Defect Tolerance for Yield Enhancement of FPGA Interconnect Using Fine-grain and Coarse-grain...

Defect ToleranceDefect Tolerancefor for Yield EnhancementYield Enhancementof of FPGA InterconnectFPGA InterconnectUsing Fine-grain and Using Fine-grain and

Coarse-grain RedundancyCoarse-grain RedundancyAnthony J. YuAnthony J. Yu Guy G.F. LemieuxGuy G.F. Lemieux

September 15, 2005September 15, 2005

2

OutlineOutline

Introduction and motivationIntroduction and motivation Previous worksPrevious works New architecturesNew architectures

Coarse-grain redundancy (CGR)Coarse-grain redundancy (CGR) Fine-grain redundancy (FGR)Fine-grain redundancy (FGR)

Experimentation ResultsExperimentation Results ConclusionsConclusions

3

Introduction and Introduction and MotivationMotivation

Scaling introduces Scaling introduces new new typestypes of defectsof defects

Smaller feature sizes Smaller feature sizes susceptible to susceptible to smaller smaller defectsdefects

Expected resultsExpected results Defects per chip increasesDefects per chip increases Chip yield declinesChip yield declines

FPGAs are mostly FPGAs are mostly interconnectinterconnect

FPGAs must tolerate FPGAs must tolerate multiple interconnect multiple interconnect defectsdefects to improve yield to improve yield (and $$$)(and $$$)

4

General Defect Tolerant General Defect Tolerant TechniquesTechniques

Defect-tolerant techniques minimize Defect-tolerant techniques minimize impact (cost) of manufacturing defectsimpact (cost) of manufacturing defects

FPGA defect-tolerance can be loosely FPGA defect-tolerance can be loosely categorized into three classes:categorized into three classes: Software Redundancy – use CAD tools to map Software Redundancy – use CAD tools to map

around the defectsaround the defects Hardware Redundancy – incorporate spare Hardware Redundancy – incorporate spare

resources to assist in defect correction (eg. resources to assist in defect correction (eg. Spare row/column)Spare row/column)

Run-time Redundancy – protection against Run-time Redundancy – protection against transient faults such as SEUs (eg. TMR)transient faults such as SEUs (eg. TMR)

5

Previous work – 1 – XilinxPrevious work – 1 – Xilinx Xilinx’s Defect-Tolerant ApproachXilinx’s Defect-Tolerant Approach

Customer (knowingly) purchases “less that perfect” Customer (knowingly) purchases “less that perfect” partsparts

Customer gives Xilinx configuration bitstreamCustomer gives Xilinx configuration bitstream Xilinx tests FPGA devices against bitstreamXilinx tests FPGA devices against bitstream

Sells FPGA parts that “appear” perfectSells FPGA parts that “appear” perfect Defects avoid the bitstreamDefects avoid the bitstream

Limitation:Limitation: Chips work only with given bitstream – no changes!Chips work only with given bitstream – no changes!

6

Previous work – 2 – Previous work – 2 – AlteraAltera

Altera’s Defect-Tolerant ApproachAltera’s Defect-Tolerant Approach Customer purchases “seemingly perfect” partsCustomer purchases “seemingly perfect” parts

Make defective resources inaccessible to Make defective resources inaccessible to useruser

Coarse-grain architectureCoarse-grain architecture Spare row and column in array (like memories)Spare row and column in array (like memories)

Defective row/column must be bypassedDefective row/column must be bypassed Use the spare row/column insteadUse the spare row/column instead

Limitation:Limitation: Does not scale well (multiple defects)Does not scale well (multiple defects)

7

ObjectiveObjective ProblemProblem

FPGA yield is on decline because of aggressive FPGA yield is on decline because of aggressive technology scalingtechnology scaling

Proposed SolutionsProposed Solutions Defect-tolerance through redundancyDefect-tolerance through redundancy

Important ObjectivesImportant Objectives Interconnect defects important (dominates Interconnect defects important (dominates

area)area) Tolerate multiple defects (future trend)Tolerate multiple defects (future trend) Preserve timing (no timing re-verification)Preserve timing (no timing re-verification) Fast correction time (production use)Fast correction time (production use)

BackgroundBackground

9

Island-style FPGAIsland-style FPGA

10

Directional Switch BlockDirectional Switch Block

11

Directional Switch BlockDirectional Switch Block

Course-grain Course-grain Redundancy Redundancy

(CGR)(CGR)

13

Coarse-grain Coarse-grain Redundancy (CGR)Redundancy (CGR)

Row

Dec

oder

Fault Free

Spare Row

Wire Extensions

Faulty

Defect

Row

Dec

oder

BypassedRow

F. Hatori et al., “Introducing Redundancy in Field Programmable GateArrays,” presented at Custom Integrated Circuits Conference, 1993.

14

So…what’s wrong with it?So…what’s wrong with it?

Spare Row and Column

0

0.2

0.4

0.6

0.8

1

1.2

1 10

Number of Defects

Yie

ld

32x32

64x64

128x128

256x256

15

Improving yield for CGR –Improving yield for CGR –Adding Adding Multiple GlobalMultiple Global

SparesSpares Add multiple Add multiple

globalglobal spare to spare to traditional CGRtraditional CGR

Global spares can Global spares can be used to repair be used to repair any defective any defective row/column in the row/column in the arrayarray

Wire extensions Wire extensions are now longerare now longer

16

Yield Impact of Multiple Global Yield Impact of Multiple Global SparesSpares

Global Spare Rows+Columns (32x32)

0

0.2

0.4

0.6

0.8

1

1.2

1 10Number of Defects

Yield

Baseline2 Global4 Global

17

Increasing Area+Delay Increasing Area+Delay OverheadOverhead

1 GLOBAL SPARE

2 GLOBAL SPARES

4 GLOBAL SPARES MAY BE IMPRACTICAL

!!!

NO SPARES

MORE SPARES MORE MUX OVERHEAD IN EVERY SWITCH

ELEMENT

18

Improving yield for CGR –Improving yield for CGR –Adding Adding Multiple LocalMultiple Local

SparesSpares Divide FPGA into Divide FPGA into

subdivisionssubdivisions

Each subdivision has Each subdivision has locallocal spare(s)spare(s)

DistributesDistributes spares across spares across chipchip Reduces mux area overheadReduces mux area overhead

(of Global scheme)(of Global scheme)

Limitation:Limitation: Spare(s) can only repair defect Spare(s) can only repair defect

withinwithin the subdivision the subdivision

19

Yield Impact of Multiple Local Yield Impact of Multiple Local SparesSpares

(not as good as Global with same # (not as good as Global with same # spares)spares)

Local Spare Rows+Columns (32x32)

0

0.2

0.4

0.6

0.8

1

1.2

1 10Number of Defects

Yield

Baseline2 Global4 Global2 Sub, 1 Spare4 Sub, 1 Spare

Fine-grain Fine-grain Redundancy Redundancy

(FGR)(FGR)

21

Our Proposed SolutionOur Proposed SolutionFine-grain Redundancy Fine-grain Redundancy

(FGR) – Defect Avoidance (FGR) – Defect Avoidance by Shiftingby Shifting

DefectSpare

a) Original b) Corrected

+1

+1 -1-1

-1+1

22

Defect-tolerant Switch Defect-tolerant Switch BlockBlock

-1 0-2

+1 0+2

-10

-2

+10

+2

-1 0-2

+1 0+2

-10

-2

+10

+2

omux

imux

a) Original b) Defect-tolerant

23

HSPICE SchematicHSPICE Schematic

16:1MUX

...

...

3:1MUX

4:1MUX

omuximux

Bypass pathDirectionalmultiplexer

24

Switch Implementation Switch Implementation OptionsOptions

• Several detailed implementations are possible• Trade off area / delay / yield(repairability)

25

Defect Avoidance –Defect Avoidance –Switch Implementation Switch Implementation

Option 1Option 1Can avoid contention by pre-shifting the red signal… OR…

[ lower area overhead, lower yield improvement ]

26

Defect Avoidance –Defect Avoidance –Switch Implementation Switch Implementation

Option 2Option 2…OR … can avoid contention by embedding the IMUX

[ higher area overhead, best yield ]

27

Single-length DefectsSingle-length Defects

OMUX

EnhancedSwitch Block

Equivalent Faults

OMUX

EnhancedSwitch Block

Wire Driver

28

Double-length DefectsDouble-length Defects

OMUX

EnhancedSwitch Block

Equivalent Faults

OMUX

EnhancedSwitch Block

29

Minimum Fault-free Radius Minimum Fault-free Radius (MFFR)(MFFR)

30

Experimentation ResultsExperimentation Results

AreaArea DelayDelay Area Delay ProductArea Delay Product YieldYield SummarySummary

31

Estimated Area overhead at Estimated Area overhead at equal yield (80%)equal yield (80%)

* CGR-G1 can only tolerate 1-2 defects

32

Area Overhead for Varying Area Overhead for Varying Wire LengthWire Length

33

Area ResultsArea Results

34

Delay ResultsDelay Results

35

Area-Delay ProductArea-Delay Product

36

Yield – 1Yield – 1Switch Implementation Affects Switch Implementation Affects

Yield Yield

* Assumes all bridging defects

37

Comparison between FGR and Comparison between FGR and CGR – FGR Tolerates Tens of CGR – FGR Tolerates Tens of

DefectsDefectsFine-grain Redundancy(Best Yield Architecture)

0

0.2

0.4

0.6

0.8

1

1.2

1 10 100Number of Defects

Yield

CGR

32x32

64x64

128x128

256x256

38

Yield for Varying Wire Yield for Varying Wire LengthLength

39

Limitations of Study & Limitations of Study & ArchitecturesArchitectures

FGRFGR Does not tolerate defects in the logicDoes not tolerate defects in the logic Cannot tolerate clustered defectsCannot tolerate clustered defects Requires a detailed fault mapRequires a detailed fault map

CGRCGR Assumes that all defects can be Assumes that all defects can be

corrected with a single row/columncorrected with a single row/column Bypass circuitry is approximatedBypass circuitry is approximated

40

Summary of FGRSummary of FGR

41

ConclusionsConclusions CGR CGR is effective for 1 or 2 defects effective for 1 or 2 defects FGR meets desired objectives:FGR meets desired objectives:

Tolerates Tolerates multiplemultiple randomly distributed randomly distributed defectsdefects

Defect correction Defect correction does not perturb timingdoes not perturb timing Tolerates an Tolerates an increasing numberincreasing number of defects of defects

as array size increasesas array size increases Correction can be applied Correction can be applied quicklyquickly

FGR potentially capable of FGR potentially capable of correcting correcting crosstalkcrosstalk faults, but has not been faults, but has not been exploredexplored

Thank you!Thank you!

anthonyy@ece.ubc.caanthonyy@ece.ubc.ca