-

:

. ., . .-

24 . , , , , , .

, - ,, .

3

.

. ,

, () .

, band edge edge.

(~).

(). chip ~-on-tape , .

(|). check ,

| , .

. , floating gate (-).

,

. , emitter-coupled (logic) gate .

emitter-coupled logic gate; emitter-coupled gate constant

(). , .

, ,

([ ]). ion [ion-beam] milling

. ion milling, ion-beam milling

, multilayer metallization [] .

,

.

:

, ,

.

4

- 2 - . . - [] - III - . - - VMO V-

5

A

abacus ( )ability:

adhesive ~ ; resolving ~ , wetting ~ ,

ablation:laser ~

abradability abrasion:

wafer ~

abrasive , absorber (

, )absorption ,

band-to-band ~ characteristic ~ [] Compton ~ extrinsic ~ free-carrier ~ fundamental ~ []impurity ~ interband ~ intraband ~ intrinsic ~ []laser radiation ~ lattice ~ surface-state ~

accelerator ( )floating-point ~ hardware ~

acceptor , deep ~ shallow ~ ()

accessibility and dissemination data

( )

accessor/y:production ~ies vacuum ~ies []

accumulation:charge ~

accumulator ; product ~ ( )round-off ~ ( )

accuracy alignment ~ instrument ~ positioning ~ repeatable ~ ; trimmed ~ () trimming ~ ()untrimmed ~ ()

actigram ( )

action 1. ; 2. () 3. ; avalanche ~ buffer ~ ( )compensating ~ continuous-wave ~ diode ~ parasitic ~ 1. 2. pulsed ~ punch-through ~ , pyrolytic ~ transistor ~ trigger ~

activation , ; annealing ~ dopant [impurity] ~ [] light ~

activity 1. ( ) 2.

acuity:

acu

6

edge ~ (. )adatom , additive 1. ; ; 2.

dope ~

add-on 1. pl () 2. adherence 1. ; 2.

( )die ~ ( )

adhesion ; photoresist ~

adhesive 1. , 2. electrically conductive ~

emulsion ~ ~ filled ~ polymer ~ thixotropic ~ unfilled ~

adhesiveness ; adion adjoint of a matrix ()

adjustment ;

functional ~ adlayer administration:

~ tests test pattern ~

advice 1. 2. ()

algorithm:A ~ A- ( , D-)aim ~ automatic placement and routing ~ backward error recovery ~ ( )best path ~ bit-map oriented spatial processing ~

block-oriented ~ -branch and bound ~ ( )channel ~ D ~ D- ( )deductive ~ ( )discard ~ (. )exact embedding ~ ( )expansion ~ fast-Fourier-transform ~ graph-based ~ , , Gummels ~ hidden-line ~ ( )image processing ~ iterative ~ Lee ~ , min-cut ~ modified Lee ~ ( ), N-step ~ N- one-direction ~ pessimistic simulation ~ ( , ..)random-search ~ repair-most ~ Roths D ~ D- routing ~ Schonhage ~ ( )selective-trace ~ ( )

alg

7

sequential ~ stable sorting ~ star ~ ( )table-driven ~ 9-value D- ~ D-wiring ~

aliasing ( )

aligner (); auto(mask)~ ( )contact ~ deep-UV projection ~ ALI [ -] diffusion tube ~ direct step-onto-wafer ~ ( )electron-beam ~ - full-field (mask) ~ () hard-contact ~ mask ~ (); projection ~ proximity ~ ()reduction projection ~ site ~ soft-contact ~ step-and-repeat [step-by-step, stepper] ~ shadow (projection) mask ~ ()

submicron (mask) ~ ( ) wafer ~ wafer-stepping ~ X-ray ~

alignment ; coarse ~ ; die-by-die ~ diffraction grating ~ double-diffraction ~ epitaxial ~ fine ~ ; Fresnel-zone ~ full-wafer [global wafer] ~ laser interferometric ~ laser scanning ~ level-to-level ~ , mask-to-wafer ~ multiple-mask ~ off-is ~ projection (mask) ~ proximity (mask) ~ () reticle ~ ; site-by-site ~ ( )spaced ~ ()target ~ theta ~

allocation:connections ~ ()

all

8

allocator:control ~ data/memory ~

alloy | mercury-cadmium-telluride , III-V ~ V

alloying:interface ~

alpha 1. ( 2. -

alumina , l23glazed ~

aluminizing aluminum , l

glass-coated ~

ambient:annealing ~ dry oxygen ~ oxidizing ~ ; reducing ~ ;

amorphization ( )

amplification 1. 2. small-signal ~ 1. 2.

amplifier antilog(arithmic) ~ bi-FET ~ bulk-effect ~ charge-transfer ~ Darlington ~ differential ~ drift-stabilized operational ~

high-output current operational ~ high-stew rate operational ~ high-speed operational ~ high-voltage operational ~ hybrid ~ , IC ~ , logarithmic ~ low-drift operational ~ mixed-process ~ , monolithic ~ ; off-chip ~ [] one-chip ~ on-chip ~ operational ~ optical isolation ~ optically-coupled ~ sample-and-hold ~ semiconductor ~ S/H ~ . sample-and-hold amplifiersmall-signal ~ thick-film ~ thin-film ~

analysis ~ synthesis ~ variance block-level ~ charged particle tivation ~ circuit ~ 1. 2. computer circuit ~

ana

9

design ~ 1. 2. , EAPFS ~ effect-cause ~ -electron microprobe ~ failure (-mode) ~ ; gate-level ~ hazard ~ incremental circuit ~ liquid-crystal failure ~ means/ends ~ ( )mixed-level ~ mixed-mode ~ modified mesh ~ () modified nodal ~ multilevel ~ neutron tivation ~ nuclear reactions ~ on-line circuit ~ post-fault ~ race ~ ( )reject ~ residual gas ~ signature ~ sparse tableau ~ spike ~ ( )static timing ~ steady-state ~ surface elemental ~ ()

thermogravimetric ~ (. )timing ~ ( )transient ~ what-if ~ -worst-case ~ X-photoemission spectroscopy ~

analyzer (1. 2. )basic ~ logic ~ , multichannel ~ optical ~ path ~ , ( )semiconductor impurity ~ spreadsheet ~ ( )

AND:dot [implied, wired] ~

angle:sidewall ~ 1. () 2. () 3. (. )

anhydride:boric ~ , , 23phosphoric ~ , , 25phosphorous ~ , , P2O3

anisotropy etching ~

anneal | high-temperature ~

annealer electron-beam ~ -

annealing bulk ~ capless ~ capping ~ contact ~ ( )

ann

10

diffusion ~ hydrogen ~ implant(ation)~ ion-beam ~ - lamp ~ laser(-beam)~ light ~ microwave ~ -plasma ~ , pulse ~ rapid ~ superficial ~ thermal ~ [] ,

anodization electrolytic ~ plasma ~

antifuse (, )

antimonide ( )aluminum ~ , AlSbgallium ~ , GaSbindium ~ , InSb

antistat anodization (

)

apparatus ; cluster ion-beam ~ () double-crucible crystal-growing ~ float-zone ~ vapor-growth ~

apparel:clean-room ~ ()

applicator:glue ~ ()

approach ; (. method,mode, technique)

basic ~ - bipolar ~ () bottom-up ~ Bristle Blocks ~ building-block ~ cassette-to-cassette ~ cellular ~ cermet ~ chip-and-wire ~ circuit motivated ~ -custom [customized] ~ () divide and conquer ~ , ( )edge-based ~ ( )epic ~ -, -figure-based ~ ( )fixed-interconnection pattern ~ flat ~ () ( )flip-chip ~ gate-array ~ , hierarchical ~ hierarchical nesting ~ hundred r nt yield ~ 100%- hybrid ~ incremental ~ in-line ~ (. )

app

11

iterative-ll ~ , Macrocell ~ master MOS ~ -master-slice ~ mesa-epitaxial fabrication ~ modular ~ monolithic ~ () path-oriented ~ , ( )planar (processing) ~ polycell (layout) ~ () (. )sea gates ~ () selective field-ide ~ shaped-beam ~ SOS ~ -standard ll(-based)~ structured ~ top-down ~ twin-tub ~ ( )two-polysilicon ~ waveform ~

approval:design ~ specification ~

approximation:FB [flat-band] ~ linear piecewise ~ - ( )

architecture 1. ; ; 2. bit-slice ~

channelless ~ ( )fault-tolerant ~

area 1. , ; (. region, zone) 2. base ~ 1. , 2. bond (ing) ~ chip-mount(ing) ~ clean ~ , , collector ~ 1. , 2. connector ~ contact ~ 1. 2. diffused ~ drain ~ 1. , ( ) 2. dust-controlled ~ () edge-contact ~ emitter ~ 1. , 2. ion-damaged ~ , land ~ masked ~ ; metallized ~ ide-free ~ placement ~ , plate loading ~ possible trouble ~ raised-contact ~ , raised-metallized ~ ; , routable ~ , safe operating ~ ( )

are

12

shaded ~ mask source ~ 1. () 2. stage working ~ terminal ~ wiring ~ ,

arm:SMIF ~ ( ) transfer ~ ,

arrangement 1. ; 2. 3. basic-circuit ~ diode ~ 1. 2. ; gate ~ 1. 2. ()heat-sinking ~ matrix ~ mounting ~ -ordered ~ stacked ~

array 1. ; 2. 3. 4. 5. bipolar ~ bulk CMOS ~ 1. 2. - cell ~ 1. (. ) 2. , [] channel-free [channelless] gate ~ charge-coupled(-device)~ circuit ~ 1. 2. coupled quantum box ~ customizable ~ data ~ diode ~ with self-scanning

drop-in test ~ FET ~ 1. 2. field-programmable gate ~ , fuse-link [fuse-programmable] gate ~ , [] C ~ ; image ~ 1. () 2. large-scale ~ ; laser-scanning ~ , lateral ~ linear ~ ( ); logic ~ [] , ; Macrocell ~ ( )mask-programmable ~ 1. , 2. , master slice ~ 1. 2. , master-slice gate [master-slice logic] ~ , [] memory ~ 1. 2. mesa p-n diode ~ microcell ~ monolithic ~ ; multichip ~ multistrip ~ n-channel [negative] MOS ~ 1. n--; n- 2. n- -

arr

13

nonoverlapping redundant ~ , original image data ~ original subimage data ~ pattern ~ ()p-channel MOS ~ 1. - -; - 2. --pin-grid ~ 1. 2. polycell ~ , (. - -)processing ~ programmable gate ~ , [] programmable logic ~ , register ~ semiconductor ~ semicustom ~ Schottky(-cell)~ Schottky TTL gate ~ , -single-layer metal ~ ; SOS ~ --; -standardized ~ ; storage logic ~ , structured ~ ( )systolic ~ ()tile(d)~ ( )uncommitted logic ~ universal ~ ( )

wafer-scale ~ ; x-y ~ 2D quantum box ~

arsenide ( () )aluminum ~ , AlAscadmium ~ , CdAsgallium ~ , GaAsindium ~ , InAs

arsine , , AsH3artwork ();

; ( )computer-generated ~ , mask ~ ; negative ~ []photo ~ positive ~ []rubylith ~

asher:plasma ~ ()

ashing:plasma ~ (. )

ASIC array-based ~ (. )standard-ll based ~

asperity (); aspirator:

chip ~ assay:

gravimetric ~ potentiometric ~

assemblage 1. ; 2. ; assembler 1. -

2. ; chip ~ 1. () ( ); ( ) 2.

ass

14

[]flat- ~ 1. () 2. ( )hybrid ~ ()] software ~ , surface-mount ~

assembly 1. ; 2. ; beam-lead ~ beam tape-automated ~ charge-shift ~ , chip ~ 1. ( ); ( ) 2. ()chip-and-substrate ~ chip-carrier ~ chip-on-board ~ () cut and paste ~ ( )flip-chip ~ header ~ hybrid ~ 1. 2. microelectronic modular ~ molded ~ , ( )multichip ~ 1. 2. operating ~ semiconductor ~ 1. 2. step-by-step ~ surface-mounted ~ 1. 2.

assertion:

timing ~ ( , )

assignment:column ~ ()gate ~ ( )pin ~ row ~ ()

Association:Electronic Industries ~ ()Semiconductor Industry ~ ()

assumption:single-stuck fault [SSF] ~

assurance:CAD system sofware quality ~ [] neutron-hardness ~

atmosphere:humid-hydrogen ~ inert ~ oxidation [oxidizing] ~ ; reducing ~ ;

atom:acceptor ~ diffusing ~ donor ~ dopant ~ foreign ~ ()impurity ~ interstitial ~ , n-type dopant ~ photo-generated ~s , p-type dopant ~ substitution ~

attachability:

att

15

die ~ ( )

attacher:frame ~ (. )

attachment 1. () ; () 2. ; die ~ [, ] (. ) die ~ eutectic die ~ flip-chip ~ flywire ~ lead-frame ~ (. )reflow ~ (. ) solder die ~

audit:conformance ~ (. )quality ~ spec. ~

autodope ,

automation:design ~ flexible ~ front-end ~ layout ~

autoregistration avalanche ,

electron ~ electron-hole ~ -

axis:crystal ~ twin(ning)~

B

backfill:V-groove isolation polycrystal ~ V-

backing ; backlap

()backscattering

Rutherford ~

backstreaming:oil ~ ( )ultra-low ~ ( )

backplane ; ;

backup 1. 2.

bag:antistatic ~

bake 1. , , 2. (. )hard ~ 1. 2. ()post ~ 1. 2. postdevelopment [postexposure] ~ soft ~ 1. 2. ()

bakeout ; , (. - bake)

ball , tinned ~ solder ~

ballast:resist ~

band 1. () 2. (); ()allowed ~ empty ~ energy ~ filled ~ flat ~ forbidden ~ impurity ~ cupied ~ rmitted ~ speed-power ~ ( )unoccupied ~ valence ~

ban

16

bandgap () ; () (. - gap)

banding ( )impurity ~ ( )

bandwidth 1. () 2. ()forbidden ~

bank ; ; | ;

bar () ; heating ~ ()n-type ~ ( ) n-zone-levelled ~ ,

barrier 1. 2. (.- junction) 3. ( )diffusion ~ , isolation ~ Josephson ~ , metal-semiconductor ~ ; organic-on-organic contact ~ oxidation ~ , (. )p-n ~ pn-potential ~ quasi-Schottky ~ resonant tunneling ~ ()Schottky ~ short period superlattice [sps] ~ unmasked ~

base 1. , 2. ;boron ~ , diffused ~ extrinsic ~ insulating ~ [] intrinsic ~

metal ~ 1. ( ) 2. ()oxide-walled ~ , package ~ permeable ~ [] ( )

base-insert ()

basis:link-by-link ~ ( )

basket:wafer ~

batch ; , batch-fabricated, batch-produced

bath

electrolythic [electroplating] ~ , etch ~ plating ~ ,

bay:diffusion ~

bead:photoresist edge ~

beak:birds ~ 1. ( ) 2. ( ) 3. ( )

beam ; electron-compensated ~ ion () excimer ~ Gaussian ~ , impurity-ion ~ Kauffman ion ~ microfocused ion ~ , molecular ~ ygen plasma ~

bea

17

plasma ~ reactive-ion ~ shaped ~

beam-leaded beamwriter bed nails

( )

behavior 1. () 2. ( ) 3. () 4., ~ circuit design external ~ , -functional ~ , output ~ semiconductor ~ 1. 2. []steady-state ~ timewise ~ transient ~ worst-case timing ~ ,

bench 1. 2. clean ~ () clean air ~ ( )laminar flow ~ () test ~

bender lead ~ ()

bending:band ~ [] ()

beryllia , glazed ~

beta 1. , ( ) 2. -

direct-current ~ inverse ~

bewildering 1. 2. ( )

bias 1. ; | ; 2. ,() | , automatic ~ back ~ , cutoff ~ etching ~ forward ~ , gate ~ 1. 2. reverse ~ ,

billet ; () semiconductor ~

bin , ( )binder ()

glass [vitreous] ~ binding:

immutable ~ ; module ~ signal ~

biochip , ( , )

bipolar 1. ; , 2.TTL-compatible ~ ,

bite:mouse ~s ( )

bit-slice blade 1. ; (

) 2. annular ~

bla

18

diamond (impregnated) ~ doctor ~ , electrodeposited diamond ~ , multiple ~s ( )peripheral ~ saw ~ ; sintered-diamond ~ ,

blank 1. ; 2. (. , )antistatic mask ~ screened ramic ~ ULA ~

blanket:inert-gas ~

bleeding (. )bleed-out (. )blemish ; (.

)blister ; (.

)bloating ; (.

)block ; ;

~ with repetitive structure , (. ,, , )basic ~ building ~ ; contact ~ 1. ( ) 2. contact leakage ~ ( )diffused-resistor ~ ( ) fault-tolerant building ~

fine dimensional ~ functional ~ large dimensional ~ logic ~ ( )metal quality ~ () pad ~ parametrizable ~ regular ~ test ~ ,

blockage ( )blower:

destaticizing ~

blurring:image ~ pattern ~ penumbral ~

board ; (. - card)bare ~ ceramic tape multilayer ~ chip ~ composite ~ daughter ~ DIP ~ DIP-edge ~ fine-like ~ (. )high-density ~ hybrid-circuit ~ () known-good ~ loaded ~ mother ~ , ; multiwire ~ populated ~ printed circuit ~ programmable silicon circuit ~ surface-mounted ~ unloaded [unpopulated] ~

boa

19

wire-wrap ~

boat 1. 2. cleaning ~ CVD ~ diffusion ~ furnace ~ growth ~ polysilicon ~

body 1. 2. carrier ~ compound-semiconductor ~ ()epitaxial ~ intrinsic ~ package ~ resistor ~ unitary ~ []

bomb:freon ~

bombardment:alpha-particle ~ -energetic ion ~ (>100 )ion ~

bond ; ; | ;, aluminum-wire ~ (. )Au-Al ~ ball ~ , die ~ ( )epoxy ~ (. ) eutectic ~ (. )

face ~ , glass ~ ; nail-head ~ , solder ~ solderless ~ [] sound ~ stitch ~ , , thermal-pulse ~ , thermocompression ~ ultrasonic ~ , wire ~ ,

bondability , thermocompression ~ wire ~

bonder 1. 2. (. )ball ~ beam tape-automated (bonding) ~ ( )BTAB ~ . beam tape-automated (bond-ing)bonder die ~ flip-chip aligner ~ hot gas ~ ( )hot-tip ~ hybrid (die) ~ , inner-lead ~ ( )

bon

20

microprocessor-controlled ~ nonflame spot ~ (. )outer-lead ~ ( ) pulsed-heat ~ spot ~ ; TAB ~ . tape-automated (bonding) bond-ertape-automated (bonding) ~ ( )thermocompression ~ thermosonic ~ ultrasonic ~ wedge ~ wire ~

bonding ;; ; , (. - bond, weld, welding)aluminum ~ automated tape-carrier ~ ( )back ~ ball ~ , batch ~ beam-lead ~ beam tape-automated ~ ( )birds-beak ~ blind ~

bumped tape-automated ~ ( )cement ~ (. )chip ~ [] chisel ~ ( )compliant ~ diffused [diffusion] ~ electron-beam ~ -energy-pulse ~ () face (-down) ~ field-assisted ~ ( ), flip-chip ~ flux-free [fluxless] ~ fusion ~ gang (-lead) ~ gold ball ~ inboard ~ interconnection ~ laser ~ lead ~ nail-head ~ , spider ~ ( )stitch ~ , TC ~ ,thermal-pulse ~ thermocompression ~ , thermosonic ~ wedge ~

bon

21

wire ~ 1. ; 2. wobble ~

booth:laminar-flow ~ [] (. )

boron , boron-diffused borosilicate

lead ~ ( )

Borsenic ( 23 As2O3)

bottle:source ~ ()

bottleneck in design bottom ; ; boule () ; boundar/y ;

antiphase ~ [] crystal ~ 1. 2. , domain ~ , grain ~ , small-angle ~ies , twin ~ , twist grain ~

bowing (. )

bowl:fish ~ () vibratory ~ ( )

box ; (. )controlled nitrogen ~ dry ~ dust-proof ~ glove ~ quantum ~ wafer shipping ~

bracelet:

grounding ~ ( )

branch:delayed ~ ( )fanout ~es

brazing ( 500 )eutectic vibration ~

breadboard | master slice ~ silicon ~ software ~ solderless ~ ( )

breakage:slice ~ []

breakdown avalanche ~ high-temperature ~ oxide ~ ; ( -)punch-through ~ , tunnel ~

breaking 1. , 2.; , ( ())chocolate ~ []( )

breakpoint ()assertion-driven ~ , data ~ ( )global ~ postamble ~ preamble ~ programmable ~

bridge ; ; , ; (. );

bri

22

air ~ ( )bridging ~ () ( )electrical ~ 1. ; (. )2.

bubble 1. , 2. 3. (. )cylindrical magnetic ~ , light ~ (. ZnS)magnetic ~ 1. , 2. seed ~ single-chip ~

bubbler.vapor ~ () ()

bucket:charge depletion ~ ( ); , , (. )

bucket-brigade 1. 2. ( - )

buffer 1. ; 2., 3.

bug:dead ~ (. DIP--),

build-up , charge ~ emulsion ~ (. )photoresist edge ~

bulk ; ()bump ,

evaporated ~ , ()external ~ ()

flip-chip ~ gang-bonding ~ plated ~ , sol-der ~ sputtered gold ~ ,

bumping tape ~ wafer ~

burn-in 1. ; 2. ;

burn-off (); (. , )

burn-out ; (. )

bus () address ~ backplane ~ data ~ polysilicon ~ stacking ~ wired-logic ~ ( )

busbar () (. bus)busket:

washing ~ ( ); ( )

bypass ; | ;

C

cabinet:environment ~

calculation:DD [drift-diffusion] ~ -

calculus:D- ~ D-, D- ( )

camera:

cam

23

multiple-lens step-and-repeat ~ optical step-and-repeat ~ ,reduction ~

can () transistor-outline ~ ,

cap (); annealing ~ () antireflection ~ glazed-ramic ~ oxide ~ () ()

capabilit/y:bearer ~ ( )current(-handling) ~ fan-out ~ (); functional ~ies load-driving ~ logic ~ ; output ~ photoresist imaging ~ repair ~ ;resolution ~ ,speed ~ technological ~

capacitance () (. -capacity)barrier-layer ~ charge ~ depletion(-layer) ~ inversion ~ node ~ node-node ~ stray ~ transfer ~

capacitor charge-storage ~ ;

chip ~ coupling ~ 1. 2. decoupling ~ diffused(-junction)~ fixed ~ floating ~ ( )flying ~ groove ~ ( )IC ~ isolation-merged ~ , junction ~ memory ~ ; MOS ~ -nitride ~ stacked ~ trench ~ ( )variable ~ wafer ~

capacity 1. () (. -capacitance) 2. current-carrying ~ gate ~ 1. 2. microprocessor-kit ~ [] MOS ~ 1. - 2. -output ~ 1. 2. placement ~ power(-handling)~ resolving ~ , wafer ~ 1. 2. , (. )

capillaries

cap

24

capillary:bonder ~ , ( )

capping , post-implantation ~

capsulation glass ~

capsule:quartz ~ (. )

capture | carrier ~

card ; (. - board)chip ~ 1. 2. IC ~ logic ~ probe ~ ( )

carousel:component ~ ( )

carrier 1. () 2. ; 3. 4. ; ; bumped chip ~ ceramic ~ 1. 2. charge ~ chip ~ , conductive ~ 1. 2. (. )current ~ diffusion (-step) ~ extrinsic ~ flip-chip ~ furnace (slice) ~ hybrid ~ inert ~ -injected ~ intrinsic ~ leaded chip ~ leadless chip ~

majority ~ mask ~ 1. 2., microcircuit ~ 1. 2., minor [minority] ~ multichip ~ 1. 2. multilayer chip ~ photogenerated charge ~ , polyimide ~ () post molded chip ~ (), premolded chip ~ ring ~ ( )single-layer chip ~ substrate ~ , ( )tape chip ~ wafer ~

case | molded ~ ; transit ~ (.)

cassette accept ~ reject ~ send ~ rework ~ SMIF ~ wafer ~

cathode:hollow ~ multifacet ~ ( )wafer cooled ~ ( )

cathodoluminescence

cat

25

cave:bat ~

cavity:chip ~ ( )mesa ~ -; -

CCD , barrier-type ~ bulk-channel ~ buried-channel ~ deep-depletion ~ junction ~ -n-overlapping-gate ~ , parallel-transfer ~ peristaltic ~ polysilicon-gate ~ recirculatlng ~ self-aligned ~ short-gate ~ staggered-ide ~ stepped-ide ~ surface-channel ~ two-phase ~

cell 1. ; 2. ( ); 3. ( ) 4. basic ~ bipolar ~ charge-coupled ~ ; charge-storage ~ ; CML memory ~ coupled [coupling] ~ [] (

)cross ~s effusion ~ ICmemory ~ interface ~ ; iterative master ~s , jumbo ~ logic ~ 1. (. - gate)2. manufacturing ~ , master ~ memory ~ monolithic ~ ; MOS memory ~ -multigate ~ 1. 2. one-device [one-T] ~ ; polysilicon-load ~ prediffused ~ (. )standard ~ (); ()super ~ taper isolated ~ uncommitted transistor ~ (. )unit ~ 1. , (. ) 2. ()

cement | ; center 1. 2.

acceptor ~ charge recombination ~ deep ~

cel

26

deep-level trapping ~ defect ~ donor ~ generation ~ impurity ~ killer ~ (.)negatively charged ~ ( )negative U- ~ neutral trapping ~ nonradiative ~ NU- ~ . negative U-centernucleation ~ ,positively charged ~ ( )radiative recombination ~ street ~ trapping ~ ,

centering:technological ~ ( )

centrifuge | centroid:

charge ~ ceramic | ceramics

aluminum(-oxide) ~ , beryllium (-oxide) ~ , camber-free - glazed ~ metal ~ , multilayer ~ piezoelectric ~ PZT ~ superconducting [superconductor] ~

Cerdip . ,

DI-cermet ,

base-metal ~ noble-metal ~

certification:process ~

chaining:command ~ ( )

chamber.coating ~ () ] , CO2/LN2 ~ deposition ~ () environment ~ evacuated growth ~ evaporation ~ () , high-low [humidity] ~ inserting ~ internal ~ (. )low-vacuum ~ plasma-etching ~ processing ~ reaction ~ sealed ~ sputtering ~ supervacuum ~ taking-out ~ ultrahigh-vacuum ~ work (piece) ~

change:compositional ~ phase ~

channel 1. () 2. , 3. ( ) 4. 5.

cha

27

bearer ~ buried ~ charge-tranfer ~ cleavage ~ ( )data ~ depletion ~ electron ~ n-enchancement ~ FET ~ [ ] Gaussian-doped ~ implanted ~ - induced ~ internal ~ ()inversion [inverted] ~ isolation ~ ; metal ~ metallized ramic ~ (. )return ~ ( )scribe ~ standard ~s (. )surface ~

channeling:ion ~ planar ~

chan-stop ,

characteristic base ~ [] ()capacitor-voltage ~ -collector ~ [] ()current-stable ~ S-current-voltage ~ -, emitter ~ [] ()

epi(taxial) -layer ~ forward ~ frequency(-response)~ -, guaranteed rformance ~ interfacial ~ load ~ 1. 2. negative-resistance ~ nonsaturation current-voltage ~ - N-type ~ N-performance ~ reverse ~ saturation ~ speed ~ static ~ steady-state ~ () S-type ~ S-subthreshold ~ terminal ~s device transfer ~ 1. 2. ()voltage-capacitance ~ -voltage-current ~ -, voltage-stable ~ N-

characterization:ellipsometric ~ LSI ~ 1. 2. MOS-process ~ 1. - 2. [] -properties ~ 1. ; (.

cha

28

) 2. (.)

charge 1. () 2., background ~ bound ~ bulk ~ electron ~ , electrostatic ~ elementary ~ , evaporation ~ () excess ~ immobile ~ induced ~ [] point ~ space ~ ; specific ~ static ~ stored ~ trapped ~ volume ~ ;

chart 1. ; ; 2. flow ~ 1. ; 2. -layout ~ logic ~ -process ~ ;

chase ( )chatter 1. (.

) 2.; | ;

check ; | ;built-in ~ dimension ~ [] electrical rule ~ , etch ~ () ()functional ~ ; nondestructive ~

checkability checker 1. ;

2. ;

connectivity ~ crystal ~ design rule ~ electrical performance ~ flatness ~ (. )layout ~

checking ; (. - check)control state ~ design rule ~ () marginal ~ rule ~ () self-checking ~ ,

checkout 1. 2. ; automatic ~ operational ~

chemical electronic-grade ~ etching ~ fine ~ wet ~

chemisorption chemistry:

dry ~ (. )ion-beam induced surface ~ , plasma etch ~ selective laser-induced heterogeneous ~ - surface ~ wet ~

chemotronics chiller:

cold trap ~ ()

chip 1. (. ) 2. , ; (. - circuit,integration) 3. (. ) ~-on-tape ,

chi

29

array ~ 1. 2. 3. , backbonded ~ 1. 2., balls-down ~ bare ~ 1. 2. beam-lead(ed)~ 1. 2. bubble-domain [bubble-memory] ~ 1. 2. bumped ~ committed ~ 1. 2. component ~ contiguous-disk (bubble) ~ custom (-built) ~ customizable ~ ,dense ~ discrete-device ~ electronic ~ 1. 2. , ; face-down ~ factory-programmable ~ , fast ~ fault-free [fault-tolerant] ~ flip ~ full-wafer ~ fuse-programmable ~ , gate-array ~ glue ~ heterogeneous ~ , highly-ked ~ 1. 2.

hybrid ~ 1. 2. ,hyper ~ , , IC ~ individual circuit ~ integrated-microcircuit ~ mask-programmable ~ master(-slice)~ ,master-slice logic ~ memory ~ 1. 2. micro ~ , microcircuit ~ 1. 2. , microprocessor ~ , monolithic ~ 1. 2. multilead ~ 1. 2. naked ~ 1. 2. nongold backed ~ , , opto ~ 1. 2. packaged ~ pedestal ~ peripheral ~ pipelined ~ planar passivated ~ , Poly Use ~ ,process-development ~ process-validation ~ resistor ~ semiconductor ~ 1. 2.

chi

30

SLS ~ solder ~ , super ~ , , support ~ TAB ~ test ~ thick-film ~ thin-film ~ tolerant ~ ultra ~ , , uncommitted ~ (. )unpackaged ~ 1. 2. wire-bonded ~ XR ~ ()X-ray made ~ , III-V ~ AIII BIV

chip-carrier , (. - carrier)

chip-cuts ()chip-on-board

( )

chipper:single ~ ;

chipping:peripheral ~ (.)

chipstrate ( )

chuck:electrostatic wafer ~ vacuum ~ ;

circle:Hamilton ~ ( )

circuit ; ; (. - chip,integration)active ~ air-isolation integrated ~ all-diffused ~ aluminum-gate (MOS) ~ amplifier integrated ~ , analog integrated ~ AND ~ AND-OR ~ application specific integrated ~ array integrated ~ asymmetric-chevron (bubble) ~ basic ~ beam-lead(ed) integrated ~ bipolar ~ , bipolar-FET integrated ~ breadboard ~ built-in self-checking monitoring ~ bulk-effect integrated ~ catalogue integrated ~ ceramic-encapsulated integrated ~ charge-coupled (device) ~ charge-domain integrated ~ charge pumping ~ charge-transfer (device) ~ chip integrated ~ CMOS ~ , commodity integrated ~ common-base ~ common-collector ~ common-emitter ~ compatible integrated ~

cir

31

complementary integrated ~ complex integrated ~ control integrated ~ crosspoint integrated ~ , current mirror integrated ~ custom [customized] integrated ~ custom-wired integrated ~ Darlington(-type)~ dead-on-arrival integrated ~ dedicated (-design) ~ depletion-mode integrated ~ , die integrated ~ dielectrically-isolated integrated ~ digital integrated ~ digital sequential ~ diode-array integrated ~ discrete-chip integrated ~ , discrete-component ~ discrete Fourier transform integrated ~ discrete integrated ~ distributed-element equivalent ~ domain-originated integrated ~ dry-processed integrated ~ , ( )dual in-line integrated ~ DIP-ECL ~ - , , EFL integrated ~ , , elevated-electrode integrated ~ encapsulated integrated ~ 1. 2

enchancement-mode integrated ~ , epitaxial integrated ~ , epitaxial passivated integrated ~ , -equivalent ~ face-down integrated ~ , fanout-free ~ fault-free [fault-tolerant] ~ faulty ~ field-effect (transistor) integrated ~ field-programmable logic integrated ~ , film-mounted integrated ~ fine-line [fine-pattern] integrated ~ flat-pack integrated ~ flip-chip integrated ~ , flip-flop ~ ; front-end ~ full-custom integrated ~ functional integrated ~ gang-bonding integrated ~ , gate-equivalent ~ , ( )governor integrated ~ guard-ring isolated integrated ~ Gunn-effect integrated ~ heterointegrated ~ high-density integrated ~ highly integrated ~ , , high-rformance ~ high-speed integrated ~

cir

32

high-technology integrated ~ , high-threshold logic ~ high-volume ~ home-grown integrated ~ homointegrated ~ hybrid ~ , hybrid dielectric integrated ~ hybrid film [hybrid-type] ~ , (. - hybrid)I2L ~ , 2infra-red integrated ~ () , -insulated-substrate integrated ~ , -integrated ~ , (. - chip, integration)interface ~ isoplanar-based integrated ~, Josephson(-junction)~ ion-implanted integrated ~ - junction isolated integrated ~ n-known-good ~ ladder(-like) ~ laminated integrated ~ large-scale integrated ~ , , leading-edge integrated ~ , ; linear integrated ~ LOCOS integrated ~ . logic integrated ~ low-noise ~ low-profile integrated ~

LSI ~ , , lumped-element equivalent ~ made-to-order integrated ~ master-slice integrated ~ matrix integrated ~ megascale integrated ~ 106 MOSBIP integrated ~ , - memory ~ merchant integrated ~ merged integrated ~ , 2microelectronic ~ , (. - integration)Micronor integrated ~ . micron-scale integrated ~ microprocessor integrated ~ , molecular integrated ~ monobrid ~ , monolithic ~ ; MOS(-transistor) ~ -, MSI ~ , , multichip ~ multilayer [multilevel] integrated ~ multiple-chip ~ naked integrated ~ NAND ~ noise-immunity integrated ~ nonredundant integrated ~ NOR ~ off-the-shelf integrated ~ one-chip integrated ~ one-mask integrated ~

cir

33

open-collector integrated ~ optical integrated ~ ; optoelectronic integrated ~ OR ~ oxide-isolated integrated ~ partially self-checking ~ photo-integrated ~ , ( )photonic integrated ~ planar integrated ~ , planar-mounted integrated ~ plastic (encapsulated) integrated ~ 1. , 2. p-n junction isolated integrated ~ -n-polymer thick-film ~ prediffused integrated ~ programmable integrated ~ proprietary integrated ~ quick Fourier transform ~ race-free ~ , radiation-hardened integrated ~ - R ~ - , RC-redundant integrated ~ refresh (ing) ~ , sample-hold ~ scaled integrated ~ scan design ~ , schematic ~

Schottky TTL (integrated) ~ , screen-printed integrated ~ sealed-junction integrated ~ , ( )self-aligned integrated ~ , self-cased LSI ~ self-checking [self-testing] integrated ~ semiconductor ~ 1. 2. semicustom [semicustomized] integrated ~ S/H ~ . sample-hold circuitsingle(-chip)~ skimming-and-reset ~ slice ~ small-integration ~ smart-power integrated ~ ( )SOI integrated ~ , -solid(-state) integrated ~ ; SOS integrated ~ , -stacked ~ standard ll-based semicustom integrated~ Strassen algorithm LSI ~ , ( )stripline integrated ~ submicron integrated ~ subnanosecond integrated ~ superconducting [superconductor] integrat-ed ~

cir

34

surface-mounted integrated ~ test-manufactured integrated ~ thick-film (hybrid) integrated ~ thin-film (hybrid) integrated ~ three-diffusion integrated three-dimensional integrated ~ transistor ~ , tri-mask integrated ~ , UHSI ~ uncommitted integrated ~ unipolar integrated ~ user specified integrated ~ C, vacuum integrated ~ () VHSI ~ [], VLSI ~ , wafer-scale integrated ~ wired OR ~ 3D integrated ~

circuitry (. - chip, circuit,integration)chip-temperature-sensing ~ ECL ~ , - ; -hardware ~ level-shifting ~ ()

clamp:Schottky ~ []

class:placement ~ (. ),

classification:automatic ~ dust ~ ( )

classifier 1. ( ) 2. ,

cleaner (. )aqueous ~ ; PCB ~ vapor ~

cleaning:glow-discharge ~ heat ~ ion-beam ~ organic ~ plasma etch ~ solvent ~ sputter ~ ultrasonic ~ ultraviolet/ozone ~ [-]

cleanout:development ~

cleanup clearing ; cleavage 1. , (.

) 2. climb:

dislocation ~ clock 1. ;

| ; 2. ;

clocking:two-phase ~ ( )

clogging:capillary ~ (. )

close-up ;

closure:package ~

cluster:

clu

35

defect ~ ion ~

CMOS -,-bulk ~ - () ( )junction-isolated ~ - -n-latch-up immune ~ - overlaid ~ - oxde-isolated ~ - stacked ~ -super ~ - ( )

coalescence , ()

coat ; | coater

cassette-to-cassette ~ photoresist ~ solder ~ spin-on dopant ~ vacuum ~

coating 1. ; 2. adhesive ~ ; anodic ~ blanket ~ composite ~ ; conformal ~ ( )dip ~ epoxy ~ evaporation ~ , () fluidized-bed ~ junction ~

lamination ~ multilayer ~ oxidation ~ 1. ; 2. passivaling [passivation] ~ photoresist ~ 1. 2. polyimide die ~ sandwich ~ screened [silk-screened] ~ , solderablc ~ , spin-on ~ striation-free ~ ( ) vapor-idation [vapox] ~ ,

codomain ( )coefficient:

dielectric ~ diffusion ~ distribution ~ Ettingshausen-Nernst ~ expansion ~ , Hall ~ [] negative temperature ~ Peltier ~ positive temperature ~ recombination ~ Seeback ~ sticking ~ ( )temperature capacitance ~ , temperature frequency ~ , temperature resistance ~ ,

cod

36

thermal expansion ~ , Thomson ~

co-evaporation:thermal ~ ,

coffin ;

cofi co-fire ( )

| ( )

coil inductance ~ stripline ~

co-implantation:P/Be ~

collapsing:dominance fault ~ equivalence fault ~ fault ~

collection modules collector ,

buried ~ diffusion ~ epitaxial ~ ,, Schottky(-barrier)~

collimation:ion ~

collision:elastic ~ inelastic ~

column:electron-optical ~ - ( )

combination:bipolar logic/complementary MOS ~ [) contact ~

combo commission ;

communication:both-way ~s peer-to-peer ~

compactness:functional ~

compactor , ( )

comparator IC ~ mask (overlay) ~ operational-amplifier ~

compatibility equipment ~ hardware ~ pin ~ () process (ing) ~

compensation charge ~ doping ~ temperature ~

compilation:hardware silicon ~ ( )

compiler:behavioral ~ block ~ cell ~ chip ~ , circuit ~ diagnostic ~ ( , )layout ~ silicon ~

completeness test (, )

complex ; impurity-vacancy ~ vacancy-ygen ~

complexity ; chip (level) ~ circuit ~ flip-fl level ~

com

37

functional ~ , gate ~ 1. 2. logic ~ , space ~ ()wafer ~ ( )wiring ~

component ; (. -element)acoustic-surface-wave ~ added [add-on] ~ axial-lead ~ [] bubble ~ ; bumped ~ chip ~ conventional ~ dedicated ~ diffused ~ discrete ~ electrooptical ~ encapsulated ~ , ; external ~ functional ~ hybrid ~ integrated (-circuit) ~ 1. , 2. , known-good ~ large-scale integration ~ 1. 2. , lateral etch ~ molded ~ monolithic ~ 1. 2. naked ~

off-the-shelf ~ ; out-of-tolerance ~ , packaged ~ passive ~ ; potted ~ , printed ~ ;, programmable system ~ , reeled ~s , ; ()screened ~ , single ~ solid-state ~ ; system ~ 1. 2. , tape (-mounted) ~s 1. , ( ) 2. uncased ~ uncommitted ~ (. )

componentry:distributed ~ lumped ~

composite 1. , 2. planar ~ silicon-on-sapphire ~ , -superconducting ~

composition 1. 2. , ;coating ~ 1. 2. deposition ~ 1. 2. dielectric ~ 1. 2.

com

38

gas-phase ~ 1. 2. multilayer ~ plasmas chemical ~ screenable ~ [] thick-film dielectric ~

compound 1. () ; 2. 3. ; () binary semiconductor ~ , bismuth-based ~ bulk-molding ~ element ~ , heat-sink ~ hygroscopic ~ lapping ~ LSCO ~ La-Sr-Cu-Ometal heterocyclic ~ -organometallic ~ potting ~ pseudobinary ~ pseudoternary ~ sealing ~ semiconducting [semiconductor] ~ thermosetting ~ wide-gap ~ ()III-V ~ AIIIBV1-2-3 ~ Y1Ba2Cu3O7-x

compression:response ~ thermal ~ ,

computer , all-applications digital ~ back-end ~ ( )

divide-and-conquer ~ , front-end ~ LSI ~ mainframe ~ 1. 2. microelectronic ~ microprocessor-array ~ molecular ~ multifunctional processing ~ single-chip ~

computer-aided, computer-assisted ;

computer-controlled concentration

acceptor ~ background (impurity) ~ (. )bulk impurity ~ defect ~ ; dopant [doping] ~ ()dosage ~ emitter impurity ~ () graded impurity ~ intrinsic ~ ionized-impurity ~ per-unit-area ~ per-unit-volume ~ recombination-nter ~ surface-state ~ vacancy ~

concept:building-block ~ design ~

con

39

device ~ microprocessor ~ , whole-wafer ~

condensation:laser induced ~ -

condition 1. 2. l ()binary valued ~ boundary ~s degeneracy [degenerate] ~ diffusion ~ Dirichlet boundary ~ forward-bias ~s hazard ~ limit ~s off ~ ; on ~ ; operating [operation] ~s race ~ reverse-bias ~s self-explanatory ~ sensitizing ~s (. )worst-case ~s

conductance 1. () 2.backward ~ electrical ~ ;, ()forward-transfer ~ junction ~ n-mutual ~ negative differential ~ quantized ~ reverse ~ specific ~

conduction , ()avalanche ~ bulk ~

defect ~ , electrical ~ ,() electron ~ , n-extrinsic ~ forward-bias ~ heat ~ hole ~ , -hopping ~ impurity ~ intrinsic ~ n-type ~ , n-p-type ~ , -thermal ~

conductivity 1. () 2. (. -conductance, conduction)electron ~ , n-electron-beam induced - , extrinsic ~ hole ~ , -impurity ~ intrinsic ~ n-type ~ , n-photo-induced ~ p-type ~ , -small-signal ~ thermal ~

conductor 1. () 2.; 3. ( )base-metal ~

con

40

bonding ~ , cermet ~ []channel-stop ~ cryogenic ~ gold ~ ohmic ~ []polysilicon line ~ screened ~ , self-aligned ~s

conduit:heavily-doped silicon ~ , interconnection ~

configuration 1. ; 2. 3. ; ;() bipolar ~ 1. 2. circuit ~ 1. 2. 3. closed-geometry ~ 1. 2. common-base ~ () common-collector ~ () common-emitter ~ () Darlington ~ diode ~ 1. 2. epoxy ~ lead frame flip-chip ~ , high-resolution ~ meander ~ mesa ~

MOS aluminum-gate ~ - pinout ~ ; sandwich-type ~ , schematic ~ 1. 2. sensitized ~ (., )strip-like ~ transistor ~ 1. 2. transistor-outline ~ , wire ~

confinement:current ~ ( .)

congestion:wiring ~ () ( )

connection 1. ; 2. ; (. - interconnection)bypass ~ chip ~ (. )common-base ~ common-collector ~ common-emitter ~ crossover ~ grounding ~ ,intercell ~ interface ~ ( )intracell ~ overflow ~s power ~ 1. 2. screen-on ~ , self-registrated ~s signal ~ 1. 2.

con

41

terminating [termination] ~ ; via ~ ( )wire ~ ; wired-logic ~ wire-wrapped ~

connectivity:electrical ~ interlevel ~ ( )

connector 1. () 2. ; (. - conductor, connection)

constant , ()absorption ~ Boltzmanns ~ collector-base time ~ dielectric ~ electron diffusion ~ grating ~ Hall ~ [] hole diffusion ~ lattice ~ [] long-time ~ Plank ~ time ~

constraints:placement ~s (. )timing ~s

construction 1. ; 2.; block ~ chip-and-wire ~ () lateral p-n-p ~ n-modular ~ monolithic ~ multichip ~ n-channel MOS ~ n- -p-channel MOS ~ - -thick-film ~ 1. 2.

thin-film ~ 1. 2. vertical p-n-p ~ p-n-p -

consumption:power ~

contact 1. | 2. ; (. - electrode)alloyed ~ [] base ~ 1. 2. , beam-lead ~ bifurcated ~ blocking ~ bonded ~ bump ~ , buried ~ [] crimp ~ edge-board ~ , ( )excimer-laser mixed ~ , hard ~ ()injection ~ ion-implanted ~ , low-resistance ~ metallization ~ 1. 2. metal-semiconductor ~ MIS ~ -nonohmic ~ []nonrectifying [ohmic] - [] point ~ polysilicon-to-diffusion ~ protruding ~ , rectifying ~ []

con

42

resistance ~ []Schottky(-barrier)~ Schottky base ~ soft ~ ( )soldered ~ substrate ~ vacuum ~ ()welded ~

container:wafer-processing ~ () ;

contaminant , ()

contamination 1. , () 2. gross ~ metal ~ paniculate ~ ()

contaminometer

contour:edge ~ [] (. )peripheral ~

contrast:resist ~ stroboscopic voltage ~ voltage ~

control 1. ; | ; 2. ; |; contamination ~ data ~ data link ~ depth ~ (. ); (. n-)dust ~ ()impurity ~ ( )

lateral ~ linewidth ~ ; ( )link status ~ microprocessor ~ , model reference adaptive ~ oscillation ~ particle ~ ( )position (ing) ~ profile ~ (. )program analysis adaptable ~ reliability ~ resistivity ~ shutterable ~ stitching ~ system-level ~ Z-axis ~ Z,

controllability ;combinational ~ ; sequential 0 ~ ~ 0sequential 1 ~ 1

controller bus interface ~ ( )furnace ~ ()graphic options ~ hybrid microelectronic ~ memory ~

con

43

microprocessor ~ microprogrammed ~ multiprotocol communications ~ , programmable ~ stage ~ vacuum-deposition ~

conversion ; conductivity-type ~ []

converter image ~ , () solid-state image ~ SO-to-DIP ~ SO DIP

conveyor:band [belt] ~

convolver mesa p-n diode-array oustic-surface-wave~ ,

cooker:pressure ~

coolant , cooler:

metal-semiconductor thermoelectric ~ Peltier(-ffect)~

cooling:convective ~ forced ~

coordinatograph Coplamos . (

n- )copy:

photomask ~ ; working ~

coring , ( ,

)correction:

forward error ~ ( )mask-proximity ~ [] ( )

correctness:~ designed circuits functional ~

counter:alpha-scintillation ~ -block-knowledged ~ ( )block-completed ~ ( )laser aerosol ~

counterdoped ,

counterdoping counterpart:

bipolar ~ , (. )discrete ~ (. )

coupler:optical [opto] ~ ,

coupling:infused emitter ~ interline ~ opto [photo] ~

cover | coverage 1. 2 (

)eutectic ~ fault ~ metal(lization) -step ~ () step ~ () ;

cracking , ;, (

cra

44

)stress ~ lines

cralering:silicon ~ []

craze | cream:

solder ~ creepage crimper:

terminal ~

criticality ( , )

cross:greek ~ ( )

crossbar ( )

crossover , air-gap ~ air-insulated beam-lead ~ conductive [conductor] ~ interconnecting [interconnection] ~

crosspoint CMOS ~ monolithic two-by-two - 2x2optoelectronic ~

cross-referencer - ( )

crossunder ( )

crosswire ( )crowding:

current ~ ( )emitter ~

pulse ~ ( )crown:

epitaxial-edge ~

crows-foot crucible

floating ~ fused silica ~ single-hearth ~ two-hearth ~

crudule ( )

crust:oxide ~

cryoelectronics cryologic 1. , 2.

cryopanel:

liquid nitrogen ~ cryopump cryotron

tunneling ~ , crystal

acicular ~ cleavage ~ Czochralsky-grown ~ , defect-free ~ dendritic ~ float-zone ~ , grown ~ imperfect ~ LEG ~ , liquid ~ nematic ~ pipe-shaped ~ pulled ~ , ribbon ~ seed ~ ; semiconducting [semiconduc-r] - single ~ win ~ , two-valley ~

cry

45

vacuum float-zone ~ , II-VI ~ ABVI

crystallite crystallization

explosive ~ laser (beam) ~ liquid-phase ~

cube:C ~ -; [] ( )D ~ - ( )primitive ~ ( -)propagation D- ~ - ( -)

cup:Faraday ~

cure | epoxy ~ infrared ~ -ultraviolet ~ -

current () avalanche ~ back ~ base ~ , bias ~ branch ~ breakdown ~ channel ~ ()critical ~ ()cutoff ~ dark ~ diffusion ~ drain ~ ()drift ~ electron ~ electron-beam induced ~ , forward ~ forward-biased ~ Fowler-Nordheim tunneling ~

gate ~ ()Hall ~ hole ~ injection ~ Josephson tunnel ~ laser-beam induced ~ , leakage ~ light ~ majority(-carrier)~ minority(-carrier) ~ noise ~ peak ~ ; pinch-off ~ quiescent ~ 1. 2. (-)recombination ~ reverse ~ reverse-biased ~ saturation ~ SCL [space-charge limited] ~ , stray ~ 1. 2. superconduction ~ threshold ~ tunnel (ing) ~ valley ~ Zener ~ []

curvature:band-edge ~ ()

curve 1. 2. current-voltage ~ -, frequency-response ~ -, life ~ load ~ pumpdown ~ saturation ~ speed-power ~ ( )transient ~ yield ~

cur

46

custom 1. 2. ;full ~ semi ~ ( )

custom-build []

custom-design [] | []

customer:foundry ~ semiconductor ~ specific ~

customization ;

customized ; custom-made ,

cut:

crystal ~ laser ~ , , oxide ~ scribe ~

cutoff:channel ~ ()current ~ diffusion ~

cutting , annular ~ laser-beam ~ peripheral ~ wafer ~ ()

CVD atmospheric pressure ~ catalytic ~ cryogenic ~ double-excitation photo ~

electron clotron resonance ~ - epitaxial ~ excimer-laser-induced - , gradient field plasma ~ homogeneous ~ laser-induced ~ - liquefaction ~ low-pressure ~ low-temperature ~ optical [photo] ~ plasma-enchanced ~ [ ] thermal ~ ultrahigh vacuum ~ very low-pressure ~

cyclability , (.)

cycle ; | bounding ~ [] design ~ 1. ( ) 2. drive-in ~ duty ~ fabrication ~ heat-treatment ~ memory ~

cyc

47

read-and-regenerate ~ read-modify-write ~ , read-restore ~

cycling:temperature ~

D

damage 1. ; | ; 2. ( ) (. -defect)crystal ~s handling ~ (. ) - implant(ation)~ , , ion-beam ~ , ion-bombardment ~ , ionization ~ , laser-induced ~ near-surface ~s [] radiation ~s residual ~ (. )static electricity ~ substrate ~s [] (. )

Darlington data:

design ~ ; layout ~

database:distributed ~ hierarchical ~ integrated ~ network structured ~

relational ~ VLSI design ~ data-slice

death:slow ~ (. ,)

debleeding ,

deburring ,

decapsulation [] decay ( )decision:

go/no go ~ ( )pass/fail ~ ( )

decoder:FPLA ~ , one-chip ~ Viterbi ~

decomposition 1. () ; 2. , (.)glow-discharge ~ pyrolythic [thermal] ~

decoration (. )

dedicated () defect

antisite ~ (. )birds beak ~ 1. ( ) 2. ( )boundary ~ clustered ~s crystal ~ dislocation ~ extended ~ Frenkel ~

def

48

hot spot ~ impurity ~ interstitial ~ lattice ~ line ~ loose ~ ( )native ~ opaque ~ ()oxide ~ pholo(masking)-induced ~ , pinhole ~ ( )point ~ radiation(-induced) ~ Schottky ~ substitutional ~ vacancy ~ visual ~

definition 1. ; 2. 3. , ()behavioral ~ carrier ~ [] ( , , , )channel ~ edge ~ [] fine-line ~ , ()mask ~ mask-level ~ metal ~ pattern ~ product ~ [ ] resist ~ scribeline ~ silicon-island ~ system ~

technology ~ thin-film ~ trench mask ~

deflash , ;

deflasher ;

deflux defluxer deformation ;

image ~ degas(ing):

high-vacuum ~

degeneracy ; doped into ~

degradation , () (. )beta ~ , , b()mobility ~ photomask ~ total dose ~ () UV ~ () -

degreaser immersion-vapor ~ ultrasonic vapor ~

degree confidence ( )

dehydrator:centrifugal ~ , (. )

deionizer 1. 2.

delay 1. ; | ; 2. adjustable ~ ambiguity ~

del

49

asymmetric ~ , carrier-storage ~ , extreme ~ ; fall ~ 1 0fanout-dependent ~ , gate ~ interchip ~ interconnection ~ , internal gate ~ mean logistic ~ path ~ ; rise ~ 0 1stage ~ stray ~ switching ~ time ~ 1. 2. turn-off ~ turn-on ~ unit ~ wiring ~ , worst-case ~

delid [] delineation ;

(. - definition)photolithographic ~ photoresist pattern ~

demand:

wire [wiring] ~s demineralization

demineralizer

mixed-bed ~ ,

dendrite metallic ~

dendrogram ( )

densely-ked ; ;

density 1. ; 2. acceptor ~ cell ~ , (. )channel ~ () charge-packet ~ chip ~ 1. 2. circuit ~ component ~ ()detect ~ ; device ~ dislocation ~ donor ~ DX-center-limited electric ~ , -electron ~ element ~ ()energy-level ~ ()equilibrium ~ etch pit ~ () function(al) ~ gate ~ hole ~ integrated-circuit [integrated-microcircuitkaging, integration] ~ 1. 2. interconnection ~ ()

den

50

inversion ~ ion flux ~ irradiation current ~ lateral packing ~ memory ~ () net doping ~ ()neutral flux ~ occupation ~ ( )optical ~ packaging [king] ~ ; parts ~ pin ~ 1. () ( ) 2. IC space-charge ~ surface ~ ; surface-state ~ wire [wiring] ~ ()

denuding:surface ~ (.);

dependability dependence:

orientation ~ on crystal growth

deplete ; depletion ;

deep ~ depletion-type

depopulation ,

( )deposit | ()deposition

amorphous like ~ blanket ~ chemical ~

chemical vapor ~ (. - CVD)diffusional ~ dynamic ~ (. )electrochemical ~ electroless ~ electrolythic ~ ,electron-beam ~ -epitaxial ~ evaporation [evaporative] ~ excimer-induced ~ , film ~ gas ~ glow-discharge ~ high-rate ~ ion-beam (induced) ~ -ionized-cluster beam ~ laser gold ~ laser-induced ~ -laser photo-assisted ~ laser photochemical ~ low-temperature vapor ~ metal ~ () ;metall-organic ~ () microcrystalline like ~ microwave plasma reactive vapor ~ , -molecular-beam ~

dep

51

multiple-stage ~ oblique ~ open-tube ~ photochemical ~ photo-initiated ~ photolytic ~ photon-controlled ~ physical vapor ~ plasma-assisted laser ~ pyrolytic ~ serigraphic ~ , sputter ~ static ~ (. )thin-film ~ vacuum vapor ~ vapor(-phase)~

depth ; diffusion ~ ; doping ~ etch ~ junction ~ -n-kerf ~ penetration ~

derating:component ~

description:behavioral ~ design ~ ; flat ~ , functional ~ hardware ~ hierarchical ~ high-level ~ logistical ~ procedural ~ ;

descriptor:

process ~ descumming

desiccant design 1. ; ;

| ; ; 2. ; ;; artwork ~ ()automated ~ automatic ~ bipolar ~ block ~ 1. [] 2. bottom-up ~ bottom-up building-block ~ built-in-test ~ chip ~ 1. () 2. ()circuit ~ 1. 2. 3. computer-aided [computer-assisted] ~ custom ~ 1. 2. damage-tolerant ~ detailed ~ 1. 2. device ~ discrete-circuit ~ dynamic ~ engineering ~ fault-tolerant ~ flat ~ flat logic ~ foundry ~ front-end ~ 1. 2. functional ~ 1. 2. geometry ~ 1. 2. hierarchical ~

des

52

high-level ~ ( ), (. )high-performance ~ IC ~ 1. 2. in-house custom ~ 1. 2. level-sensitive scan ~ logic ~ , manual ~ mask ~ modular ~ multichip [multiple-chip] ~ 1. 2. ; on-line ~ 1. 2. operational ~ ; option ~ package ~ PC board ~ 1. 2. physical ~ -, () ( )process ~ random-logic ~ regular-logic ~ scan path ~ ( )standard-cell ~ 1. 2. structured ~ substrate ~ system-level ~ target ~

testing ~ ( , )top-down ~ topological layout ~ ( )transistor ~ trial and error ~ worst-case ~

designer ; ;circuit ~ system ~

designics ( )

desmearing (. )plasma ~

desolder ; destaticization detail:

circuit ~ ;

detection:crack ~ defect ~ end-point ~ (. )fault ~

detector image ~ ; Josephson-effect [Josephson-junction] ~ leak ~ ,

detrapping developer 1. () 2.

aqueous ~ 1. - 2. -photoresist ~ 1. 2. solvent ~

dev

53

spray ~ , wafer ~

development 1. ; (.- design) 2. ()bubble (-memory) ~ custom ~ dry ~ immersion ~ in-house CAD system ~ [ ] spray ~ , static-charge ~ wet ~

device 1. (. , , );; 2. acoustic-wave ~ active ~ ; add-on ~ analog ~ array ~ attached ~ backup ~ beam-lead(ed)~ bipolar ~ bipolar-MOS ~ -blown-fuse ~ (. )bubble-(domain) ~ bucket-brigade ~ bulk oustic-wave ~ bulk-channel carrier-transfer ~ bulk-effect ~

carrier-transfer ~ , charge-coupled ~ , (. -. CCD)charge-domain ~ ( )charge-injection ~ , charge-priming ~ charge-transfer ~ , chip-and-wire ~ CMOS ~ 1. -, 2. -,-CMOS/SOS ~ 1. - -, - 2. - -compound-semiconductor ~ contiguous-disk ~ controlled surface ~ () custom(-designed) ~ dense ~ depletion(-mode)~ , dielectric isolation ~ diffused ~ discrete ~ double-diffused MOS ~ , elastic-surface-wave ~ [] electrooptic ~ elementary ~ enchancement(-mode) ~ , end-use ~ epiplanar ~ -epitaxial ~ FAMOS ~ - -

dev

54

field-effect ~ 1. 2. (. - FET)field-programmable ~ , FIMOS ~ - - functional ~ graded-gap (semiconductor) ~ Gurm(-effect) ~ ( ) Hall(-effect)~ ( ) hard(ened)~ heteroepitaxial ~ heterojunction ~ , high-gain ~ high-immunity noise ~ high-technology ~ , high-threshold ~ homojunction ~ , hybrid high-power ~ identification ~ I2L ~ , 2image [imaging] ~ , () IMPATT ~ - implanted ~ - integrated-optic ~ integrated semiconductor ~ 1. 2. integration ~ , (. - chip, circuit, integration)interdigitated ~ - interface ~ 1. , 2. Josephson(-junction)~

Josephson logic ~ junction-isolated ~ -n-large-scale integrated [large-scale integra-tion] ~ , , (. - chip, circuit, inte-gration)latch-up free CMOS ~ () leaded ~ () leadless inverted ~ light-wave ~ locked-in ~ logic array ~ low-power Schottky ~ magnetostatic-wave ~ majority-carrier ~ () mask-programmable ~ metal-masked ~ , metal-semiconductor ~ microdiscrete ~ microelectronic ~ minority-carrier ~ () MIS(-type) ~ 1. - 2.--mixed(-process) ~ () , (, )molecular-beam epitaxy-based ~ , - monolithic ~ ; MOS ~ 1. -, 2. -MTL ~ , , 2

dev

55

multilayered [multilevel] ~ []n-channel (MOS) ~ n- -negative-resistance ~ non-CPU ~ npn ~ npn-off-chip ~ on-chip ~ , optocoupler semiconductor ~ optocoupling ~ , passive ~ ; p-channel (MOS) ~ - -peripheral ~ 1. 2. permalloy bubble ~ permalloy T-bar ~ - photo-coupled semiconductor ~ photosensitive ~ [] piezoelectric ~ piggyback ~ , ( )planar ~ , plotting ~ ;plug-in ~ p-n-p ~ pnp- positioning ~ printing ~ ; programmable (logic-array) ~ 1. , 2.

quantum ~ , quantum-well ~ redundancy ~ resin-molded ~ SAW ~ , SAW delay ~ scaled(-down)~ 1. 2. Schottky(-barrier)~ (. o)second-source ~ , ; self-aligned semiconductor ~ semiconductor-on-sapphire silicon-on-dielectric [silicon-on-insulator] ~ silicon-on-sapphire ~ single ~ single-crystal ~ slow ~ SLS ~ small-geometry ~ solder-evacuator ~ SOS/MOS ~ 1. - -, - 2. - -stacked semiconductor ~ static-sensitive ~ (), stripeline ~ , submicron-scale MOS ~ -

dev

56

superconducting Josephson-junction ~ superconducting quantum interference ~ , superconductive quantum interferometric ~ super-lattice functional ~ superstructure ~ , surface-acoustic-wave ~ surface charge-transfer ~ surface-mounted ~ switching ~ []TAB ~ , thermocompression bonded ~ thick-film ~ thin-film ~ transcalent ~ transferred-electron ~ ; () transil-time-negative-resistance ~ - trench isolated ~ tunnel (-ffect) ~ two-level polysilicon MOS ~ ULA ~ ultrafine-scale ~ ultra-large-scale integrated ~ , , ultra-submicron ~ - ( 0,10,2 )uncased ~ vertical-junction ~

very large-scale integrated-circuit [verylarge-scale integration] ~ ,V-groove (MOS) ~ - V- wafer-printing ~

devitrification ;

dewetting ()

diagnosis:multifault ~ post-test ~

diagnostics:contactless ~ []laser ~ light-scattering ~ Raman ~

diagram ; ; binary decision ~ (); ()block ~ -; block integration ~ ( )circuit ~ () connection ~ current-voltage ~ -, flow ~ functional ~ interconnection ~ logic ~ operational sequence ~ phase ~ , schematic (circuit) ~ ; state ~ , stick ~ timing ~ truth ~ ( )wiring ~ 1. ; 2. ()

dia

57

diaphragm:prestretched ~ resilient ~

dice 1. () 2.

dicer ; (. )

dicing:laser ~

dictionary:detection ~ location ~ ( ),

die () ~on-tape , uncommitted ~ ; ,

dielectric gate ~ high-integrity ~ interlayer ~ (. )layered ~ []thick-film ~

diffraction:convergent beam-electron , electron ~ Frensel ~ , low-energy electron ~ , reflection high-energy electron ~ , X-ray ~ X-ray total reflective Bragg ~

diffractometer:X-ray ~

diffusant, diffuser ,

fast ~ low ~

diffusion 1. 2. . ~ from an infinite source [] ; ~from planar source ampoule ~ back ~ , ()base ~ , base-and-resistor ~ blanket ~ box ~ ()B&R ~ . base-and-resistor diffusionchannel ~ ( )closed-tube ~ collector reach-through ~ contact ~ cross ~ doped-polysilicon ~ double ~ [] drain and source ~ ( )drive-in ~ ( )enhanced ~ []error-function ~ 1floating ~ gaseous [gas-phase, gas-source] ~ guarding ~ , in ~ , ()inlerfacial ~

dif

58

interstitial ~ , laser-assisted [laser-enhanced] ~ - lateral ~ [] liquid-phase ~ masked ~ multiple ~ n-type ~ 1. 2. n-one-step ~ open-tube ~ out ~ , ()oxidation-enhanced ~ , oxide-masked ~ pipe ~ planar ~ predeposition ~ ( )proton-enhanced ~ , p-type ~ 1. 2. -selective ~ separation ~ [] shallow ~ 1. [] 2. sideways ~ [] single ~ solid(-state) ~ substitutional ~ , substrate ~ () tail ~ vapor(-phase)~

diffusivity digitize

digitizer digitizing manually prepared layouts

[ ]

diluent ; N2 ~ -

dilution ; dimension

critical ~ (. )depth ~s lateral ~s overall ~s submicrometer ~

diode abrupt-junction ~ avalanche ~ 1. 2. - , avalanche-injection ~ , - avalanche-transit-time ~ - , back-biased ~ - BARITT [barrier-injection and transit-time] ~ - base-emitter ~ () buried Zener ~ CATT ~ . controlled avalanche-transit-time diodecharge-storage ~ , chip ~ clamp(ing) ~ [] collector-base ~ () controlled avalanche-transit-time ~ - deep ~ ( )double-diffused ~ emitter-base ~ () emitting ~ , , Esaki ~ gold-barrier Schottky ~ graded-junction ~ Gunn(-ffect)~ heterojunction ~ hot-carrier ~ impact-avalanche and transit-time[IMPATT] ~ - ,

dio

59

intrinsic-barrier ~ in-isolation ~ laser ~ , light-emitting ~ , , MBE ~ , - mercury-probe-silicon ~ n- mesa (-type) ~ , negative(-resistance) ~ organic-on-GaAs ~ pin ~ pin-planar epitaxial ~ -punch-through ~ ()Read ~ reference ~ reverse-biased ~ - Schottky(-barrier)~ shallow ~ (, )source-drain ~ () ( - V-)temperature-compensated ~ TRAPATT [trapped plasma avalanche tran-sit-time] ~ - variable-capacitance ~ ; variable-reactance ~ VC ~ CM. variable-capacitance diodevoltage-reference [voltage-regulator, Zener]~

dioxide 1. 2. , SiO2native-grown silicon ~ recessed silicon ~ , silicon ~ , SiO2titanium ~ , iO2tungsten ~ , WO2

DIP , DIP, DIP-

lead cavity ~ DIP- shrink ~ DIP- ( 1,75 )single-layer alumina metallized ~ DIP- () skinny ~ DIP- ( 1,75 )SLAM ~ . single-layer alumina metal-lized DIPstandard ~ DIP- ( 2,5 )

dip:emitter ~

dipping ; solder ~ ()

direction:crystal(lographic)~ preferred ~ ( )

discard-at-failure ( )

discharge 1. 2. ()~ holes glow ~ Townsend ~

discipline:design ~ 1. ( ) 2. ( , )

discontinuity ; band ~ heterojunction ~

dislocation edge ~ Frank partial ~ imperfect [misfit] ~ perfect ~ screw ~ Shockley partial ~ slip ~

dis

60

dismear(ing) ;

disorder () ( )compositional ~ ; (. ), -lattice ~ ()

dispenser ; ( )

dispensing:syringe ~ (. )

display:character ~ 1. - 2. -graphic ~ 1. 2. ; lead status ~ -motion-picture ~ ; network status ~ 1. 2.

dissipation:power ~

dissipator ; (. -sink)

dissociation:IB multiple-proton ~ single-photon ~

distance:interatomic ~ lattice ~ []

distortion:~ energy bands lattice ~ mask ~ 1. 2. [] out-of-plane ~ pattern ~

wafer ~ X-ray ~

distribution:Boltzman ~ charge ~ congestion ~ () ( )cumulative service time ~ ( )defect-density ~ degenerate ~ depth ~ () dopant [doping] ~ ()electron energy ~ error-function ~ 1Fermi ~ field ~ (. )Gaussian ~ []impurity ~ () nondegenerate ~ Maxwell ~ power ~ ( )space [spatial] ~ velocity ~ 3-D ~ (. )

distributor disturbance:

lattice ~

ditch ; Dolby , domain 1. 2.

antiphase ~ bubble [lindrical magnetic] ~ , fault ~ ferroelectric ~ ferromagnetic ~ magnetic bubble ~ , space ~

dom

61

time ~ dongle donor 1. , 2.

deep ~ shallow ~

dopant () acceptor ~ arsenic ~ buried-collector ~ () conductivity-type determining ~ , donor ~ ion-implanted ~ -isolation ~ ()n-type ~ p-type ~ silicon ~ spin-on ~ , spun-on ~ ,

dope () | (. -dopant)

doped degenerately ~ heavily [highly] ~ lightly ~

doper doping

arsenic ~ atomic layer ~ background ~ control ~ counter ~ ( )double ~ [] droplet-migration ~ , erratic ~ field ide ~ heavy [high] ~

implant(ation)~ , injection ~ ( )interstitial ~ ion-implant(ation)~ , ion-shower ~ ( )laser ~ [-]lifetime-killer ~ , localized ~ low(-concentration) ~ modulation ~ []neutron(-transmutation)~ -photochemical ~ plasma ~ () post-idation ~ preferential ~ proximity ~ ( )sheet ~ shower ~ ( )solute ~ substitutional ~ transmutation ~ -

dosage 1. 2. ion-implantation ~ ,

dose | electron ~ , exposure ~ heavy ~ light ~ radiation tolerance ~ (. - )

doser ,

dos

62

dot:ink ~ ( )quantum ~ ()

dotting:gold ~ (. )

down(ward) -scaling , ( ) (. - scaling)active ~ ( )

draft ; | ;

drafter 1. ; 2. ; ;

drafting:computer(-aided)~ coordinate ~

drain 1. , () 1. diffused ~ ion-implanted ~ - lightly-doped ~ majority-carrier ~ n-doped ~ n-

drawing 1. ; ; (.- layout) 2. 3. (. )assembly ~ computer-aided ~ layout ~ 1. 2. master ~ 1. 2. ()photomask ~ scale ~ , scaled-up ~

drier . dryerdrift ; ; | ;

carrier ~

electron ~ gain ~ long-term ~ offset-voltage ~ short-term ~ temperature ~

drive 1. ; | ; 2. 3. 4. backward [C-] ~ , -( D-- )D- ~ D-, D- ( D- )forward ~ ( )multiple-vector D- ~ D-single-vector D- ~ D-

drive-in ( ) | base ~ diffusion ~

driver 1. ; 2.access ~ bipolar ~ bus ~ clock-pulse ~ ; coil ~ ( )current ~ depletion-mode ~ , enhancement-mode ~ , integrated ~ memory ~ ( ) peripheral ~ read ~ write ~ ;

drop:contact ~ IR ~ ()

dro

63

pressure ~ temperature ~ voltage ~

drop-in 1. 2. ; ( )

dropouts [] ()

dropper:eye ~ ( )

dross (. ) |

dry | flash ~ oven ~ spin ~

dryer , cabinet ~ conveyor ~ infrared ~ , solvent ~ spin rinse ~ tunnel ~ vacuum ~

drying (. - dry)air ~ ; cold ~ HF ~ vacuum ~

dummy duplicate ; | ;

, (. )

duplication ; , (. )

duplicator ; (. )

durability 1. ; 2.; acid ~ chemical ~ , etching ~ humidity ~ photoresist ~

duration , life ~ ,

duroid ( )

dust 1. 2. | abrasive ~ active ~ diamond ~ grinding ~

dusting:nitrogen ~ (. )

duty 1. (); 2. ()continuous ~ critical ~ heavy ~ operating ~

dye | dye-sensitized dynamics:

lattice ~

E

edge 1. (. ) 2. () 3. pl , ~ board band ~ () chip ~ (); ()crystal ~ diffusion ~ exposed ~ ()knife ~ sharp ~ [] (. )valence-band ~

effect 1. ; 2. ; acoustoelectric ~ avalanche ~ 1. 2. band-folding ~ ()barrier ~ birefringent ~ , ()body ~ ( )bulk ~ channel ~

eff

64

charge-volume ~ Dember ~ domain ~ Early ~ , edge ~ electrooptical ~ end ~ Esaki ~ Ettingshausen ~ field ~ , flux-creep ~ - ( , )Gunn ~ Hall ~ hot-carrier ~ hot-electron ~ inter-proximity ~ intra-proximity ~ [] Josephson ~ Kerr (magnelooptical) ~ magnetostrictive ~ manhatten ~ ( )moir ~ Nernst ~ , Nernst-Ettingshausen ~ , nonparabolicity ~ ( )Ovshinsky ~ pairing ~ Peltier ~ () photodiffusion ~ photovoltaic ~ ploy ~ ( )Pockels ~ () proximity ~ ( )punch-through ~ , Read ~ Schottky ~

Seebeck ~ () shadow ~ (. )short-channel ~ , ( )shot ~ sidewalk ~ skin ~ -, surface-leakage ~ Thomson ~ , threshold ~ transient ~ trapping ~ tunnel (ing) ~ Wiedemann ~ Zener ~ () particle ~ -

efficiency 1. ; ; 2. , collector ~ , , conversion ~ electronic ~ injection ~ quantum ~ , reaction ~ transfer [transport] ~

effort:assembly ~ - design ~ 1. ; ; 2.

ejector:die ~

electret electricity

static ~ electrode

base ~ , CCD ~ collector ~ ,

ele

65

control ~ (); coplanar ~s depletion-mode gate ~ -, drain ~ ()enhancement-mode-gate ~ -, extra ~ ()gate ~ (. )insulated gate ~ metal gate ~ ; ()phase ~ ()planar ~ reference ~ Schottky(-barrier gate)~ , self-aligned ~ source ~ ()spaced ~s [ ]storage ~ ()

electrodeposition ,

electrodialysis electroetching electroforming electromicrograph

[]

electromigration electron

Auger ~ -backscattered ~s (. )bound ~ conduction ~ drifting ~ ejected [emitted] ~ , []excess ~ free ~ hot ~

injected ~ , outer(-shell) [ripheral]~ photoejected ~ replacement ~ tunneling ~ valence ~

electron-coupled electronegativity electronics 1. 2.

; ; analog ~ 1. 2. ; cryogenic ~ ,digital ~ 1. 2. ; film ~ functional ~ high-speed ~ integrated ~ 1. 2. microsystem ~ microwave ~ -; -molecular(-scale)~ peripheral ~ picosecond ~ semiconductor ~ solid-state ~ superconducting [superconductive] ~ 1. 2. , transistor ~ very high-speed ~ [] ;

electrooptics 1. 2.

electrophilic ,,

electroplating ,

ele

66

laser-heated ~

electropolishing ,

electrorefining ,

electrostatics electrostriction electrotinning element 1. ; ; ;

, (. - chip, circuit,component) 2. () active ~ 1. ; 2. ( :, )array ~ 1. ; 2. capacitive-storage ~ ( )chevron propagating ~ chip ~ circuit ~ ; column III V ~ Vcombinational logic ~ control ~ ; cryogenic ~ distributed ~ doping ~ electronic ~ ; field-effect-transistor ~ 1. 2. (.- FET)floating-gate ~ functional ~ fuse ~ ( )generic ~ [] Gunn ~ ; ( )Hall ~

image ~ impurity ~ ; inclusive OR ~ integrated ~ inverting ~ ;Josephson junction ~ key ~ ; library ~ () (. , , , )light-emitting semiconductor ~ (. )light-receiving ~ (.)linear ~ logical ~ (. - gate)lumped-circuit ~ magnetic propagation ~ majority ~ , march ~ ( )matrix ~ memory ~ ; microcircuit ~ microelectronic ~ ; , monolithic ~ multiple logic ~ (. , )NAND ~ NAND-NOR ~ negative-resistance ~ network ~ nonlinear ~ one-transistor ~ optoelectronic ~ parasitic ~

ele

67

passive ~ pattern ~ phantom ~ , (. , )picture ~ propagating [propagation] ~ redundant ~ resolution ~ , (. )semiconductor ~ 1. () , 2. ; 3. ( )shared ~ () solid-state ~ ; stripe-geometry ~ , superconducting ~ thick-film ~ thin-film ~ ultratrace ~ ()

elephant:white ~ . ( , )

elevator.cassette ~

elimination:electrostatic ~ Gaussian ~

ellipsometer ( )

embedding:crystal ~ exact ~ ()

embossment (. )

emission 1. 2. cold ~ deep-level [DL] ~

electron ~ field ~ gamma ~ -photoelectric ~ , Schottky ~ secondary electron ~ thermionic ~

emitter , amorphous ~ , arsenic(-doped) ~ , diffused ~ grid ~ infrared ~ -interdigital ~ -inverted ~ ion-implanted ~ -mesh ~ oxide-walled ~ shallow ~ , submicrometer-wide ~ superlattice ~ walled ~ wide-band-gap ~

emitter-coupled emulation

roving ~ ( )snapshot ~

emulator in-circuit ~

emulsifier emulsion ; ,

electron-sensitive ~ -fine-line [high-resolution] light-sensitive ~ , negative ~ ,

emu

68

positive ~ , UV ~ , [-]

enable:byte high ~ ( )

enamel:porcelain ~ ( ) vitreous ~

encapsulant , epoxy ~ plastic ~ semiconductor ~ silicone ~ -

encapsulation ()dip ~ ( )epoxy ~ glass ~ hermetic ~ high-specification ~ leak-tight ~ metal-can ~ plastic ~ resin ~ silicone ~

encasing enclosure ;

hermetic ~ SMIF ~ ()

encoder , ; digital ~ ; priority ~ pulse ~ Viterbi ~ voltage ~

encroaching:lateral ~

encroachment:base ~ ; field-ide ~ oxide ~

endpoint:etch ~

endurance 1. ; 2. , heat ~

energy acceptor tivation ~ allowed ~ bandgap ~ () domain ~ donor tivation ~ excitation ~ Fermi ~ ; free ~ impurity tivation ~ impurity ionization ~

engine:simulation ~ ;

engineering 1. 2. ;atomic layer ~ [] circuits ~ computer-aided ~ ( )control ~ ; cryogenic ~ electronic ~ front-end ~ high-frequency ~ integrated-circuit ~

eng

69

mask-making ~ microwave ~ -molecular ~ photomask-making ~ plant ~ , process ~ production ~ reverse ~ , ()semiconductor ~ software ~ systems ~

engraving ; wafer ~

enhancement 1. 2. ;; ~ approach electron ~ hole ~ image ~ ion ~ irradiation induced ~ oxidation ~ ()picture ~ resolution ~ thermal-gradient ~

enhancement-type

entrapping 1. (. ) 2. ( )

entry:conversational remote batch ~ () conversational remote job ~ direct data ~

envelope ; electron ~ glass ~

metal ~ environment

ambient ~ CAD programming support ~ class-100 clean ~ () , 100clean-room ~ dust-free ~ (.)engineering workstation ~ evacuated ~ , harmful ~ (. )hierarchical ~ hostile ~ information-retrieval ~ - integrated project support ~ oxidizing ~ rugged ~ (.); severe ~ (. ); vacuum ~ ,

epi 1. 2. arsenic-doped ~ , epi-island

epilayer lattice-graded ~s

epitaxy atmospheric pressure ~ atom layer ~ [-]chemical beam ~ - chloride vapor phase ~ close space ~ EBE ~ -

epi

70

electron-beam ~ -flow-rate modulation ~ gas-source molecular-beam ~ - hot wall ~ hydrothermal ~ s isolated silicon ~ . lateral ~ liquid (-phase) ~ , liquid(-phase) shift ~ low-temperature ~ metalloorganic vapor-phase ~ migration-enhanced ~ ( ), -molecular(-beam)~ -[] photoassisted molecular-beam ~ -seeding ~ ()selective ~ [] self-masking ~ solid-phase ~ thin-film ~ vacuum ~ , vapor levitation ~ , vapor-phase ~ vapor-transport ~

epoxy conductive ~ thermally conductive ~

epoxy-glass equation

adjoint ~s Arrhenius ~ Boltzmann transport ~ continuity ~ diffusion ~ Ebers-Moll ~ field ~ ideal diode ~ , Josephson ~ Poisson ~ regression ~ Schrodinger ~ Shockley ~ , stiff ~ ( , )transistor ~ transport ~

equilibrium , equipment ; ;

artwork ~ assembly ~ -automated test ~ ( )automatic drafting ~ , beam-tape microinterconnection ~ capital ~ ()chip production ~ ( )computer-aided ~ computer update ~ cryogenic ~ diffusion ~ direct-wafer-stepping ~ evacuation ~

equ

71

fabrication ~ high-vacuum technology ~ () in-line ~ inspection ~ interactive graphics ~ interconnection ~ -leased-circuit connection ~ manufacturing ~ masking ~ 1. 2. mask-making ~ microinterconnection ~ - photolithography ~ plotting ~ ;polysilicon diffusion ~ printing ~ ; processing [production] ~ projectionalignment ~ step-and-repeat ~ 1. (.) 2. step-on-wafer ~ support ~ tape-carrier system ~ wafer handling ~ -

wafer-measuring ~ - wafer-processing ~ wafer-stepping ~ yellow room ~ ,

equivalent 1. 2. ( )cell ~ (. )discrete IC ~ (. )functional ~ gate ~ ( )

erosion:ion ~ , ,

error alignment ~ alpha-induced soft ~ , -image ~ interconnection ~ punctuation ~ ( )scaling ~ , soft ~ step-and-repeat ~ superposition ~ wiring ~

escape ( )

estate:real ~ ;

etch 1. (. etchant) 2.

etc

72

(. etching) | to ~ away; to ~ into ; to ~ outacid ~ 1. 2. anisotropic ~ 1. 2. buffered ~ caustic ~ 1. 2. chemical ~ 1. 2. crystal-orientation dependent ~ 1. 2. gas(eous)~ isotropic ~ 1. 2. orientation dependent ~ 1. 2. ide ~ 1. (. ) 2. photoresist-controlled ~ planar plasma ~ step ~ stress relief ~ trench ~ V-groove ~ 1. V- 2. V- wet ~

etchability ,

etchant (. etch)directional ~ dry ~ () polishing ~ () selective ~ [] vapor ~ ;

etchback () (. )

etcher () acid ~ ,

bias-ECK plasma stream ~ - cassette-to-cassette ~ ( )magnetron ion ~ multichamber dry ~ plasma ~ , , (. - reactor)spray ~ tetrode ~ triode ~ ultrasonic ~

etching (. - etch)axid ~ anisotropic ~ anode ~ batch ~ blanket ~ , chemically assisted ~ crystallographically sensitive ~ differential ~ , digital ~ ( )diode (ion) ~ dip ~ directional ~ dislocation ~ dry (process) ~ electron-beam induced ~ , excessive ~ exciraer laser ~ ( )gas-phase plasma-assisted ~

etc

73

high-frequency ion ~ hydrogen reactive ion ~ ion ~ [-] ion-assisted plasma ~ , (1100 )ion-beam induced ~ , - ()isotropic ~ jet ~ laser-enhanced ~ -laser-induced pattern projection ~ - laser radical ~ lateral ~ [] lift-off ~ light-induced ~ low-pressure (plasma) ~ masked ~ maskless ~ , maskless laser ~ - mesa ~ microwave (plasma) ~ -mild ~ nonundercutting ~ orientation-dependent ~ oxygen gas plasma ~ permeation ~ (. )photochemical ~ photoelectrochemical ~ photo-enhanced chemical dry ~ photoexcited ~

photo-initiated ~ photoresist-masked ~ , plasma (reactor) ~ post ~ ( )preferential ~ []; radical (plasma) ~ radio-frequency plasma ~ reactive ion ~ ,regenerative ~ resistless ~ (. )selective ~ [] sharp ~ , () (. )sideways ~ [] single-step laser ~ spray ~ sputter ~ steady-state ~ synchrotron radiation-assisted ~ , taper ~ tetrode (ion) ~ triode (ion) ~ undercut(ting)~ (. )UV laser ~ - -vacuum ultraviolet-assisted ~ , vertical ~ VUV-assisted ~ . vacuum ultraviolet-as-sisted etchingwet (chemical) ~

etc

74

zero-undercut ~ Eurochip ,

-

eutectic gold-silicon ~ gold-tin ~

evaluation ; automatic computer ~ contact electrical ~ go/no-go ~ input count ~ ( )nondestructive ~ process ~ scanning-electron microscope ~ yield ~

evaluator 1. (. ) 1. ( )

evaporant 1. 2.

evaporation 1. , 2. activated reactive ~ , angle ~ , e-beam [electron-beam] ~ 1. - 2. - flash ~ ion ~ ion-enhanced ~ -laser-(beam)~ 1. 2. metal ~

oblique ~ , splash-free ~ thermal ~ , thin-film ~ vacuum ~ 1. , 2. ,

evaporator 1. , 2. boat ~ crucible ~ electron-beam ~ 1. 2. - electron-bombardment ~ - film ~ flash ~ high-capacity ~ ; hot-filament ~ metal ~ resistive ~ vacuum ~ 1. , 2.

event ( )flag ~

examination:bright light ~ X-ray ~

exchange , |()anion ~ cation ~ radix ~

exchanger:ion ~ 1. 2.

exc

75

excise , (. )

excitation 1. 2. electronic vibrational ~ - laser ~ rf ~ [-]thermal ~

exciton acceptor-bound ~ , bound ~ donor-bound ~ , Frenkel ~

exclusion:minority-carrier ~

exerciser ( )exhaustion:

fume ~ [] (. )

expander gate ~ input/output ~ priority ~

expansion linear ~ off-chip memory ~ ( )thermal ~ [] volume ~

expectancy:life ~

expose 1. (. ) 2., (. )3. ; to electron-beam~

exposer ( ), electron-beam ~ - X-ray ~

exposure 1. 2. , (. )blanket ~

contact ~ deep-UV ~ die-by-die pattern ~ direct wafer ~ (-) ( )direct-writing ~ [](-) electron-beam ~ -[] flood ~ ( ); full-field [full-wafer] ~ ion ~ - laser ~ light (optical) - mask ~ ( )multiple ~ pattern ~ postdevclopment ~ projection ~ proton ~ proximity ~ () SOR ~ . synchrotron exposurestep-and-repeat ~ , synchrotron ~ ultraviolet ~ [-]X-ray ~

expression requirements extinction extraction ;

carrier ~ chip-carrier ~ fume ~ heat ~ plasma ~

ext

76

extractor:DIP ~ DIPphotoresist ~ ()

extrinsic ()

extrusion 1. () 2.;

eye:laser ~ ( )

eyeballing

F

fabrication ; all-ion-bombardment ~ batch ~ continuous-cle ~ () electron-beam ~ - fine-pattern ~ flexible ~ , high throughput ~ ; high-volume ~ in-house ~ ion-implantation ~ large-batch ~ () ; large-scale ~ laser ~ low-volume ~ nanoscale [nanostructure] ~ photolithographic circuit ~

volume ~ X-ray ~

face 1. () ; 2. () 3. ()cleavage ~ crystal ~ lapped ~ ; 100 plane ~ , 100

facet 1. () () 2. | , ( )

facilit/y 1. ; 2. l; ; 3. plapplication development ~ computer-aided design ~ies custom ~ies design ~ies desk-top prototyping ~ ()diagnostic ~ies DI water ~ies fabrication ~ies industrial ~ies in-house ~ major IC ~ies operational development test ~ ( )processing ~ies turnkey manufacturing ~ white-room ~ies

factor 1. ; 2. ;absorption ~ alpha current ~ , ,

fac

77

amplification ~ avalanche multiplication ~ beta-current gain ~ , , compensation ~ (.)complexity ~ conversion ~ 1. 2. correction ~ cost-of-error ~ ( )current amplification ~ current multiplication ~ degeneracy ~ dielectric dissipation ~ diffusion ~ dissipation ~ etch ~ ( )gain ~ injection ~ noise ~ , -power amplification ~ reflection ~ scale [scaling] ~ , Stability ~ ; transport ~ utilization ~ (. )voltage amplification ~ weight(ing)~ , yield ~ ,

fail-proof fail-safe failure ; ;

bond ~

catastrophic ~ ; complete ~ degradation ~ die ~ girth die ~ infant ~ partial ~ post-delivery ~ , (. )premature ~ qualification ~ , soft ~

fallouts family:

~ characteristics block-structured ~ chip ~ logic ~ memory ~ standard ~

fan-in fan-out 1. 2.

( );

fashion:piggyback ~ ( )

fault ; , ac ~ AND-bridge ~ branch-open ~ ( )branch-short ~ ( )bridge [bridging] ~ coupling ~ dc ~ delay ~ detectable ~ , detected ~ dynamic ~ floating-date ~ ( )

fau

78

functional ~ hazardously detectable ~ , hyperactive ~ ( )input stuck-at ~ internal ~ (. )intragate ~ irredundant ~ MOS-stuck ~ ( )multiple ~ multiple cess ~ nonfeedback bridging ~ , nonstuck ~ []open ~ OR-bridge ~ pattern ~ pattern sensitive ~ , ( )permanent ~ pin ~ redundant ~ short ~ short diffusions ~ ( )single-stuck ~ stacking ~ static ~ stuck-at ~ [] ( )stuck-at-one ~ , 1stuck-at-open ~ stuck-at-short ~

stuck-at-X ~ stuck-at-Z ~ sluck-at-zero ~ , 0stuck-high ~ , 1stuck-low ~ , 0timing ~s

fault-free ; feasibility:

engineering ~

feature 1. () ;; 2. ; () design ~ (. )device ~ mask ~ topographical ~

feed ; | ; belt ~ bowl ~ cassette-to-cassette ~ in-line ~ magazine ~

feedback capacitive ~ local ~ negative ~ on-line ~ positive ~ strong ~ weak ~

feeder , belt ~ bowl ~ magazine-to-magazine ~ (. ) reel ~ vibration ~

feedforward feedthrough 1. ( ) 2.

fee

79

( )ferromask FET ,

barrier-gate ~ bipolar inversion channel ~ , Bloch ~ buried-channel ~ charge-coupled ~ closed-geometry ~ compound ~ 1. ( , ) 2. conductor-insulator-semiconductor ~ -depletion(-mode) ~ , dual-gate ~ enhancement(-mode)~ , floating-gate ~ heterointerface ~ , heterostructure insulated-gate ~ high-rformance ~ infrared ~ , [-] insulated-gate ~ ion-implanted ~ - ion-sensitive ~ , junction(-gate)~ n-

K-band ~ -(1826 )lateral ~ MBE ~ , metal-gate ~ ; metal-insulator-semiconductor ~ -metal-ide-semiconductor - (. - MOSFET)metal-Schottky [metal-semiconductor] ~ microwave ~ -modulation-doped ~ [] multichannel ~ multiple-gate finger ~ nanometer-scale ~ n-channel [negative] ~ n-negative resistance ~ normally-off ~ , normally-on ~ , offset-gate ~ p-channel ~ -photo(sensitive) ~ pn-junction ~ n--positive-type ~ -resonant tunneling ~ Schottky-diode [Schottky-gate] ~ self-aligned (gate) ~ , short-channel ~

FET

80

short gate-length ~ silicon-gate ~ tunneling-transfer ~ ()two-dimensional electron-gas ~ unipolar ~ , vertical-channel [vertical-structure] ~ V-gate ~ V-(-doped)~ -

fidelity:geometric ~ [] (. )printing ~ ()

field 1. ; 2. analog ~ bubble collapse ~ built-in ~ ; n-character string ~ , [] digital ~ drive ~ ()extension ~ fixed ~ image ~ multipolar magnetic ~ threshold ~

field-programmable

figure 1. ; 2. ; 3.; ~ merit 1. 2. etch ~ noise ~ , -

file 1. ( ; 2. ; brought-forward ~ , carried-forward ~ hash random ~ history ~

input-state-output ~ , , register ~ filing: electronic ~

fill and spill ( ) ( )

filler:organic ~ thixotropic ~

filling:dioxide ~ (. ) hole ~ ( )

film 1. ; 2. ;base ~ boundary ~ chemical vapor deposition ~ , compound ~ contaminant-free ~ ()electrodeposited ~ , epitaxial [epitaxially grown] ~ exposed ~ field-ide ~ gate insulating ~ hardened ~ 1. 2. heteroepitaxial ~ interfacial layer ~ kapton ~ [] KPR ~ laminate ~ Langmuir-Blodgett [LB] ( )magnetic-bubble ~ mask(ing)~ metal-insulator-metal ~ ,-monomolecular ~ mylar ~ oxidation-barrier ~ , (. )

fil

81

oxynitride ~ patterned ~ plasma-laser deposition [PLD] ~ , , , - polyimide ~ polymer thick ~ 1. 2. pl release ~ , resist ~ resistive ~ semiconductor-on-insulator thin ~ shield (ing) ~ ; single-crystal ~ solid photoresist ~ sputtered ~ , substrate ~ , superlattice LangmuirBlodgett ~s thermally grown ~ , thick ~s 1. 2. thin ~s 1. 2. transparent ~ vacuum-deposited ~ , wiring multilayer ~

filter | acoustic (-wave) ~ band-pass ~ bipolar ~ cartridge ~ CCD ~ charge-domain ~ ( )cloth ~ CMOS ~ , codec ~ coding ~

crystal ~ digital ~ disk ~ ( )gyrator ~ integrated (-circuit) ~ integrated-injection logic ~ monolithic ~ orthogonal-propagation SAW ~ recursive ~ single-chip ~ SIP ~ surface(-acoustic)-wave ~ ,-switched-capacitor ~ ,

fin:cooling [heat] ~ []

fine-line ;

finger:base ~ ( )gate ~s ()lead ~ , multiple-gate ~s

finish 1. 2. bright ~ fine ~ mirror(-like) [optical] ~ surface ~

firing:thick-film ~ [] ( )

firmware - fisheye (

)fissure ; |

fis

82

fit 1. | 2. | 3. ;

fixture ; ; assembly ~ ; bonding ~ () planetary ~ ( )

flag:framing error ~ ( )hazard status ~

flange:high-vacuum ~

flash 1. | 2. , |

flask:Dewar ~

flat:orientation ~ , ( )

flatness wafer ~

flatpack metal ~

flaw ; ; flexibility:

design ~ ;

flic ,

flip ; ()

flip-chip 1. 2.

flip-flop 1. ; 2. binary ~ -, buried ~ clocked ~ D-type ~ D-edge-triggered ~ , gated ~

J-K ~ J-K-monostable ~ []reset-set [R-S] ~ RS-K-S-T ~ RST-, RS-set-reset ~ SR-static ~ T [trigger] ~ T-

flip-over

float:dice ~ ()

floorplan:chip ~ (. )general ~

floorplanning floorspace () flop (

, 1 . )

Flotox c ( )

flow 1. ; 2. ( ) 3. charge-carrier ~ current ~ laminar ~ (. )layout process ~ leakage ~ ; process ~ turbulent ~ VLSI design (process) ~

flowchart 1. ; 2. -clerical ~ -logic ~ -process ~ system ~ -

fluence:energy ~ laser ~

fluid:coolant ~

flu

83

diffusion-pump ~ liquid-crystal ~

fluidity fluid-tight ,

fluor , F

plastic ~ fluorescence:

optical-resonant ~ (. -)photodissociation product ~ X-ray ~

fluoride ammonium ~ , NH4F

fluorination fluorine , Ffluorinert (

)

fluorocarbon fluorochemical flush 1. | []

2. ; ( )

flusher flux