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1
Sensor QA at BNL
2004/09/07
Junkichi Asai (RBRC)
(Kieran Boyle (SBU))
2
Contents
1. Previous Evaluation of Stripixel Sensor– Result IV (leakage current –Voltage)
CV (Capacitance-Voltage) (at BNL)
2. Preparation– Semi-automatic probe station– IV measurement with comb type– Effect of grounding other strips on IV measurement
3. Schedule of sensor QA– Development/production
3
Setup for IV/CV measurement
picture
Bias Voltage
chuck
Micro Scope
Grounded Needle to guard ring
Measured Needle to sensor pad
wafer
Micro Scope
chuck
Measured Needle
Grounded Needle
Dark Box
There are in the Instrumentation Division.
Because the pad size so small, the probe needle is contacted the pad of the wafer by watching through the microscope.
Vacuum hole
4
Result : IV/CV measurements
We found leakage current in the range of 100’s nA and capacitance in the 10s of pF range.
400um strip sensor
5
• For these measurements, an adjacent channel was grounded. The leakage current decreases by around 1/3.
Effect of grounding other strip
Bias Voltage
chuck
Micro Scope
Grounded Needle to neighbor pad
Measured Needle to sensor pad
wafer
decrease current
Lea
kage
cur
rent
(uA
)
Grounded Needle to guard ring
10-1
10-1
10-2
100
10-1 100 101 102 103
Bias Voltage (V)
With Grounded Needle to neighbor pad
6
Why Semi-Automatic Probe station
• With the present manual probe station, measuring one entire wafer (200 measurements) takes ~ 2 weeks.
• To speed up, We use the Semi-Automatic Probe Station
7
Ribbon Cable
GPIB Cable
Setup Semi-Automatic Probe station
Probe station
HV/AmmeterKeithley 6487
Switch systemKeithley 7002
LCR MeterAgilent 4263B
Windows LabView
Windows LabView controlled All device through GPIB cable.
Dark BoxMicroscope
Movable stage
chuck
Probe posit
ioner
for Guard
Ring
Probe card
sensorProbe stag
e
Early Oct., they will be moved to the RIKEN Lab room in physics building at BNL. In the room, the clean tent will be set up. Then we can start measurement.
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Probe Card64 x strip needles
330um
80um
64 u strip needles
150um
80um
By RUCKER & KOLLS, INC.
•One needle is used to measure, the other127 are grounded
•Measurement all 384 pad of strip with overlap step by step
9
It was pictured by the Imaging card. We can check without looking through the microscope.
64 u needles of probe card
COMB type sensor
u padsThe needles contacted with the u pads
Maximum zoom
Semi-Automatic Probe station with Imaging card
Check the contacting
10
IV/CV measurement schematic
Keithley 6487 HV/Ammeter
Agilent 4263B LCR Meter
GND Ring
IV MeasurementCV Measurement
Keithley 7002,7011,7153 switch system
Chuck
measured
n
n-1
CV Measurement (Between strip-strip) IV Measurement (Between strip-strip)
11
Result of IV measurement with Semi-Automatic Probe station
Using COMB design for practice
12
Effect of grounding other stripsIV Measurement depending on # grounded
400um cutted comb type sensor
1.E+00
1.E+01
1.E+02
1.E+03
0.1 1 10 100 1000
Voltage [V]
Lea
kag
e C
urr
ent
[nA
] GND:0
GND:1
GND:2
GND:4
GND:6
GND:10
GND:14
Mea
sure
dG
ND nee
dle:
0
GND n
eedl
e: 1
GND n
eedl
e: 2
GND n
eedl
e: 4
GND n
eedl
e: 6
GND n
eedl
e: 1
0
GND n
eedl
e: 1
4
Needles of Probe Card
400um
Electric Field
13
Schedule of silicon sensor•Preproduction Sensor Soon SINTEF 17 wafers are supposed to arrive at RIKEN, yesterday (9/6)
(500um, STD design, 2 type : sintering process deference)They will be shipped to BNL and UNM, when clean room ready(?)
End of Sep. 20 sensors from Hamamatsu(4 type : thickness=(500um, 625um) , design=(STD, New))
•Clean Room Early Oct. build at RIKEN Lab room in BNL•QA test Now Programing Semi-Automatic station with LabView
Wiring (probe card, Scanner, HV/Am, LCR…) should decide how to measurement Sep. IV/CV measurement at UNM (with probe positoner)
Continue studying sensor response with probe card at BNL Oct. IV/CV measurement at BNL
All wafers are expected to complete QA in Dec. 2004 or earlier
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