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11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Status MVD demonstrator:mechanics & integration
T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser,
I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser
and B. Wiedemann
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Status MVD demonstrator:mechanics & integration
Outline:
MVD demonstrator
- Global design- Sensors- Mechanical support- FPC- Integration procedure- Demo-Aux board- Thermal simulations- Mechanical and thermal stress tests
Cryogenic system and vacuum system
Summary and Outlook
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator:Global design
2x MIMOSA-20 Sensors
ZIF connectorFlex-rigid R/O
Demo-Aux board
Liquid cooledCu heat sink
TPG/RVC/TPG sandwich
Flexprint Cable
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator:Sensors
MIMOSA-20 - 320 x 640 pixels
- 30 μm pixel pitch
- ~ 2 ms time resolution
- ~ 2 cm² active surface
- 2 serial analogue outputs
- Differential output lines
MIMOSA-20
Successfully operated with demonstrator electronics(See talk of S. Amar-Youcef)
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Structure of the support:
MVD demonstrator:Mechanical support
TPG (Thermal Pyrolytic Graphite)ultra high heat conduction (1500 W/mK in two dimensions)
RVC (Reticulated Vitreous Carbon)ultra light and stiff material
Dummy chips (former CMS test structures)
Complete support is called „sandwich“.
Currently 0.455 % X0
plus sensors
Thickness [μm]
1x Splicing tape glue 35 ± 52x TPG (C) 300 ± 202x Liquid glue 100 ± 201x RVC (C foam) 5600 ± 200
Sum 6435 ± 205
2x
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator:Flexprint cable
Currently 0,212 % X0
3 layers of 12 μm copper on Polyimide
- Minimized set of lines for 2 MIMOSA-20- One cable for two sensors for individual readout- 60 pads for chip bonding
Design and layout by electronics workshop @ IKF
52,5 mm
32 m
m
Can be reduced by replacing Cu with Al.Contact to ALICE Silicon Trackergroup established.
Flexprint cable demonstrator
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator:Flexprint cable
FPC-balcony structurecomes with pad-layout
advantage: easier bonding
First bonding exercises with FPC glued on Dummy Chip succeeded
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator: Integration procedure
SiliconTPG
RVC
AdhesiveFPC
Bonds
Components:
Handling -Support
1-side (DemoV1):
Double-side (DemoV2):
Handling
-Support
Open questions:
- Order of mounting
- High precison positioning
- Risks of damages while mounting
- 1-sided / 2-sided mounting
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator:Demo-Aux board
see talk of C. Schrader
Demo-Aux boardconnects Chip and FPCwith readout chain.
Mounted onheat sink for directcooling.
Heat sink modificationis work in progress.
Heat sink
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator: Thermal simulations
10 mW
2 W
10 mW
1 W/cm²1 W/cm²
FPC 50Chip 150TPG 1500, 1500, 20RVC 0,04
1Block 400
W/mK
Glue
2 W
0°C
Thermal simulations:
MVD demonstratorcan handle theupcoming heat.
Dissipated by FPC
Dissipatedby Demo-Aux board
Dissipatedby Demo-Aux board
Dissipated by FPC
Dissipated by Chips
Simulations done bySamir Amar-Youcef
Hea
t co
nduc
tivity
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
MVD demonstrator: Thermal simulations
0 5 10 15 20 25 30 35 40 45
0
5
10
15
20
25
30
35
ChipsTemperature characteristics
FPC: 20 mW
FPC: 20 mW
20mW / no RVC
Length / mm
Tem
pera
ture
/ °C
Temperature maximum 30.4 °C
Temperature minimum 0 °C
Temperature gradienton chip surfaceFirst chip 5°CSecond chip 8°C
to be confirmedexperimentally
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Study potential problems caused by different thermal expansion coefficients of the support materials.
Thermocycling with Liquid Nitrogen
MVD demonstrator:Mechanical and thermal stress tests
Testchips do notshow any changes,especially no cracks
First resultsare promising.
CTE [1/K]
Dummy chips (Si) 3,00 x 10-6
TPG (C) 1,00 x 10-6
RVC (C foam) 2,20 x 10-6
Static load test of one Sandwich by an accident. RVC was compressed but
test chips do not show any cracks
Further tests are needed.
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Cryo system and vacuum system
Demonstrator is designed and constructed for use in vacuum.
Vacuum system is ready and operational.
First material tests were madebut further studies are needed to make a qualitative statement.
Characteristics:
- vacuum operation down to 10-8 mbar
- electronic pressure readout via Labview
- 50 Pin- and several BNC-feedthroughs
available for electronic test under vacuum
- modular system inside the vacuum system
multifarious operations feasibletogether with B. Wiedemann
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Cryo system and vacuum system
A cryogenic system is placed inside the vacuum system to studyradiation hardness of MIMOSA-chips at temperatures downto Liquid Nitrogen temperature for the future MVD.
Affluxion of LN2 isregulated viatemperature sensorsmountedinside the system.
Additional cooling circuit forMIMOSA readout cards needed,can handle temperatures down to- 90°C. Readout cards mustprevented to be at LN2 temperature.
LN2 temperature insidecryogenic system
Temperature sensors
11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI
Summary and Outlook
Outlook:
Combination of functionalities ( heat conductivity, mechanical stability and FPC) together with IPHC (Strasbourg) and IMEC (Belgium)
Summary:
Global design of the MVD demonstrator was updated and tested in simulations.
Mechanical support was build and tested.
FPC is available and first exercises in bonding started.
First mechanical stress tests were made with promising results.
Conclusion:
Main components of the demonstrator are available and also tested.
Experiments to confirm the simulation results must follow.
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