Prototyping Pilot Line Workshop | ANDRE Bernard | 28/06/2019

OVERVIEW OF ADVANCED MATERIAL DEPOSITION CAPABILITIES

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300mm & 200mm Si components Platforms ~270@200mm equipments ~105@300mm equipments

5600 square meters Cleanroom - ISO3-5

24/7 operations

200mm MEMS Platform ~130@200 mm equipments 2200 square meters - ISO 4-5

24/7 operations

Substrates <200 mm, III-V and II-VI Platform ~230 @ various diameter equipments

1000+1000 square meters - ISO 4-5 1shift/day

Nano-CHARACTERIZATION Platform ~ 40 huge equipments

2200 square meters

8 centers of competences Concentration of Means to Address Large Photonics

Challenges Closely with the Silicon Platform

NEW PHOTONICS PLATFORM IN 2017

ABOUT THE MICRO, NANO-ELECTRONICS & PHOTONICS

PLATFORMS

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Mature Processes& Technologies

Wafer service thruLETI 3S (SiliconSpecialitiesSolutions)

IP licensing

TechnologyTransfer

New products & applications

Collaboration thruLETI’s SiliconProduct Divisions (DCOS, DOPT, DTBS)

New Materials & Process

Development

Collaborative bilateral researchon specific project

Common laboratories

Affiliation program

New Equipement Engineering

Specific Joint DevelopmentProgram

A full range of business models to meet our partner’s needs

OUR COLLABORATION OFFER

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• Our Motto :

Developing Advanced Materials Solutions for Industrial

Applications

Advanced PCRAM Multilayer Optical filters for imagers Interco : Pillars 10µm pitch3 MoS2 monolayers on 12’’

substrate

ADVANCED MATERIAL DEPARTMENT

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- 100 permanent positions

- 10 PhD students

- 7X24 hrs Shift timePVD,CVD, ECD

- 40 Tools

- > 100 process chambers

- 200 and 300 mmField of applications

- Microelectronics

- Photonics

- Sensors

IDENTITY CARD of the Advanced Material Deposition

department : Some Figures

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Engineering

Developments

Process tuning on known

basis

« Longer » developments

(typically < week)

Directly related to the

programs needs

Chalenged in term of delay

Daily Operations Longer term R&D

New Material Developments

New Deposition Technique

New Material Functionalities

In collaboration with

Academics and Tool

Suppliers

Known Process

Recurent Batches

Higher Level of Maturity

Chalenged in terme of

delay (typically<1shift)

Optical Filters

3 ACTIVITY TYPOLOGIES

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Magnetronsputtering

Wet deposit.

ECD

Muli-Cathode co-sputtering

E-beamevaporation

Ion Beam deposition

CVD/ALD

Ionfab 200mm

Centura 200mm

Volta lineri-Sprint SSW

Sigma 200mmEndura 300mmEndura 200mmClusterline 200mmLLS EVO

EVA 760

Versalis 300mm

Polygon 300mm

W

Alta 300mm &

in-situ metroRaider

300mm

Producer 300mm

Planar 300mm

CAPABILITIES OVERVIEW

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• Our Motto :

« From Material to Device » : fast Proof Of Concept demonstration

mainly for Photonic Applications.

• Our Skills :

Crystal growth & Thin Film epitaxy

Technology & processes on

Non « CMOS standard » substrates & materials

II-VI Crystal Growth & epitaxy

GaN epitaxy for Native

Coloured LED (RGB) Lasers, 3-5 Photonic Display 3-5, GaN

PHOTONIC MATERIAL & TECHNOLOGY DEPARTMENT

Array Detector III-VIGaN epitaxy Power Devices

HgTe HgCdTe

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Substrates & Surface prep

Thin Film Epitaxy

1µm contactlesslithography

Plasma & Ionbeam Etching

PVD / CVD / ALD

Physical Characterization

CAPABILITIES OVERVIEW <200mm platform

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• From Surface Preparation to Contact Plug and Integration

Quasi in-situ XPS

AFM

InP surfaces

Impact of preclean on surface properties Study of solid-state reaction

Contact Plug Development Integration of contacts

Ni / GeSn system

W Liner and W Filling

14.5

µm

III-V / Si Lasers

EXAMPLE 1/6

Advanced Contact Technologies for Electronics and Photonics

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Cosputtering capability for

composition fine-tuning

Memory cell on

300mm MAD300 test

vehicle

Ti/TiN

Top electrode

Surface

preparation

Top electrode

PCM1

1

2

2

3

3

Industrial

pDC GST

chamber

Multicathode

chamber

Si

PCM full stack deposition:

EXAMPLE 2/6

Phase Change Memories

Quasi in-situ metrology

connectivity via Single wafer

vacuum carrier (XPS,

Raman,Ellipso w/o air break)

Si

Multi-layer deposition and

ultra thin film control

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Applications

• RGB filter on top of photosites matrix

• Colored picture (Bayer Matrix)

• IRCUT / IRPB filters defined under RGB filter

• IRCUT : suppress RGB filter rejection in IR

• IRPB : optimization of transmittance in IR

AMAT PRODUCER GT1

In Operando metrology

EXAMPLE 3/6

Filters for CMOS Image Sensors

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TSV

Barrier and seed deposition Versalis (MOCVD TiN, iPVD Cu)

eGseed (Direct on Barrier / seed repair) Raider ECD4- aveni chemistry

TSV filling Raider ECD4- Dow IL9200

Anneal Oven Cu1-2

DAMASCENE

Barrier & seed layer Endura 300B (iPVD TaN, Cu)

ECD filling Raider ECD4- NP52000

Anneal Raider ECD1

RDL, µbumps, µpillars

Ti, Cu undelayer Versalis

ECD metal deposition Raider ECD3 (Cu, Ni, SnAg, Au)

Cobalt ECD Raider ECD3 (aveni Kari chemistry)

advanced “zip filing” process developed with

iPVD

Ti/TiNiPVD

Cu

MOCVD

TiN

SPTS Versalis

AMAT Raider ECD3

AMAT Raider ECD4

Cu Cu

Cu Cu

Cu

Example 4/6

Interconnects for 3D integrations

1x10 µm (AR 10:1)

HD TSV

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PZT (Pb(Zr,Ti)O3) AlN

Sol gel deposition Sputtering deposition

MEMS actuators

High K, High piezo coef

NEMS sensors,

Acoustic Wave Devices

EXAMPLE 5/6

Piezoelectric materials

expertise in piezo material

LiNbO3 AlN:Sc (K,Na)NbO3

Pulsed Laser DepositionStarting 2020

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12’’

EXAMPLE 6/6

2D materials

To Léti 12’’ demos

Patent process

S. Cadot & al

300mm

- 3 MoS2 monolayers on 12’’ substrates- ~50nm domains size

From proof of concepts And Joint Developments with

Industrial Equipment Suppliers

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PEOPLE

- 100

- 24 hours shift organisation

CAPABILITIES

~ 100 [PVD CVD ALD ECD]

tool chambers

Industrial config or Dev Tools

OUR GOAL

speed up yourinnovations in

material sciences

and bringing them to industry

Takeaways

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Leti, technology research institute

Commissariat à l’énergie atomique et aux énergies alternatives

Minatec Campus | 17 rue des Martyrs | 38054 Grenoble Cedex | France

www.leti-cea.com

THANK YOU FOR YOUR ATTENTION

Contact : ANDRE Bernard

Head of Advanced Material Deposition Department

Next related talks :

- Advanced Metal Contact : Philippe Rodriguez

- 2D materials : Cécile Moulin

- Piezo materials : Guillaume Rodriguez

- AVENI solutions for 3D : Céline Doussot

- GaN Material : Bérangère Hyot

- Materials for Topologic Isolation : Philippe Ballet