CIRCUITS WEST

INCORPORATED

World Class Manufacturer of Printed Circuit Boards

Capabilities 1-18 Layer Rigid PCB’s Same day quick-turn delivery

service Ten day standard delivery. Blind & Buried Vias. FR-4 through most exotic

laminates. HASL, Gold, Immersion Tin,

Immersion Silver. Via in pad.

Resources 24/7 Engineering Support ODB++ Compliant DRC & DFM FAE’s for Customer Site Support Online Order Placement ISO 9001:2000 certified ITAR certified

20,000 sq ft Facility

US Manufacturing (up to 100 panels/day) (with high volume agreements with off

shore qualified sources) 410 South Sunset Street Suite D

Longmont, CO 80501 (877) 650-5321 www.circuitswest.com Send RFQs to

sales@circuitswest.com

AOI True Artwork and Circuitry Verification

DrillsUtilize the latest in air bearing spindles, fortrue small hole capability

Inline DES (Develop, Etch, Strip)

Flying ProbeAutomated Electrical Test

Technology RoadmapFacility Tolerance Production Standard Advanced EmergingMaximum Number of Layers 14 16 18 >20Minimum Outer Line Width 0.005 0.005 0.004 0.003Minimum Inner Line Width 0.005 0.005 0.004 0.003Maximum Board Outer Dimension 16.00" X 22.00" 16.50" X 22.50" 21.00" x 24.00" 24.00" x 30.00"

Finished Hole Size 0.008 0.008 0.006 <.006Finished Copper Thickness .5oz - 8oz .0oz - 8oz 10oz 12ozMaximum Drilling Aspect Ration 8:01 10:01 12.5:1 >14:1Impedance Tolerances +/- 10% +/- 10% +/- 8% +/- 6%# Of Lamination Cycles (Blind/Buried) 3 4 6 >7

MaterialsMaterials Available Production Standard Tg DkFR-4 Standard Multifunctional yes yes 140 3.9-4.4

FR-4 High Tg yes yes 170-180 3.9-4.4

Getek yes yes 170 3.9-4.1

Nelco 4000-13 yes yes 180 3.7-3.9

FR-408 yes yes 180 3.7-3.8

Polyimide yes yes 230-260 4.2-4.6

BT Epoxy yes yes 180 3.6-4.1

Teflon yes yesCall for

InformationCall for

InformationFlex and Other Materials yes yes

Call for Information

Call for Information

Typical Process FlowLaminate Receive Flash Route

Inner Layer Imaging Drilling

Develop Etch Strip Deburr / Desmear

AOI Electroless Copper

Inner Layer Stack Imaging

Multilayer Prep Develop

Multilayer Pressing Copper Plate - Tin Plate

AQL Shipping

Etching / Tin Stripping

Final Inspection

Electrical Testing

Final Fab/Route, Score, Bevel

Silkscreen Legend

Final Surface Finish

LPI Solder Mask