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BCI-ROM FMU
Simcenter Flotherm
Byron Blackmore,
Electronics Cooling Product Manager
Where today meets tomorrow
Simulation of Power Electronics
Example
Unrestricted © Siemens 2020
2020-MM-DDPage 3 Siemens Digital Industries Software
Power Electronics – Use Cases
◼ Automotive electronics are subject to a wide
range of operating and thermal conditions.
◼ Transient power dissipation depends on
vehicle speed/acceleration, motor speed/characteristics, driver preferences and
system design.
◼ Challenge: Generate electronics device
temperatures accurately and rapidly enough
to robustly explore reliability and
performance.
Unrestricted © Siemens 2020
2020-MM-DDPage 4 Siemens Digital Industries Software
Power Electronics Temperature Prediction
◼ 1D Simulation tools are fast enough to support very complex
transient use cases, and are already used to model many aspects of
electric vehicle systems, including the calculation of module power
dissipation.
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2020-MM-DDPage 5 Siemens Digital Industries Software
Power Electronics Temperature Prediction
◼ However, 1D tools cannot adequately
model the thermal aspects of power
electronics modules. They are typically 3D
in nature, and often thermally coupled with other heat sources in the system.
Simcenter Flotherm model of an IGBT module
◼ This has often necessitated the use of full 3D CFD simulation tools to
calculate device temperatures and temperature variations.
◼ For complex transient power profiles, this results in very long
computation times and slow design cycles.
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2020-MM-DDPage 6 Siemens Digital Industries Software
Power Electronics Temperature: The Way Forward
◼ The recent introduction of Boundary Condition Independent
Reduced Order Models (BCI-ROMs) to industry offers an opportunity
to bring together the accuracy of 3D thermal models and the speed
of 1D simulation.
◼ Here we introduce a work flow to provide Flotherm BCI-ROMs in the
industry standard FMU format for use in 1D simulation tools. 1D
tools can then calculate temperatures for power electronics in real
world conditions, allowing full design space exploration without compromising on accuracy or simulation speed.
FMI and BCI-ROMs
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BCI-ROM Overview
◼ Simcenter Flotherm BCI-ROMs:
◼ Support multiple heat sources
◼ Accurate with any HTC
◼ Accurate for all transient time scales
◼ Solved up to 100,000x faster than CFD
◼ Inputs: Powers, HTCs, and Ambient
Temperatures
◼ Outputs: Temperatures and Peripheral Heat Flows.
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2020-MM-DDPage 9 Siemens Digital Industries Software
Functional Mock-up Interface (FMI)
◼ The FMI standard https://fmi-standard.org is an open format for sharing simulation models.
◼ The standard specifies two types of FMU (Functional Mock-up Unit):
◼ Model Exchange and Co-Simulation
◼ The FMU Export from Simcenter Flotherm is the Co-Simulation type.
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2020-MM-DDPage 10 Siemens Digital Industries Software
What tools can import Co-Simulation FMU?
◼ 60+ tools, including:
◼ Simcenter AMESim
◼ Simcenter Flomaster
◼ Ansys Simplorer
◼ Matlab Simulink
◼ GT-Suite
◼ And more
◼ See https://fmi-standard.org/tools for the full list
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2020-MM-DDPage 11 Siemens Digital Industries Software
Generating BCI-ROM FMUs
◼ Workflow: Create BCI-ROM, then convert to FMU
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2020-MM-DDPage 12 Siemens Digital Industries Software
BCI-ROM FMU Example: Simcenter Flomaster
Liquid Cold Plate and IGBT Module
FMU: BCI-ROM
Device Powers
Heat Transfer Coefficients and Fluid Temperatures
Heat Flows
1D Cold Plate Channel Network
Flow Rate
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2020-MM-DDPage 13 Siemens Digital Industries Software
BCI-ROM FMU Example: Simcenter Amesim
Electronics Topology and EV Performance
FMU| BCI-ROM
(High Accuracy, 100,000x
Faster transient sim)
Junction
Temperature
Cold Plate
Temperature
Coolant Inlet
Temperature
Reliability
EV Range Calculation
Battery Discharge Calculation
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2020-MM-DDPage 14 Siemens Digital Industries Software
Summary
◼ Enabling 1D tools to incorporate accurate 3D thermal BCI-ROMs greatly accelerates the design process and improves product reliability. Simulation
data is generated quickly enough to allow design space exploration of complex systems while fully considering temperature, reliability and system design.
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