samsung Electronics 6-11
6-4 Servo
6-4-1 Outline
SERVO system of DVD is divided into Focusing SERVO, Tracking SERVO, SLED Linked SERVO and CLV SERVO (DISC Motor Control SERVO).
1) Focusing SERVOFocuses the optical spot output from object lens onto the disc surface. Maintains a uniform distance betweenobject lens of Pick-up and disc (for surface vibration of disc).
2) Tracking SERVOMake the object lens follow the disc track in use of tracking error signal (created from Pick-up).
3) SLED Linked SERVO When the tracking actuator inclines outwardly as the object lens follows the track during play, the SLED motor moves slightly (and counteracts the incline).
4) CLV SERVO (DISC Motor Control SERVO)Controls the disc motor to maintain a constant linear velocity (necessary for RF signal).
6-4-2 Block Diagram
Fig. 6-17
DISCSLED M/T
HALLPCB
LD PDSPINDLE M/T
CN1HA1+HA1–HA2–HA2+SLED+SLED–
AODOCOBOFOEOPDLDF–T+T–F+
SPINDLE
FOCUSING
TRACKING
SIC8NJM2903 RIC1
KS1461
MIC1TMP 93CS41F
SIC1KS1452
DRIC2KA3010D
DRIC1KA3011D
+
›
!x
“
0
&
t
1287
!@
#@%^
Circuit Descriptions
6-12 Samsung Electronics
6-4-3 Operation
1) FOCUSING SERVO
(1) FOCUS INPUT
The focus loop is changed from open loop to closed loop, and the triangular waveform moves the object lens up and down (at pin 75 of SIC1 during Focus SERVO ON.) At that time, S curve is input to pin 65 of SIC1.
ABAD (pin 39 of RIC1) signal, summing signal of PD A, B, C, D, is generated, and zero cross(2.5V) point occurswhen S curve is focused and ABAD signal exceeds a preset,constant value. The focus loop is changed toclosed loop, and the object lens follows the disc movement, maintaining a constant distance from the disc. (these operations are same in CD and DVD).
Fig. 6-18
Vref
Vref
1.5V
Pin75 of SIC1 (FOD)
Pin65 of SIC1 (FEI)
Pin39 of RIC1 (ABCD)
(2) PLAY
When focus loop closes the loop during focus servo on, both pin 65 and pin 75 of SIC1 are controlled by VREF voltage (approx. 2.5V), and pin 1, 2 of DRIC2 are approximately 4.5V.
2) TRACKING SERVO
(1) NORMAL PLAY MODE
Œ For DVDComposite : The signal output from PD A, B, C, D of Pick-up, the tracking error signal (pin36 of RIC1) uses thephase difference of A+C and B+D in RIC1, and inputs to terminal 64 of SIC1. Then, it is output to SIC1 pin 76 via digital equalizer, and applied to the tracking actuator through DRIC2.
Pins 17, 18 of SIC1 are controlled by VREF(approx. 2.5V) during normal play.Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speedfrom disc is faster than data output speed on screen).
´ For CD, VCDReceive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD.
Circuit Descriptions
Samsung Electronics 6-13
(2) SEARCH Mode :
Search mode : Fine seek,(Moving the tracking actuator slightly little below 255 track) and coarse search, movingmuch in use of sled motor. The coarse search will be described in sled linked servo and now, the fine seek is explained shortly.If the object lens is located near target, cut off the tracking loop and give the control signal as many as desired count to move the tracking actuator via SIC1 pin 76 terminal(TRD).
3) SLED LINKED SERVO
¥ Normal play modeMove SLED motor slightly by means of PWM signal in SIC1 pin 73, as the tracking actuator moves along with track during play. Control to move the entire Pick-up as the tracking actuator moves.
¥ Coarse serach modeIn case of long-distance search (such as chapter serach), SIC1 uses sled FG (SIC8 pin 1, 7, which is generated) byrotation of sled motor via hall PCB. Then, read ID and compute the existing track count after input of next track. If the existing track count is within fine seek range, tracking begins using fine seek.
4) CLV SERVO(DISC MOTOR CONTROL SERVO)
Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to SIC1 pin 55 for constant linear velocity.
Circuit Descriptions
6-14 Samsung Electronics
6-5 DVD Data Processor
6-5-1 Outline
DIC1(KS1453) performs Sync detection, EFM/EFM demodulation and error correction and Spindle motor control(CLV control) after inputting sliced EFM signal of RF signal at disc playback and EFM read clock (PLCK) signal gen-erated from PLL. Outputs data which converted to the last audio and video from A/V decoder(VIC1). KS1453 usesexternal memory(4M DRAM) as buffer as well as for error correction and carries out Variable Bit Rate transfer func-tion. VBR function uses the external buffer as buffer to absorb the difference of transfer rate occurring because thetransfer rate of disc playback is faster than data transfer rate demanded by A/V decoder(Video/Audio SignalProcess Chip).In case of general disc refresh, the memory is almost filled up periodically. It is because Write rate to memory afterdisc playback and signal process is faster than Read of A/V decoder. When the memory is filled, this status is report-ed by interrupt to main micom, which controls the servo to kick back the pick-up to the previous track after mem-orizing the last data read from disc until now. It takes some times to jump to the previous track and return to theoriginal(jump location) again. The memory will have an empty space because A/V decoder reads out data of mem-ory.When the memory has an empty space, where data can be processed and written and the pick-up correctly gets tothe original location(before kick back location) again, it reads data again avoids the interrupt of data read previ-ously. The basic operation repeats to perform as described above.
6-5-2 Block Diagram
Fig. 6-19
AD[7..0]HA[23..8]*WR(73)
INTO(ZIRQZD)INT4(/INT)*RD(72)
MIC1 TMP93CM41F
HDATA[7..0]HADDR[3..0]
/CS/RD/WR/INT
DVD-D[7..0]VSTROBEREQUESTDACK*ERR
VIC1(ZiVA-3)192
191196200
177, 178
CLOCK 27MHzCLOCK 33.8688MHzCLOCK 27MHz
1495
6970587157
SDATA[7..0]CSTROBE
DATREQDATACK
DTERTOS
OE
WE
CAS
RAS[
[D15..0 [
[A8..0
[
[
DD15..0
[
[
DADR8..0
ZRAS
ZCAS
ZWEO
ZOEO
MDAT[7:0]MRZA(3)ZCS(2)
MWR(128)MRD(127)
ZIRQZD(126)
EFMIPLCK
116104
109110
MDPMDS
EFMPLCK
DIC1(KS1453)
DIC2(KM416C254)
Circuit Descriptions
Samsung Electronics 6-15
6-5-3 Waveform Description
It measures the timing that data processed in DIC1 at DVD playback.
STROBE
REQ
DACK
SDATA all2 2 0 1 0
Fig. 6-20
• CH1 : STROBE (DIC1-69, CLOCK)• CH2 : REQ (DIC1-70, DATA REQUEST)• CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE)• CH4 : SDATA (DIC1-60~67, DATA)
Circuit Descriptions
6-16 Samsung Electronics
6-6 Video
6-6-1 Outline
VIC50 sends VSYNC and HSYNC from VIC1(A/V decoder) and receives 8bit video data.VIC50 does RGB encoding, copy guard processing and D/A conversion of 8bit video data inputted from VIC1(A/Vdecoder) by control of MIC1(Micom).Video signal converted into analog signal is outputted via amplifier of analog part.
(Main Board) (Output Board)
VIC1A/V Decoder
ZiVA-3
MIC1Main Micom
TMP93CM41F
Videodata
VIC50SAA7128
Videoencoder
VIC52AmplifierBA7660
VIC51AmplifierBA7660
CVBS-1
CVBS-2
Y
C
Y
Pr
Pb
Fig. 6-21 Video Output Block Diagram
Circuit Descriptions
Samsung Electronics 6-17
6-6-2 NTSC/PAL Digital Encoder (VIC50 : SAA7128)
VIC50 inputted from pin4 with 27MHz generates HSYNC and VSYNC which are based on video signal. EachHSYNC and VSYNC outputted from Pin8 and Pin7 are inputted to Pin157 and Pin158 of A/V decoder VIC1(ZIVA-3). VIC1 is the synchronous signals with the video signal and control the output timing of 8bit video signal of ITU-R601 format. (Pin180, 182, 184 ~ 189 (MSP))8bit data is inputted to Pin9(MSB) and Pin16 of VIC50 and the inputted data is demuxed with each 8bit of Y/R-Y/B-Y. The separate signal is encoded to NTSC or PAL by control of MIC1. The above signals, that is CVBS(Composite Video Burst Synchronized)(Pin30), S-Video (Y:Pin27, C:Pin24), Y/Pb/Pr(Pin27/Pin29/Pin23) andGB(Pin26/Pin29/Pin23). In course of encoding, 8bit data can extend to 10bit or more. To convert the extended datato quantization noise as possible, VIC50 adopts 10bit D/A converter. VIC50 perform video en-coding as well ascopy protection.
VDATA[7:0]
VSYNCHSYNC27M
MRSTSDASCL
9~16
784
404241
Demultiplexer
Y
CR-CBRGB encoding
Luminaceprocessing
MACROVISION7.0.1/6.1
Cloed captionsCGMS
Chrominanceprocessor
CTRL+CFGregister
Trap 10-bit DAC
30
27
24
23
26
29
CVBS
Y
C
Cr/R
G
Cb/B
VIC1 (SSA7128)
Fig. 6-22
6-6-3 Amplifier (VIC51, VIC52 : BA7660)
VIC51 and VIC52 are 6dB amplifier. Based on CVBS signal, the final output level must be 2Vpp without 75ohm ter-minal resistance. Because the level of video encoder output is only 1.1Vpp, the level is adjusted with the specialamplifier. When mute of pin1 is high active, if the pin is floating and connected to power, the output signal is neveroutputted. CVBS, Y, C, Cr and Cb outputted from video encoder are inputted to VIC52 (Pin7, Pin2 and Pin4) andVIC51 (Pin7 and Pin4) respectively and outputted from VIC52 (Pin10, Pin15 and Pin13) and VIC51 (Pin10 and Pin13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compen-sation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. Thesignal to which gain is adjusted by amplifier is outputted from jack via 75ohm.
Circuit Descriptions
6-18 Samsung Electronics
6-6-4 Scart Jack Output
The AV1 of scart jacks is used for connecting a TV or other display devices and the AV2 for a VCR or other players.When the DVD player is turned on, the RGB, CVBS, or S-VIDEO is outputted to AV1 and CVBS to AV2. When theplayer is turned off, CVBS signal of the TV is inputted and CVBS or RGB of a VCR inputted via AV2 is outputted.In case of AV2, the reverse signal flow to that.Switching of power on/off is controlled by SCIC1, SCIC2, and SCIC5. The control signal (Pin 9,10,11) of SCIC1 and SCIC2 is outputted from PIN100 of FIC1 and connected to the sig-nal(Pin 4) inverted by FIC3. The control signal(Pin 9,10,11) of SCIC5 is also outputted from Pin100 of FIC1 and inverted again by SCQ8.According to the characteristics that SCART Jack is supplied same pins for the output of CVBS signal and Y signaland for the R signal and C signal, SCIC3 lets the user select two signals in setup menu.This control signal (Pin 9,10,11) of the switch is outputted from Pin 92 of FIC1.The signal selected by switch is amplified by SIC4 and SIC6 and outputted through the SCART jack.The scart jack has the function select signal (Pin 8 of AV1) that the TV can select automatically RF and the externalvideo signal. SCQ1 to SCQ7 are the circuit to point, FIC1 (Pin100, 94) controls. When the TV aspect ratio is 4/3 or 16/9, it is out-putted 4.5 ~ 7V or 9.5 ~ 12V each. But, when the DVD video source is 16/9 and 16/9 wide is selected in setup menu, 4.5 ~ 7V is outputted. Otherwise, 9.5 ~ 12V is outputted. When the player is turned off, the TV works with function selection by output signal of VCR in relation of SCQ9and SCQ10.RGB control signal (Pin 16 of AV1) is outputted that the TV can select between RGB and CVBS. SCQ11 ~ SCQ14 and SCQ17 are for RGB control and controlled by FIC1 (Pin91).When the player is turned off, receives VCR input (Pin 37 of AV2) and buffers in this circuit and then outputs to Pin 16 of AV1.
SIC2(14053)Switch
SIC1(14053)Switch
SIC3(14053)Switch
SIC5(14053)Switch
SIC4(NJM2267)Amplifier
SIC6(BA7660)Amplifier
AV1TV
AV2VCR
Y_S
C_S
R_S
R_VCR_IN
G_VCR_IN
B_VCR_IN
CVBS_VCR_OUT
R_TV_OUT
G_TV_OUT
B_TV_OUT
CVBS/Y_VCR_OUT
CVBS_TV_IN
R_VCR_ING_S
G_VCR_INB_S
B_VCR_IN
CVBS_VCR_IN
CVBS_S
CVBS_TV_IN R/C_TV_OUT
G_TV_OUT
B_TV_OUT
CVBS_VCR_OUT
Fig. 6-23
Circuit Descriptions
Samsung Electronics 6-19
6-7 Audio
6-7-1 Outline
The four data (Data 0~3) outputted from A/V decoder (VIC1 ; ZiVA-3) are supplied to DATA 0 for 2-channelmixed audio output and to DATA 1~3 for Analog audio output (5.1-channel).The audio data (0~3) transmitted from A/V decoder (VIC1 ; ZiVA-3) are converted into analog signal via audioD/A converter and outputted via post filter and amplifier.CD and VCD are outputted with only 2 channels audio data and transmit them to Data 0 and Data 1. Front L/R channel is outputted in mixed audio output (L/R output) and analog audio output and surround L/R,center and subwoofer arenÕt outputted.If DVD of 2 channels source disc is used, it is outputted by the same way with CD and VCD. If 5.1-channel source disc, front L/R channel is outputted in Data 1, Surround L/R in Data 2 and Center/Sub-woofer in Data 3. At that time, 5.1 channel can be downmixed in 2 channel in Data 0.
AIC2AK4324
D/A CONVERTER
POSTFILTERPOST
FILTER
AIC1AK4324
D/A CONVERTER
POSTFILTERPOST
FILTER
POSTFILTERPOSTFILTER
POSTFILTERPOST
FILTER
AMP
AMP
AMP
AMP
AMP
AMP
AMP
AMP
AIC3AK4324
D/A CONVERTER
AIC4AK4324
D/A CONVERTER
VIC1(ZiVA-3)
A/V Decoder
DATA0LRCKBCK
DATA1
DATA2
DATA3CENTER
SURROUND-L
SURROUND-R
L
R
FRONT-L
FRONT-R
SUB WOOFER
Mixed Audio Output (2-Channel)
Analog Audio Output (5.1-Channel)
Fig. 6-24 Audio Output Block Diagram
Circuit Descriptions
6-20 Samsung Electronics
6-7-2 DVD Audio Output
1) Compressed Data
The audio data inputted to VIC1 (ZiVA-3) A/V decoder is divided into compressed data and uncompressed data.It is compressed data that is compressed with multi-channel audio data such as Dolby digital, MPEG, DTS, etc.The compressed data inputted to VIC1 (ZiVA-3) is converted into the uncompressed data of 2, 4, and 6 channelsthrough ZiVA-3 built-in audio decoder and is outputted to Data 0, 1, 2, and 3 through digital audio interface. The compressed data is transmitted to external AC-3 amplifier or MPEG/DTS amplifier as IEC-958/1937 trans-mission data format compressed by ZiVA-3 built-in IEC-958 output process.
2) Uncompressed Data
The uncompressed data is that data isnÕt compressed, so it is called CD-DA, LPCM data. The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted indigital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTSamplifier built in the external digital input source with IEC-958/1937 transmission format.
AUDIO INPUTBUFFER
AUDIO OUTPUTBUFFER
RECEIVER or
DECODER(IEC-958/1937)
AUDIODAC
HOST or DVD/CDINTERFACE
IEC-958/1937OUTPUT PROCESS
IEC-958/1937INTERFACE
AUDIO DECODER(MPEG, DOLBY DIGITAL,
CD-DA, LPCM
DIGITAL AUDIOINTERFACE
2-, 4, or 6-CHANNEL OUTPUT
PROCESS
Uncompressed 16- or 24-bitLPCM camples atfs=44.1,48,96KHz
2-Channel LPCM, DecoderDolby Digital, Decoded MPEG
Compressed Data(MPEG, Dolby Digital),CD-DA, LPCM
VIC4, 10 (LOCAL DRAM) VIC1 (ZiVA-3 ; A/V DECODER)
Source Data Types :MPEG-1,-2, Dolby Digital,
CD-DA, LPCM
Fig. 6-25 Audio Decoder and Output Interface Datapath
Samsung Electronics 7-1
7. Troubleshooting
No
Sear
ch O
pera
tion
PS0,
PS1
is in
put
SIC1
-2, 3
term
inal
from
SIC8
-1, 7
?
Actu
al v
eloc
ity o
ccur
sat
SIC
1-73
term
inal
?
Actu
al v
eloc
ity o
ccur
sat
DRI
C2-1
1, 1
2 te
rmin
al?
Chec
k SI
C8 p
erip
hera
l circ
uit.
0.1V
p-p
sine
wav
eoc
curs
at s
earc
h at
SIC
8-2,
6te
rmin
al?
Repl
ace
Hall
PCB
Chec
k SI
C1 p
erip
hera
l circ
uit.
Chec
k DR
IC2
perip
hera
l circ
uit.
No
No
No
No
Yes
TE o
ccur
s in
sear
ch ra
nge?
Focu
s On
?
Yes
Yes
Yes
No
Yes
A
See
"Fin
e Se
ek C
heck
"
No
FIN
E SE
EK C
heck
FIN
E SE
EK M
IRR
sign
al (R
IC1-
57) i
s m
issi
ng?
TZCO
sig
nal
(SIC
1-52
) is
occu
rs?
Trac
k in
com
min
g is
dela
yed?
TE is
with
in
2V a
nd 3
V?
Pick
-up
trans
fer s
moo
th.
Chec
k RI
C1 P
erip
hera
l cur
cuit.
Chec
k SI
C1 P
erip
hera
l cur
cuit.
Tim
e ou
t due
to m
any
jum
p co
unts
.
Chec
k SI
C1 p
erip
hera
l circ
uit.
SIC1
-76
outp
utis
nor
mal
?
DRIC
2-17
, 18
term
inal
out
puts
are
norm
al?
Chec
k CN
6 an
d pi
ck-u
p.
Chec
k M
ECHA
.
Chec
k RI
C1-3
6 te
rmin
al.
Chec
k DR
IC2
perip
hera
l circ
uit.
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
No No
Troubleshooting
7-2 Samsung Electronics
Abn
orm
al ro
tatio
n of
di
sc m
otor
Inpu
t of R
F si
gnal
is n
orm
al?
(SIC
1-59
)
SPD
outp
ut is
nor
mal
?(S
IC1-
74)
Afte
r res
olde
ring
SIC1
.
DRIC
1-24
out
put (
FG)
is n
orm
al?
DRIC
1-23
sig
nal
MON
is "H
" ?
Chec
k or
repl
ace
disc
mot
or.
Chec
k DI
C1, M
IC1.
Chec
k DR
IC1
sold
erin
g an
d po
wer
.
Chec
k pa
th to
RIC
1 an
d SI
C1.Ch
eck
RIC1
sol
derin
g an
d po
wer
.
RIC1
-86
outp
utar
e no
rmal
?
RIC1
-88
outp
utis
nor
mal
?
Chec
k RI
C1 p
erip
hera
lci
rcui
t and
A, B
, C, D
.
Yes
Yes
Yes
Yes
Yes
Yes
No No
No
No
No
No
No
Tray
ope
n/cl
ose
MIC
1-84
, 85
isOp
en ;
"L",
"L" ?
Clos
e ; "
H", "
H"?
Chec
k DR
IC2-
26, 2
7ou
tput
at o
pen/
clos
e
Chec
k si
gnal
line
sta
te fr
om
DRIC
1-26
, 27
to tr
ay m
otor
.
Mic
om (M
IC1)
erro
e.
Chec
k DR
IC2
Yes
Yes
No
No
Troubleshooting
Samsung Electronics 7-3
No
Dis
c re
cogn
ition
LD is
out
putte
dfro
m o
bjec
t len
s at
play
key
inpu
t?
No
focu
s in
com
ing
and
no d
isc
occu
rs.
Yes
No
B
A
No
focu
s in
com
ing
FE in
SIC
1-65
is w
ithin
spe
cifie
d ra
nge?
DRIC
4-1,
2 o
utpu
tar
e no
rmal
?
Chec
k op
en s
tate
from
DRIC
4 to
pic
k-up
.
Chec
k RI
C1 a
nd A
, B, C
, D in
put.
Chec
k DR
IC4
Yes
Yes
No
No
A
Troubleshooting
7-4 Samsung Electronics
No
pick
-up
hom
e po
sitin
g
SELE
D FG
Ps0
, PS1
is in
put n
orm
ally
.(S
IC1-
2, 3
)
Chec
k SI
C1 s
olde
ring
and
pow
er.
Chec
k SI
C8, D
RIC2
sig
nal
trans
fer s
yste
m
Yes
No
NO
LD
ON
RIC1
-28
is 5
V?
RIC-
29 o
utpu
tis
200
mV?
Curre
nt e
xcee
ds 0
.1A?
LD o
ut p
ick-
up re
plac
e.
Open
che
ck in
rela
ted
circ
uit.LD
MPD
erro
r. Re
plac
e pi
ck-u
p
RIC1
-50
outp
ut is
0V?
Chec
k M
IC1
Yes
Yes
Yes
Yes
Yes
No
No
No
No
Divi
de R
Q1 e
mitt
er te
rmin
alvo
ltage
and
5V
real
vol
tage
diffe
renc
e in
to 3
3ohm
.
B
Troubleshooting
Samsung Electronics 7-5
CD/V
CD/D
VD L
/R o
utpu
t err
or(M
ixed
Aud
io o
utpu
t)
Nor
mal
DAT
A 0
isin
put i
n AI
C1-7
?
Anal
og o
utpu
t of
AIC1
-16,
17,
18,
19
is n
orm
al?
Chec
k AV
J2 p
erip
hera
l so
lder
ing
shot
.
Chec
k VI
C1-1
61 o
utpu
t.
Chec
k VI
C1-1
69(C
D/VC
D ; 1
6.93
44M
Hz,
DVD
; 18.
432M
Hz)
Yes
Yes
No
No
AOP1
-1, 7
out
put
is n
orm
al?
Chec
k AO
P1 p
erip
hera
l circ
uit.
Yes
No
Base
term
inal
leve
lof
AQ1
, 2, 3
, 4ar
e "L
"?
Chec
k FI
C1-9
8 m
ute.
Yes
No
Fron
t L/R
out
put e
rror
(Ana
log
Aud
io o
utpu
t)
Nor
mal
DAT
A 1
isin
put i
n AI
C2-7
?
Anal
og o
utpu
t of
AIC2
-16,
17,
18,
19
is n
orm
al?
Chec
k AV
J3 p
erip
hera
l so
lder
ing
shot
.
Chec
k VI
C1-1
63 o
utpu
t.
Chec
k VI
C1-1
69(C
D/VC
D ; 1
6.93
44M
Hz,
DVD
; 18.
432M
Hz)
Yes
Yes
No
No
AOP2
-1, 7
out
put
is n
orm
al?
Chec
k AO
P2 p
erip
hera
l circ
uit.
Yes
No
Base
term
inal
leve
lof
AQ5
, 6, 7
, 8ar
e "L
"?
Chec
k FI
C1-9
8 m
ute.
Yes
No
Troubleshooting
7-6 Samsung Electronics
Surr
ound
L/R
out
put e
rror
(Ana
log
Aud
io o
utpu
t)
5.1-
chan
nel i
sco
ntai
ned
in p
layi
ng d
isc?
Nor
mal
DAT
A 2
isin
put i
n AI
C3-7
?
Chec
k AV
J3 p
erip
hera
l so
lder
ing
shot
.
Outp
ut o
nly
in 2
-cha
nnel
(s
tere
o ch
anne
l)
Chec
k VI
C1-1
64 o
utpu
t.
Yes
Yes
No
No
Anal
og o
utpu
t of
AIC3
-16,
17,
18,
19
is n
orm
al?
Chec
k VI
C1-1
69 D
VD ;
18.4
32M
Hz
Yes
No
AOP3
-1, 7
outp
ut is
nor
mal
?Ch
eck
AOP3
per
iphe
ral c
ircui
t.
Yes
No
Base
term
inal
leve
lof
AQ9
, 10,
11,
12
are
"L"?
Chec
k FI
C1-9
7 m
ute.
Yes
No
Cent
er/S
ub-W
oofe
r out
put e
rror
(Ana
log
Aud
io o
utpu
t)
5.1-
chan
nel i
sco
ntai
ned
in p
layi
ng d
isc?
Nor
mal
DAT
A 3
isin
put i
n AI
C4-7
?
Chec
k AV
J3 p
erip
hera
l so
lder
ing
shot
.
Outp
ut o
nly
in 2
-cha
nnel
(s
tere
o ch
anne
l)
Chec
k VI
C1-1
65 o
utpu
t.
Yes
Yes
No
No
Anal
og o
utpu
t of
AIC4
-16,
17,
18,
19
is n
orm
al?
Chec
k VI
C1-1
69 D
VD ;
18.4
32M
Hz
Yes
No
AOP4
-1, 7
outp
ut is
nor
mal
?Ch
eck
AOP4
per
iphe
ral c
ircui
t.
Yes
No
Base
term
inal
leve
lof
AQ1
3, 1
4, 1
5, 1
6ar
e "L
"?
Chec
k FI
C1-9
5, 9
6 m
ute.
Yes
No
Troubleshooting
Samsung Electronics 7-7
Dig
ital o
utpu
t err
or
Outp
ut in
VIC
1-15
9 is
nor
mal
?
Outp
ut in
AIC5
-6, 8
, 10
isno
rmal
?
Chec
k AV
J4 p
erip
hera
l so
lder
ing
shot
.
Chec
k VI
C1 p
erip
hera
l circ
uit.
Chec
k VI
C5.
Yes
No
No
Yes
No
Pow
er(S
tand
by L
ED O
FF)
PF01
erro
r?
PD01
vol
tage
is m
issi
ng?
Repl
ace
PIC1
.
Repl
ace
fuse
.
Chec
k PR
10.
No
No
Yes
Yes
PIC1
dra
in (p
in 1
)vo
ltage
is m
issi
ng?
Chec
k 2d
vol
tage
.
No
No
Volta
ge e
xist
s in
PIC1
-5?
Chec
k PR
11, 1
2, 1
3, 1
4.
Yes
No
Puls
e is
mis
sing
in P
IC1-
5?Re
plac
e PI
C1.
Chec
k fe
ed b
ack.
Yes
Yes
Troubleshooting
7-8 Samsung Electronics
No
fron
t (SE
T) o
pera
tion
REF
+/-,
5V-a
ll, -2
8Vpo
wer
is s
uppl
ied.
12M
Hz o
scill
atio
n (F
Y1)?
If th
e pr
oble
m p
ersi
sts
;Ch
eck
afte
r rep
laci
ng J
ack
PCB,
w
ith a
noth
er o
ne.
Chec
k ot
her p
arts
for a
bnor
mal
fro
nt o
pera
tion
pers
ists
.
Chec
k po
wer
sta
tus.
Chec
k X-
TAL
perip
hera
l circ
uit.
Yes
Yes
No
No
Rese
t wor
king
inFI
C1-1
2?Ch
eck r
eset
perip
hera
l circ
uit of
FIC2
.
Yes
No
FIC1
sol
derin
g is
OK?
Chec
k FI
C1 s
olde
ring.
Yes
No
Oper
atio
nal w
avef
orm
is m
issi
ng in
FIC
3(F
LT) p
in?
Chec
k FI
C1 p
erip
hera
l circ
uit.
Yes
Yes
Key
of S
TOP,
PLA
Y, O
PEN
wor
k no
rmal
ly?
Chec
k S/
W in
terfa
ce.
Chec
k co
mm
unic
atio
n st
atus
with
m
ain
mic
om(C
heck
FIC
1 pi
ns 2
7, 7
2, 7
3, 7
4, 7
5)
No
No
DVD
pla
y er
ror
'NO
DISK
' app
ears
after
pick-u
p mov
es up
and
down
twice
at po
wer o
n?
27M
Hz c
lock
isin
put i
n DI
C1-1
4?
VIC1
per
iphe
ral s
olde
ring
and
shor
t che
ck.
Chec
k DIC
1, M
IC1
perip
hera
l sho
rt.
Chec
k 27
MHz
osc
illat
ing
part.
Yes
No
No
Sign
als
are
outp
utfro
m S
IC1-
42, 4
4?Re
plac
e SI
C1.
Yes
No
Yes
Troubleshooting
Samsung Electronics 7-9
All p
ower
is me
asure
dco
rrectl
y and
fron
t cab
le is
prope
rly co
nnec
ted?
All c
locks
(20M
Hz,
33.86
88M
Hz, 2
7MHz
) of m
ain PC
Bos
cillat
e norm
ally?
Chec
k A/V
deco
der s
ignal
proc
ess b
lock.
Chec
k al
l clo
ck o
scill
atin
g pa
rts.
Yes
Yes
No
/CS2
, /RD
, /W
R si
gnal
occ
ur?
Chec
k sh
ort p
in o
ut o
f mic
om
com
mon
-bus
(8-b
it).
Chec
k sh
ort o
r ope
ratin
g of
mic
om.
Chec
k so
lder
ing
of m
icom
and
co
mm
unic
atio
n de
vice
s.
Yes
No
Play
wor
ks?
Chec
k VI
C1 p
erip
hera
l uni
t.
Yes
No
Yes
Yes
Yes
Yes
C
Key
oper
atio
n or
rem
ote
cont
rol e
rror
MIC
1-9
is fi
xed
to 0
V?
MIC
7-4,
5 p
in is
fixe
d to
0V?
Chec
k A/V
deco
der s
ignal
proc
ess b
lock.
Chec
k DV
D si
gnal
pro
cess
blo
ck.
Yes
Yes
MIC
1-10
, 19
wave
form
stat
e (0,
1)ch
ange
s whe
neve
r pre
ssing
front
key?
Chec
k M
IC1
perip
hera
l sol
derin
g.Ye
s
Chec
k ei
th a
rticl
e "N
o Fr
ont (
SET)
Ope
ratio
n"
No
C
No No
Troubleshooting
7-10 Samsung Electronics
Vide
o ou
tput
err
or in
RCA
Jac
ks
Powe
r lev
el is
norm
al at
pin 6
, 17,
20, 2
5, 28
,31
, 36,
39 in
VIC
50?
27M
Hz c
lock
inpu
tis
nor
mal
at p
in 4
inVI
C50?
Chec
k th
e co
nnec
tion
betw
een
pin
2 in
PIC
6 an
d Em
mite
r in
PQ24
.
Chec
k th
e co
nnec
tion
betw
een
pin
10 in
VIC
6 an
d pi
n 4
in V
IC50
.
Yes
Yes
No
No
MRS
T is
hig
h st
ate
at p
in 4
0 in
VIC
50?
Yes
No
Cont
rol s
ignal
isno
rmal
at pi
n 41,
42 in
VIC
50?
(Whe
n pow
er on
or
open
)Yes
No
SYN
C si
gnal
isno
rmal
at p
in 7
, 8 in
VIC5
0?
Chec
k th
e so
lder
ing
of V
IC50
.
Yes
Chec
k th
e co
nnec
tion
betw
een
pin
1 in
FIC
1 an
d pi
n 40
in V
IC50
.
Chec
k the
conn
ectio
n betw
een
pin 86
, 87 i
n MIC1
and p
in 41
, 42 i
n VIC5
0.
Chec
k th
e co
nnec
tion
with
pi
n 18
0, 1
82, 1
84 ~
189
in V
IC1.
Vide
o da
ta a
re in
pute
dno
rmal
ly a
t pin
9 ~
16
inVI
C50?
Analo
g sign
als ou
tput
norm
ally a
t pin
30, 2
7, 24
,29
, 23,
in VI
C50?
Yes
No
Yes
D
Chan
ge V
IC50
.
No
No
Chec
k th
e so
lder
ing
of V
IC50
.
Chan
ge V
IC50
.
No
No
Analo
g sign
alsar
e inp
uted
norm
ally a
t pin
2, 4,
7 in V
IC51
, 52?
Pow
er is
nor
mal
at p
in 1
6 in
VIC
51, 5
2?
Chec
k th
e co
nnec
tion
betw
een
VIC5
0 an
d VI
C51,
52.
Chec
k th
e co
nnec
tion
betw
een
VIC5
1, 5
2 an
d Em
mite
r of P
Q24.
Yes
No
No
Pin
1 in
VIC
51, 5
2 is
in
Low
sta
te?
Yes
No
Vide
o sign
als of
abou
t 2V
appe
ar at
pin 1
0, 13
, 15
in VI
C51,
52?
Yes
No
Vide
o si
gnal
s of
ab
out 1
V ap
pear
at
outp
ut ja
cks?
Chec
k th
e so
lder
ing
of
VIC5
1, 5
2.
Yes
Conn
ect t
o gr
ound
.
Chec
k th
e co
nnec
tion
betw
een
VIC5
1, 5
2 an
d ou
tput
jack
s.
Chec
k th
e RC
A ca
ble.
Yes
D
Chan
ge V
IC51
, 52.
No
No
Samsung Electronics 8-1
8. Exploded View and Parts List
8-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Page
8-2
8-4
Exploded Views and Parts List
8-2 Samsung Electronics
8-1 Cabinet Assembly
151
602
(ASS
Y-PC
B-JA
CK)
151
1
701
151 70
215
1
212
11
12
S.N
.A. (
CABI
NET-B
OTTO
M)
611
610
601
(ASS
Y-PC
B-M
AIN)
151
150
CN11
A
14
13605
151
150
101
150
S.N
.A. (
DECK
-DVD
MEC
HA)
S.N
.A. :
Ser
vice
Not
Ava
ilabl
e
S.N
.A. (
CHAS
SIS-
REAR
)UT
01
Exploded Views and Parts List
Samsung Electronics 8-3
Loc. No Parts No. Description ; Specification Remark
1 AH95-10355E ASSY-CABINET FRONT;DVD-739,ABS94HB,XAA2 AH95-50369E ASSY-DOOR TRAY;DVD-739,ABS,XAA11 AH61-00194A HOLDER-DECK A;-,ABS 94HB,-,BLK,-,DVD-90912 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD13 AH61-00194B HOLDER-DECK B;-,ABS 94HB,-,BLK,-,DVD-90914 AH61-00194C HOLDER-DECK C;-,ABS 94HB,-,BLK,-,DVD-909150 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018151 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC101 AH97-00188D ASSY-CABINET TOP;DVD-739,ASSY,XAA601 AH92-00172A ASSY-PCB-MAIN;DVD-739,MAIN PCB602 AH92-00173A ASSY-PCB-JACK;DVD-739,JACK PCB605 AH63-00040A GROUND-REAR;-,PBS,T0.2,-,DVD-909610 AH39-00034A POWER CORD;KJ-10W,EP2,-,1.83M,CONNECTOR,611 3301-000132 CORE-FERRITE;AC,28.8x19.3x7.5mm,1400,290701 AH92-00167A ASSY-PCB-POWER;DVD-709/DOM,POWER LEADER702 AH92-00166A ASSY-PCB-PLAY;DVD-709/DOM,PLAY LEADERUT01 AH59-10141A REMOCON-ASS’Y;-,-,-,48,DVD-909,S.SCN11A 3809-001133 CABLE-FLAT;30V,80C,200MM,35P,1.25MM,UL28
Exploded Views and Parts List
8-4 Samsung Electronics
8-2 Deck Assembly
903 903
225225
903225
223
217
222220
218
909201
210
212
213209908
208
231
229230
230
205203
202
227
902
207904
901211
219
903
224
905
901
907
215
220
216
220221
204
206
214
906 S.N.A.
216
S.N.A. : Service Not Available
S.N.A.
S.N.A.
Exploded Views and Parts List
Samsung Electronics 8-5
Loc. No Parts No. Description ; Specification Remark
201 AH91-60117A ASSY-DECK CLAMPER;DVD860,-,DP-1202 AH92-00035A ASSY-PCB-DECK;DP-3,-203 3809-001125 CABLE-FLAT;30V,80C,140MM,8P,1MM,UL2896204 AH91-60147A ASSY-BRKT DECK;DP-3,DVD-909,-205 AH66-90054A TRAY-DVD;DP,ABS,-,BLK,-,DP-1206 AH91-60154A ASSY-DECK HOUSING;DP-3,DVD-909,-207 AH66-30087A LEVER-OPEN SW;DP,KEPITAL,T0.7,L26,F20-03208 AH66-20194A GEAR-CAM CENTER;DP,KEPITAL F20-03,M1.2,Z209 AH66-20183A GEAR-CAM SUB;DP,KEPITAL FT2020,M1,2,Z7,-210 AH66-20185A GEAR-TRAY A;DP,KEPITAL F20-03,M0.4/M0.5,211 AH66-10024A PULLEY-GEAR;DP,KEPITAL F20-03,BLK,DP-1212 AH66-60033A BELT-PULLEY;DP,CR,T1.5,0.08,L82.7,BLK,DP213 AH66-20184A GEAR-TRAY;DP,KEPITAL F20-03,M0.5/M0.6,Z4214 AH97-00178A ASSY-BRKT FEED;DP-3,-,SOH-DP1215 BG61-20031A HOLDER-CAM;-,POM,-,-,-,DDR-4216 AH61-50327A SHAFT-P/U;DP,SUS420J2,OD3,L84.7,S/FINISH217 AH66-20228A RACK-SLIDE;DP,KEPITAL F20-03,WHT,M0.4,P1218 AH30-20001B PICK-UP;SPU-DP1 DVD-909219 AH91-60151A ASSY-MOTOR SPINDLE;DP-3,DVD-909,-220 AH60-30020A WASHER-PLAIN;DP,-,ID3.1,OD6,T0.3,RED COL221 AH91-60120A ASSY-GEAR-FEED-AU/AL;DP-1,DVD-860,-222 AH66-20182A GEAR-FEED B;DP,KEPITAL F20-03,M0.4,Z44,W223 AH91-60121A ASSY-GEAR-FEED-CU/CL;DP-1,DVD-860,-224 AH63-30245B COVER-sheet;-,-,-,T0.7,CLR,-,BLK CARBON,225 AH73-10017A RUBBER-INSULATOR;RUBBER(LB-40),OD11,DP-1227 3809-001123 CABLE-FLAT;30V,80C,90MM,40P,1.25MM,UL289229 AH61-50323A SHAFT-SYNCRO;-,sus304,2.1,119,-,-,dvd-90230 AH66-22005A GEAR-SYNCRO-A;KEPITAL F20-03,M0.8,Z9,-,P231 AH97-00179A ASSY-HOUSING MOTOR;DP-3,-,SOH-DP1901 AH60-10151A SCREW-TAP TITE;DP,SPEC6.8 ,PH,+,CP,M2,L902 AC60-10051A SCREW-TAPPING;BH,-,-,M3,L8,FZY903 AH60-10143U SCREW-TAP TITE;DP,PH,+,SPEC,TAP1.7,L5,ZP904 AH60-10145A SCREW-TAP TITE;DP,PH,+,SPEC OD5.5 FP,TAP905 AH60-10147A SCREW-MACHINE;DP,CH,+,FP,M2,L4,ZPC,SWRCH906 AC60-10059A SCREW-TAPPING;BH,+,-,1.7,X5,ZPC2907 AH60-00010A SCREW-MACHINE-MOTOR;-,+,SWCH18AK,M1.7,L2908 AC60-10042A SCREW-TAPPING;PWH,+,-,M3,L8,-909 BG60-10020A SCREW-SP MOTOR;-,BHW TOOTH,-,-,M1.7,L3,-
Exploded Views and Parts List
8-6 Samsung Electronics
MEMO
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
Samsung Electronics 9-1
601 ASSY-PCB-MAIN;DVD-739AR1 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR2 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR3 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR4 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR5 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR6 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR7 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608AR8 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608AR9 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608CN6 3708-001085 CONNECTOR-FPC/FC/PIC;40P,1.25mm,STRAIGHTCN7 3711-003358 CONNECTOR-HEADER;BOX,8P,1R,2.5mm,STRAIGHCN8 3708-001364 CONNECTOR-FPC/FC/PIC;35P,1.25MM,STRAIGHTDC1 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC15 2203-001567 C-CERAMIC,CHIP;10pF,0.5pF,50V,CH,TP,1608DC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC2 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC3 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,DC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DE1 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DIC1 AH13-10030P IC-ASIC;-,KS1453,TQFP,128P,DATA PRO. IDIC2 1105-001233 IC-DRAM;416C256,256KX16BIT,SOJ,40P,400MIDIC7 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110DL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,DRE1 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE2 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE3 2401-002075 C-AL;4.7uF,20%,50V,GP,TP,5x11,5DRE4 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE6 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE7 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE8 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRE9 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5DRIC1 1003-001130 IC-MOTOR DRIVER;KA3011DTF,SOP,28P,-,QUADDRIC2 1003-001067 IC-MOTOR DRIVER;KA3010D,SOP,28P,375MIL,QDRL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-DRR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
DRR11 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608DRR12 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608DRR13 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608DRR14 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608DRR3 2007-007157 R-CHIP;1ohm,5%,1/4W,DA,TP,3216DRR4 2007-007157 R-CHIP;1ohm,5%,1/4W,DA,TP,3216DRR7 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608DRR9 2007-000616 R-CHIP;24Kohm,5%,1/16W,DA,TP,1608MC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC16 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC18 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC19 2203-001656 C-CERAMIC,CHIP;470pF,5%,50V,CH,TP,1608,1MC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC3 2203-000426 C-CERAMIC,CHIP;18pF,5%,50V,NPO,1608,-,TPMC4 2203-000426 C-CERAMIC,CHIP;18pF,5%,50V,NPO,1608,-,TPMC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,MIC1 0903-001144 IC-MICROCONTROLLER;93CM41,8BIT,QFP,100P,MIC2 0801-002207 IC-CMOS LOGIC;74AC573,LATCH,SOP,20P,300MMIC5 1103-001133 IC-EEPROM;24C020,256x8BIT,SOP,8P,150MIL,MIC6 0801-002143 IC-CMOS LOGIC;7S32,OR GATE,SOT-25,5P,63MMIC7 0801-000379 IC-CMOS LOGIC;74HC00,NAND GATE,SOP,14P,1MIC8 1102-001090 IC-EPROM;27C081,1MX8BIT,DIP,32P,600MIL,1MIC8A 3704-000472 SOCKET-IC;32P,DIP,SN,2.54mmML1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-MQ1 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPMR1 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR12 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR13 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR14 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR15 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR16 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR17 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR18 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR19 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR2 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608MR22 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR23 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR24 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608MR25 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608MR3 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR33 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608MR34 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR35 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR36 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608MR37 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608MR38 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608MR39 2007-000103 R-CHIP;120Kohm,5%,1/16W,DA,TP,1608MR4 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR40 2007-000402 R-CHIP;150ohm,5%,1/16W,DA,TP,1608MR43 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608MR5 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
9. Electrical Parts List
Loc.No Part No Description ; Specification RemarkLoc.No Part No Description ; Specification Remark
9-2 Samsung Electronics
Electrical Parts List
MR6 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR7 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR8 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MR9 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608MXTAL1 2801-000199 CRYSTAL-UNIT;20MHz,50ppm,28-AAA,16pF,50oPC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,PE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE3 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5PE4 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5RC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC12 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC13 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC14 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-RC15 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC2 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC21 2203-000384 C-CERAMIC,CHIP;.015NF,5%,50V,NPO,TP,1608RC22 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC24 2203-001697 C-CERAMIC,CHIP;.082NF,5%,50V,NPO,TP,1608RC25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC27 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC28 2203-001052 C-CERAMIC,CHIP;.56NF,10%,50V,X7R,TP,1608RC29 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC32 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC34 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC35 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,RC36 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608RC37 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC38 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC39 2203-000531 C-CERAMIC,CHIP;2.7nF,10%,50V,X7R,TP,1608RC4 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,RC40 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RC41 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC42 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC43 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC44 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC45 2203-001652 C-CERAMIC,CHIP;470NF,+80-20%,16V,Y5V,TP,RC46 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,RC47 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC50 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC51 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC52 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC53 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC54 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,RC55 2203-000888 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,1608RC6 2203-001052 C-CERAMIC,CHIP;.56NF,10%,50V,X7R,TP,1608RC7 2203-001640 C-CERAMIC,CHIP;390pF,10%,50V,X7R,TP,1608RC8 2203-000384 C-CERAMIC,CHIP;.015NF,5%,50V,NPO,TP,1608RC9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608,RD1 0401-000008 DIODE-SWITCHING;DAN217,80V,100mA,SOT-23,RD2 0403-001079 DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TPRD6 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-
RD7 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-RE10 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmRE11 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mRE12 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RE13 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE17 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RE2 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE8 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5RE9 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5RIC1 AH13-10030M IC-ASIC;-,KS1461,VQFP,100P,RF ICRIC2 0801-002279 IC-CMOS LOGIC;74VHC4053,MUX,SOP,16P,150MRIC3 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUALRIC4 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/MRIC6 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110RL2 2703-000398 INDUCTOR-SMD;10UH,10%,3.2X2.5X2.2MMRL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-RL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-RQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT-RQ2 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPRR1 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR10 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR11 2007-000509 R-CHIP;2.4Kohm,1%,1/16W,DA,TP,1608RR12 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608RR13 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR14 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR15 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR16 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608RR17 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR18 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR19 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR2 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR20 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR21 2007-000081 R-CHIP;2.7Kohm,5%,1/16W,DA,TP,1608RR22 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR23 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR24 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR25 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR26 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR27 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608RR28 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR29 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608RR3 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR30 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR31 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR32 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR32A 2007-000108 R-CHIP;510Kohm,5%,1/16W,DA,TP,1608RR33 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR34 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR35 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR36 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR37 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR38 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR39 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR4 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR40 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608RR41 2007-000708 R-CHIP;3.9Kohm,1%,1/16W,DA,TP,1608RR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR43 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR44 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR45 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR46 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR47 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR48 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608RR49 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR5 2007-001056 R-CHIP;6.2Kohm,5%,1/16W,DA,TP,1608RR50 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
Electrical Parts List
Samsung Electronics 9-3
RR51 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608RR52 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR53 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608RR53A 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608RR56 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR57 2007-000088 R-CHIP;7.5Kohm,5%,1/16W,DA,TP,1608RR58 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR59 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR6 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR62 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608RR63 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608RR65 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608RR67 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608RR68 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608RR69 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608RR69A 2007-000431 R-CHIP;16Kohm,5%,1/16W,DA,TP,1608RR7 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608RR70 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608RR71 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608RR8 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608RR9 2007-000783 R-CHIP;33OHM,5%,1/8W,DA,TP,3216SC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC10 2203-001222 C-CERAMIC,CHIP;820pF,10%,50V,X7R,TP,1608SC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC14 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC15 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC17 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SC18 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC19 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608SC2 2203-001573 C-CERAMIC,CHIP;12pF,5%,50V,CH,1608,1.6mmSC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC21 2203-001567 C-CERAMIC,CHIP;10pF,0.5pF,50V,CH,TP,1608SC26 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608,SC29 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,SC3 2203-001573 C-CERAMIC,CHIP;12pF,5%,50V,CH,1608,1.6mmSC30 2203-000372 C-CERAMIC,CHIP;15nF,10%,50V,X7R,TP,1608,SC31 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC32 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608SC33 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SC34 2203-000405 C-CERAMIC,CHIP;180pF,5%,50V,NPO,TP,1608,SC36 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC37 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC38 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC39 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,SC9 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,SD2 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-SD3 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-SE1 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE2 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE3 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5SE4 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5SE5 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mSIC1 AH13-10030N IC-ASIC;-,KS1452,QFP,80P,DSSP ICSIC2 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110SIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110SIC8 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUALSL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-SQ1 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPSR1 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608
SR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608SR11 2007-000107 R-CHIP;470Kohm,5%,1/16W,DA,TP,1608SR12 2007-001235 R-CHIP;910Kohm,5%,1/16W,DA,TP,1608SR13 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR14 2007-000450 R-CHIP;180ohm,5%,1/16W,DA,TP,1608SR15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608SR16 2007-000131 R-CHIP;91Kohm,5%,1/16W,DA,TP,1608SR17 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608SR18 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608SR19 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR2 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR20 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR21 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR22 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR23 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608SR24 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR26 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608SR3 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR31 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR32 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR33 2007-000080 R-CHIP;2Kohm,5%,1/16W,DA,TP,1608SR34 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR35 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR36 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR37 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608SR38 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608SR39 2007-000458 R-CHIP;18Kohm,5%,1/16W,DA,TP,1608SR4 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608SR40 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608SR44 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR45 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR46 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR47 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608SR48 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR49 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608SR5 2007-000087 R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608SR50 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608SR51 2007-000082 R-CHIP;3.3Kohm,5%,1/16W,DA,TP,1608SR52 2007-000704 R-CHIP;3.6Kohm,5%,1/16W,DA,TP,1608SR53 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608SR54 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608SR6 2007-000098 R-CHIP;56Kohm,5%,1/16W,DA,TP,1608SR7 2007-000799 R-CHIP;360ohm,5%,1/16W,DA,TP,1608SR8 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608SR9 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608SY1 2801-000261 CRYSTAL-UNIT;33.8688MHZ,50PPM,28-AAA,12PVC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC10 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC12 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC13 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC14 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC15 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC18 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC19 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC20 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC21 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC22 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC25 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC26 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC27 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,
VC28 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC29 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC3 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC30 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC31 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC32 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC34 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC35 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC36 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC37 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC38 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC39 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC40 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC41 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC42 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC43 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC44 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC45 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC47 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC48 2203-000681 C-CERAMIC,CHIP;27pF,5%,50V,NPO,1608,-,TPVC5 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC50 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC51 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC52 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC53 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC54 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC55 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP,VC6 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC61 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC62 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC65 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC66 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC67 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC68 2203-000815 C-CERAMIC,CHIP;33pF,5%,50V,NPO,TP,1608,-VC69 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC7 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC70 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC71 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC72 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC73 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC74 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC75 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC76 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC77 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC78 2203-000626 C-CERAMIC,CHIP;22pF,5%,50V,NPO,TP,1608,-VC8 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VC81 2203-000851 C-CERAMIC,CHIP;39pF,5%,50V,NPO,TP,1608,-VC82 2203-000851 C-CERAMIC,CHIP;39pF,5%,50V,NPO,TP,1608,-VC83 2203-001071 C-CERAMIC,CHIP;56pF,5%,50V,NPO,TP,1608,-VC84 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,VC85 2203-000236 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,1608,VC9 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,VE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5VE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5VIC1 1204-001438 IC-DECODER;ZIVA-3,VQFP,208P,1098MIL,PLASVIC10 1105-001259 IC-DRAM;416S1020,16BIT,TSOP,50P,400MIL,8VIC3 0801-002097 IC-CMOS LOGIC;7SET08,AND GATE,SOP,5P,110VIC4 1105-001259 IC-DRAM;416S1020,16BIT,TSOP,50P,400MIL,8VIC6 AH14-10004R IC;M74HCU04,SOP,TAPE 14PVL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL10 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012VL11 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL12 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL13 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-
VL14 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL15 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL16 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL17 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL18 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL19 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL20 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL21 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL22 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL23 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL24 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL25 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL26 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL27 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL28 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL29 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL3 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL4 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL5 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL6 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VR1 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608VR10 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR100 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR101 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR102 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR103 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR104 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR2 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR21 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR22 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR23 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR24 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR25 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR26 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR27 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR28 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608VR3 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR30 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR31 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR32 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR33 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR34 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR35 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR36 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR37 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR38 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR39 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR4 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608VR40 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR41 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608VR42 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR43 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR44 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR45 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR46 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR47 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR48 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR49 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR50 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR51 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR52 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR54 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR55 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR56 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608VR57 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
Loc.No Part No Description ; Specification Remark
9-4 Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark
VR58 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR59 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR60 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR61 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR62 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR63 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR64 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR65 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608VR66 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR67 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR68 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR69 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR7 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608VR70 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR71 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR72 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR73 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR74 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR75 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR76 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR77 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR78 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR79 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR80 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR81 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608VR82 2007-000402 R-CHIP;150ohm,5%,1/16W,DA,TP,1608VR83 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR84 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR85 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR86 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR87 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR88 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR89 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR9 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608VR90 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR91 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR92 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR93 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR94 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR95 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR96 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR97 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR98 2007-001134 R-CHIP;68ohm,5%,1/16W,DA,TP,1608VR99 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608VY1 2801-003554 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o
602 ASSY-PCB-JACK;DVD-739AC1 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC10 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,-AC11 2202-000806 C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TPAC12 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC2 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC3 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VAC4 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,-AC5 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC56 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC6 2203-000595 C-CERAMIC,CHIP;220pF,5%,50V,NPO,TP,2012,AC60 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VAC7 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC71 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC73 2301-000161 C-FILM,PEF;12nF,5%,50V,6.5X5.5X3.0X5,5mmAC74 2301-000161 C-FILM,PEF;12nF,5%,50V,6.5X5.5X3.0X5,5mmAC8 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,AC90 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC94 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC95 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.AC98 2203-000239 C-CERAMIC,CHIP;100pF,5%,50V,NPO,TP,2012,AD1 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD2 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD4 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,AD5 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,AD6 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AD7 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT-AE1 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE10 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5AE11 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5AE2 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE3 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5AE30 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5AE31 2401-001969 C-AL;470uF,20%,25V,GP,TP,10x12.5,5AE4 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE5 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE6 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mAE7 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE8 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5AE9 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mAIC1 1002-001129 IC-D/A CONVERTER;AK4324VF,24BIT,VSOP,24PAIC5 AH14-10004R IC;M74HCU04,SOP,TAPE 14PAL1 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL19 2901-001125 FILTER-EMI ON BOARD;50V,0.5A,-,220pF,7x7AL2 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL5 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AL6 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-AOP1 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/MAQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ17 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-AQ18 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-AQ19 0504-001003 TR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TO-AQ2 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ20 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22KAQ21 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPAQ22 0504-000156 TR-DIGITAL;DTA124EKA,PNP,200mW,22K-22KAQ3 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AQ33 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TPAQ4 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-AR1 2007-000290 R-CHIP;100OHM,5%,1/10W,DA,TP,2012AR10 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR11 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR119 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012AR12 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR121 2007-001247 R-CHIP;91OHM,5%,1/10W,DA,TP,2012
Electrical Parts List
Samsung Electronics 9-5
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
AR13 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR130 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR134 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR138 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012AR14 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR15 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR150 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR151 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR18 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR19 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR20 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR21 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR22 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR23 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR24 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR25 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR26 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012AR27 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012AR28 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR29 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR30 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR31 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR32 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012AR41 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMAR42 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR8 2007-000308 R-CHIP;10OHM,5%,1/10W,DA,TP,2012AR9 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR90 2001-000241 R-CARBON;1.5KOHM,5%,1/8W,AA,TP,1.8X3.2MMAR91 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAR92 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMAVJ1 3722-001355 JACK-RCA;3P(4P),3.2MM,NI,GRN/RED/BLU,-AVJ2 3722-001358 JACK-RCA;3P,3.2MM,NI,BLK,-AVJ4 3722-001053 JACK-RCA;1P,3.2mm,NI,BLK,-AZD1 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500mCN11 3708-000277 CONNECTOR-FPC/FC/PIC;35P,1.25mm,ANGLE,SNCN12 AH39-00035A LEAD CONNECTOR-ASSY;-,5264-08,35023-08,8CN16 3711-001061 CONNECTOR-HEADER;BOX,6P,1R,2mm,ANGLE,SNCN18 3711-000967 CONNECTOR-HEADER;BOX,4P,1R,2mm,ANGLE,SNFC1 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC10 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC14 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC15 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC16 2202-000173 C-CERAMIC,MLC-AXIAL;1nF,10%,50V,Y5P,TP,1FC2 2203-000389 C-CERAMIC,CHIP;15pF,5%,50V,NPO,TP,2012,-FC3 2203-000389 C-CERAMIC,CHIP;15pF,5%,50V,NPO,TP,2012,-FC4 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFC6 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VFD10 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD6 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD7 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD8 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35,FD9 0403-000551 DIODE-ZENER;MTZ3.9B,3.9V,3.89-4.16V,500mFE1 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mFE12 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5FE13 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11,5FE2 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FE5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FE8 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5FIC1 AH09-00010A IC-MICOM MASKING;LC866232,100PIN,QIP,FLTFIC2 1203-001252 IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTICFIC3 0801-002166 IC-CMOS LOGIC;7SHU04,INVERTER,SSOP,5P,63FIC4 AH59-60010A MODULE-REMOCON;-,GP1U281Q,38KHz,940,MESHFL1 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mmFL2 2701-000113 INDUCTOR-AXIAL;100uH,5%,2.5x3.4mmFR1 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR10 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM
FR101 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR102 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR103 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR104 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR105 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR106 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR11 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR12 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR13 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR16 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MMFR17 2001-000027 R-CARBON;100OHM,5%,1/4W,AA,TP,2.4X6.4MMFR18 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR19 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR20 2001-000449 R-CARBON;2.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR21 2001-000435 R-CARBON;1MOHM,5%,1/8W,AA,TP,1.8X3.2MMFR24 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR25 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMFR26 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMFR31 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR32 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR33 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR34 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR35 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR36 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR37 2007-000282 R-CHIP;100KOHM,5%,1/10W,DA,TP,2012FR43 2001-000793 R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3.2MMFR44 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR45 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR46 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR5 2001-000325 R-CARBON;120OHM,5%,1/8W,AA,TP,1.8X3.2MMFR57 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MMFR58 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012FR59 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012FY1 2802-000108 RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0PC01 2305-001021 C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.PC02 2305-001021 C-FILM,MPEF;100nF,20%,275V,TP,17.5x7x13.PC04 2301-000140 C-FILM,PEF;10nF,10%,630V,BK,16.5X9.5X5.7PC05 2201-000129 C-CERAMIC,DISC;100pF,10%,1KV,Y5P,TP,6x5,PC07 2301-000129 C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5mPC09 2301-000415 C-FILM,PEF;22nF,5%,50V,TP,6.5x10.5x4mm,5PC10 2201-000916 C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10xPC11 2201-000916 C-CERAMIC,DISC;100pF,10%,400V,Y5U,TP,10xPC12 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC13 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC14 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC15 2203-000575 C-CERAMIC,CHIP;220NF,10%,25V,X7R,TP,2012PC44 2301-000129 C-FILM,PEF;100nF,5%,50V,TP,10X9X4.3X5,5mPCN01 3711-000178 CONNECTOR-HEADER;1WALL,2P,1R,3.96mm,STRAPD01 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD02 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD03 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD04 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TPPD11 0402-000378 DIODE-RECTIFIER;EG01C,1000V,500mA,DO-41PD12 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD3 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD31 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD32 0402-000430 DIODE-RECTIFIER;FML-G02S,200V,3.0A,TO-22PD33 0402-001251 DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220FPD34 0402-001251 DIODE-RECTIFIER;FMG-22R,200V,10A,TO-220FPD35 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DOPD37 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TPPD38 0402-000132 DIODE-RECTIFIER;1N4004,400V,1A,DO-41,TPPE10 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5PE11 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE12 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE13 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5
Loc.No Part No Description ; Specification Remark
9-6 Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark
PE3 2401-001682 C-AL;82uF,20%,400V,GP,BK,22x25,10mmPE31 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE32 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE33 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE35 2401-000360 C-AL;100uF,20%,50V,GP,TP,8x11.5,5PE36 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mmPE37 2401-001134 C-AL;330uF,20%,35V,WT,TP,10x16,5PE38 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE39 2401-001134 C-AL;330uF,20%,35V,WT,TP,10x16,5PE4 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5PE41 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmPE42 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE43 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5PE44 2401-002036 C-AL;1uF,20%,50V,GP,TP,5x11,2.5mmPE6 2401-001583 C-AL;47uF,20%,50V,WT,TP,6.3x11,5PF0A 3601-000453 FUSE-FERRULE;250V,1.6A,SB,GLASS,5.2x20mmPIC1 1203-001721 IC-PWM CONTROLLER;STR-G6153T,T0-220,5P,1PIC2 0604-000186 PHOTO-COUPLER;TR,-,200mW,DIP-4,STPIC3 AC14-12006D IC;KA431Z,TO-92,TAPINGPIC4 1203-000122 IC-NEGA.FIXED REG.;7908,TO-220,3P,-,PLASPIC5 1203-001697 IC-VOLTAGE REGULATOR;78R08,TO-220,4P,-,PPIC6 1203-001083 IC-VOLTAGE REGULATOR;3RF23,TO-202,4P,12.PL01 AC29-30050A FILTER-LINE NOISE;-,400UH,-,250V,-PL02 AC27-92001Q COIL-LINE FILTER;BSF-2120Z,25MH,-,-,-PL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,PL11 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,PQ1 0501-000398 TR-SMALL SIGNAL;KSC945,NPN,250mW,TO-92,TPQ2 0501-000616 TR-SMALL SIGNAL;KSC2328A-Y,NPN,1W,TO-92LPQ21 0504-000142 TR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,TPQ22 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-PQ23 0502-000298 TR-POWER;KSD73,NPN,30W,TO-220,-,120-240PQ24 0502-000298 TR-POWER;KSD73,NPN,30W,TO-220,-,120-240PQ3 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO-PQ4 0504-000142 TR-DIGITAL;KSR2001,PNP,300MW,4.7K/4.7K,TPR10 2006-000262 R-CEMENT;2.7ohm,10%,2W,CB,ST,7.5x11x20.PR11 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR12 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR13 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR14 2001-000073 R-CARBON;33KOHM,5%,1/4W,AA,TP,2.4X6.4MMPR15 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9xPR16 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W,AF,TP,3.9xPR17 2003-000148 R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MMPR18 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMPR2 2003-000148 R-METAL OXIDE;100OHM,5%,2W,AE,TP,6X16MMPR20 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR3 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR31 2001-000034 R-CARBON;220OHM,5%,1/4W,AA,TP,2.4X6.4MMPR32 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR33 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR34 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MMPR35 2001-000362 R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X3.2MMPR36 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR37 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR38 2004-000869 R-METAL;3Kohm,1%,1/8W,AA,TP,1.8x3.2mmPR39 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x3.2mPR4 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPR40 2003-000111 R-METAL OXIDE;0.47ohm,5%,1W,AD,TP,4.3x12PR5 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMPR6 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MMPT01 AH26-00008A TRANS-SWITCHING;-,85V-240V,UL/CSA,EE2821PVA01 1405-000186 VARISTOR;470V,4500A,17x12mm,TPPZD31 0403-000716 DIODE-ZENER;MTZJ4.7B,4.7V,4.55-4.8V,500mRC12 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11xRC13 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,11xRL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,SVJ1 3722-001375 JACK-DIN;4P,-,NI,BLK,-
VC1 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC10 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC100 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC101 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC102 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC103 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC104 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5VVC105 2007-000029 R-CHIP;0OHM,5%,1/10W,DA,TP,2012VC11 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC12 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC13 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC14 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC2 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC3 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP,VC4 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC5 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC6 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC7 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC8 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VC9 2202-000849 C-CERAMIC,MLC-AXIAL;18pF,5%,50V,CH,TP,3.VE51 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE54 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5VE55 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE58 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5VE58A 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE60 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE61 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE66 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE67 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5mVE69 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5VE70 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE71 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE72 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VE73 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5VFD1 AH07-00002A VF-DISPLAY;SVV-08M,21SEG,25X100MM,DVD-90VIC50 1204-001366 IC-VIDEO ENCODER;SAA7128,QFP,44P,-,PLASTVIC51 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,VIC52 1201-001419 IC-VIDEO AMP;7660,SSOP,16P,173MIL,3,6DB,VL100 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL110 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,VL111 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400,VL112 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VL113 2701-000138 INDUCTOR-AXIAL;18uH,5%,2.4x3.4mmVL115 2701-000002 INDUCTOR-AXIAL;100uH,10%,4.2x9.8mmVL116 2701-000002 INDUCTOR-AXIAL;100uH,10%,4.2x9.8mmVL119 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,-VR10 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR100 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MMVR108 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR109 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR11 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR110 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR111 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR112 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR113 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR114 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR115 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR116 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR117 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR12 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR13 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR130 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR132 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR133 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR14 2001-000591 R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR146 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM
Electrical Parts List
Samsung Electronics 9-7
Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
VR15 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR16 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR17 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR175 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR176 2001-000554 R-CARBON;270OHM,5%,1/8W,AA,TP,1.8X3.2MMVR177 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X3.2MMVR178 2001-000003 R-CARBON;330OHM,5%,1/8W,AA,TP,1.8X3.2MMVR18 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MMVR192 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MMVR4 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR5 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR7 2001-000977 R-CARBON;8.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR8 2001-000977 R-CARBON;8.2KOHM,5%,1/8W,AA,TP,1.8X3.2MMVR9 2001-000008 R-CARBON;15KOHM,5%,1/8W,AA,TP,1.8X3.2MM
701 ASSY-PCB-POWERCON24 AH39-00033A LEAD CONNECTOR-ASSY;-,51004-04,35023-04,KD2 0601-001238 LED;ROUND,RED,3.1mm,697nmKSW2 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
702 ASSY-PCB-PLAYCON22 AH39-00028A LEAD CONNECTOR-ASSY;-,51004-06,35023-06,FSW1 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW2 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW4 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW5 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,SFSW6 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S
202 ASSY-PCB-DECK;DP-3,-CN1 3708-001081 CONNECTOR-FPC/FC/PIC;11P,1mm,STRAIGHT,SNCN2 3708-001001 CONNECTOR-FPC/FC/PIC;20P,1mm,SMD-A,SNCN3 3711-000827 CONNECTOR-HEADER:BOX,2P,1R,2mm,STRAIGHT,CN4 3708-001108 CONNECTOR-FPC/FC/PIC;8P,1.0MM,ANGLE,SNCN5 3708-001084 CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SNDC1 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC2 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC3 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216DC4 2203-000612 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,3216,DE1 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,-DE2 2404-000259 C-TA,CHIP;47uF,20%,6.3V,-,TP,6032,-DL1 3301-000325 CORE-FERRITE BEAD;AB,3.2x2.5x1.3mm,-,-DLED 0601-001372 LED;ROUND,GRN,3.5MM,621NMDR1 2007-000800 R-CHIP;360ohm,5%,1/8W,DA,TP,3216DR2 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216DR3 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216DR4 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216DR5 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216SW1 AH34-30001A SWITCH-PUSH;2EA,6.65X7.5,-,DC5VSW2 3403-001001 SWITCH-PUSH;5V,5mA,-,OFF-ONSW3 3408-000323 SWITCH-SLIDE;SSSS712GD011/12VDC 100ma
Loc.No Part No Description ; Specification Remark
9-8 Samsung Electronics
Electrical Parts List
Loc.No Part No Description ; Specification Remark
Samsung Electronics 10-1
10. Block Diagram
DECK ASS'Y
DiscMotor
Disc MotorDriver
Actuator &Motor Driver
FeedMotor
DIC2 4M DRAM VIC4/10 32M SDRAM
2K EEPROM
Pick-UP& I/V Amp
Remote Control
AMP
AMP
AMP
Coaxial
LT
RT
YoutCout
SIC1(KS1452)
Digital Servo
DIC1(KS1453)
DVD & CD Processor
RIC1(KS1461)
RF Amp & DPD
MIC8 8M EPROM MIC1(TMP93CM41F)Main Controller
FIC1(LC86P6232)
Front Controller
VIC1(ZiVA-3)
A/V Decoder
VIC50(SAA7128)
Video Encoder
AIC1(AK4324)
Audio DAC
CVBS
LPF
LPF
AMP
AMP
AMP
AMP
AMP
Y
Pb
Pr
Block Diagrams
10-2 Samsung Electronics
MEMO
Samsung Electronics 11-1
11. PCB Diagrams
11-2
11-3
11-4
11-4
11-4
11-1 Main - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-2 Jack - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-3 Power - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-4 Play - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-5 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
PCB Diagrams
11-2 Samsung Electronics
11-1 MainCO
MPO
NEN
T SI
DE
SOLD
ER S
IDE
PCB Diagrams
Samsung Electronics 11-3
11-2 Jack
PCB Diagrams
11-4 Samsung Electronics
11-5 Deck
11-4 Play
11-3 Power
Samsung Electronics 12-1
12. Wiring Diagram
JACK PCB
MAIN PCB
DECK PCB
PLAY PCB
POWER PCB
Wiring Diagram
12-2 Samsung Electronics
MEMO
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