3D electronic packaging for IoT devices from …...Tobias Tiedje & Friedrich Hanzsch 3D...

Tobias Tiedje & Friedrich Hanzsch

3D electronic packaging for IoT devices – fromprototype to series production

Electronic Packaging Lab (IAVT)

Technische Universität Dresden

Outline

• The Challenges of 3D Packaging

• The Challenge of High Frequency Connections

• The Solution – The KONEKT Approach

• Current Demonstrators

The Challenges of 3D Packaging

The Challenges of 3D Packaging

3D System-in-PackageNormal System-in-Package on PCB

Why 3D Electronic Packaging?

Advantages:

- Miniaturization

- Heterogeneous Integration

- Package as Functional Component

- Larger Freedom in Design

RF Packaging – The Classical Approach

0 1 0 1 0 0 1 0

Signal at high frequencyInput Output

? ? ? ? ? ? ? ?

RF Packaging – The Classical Approach

0 1 0 1 0 0 1 0

? ? ? ? ? ? ? ?

Signal at high frequencyInput Output

The Solution – The KONEKT Approach

RF Packaging – The KONEKT Approach

0 1 0 1 0 0 1 0

Signal at high frequencyInput Output

0 1 0 1 0 0 1 0

The KONEKT Approach - Customization

Free choice of arrangement, distance and vendor

Free placement ofelectronic

componentsWhat we do:

Your advantage:

The KONEKT Approach - Customization

Free choice of arrangement, distance and vendor

Free placement ofelectronic

components

Any shape of package bycustomer needs onlyavailable in 3D, e.g.

trenches and canals forsensors

What we do:

Your advantage:

Adaption of package sizeneeds esp. miniaturization

The KONEKT Approach - Customization

Free choice of arrangement, distance and vendor

Variations in device can beequalized in package, whichincreases yield and reduces

costs

Free placement ofelectronic

components

Any shape of package bycustomer needs onlyavailable in 3D, e.g.

trenches and canals forsensors

Customizedproduction

available for eachindividual package

What we do:

Your advantage:

Adaption of package sizeneeds esp. miniaturization

The KONEKT Approach - Customization

Free choice of arrangement, distance and vendor

Flexible copper connectionsallow high frequency

applications

Variations in device can beequalized in package, whichincreases yield and reduces

costs

Free placement ofelectronic

components

Any shape of package bycustomer needs onlyavailable in 3D, e.g.

trenches and canals forsensors

Customizedproduction

available for eachindividual package

Connection ofcomponents with low

temperaturemetallization and

structuring

What we do:

Your advantage:

Adaption of package sizeneeds esp. miniaturization

The KONEKT Approach – Batch Production

Customization

Current Demonstrators

Electro Optical Fluidic Demonstrator

Electro Optical Fluidic Demonstrator

Customized VIAS for microfluidic applications, or coolingpurposes

Customization regarding shape and colour

Reconnection to PCB possible

Perfect Tracebility by individual marking of every product

ISO 25178

Surface parameters

Sq 0,03 µm

Ssk -1,45

Sku 8,69

Sp 0,11 µm

Sv 0,29 µm

Sz 0,40 µm

Sa 0,02 µm

Surface properties of the embedding process

Integration of components in package with low surface roughness

Package

materialLaser driver

Laser

(VCSEL)

Topography level (+/- 2 µm) and low tilt of components

Same roughness as individual components

Electro Optical Fluidic Demonstrator

Embedding material

0201 LED package

Cross-section polymer

LED

-Pac

kage

02

01

LED

Cross-section of electric contact in package

High quality electric connection of package

20 µm200

500

1000

2000

2000+100

50 µm

Commercial LEDPCB Via

20 µmAdditive Copper on Package

TST cycles

Conditions:-20°C – 85°C1-2000 cycles-40°C – 125°C>2000 cycles

Thermal Shock Test (TST) of package including electric connection

KONEKT Technolgy enables:

Combination of series production andmanufacturing (Lotsize 1)

Less resourcesLess energy

Lower costs forpackage prototypes

Compact package size

High frequency copperinterconnects

Free combination ofelectrical, mechanicaland optical components

Tracebility

Fast production time

Who we are

Who we are

Dr. Andreas Krause, DI Sebastian Lüngen, MSc. Friedrich Hanzsch, DI Tobias Tiede

We are a Start-up at the Electronic Packaging Lab (IAVT)of TU Dresden with world class research possibilities

The project "Kontaktierung eingebetteter Komponenten als Technologielösung", in short: KONEKT (FKZ: 03EFMSN148) is funded under the EXIST program by the Federal

Ministry for Economic Affairs and Energy and the European Social Fund.

Thank you very much for your kind attention!Find further information at:

https://www.avt.et.tu-dresden.de/forschung/projekte/konektor

konekt@avt.et.tu-dresden.de