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Over the past 60 years, Epec has emerged as a leading provider of time-critical, high performance printed circuit board solutions. Our more than 1000 active customers represent a wide range of leading original equipment manufacturers (OEM) and electronics manufacturing services (EMS) companies, in the medical, electronics, industrial, communications, access controls, automotive, computing, and military sectors. From a simple single sided board to a complex multi-layer, double sided surface mount design, our goal is to provide you a design that meets your requirements and is the most cost effective to manufacture. Our experience in IPC Class III standards, very stringent cleanliness requirements, heavy copper and production tolerances allow us to provide our customers exactly what they need for their end product.
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DELIVERING QUALITY SINCE 1952.
Printed Circuit Board Overview
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America's Oldest,A History of Innovation
Privately held company, established in 1952.
Estimated 2013: Sales: US$40 Million
100+ Employees Worldwide (70 – North America, 30 – Asia, 3 – Europe)
Design and manufacture customized, built-to-print, performance-critical products for all sectors of the electronics industry.
Leading provider of printed circuit boards, membrane switches, graphic overlays, silicone rubber products, electronic heaters, fans, motors and custom battery packs.
Integrated supply chain management solutions to handle the complexity of today’s global marketplace while making sure that every order is being manufactured at the “right” factory.
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Global Operations
Significant Investment in People and Facilities across the globe.
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Our Customers - The Top GlobalOEM’s In Growth Industries
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Quickturn PCB Capabilities
Up to 18 Layers Laminate – FR-4 (All Tg & Td Ranges), CEM-1, Teflon, Ceramic, Polyimide Finished Thickness Up to .300” Minimum Dielectric Spacing = .003” Green, Blue, Red, Black, Clear and White Solder Masks and Legend Inks Immersion Gold, Gold Fingers, Full Body Gold, Bondable Gold Immersion Silver, Immersion Tin, Lead Free HAL, OSP, ENEPIG Minimum Lines & Spaces =.003” Blind & Buried Vias Maximum Panel Size = 24” x 36” Minimum Finished Hole Size = .005” +/- .003” Maximum Hole Aspect Ratio = 15:1 Maximum Copper Weight = 6 oz. (UL Approved) Laser Direct Imaging and Laser Drilling Controlled Impedance +/- 10% Carbon Ink
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Heavy Copper PCB’s
Epec has been building heavy copper circuit boards with traces and copper planes of up to 6 ounces for over 20
years.
Maximum Number of Layers = 16 Laminate – FR-4 (All Tg Ranges), Teflon,
Ceramic, Polyimide Finished Thickness = .020" - .275" Minimum Soldermask Clearance – 6 mils Minimum Solderdam Width – 5.5 mils Hot Air Solder Leveling (HASL) Immersion Gold (ENIG) & Immersion Silver
Blind & Buried Vias Minimum Drill Bit Hole Size = .012" Minimum Holes Size - .008" +.005"/-.008" Maximum Hole Aspect Ratio = 10:1 Maximum Copper Weight = 6 oz. (UL App) Controlled Impedance +/- 10% Minimum Silkscreen Line Width – 8 mils Green, Blue, Red, Black, Clear & White Solder
Masks & Legend Inks
Heavy Copper Production Capabilities
Check out our web site for heavy copper production minimums
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Flex & Rigid Flex PCB’s
SS, DS & Multi-Layer Flex Circuits Rigid Flex up to 10 Layers Installation of connectors & contacts Materials: Kapton, Mylar, Teflon Adhesives: Acrylic, flame retardant,
epoxy, polyimide, phenolic Stiffeners: FR-4, polyimide, aluminum
Quickturn Prototypes Production Quantities Design for Manufacturability
Reviews & Assistance Different coverlay options
available
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HDI – High Density Interconnect PCB
HDI is a PCB with a higher wiring density per area, finer lines and space, smaller vias and pads than conventional PCB’s.
HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
To produce HDI boards, laser direct imaging and laser drilling equipment is a must along with investment in other high tech equipment to ensure high quality production.
HDI Production Capabilities
Laser Microvias Blind and Buried Via’s Sequential Lamination Via-In-Pad Technology 2/2 lines and spacing Copper filled stacked microvia’s Up to 18 Layers Down to 2 mil dielectrics Tight Impedance Control
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PCB Services
Delivery
STANDARD LEAD TIME - 20 Working DaysTechnology 1 Day 2 Day 3 Day 5 Day 7 Day 10 Day
1 - 4 Layers x x x x x x
6 - 10 Layers x x x x x
> 10 Layers x x x x
Both Prototype and Production Quantities
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Value Added Capabilities
Castellated Edges Counter Sinks/Counter Bores
– Plated/Non-Plated Standoff’s, Spacers & Pem Nuts Installed Connectors (Soldered/Press Fit) Aluminum Clad Boards Silver Thru Hole Volume Production
FR-4 Custom Board Spacers Ultra Clean Ionic Cleanliness Eyelets Peelable Solder Mask Edge Plating MIL-55110 & 31032 Back Planes
Hole Tolerance +/- .002”
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Industry’s Leading Online Tools
Sign up today and try InstantPCBQuote™, the most flexible and user friendly internet quoting and ordering tool in the PCB industry.
Try it Now!www.epectec.com/instantpcbquote
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PCB Design and Layout
Our Capabilities Encompass The Full Design Flow From Start To Finish Including:
Micro BGA / Micro Via / Blind and Buried Vias Rules Driven Designs Schematic Capture Library Development Database Construction and Verification Signal Integrity/Design Verification EMI Checking Full Document Package Creation Electrical Engineering Expertise
We are fully licensed and utilize industry leading tools, including Cadence Allegro, Mentor Expedition, Mentor's PADS, Altium, Valor for DFM Analysis.
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World Class Quality Assurance & Engineering
US Based QA Capabilities Include:– Full Cross Section/Microsection Reporting and Ionic
Testing Equipment– X-Ray Fisherscope for all Metal Thickness & Purity
Measurement on every lot.– Scienscope DMP-1000 stereo zoom microscope with
digital picture capability up to 100x– Vision Engineering Mantis Elite for 10X full range
visual inspection.– World Class Electronics Test Lab
Epec’s superior on-time delivery rates are the result of our significant, dedicated engineering resources and processes.
– Perform all DRC, DFM, Graphic Art and Engineering reviews at our Engineering Center outside of Boston, MA
– Documentation of all manufacturing and detailed planning processes, for all special requirements,
– Consistent documentation and tooling at all manufacturing locations to ensure seamless prototype through production manufacturing.
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The Epec Value Added Operation
The Broker
Customer Delivery in
as little as 1 day.
98% On-Time
99.5% Quality
Product arrives at
Epec, is re-inspected, final QA is completed
before shipping to customer.
On-site QA Inspection at factory by Epec
employees.
Epec US & Asian
Operations groups
manages order status,
on-site; daily WIP analysis
through ERP System
Continual process and
on-site technical
improvement program, to
optimize delivery and
quality performance
Manufacturing Begins
Complete Epec Eng Analysis, work with customer to resolve
all technical and build issues.
Production Planning matches
order with our optimal domestic or
Asian facility
Receive Customer
Order
The Epec Operation
Customer Delivery in
5-8 weeks
80% On-Time80% Quality
Send order to the factory broker
works with
Receive Customer
Order
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Our Products
Battery Packs Flex & Rigid-Flex PCB’s User Interfaces
Fans & Motors Cable Assemblies Printed Circuit Boards
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Inventory Management
Customer requirements are always unique and customized, therefore our inventory management system must accommodate for this type of environment.
We Offer:– Kanban– Consignment– JIT Programs– Blanket Orders– Customer Fulfillment– Bonded Warehousing– Kitting– Safety Stock– Other flexible solutions
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The Difference is Quality and Delivery
1. Quicker Delivery - Epec's technology infrastructure and people, including the Asian and US based operations and engineering teams, enable jobs to get started the same day the order data is electronically received by our factory.
2. Accurate Information - Epec's on-site personnel provide accurate daily Work In Process reports so customers can receive immediate order status information, along with in person verification of all daily reports by Epec staff.
3. Better Quality - Epec ensures higher levels of quality through three key additional processes. On-site QA inspectors at each facility provide an additional audit before it leaves Asia, Epec maintains dual UL approval at each facility with quarterly audits, and perform QA audits at our headquarters in Boston, MA.
4. Flexibility - Each of our manufacturing facilities have been selected for theirbest-in-class niche product and delivery solutions, ensuring our optimal facility is building every order.
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If you require additional information please contact us with any questions or requests.
North American Headquarters174 Duchaine Blvd.New Bedford, MA 02745Tel: (508) 995-5171Fax: (508) 998-8694
Contact Us By Email:Sales [email protected] [email protected] [email protected]
Visit Our Website For More Informationwww.epectec.com
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