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DOW EPOXY BUILDING BLOCKS=
UNLIMITED POSSIBILITIES FOR THE COMPOSITE INDUSTRY
THE DOW CHEMICAL COMPANY IS A GLOBALLY LEADING SUPPLIER OFINDUSTRIAL RAW MATERIALS FOR MANY APPLICATIONS. OVER THE LASTDECADES DOW HAS ESTABLISHED ITSELF AS A MAJOR GLOBAL PRODUCER
TOF HIGH QUALITY EPOXY PRODUCTS. THE CHEMISTRY OF SOME BUILDINGBLOCKS WILL BE EXPLAINED AND THEIR RELATION TOWARDS PRODUCTPROPERTIES SUCH AS MECHANICAL STRENGTH AND TEMPERATURERESISTANCE (E.G. GLASS-TRANSITION TEMPERATURE)..
Composite-Expo - 20147th International Specialized Exhibitionon composite materials and technologiesMoscow, RussiaToine Dinnissen, February 25th 2014
Outline
The Dow Chemical CompanyThe Dow Chemical Company• Epoxy business & Commitment,
Epoxy Compositespo y Co pos es• Bisphenol-A Epoxy Resins• Curing Agents
l P t lif / hi h fl ibilit– long Pot-life / high flexibility– high temperature resistance
• Bisphenol-F Epoxy Resin• Epoxy Novolac Resins• Curing
– Gelation– Gelation– Crosslink Density– Glass Transition
Toine Dinnissen, February 25th 2014
• New development Novolac
The Dow Chemical Company
• Founded in 1897 by Herbert H. Dow in Midland, Michigan• Supplies broad range of products / services in about 160 countries• More than 5,000 products manufactured at 188 sites in 35 countries• Employs 52,000 employees worldwide
A l l f $57 billi (2013 +1%)• Annual sales of $57 billion (2013 = +1%)• $1.7B in R&D investment (2012)
Our MissionTo passionately innovate what is essential to human progress by providing sustainable solutions to our customers
2010 – Dow becomes a Worldwide Partner and the “Official Chemistry Company” of the Olympic Games
Toine Dinnissen, February 25th 2014
of the Olympic Games
Dow Epoxy
•The world’s largest producer of epoxy resins & intermediates.• Broad product mix & strong global presence.• Eight manufacturing facilities in:Eight manufacturing facilities in:
• Asia Pacific – China, Korea• Europe – Germany, Italy• Latin America – BrazilLatin America Brazil• North America – USA
• Backward integration into feed-stocks that allows consistent,reliable product supplyreliable product supply.
• Almost 60 years of industry service• Strong commitment to product technology & solution innovation
Strong re investment in the business• Strong re-investment in the business• Continuously improving our business to:
• maintain reliable partner for our clients
• create shareholder value
Toine Dinnissen, February 25th 2014
• create shareholder value
Epoxy Products in Composites
Features:• Excellent adhesion to many (difficult) substrates• Low shrinkage upon cure• Excellent Chemical Resistance• Excellent Mechanical Properties• Good Heat ResistanceGood Heat Resistance• …
Often used to produce light weight composite parts that can replace metal articles.e g FRP pipes automotive parts storage tanks wind mill blades e.g. FRP pipes, automotive parts, storage tanks, wind-mill blades, ….
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Mechanical Properties ComparisonBlack Steel Stainless Steel Hastelloy® C GRPBlack Steel Stainless Steel
316Hastelloy® C GRP
(Mat & Roving)Density [gr/cm3] 7.8 7.9 8.9 1.5Tensile Modulus [GPa] 207 193 180 10 15Tensile Modulus [GPa] 207 193 180 10-15
Tensile Strength [MPa] 450 590 550 120-250
Heat Conductivity [W/mºC] 46 15 12 0.2
Thermal Expansion Coefficient [mm/mm ºC]x10-6
12 16 12 23
PE PP PVC PVDF GRPDensity [gr/cm3] 0.95 0.90 1.4 1.75 1.5Tensile Modulus [MPa] 80 80-130 300-350 1200 10 000-15 000Tensile Modulus [MPa] 80 80 130 300 350 1200 10,000 15,000
Tensile Strength [MPa] 30 30 60 50 120-250
Heat Distortion 40 45 75-100 90 100-200
Toine Dinnissen, February 25th 2014
Temperature [ºC]
All data are typical data and not to be construed as specifications
Fibre Reinforced Composites
Property Epoxy Unsaturated Polyester (UPR) and Epoxy Vinyl Ester Resin (EVER)
Phenolic
Cure mechanism Polymerization of resin plus hardener
Catalytic copolymerization
CondensationPolymerizationplus hardener copolymerization Polymerization
(produces water)Wet impregnation, typical
systemLiquid resins plus amine
or other hardenersStyrene-modified resins plus peroxide
catalystsLiquid phenolics plus acid
catalystsCure temperature (°C) 25 150 25 100 25 170Cure temperature (°C) 25-150 25-100 25-170
Typical cure time (min) 60-180 10-60 60-180Stability of resin (alone) Excellent Fair Poor
Cure shrinkage of system Low (2 3%) High (6 8%) HighCure-shrinkage of system Low (2-3%) High (6-8%) High
Adhesion to metal Excellent Fair Fair
Physical properties of cured laminate
Excellent Excellent Excellent/Bad (best heat resistance, most brittle), )
All data are typical data
Toine Dinnissen, February 25th 2014
All data are typical data and not to be construed as specifications
Epoxy Resin Route
Crude Oil Brine Salt
Naphta Electrolysis
Benzene Propylene CL2 NaOH
Cumene Allylchloride
OH O
OOH
HOClCa(OH)2
Cl
Acetone Phenol
EpichlorohydrinBisphenol-A
OH O
OHHO ClO
Polycarbonate Epoxy Resins
Toine Dinnissen, February 25th 2014
Standard Bisphenol-A epoxy resin
Bisphenol A
OCl
Epichlorohydrin
OCl
OHHOBisphenol A(A = Acetone)
Epichlorohydrin Epichlorohydrin
OOO O
DGEBA = Diglycidylether of Bisphenol A
BADGE = Bisphenol-A Diglycidylether
LER = standard liquid epoxy resin
D.E.R.™ 33X-series
Viscosity = ± 4000 mPa.s
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Higher Molecular Weight Species
ClO+
OHHO
Resin n=0NaOH
OOO O
Diglycidyl ether of bisphenol A (DGEBA)NaOH
NaOHOO
OHO
OOO
n
Diglycidyl ether of bisphenol A - Oligomer n=1,2,3...
Toine Dinnissen, February 25th 2014
Typically between 5 and 15%Increase in viscosity
Mono-Hydrolyzed Resin (alpha-glycol)
OOO O
O OHCl
O
H2O
Diglycidyl ether of bisphenol A (DGEBA) OH
1,2-Diol / α-Glycol
Monohydrolyzed Resin (MHR)
function
Typically between 0.1 and 5%
OO
OH
OHO
Increase in viscosityIncrease in OH groups – can have impact on wetting, adhesion and reactivityD i E F ti lit
Toine Dinnissen, February 25th 2014
Decrease in Epoxy Functionality
Bisphenol-A Liquid Epoxy Resins
D.E.R.™ 332 Epoxy Resin
D.E.R. 330Epoxy Resin
D.E.R. 331™ Epoxy Resin
Epoxide Equivalent Weight [gr/eq]A S TM D 1652
171 – 175 176 ‐ 185 182 – 192A.S.T.M. D‐1652
Viscosity @ 25 °C [mPa.s]A.S.T.M. D‐445
4000 – 6000 7000 ‐ 10000 11000 ‐ 14000
340 / average EEW 1 97 1 89 1 82340 / average EEW 1.97 1.89 1.82
Mix with D.E.H.™ 24 hardener [phr] 14.0 13.5 13.0
Mix‐viscosity @ 25 °C [mPa.s] 900 1250 2250
Time to gel, 500 grams [min] 43 40 25
Heat Deflection Temperature [°C] 107 104 111
with Nadic‐Methyl‐Anhydride [°C] 156
with BF3‐MEA [°C] 168
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Bisphenol-A Liquid Epoxy Resins
Resin D.E.R.™ 330 Epoxy Resin D.E.R. 331™ Epoxy Resin
D.E.H.™ 24 Hardener wt% Change wt% Change
Days; 7 28 120 7 28 120Days; 7 28 120 7 28 120
Sulphuric Acid (30%) 0.56 1.24 2.85 0.69 1.80 3.10
Acetone 0.17 0.74 4.48 0.45 2.10 7.70
Sodium Hydroxide (50%) 0.00 ‐0.06 ‐0.11 0.00 0.04 0.02
Jet‐fuel 0.03 ‐0.01 0.09 0.02 ‐0,01 0.09
Distilled Water 0.40 0.79 1.68 0.41 0.88 1.70
Thermal Degradation
Hours 100 200 300 500 100 200 300 500
eight loss @ 160 °C 0 95 0 95 1 32 1 41 0 71 1 00 1 40 1 60weight loss @ 160 °C 0.95 0.95 1.32 1.41 0.71 1.00 1.40 1.60
weight loss @ 210 °C 2.11 3.77 7.39 3.40 5.40 6.80 7.80
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Recent Innovation More FlexibilityRecent Innovation – More FlexibilityColor 30 APHAAmine number 472 mg KOH/gViscosity 15 mPa.s @ 25 °CDensity 0.96 g/cm3Mol. Weight 230AHEW 63 gr/eq
D.E.R.™ 330 epoxy resin 100 100
D.E.H.™ 23 amine hardener 32 25
IPDA ‐ 5
Mix‐viscosity [mPa.s @ 23°C] 320 620
Tg [°C]; DSC 90 98
D.E.H. 23
80
90
100Flexural Strength [MPa] 102 131
Flexural Modulus [GPa] 3.14 3.38
Tensile Strength [MPa] 66 9 73 8
50
60
70
80Tensile Strength [MPa] 66.9 73.8
Izod impact Strength [cm‐kg/cm] 7.08 8.17
Elongation at Break [%] 10.0 8.0
20
30
40
20 2 28 32 36 0
Glass Transition Temperature [°C]
Heat Deflection Temperature [°C]
Toine Dinnissen, February 25th 2014
20 24 28 32 36 40 44
Theoretical mixing Ratio : 31.1 phr D.E.R. 330 epoxy resinEmpirical mixing ratio : 32.0 phr D.E.R. 330 epoxy resin
™ Trademark of The Dow Chemical Company
Glass Transition Temperature, TgTg = The Temperature Range where a polymer changesTg = The Temperature Range where a polymer changesg p g p y g
from Glass to Rubber
* Secondary Bonds are Broken * Molecular Mobility Increases
g p g p y gfrom Glass to Rubber
* Secondary Bonds are Broken * Molecular Mobility Increasesy* Free Volume Increases* Strength Decreases* Flexibility Increases* Internal Stress is Relieved
y* Free Volume Increases* Strength Decreases* Flexibility Increases* Internal Stress is Relieved
25
30 Slow CureCure is diffusion controlled
Glassy
15
20 VitrificationFast Cure
Tg = Cure Temp.
Liquid /Rubber
5
10
When the Tg of the Growing Polymer Reaches the Cure Temperature, The Polymer VitrifiesExtend of cure is determined by the Tg, Average Functionality
Liquid /Rubber
Cure is KineticallyC t ll d
Toine Dinnissen, February 25th 2014
0
0 2 4 6 8 1 0 1 2 1 4Cure Time
te d o cu e s dete ed by t e g, e age u ct o a tyControlled
Recent Innovation High TemperatureRecent Innovation – High Temperature4,4'-Methylenedianiline (MDA) is a suspected carcinogen. It is included in the "substances of very high concern" list of the European Chemicals Agency (ECHA)
DiethyleneTolueneDiamine(ECHA).Pure methylenedianiline is a highly toxic, colorless solid.May be fatal if swallowed, inhaled or absorbed through skin. Causes irritation to the skin, eyes and respiratory tract. Combustible solid or liquid when heated. p y qMay cause methemoglobinemia. Affects blood, cardiovascular system, central nervous system, liver and kidneys and may cause cancer.
Ancamine DL-50 (MDA-blend)Highly viscous / solid = light to dark brown @ 50,000 - 55,000 mPa.s (AHEW = 51 gr/eq)
DETDALow viscosity liquid = clear amber liquid @ 100 200 mPa s (AHEW = 46 gr/eq)
Toine Dinnissen, February 25th 2014
Low viscosity liquid = clear amber liquid @ 100 - 200 mPa.s (AHEW = 46 gr/eq)Need 10% less per 100 kilo epoxyMuch lower viscosity = allows blending and use at much lowers temperatures (room temperature)
D.E.H.™ 650 Curing Agent
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
R t I ti Hi h T tL b li di EC Di i Recent Innovation – Higher TemperatureLabeling according to EC Directives:Hazard Symbol: Xn ‐ Harmful
N ‐ Dangerous to the EnvironmentRisk Phrases: R 21/22 ‐ Harmful in contact with skin and if swallowed.
R 48/22 ‐ Harmful: danger of serious damage to health by prolonged exposure if swallowedR 36 ‐ Irritating to eyes
ASTM D‐7903 point Flex
MDA Ref. D.E.H.™ 650
R 36 Irritating to eyes.R 50/5 ‐ very toxic to aquatic organisms, may cause long‐term adverse effect in aquatic environment
D E H ™ 650 hardener @ 37 °Cp
Tg (DSC, °C) 167 178
Flexural Strength [MPa]
110 116
D.E.H. 650 hardener @ 37 C
Modulus [MPa] 2707 3137
Strain [%] 8.3 6.3
Stress @ Break [MPa]
106 116[MPa]
K1c Fracture Toughness
0.76 0.61
MDA-reference @ 57 °C
Toine Dinnissen, February 25th 2014
Pot-life 150 grams
™ Trademark of The Dow Chemical Company
Bisphenol-F Epoxy Resins
OH OH
OCl
O
O
O
O
Bisphenol F(F = Formaldehyde)
EpichlorohydrinDiglycidylether of Bisphenol-F
O
OO
OO
O
O
O
O
O
O
para - para
O
OO
O
OO
nO
O
ortho - para
ortho - ortho
Toine Dinnissen, February 25th 2014
D.E.R.™ 354 liquid epoxy resin
™ Trademark of The Dow Chemical Company
Epoxy Novolac Resins
OH OHOH
O
O O
O O
O
OCl
+n
n
Phenol Novolac Epichlorohydrin Epoxy Novolac Resin
n = 0 - 0.2 for D.E.R.™ 354 liquid bisphenol-F epoxy resinn = 0.4 for D.E.N.™ 425 LIQUID epoxy novolac resinn = 0 8 for D E N 431 epoxy novolac resinn = 0.8 for D.E.N. 431 epoxy novolac resinn = 1.6 for D.E.N. 438™ epoxy novolac resinn= 1.8 for D.E.N. 439 epoxy novolac resin
Higher epoxy functionality ===> Higher crosslink density Excellent solvent/chemical resistance.Higher Temperature ResistanceGel at lower conversion
Toine Dinnissen, February 25th 2014
Gel at lower conversion
™ Trademark of The Dow Chemical Company
MTHPA versus DETDAD E H ™ 70 [MTHPA] D E H 650 [DETDA]D.E.H. 70 [MTHPA] D.E.H. 650 [DETDA]
Resin D.E.R.™ 330 D.E.N.™ 438™ D.E.R.™ 330 D.E.N.™ 438™
EEW [gr/eq] 176 – 185 176 - 181 176 – 185 176 - 181
Mix-ratio [phr] D.E.H. 70 / MI85 / 1
D.E.H. 70 / MI85 / 1
26.0 26.3
Cure Schedule; Hours @ °C 2 hrs @ 85 °C3 hrs @ 150 °C
2 hrs @ 85 °C2 hrs @ 150°C2 hrs @ 200 °C
2 hrs @ 120 °C2 hrs @ 177 °C
2 hrs @ 120 °C2 hrs @ 177°C2 hrs @ 225 °C2 hrs @ 200 C 2 hrs @ 225 C
Glass Transition Temperature [°C] 148 149 182 220
Coefficient of Linear Expansion [ppm/°C] 70 66 74 69
%Water Absorption, 2 weeks boil [%] 1.45 1.49 2.35 2.47
Flexural Strength [MPa] 128 138 108 110
Flexural Modulus [GPa] 3.27 3.51 2.64 3.06
Strain @ Yield [%] 6.7 6.7 6.9 6.1
Cured density [gr/cm3] 1.190 1.224 1.140 1.210
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Gelation versus Functionality
Active Groups per Molecule 2 Functional Epoxy Groups
OO
OHO
OOO
n
5 Functional Amine-Hydrogen Groups
Functionality ≤ 2 Linear Molecular Weight BuildFunctionality ≤ 2 Linear Molecular Weight Build
A A B B A A B B
A BNo Cross linking
Functionality > 2 Cross Linking
Toine Dinnissen, February 25th 2014
Functionality > 2 Cross LinkingCross linking leads to gelation
Gelation
∞Covalently Bonded Polymer Network
Molecular Weight Infinitely High∞Molecular Weight Infinitely High
Gel = “One” macromolecule
S l L l l i h f i
Polymer Properties develop at Gel-Point
Sol = Low molecular weight fraction
y p p
Solvent Soluble Solvent In-soluble
Sol Gel
M No Physical StrengthFluid Behavior50% of Shrinkage
Physical StrengthElastic Behavior50% of Shrinkage
Gel PointMonomers
Toine Dinnissen, February 25th 2014
Gel-point can be Predicted
/ Carothers: % Cure @ Gel Ξ 2 / favg
Flory: % Cure @ Gel Ξ 1[1 + (f-2)]1/2
Gelation is Controlled by Functionality
[1 + (f-2)]
react 3 moles of D E R ™330 epoxy resin = 6 reactive groupsreact 3 moles of D.E.R. 330 epoxy resin = 6 reactive groupswith 2 moles of amino-ethyl piperazine = 6 reactive groupsaverage functionality = 12 groups / 5 mole = 2.4Gel Point ~ 2/2.4 ~ 83% cure at Gelreact 7 moles of D E R ™330 epoxy resin = 14 reactive groupsreact 7 moles of D.E.R.™330 epoxy resin = 14 reactive groupswith 2 moles of tetra-ethylene-pentamine = 14 reactive groupsaverage functionality = 28 groups / 9 mole = 3.11Gel Point ~ 2/3.11 ~ 64% cure at Gelreact 14 moles of D.E.N.™425 epoxy resin = 35 reactive groupswith 5 moles of tetra-ethylene-pentamine = 35 reactive groupsaverage functionality = 70 groups / 19 mole = 3.68Gel Point ~ 2/3.68 ~ 54% cure at Gel
Toine Dinnissen, February 25th 2014
Gel Point 2/3.68 54% cure at Gel
Higher Functionality is Early Mould Release™ Trademark of The Dow Chemical Company
Crosslink Density:
High Crosslink DensityHigh Crosslink DensityHigh Crosslink DensityHigh Crosslink DensityHigh Chemical & Heat ResistanceStrong, RigidHeat Cure Needed
D.E.N.™438™
D.E.R.™324
Low Crosslink DensityLow Crosslink DensityModerate Chemical & Heat Resistance Flexible ToughFlexible, ToughCure at Lower Temperatures
Fl l St th 21 000 iHigh X-Link DensityD.E.R.™ 331 / Imicure(1) EMI 24Cure @ 150 °C
Flexural Strength 21,000 psiFlexural Modulus 540,000 psiElongation @ Break 2 %Glass Transition 160 °C3 h t b il 1 % t i
Low X-Link DensityD.E.R.™ 331 / Jeffamine(2) D-400C @ 30 °C
3 hr acetone boil 1 %wt gain
Flexural Strength 11,200 psiFlexural Modulus 406,000 psi
Toine Dinnissen, February 25th 2014
Cure @ 30 °C Elongation @ Break 60 %Glass Transition 30 °C3 hr acetone boil 29 %wt gain
™ Trademark of The Dow Chemical Company
Tg versus Cured Property
Tg < Service Temperature Tg > Service Temperature
Epoxy Cycloaliphatic Amine Epo Pol amide Epoxy-Cycloaliphatic Amine Cured @ 100°CTg = 110°CService Temperature 80°C
Epoxy-Polyamide Cured @ 25°CTg = 30°CService Temperature 40°C
Glassy, RigidLow Impact ResistanceHigh Internal StressHigher Barrier Properties
Rubbery, ToughHigh Impact ResistanceLow Internal StressLower Barrier Properties
Functionality TgGel PointCrosslinking
Gel PointDry TimePot Life
Chemical ResistanceStrength
RheologyChemical ResistanceShrinkage
% CureGlass/RubberInternal Stress
Toine Dinnissen, February 25th 2014
ShrinkageReactivity
D.E.N.™ 440 High FunctionalityEpoxy Novolac Resin
Part A D.E.N.™ 438™ epoxy novolac
D.E.N. 440 epoxy novolac
Epoxy Resin 80.2 80.2
Part B
D.E.N.™ 425 (f=2.5)
Part B
D.E.N. 431 19.8 19.8
DICY 5.6 5.6
UREA 2 8 2 8D.E.N. 431 (f=2.8)
D.E.N. 438™ (f=3.6)
UREA 2.8 2.8
Uncured rheology properties
D.E.N. 439 (f=3.8)
D.E.N. 440 (f=4.5 !!!)
η* @ 80oC (Pa*s) 1.5 6.4G* @ 1rad/s (MPa@25°C)) 0.005 0.21
Cured polymer tiproperties
Tonset (oC) 117 117
Tg (oC)160oC cured 193 215
Flexure Modulus (GPa) *2 93 *3 53
Toine Dinnissen, February 25th 2014
Flexure Modulus (GPa) 2.93 3.53
KIC (MPa*m0.5) *0.58 *0.52
™ Trademark of The Dow Chemical Company
SummaryThe Dow Chemical Company Epoxy business is Committed and Reliable partners for our Clients
• High Quality standard Raw Materials• D E R™ 33x epoxy resins• D.E.R 33x epoxy resins• D.E.N.™ 43x epoxy novolac resins• D.E.H.™ curing agents (incl. D.E.H. 70 anhydride hardener)
• Higher Temperature Performanceg p• D.E.H. 650 curing agent• D.E.N. 440 epoxy novolac resin• FORTEGRA™ epoxy toughening technology
• Viscosity• Diluents (mono-, di- or multi-functional); D.E.R.™ 7xx series• Bisphenol-F epoxy resin(s); D.E.R. 354, 351, 352
• Cure rate• Room temperature / Latent master-batch accelerated resins; D.E.R. 34xx• Long(er) pot-life amine hardeners (D.E.H™ 23 or D.E.H. 2132 curing agent)
Fl ibilit
Toine Dinnissen, February 25th 2014
• Flexibility• Amines (e.g. D.E.H. 23), diluents (e.g. D.E.R. 732P) or
D.E.R. 3913 Flexible epoxy resins™ Trademark of The Dow Chemical Company
Контакты
Meet us for face-to-face discussion at the EXPO; Booth G05
Дау Юроп, Московское ПредставительствоДмитрий Белобородовdbeloborodov@dow.com
Dow Europe GmbHToine Dinnissen
tdinnissen@dow.com
ЗАО "НЕО Кемикал"Юлия ТашкиноваЮлия Ташкинова
tashkinova@neochemical.ru(8313) 32-06-74, 33-68-68, 32-59-63
Toine Dinnissen, February 25th 2014
DOW Epoxy ProductsN P d t TName Product Type
D.E.R.™ 31x / 31xx Liquid epoxy resin with non‐reactive diluents / additives
D.E.R. 32x / 32xx Liquid epoxy resin with reactive diluent(s)
D.E.R. 33x / 33xx Unmodified bisphenol‐A Epoxy Resin
D.E.R. 34x / 34xx Accelerated liquid epoxy resin
D.E.R. 35x / 35xx Bisphenol‐F epoxy resin containing liquid epoxy resin, might contain reactiveD.E.R. 35x / 35xx Bisphenol F epoxy resin containing liquid epoxy resin, might contain reactive diluent (3rd digit can indicate the main reactive diluent type)
D.E.R. 36x / 37x Few “exotic” grades
D.E.R. 38x Only D.E.R. 383 = US version of D.E.R. 330y
D.E.R. 39xx Specialty epoxy resin
D.E.R. 5xx Brominated epoxy resin
D E R 6 S lid iD.E.R. 6xxx Solid epoxy resins
D.E.R. 9xx Emulsions, Dispersions or water‐emulsifiable epoxy resins
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
DOW Curing Agents
Name Product Type
D.E.H.™ 1xx / 1xxx Polyamide and Amidoamine curing agents
D.E.H. 2x Polyamine building blocksy g
D.E.H. 2xx / 2xxx Modified polyamine(s) / blends
D.E.H. 3x AEP and Accelerators
D E H 4 / 4 F l d E A i ddD.E.H. 4xx / 4xxx Formulated Epoxy – Amine adducts
D.E.H. 5x Simple adduct / blend (her. Dow)
D.E.H. 5xx Formulated Epoxy – Amine adducts; US only (her. GNS)
D.E.H. 6xx Fast & Low temperature curing agents
D.E.H. 7x Anhydride
D.E.H. 8x Phenolic hardeners (powder coatings)D.E.H. 8x Phenolic hardeners (powder coatings)
D.E.H. 8xx Curing agents for aqueous systems.
Toine Dinnissen, February 25th 2014 ™ Trademark of The Dow Chemical Company
Recent Innovation - Low Viscosity
Designation Type
D E R ™ 72 f i l i dil
Toine Dinnissen, February 25th 2014
D.E.R.™ 72x mono‐functional reactive diluents
D.E.R. 73x di‐functional reactive diluents
D.E.R. 74x Multi‐functional reactive diluents
™ Trademark of The Dow Chemical Company
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