20
Israel, May 4, 2010 nanoRVInteractive™ 1 1 Nanometer Reliability

C:\fakepath\micrologic track c

Embed Size (px)

Citation preview

Page 1: C:\fakepath\micrologic   track c

Israel, May 4, 2010

nanoRVInteractive™

11

Nanometer Reliability

Page 2: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Nanometer Reliability – Current Verification Flow Done only when large IC layout blocks are ready

Long RV time

Reliability Corrections lead to DRC, LVS Re-Verification

Reliability issues waived due to Tape Out schedules

2

Page 3: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Nanometer Era – Challenges

Process Shrink – integrating more transistors on a die

IC’s complexity increase – Thousands of Design Rules

Performance increase with lower current consumption

New materials, new physical phenomenon

Design constraints

Package complexity

3

Page 4: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Reliability Challenges

Hot Electron Effect & Oxide Degradation

Electromigration & Self Heat

Oxide Breakdown

Latchup

ESD – Electrostatic Discharge

Voltage Drop

Soft Errors

4

Page 5: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Hot Electron Effect & Oxide Degradation Electrons/Holes that gained high kinetic energy

due to a strong electric field

Especially in MOS devices

Electrons/Holes can get injected and trapped in wrong areas

The term “Hot” means the range of kinetic energy to escape from the atom’s path

5

Page 6: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Electromigration & Self Heat

Hot Electron Effect & Oxide Degradation

Electron movement induced by the current in the metal power lines causes metal ions to migrate

POWER Electromigration – Uni Direction EM

Switching signals are defined as Bi-Direction EM

EM is accelerated by high temperature

6

Page 7: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Electromigration & Self Heat (Cont.)

Short Circuit OPEN Circuit

7

Images Source: Computer Simulation Laboratory ; Clark University

Page 8: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Oxide Breakdown

Hot Electron Effect & Oxide Degradation

The destruction of an oxide layer in a semiconductor device

Oxide layers are used in many parts of devices Gate oxide between the metal and the semiconductor in

MOS transistors Dielectric layer in capacitors Inter-layer dielectric to isolate conductors

Oxide breakdown is also referred to as 'oxide rupture' or 'oxide puncthrough'

8

Page 9: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Latchup

Hot Electron Effect & Oxide Degradation

Short circuit which can occur in an improperly designed circuit

Unintended creation of a low impedance path between the power supply

Triggering a parasitic structure which disrupts proper functioning of the part and possibly even leading to its destruction due to over current

9

Page 10: C:\fakepath\micrologic   track c

Israel, May 4, 2010

ESD – Electrostatic Charge

Sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field

An IC connected to external ports is susceptible to damaging ESD pulses from the operating environment and peripherals

10

Page 11: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Voltage Drop

The reduction in voltage in an electrical circuit between the source and load due to wire res. & current drawn from power

Causes lower voltage than required, which leads to larger TPDs, also effect Noise

11

Page 12: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Soft Errors – Datum Error

Transient faults that occur in VLSI circuits due to external radiation and affect the logic states of sensitive nodes

Generally occur from nuclear decay of packaging materials or atmospheric particles accelerated towards the earth by cosmic rays

Neutron radiation interferes with charges held in sensitive nodes in circuits causing soft errors - or SEU (Single event upset)

Generally affect storage elements such as memory, latches and registers

12

Page 13: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Current verification

EDA offers standard verification tools (Cadence, Synopsys, Apache)

IC Design houses develop in-house flows

Synthesis tools include built-in reliability considerations (P&R)

13

Page 14: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Current Solutions

Circuit Designs – Current Limiters (Frontend)

Signals & Power metals width (Backend)

Manufacturing improvements (Fabrication)

14

Page 15: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Future Innovation

Early Reliability Analysis During IC Layout Design Find problems as they are created Fix them when it is easy Reach signoff checks with significantly fewer issues

Analysis Correlation with simulation results

Critical signals timely analysis (Clocks, Critical Paths, Etc)

Look Ahead analysis during construction, creating Signoff Ready design

15

Page 16: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Early Detection – Example #1

16

Page 17: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Early Detection – Example #2

17

Page 18: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Early Detection – Example #3

18

Page 19: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Thank you for your time!

Q/A

19

Page 20: C:\fakepath\micrologic   track c

Israel, May 4, 2010

Thank you for your time!

Thank You

20