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Západočeská univerzita v Plzni , Česká republika Výzkumné centrum Nové technologie. STUDIUM ZMĚNY OPTICKÝCH VLASTNOSTÍ V ZÁVISLOSTI NA ZMĚNĚ STRUKTURY a-Si:H. Lucie Prušáková , Veronika Vavruňková,. Marie Netrvalová, Jarmila Mullerová, Pavol Šutta. - PowerPoint PPT Presentation
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Západočeská univerzita v Plzni, Česká republikaVýzkumné centrum Nové technologie
Váš partner pro výzkum, vývoj a inovace v průmyslových aplikacích
STUDIUM ZMĚNY OPTICKÝCH VLASTNOSTÍ V ZÁVISLOSTI NA ZMĚNĚ STRUKTURY a-Si:H
Marie Netrvalová, Jarmila Mullerová, Pavol Šutta
Lucie Prušáková, Veronika Vavruňková,
This presentation is co-financed by the European Social Fund and the state budget of the Czech Republic.
Materiály a technologie (MAT)projekt 1M06031
Materiály a komponenty pro ochranu
životního prostředí
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Introduction Introduction ::
Tandem solar cell is one of the concepts well established as a Tandem solar cell is one of the concepts well established as a way how to improve solar cell performance beyond that of a way how to improve solar cell performance beyond that of a single cellsingle cell..
This concept needs semiconductor materials with different This concept needs semiconductor materials with different band-gaps, which are stacked on top of another, in order to filter band-gaps, which are stacked on top of another, in order to filter the photons of different energies passing through the stackthe photons of different energies passing through the stack..
One of the possibilities how to solve this problem is taking One of the possibilities how to solve this problem is taking advantage from the well established silicon technology (a-Si:H, advantage from the well established silicon technology (a-Si:H, μc-Si:H and poly-Si materials)μc-Si:H and poly-Si materials)..
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Introduction Introduction ::
One of the possibilities how to obtain poly-Si films of a good One of the possibilities how to obtain poly-Si films of a good quality consists generally of two steps:quality consists generally of two steps:
DDeposition of a-Si or a-Si:H thin films by means of PVD eposition of a-Si or a-Si:H thin films by means of PVD or CVDor CVD
technologies at low temperatures andtechnologies at low temperatures and
SSubsequent reubsequent re--crystallization of the films from solid crystallization of the films from solid phase by thermalphase by thermal treatment at temperatures near to treatment at temperatures near to 600°C600°C..
0 2 4 6 8 10
0.0
0.2
0.4
0.6
0.8
1.0
No
rma
lize
d in
teg
rate
d in
ten
sity
[-]
Thermal treating time [hours]
580°C 590°C 600°C 610°C 620°C
a-Si:H to uc-Si:H transition
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Deposition techniqueDeposition technique::
PE-CVD SAMCO PD 220N unitPE-CVD SAMCO PD 220N unit
deposition temperature 250°Cdeposition temperature 250°C
RF power 40 WRF power 40 W
at constant presure of 67 Paat constant presure of 67 Pa
Precursors: SiH4 (10% in Ar), H2 Precursors: SiH4 (10% in Ar), H2
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Outline of the experimentOutline of the experiment::
Dilution SiH + Ar flow
[sccm]
H flow
[sccm]
Volume content [%] Dimension of coherently diffracting
domain [nm]
Thickness [nm]
Silicon Silicon hydride
Silicon Silicon hydride
R 0 250 0 - - - - 170
R 20 83 167 - - - - 120
R 30 62.5 187.5 - - - - 140
R 40 50 200 53 47 6 18 140
R 50 42 208 32 68 9 14 180
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2 R = [H ] / [SiH ] 4
XRDXRD::
Panalytical X’Pert PROX-ray powder diffractometer
Applications:• Qualitative and quantitative phase analysis• Residual stress analysis• Texture analysis• Analysis of changes in the crystal structure• Ultra fast data collection with using
X’CeleratorTheta-Theta goniometer
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Substrate: Corning glassDeposition temperature: 250 °CDilution: R = 0, 20, 30, 40, 50 (R = H2/SiH4)Working gas: Argon (90 %) / silane (10 %)
XRD patterns - in range of 15 – 65 degrees of 2 measured on attachment *) with asymmetric geometry
- semi-quantitative XRD phase analysis was carried out from all significant diffraction lines
XRDXRD::
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XRDXRD::
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XRDXRD::
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Raman spectroscopyRaman spectroscopy::
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Yvon Labram Raman Spectrometer
Micro-Raman spectra excited with a laser generating the wavelength of 532 nm
Shift of the Raman peaks due to different hydrogen dilution was observed
400 450 500 550 600 650
0
500
1000
1500
Inte
nsi
ty [a
.u.]
Raman shift [cm-1]
520
Crystalline Si
Influence of hydrogen Influence of hydrogen ::
15 20 25 30 35 40 45 50 55 60 65
0
1 000
2 000
3 000
4 000
Si4H
Inte
nsi
ty (
cou
nts
)
2 (degrees)
Si (111)
Si (220)
Si (311)Corning glass
Resultant patternsa-Si:H/glassR = 40
Si4H
Experimental data
Dilution Volume content [%] Dimension of coherently
diffracting domain [nm]
Thickness [nm]
Silicon Silicon hydride
Silicon Silicon hydride
R 40 53 47 18 6 140
R 50 68 32 14 9 180
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Optical spectrophotometryOptical spectrophotometry::
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• UV / VIS Spectrophotometer- spectral region 190 – 1100 nm- measurement of transmittance, absorbance
and reflectance in dependence on the wavelength
• Accessories- Absolute Reflectance Attachment (determine
the absolute reflectance of reflecting films)- Variable Angle Reflectance Attachment
(determine refractive index of solid samples)- Integrating Sphere (for the measurement of
transmittance and diffuse reflectance)
SPECORD 210
400 500 600 700 800 900 1000 1100
0
20
40
60
80
100
Tra
nsm
itta
nce
(%
)
Wavelength (nm)
t = 170 nm t = 340 nm t = 520 nm
R = 0
• Spectral refractive indices and absorbtion coefficients were extracted from measured transmittance spectra using the Delphi-based program based on an optimization procedure using genetic algorithm
• The optimization procedure minimizes differences between the experimental and theoretical transmittance i the broad spectral region including the region in the vicinity of the absorption edge.
Optical propertiesOptical properties::
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The refractive index shifts towards the values typical for single-crystalline silicon (n ~ 3.5) with increasing R.
Increased hydrogen dilution shifts the absorption edge to the higher energies (lower wavelengths).
The optical band-gap energies for the films with lower hydrogen dilution (R≤20) are 1.75 - 1.9 event. In case of R≥30 Eg = 2.15 eV.
Outline of the experimentOutline of the experiment::
Series number
Thickness [nm]
Re-crystallization temperature [°C]
Comments1 2 3 4 5 6
580 590 600 610 620 ref.
A0035 2400 42 42 22 18 18 1* The thicknesses of the samples were evaluated from the optimization procedure during the optical spectra processing
A0036 1860 42 42 22 18 18 1*
A0037 1200 42 42 22 18 18 1*
A0038 600 - 42 22 18 18 1*
- Σ = 126 168 88 72 72 4* ΣΣ = 530 XRD records
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Substrate: Corning glassDeposition temperature: 250 °CDilution: R = 0 (R = H2/SiH4)Working gas: Argon (90 %) / silane (10 %)Isothermal heating was usedLinear temperature starting-up (50°C/min.) was appliedPressure in a high-temperature chamber was 0.1 PaTemperature decay - exponential shape (only by irradiation)
XRD patterns – in range of 15 – 65 degrees of 2 in initial state measured on attachment *)
– lines (111) during the heating– in range of 20 – 65 degrees of 2 after the heat treatment
Outline of the experimentOutline of the experiment::
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„„In situ“ XRD monitoring of a-Si:H poly-Si re-crystallization processIn situ“ XRD monitoring of a-Si:H poly-Si re-crystallization process Parameters of the experimentParameters of the experiment
Sample Sample numbernumber TemperatureTemperature Number of XRD Number of XRD
measurementsmeasurementsDuration Duration [hours][hours]
11 580°C580°C 40+240+2 2020
22 590°C590°C 40+240+2 2020
33 600°C600°C 20+220+2 1010
44 610°C610°C 16+216+2 88
55 620°C620°C 16+216+2 88
66 roomroom beforebefore --
0 2 4 6 8 10 12 14 16 18 20
0
2500
5000
7500
10000In
teg
rate
d in
ten
sity
[a.u
.]
Thermal treatment time [hours]
590°C
600 nm
1200 nm
2400 nm
0 2 4 6 8 10 12 14 16 18 20
0.0
0.2
0.4
0.6
0.8
1.0
No
rma
lize
d in
teg
rate
d in
ten
sity
[-]
Thermal treating time [hours]
580°C 590°C 600°C 610°C 620°C
2400 nm
X-ray diffraction – symmetric X-ray diffraction – symmetric -- geometry geometry ::
20 25 30 35 40 45 50 55 60 650
1x104
2x104
3x104
4x104
Inte
nsi
ty (
cou
nts
)
2 (degrees)
600 nm
(111)
(220)(311)
20 25 30 35 40 45 50 55 60 650
1x104
2x104
3x104
4x104
Inte
nsi
ty (
cou
nts
)
2 (degrees)
(111)
(220)
(311)
1200 nm
20 25 30 35 40 45 50 55 60 650
1x104
2x104
3x104
4x104
Inte
nsi
ty (
cou
nts
)
2 (degrees)
(111)
(220)
(311)
2400 nm
20 25 30 35 40 45 50 55 60 650
1x104
2x104
3x104
4x104
Inte
nsi
ty [c
ou
nts
]
2 [degrees]
1860 nm
(111)
(220)
(311)
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Raman spectroscopy Raman spectroscopy ::
400 450 500 550 600 650
0
500
1000
1500
Inte
nsi
ty [a
.u.]
Raman shift [cm-1]
520
Crystalline Si
475 500 525 5500.0
4.0x104
8.0x104
1.2x105
1.6x105
580°C590°C600°C610°C620°C
Inte
nsi
ty (
a.u
.)
Raman shift [cm-1
]
519
475 500 525 5500.0
0.2
0.4
0.6
0.8
1.0
No
rma
lize
d in
ten
sity
Raman shift [cm-1
]
519580°C590°C600°C610°C620°C
400 450 500 550 6000.0
3.0x104
6.0x104
9.0x104
1.2x105
1.5x105
Inte
nsi
ty [
a.u
.]
Raman shift [cm-1]
re-crystallizedpoly-Si films
519 cm-1
as-deposited a-Si:H film
480 cm-1
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Refractive indices Refractive indices ::
500 600 700 800 900 1000 11003.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6R
efr
act
ive
ind
ex
[-]
Wavelength [nm]
590°C 600°C 610°C 620°C Initial state
500 600 700 800 900 1000 11003.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
Re
fra
ctiv
e in
de
x [-
]
Wavelength [nm]
580°C 590°C 600°C 610°C 620°C Initial state
500 600 700 800 900 1000 11003.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
Ref
ract
ive
ind
ex
[-]
Wavelength [nm]
580°C 590°C 600°C 610°C 620°C Initial state
600 700 800 900 1000 11002,5
3,0
3,5
4,0
4,5
5,0
Re
frac
tive
inde
x [-
]
Wavelength [nm]
580°C 610°C 590°C 620°C 600°C Initial (small) Initial (large)
1860 nm
600 nm 1200 nm
2400 nm
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UV-VIS spectrophotometry UV-VIS spectrophotometry ::
300 400 500 600 700 800 900 1000 1100
0
20
40
60
80
100
Tra
nsm
itta
nce
[%
]
Wavelength [nm]
Initial state580°C590°C600°C610°C620°C
200 300 400 500 600 700 800 900 1000 1100
0
20
40
60
80
100Initial state590°C600°C610°C620°C
Tra
nsm
ittan
ce [%
]
Wavelength [nm]
400 500 600 700 800 900 1000 1100
0
20
40
60
80
100Initial state580°C590°C600°C610°C620°C
Tra
nsm
ittan
ce [%
]
Wavelength [nm]
400 500 600 700 800 900 1000 1100
0
20
40
60
80
100Initial state580°C590°C600°C610°C620°C
Tra
nsm
ittan
ce [%
]
Wavelength [nm]
600 nm 1200 nm
2400 nm1860 nm
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Absorption coeficient Absorption coeficient ::
1,2 1,3 1,4 1,5 1,6 1,7 1,8 1,9 2,0100
101
102
103
104
Ab
sorp
tion
co
efii
cie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C initial state (small) initial state (large)
amorphous state
polycrystalline state
1.2 1.4 1.6 1.8 2.0 2.2 2.4100
101
102
103
104
105
Ab
sorp
tion
co
effi
cie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C initial state
2400 nm
1200 nm
1.2 1.4 1.6 1.8 2.0 2.2 2.4100
101
102
103
104
105
Abso
rptio
n c
oeff
icie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C Initial state
1,2 1,4 1,6 1,8 2,0 2,2 2,4100
101
102
103
104
105
Ab
sorp
tion
co
effi
cie
nt [
cm-1
]
Photon energy [eV]
590°C 600°C 610°C 620°C Initial state
1860 nm
600 nm
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Absorption coeficient Absorption coeficient ::
1,2 1,3 1,4 1,5 1,6 1,7 1,8 1,9 2,0100
101
102
103
104
Ab
sorp
tion
co
efii
cie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C initial state (small) initial state (large)
amorphous state
polycrystalline state
1.2 1.4 1.6 1.8 2.0 2.2 2.4100
101
102
103
104
105
Ab
sorp
tion
co
effi
cie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C initial state
2400 nm
1200 nm
1.2 1.4 1.6 1.8 2.0 2.2 2.4100
101
102
103
104
105
Abso
rptio
n c
oeff
icie
nt [
cm-1
]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C Initial state
1,2 1,4 1,6 1,8 2,0 2,2 2,4100
101
102
103
104
105
Ab
sorp
tion
co
effi
cie
nt [
cm-1
]
Photon energy [eV]
590°C 600°C 610°C 620°C Initial state
1860 nm
600 nm
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A.V.Shah A.V.Shah et alet al., Prog., Progress inress in Photovolt Photovoltaics:aics:ResResearch andearch and Appl Applications, ications, 2004, 12, 113 – 1422004, 12, 113 – 142
1.2 1.4 1.6 1.8 2.0 2.2 2.4100
101
102
103
104
105
Abs
orpt
ion
coef
ficie
nt
[cm
-1]
Photon energy [eV]
580°C 590°C 600°C 610°C 620°C initial state
Our resultsOur results
ComparisonComparison
Absorption coeficient Absorption coeficient ::
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Conclusions Conclusions ::
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• Amorphous and polycrystalline silicon films were obtained using PE-Amorphous and polycrystalline silicon films were obtained using PE-CVD. Amorphous phase a-Si:H - RCVD. Amorphous phase a-Si:H - R≤20≤20;; polycrystalline polycrystalline c-Si:H - R≥30.c-Si:H - R≥30.
• Polycrystalline silicon films were obtained using subsequent thermal Polycrystalline silicon films were obtained using subsequent thermal processing of the films at temperatures near 600°C.processing of the films at temperatures near 600°C.
• PE-CVD / PE-CVD / re-crystallized poly-Si films still containing re-crystallized poly-Si films still containing 30-5030-50 / / 21-25% 21-25% residual amorphousresidual amorphous (disordered) (disordered) phase, which was confirmed by phase, which was confirmed by the the Raman spectroscopyRaman spectroscopy..
• Average crystallite size obtained from the PEAverage crystallite size obtained from the PE-CVD / -CVD / re-crystallization re-crystallization process was process was 15-20 / 15-20 / 40-50 nm without particular dependence on heat 40-50 nm without particular dependence on heat treatment temperature usedtreatment temperature used..
• Significant optical absorption in re-crystallized Significant optical absorption in re-crystallized siliconsilicon films films compared compared with awith a--SiSi:H:H waswas observed between 1.65 – 1.85 eV photon energies observed between 1.65 – 1.85 eV photon energies..
• These results indicate that the films under study could be considered These results indicate that the films under study could be considered as convenient material for tandem solar cells technologies.as convenient material for tandem solar cells technologies.
Pilsner TCO´s Pilsner TCO´s ::
XRD patterns for sputtered ZnO:Al filmsStandard - ZnO powder
All samples – polycrystalline structure All samples – polycrystalline structure
Crystallite size – 68 to 109 nmCrystallite size – 68 to 109 nm
Low resistivity – Low resistivity –
High transparency - High transparency -
High reproducibility of sputtering processHigh reproducibility of sputtering process
Dependence of Resistivity on Biaxial stressDependence of Resistivity on Biaxial stress
Texture in Texture in [[001001]] direction perpendicular to the substrate direction perpendicular to the substrate
0,0046 0,0046 ΩΩ.cm.cm
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> 9> 90%0%
Acknowledgements Acknowledgements ::
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0.0 0.2 0.4 0.6 0.8 1.0-0.0020
-0.0015
-0.0010
-0.0005
0.0000
Asahi U-type = 6.93 % ZnO:Al (etch) = 6.89 %
Cur
rent
den
sity
[A
/m2]
Voltage [V]0.0 0.2 0.4 0.6 0.8 1.0
-0.0020
-0.0015
-0.0010
-0.0005
0.0000
ZnO:Ga = 5.51 % ZnO:Al (etch) = 6.89 %
Cur
rent
den
sity
[A
/m2]
Voltage [V]
Efficiency Efficiency 9.979.97% - ASAHI% - ASAHI
Efficiency 6.89% - AZO 4Efficiency 6.89% - AZO 4
Efficiency η[%]
5,26
5,51
5,18
6,93
6,55
6,35
5,14
6,44
6,89
6,17
6,73
GZO
GZO
GZO
ASAHI
ASAHI
ASAHI
AZO 3
AZO 3
AZO 4
AZO 4
AZO 4
1ln
.
0J
J
q
TkV phBoc
ocsc VI
VIFF
.
. maxmax
Acknowledgements Acknowledgements ::
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This work was supported by the project of MSMT of the This work was supported by the project of MSMT of the Czech RepublicCzech Republic No. 1M06031 and by the No. 1M06031 and by the SlovakSlovak Grant Grant Agency under the project Agency under the project No. No. 2/0070/10 and by the 2/0070/10 and by the Slovak Research and Development Agency under the Slovak Research and Development Agency under the project APVV-0577-07.project APVV-0577-07.
The authors would like to thank to M. Ledinsky from The authors would like to thank to M. Ledinsky from CASCAS for Raman spectra measurements. for Raman spectra measurements.
Thank you for Your interest in Thank you for Your interest in photovoltaic applicationsphotovoltaic applications