CCL Confidential 電信等級開放平台 AdvancedTCA 之技術趨勢與規格介紹 黃嘉淵...

CCL Confidential

電信等級開放平台AdvancedTCA 之技術趨勢與規格介紹

黃嘉淵 博士 工研院電通所

2005/12/02

CCL Confidential

Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport

MicroTCA and others

CCL Confidential

通訊產業海外產值增長趨勢

WLAN 全球佔有率與海外產值增長趨勢2001 2002 2003 2004

年產值(億新台幣) 167 216 504 514全球產量佔有率 60% 80% 91% 95%海外生產比重 0% 0% 17% 44%全球排名 1 1 1 1

SOHO Router 全球佔有率與海外產值增長趨勢2001 2002 2003 2004

年產值(億新台幣) 71 90 263 330全球產量佔有率 32% 39% 73% 75%海外生產比重 0% 18% 30% 75%全球排名 1 1 1 1

DSL CPE 全球佔有率與海外產值增長趨勢2001 2002 2003 2004

年產值(億新台幣) 181 216 230 327全球產量佔有率 34% 41% 65% 76%海外生產比重 3% 8% 18% 49%全球排名 3 2 1 1

Cable Modem 全球佔有率與海外產值增長趨勢2001 2002 2003 2004

年產值(億新台幣) 105 104 100 124全球產量佔有率 25% 32% 53% 53%海外生產比重 7% 9% 20% 51%全球排名 3 2 1 1

• 國內成熟的通訊產品近年來生產基地持 續外移， 其中包括了國內產值前三名的 產品， WLAN 、 SOHO Router 、 DSL CPE 。• 提升國內產值的策略為，持續研發高技 術性之通訊產品以提升國內廠商之技術 水準， 增加產品的附加價值，減低對低 勞工成本的依賴。

-

1,000

2,000

3,000

4,000

5,000

單位

：億

新台

幣

國內產值 1,023 1,431 1,432 2,359 2,303

海外產值 454 525 651 755 1,701

總產值 1,477 1,956 2,083 3,114 4,004

2000 2001 2002 2003 2004

Source: IEK 2005

CCL Confidential

網通產業的現況與升級契機

產業現況 台灣廠商以 SOHO/SME/CPE 端低價設備量產為主，利潤微薄 全球新興網路與服務佈建快速成長 , IP/Ethernet 為基礎建設之主流

電信等級基礎與應用設備將是高附加價值的重要市場 電信等級 (Carrier Grade) 技術為我國通訊產業升級之核心關鍵

產業升級契機 電信等級設備由私有 (Proprietary) 架構趨向標準開放架構 標準開放架構具備標準化及模組化之特性，有利於國內廠商切入原

為 Proprietary 封閉技術之電信設備市場，將造成產業供應生態結構性的改變，不再由少數大廠壟斷

國內產業現有 domain knowledge + 電信等級技術 切入 電信等級標準化模組 供應鍊

累積各種 電信等級標準化模組，建立標準開放平台技術能量促成各種高附加價值電信等級設備與應用服務產業發展

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開放架構平台的影響- 更專注於提供創新的 Total Soultion

Proprietary HardwareProprietary Hardwareand ASICsand ASICs

Platform R&DPlatform R&D

Software & Solution R&DSoftware & Solution R&D

Validation & TestValidation & Test

Commercial ProcessorsCommercial Processors and Building Blocksand Building Blocks

Platform R&DPlatform R&D

Software & Software & Solution R&DSolution R&D

Validation & TestValidation & Test

傳統設備開發成本傳統設備開發成本

將注入更多的服務創新 將注入更多的服務創新 !!!!

利用標準模組快速建利用標準模組快速建立平台立平台

全心投入解決方案全心投入解決方案的開發的開發

開放架構設備開發成本開放架構設備開發成本

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ITU-TOCAF-CGOE

ASI-SIG

IEEE 802.3apBackplane Ethernet

PICMG 3.XAdvancedTCA

OSDLCarrier-Grade Linux

Service Availability ForumAIS/HPI/SMS specs

NG

N S

erv

ices &

Infra

structu

re電信等級開放平台相關標準

ProprietaryHardware

ProprietaryReal-time OS

ProprietaryHA Middleware

ProprietaryApplications

Network Element

ProprietaryProprietary

ProprietaryFabric/Silicon

Standards-BasedStandards-BasedOpen Commun. Arch.Open Commun. Arch.

Network Element

Proprietary & 3rd party Applications

HA Middleware

Std. App API

Std. Platform API

Standard HA Hardware

StandardCarrier Grade OS

Commercial Backplane Fabric/Silicon

AIS: Application Interface SpecAIS: Application Interface SpecHPI: Hardware Platform InterfaceHPI: Hardware Platform InterfaceSMS: System Management Spec.SMS: System Management Spec.OSDL: Open Source Development LabsOSDL: Open Source Development LabsNGN: Next Generation NetworksNGN: Next Generation NetworksSAF: Service Availability ForumSAF: Service Availability Forum

PICMG: PCI Industrial Computer Manufacturers GroupPICMG: PCI Industrial Computer Manufacturers GroupAdvancedTCA/ATCA: Advanced Telecommunications Computing ArchitectureAdvancedTCA/ATCA: Advanced Telecommunications Computing ArchitectureASI-SIG: Advanced Switching Interconnect Special Interests GroupASI-SIG: Advanced Switching Interconnect Special Interests GroupOCAF: Open Communications Architecture ForumOCAF: Open Communications Architecture ForumCGOE: Carrier Grade Open EnvironmentCGOE: Carrier Grade Open Environment

Standards BodiesStandards Bodies

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開放架構模組化之彈性組合

GbE

I/FQ

uad OC

-3c I/F

GbE

Sw

itchG

bE S

witch

Com

pute Module

SS

7 Processor

E1/D

S1 I/F

SGSNSGSN

CG Linux

RT

U (D

SP

or NP

U)

GbE

I/FQ

uad OC

-3c I/F

DP

Sw

itchD

P S

witch

Com

pute Module

SS

7 Processor

E1/D

S1 I/F

RNCRNC

CG Linux

IWF

GbE

I/FQ

uad OC

-3c I/F

DP

Sw

itchD

P S

witch

Com

pute Module

E1/D

S1 I/F

MediaMediaGatewayGateway

CG Linux

Carrier C

ard

Disk M

odule

GbE

Sw

itchG

bE S

witch

Com

pute Module

BladeBladeServerServer

CG Linux

共通之機架 , OS, & 平台軟體

Chassis Middleware

CG Linux

Operating System Applications

Platform Software

Com

pute Module

GbE

Sw

itch

Carrier C

ard

Disk M

odule

RT

U (D

SP

or NP

U)

GbE

I/F

Quad O

C-3c I/F

DP

Sw

itch

SS

7 Processor

E1/D

S1 I/F

IWF

Blades

可重覆使用之模組

SGSN:Serving GPRS Support NodeRNC: Radio Network Controller

CCL Confidential Source: Intel

CCL Confidential

電信等級開放平台市場趨勢

ATCA revenues in various market segments ($B)

0

2

4

6

8

10

12

14

2004 2005 2006 2007 2008 2009Year

Medical/Industrial

Military

Enterprise

Communications ATCA CAGR in:Communications =104.9%Enterprise >220%

Carrier Grade characteristicsalso fit Enterprise’s needs

Open Std. Chassis market**:

CAGR=54.4%

ATCA’s CAGR = 104.9%

ATCA’s share in 2009 = 64.5%

ATCA is the main stream of OSC in Co

munications

* Other OSCs include CompactTCA, MicroTCA, VMEbus, and BladeCenter ** Market segments counted for OSC:Service Provider Edge/Core, DSLAMs,VoIP GW, SoftSW, MultiService Switches, IP Service Switches, GE Switches, Voice Switches, Telco Servers, MSPPs, Cellular Infrastructure Equipment, Other.

CAGR = Compound Annual Growth RateSource: In-Stat, 02/05

Revenues for various Open Std. Chassis ($B)

0

2

4

6

8

10

12

14

2004 2005 2006 2007 2008 2009

Other OSCs*

CompactPCI

AdvancedTCA

CCL Confidential

ATCA ShelfATCA shelves are designed to fit 19,23-inch,or ETSI cabinets and provide between 2 and 16 slots.

Sources :Motorla 14 slots(left), Schroff 5 slot(right))

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ATCA Components

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RadiSys and Continuous Computing Shelf

RadiSys Promentum ATCA-3000

Continuous Computing FlexChassis ATCA-5U-5(left) ATCA-12U-14

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PICMG history PCI Industrial Computer Manufacturers Group (PICMG) PICMG's original mission was to extend the PCI standar

d for computer systems

PICMG (founded in 1994) over 450 companies http://www.picmg.org

PICMG Europe: 61 members http://www.picmgeu.org/

PICMG Japan 27 members http://www.picmg-japan.com

PICMG China (1998-02-20 founded) 25 members http://www.compactpci-systems.com/columns/picmg/china.html

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PICMG 1.X

Specifications: PCI/ISA (1.0)-1994, 13 page

PCI-ISA card edge connector proposal for single board computer

PCI/ISA Bridging (1.1)-1995, 21 page PCI-PCI bridge board specification for single board

computer

PCI Only (e-PCI-X) (1.2)-2002, 34 page Embedded PCI-X specification for system host boards

and backplanes supporting single or dual PCI-X busses

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CompactPCI(PICMG 2.X)

Specifications: PCI/ISA(1.0) -> CompactPCI(2.0) 2.0->2.20 2.50 CompactTCA

CompactPCI objectives CompactPCI use industry standard mechanical co

mponents and high performance connector technologies to provide an optimizes system intended for rugged applications

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What is AdvancedTCA?

Specifications: PCI/ISA(1.0) -> CompactPCI(2.0) -> AdvancedTC

A Serial Interconnect(3.0)

Advanced Telecommunication Computing Architecture (AdvancedTCA) PICMG 3.X family of standards

Primary application focus: Telecom Carrier Grade applications based on stan

dard fabric solutions

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AdvancedTCA Standards

Base Spec (PICMG3.0) covers mechanical, power, cooling, interconnect of the AdvancedTCA family of specs ratified 12/30/2002

Subsidiary specs: 3.1: Ethernet and Fiberchannel Transport 3.2: InfiniBand Transport 3.3: StarFabric Transport 3.4: PCI Express Transport 3.5: Serial RapidIO

Additional PICMG efforts: AMC.0 AdvancedMC Mezzanine Module AMC.1 PCI Express and AS on AMC AMC.x Ethernet on AMC AMC.y Fibre Channel on AMC AMC.z Serial ATA on AMC SFP.0 System Fabric Plane

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AdvancedTCA Standards

Source: Intel

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

CCL Confidential

ATCA Mechanical Requirements

Targeted for 16 slot shelves in 600 mm ETSI cabinets 14 slots will fit in an EIA 19” cabinet 23” telecom cabinets also supported

Large enough board for future requirements Increased board pitch and room for SMT components

on rear side Cooling for 200W per board No exotic (expensive) cooling systems Reliable mechanics

Serviceability, shock and vibration EMC

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Chassis Mechanical

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Chassis Mechanics

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Board Mechanics

Front board size 8U x 280 mm

Rear board size 8U x 70 mm Connects directly to front bo

ard Board width 6HP (1.2”) PCB thickness: 1.6mm - 2.4

mm allowed Simplified Telecom Packagin

g Provisions for 4 PMCs Provisions for 8 AMCs Alignment/Key pins

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AMC Mechanics

New mezzanine for ATCA carriers

12V power source 60 W maximum dissipation 181.5 mm deep modules Single/double width module

73.8 mm wide for single width

148.8 mm wide for double width

Half/full height modules 13.88 mm high for half

height 28.95 mm high for full height

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Board Mechanics, Component Height

21.33 mm maximum component height on side 1

maximum component height on side 2 depends on the board design

~1.99 mm with flexible side 2 cover and 1.6 mm PCB

~1.19 mm with flexible side 2 cover and 2.4 mm PCB

~2.45 mm with 1 mm rigid side 2 cover and 1.6 mm PCB

~1.65 mm with 1 mm rigid side 2 cover and 2.4 mm PCB

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Chassis Mechanics, Sheet Metal

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Board Mechanics, ESD Discharge Strips

ESD discharge strips on bottom edge of Front Board and RTM Segment 1: 10 MOhms to Face Plate

Discharges installer Segment 2: 10 MOhms to Logic Ground

Discharges board Segment 3: 0 Ohms to Face Plate

Solid ground even if the board is not mated with the backplane

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Board Mechanics, Alignment & Keying

Four stages of alignment Subrack Guide Rails Backplane alignment/key pi

ns Front Panel alignment/key pi

ns Connectors

Front Board key (A1) RTM key (rA1) Front Board to RTM key (A2) Eight key and receptacle pos

itions 64 possible combinations

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

CCL Confidential

Purpose of Shelf Management

Monitor & control low-level aspects of ATCA boards and other Field Replaceable Units

Watch over basic health of the shelf, report anomalies, take corrective action when needed

Retrieve inventory information & sensor readings Receive event reports and failure notifications from b

oards and other intelligent FRUs Manage power, cooling & interconnect resources (ele

ctronic keying) Enable visibility into a shelf for a logical System

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System Management view

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Typical Shelf-Management Modules

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FRU

Field Replaceable Unit (FRU) Define two types of FRUs

Intelligent FRUs include IPM Controller Managed FRUs are either Intelligent or represente

d by an Intelligent FRU Directly attaches to IPMB-0 must an Intelligen

t FRU IPMC may implement additional FRUs Sensor Data Records (SDRs)

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Internet Protocol based services

Simple Network Management Protocol Remote Boot Disk Services Web-Based Enterprise Management

Protocol Remote Management Control Protocol

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IPM Controller Interfaces

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

CCL Confidential

Power Requirements

-48/-60 VDC power input -40.5 to -57 VDC, -50 to -72 VDC Redundant power inputs Distribution of ringing voltages Capacity of over 3,200 Watts per shelf Local power conversion DC-DC converters on each board

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Power Distribution

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Zone 1 Connector

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Board power sequencing

Power and ground sequencing 1. ESD segment #1 and the Guide Rail provide the

first electric contact 2. The first pins to mate in the power connector

are the logic and Frame/Shelf Grounds and the EARLY_A; EARLY_B;VRTN_A; and VRTN_B pins.

3. The last pins to engage in the power sequence are the enable pins ENABLE_A and ENABLE_B

Management power(<10W) Payload power

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Board power sequencing

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

CCL Confidential

Shelf – Cooling

200 Watts per slot

– Dual slot up to 400 Watts

Airflow Direction Bottom to top Right to left

Minimum requirement to support 5 W RTMs

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How much flow per slot

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Slot operating point

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

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Data transport zone (Zone 2)

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Base and Fabric Channels

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Zone 2 Backplane Interfaces Base Interface

10/100/1000 BASE-T Ethernet Dual Star fabric topology

Fabric Interface SERDES (3.125 Gbps min) 1x, 2x, or 4x Channels Star or Mesh fabric topology Interoperability defined by subsidiary specifications

Synchronization Interface Three dedicated clock interfaces(8kHz, 19.44 MHz, user define

d) Redundant buses MLVDS signaling

Update Channel Point to point connection between two slots

CCL Confidential

ATCA backplane communication topologies

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Agenda

Preface What is AdvencedTCA Mechanical Shelf management Power distribution Thermal Data transport MicroTCA and others

CCL Confidential

Micro TCA

4U*19-inch shelf(left),8-inch modular cube(right)

Micro TCA take advantage of the opportunity by AMCs to form a small chassis at very little cost .The full specification for Micro TCA is still discussion within PICMG

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Typical Switch Blade

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CPU/Server Blades

This is a basic ATCA blade,providing a general purpose CPU and standard ATCA base interface. There are most CPU blade shipping today

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Networking BladesFor telecom applications the networking blades are the key part of ATCA system.below show a networking blades with RTM

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AMC/PMC Carrier BladesAll carrier blades available today support either four AMC(Advanced Mezzanine card) modules or four PMC/PTMC modules

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Thank you!

Email: ricehuang@itri.org.tw

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Supplement (1/4)

Another important function Electronic Keying IPMC contains FRU information Shelf mngt via IPMB to the IPMC, then IPM

C enable the only compatible interface System manage

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Supplement (2/4)

ATCA board and shelf manager IPM Controller attached to IPMB Special Shelf Management Controller

Watch over managed devices Handle hot-swap events IPMI’s BaseBoard Mngt Ctrler(BMC) Negotiate power budgets Initiates changes in fan level

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Supplement (3/4)

IPMB-A & IPMB-B aggregation as IPMB-0

Shelf mngt Power and cooling Discovery state: mngt collection info Normal Op: mngt await event Abnormal Op: FRU reguest event

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Supplement (4/4)

Addressing Hardware Address Intelligent Platform Management Bus

Address Physical Address Shelf Address

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J23/P23 connector for Node Boards/Slots

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J23/P23 connector for Hub Boards/Slots

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Base Interface Dual Star routing

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Full Mesh Backplane routing assignments

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Dual Star Backplane routing assignments