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Israel, May 4, 2010
Semiconductor Testwith
Software-Defined Modular Instrumentation
Yechiel PELED
National Instruments ISRAEL Ltd
NI PXIe-6544/45/47/48
High-Speed Digital I/O
NI PXI-4132 High-Precision
Source Measure Unit
NI PXIe-5663E/5673E
6.6 GHz VSA & VSG
&
Israel, May 4, 2010
Challenges in Testing Mixed-Signal ICs
Israel, May 4, 2010
Circuit Design
•Circuit design / Circuit simulation•Floor planning, Design review & Layout•Design For Test & Test pattern generation•Design for manufacturability (IC)
Production
Validation
• Wafer Fabrication • Wafer Testing, Die Sort• Packaging, Package Testing• Burn In & Final Test
• Design Validation & Verification• Device Characterization• Datasheet Generation• Failure Analysis
Design to Validation
Israel, May 4, 2010
Structural vs. Functional
1. Structural Test/Validation– Properly Deposited– No Faults– Focus on DC and Digital
2. Functional Test/Validation– Final Setup (simulation)– Meets Specifications– Digital, Mixed Signal, RF
Israel, May 4, 2010
Parametric Measurements
• Verify structure by checking that certain features are within acceptable limits– DC Parameters
• Power Consumption• Voltage Thresholds• Current Input/Output
– AC Parameters• Rise Time• Setup / Hold Time
Israel, May 4, 2010
Microelectrical mechanical Systems (MEMS)
Types of MEMS devices:• Accelerometers, gyroscopes, microphones, etc.
Industry Trends:• Rapid industry adoption into consumer electronics
• Lower test costs due to quantities / purchasing structure
Key Measurements:• Typical IC characterization measurements
• Open and shorts measurements
• Leakage and standby current draw
• Vary based on sensor type – typically very analog heavy
Israel, May 4, 2010
PXI Microelectromechanical (MEMS) Test SystemCharacterize MEMS Accelerometers, Gyroscopes, Microphones
•±20 V, 2 A source/measure capability for parametric measurements down to 1 nA sensitivity
•Two simultaneously updated analog inputs and outputs with 24-bit resolution up to 204.8 kS/s
•Up to 200 MHz digital I/O with various voltage levels for MEMS output/input signals
•Characterize open/shorts, standby/leakage current (IDD), positive/negative continuity, and more
•Switch in DC instrumentation to multiple test points
•Control MEMS operation through common digital protocols including SPI, I2C, and JTAG
Israel, May 4, 2010
LabVIEW Graphical Programming
• Compiled graphical development environment• Development time reduction of four to ten times• Tools to acquire, analyze, and present your
data
Israel, May 4, 2010
Custom, Software-Defined Chip Test
Graphical Programming
Configuration
Textual Math
Modeling & Simulation Statecharts
Israel, May 4, 2010
Chip Testing with PXI and LabVIEW
MEMS Devices- Accelerometers- Gyroscopes- Microphones
Power Management ICs (PMICs)- DC-DC Converters- LDOs- LED Drivers
Memory Devices- SRAM- DRAM- F-RAM
Wireless ICs (RFICs)- Mod/Demodulators- Power Amplifiers- Transceivers
Discrete Components- Transistors- Diodes- Capacitors- Resistors
ADCs and DACs- A/D Converters- D/A Converters
Video DevicesNDT (Non-Destructive Test ) & Ultrasound applications
Israel, May 4, 2010
Software-Defined Modular Instrumentation
Israel, May 4, 2010
Backplane- PCI bus communication- Timing and Synchronization
Peripheral Instrument Modules - Over 1,500 modules from 70+ vendors
Chassis- 4, 8 and 18 slot options
Controller- Embedded PC, remote PC, or laptop interface- Runs all standard SW
PXI – PC-Based Modular Instrumentation
Systems Alliance
Israel, May 4, 2010
Lower Cost and Size of PXI-Based System
Photos courtesy of Agilent, Keithley, Advantest, Nicolet, and Tektronix
• Integrated SW & HW• Flexible performance• Small size• High throughput• Cost effective
Israel, May 4, 2010
NI PXI Semiconductor Suite
• Expanded capabilities for mixed-signal chip test– Fast single-ended digital clock rates up to 200 MHz– High-resolution current measurements down to 10 pA– Deterministic multiband RF measurements with RF List Mode– Advanced per-pin DC measurements with signal insertion
switch– Added support for importing WGL and STIL data formats
NI PXIe-6544/45/47/48
High-Speed Digital I/O
NI PXI-4132 High-Precision
Source Measure Unit
NI PXI/PXIe-2515
HSDIO Switch
WGL/STIL SW
File Importing
NI PXIe-5663E/5673E
6.6 GHz VSA & VSG
Israel, May 4, 2010
Chip Test System Architecture
Application Development
Test Management Software
Digital Instrumentation
Analog Instrumentation DC Parametric Measurements
Switching/Connectivity- Up to 200 MHz/400 Mbps- SPI, I2C, JTAG, etc.
- Up to 24-bit acquisition- Bandwidth over 1 GHz
- Resolution down to 10 pA- Open/shorts, leakage, etc.
High-Speed Digital and FPGA I/O
SMUs and Power SuppliesDigitizers and RF VSAs/VSGs
SSRs and FETs
- ~50 switch module options- Multiple topologies
PXI Modular Instrumentation Platform
Characterization or Production
NI TestStand
Israel, May 4, 2010
Chip Testing with PXI and LabVIEW
• Flexible Test Platform – Custom, one-off measurements in SW– Modular instrumentation / small footprint
• Lower Total Cost of Test– Improve quality - automated testing (repeatable)– Improve throughput – faster test development– Correlate results - characterization vs production
• Mixed Signal Instrumentation– Instrument options from DC to RF on one platform– Synchronized measurements across analog and digital
Israel, May 4, 2010 17
ImagingLab Robotics Library for DENSO -
LabVIEW Toolkit for Directly Controlling DENSO Robotics
Robotics- Wafers & components handling
Robot places part at several known positionsVision reads part location at each positionSoftware determines linear transfer function for X, Y and theta
Coordinate Vision and Robot Space
Israel, May 4, 2010
Analog InstrumentationDigitizers and Arbitrary Waveform Generators
Israel, May 4, 2010
A/D and D/A Converter Testing
Types of data converters:• Analog-to-Digital (ADC); Digital-to-Analog (DAC)
Industry Trends:• Integration into SoC and SiP designs
• Increased complexity with footprint and power reduction
Key Measurements:• Dynamic performance
• SINAD, THD, SNR, SFDR, EOB, PHSN, IMD, and ISO
• Linearity testing (INL/DNL)
• Current consumption (IIH, IIL, IDDQ, standby)
• Voltage thresholds (VOH, VOL, VIH, VIL) plus gain and offsets
Israel, May 4, 2010
Automated ADC Characterization
• Characterize dynamic performance of ADC– SINAD, SNR, THD, EOB, PHSN
• Test INL / DNL, IMD, Iref, Vref, and other specifications• Tight synchronization of HSDIO, FGEN, and M Series
Box Instrument Approach Automation with PXI, LabVIEW, and DIAdem
Israel, May 4, 2010
Model Description PlatformsInput
ChannelsSampling Rate
(S/s)Bandwidth
(MHz)Resolution
(bits)
NI 5152/3/4
High-speed, high-bandwidth
PXI, PCI 21 G (or 2 G on 1
ch)300/500/
10008
NI 5114 High-speed, low-cost PXI, PCI 2 250 M 125 8
NI 5124 High-resolution PXI, PCI 2 200 M 150 12
NI 5122 High-resolution PXI, PXIe, PCI 2 100 M 100 14
NI 5142High-resolution, IF
acquisitionPXI, PCI 2 100 M 100 14
NI 5132/33
Low-cost, portable USB 2 50 M/100 M 50 8
NI 5105 High-density, low-cost PXI 8 60 M 60 12
NI 5622High-resolution, IF
acquisitionPXIe 1 150 M 3 to 60 16
NI 5922 High-resolution PXI, PCI 2 15 M 6 24 to 16
PXI and PCI Digitizers
Israel, May 4, 2010
NI & Tektronix collaborate on Fastest PXI Digitizer
Israel, May 4, 2010
High-Speed Signal Generators
5402 5404 5406 5412 5421 5422 5441 5442
Type Function Clock Function Arb Arb Arb Arb Arb
Bandwidth 20 MHz 105 MHz 40 MHz 20 MHz 43 MHz 80 MHz 43 MHz 43 MHz
Sample Rate 400 MS/s300
MS/s400 MS/s 100 MS/s 100 MS/s 200 MS/s 100 MS/s 100 MS/s
Resolution (bits)
14 12 16 14 16 16 16 16
Function Generators Arbitrary Waveform Generators
Israel, May 4, 2010
Power Management IC / MOSFET Characterization
• Create standard test platform on benchtop– Fast edge, propagation delay, and jitter
measurements– Correlate with ATE in production
• Chose PXI and LabVIEW– Smaller footprint, tighter integration– Less expensive, better repeatability
“PXI offered us a characterization platform for PMICs with a smaller footprint and tighter integration than our bench top instruments at a lower cost.”
- Amiri McCain, ON Semiconductor
Israel, May 4, 2010
Digital InstrumentationDigital Waveform Generators / Analyzers, FPGA-Enabled I/O
Israel, May 4, 2010
Digital Communication Protocols
• Component/IC Communication– SPI, I2C, JTAG, PS/2, …
• System Communication– Aerospace: MIL-STD-1553, ARINC-429, …– Automotive: CAN, MOST, KWP, 1939, …
• Consumer Electronics– Digital Audio: S/PDIF, I2S
• Custom
Israel, May 4, 2010
Digital Structural Test
• Boundary Scan– Board Level Testing of Multiple
Components– JTAG Communication – “Scan Chain”
• BIST (Built-In Self Test)– Chip Level Testing of Single Components– AMBIST, mBIST, LBIST
Israel, May 4, 2010
Bit Error Rate Testing (BERT)
Testing method for digital communication circuits that uses predetermined stress patterns
ed transmittsamples #
errorsbit #BER
Clk InStart
Data In
Data Out
Clk OutData Active
Timing & Triggering
Stimulus / Response
Response Digital Pattern Generator(Pin Electronics)
VDD
Israel, May 4, 2010
PCI / PXI-6541/42 PXIe-6544/45 PXIe-6547/48 PCI / PXI-6551/52
Max Speed 50 / 100 MHz 100MHz / 200 MHz 100MHz / 200 MHz 50 / 100 MHz
Platform PCI / PXI PXI Express PXI Express PCI / PXI
# of Channels 32 32 32 / 24 (with HWC) 20
Direction Input or Output Input or Output In/Out or Bidirectional Bidirectional
Precision CLK No Yes Yes No
Max DDR No No 400/300 Mbps (out/in) No
Voltage Levels Selectable 1.8, 2.5, 3.3, 5V*
Selectable - 1.2, 1.5, 2.5, 1.8, 3.3 V
Selectable 1.2 - 3.3V (100 mV res.)
Programmable -2 to 5V (10 mV res.)
HWC / Tri-state No No Yes (24 ch) Yes (20 ch)
Streaming 115 MB/s 400 / 660 MB/s 400 / 660 MB/s 115 MB/s
NI PXI High Speed Digital Offering
Israel, May 4, 2010
NI PXIe-6544/45 & PXIe-6547/48
Applications• Interfacing to high-speed semiconductor chip designs• Standard and custom protocols (SPI, I2C, JTAG, etc)• 1080p video test (via NI VideoMASTER)• High-bandwidth data streaming of digital data
PXI Express x4 link provides up to 660 MB/s
Banked data delay for custom edge placement
Up to 32 channels DIO or 24 ch. bidirectional
100 & 200 MHz clock rates
Voltage levels from 1.2 - 3.3V (down to 100 mV precision)
High resolution on-board clock with subHz resolution
Israel, May 4, 2010
WGL/STIL Software Importer• Import WGL & STIL file formats• Outputs a CSV ASCII file• Allows user to adjust signal settings to adapt to different device capabilities• Vectors work directly with HSDIO hardware
-654x, 655x, 656x- Ships with 30 day eval
• Sold and supported by TSSI• Eval version ships with NI HSDIO
http://www.tessi.com/
Israel, May 4, 2010
Precision DC InstrumentationMultimeters, Power Suppliers, Source Measure Units
Israel, May 4, 2010
Product Description Platform Digits
PXI-4071High-resolution DMM and 1.8 MS/s isolated
digitizer PXI 7½
PXI-4072DMM, 1.8 MS/s isolated digitizer, and LCR
meter PXI 7
NI 4070 DMM and 1.8 MS/s isolated digitizer PCI, PXI 7
NI 4065 Low-cost DMMPXI, PCI, PCIe,
USB 6½
NI PXI-4071 7½-Digit FlexDMM
NI’s Complete Digital Multimeter Offering
• Industry’s Most Accurate 7½-digit DMM• Wide measurements ranges
±10 nV to 1000 VDC, ±1 pA to 3 A , 10 µ to 5 G ±500 VDC/Vrms common-mode isolation
• 1.8 MS/s isolated, high-voltage digitizer Flexible resolution: 1.8 MS/s at 10 bits to 5 S/s at 23 bits
Israel, May 4, 2010
NI PXI-4110Power Supply
NI PXI-4130Power SMU
NI PXI-4132Precision SMU
Target Apps 3-channels - Power source/readback
High power (40W) IV sweeps,
Low-power (2W) leakage testing
Max Voltage +6V, +20V, -20V +/-20V +/- 100V
Max Current 1A on each channel +/- 2A +/- 100mA (2W max)
4-quadrant No Yes Yes
Current Meas. Sensitivity
400 nA 1 nA 10pA
Integrated Guarding No No Yes
Output timing Software Timed Software Timed SW or HW timed
Triggering No No Yes – PXI backplane
NI PXI Power Supply / SMU Offering
Israel, May 4, 2010
NI PXI-4132 High-Precision SMU
Applications• Leakage test on discrete components• Parametric measurements on packaged semiconductors• IV characterization LEDs / transistors• High-voltage physical measurements, wafer test
10pA measurement sensitivity
Up to +/-100V and up to +/-100mA
Remote (4-wire) sense, guarding
High-speed hardware sequencing and triggering
4-quadrant source/sink operation
Israel, May 4, 2010
Source Measure Unit
• An SMU can:– Source Current (positive and negative)– Measure Voltage– Source Voltage– Measure Current (uA resolution)– Sink Current (Dissipate Power)– Be Used with Other SMUs or Supplies
Israel, May 4, 2010
Power Consumption Tests
• Goal: Verify that a device doesn’t draw too much power in a variety of states– After Reset– In Standby Mode– While Active
VDD
VSS
DUT Circuitry
SourceMeasure Unit
Digital I/O
Israel, May 4, 2010
RF InstrumentationVector Signal Generators / Analyzers and Modulation
Software
Israel, May 4, 2010
NI RF Hardware Products
RF Hardware• 2.7 GHz Vector Signal Analyzer• 2.7 GHz Vector Signal Generator• 6.6 GHz Vector Signal Analyzer• 6.6 GHz Vector Signal Generator• 6.6 GHz CW Generator• 3.0 GHz 30 dB Pre-Amp• 6 GHz True-RMS Power Meter• Up to 26.5 GHz, mux, GP relays
IF/Baseband Hardware• 400 MS/s 16-bit Dual Channel AWG• 150 MS/s 16-bit High-speed IF digitizer• 32 Channel, 400 Mb/s High-speed DIO
LabVIEW FPGA Hardware• IF- RIO• FlexRio
Israel, May 4, 2010
RF Testing Capability
• Software defined instruments• Fast RF measurement speed• Standard-specific measurements for WILAN,
WIMAX, GPS, GSM/EDGE, WCDMA,…
PXIe-5673 VSG
PXIe-5663 6.6 GHz VSA•10 MHz to 6.6 GHz•50 MHz Instantaneous BW (3 dB)
PXIe-5673 6.6 GHz VSG•85 MHz to 6.6 GHz•>100 MHz Instantaneous BW
RF Software•Modulation/Spectral Measurements•Standard-specific toolkits
Israel, May 4, 2010
Local Oscillator Downconverters
Digitizers
Shared LO
Shared ADC Clock
MIMO - Four Channel of Phase-Coherent VSA
Israel, May 4, 2010
Wireless IC (RFIC) Testing
Types of wireless ICs:• Power amplifiers (PAs)
• Transceivers / RF front-ends
• Modulators and demodulators
Industry Trends:• Increased integration with other chips in consumer electronics
Key Measurements:• Input/output power and efficiency
• EVM, carrier leakage, frequency offset
• Variety of modulation schemes (QAM, ASK, FSK, etc.)
Israel, May 4, 2010
Software-Defined Wireless IC Characterization
• Automate global testing of complex RFICs– Many teams with different capabilities– Improve quality with repeatability– Reduce total test time
• Common Set of Measurement Tools– Share software code between groups– Easy to use operator interface
“To improve code reuse and reduce test development time, we needed to implement a standard test automation framework built on common software tools. We reduced the time necessary to validate an IC from two months to three weeks.”
- Sylvain Bertrand, ST-Ericsson
Israel, May 4, 2010
NI RIO Technology PlatformRIO = FPGA based Reconfigurable I/O
Israel, May 4, 2010
NI FlexRIO – Speed and Flexibility
FlexRIO FPGA Module• Up to 132 channels• Up to 1 Gb/s per pair• Up to 128 MB of DDR2 DRAM
FlexRIO Adapter Module• Interchangeable I/O• Customizable by users• Module Development Kit
Israel, May 4, 2010
FlexRIO Adapter Modules from NI
PXI-6581R - 100 MHz SE / 54 Ch. DIO
• 100 MHz Clock Rates
• 54 DIO lines
• Selectable voltages of 1.8, 2.5, and 3.3 V or external reference voltage (1.8 to 5.5 V)
PXI-6585R – 200 MHz LVDS / 32 ch. DIO
• 200 MHz Clock Rates
• 32 LVDS DIO lines
• 10 PFI lines for triggers and clocks
Israel, May 4, 2010
PXI-5752R - 32-Channel, 12-Bit, 50MS/s Digitizer for
NDT (Non-Destructive Test ) and Ultrasound applications
Specifications•32 differential inputs (100 ohm)•AC coupling•NDT-specific ADC features•16 DO channels
Markets/Application Areas•Replacing custom, in-house NDT systems•OEM NDT systems•Phased array and other high channel count NDT research
Israel, May 4, 2010
What is Non-Destructive Test?
The use of noninvasive techniques to determine the integrity of a material, component or structure
or quantitatively measuresome characteristic ofan object.
i.e. Inspect or measure without doing harm.
Israel, May 4, 2010
Video Testing ( Analog to HDMI)
