WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation ... · WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for TI ... the Wi-Fi and Bluetooth Radio Module of

User's GuideSWRU382A–November 2014–Revised December 2014

WL1837MODCOM8I WLAN MIMO and Bluetooth® ModuleEvaluation Board for TI Sitara™ Platform

The WL1837MODCOM8I is a Wi-Fi® dual-band, Bluetooth, and BLE module evaluation board (EVB) withthe TI WL1837 module (WL1837MOD, with Bluetooth) or WL1807 module (WL1807MOD, withoutBluetooth). The WL18x7MOD is a certified WiLink™ 8 module from TI that offers high throughput andextended range along with Wi-Fi and Bluetooth coexistence in a power-optimized design. TheWL1807MOD offers A 2.4- and 5-GHz module solution with two antennas supporting industrialtemperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) andclient. TI offers drivers for high-level operating systems, such as Linux®, Android™, WinCE, and RTOS.TI.

Contents1 Overview ...................................................................................................................... 3

1.1 General Features ................................................................................................... 31.2 Key Benefits ......................................................................................................... 31.3 Applications.......................................................................................................... 4

2 Board Pin Assignment ...................................................................................................... 42.1 Pin Description ...................................................................................................... 52.2 Jumper Connections ............................................................................................... 7

3 Electrical Characteristics.................................................................................................... 74 Approved Antenna Types and Maximum Gain Values ................................................................. 85 Antenna Characteristics..................................................................................................... 9

5.1 VSWR ................................................................................................................ 95.2 Efficiency ........................................................................................................... 105.3 Radio Pattern ...................................................................................................... 10

6 Circuit Design ............................................................................................................... 116.1 EVB Reference Schematics ..................................................................................... 116.2 Bill of Materials (BOM)............................................................................................ 12

7 Layout Guidelines .......................................................................................................... 137.1 Board Layout....................................................................................................... 13

8 Ordering Information ....................................................................................................... 18

List of Figures

1 WL1837MODCOM8I EVB (Top View) .................................................................................... 32 EVB Top View................................................................................................................ 43 EVB (Bottom View) .......................................................................................................... 54 Antenna VSWR Characteristics............................................................................................ 95 Antenna Efficiency ......................................................................................................... 106 EVB Reference Schematics .............................................................................................. 117 WL1837MODCOM8I Layer 1 Layout .................................................................................... 138 WL1837MODCOM8I Layer 2 Layout .................................................................................... 139 WL1837MODCOM8I Layer 3 Layout .................................................................................... 1410 WL1837MODCOM8I Layer 4 Layout .................................................................................... 14

Sitara, WiLink are trademarks of Texas Instruments.Bluetooth is a registered trademark of Bluetooth SIG, Inc.Android is a trademark of Google, Inc.Linux is a registered trademark of Linus Torvalds.Wi-Fi is a registered trademark of Wi-Fi Alliance.

1SWRU382A–November 2014–Revised December 2014WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Boardfor TI Sitara™ PlatformSubmit Documentation Feedback

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11 Module Layout Guidelines (Top Layer).................................................................................. 1512 Module Layout Guidelines (Bottom Layer).............................................................................. 1513 Trace Design for the PCB Layout ........................................................................................ 1614 Layer 1 Combined With Layer 2.......................................................................................... 1615 Top Layer – Antenna and RF Trace Routing Layout Guidelines .................................................... 1716 Bottom Layer – Antenna and RF Trace Routing Layout Guidelines................................................. 1717 MIMO Antenna Spacing ................................................................................................... 18

List of Tables

1 Pin Description ............................................................................................................... 52 Approved Antenna Types and Maximum Gain Values ................................................................. 83 BOM.......................................................................................................................... 124 Module Layout Guidelines ................................................................................................ 155 Antenna and RF Trace Routing Layout Guidelines.................................................................... 17

WarningThe WL1837MODCOM8I board is tested to comply with ETSI/R&TTE over temperatures from –40°C to+85°C.

This board should not be modified to operate in other frequency bands other than what they are designedfor.

FCC Licensing Requirements for the Wi-Fi and Bluetooth Radio Module of the EVM:For evaluation only; not FCC approved for resale. This kit is designed to allow:1. Product developers to evaluate electronic components, circuitry, or software associated with the kit to

determine whether to incorporate such items in a finished product2. Software developers to write software applications for use with the end product. This kit is not a

finished product and when assembled may not be resold or otherwise marketed unless all requiredFCC equipment authorizations are first obtained. Operation is subject to the condition that this productnot cause harmful interference to licensed radio stations and that this product accept harmfulinterference. Unless the assembled kit is designed to operate under part 15, part 18, or part 95 of thischapter, the operator of the kit must operate under the authority of an FCC license holder or mustsecure an experimental authorization under part 5 of this chapter.

Per TI’s Regulatory Compliance Information located in the WL1837MODCOM8I User’s Guide’s“Evaluation Board/Kit/Module (EVM) Additional Terms,” this EVM cannot be used for production purposesand is explicitly restricted from end-product introduction.

Use of this EVM requires the developer to provide a minimum distance of at least 20 cm from the antennato all persons in order to minimize risk of potential radiation hazards.

CAUTIONDo not leave the EVM powered when unattended.

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U1

WL1837MODGI

www.ti.com Overview

1 OverviewFigure 1 shows the WL1837MODCOM8I EVB.

Figure 1. WL1837MODCOM8I EVB (Top View)

1.1 General FeaturesThe WL1837MODCOM8I EVB includes the following features:• WLAN, Bluetooth, and BLE on a single module board• 100-pin board card• Dimensions: 76.0 mm (L) x 31.0 mm (W)• WLAN 2.4- and 5-GHz SISO (20- and 40-MHz channels), 2.4-GHz MIMO (20-MHz channels)• Support for BLE dual mode• Seamless integration with TI Sitara and other application processors• Design for the TI AM335X general-purpose evaluation module (EVM)• WLAN and Bluetooth, BLE, and ANT cores that are software- and hardware-compatible with prior

WL127x, WL128x, and BL6450 offerings for smooth migration to device• Shared host-controller-interface (HCI) transport for Bluetooth, BLE, and ANT using UART and SDIO for

WLAN• Wi-Fi and Bluetooth single-antenna coexistence• Built-in chip antenna• Optional U.FL RF connector for external antenna• Direct connection to the battery using an external switched-mode power supply (SMPS) supporting

2.9- to 4.8-V operation• VIO in the 1.8-V domain

1.2 Key BenefitsThe WL18x7MOD offers the following benefits:• Reduces design overhead: Single WiLink 8 module scales across Wi-Fi and Bluetooth• WLAN high throughput: 80 Mbps (TCP), 100 Mbps (UDP)• Bluetooth 4.1 + BLE (Smart Ready)• Wi-Fi and Bluetooth single-antenna coexistence• Low power at 30% to 50% less than the previous generation• Available as an easy-to-use FCC-, ETSI-, and Telec-certified module



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Overview www.ti.com

• Lower manufacturing costs saves board space and minimizes RF expertise.• AM335x Linux and Android reference platform accelerates customer development and time to market.

1.3 ApplicationsThe WL1837MODCOM8I device is designed for the following applications:• Portable consumer devices• Home electronics• Home appliances and white goods• Industrial and home automation• Smart gateway and metering• Video conferencing• Video camera and security

2 Board Pin AssignmentFigure 2 shows the top view of the EVB.

Figure 2. EVB Top View



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www.ti.com Board Pin Assignment

Figure 3 shows the bottom view of the EVB.

Figure 3. EVB (Bottom View)

2.1 Pin DescriptionTable 1 describes the board pins.

Table 1. Pin Description

No. Name Type Description1 SLOW_CLK I Slow clock input option (default: NU)2 GND G Ground3 GND G Ground4 WL_EN I WLAN enable5 VBAT P 3.6-V typical voltage input6 GND G Ground7 VBAT P 3.6-V typical voltage input8 VIO P VIO 1.8-V (I/O voltage) input9 GND G Ground10 N.C. No connection11 WL_RS232_TX O WLAN tool RS232 output12 N.C. No connection13 WL_RS232_RX I WLAN tool RS232 input14 N.C. No connection15 WL_UART_DBG O WLAN Logger output16 N.C. No connection17 N.C. No connection18 GND G Ground19 GND G Ground20 SDIO_CLK I WLAN SDIO clock

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Board Pin Assignment www.ti.com

Table 1. Pin Description (continued)No. Name Type Description21 N.C. No connection22 GND G Ground23 N.C. No connection24 SDIO_CMD I/O WLAN SDIO command25 N.C. No connection26 SDIO_D0 I/O WLAN SDIO data bit 027 N.C. No connection28 SDIO_D1 I/O WLAN SDIO data bit 129 N.C. No connection30 SDIO_D2 I/O WLAN SDIO data bit 231 N.C. No connection32 SDIO_D3 I/O WLAN SDIO data bit 333 N.C. No connection34 WLAN_IRQ O WLAN SDIO interrupt out35 N.C. No connection36 N.C. No connection37 GND G Ground38 N.C. No connection39 N.C. No connection40 N.C. No connection41 N.C. No connection42 GND G Ground43 N.C. No connection44 N.C. No connection45 N.C. No connection46 N.C. No connection47 GND G Ground48 N.C. No connection49 N.C. No connection50 N.C. No connection51 N.C. No connection52 PCM_IF_CLK I/O Bluetooth PCM clock input or output53 N.C. No connection54 PCM_IF_FSYNC I/O Bluetooth PCM frame sync input or output55 N.C. No connection56 PCM_IF_DIN I Bluetooth PCM data input57 N.C. No connection58 PCM_IF_DOUT O Bluetooth PCM data output59 N.C. No connection60 GND G Ground61 N.C. No connection62 N.C. No connection63 GND G Ground64 GND G Ground65 N.C. No connection66 BT_UART_IF_TX O Bluetooth HCI UART transmit output67 N.C. No connection

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www.ti.com Board Pin Assignment

Table 1. Pin Description (continued)No. Name Type Description68 BT_UART_IF_RX I Bluetooth HCI UART receive input69 N.C. No connection70 BT_UART_IF_CTS I Bluetooth HCI UART Clear-to-Send input71 N.C. No connection72 BT_UART_IF_RTS O Bluetooth HCI UART Request-to-Send output73 N.C. No connection74 RESERVED1 O Reserved75 N.C. No connection76 BT_UART_DEBUG O Bluetooth Logger UART output77 GND G Ground78 GPIO9 I/O General-purpose I/O79 N.C. No connection80 N.C. No connection81 N.C. No connection82 N.C. No connection83 GND G Ground84 N.C. No connection85 N.C. No connection86 N.C. No connection87 GND G Ground88 N.C. No connection89 BT_EN I Bluetooth enable90 N.C. No connection91 N.C. No connection92 GND G Ground93 RESERVED2 I Reserved94 N.C. No connection95 GND G Ground96 GPIO11 I/O General-purpose I/O97 GND G Ground98 GPIO12 I/O General-purpose I/O99 TCXO_CLK_COM I Option to supply 26 MHz externally100 GPIO10 I/O General-purpose I/O

2.2 Jumper ConnectionsThe WL1837MODCOM8I EVB includes the following jumper connections:• J1: Jumper connector for VIO power input• J3: Jumper connector for VBAT power input• J5: RF connector for 2.4- and 5-GHz WLAN and Bluetooth• J6: Second RF connector for 2.4-GHz WLAN

3 Electrical CharacteristicsFor electrical characteristics, see the WL18xxMOD WiLink™ Single-Band Combo Module – Wi-Fi®,Bluetooth®, and Bluetooth Low Energy (BLE) Data Sheet (SWRS170).



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http://www.ti.com/lit/pdf/SWRS170


Approved Antenna Types and Maximum Gain Values www.ti.com

4 Approved Antenna Types and Maximum Gain ValuesThis device is intended only for OEM integrators under the following conditions:• The antenna must be installed so that 20 cm is maintained between the antenna and users.• The transmitter module cannot be co-located with any other transmitter or antenna.• The radio transmitter can operate only using an antenna of a type and maximum (or lesser) gain

approved by TI. Table 2 lists the antennas approved by TI for use with the radio transmitter along withmaximum allowable gain values. Antenna types not included in the list or having a gain greater thanthe maximum indicated are strictly prohibited for use with this transmitter.

Table 2. Approved Antenna Types and Maximum Gain Values

Antenna Type Brand 2.4 GHz 4.9 to 5.9 GHz (1) UnitPCB Ethertronics –0.600 4.50

Dipole LSR 2.00 2.00PCB Laird 2.00 4.00

dBiChip Pulse 3.20 4.20PIFA LSR 2.00 3.00Chip TDK 2.27 3.96

(1) Range is approximate.

NOTE: If these conditions cannot be met (for example, with certain laptop configurations or co-location with another transmitter), the FCC/IC authorization will not be considered valid andthe FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEMintegrator is responsible for reevaluating the end product (including the transmitter) andobtaining a separate FCC/IC authorization.



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www.ti.com Antenna Characteristics

5 Antenna Characteristics

5.1 VSWRFigure 4 shows the antenna VSWR characteristics.

Figure 4. Antenna VSWR Characteristics



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Antenna Characteristics www.ti.com

5.2 EfficiencyFigure 5 shows the antenna efficiency.

Figure 5. Antenna Efficiency

5.3 Radio PatternFor information on the antenna radio pattern and other related information, seeproductfinder.pulseeng.com/product/W3006.



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http://productfinder.pulseeng.com/product/W3006


EDGE CONNECTOR - MALEANT2 - WL_2.4_IO1/WL_5GHzANT1 - WL_2.4_IO2/BT/WL_5GHz

R20 for test mode.

These two TPs for test modewhen WL_IRQ pull high.

WL_UART_DBG

BT_AUD_CLK

BT_AUD_FSYNC

BT_AUD_IN

WL_RS232_TX

WL_RS232_RX

BT_HCI_TX

BT_HCI_RX

BT_HCI_CTS

BT_HCI_RTS

BT_EN_SOC

BT_UART_DBG

SDIO_CLK_WL

SDIO_CMD_WL

SDIO_D0_WL

SDIO_D2_WL

SDIO_D3_WL

SDIO_D1_WL

WLAN_EN_SOC

BT_AUD_OUT

RESERVED1

GPIO9

GPIO11

GPIO12

GPIO10

SLOW_CLK

RESERVED2

WLAN_IRQ

RF_ANT1 RF_ANT2

SDIO_D3_WL

GPIO12

SDIO_D2_WL

GPIO11

SDIO_D0_WL

SDIO_D1_WL

GPIO9

WLAN_IRQ

GPIO10

RF_ANT2

WL_RS232_TX

WL_RS232_RX

RF_ANT1

RESERVED1

RESERVED2

BT_HCI_RX

BT_HCI_TX

BT_HCI_CTS

BT_HCI_RTS

BT_AUD_IN

BT_AUD_OUT

BT_AUD_CLK

BT_AUD_FSYNC

SDIO_CMD_WL

SDIO_CLK_WL

SLOW_CLK

WL_UART_DBG

BT_UART_DBG

BT_EN_SOC

WLAN_EN_SOC

EXT_CLK_REQ_OUT

EXT_CLK_REQ_OUT

TCXO_CLK_COM

TCXO_CLK_COM

VBAT_IN

VIO_IN

VIO_IN

VBAT_IN

VIO_IN

VIO_IN

VBAT_IN VIO_CLK

VIO_CLK

TP2 1

R14 0R 0402

R320R0603

L31.8nH0402

TP51

C210uF0603

J3NU_HEADER 1x2H-1X2_2MM

12

L11.3nH0402

R9 0R 0402

C142.4pF0402

R15 0R 0402

R8 0R 0402

R29 0R 0402

R12 0R 0402

R5 NU0402

R60R0402

J2NU_100pin Micro Edge MEC6SD-100P

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

47 48

49 50

51 52

53 54

55 56

57 58

59 60

61 62

63 64

65 66

67 68

69 70

71 72

73 74

75 76

77 78

79 80

81 82

83 84

85 86

87 88

89 90

91 92

93 94

95 96

97 98

99 100

0RR26 0402

R1 0R 0402

R13 0R 0402

R35NU0402

TCXO1NU_TCXO 26MHz2.0x1.6x0.73mm

NC1

VCC4

OUT3

GND2

TP81

C7NU_0R0402

R18 0R 0402

R7 0R 0402

TP41

TP1 1

C11uF0402

0RR24 0402

R310R0603

J6U.FL-R-SMT(10)U.FL

12

3

C50R0402

R28 0R 0402

TP31

R10 0R0402

R20 10k0402

TP6 1

R36 NU0402

L42.2nH0402

R34NU0402

U4NU_TLV70518XBGA-N4_0.8X0.8_0.4

VINB2

VOUTB1

ENA2

GNDA1

U1

WL1837MODGI

E-13.4X13.3-N100_0.75-TOP

GND17

VIO

38

VB

AT

47

EX

T_32K

36

BT_AUD_FSYNC58

BT_AUD_IN56

BT_AUD_OUT57

BT_AUD_CLK60

WL_S

DIO

_D

212

WL_S

DIO

_C

LK

8

WL_S

DIO

_D

313

WL_S

DIO

_D

010

WL_S

DIO

_D

111

WL_S

DIO

_C

MD

6

BT_HCI_RTS50

BT_HCI_RX53

BT_HCI_TX52

BT_HCI_CTS51

GN

D16

GPIO_425

GPIO_226

GPIO_127

BT

_E

N_S

OC

41

WLA

N_IR

Q14

WLA

N_E

N_S

OC

40

BT

_U

AR

T_D

BG

43

WL_U

AR

T_D

BG

42

GNDG13

GNDG14

GNDG15

GNDG16

GNDG9

GNDG10

GN

D48

GNDG11

GNDG12

VB

AT

46

GND28

GNDG1

GNDG2

GNDG3

GNDG4

GNDG5

GNDG6

GNDG7

GNDG8

RF_ANT132

RESERVED64

GN

D1

GND20

RESERVED121

RESERVED222

GN

D37

GND19

RESERVED362

GNDG17

GNDG18

GNDG19

GNDG20

GNDG21

GNDG22

GNDG23

GNDG24

GNDG25

GNDG26

GNDG27

GNDG28

GNDG29

GNDG30

GNDG31

GNDG32

GNDG33

GNDG34

GNDG35

GND23

GND59

GN

D34

GND29

GN

D7

RF_ANT218

GND49

GN

D9

GND31

GN

D35

GN

D15

GND55

GN

D45

GN

D44

GND30

GND24

GND63

GND61

GN

D39

GN

D33

GND54

GNDG36

GP

IO11

2

GP

IO9

3

GP

IO10

4

GP

IO12

5

OSC11V8 / 32.768kHzOSC-3.2X2.5

EN1

VCC4

OUT3

GND2

ANT2W3006ANT-10.0X3.2MM_A

FEED1

NC2

R27 0R 0402

C40.1uF0402

0RR19 0402

C60R0402

C131pF0402

R16 0R 0402

R25 0R 0402

L2NU0402

R330R0402

C15NU_1uF0402

C8NU_0R0402

J5U.FL-R-SMT(10)U.FL

12

3

R3 0R 0402

0RR22 0402

R30 0R 0402

C30.1uF0402

C32NU_0.1uF0402

TP7 1

R17 0R 0402

ANT1W3006ANT-10.0X3.2MM_B

FEED1

NC2

0RR21 0402

J1NU_HEADER 1x2H-1X2_2MM

12

R23 0R 0402

R2 0R 0402

R4 0R 0402

R11 0R 0402

www.ti.com Circuit Design

6 Circuit Design

6.1 EVB Reference SchematicsFigure 6 shows the reference schematics for the EVB.

Figure 6. EVB Reference Schematics



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Circuit Design www.ti.com

6.2 Bill of Materials (BOM)Table 3 lists the BOM for the EVB.

Table 3. BOM

Item Description Part Number Package Reference Qty Mfr1 TI WL1837 Wi-Fi / Bluetooth WL1837MODGI 13.4 mm x 13.3 mm U1 1 Jorjin

module x 2.0 mm2 XOSC 3225 / 32.768KHZ / 1.8 V / 7XZ3200005 3.2 mm × 2.5 mm × OSC1 1 TXC

±50 ppm 1.0 mm3 Antenna / Chip / 2.4 and 5 GHz W3006 10.0 mm × 3.2 mm ANT1, ANT2 2 Pulse

× 1.5 mm4 Mini RF header receptacle U.FL-R-SMT-1(10) 3.0 mm × 2.6 mm × J5, J6 2 Hirose

1.25 mm5 Inductor 0402 / 1.3 nH / ±0.1 nH / LQP15MN1N3B02 0402 L1 1 Murata

SMD6 Inductor 0402 / 1.8 nH / ±0.1 nH / LQP15MN1N8B02 0402 L3 1 Murata

SMD7 Inductor 0402 / 2.2 nH / ±0.1 nH / LQP15MN2N2B02 0402 L4 1 Murata

SMD8 Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01 0402 C13 1 Murata

/ ±0.1 pF9 Capacitor 0402 / 2.4 pF / 50 V / GJM1555C1H2R4BB01 0402 C14 1 Murata

C0G / ±0.1 pF10 Capacitor 0402 / 0.1 µF / 10 V / 0402B104K100CT 0402 C3, C4 2 Walsin

X7R / ±10%11 Capacitor 0402 / 1 µF / 6.3 V / GRM155R60J105KE19D 0402 C1 1 Murata

X5R / ±10% / HF12 Capacitor 0603 / 10 µF / 6.3 V / C1608X5R0J106M 0603 C2 1 TDK

X5R / ±20%13 Resistor 0402 / 0R / ±5% WR04X000 PTL 0402 R1 to R4, R6 to 31 Walsin

R19, R21 toR30, R33, C5,

C6 (1)

14 Resistor 0402 / 10K / ±5% WR04X103 JTL 0402 R20 1 Walsin15 Resistor 0603 / 0R / ±5% WR06X000 PTL 0603 R31, R32 2 Walsin

(1) C5 and C6 are mounted with a 0-Ω resistor by default.



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www.ti.com Layout Guidelines

7 Layout Guidelines

7.1 Board LayoutFigure 7 through Figure 10 show the four layers of the WL1837MODCOM8I EVB.

Figure 7. WL1837MODCOM8I Layer 1 Layout




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Layout Guidelines www.ti.com



Figure 11 and Figure 12 show instances of good layout practices.



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Figure 11. Module Layout Guidelines (Top Layer)

Figure 12. Module Layout Guidelines (Bottom Layer)

Table 4 describes the guidelines corresponding to the reference numbers in Figure 11 and Figure 12.

Table 4. Module Layout Guidelines

Reference Guideline Description1 Keep the proximity of ground vias close to the pad.2 Do not run signal traces underneath the module on the layer where the module is mounted.3 Have a complete ground pour in layer 2 for thermal dissipation.4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible.6 Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.

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Layout Guidelines www.ti.com

Figure 13 shows the trace design for the PCB. TI recommends using a 50-Ω impedance match on thetrace to the antenna and 50-Ω traces for the PCB layout.

Figure 13. Trace Design for the PCB Layout

Figure 14 shows layer 1 with the trace to the antenna over ground layer 2.

Figure 14. Layer 1 Combined With Layer 2

Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing.

NOTE: RF traces must be as short as possible. The antenna, RF traces, and modules must be onthe edge of the PCB product. The proximity of the antenna to the enclosure and theenclosure material must also be considered.



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Figure 15. Top Layer – Antenna and RF Trace Routing Layout Guidelines

Figure 16. Bottom Layer – Antenna and RF Trace Routing Layout Guidelines

Table 5 describes the guidelines corresponding to the reference numbers in Figure 15 and Figure 16.

Table 5. Antenna and RF Trace Routing Layout Guidelines

Reference Guideline DescriptionThe RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace1 starts to radiate.RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF2 traces must not have sharp corners.

3 RF traces must have via stitching on the ground plane beside the RF trace on both sides.4 RF traces must have constant impedance (microstrip transmission line).

For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The5 ground layer must be solid.6 There must be no traces or ground under the antenna section.



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Ordering Information www.ti.com

Figure 17 shows the MIMO antenna spacing. The distance between ANT1 and ANT2 must be greaterthan half the wavelength (62.5 mm at 2.4 GHz).

Figure 17. MIMO Antenna Spacing

Follow these supply routing guidelines:• For power supply routing, the power trace for VBAT must be at least 40-mil wide.• The 1.8-V trace must be at least 18-mil wide.• Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.• If possible, shield VBAT traces with ground above, below, and beside the traces.

Follow these digital-signal routing guidelines:• Route SDIO signal traces (CLK, CMD, D0, D1, D2, and D3) in parallel to each other and as short as

possible (less than 12 cm). In addition, each trace must be the same length. Ensure enough spacebetween traces (greater than 1.5 times the trace width or ground) to ensure signal quality, especiallyfor the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signaltraces. TI recommends adding ground shielding around these buses.

• Digital clock signals (SDIO clock, PCM clock, and so on) are a source of noise. Keep the traces ofthese signals as short as possible. Whenever possible, maintain a clearance around these signals.

8 Ordering Information

Part number: WL1837MODCOM8I

Revision History

Changes from Original (November 2014) to A Revision ................................................................................................ Page

• Added WL1807MOD in abstract ........................................................................................................ 1• Added Warning ............................................................................................................................ 2• Changed EVB in Figure 1 ................................................................................................................ 3• Added input type to pin 99 in Table 1 .................................................................................................. 7• Added Section 4, Approved Antennas and Maximum Gain Values ................................................................ 8• Changed EVB reference schematics in Figure 6 .................................................................................... 11



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www.ti.com Revision History

• Deleted item 16 (PCB) in Table 3 ..................................................................................................... 12

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IMPORTANT NOTICE

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Documents

WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation ... · WL1837MODCOM8I WLAN MIMO and Bluetooth® Module Evaluation Board for TI ... the Wi-Fi and Bluetooth Radio Module of