TR-900 GSM/GPRS Module - iwow.com.sg · TR-900 GSM/GPRS Module ... 4.15 Digital Audio Interface – MCSI_CK, MCSI_FS, MCSI_RX, MCSI_TX ... 11 CAUTION DISPLAY

CONFIDENTIAL

TR-900 GSM/GPRS Module

Product Technical Specifications and Design Notes

Date : 18 October 2012

Document Version : 1.5

Our Reference : 02000B33

All specifications are correct at the time of release. iWOW Connections owns the proprietary rights to the information contained herein this document. It may not be edited, copied or circulated without prior written agreement by iWOW Connections Pte Ltd. © 2011, 2012 iWOW Connections Pte Ltd.

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TR-900 Module Product Technical Specifications •02000B33 v1.5

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Document History

Revision Date Document History

1.0 20 Dec 2010 Preliminary Release

1.1 30 May 2011 Commercial Release Updated contents and electrical characteristics Updated TR-900 mechanical drawing

1.2 28 Oct 2011 Updated power consumption specification Updated design notes

1.3 27 February 2012 Updated speaker design notes

1.4 18 June 2012 Updated sleep mode details

1.5 18 Oct 2012 Update ring indicator and LED Pulse Generator


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GENERAL NOTE

This document aims to support the application and engineering efforts of iWOW’s customers. This document is

intended for testing, evaluation, integration, and information purposes only.

iWOW makes every effort to ensure that the quality of the information. However, the content of this

documentation is provided on an “as is” basis and may contain deficiencies or inadequacies.

iWOW disclaims any warranty and all responsibility for the application of the device(s) that is made in relation

to the accuracy, reliability or contents of this document. iWOW is not liable for any injury, loss or damage of

any kind that may incur from the use or reliance of this document.

iWOW reserves the right to make any modifications, additions and deletions to this document due to

typographical errors, inaccurate information, or improvement to our products at any time without notice.


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TABLE OF CONTENTS

1 INTRODUCTION .................................................................................................................................. 1

1.1 Reference Documents .............................................................................................................................. 1

1.2 Abbreviations ........................................................................................................................................... 1

1.3 Type Approvals ......................................................................................................................................... 3

1.4 Regulatory Requirement .......................................................................................................................... 4

1.4.1 Requirement for FCC Regulatory Compliance .......................................................................................... 4

1.4.2 RF Exposure Requirement ........................................................................................................................ 5

1.5 Safety Precautions .................................................................................................................................... 5

2 TECHNICAL SPECIFICATIONS ............................................................................................................... 7

2.1 General Specifications .............................................................................................................................. 7

2.2 GSM/ GPRS Specifications ........................................................................................................................ 7

2.3 RF Frequencies ......................................................................................................................................... 8

2.4 Baseband Functionalities ......................................................................................................................... 8

2.5 Interface Specifications ............................................................................................................................ 9

3 FUNCTIONAL ARCHITECTURE ........................................................................................................... 10

4 INTERFACES ...................................................................................................................................... 11

4.1 General-Purpose Connector (GPC) ......................................................................................................... 11

4.1.1 On-Board GPC Pin Assignments ............................................................................................................. 11

4.1.2 On-Board GPC Pin-Out description ........................................................................................................ 12

4.2 Power Supply and Ground – VBAT, GND ................................................................................................ 14

4.3 Operating Modes.................................................................................................................................... 15

4.3.1 Power Specs ........................................................................................................................................... 16

4.4 Backup Power Supply – VBACKUP .......................................................................................................... 17

4.4.1 Application ............................................................................................................................................. 17

4.5 Battery-Charging Interface (BCI) – PCHG, ICTL, VCCS ............................................................................. 18

4.6 Analog to Digital Converter (ADC) – ADCIN1, ADCIN2 ........................................................................... 19

4.7 Power ON Control - PWON ..................................................................................................................... 20

4.7.1 Auto Switch-ON ...................................................................................................................................... 20

4.7.2 Manual Switch ON .................................................................................................................................. 20

4.7.3 Switch-OFF Condition ............................................................................................................................. 21

4.8 Reset Signal - RESET ............................................................................................................................... 21

4.9 Digital Supply Output - VIO .................................................................................................................... 23


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4.10 Subscriber Identity Module (SIM) Interface - SIMIO, SIMCLK, SIMRST, VRSIM, SIMDTC ....................... 23

4.10.1 SIM Detection .................................................................................................................................... 24

4.10.2 SIM Card Holder / Embedded SIM ..................................................................................................... 25

4.11 Serial Link (UART) Interfaces .................................................................................................................. 25

4.11.1 Modem port - UART_TX, UART_RX, UART_CTS, UART_RTS, RI, DCD, DTR, DSR ............................... 25

4.12 Application ............................................................................................................................................. 26

4.12.1 Ring Indicator - RI .............................................................................................................................. 27

4.13 USB Interface – VBUS, USB_DM, USB_DP .............................................................................................. 28

4.13.1 Application ......................................................................................................................................... 28

4.14 Analog Audio Interfaces – MICIN, MICIP, EARN, EARP, SPKNA, SPKPA .................................................. 29

4.14.1 Microphone input – MICIN, MICIP .................................................................................................... 29

4.14.2 MIC Application ................................................................................................................................. 29

4.14.2.1 Differential Ended ............................................................................................................... 29

4.14.2.2 Single-end ............................................................................................................................ 30

4.14.3 Earphone – EARN, ERNP .................................................................................................................... 30

4.14.4 Speaker – SPKNA, SPKPA ................................................................................................................... 31

4.14.5 Application ......................................................................................................................................... 31

4.15 Digital Audio Interface – MCSI_CK, MCSI_FS, MCSI_RX, MCSI_TX ......................................................... 32

4.16 LED Pulse Generator – LPG ..................................................................................................................... 32

4.17 General Purposes Input / Output ports – GPIO_1-GPIO_17 .................................................................. 34

4.18 Keyboard Interface – KBC0-KBC4, KBR0-KBR4 ....................................................................................... 35

4.18.1 Implementation of a 5x5 keyboard ................................................................................................... 36

4.19 2-Wire Serial Interface – I2C_SDA, I2C_SCL ........................................................................................... 37

4.20 Serial Peripheral Interface (SPI) – SPI_CLK, SPI_MISO, SPI_MOSI, SPI_NCS0, SPI_NCS1 ....................... 37

4.20.1 SPI Address 0 ..................................................................................................................................... 38

4.20.2 SPI Address 1 ..................................................................................................................................... 38

4.21 Buzzer Interface ..................................................................................................................................... 38

4.22 RF interface ............................................................................................................................................ 38

4.22.1 Coaxial Receptacle ............................................................................................................................. 38

4.22.2 RF Pad for Coaxial Cable .................................................................................................................... 39

4.22.3 RF Performance ................................................................................................................................. 39

4.22.4 Recommendations ............................................................................................................................. 39

5 ELECTRICAL & RELIABILITY CHARACTERISTICS .................................................................................. 40

5.1 Electrical Characteristics ........................................................................................................................ 40

5.2 Absolute Maximum Ratings ................................................................................................................... 41

5.3 Reliability Compliance ............................................................................................................................ 42


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6 GENERAL RECOMMENDATION ......................................................................................................... 43

6.1 General RF Guide .................................................................................................................................... 43

6.2 General Layout Guideline ....................................................................................................................... 43

6.3 Firmware Upgrade.................................................................................................................................. 44

6.4 Power Supply Guideline ......................................................................................................................... 44

7 INCOMING INSPECTION CRITERIA FOR TR-900 MODULE .................................................................. 46

7.1 Logistics Inspection ................................................................................................................................ 47

8 STORAGE CONDITIONS ..................................................................................................................... 48

9 PACKAGING INFORMATION ............................................................................................................. 49

10 LABELING INFORMATION ................................................................................................................. 50

10.1 Module Box Label ................................................................................................................................... 50

10.2 Module Label .......................................................................................................................................... 50

11 CAUTION DISPLAY – HANDLING ....................................................................................................... 51

12 ASSEMBLY PROCESS ......................................................................................................................... 52

12.1 60 pin Connector Insertion Process ....................................................................................................... 52

12.2 Soldering of legs ..................................................................................................................................... 52

12.2.1 Hand soldering ................................................................................................................................... 52

12.3 RF connection ......................................................................................................................................... 52

12.3.1 Connection via the coaxial RF receptacle .......................................................................................... 52

12.3.2 Connection to the RF pad by soldering with a coaxial cable ............................................................. 53

12.3.3 Connection to the RF pad with a spring contact ............................................................................... 54

13 REWORK AND MODULE EXCHANGE PROCESS .................................................................................. 55

14 MECHANICAL DRAWING .................................................................................................................. 56

15 SUPPORT/ CONTACT US ................................................................................................................... 57

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All specifications are correct at the time of release. iWOW Connections owns the proprietary rights to the information contained herein this

document. It may not be edited, copied or circulated without prior written agreement by iWOW Connections Pte Ltd.

© 2011, 2012 iWOW Connections Pte Ltd

1

1 Introduction

This document describes the hardware interface, including interface specifications, electrical and mechanical

details, of the TR-900 module that connects to the cellular device application.

1.1 Reference Documents

S/N Document Reference

1 TR-900 Series AT Commands Guide 02000B34

2 TR-900 Series Multiplexer User Guide 02000B37

3 TR-900 Development Starter Kit User Guide 02000B22

4 TR-900 Series Multisocket Internet Connection ATC Guide 02000B34

5 TR-900 Series Firmware Programmer Guide 02000B40

6 Application Note: TR-900 Series Lower Power Implementation 02000B31.001

7 Application Note: TR-900 Series Firmware Upgrade Requirement 02000B31.004

1.2 Abbreviations

The following abbreviations are used in this document:

Abbreviation Description

ADC Analog to Digital Convertor

AMR Adaptive Multi-rate

AMR- FR AMR Full-rate

AOC Advice of Charge

APN Access Point Name

AT ATtention

CLIP Calling Line Identity Presentation

CSD Circuit Switched Data

CUG Closed User Group

CTS Clear To Send

DCD Data Carrier Detect

DCE Data Communication Equipment

DCS Digital Cellular System

DSR Data Set Ready

DTE Data Terminal Equipment

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Abbreviation Description

DTMF Dual Tone Multi Frequency

DTR Data Terminal Ready

EFR Enhanced Full-rate

FR Full-rate

GPIO General Purpose Input Output

GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

HR Half-rate

IP Internet Protocol

kbps kilo bit per second

MO Mobile Originated

MS Mobile Station

MT Mobile Terminal

PDP Packet Data Protocol

PDU Packet Data Unit

PD Pull Down

PU Pull Up

PIN Personal Identification Number

PPP Point-to-Point Protocol

RF Radio Frequency

RTS Ready To Send

SAR Specific Absorption Rate

SIM Subscriber Identification Module

SMS Short Messages Service

SPI Serial Peripheral Interface

TCP Transmission Control Protocol

TE Terminal Equipment

UART Universal Asynchronous Receiver Transmitter

UDP User Datagram Protocol

USSD Unstructured Supplementary Service Data

AB Application Board of Customer

NC Not Connected

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1.3 Type Approvals

The TR-900 module is a fully certified cellular radio engine. TR-900, together with its development starter kit,

has been certified for compliance with the directives and standards listed below:

Directive Description

99/05/EC “Directive of the European Parliament and of the council of 9 March 1999 on

radio equipment and telecommunications terminal equipment and the

mutual recognition of their conformity”, in short referred to as R&TTE

Directive 1999/5/EC

ETSI EN 301 489-1 /

EN301 489-7

Candidate Harmonized European Standard (Telecommunications series)

Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro

Magnetic Compatibility (EMC) Standard for Radio Equipment and Services;

Common Technical Requirements

Part 7: Specific conditions for mobile and portable radio and ancillary

equipment of digital cellular radio telecommunications systems (GSM and

DCS)

ETSI EN 301 511

“V7.0.1 (2000-12) Candidate Harmonized European Standard

(Telecommunications series) Global System for Mobile communications

(GSM); Harmonized standard for mobile stations in the GSM 900 and DCS

1800 bands covering essential requirements under article 3.2 of the R&TTE

directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998)”

EN60950/51 Safety of information technology equipment

EN 50383 /

EN 50385

Basic standard for the calculation and measurement of electromagnetic field

strength and SAR related to human exposure from radio base stations and

fixed terminal stations for wireless telecommunications system

Product Standard to Demonstrate the Compliances of Radio Base Stations

and Fixed Terminal Stations for Wireless Telecommunication Systems with

the Basic Restrictions or the Reference Levels Related to Human Exposure to

Radio Frequency Electromagnetic Fields (110 MHz - 40 GHz)

2002/95/EC RoHS Directive – Compliance

Title VII of REACH

Regulation (EC) No.

1907/2006

REACH Directive – Compliance Test

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Directive Description

GCF Global Certification Forum – Compliance Test

PTCRB, NAPRD.03 Ver. PCS Type Certification Review Board

3GPP TS 51.010

Version:v9.5.0

“Digital cellular telecommunications system (Phase 2); Mobile Station (MS)

conformance specification”

FCC FCC CFR Part 2, Frequency allocations and radio treaty matters; general rules

and regulations. Oct 1, 2010

Part 22, Public Mobile Services. Oct 1, 2010

Part 24, Personal Communications Services, Oct 1, 2010

IC RSS-132 Issue 2

RSS-133 Issue 5

1.4 Regulatory Requirement

1.4.1 Requirement for FCC Regulatory Compliance

The TR-900 module complies with part 22 and part 24 of the FCC rules. There certain operating condition to

integrate TR-900 into the application board into the mobile or fixed devices to use the FCC Grants of the TR-

900 module for the final products. The FCC label of the TR-900 shall be visible from the outside of the final

products. If the FCC ID is not visible, the final product shall bear an exterior label stating “Contains Transmitter

Module FCC ID: QPB-TR9000311” or "Contains FCC ID QPB-TR9000311".

Figure 1: TR-900 Module with label of FCC ID: QPB-TR9000311

Users of portable devices incorporating TR-900 are required to have their final product certified and apply for

their own FCC Grant related to the specific portable mobile. This is mandatory to meet the SAR requirements

for portable mobiles.

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Note:

TR-900 operation is subject to the following two conditions:

(1) this device may not cause harmful interference

(2) this device must accept any interference, including interference that may cause undesired operation.

WARNING:

Changes or modifications not expressly approved by the party responsible for compliance could void the user's

authority to operate the equipment.

1.4.2 RF Exposure Requirement

Based on the FCC radiation exposure limits, and the standards EN50385 and EN50383, a minimum safety

operating distance between the device and human body must be maintained.

Note:

A 203mm (8inches) separation distance between the TR-900 and human body must be maintained at all times

during device operation for mobile or fixed operating conditions. This transmitter must not be co-located or

operating in conjunction with any other antenna or transmitter.

Portable mobiles of a TR-900 based application will require SAR to be tested and approved for the compliance

with relevant regulatory party. It is the manufacturer of the final product responsibility to ensure that its

product meets the required standards or directives.

Refer to section 4.22.4 for antenna’s recommendation.

1.5 Safety Precautions

For your own safety, please follow the safety precautions listed below during all phases of the operation,

usage, service or repair of any cellular terminal or mobile incorporating the TR-900 Module. All manufacturers

of these cellular terminals or mobile devices are advised to include the following safety precautions into all

manuals provided with their terminal or mobile device, and pass this information to device users and

operating personnel. Failure to comply may be dangerous or illegal.

Road safety

Do not use a mobile device while driving. Park the vehicle first or use a hand free earphone. It is illegal in some

countries to use a mobile device while driving.

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Switch off in aircraft

Cellular terminal or mobile devices can cause interference to aircraft electronics. Using them on aircraft is both

illegal and dangerous.

Switch off when refuelling vehicle

Do not use the cellular terminal or mobile device at a refuelling station or near fuels or chemicals.

Forbidden Usage

Always switch off your cellular terminal or mobile device where it is forbidden to be used in any areas like a

hospital.

Interference

All cellular terminals or mobile devices may be subjected to radio interference, which could affect their

performance.

Emergency calls

As the GSM/GPRS module is based on GSM standard for radio signals and cellular networks, this connection

cannot be guaranteed at all times under all conditions. It should never be entirely relied upon for essential

communications such as an emergency call.

Note on compliance with international rules and regulations

The TR-900 module is a fully certified cellular radio engine. The module has been tested and certified for

compliance to international safety and GSM standard requirements at the modular level.

Manufacturers of cellular terminal or mobile equipment incorporating the TR-900 are advised to test their final

products to ensure compliance to these EMC tests/requirements:

ESD

Radiated Spurious Emissions

Conducted Emissions, if applicable

Further tests if applicable

Manufacturers of the final products are also responsible to ensure that their products are tested for

compliance to any other regulatory requirements that might be applicable.

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2 Technical Specifications

2.1 General Specifications

Feature Description

Network Type Quad-Band GSM/GPRS

Frequency Bands Quad Band: GSM850 / EGSM900 / DCS1800 / PCS1900

Output Power GSM 850 / EGSM 900 : Class 4 (2W)

DCS1800 / PCS1900: Class 1 (1W)

AT Command Interface Compliant to GSM 07.05 and GSM 07.07 recommendations

iWOW Proprietary AT Commands

Physical Dimensions Dimensions: 38mm x 31mm x 3.5mm

Weight: 6g

Power Supply 3.2V to 4.5V

Operational Environmental Description

Normal Operating Temperature

-20° C to +55° C

Extended Operating Temperature

-40° C to +85° C

Relative humidity 5 – 95%

Air pressure (altitude) 70 kPa to 106 kPa (-400m to 3000m)

2.2 GSM/ GPRS Specifications

Feature Description

GSM Audio Telephony

Emergency call

Half Rate, Full Rate and Enhanced Full Rate (HR/FR/EFR)

Adaptive Multi-rate (AMR)

Hands-Free Operation

Echo Cancellation (Enhanced AEC)

Noise Reduction

DTMF Encoding only

Circuit Switched Data (CSD) Asynchronous, Transparent & Non-Transparent

Max speed: up to 14.4kbps

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Feature Description

SMS Point-to-point (MO/MT)

Cell Broadcast

Text and PDU mode

Supplementary Services Call Forwarding, Barring, Waiting, Hold

Multiparty

Advice of Charge (AoC)

Calling Line Identification Presentation (CLIP)

Calling Line Identification Restriction (CLIR)

Unstructured Supplementary Services (USSD)

Closed User Group (CUG)

GPRS Multislot Class 12

Mobile Station Class B

Coding Schemes MCS1 – MCS4

PBCCH Support

PCCCH Support

PPP Stack

EDGE-RX Multislot Class 12 (downlink)

Coding Schemes RX MCS1 – MCS9, TX MCS1 – MCS4

DARP SAIC Support

2.3 RF Frequencies

RF functionalities comply with the GSM Phase II GSM 850/EGSM 900/DCS 1800/PCS 1900 recommendations. The frequencies covered are:

Tx GSM850: (824 ~ 849 MHz)

Tx EGSM900: (880 ~ 915 MHz)

Tx DCS1800: (1710 ~ 1785 MHz)

Tx PCS1900: (1850 ~ 1910 MHz)

Rx GSM850: (869 ~ 894 MHz)

Rx EGSM900: (925 ~ 960 MHz)

Rx DCS1800: (1805 ~ 1880 MHz)

Rx PCS1900: (1930 ~ 1990 MHz)

2.4 Baseband Functionalities

The Baseband is composed of an ARM, a DSP and an analog element (with audio signals, and ADC). The core power supply for signal interface is 1.8V.

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2.5 Interface Specifications

Feature Description

60-pin Board-to-Board

Connector

Power Supply

Back-up Battery

Keypad

1 Serial Link UART

USB 2.0

1.8V/3V SIM

SIM Detection

GPIOs

Analog to Digital Converter

Digital* & Analog Audio

Reset

Power On

Battery Charging Interface*

SPI with 2 Addresses*

2-Wire Bus*

Others UMC Antenna Connector and Antenna Pad

On-Board SIM holder (Optional)

* For hardware reference only. These features are not enabled in the standard module firmware as it requires a

certain level of firmware customization depending on its intended application. Please contact iWOW for more

information.

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3 Functional Architecture

Figure 1 shows a block diagram of TR-900 module and illustrate the major functional components.

Figure 2: TR-900 Functional Architecture Block Diagram

26MHz

32MHz

Matching

Saw

Filters

RF Power

Amplifier &

Switch

RF

Connector

/Pads

Control

60 p

in b

oa

rd-t

o-b

oard

Co

nn

ecto

r

VBat

Power &

Control

1V8

Keypad

Controls

GPIO

SPI

ADC

I2C

AUDIO

UART

USB

SIM

Baseband & Digital

Radio Processor

PSRAM /

Flash

A/D

(0-1

5)

A16

-A24

Con

trol

1V8

Embedded

SIM

(option)

SIM Card

Connector

(option)

VSIM

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4 INTERFACES

This section describes the available interfaces and their characteristics. All Pin Voltage are supplying at nominal

1.8V unless specified otherwise.

4.1 General-Purpose Connector (GPC)

The General-Purpose Connector (GPC) is provided to interface to the TR-900 module. The GPC is a 60-pin

0.5mm-pitch board-to-board socket from Astron with a part reference of 6091060-252-R. The recommended

mating part is 6090060-252-R from Astron. Further information is available in http://www.astron.com.tw (part

number: 6091XXX-25X-R or 6090XXX-25X-R).

4.1.1 On-Board GPC Pin Assignments

VBAT 60 1 VBAT

VBAT 59

TR-900

GPC

2 VBAT

VCCS 58 3 GND

ICTL 57 4 NC

VIO 56 5 VBACKUP

ADCIN2 55 6 ADCIN1

USB_DP 54 7 VBUS

USB_DM 53 8 RFU

SPKPA 52 9 PWON

SPKNA 51 10 RESET

KBR0 50 11 KBC0

KBR1 49 12 KBC1

KBR2 48 13 KBC2

KBR3 47 14 KBC3

KBR4 46 15 KBC4

SIMDTC 45 16 SIM_IO

VRSIM 44 17 SIM_CLK

SIM_RST 43 18 DSR

GPIO_4* 42 19 RI

SPI_CLK 41 20 GPIO_3*

SPI_MOSI 40 21 SPI_MISO

SPI_NCS1 39 22 SPI_NCS0

I2C_SCL 38 23 I2C_SDA

RXD 37 24 TXD

CTS 36 25 RTS

DTR 35 26 DCD

MCSI_TX 34 27 EARP

MCSI_RX 33 28 EARN

MCSI_FS 32 29 MICIP

MCSI_CK 31 30 MICIN

Figure 3: TR-900 GPC Pin Assignments

http://www.astron.com.tw/

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4.1.2 On-Board GPC Pin-Out description

Pin Signal Name Signal I/O Description Alternate Functions

Module Power up

1 VBAT I Power Supply Input - Input


3 GND - Ground - Not applicable

4 NC - NC - Not applicable

5 VBACKUP O Bulk Capacitor Connection for RTC - Not applicable

6 ADCIN1 I 10-bit Analog-to-Digital input 1 - Input

7 VBUS I/O USB VBUS power supply line - Input

8 RFU I/O Reserved for future use - Input

9 PWON I External switch-on event (ON/OFF)

- Input, PU Active

10 RESET I External RESET Input. (Test only)

Internally pulled up by 20 k

- PU

11 KBC0 O Keypad Matrix Column 0 - Input, PU Active




15 KBC4 O Keypad Matrix Column 4 GPIO_5* Input, PU Active

16 SIM_IO I/O SIM Data - Output LOW

17 SIM_CLK O SIM Clock - Output LOW

18 DSR I Data Set Ready (after boot-up) GPIO_1* Input, PU Active

19 RI I/O Ring Indicator GPIO_2* Input, PU Active

20 GPIO_3* I/O General Purpose IO Input, PD Active

21 SPI_MISO I/O SPI Data: Master in/ Slave out I = MSSPI serial data master-in O = MSSPI serial data slave-out

GPIO_6 Input, PD Active

22 SPI_NCS0 I/O SPI chip select 0 output GPIO_7* Input, PD Active

23 I2C_SDA I/O Two wire interface serial bi-directional data

- Input

24 TXD I DCE Data Receive (Transmit serial data)

- Input, PD Active

25 RTS I Request to send - Input, PU Active

26 DCD I/O Data Carrier Detect GPIO_8* Input, PD Active

27 EARP O Earphone positive output -

28 EARN O Earphone negative output -

29 MICIP I Microphone positive input -

30 MICIN I Microphone negative input -

31 MCSI_CK I/O MCSI Clock I/O GPIO_9* Input, PD Active

32 MCSI_FS I/O MCSI Frame synchronization I/O GPIO_10* Input, PD Active

33 MCSI_RX I MCSI receive data GPIO_11* Input, PD Active

34 MCSI_TX O MCSI transmit data GPIO_12* Input, PD Active

35 DTR I Data terminal ready GPIO_13* Input, PD Active

36 CTS O Clear to send - Input, PD Active

37 RXD O DCE Data Transmit (Receive serial data)

- Input, PU Active

38 I2C_SCL I/O Two wire interface Master serial clock - Input

39 SPI_NCS1 O SPI chip select 1 output GPIO_14 Input, PD Active

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Pin Signal Name Signal I/O Description Alternate Functions

Module Power up

40 SPI_MOSI I/O SPI data: Master out/Slave in O = SPI serial data master-out I = SPI serial data slave-in

GPIO_15 Input, PD Active

41 SPI_CLK I/O SPI serial clock GPIO_16 Input, PD Active

42 GPIO_4* I/O General Purpose IO - Input, PD Active

43 SIM_RST O SIM Reset - Output LOW

44 VRSIM O Power supply for 1.8V/3V SIM -

45 SIMDTC* I SIM Detection - Input, PU Active

46 KBR4 I Keypad Matrix Row 4 GPIO_17* Input, PU Active

47 KBR3 I Keypad Matrix Row 3 - Input, PU Active




51 SPKNA O Speaker negative output -

52 SPKPA O Speaker positive output -

53 USB_DM I/O USB data bus (negative terminal) -

54 USB_DP I/O USB data bus (positive terminal) -

55 ADCIN2 I ADC input 2 - Input

56 VIO O Internal Regulated Output voltage -

57 ICTL O Charger external transistor control (Charger)

-

58 VCCS I Charge current sense - 59 VBAT I Power Supply Input - Input


* IO with interrupt signal.

Note: Recommended to purchase mating connector from iWOW to ensure compatibility.

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4.2 Power Supply and Ground – VBAT, GND

The power supply design is one of the key design areas for a GSM terminal due to the burst characteristics of

GSM transmission. The supply must be able to deliver very high current peaks in a very short time during a

GSM transmit burst, typically up to 1.5 A. During these bursts, it is recommended that the voltage drop does

not exceed 400mV. The voltage ripple should not exceed 50mV at frequencies up to 200 kHz and 5mV at

frequencies above 200 kHz. The module will reset if the power supply drop below 3.2V

The supply to the module is provided from the dedicated VBAT pins of the GPC. The module’s RF power

amplifier is supplied directly from VBAT. Power to other parts of the module is regulated internally. The VBAT

supply to the module must be externally regulated according to the supply input limits of the module.

All four legs of the shield must be soldered onto the target PCB. The ground connection of the target PCB has

to go through a full ground plane on the PCB.

Pin Description

Signal Pin Number Type

VBAT 1,2,59,60 Power Supply Input

GND 3 Ground

Power Supply Voltage

The power supply voltage for VBATT is given below:

Power Supply Parameters Conditions Min Typ Max Unit

VBATT Supply

Voltages

Voltage measured at the VBATT pin of the

connector. If voltage drops below 3.2V,

the module will automatically power off.

3.2* 3.6 4.5 V

Voltage

Drop

Normal condition with max transmitter

output

400 mV

Voltage Ripple Normal condition with max transmitter

output

50 mV

Note: * must be guaranteed to ensure compliance with the GSM certification requirements.

If VBATT is kept at voltage levels lower than 3.2V, it will automatically power-off. During burst emissions in

GSM/GPRS, the power supply must provide high current peaks of 1.5A.

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4.3 Operating Modes

Operation Type Mode Description

Normal Operation GSM IDLE The module is registered to the network. Power consumption

depends on the interval of the network paging.

GSM CONNECTED The module has established a call connection with the network.

Power consumption depends on the network settings and

coverage

GPRS IDLE The module is attached to the GPRS network. Power

consumption depends on the network settings.

GPRS DATA The module sends and receives data from the network. Power

consumption depends on the network settings and GPRS

configurations.

GSM/GPRS SLEEP* In order to extend the battery life of hand held devices, the

module can enter into a sleep mode with AT$CSLEEP=1.

When sleep mode is enable, the module will go into a deep

sleep stage from idle when there is no activity for 10 sec. The

module will wake up from the sleep mode if there are any

activities.

CHARGE The module can perform battery charging in parallel with other

normal operation

Reduced operation POWER DOWN The module can be power down with AT$CPOF=1.

All activities will be terminated. Only real time clock is active in

this mode. The module will go into power down mode

automatically if the power supply falls below 3.2V.

MINIMUM

FUNCTION

The module enter into minimum functional mode with

AT+CFUN=0.

In this mode, the module will disconnect from network and

power down SIM card.

AIRPLANE The module enter into airplane mode with AT+CFUN=4.

The module disconnect from the network just like MINIMUM

FUNCTION but keep the SIM active so that activity like accessing

the phone book in SIM is still possible.

Battery Charging CHARGE The module performs battery charging in parallel with other

operations.

Note: *To implement Sleep Mode in the module, please refer to Application Note: Low Power Implementation.

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4.3.1 Power Specs

Operating Mode Conditions Average Burst Unit

Power Down VBATT = 3.6V 34 - µA

Minimum Function VBATT = 3.6V 36 - uA

Airplane Mode VBATT = 3.6V 36 - uA

GSM/GPRS Idle DRX = 2 21 - mA

DRX = 9 20 - mA

GSM/GPRS Sleep DRX = 2 2.1 - mA

DRX = 9 1.2 - mA

GSM Connected GSM 850, EGSM 900, PCL = 5 199 1270 mA

GSM 850, EGSM 900, PCL = 19 58 145 mA

DCS 1800, PCS 1900, PCL = 0 149 864 mA

DCS 1800, PCS 1900, PCL = 15 57 120 mA

GPRS Data GSM 850, EGSM 900, PCL = 5, Class 8 187 1271 mA

GSM 850, EGSM 900, PCL = 5, Class 10 211 886 mA

DCS 1800, PCS 1900, PCL = 0, Class 8 141 915 mA

DCS 1800, PCS 1900, PCL = 0, Class 10 232 890 mA

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4.4 Backup Power Supply – VBACKUP

Backup capacitor can be connected to the module on VBACKUP via a series resistor of 470 ohms. It is used as

a backup power supply to maintain the internal Real Time Clock (RTC). This feature is required to maintain the

date and time in the module during powered-OFF.

Pin Description

Signal Pin Number Type Description

VBACKUP 5 Supply output Capacitor connection for RTC

Electrical Characteristics

Parameters Conditions Min Nom Max Unit

Output voltage Backup capacitor connected on VBACKUP - 2.3 - V

Capacitance - - 1 F

4.4.1 Application

To enable RTC functionality when VBAT has been removed, a backup capacitor can be connected on VBACKUP

via a series resistor of 470 ohms.

Figure 4: Example Voltage Backup connection

TR-900 GPC

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4.5 Battery-Charging Interface (BCI) – PCHG, ICTL, VCCS

This feature controls the charging of Lithium Polymer or Lithium-ion batteries. It can be used to perform

functions such as battery pre-charging and battery charging. NOTE: BCI function is not available in default

firmware.

Below shows an example of the charging circuit diagram with typical output current of 700mA. For hardware

reference only. This feature is not enabled in the standard module firmware as it requires a certain level of

firmware customization depending on its intended application.

Figure 5: Charging Circuit Diagram Example

Note: For charger voltage input, connect VBAT to relevant pins of charging IC

Pin Description

Signal Pin Number Type Description Termination

ICTL 57 Analog Output Charger external transistor control Open

VCCS 58 Analog Input Charging current sense Open

Note: Short VCCS to VBAT when not in use.

TR-900 GPC

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4.6 Analog to Digital Converter (ADC) – ADCIN1, ADCIN2

The module provides two 10-bit ADC inputs, ADCIN1 and ADCIN2.

ADCIN1 and ADCIN2, respectively, can be also used as battery type sensing (BAT-TYPE) and battery

temperature reading (BAT-TEMP) for Battery Charging Interface (BCI).

Pin Description


ADCIN1 6 Analog Input ADC input 1

ADCIN2 55 Analog Input ADC input 2



Resolution - - 10 - Bits

Reference voltage - - 1.2 - V

Differential non-linearity - -2 - 2 LSB

Integral non-linearity Best Fitting -2 - 2 LSB

Input Range - 0 1.2 V

Input Resistance - 1 - MΩ

For hardware reference only. The BCI functions (BAT-TEMP and BAT-TYPE) are not enabled in the standard

module firmware as it requires a certain level of firmware customization depending on its intended application.

Please contact iWOW for more information.

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4.7 Power ON Control - PWON

This input pin is used to switch the module ON. A switch-ON interruption is triggered in the module at the

detection of a falling edge of this signal pin over a period of 30ms.

Note: The module should be properly switched OFF before all power supplies are removed. This is to avoid any

corruption of internal data.

Pin Description


Parameters Min Nom Max Unit

High level input voltage, VIH 1.495 - - V

Low level input voltage, VIL - - 0.805 V

4.7.1 Auto Switch-ON

The module will be switch on automatically when the power is applied if the auto power on feature is enable.

4.7.2 Manual Switch ON

The module can be switch on manually when the auto power on feature is disabled. The manual switch on is

not a standard feature of TR-900. Please contact iWOW if this feature is required.

This condition will switch-ON the module:

When the main supply is above 3.2V.

When a falling edge, after debouncing, is detected on the PWON pin. The PWON pin is debounced by

embedded hardware. The debouncing time is approximately 30ms.

Vbat

PWON

Module Status


PWON 9 Input External switch-on event

~30ms

Module ON

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4.7.3 Switch-OFF Condition

This condition will switch-OFF the module:

A falling edge signal is detected on the PWON pin after debouncing and the signal remains low for a

minimum period of 900ms. The PWON signal must be released back to high after the module has

switched-OFF.

Note: When the switch-OFF sequence is started, the sequence is completed even if a switch-ON condition

occurs. In this event, data corruption may occur if flash writing is in progress.

Figure 6. Example of the PWON Pin Connection Either By a Switch or Via an Open Collector Transistor

4.8 Reset Signal - RESET

This reset Pin 10 provides an unconditional hardware reset input to the module. A low level signal will trigger

the reset of the module. When the pin is not used, it can be left unconnected. This pin is internally pulled up

by a 20 k resistor.

The RESET signal has a 20K internal pull up resistor to VCC_1V8.

Vbat

PWON

~900ms

Module

(Switch-off)

TR-900 GPC TR-900

GPC

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Figure 7. Reset Timing

Pin Description


RESET 10 Input(internally pulled up by 20

k)

External Reset Input.

Parameters Min Nom Max Unit Operating Mode

High level input voltage, VIH 1.17 - - V Reset Inactive

Low level input voltage, VIL - - 0.63 V Reset Activated

Note: The hardware reset is to be used with caution. It may cause data loss in the volatile memory. It is

designed for emergency where the module fails to respond for more than 30 sec.

The reset can be driven by either a push button or an open collector/drain transistor as shown in the figures

below.

Figure 8.Example of RESET Pin Connection

VBATT

On/OFF

~RESET

250ms (min)

Ta

TR-900 GPC

TR-900 GPC

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4.9 Digital Supply Output - VIO

This internally regulated digital supply output can be used to supply external peripherals. It will only be

available after the module is switched-ON and as such, this pin can be used to signalize the module’s state,

indicating whether it is in ON or OFF mode.

Pin Description


VIO 56 Supply output Digital supply output



Output voltage, VOUT ON mode 1.65 1.8 1.95 V

LOW POWER mode 1.65 1.85 1.95 V

Rated output current, IOUT ON mode - - 200 mA

LOW POWER mode - - 1 mA

4.10 Subscriber Identity Module (SIM) Interface - SIMIO, SIMCLK, SIMRST, VRSIM,

SIMDTC

The SIM card interface is composed of an internally dedicated voltage regulator and I/O level shifters. It is able

to support both 1.8V and 3V SIM cards. It is recommended that the routing traces of the SIM interface lines be

kept as short as possible. ESD diodes should be added to the signals connected to the SIM socket to prevent

any ESD--damage. The diodes shall be placed as close to the SIM socket as possible. Also, a decoupling

capacitor of about 100nF should be added on the VRSIM line near the SIM socket. At any point of time, only

one SIM card is to be connected as the same pins of both (SIM holder placed on top of the module, external

SIM holder) are shared.

Pin Description


SIMIO 16 Input/ Output SIM Data. Pull up.

SIMCLK 17 Output SIM Clock

SIMRST 43 Output SIM Reset

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VRSIM 44 Output Power supply for 1.8V/3V SIM

SIMDTC 45 Input SIM Card Detection



VRSIM SIM 3V 2.7 2.85 2.95 V

SIM 1.8V 1.65 1.8 1.95 V

SIMDTC, Low level input voltage, VIL - - 0.54 V

SIMDTC, High level input voltage, VIH 1.17 - - V

SIMDTC, Debouncing time (SIM-card insertion) 0.5 -

8 ms

SIMDTC, Debouncing time (SIM-card extraction) 0.5 -

8 ms

Figure 9. Example of a SIM Socket Implementation

4.10.1 SIM Detection

SIM detection is done by detecting the open/closed of the SIM card connector. SIMDTC will detect a LOW

when the SIM card connector is closed. Interrupt will be generated when SIM card connector is opened or

closed.

TR-900 GPC

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4.10.2 SIM Card Holder / Embedded SIM

An optional SIM card holder / Embedded SIM may be placed on top of the TR-900 module.

Figure 10. SIM Pad on TR-900

4.11 Serial Link (UART) Interfaces

4.11.1 Modem port - UART_TX, UART_RX, UART_CTS, UART_RTS, RI, DCD, DTR, DSR

These interfaces are assigned to the module communication with the application board using AT Commands.

The UART features are:

16C750 compatibility

Baud rate from 300 bits/s up to 115200 bits/s with auto-bauding support feature

Note: Default factory setting baudrate is set at 115200, unless other specified.

Data bit: 5, 6, 7, or 8 bits

Parity bit: even, odd, none

Stop bit: 1, 1.5, 2 bit(s)

RTS/CTS Hardware flow control

Software flow control (XON/XOFF)

Pin Description

Signal Pin Number I/O I/O Type Reset

State Description

UART_TX 24 Input 1V8 1 DCE Data Receive

UART_RX 37 Output 1V8 0 DCE Data Transmit

UART_CTS 36 Output 1V8 0 Clear To Send. Hardware flow control

UART_RTS 25 Input 1V8 1 Ready To Send. Hardware flow

control

RI 19 Output 1V8 1 Ring Indicator

DCD 26 Output 1V8 1 Data Carrier Detect

Pads for SIM Card Holder

Embedded SIM pads

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Signal Pin Number I/O I/O Type Reset

State Description

DTR 35 Input 1V8 1 Data Terminal Ready

DSR 18 Output 1V8 1 Data Set Ready

Note:

If RTS and CTS are not in use, it is recommended to connect the pins together.

4.12 Application

The block diagram below shows the possible UART connection.

Figure 11: Interfacing with UART

Figure 12: Level-shifter connection to RS232

Data Set Ready (DSR) and RI can be implemented using GPIO 1,2 respectively by connecting the signals to a

level shifter before interfacing with RS-232.

Do note that DCD, DTR and DSR can be set via AT-commands AT&C, AT&D and AT&S respectively.

TR-900

TXD

/RXD

PC

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4.12.1 Ring Indicator - RI

The Ring Indicator (RI) is used to indicate incoming call, unsolicited SMS and network activity indication.

For utilising power save mode in application design, it is recommended for customer to connect RI to an

interrupt line for their application. The application may be designed to receive an interrupt when RI goes low.

This signal is used as an interrupt to wake up the host application in the case where the sleep mode with

AT$CSLEEP=1 is activated when UART is turn off. This solution is best recommended for power consumption

sensitive application.

Behaviour of RI varies in different activity indications.

Voice/Data Call

When a voice/data call comes in, the RI signal goes low for 1 second and high for another 4 seconds. The

repeated 5 seconds the ring string is generated until the call is answered or disconnected.

Figure 13: Voice/Data call RI Timing

Unsolicited SMS / Loss of network / Reconnection of network

For unsolicited events namely SMS, loss of network and reconnection of network, it will result in RI to go low

for 1 second. The line must stay high for at least 4 second before the next activity trigger.

Figure 14. Unsolicited SMS/Loss of Network/Reconnect of Network RI Timing

5s

1s

1s

4s

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4.13 USB Interface – VBUS, USB_DM, USB_DP

The USB interface supports a USB 2.0 Full Speed (12 Mbits/s) and low-speed (1.5 Mbits/s) operations. It is

primarily intended for flashing of firmware and for use as command and data interface.

Note: Connection of a 4.7F Capacitor externally at VBUS for filtering is required.

Pin Description


VBUS 7 Input/ Output USB VBUS power supply line

USB_DM 53 Input/ Output USB Data Bus (-ve)

USB_DP 54 Input/ Output USB Data Bus (+ve)

4.13.1 Application

Figure 15: Example of USB implementation

TR-900 GPC

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4.14 Analog Audio Interfaces – MICIN, MICIP, EARN, EARP, SPKNA, SPKPA

4.14.1 Microphone input – MICIN, MICIP

The handset differential inputs MICIP and MICIN can be amplified by the differential handset microphone

amplifier. The microphone reference voltage is at 2V. The audio gain of the microphone signal (MICP-MICN) is

adjustable using AT command. AT$VTXG=<Level> where Level is from 0-100.

Pin Description


MICIP 29 Input Microphone amplifier input (+ve)

MICIN 30 Input Microphone amplifier input (-ve)



Maximum differential input range (MICIP – MICIN) Input 3 dBm0 - - 0.8 Vpp

Nominal reference level (MICIP – MICIN) - - -10 - dBm

Differential input resistance (MICIP – MICIN) - - 50 - KΩ

Amplifier gain for (MICIP-MICIN) input Differential MIC - - 39 dB

Recommended MIC Impedance - 2k - Ohms

Recommended MIC Sensitivity 40 - 50 dB/PA

Recommended MIC SNR - - 50 dB

4.14.2 MIC Application

This section describes the two common approaches to microphone connection. Since this feature is exposed

to the environment, provision for ESD protection is recommended. Typical characteristics of a microphone

device which can be used: Impedance: ~2 kohm, sensitivity ~ 40-50 dB/PA and SNR >50 dB.

4.14.2.1 Differential Ended

Differential ended connection is the recommended implementation. The following diagram shows a proposed

implementation. The traces need to be run in parallel and C1 placed near MIC while C2 placed near module

pins. The capacitance values chosen may need to be optimized based on application, for GSM related EMI, this

can be from 11 pF to 47 pF for an 0402 size.

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4.14.2.2 Single-end

Single ended connection is not the recommended approach. The following diagram shows a possible

implementation. C1 need to be placed near MIC while C2 and L1 placed IC pins. The capacitance values

chosen may need to be optimized based on application, for GSM related EMI, C1 can be from 11 pF to 47 pF

for a 0402 size while C2 and L1 need to be tuned according to the requirement.

4.14.3 Earphone – EARN, ERNP

The earphone amplifier provides a full differential signal on the EARP and EARN terminals. The amplifier is

capable of driving 100 mWrms into a 16 ohm load. The audio gain of earphone (EARP-EARN) is adjustable

using AT command by AT$VRXG=<Level> where Level is 0-100. The default level is 50.

Pin Description


EARP 27 Output Earphone amplifier output (+ve)

EARN 28 Output Earphone amplifier output (-ve)



Power supply rejection Mono Modes(GSM Voice) 90 100 - dB

Maximum Output Swing at

EARP-EARN

Load = OPEN - 4.1 - Vpp

- -

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Figure 16: Example of earphone implementation

4.14.4 Speaker – SPKNA, SPKPA

The class D amplifier is capable of driving 700 mWrms into an 8 ohms load. Default switching frequency is 600

kHz.

Pin Description


SPKNA 51 Output Speaker signal (-ve)

SPKPA 52 Output Speaker signal (+ve)

Electrical Characteristic

Parameters Min Nom Max Unit

Output Load Resistance - 8 - Ω

4.14.5 Application

The connections to the speaker should run in parallel to the transducer and provisions for shunt capacitors are

recommended for filtering RF and Digital Noise. Suggested values are 33 pF for EMI. Ensure that the voltage

rating of the selected components can withstand operation at the maximum swing voltages in both directions,

16 volt parts should be sufficient. Since this feature is exposed to the environment, provision for ESD

protection is recommended.

Figure 17: Speaker schematic

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4.15 Digital Audio Interface – MCSI_CK, MCSI_FS, MCSI_RX, MCSI_TX

This Multi-Channel Socket interface (MCSI) is intended to support external digital voice interface with PCM-

Codec connection (such as Bluetooth).

Pin Description


MCSI_CK 31 Input/Output MCSI Clock I/O

MCSI_FS 32 Input/Output MCSI Frame Synchronization

MCSI_RX 33 Input MCSI Receive Data

MCSI_TX 34 Output MCSI Transmit Data

For hardware reference only. This feature is not enabled in the standard module firmware as it requires a


information.

4.16 LED Pulse Generator – LPG

This interface produces electrical signal for a blinking LED indicating the status of the GSM Network activity.

Pin Description

Signal Pin Number Type Description Alternate Function

LPG 42 Output Modem status signal GPIO_4

Blinking Characteristics

Module Status LED activity

In OFF mode OFF

ON mode, not registered to network Permanently ON

ON mode Permanently ON

ON mode, registered to network, communication inactive Slow Flashing

On: 200ms, Off: 2s

ON mode, registered to network, communication in progress Quick Flashing

On: 200ms, Off: 600ms

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High level input voltage, VIH - 1.26 - 1.89 V

Low level input voltage, VIL - 0 - 0.36 V

High level output voltage, VOH IO = 5mA 1.35 - - V

Low level output voltage, VOL IO = 5mA - - 0.5 V

Output current - - 5 - mA

Figure 18: Example of an LED Driven by the LPG Output

TR-900 GPC

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4.17 General Purposes Input / Output ports – GPIO_1-GPIO_17

Each GPIO port can be configured individually as input or output ports through AT Commands.

Pin Description

Signal Pin Number Type Alternate Function

GPIO_1 18 I/O DSR

GPIO_2 19 I/O RI

GPIO_3 20 I/O BUZZER

GPIO_4 42 I/O LPG

GPIO_5 15 I/O KBC4

GPIO_6 21 I/O SPI_MISO

GPIO_7 22 I/O SPI_NCS

GPIO_8 26 I/O DCD

GPIO_9 31 I/O MCSI_CK

GPIO_10 32 I/O MCSI_FS

GPIO_11 33 I/O MCSI_RX

GPIO_12 34 I/O MCSI_TX

GPIO_13 35 I/O DTR

GPIO_14 39 I/O SPI_NCS1

GPIO_15 40 I/O SPI_MOSI

GPIO_16 41 I/O SPI_CLK

GPIO_17 46 I/O KBR4







Rated output current, IOL / IOH - - 3 - mA

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4.18 Keyboard Interface – KBC0-KBC4, KBR0-KBR4

The 10-pin keyboard interface includes 5 row inputs and 5 column outputs. The 5 output lines can

alternatively be used as general purpose outputs while the 5 input lines can alternatively be used as general

purpose inputs. Please contact iWOW directly for more information on the extended customization to this

interface.

Pin Description

Signal Pin Number Type Default Function

KBC0 11 Output Keyboard column 0





KBR0 50 Input Keyboard row 0

KBR1 49 Input (Internal pull-up) Keyboard row 1










Output current - - 3 - mA

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4.18.1 Implementation of a 5x5 keyboard

If a key button of the keyboard matrix is pressed, the corresponding row and column lines are shorted

together. To allow key press detection, all input pins (KBR) are pulled up to VCC and all output pins (KBC) are

driving a low level. Any action on a button will generate an interrupt through the input pin to the micro-

controller that will, as answer, scan the column lines. The scanning is a digital one with the debouncing done

in the module itself. A 33pF capacitor is recommended for each of the keypad input lines to eliminate ghosting

effect. ESD diodes are also recommended to eliminate ESD issues.

Figure 19: Keyboard Implementation Diagram

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4.19 2-Wire Serial Interface – I2C_SDA, I2C_SCL

This is a half-duplex serial port using 2-line for data transmission consisting of SDA data signal and SDL clock

signal. It can transfer at speeds up to 400Kbits/s (fast-mode).

Note: Supports 1.8V I2C compliant devices.

Pin Description

Signal Pin Number Type Default Function

I2C_SDA 23 Input/ Output 2- wire interface serial bi-directional data

I2C_SCL 24 Input/ Output 2- wire interface Master serial clock



High level input voltage, (SDA and SCL), VIH - - - 1.8 V

Low level input voltage(SDA and SCL), VIL - 0 - - V



information.

4.20 Serial Peripheral Interface (SPI) – SPI_CLK, SPI_MISO, SPI_MOSI, SPI_NCS0, SPI_NCS1

The SPI bus includes clock (SPI_CLK), I/O (SPI_MISO, SPI_MOSI) and chip select (SPI_NCS0, SPI_NCS1) signal.

Note: Supports 1.8V SPI compliant devices.

Pin Description


SPI_CLK 41 Input/

Output SPI serial clock

Open

SPI_MISO 21 Input/

Output

SPI Data: Master in/ Slave out

I = SPI serial data master-in

O = SPI serial data slave-out

Open

SPI_MOSI 40 Input/

Output

SPI data: Master out/Slave in

O = SPI serial data master-out

I = SPI serial data slave-in

Open

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4.20.1 SPI Address 0

Pin Description:


SPI_NCS0 22 Output MSSPI chip select 0 output Open

4.20.2 SPI Address 1

Pin Description:


SPI_NCS1 39 Output MSSPI chip select 1 output Open



information.

4.21 Buzzer Interface

The digital buzzer on pin 20 (shared function with GPIO_3) generates a modulated frequency signal for an

external buzzer up to 5K Hz. Connection pin shall remain open when not used.



information.

4.22 RF interface

TR-900 RF interface has a characteristic impedance of 50. The matching networks for an external antenna

connection are not included in the module and should be placed on the application board. Two methods of RF

connections are possible to the application board’s antenna.

4.22.1 Coaxial Receptacle

An ultra-miniature coaxial receptacle is provided on the bottom side of the module (60-pin connector side).

For this receptacle, Harwin’s UMC-series connector is adopted. Its part reference for the Harwin’s UMC

receptacle is UMCR-2250005R.

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4.22.2 RF Pad for Coaxial Cable

An RF pad, along with two ground pads, is provided on the topside of the module (along iWOW logo) for direct

connection to an antenna or coaxial cable. Please refer to the mechanical drawing for the location and

dimensions of these pads.

4.22.3 RF Performance

Frequency Bands RF Sensitivity (dBm) (Nominal)

GSM 850/EGSM 900 -104dBm

DCS1800/ PCS1900 -102dBm

4.22.4 Recommendations

The antenna must fulfill the following requirements below:

Frequency Bands EGSM 900 DCS 2800 GSM 850 PCS 1900

TX Frequency 880 - 915 MHz 1710 - 1785 MHz 824 - 849 MHz 1850 - 1910 MHz

RX Frequency 925 - 960 MHz 1805 - 1880 MHz 869 - 894 MHz 1930 - 1990 MHz

Impedance 50 ohm

VSWR Rx max 1.5 : 1

VSWR Tx max 1.5 : 1

Typical radiated gain 0 dBi in one direction at least

The optimum operating frequency depends on the application. A dual-band or a quad band antenna must

operate in the above frequency bands.

RF Pad

Ground Pads

Antenna

receptacle

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5 Electrical & Reliability Characteristics

5.1 Electrical Characteristics

Parameter Description Min Nom Max Unit

Supply Input:

VBAT Battery Input Voltage 3.2 3.8 4.5 V

IBBURSTB Burst peak current - - 1.5 A

Regulated Output:

VBOUTB Output voltage 1.65 1.8 1.95 V

IBOUTB Rated output current - - 200 mA

SIM Card Related:

VSIM Output voltage to 3V SIM card 2.7 2.85 2.95 V

VIL SIMDTC, Low level input voltage - - 0.54 V

VIH SIMDTC, High level input voltage 1.17 - - V

POWER ON/OFF Switch:

VTBIHTB High level input voltage 1.495 - - V

VTBILTB Low level input voltage - - 0.805 V

Digital Signal Characteristic (GPIO,UART,LPG,Keyboard):

VTBIHTB High-level input voltage 1.26 - 1.89 V

VTBILTB Low-level input voltage 0 - 0.36 V

VTBOHTB High-level output voltage at rated

current

1.26 - - V

VTBOLTB Low-level output voltage at rated

current

- - 0.45 V

ITBOHTB Rated output high current - 3 - mA

ITBOLTB Rated output low current - 3 - mA

Note: Due to the burst emission in GSM, the power supply (VBAT) must be able to handle high current peaks (1.5A max in EGSM band) in a short time.

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5.2 Absolute Maximum Ratings

Below list the absolute maximum ratings over operating free-air temperature:

Parameter Rating

Supply voltage range, VBAT -0.3 V to +4.5 V

Voltage on any input -0.2 V to +2.0 V

Peak output current on VIO (Note) 1.8V

Peak output current on VSIM 15 mA

Free-air temperature range. -30oC to 85

oC

Storage temperature range -40 oC to 85

oC

Note: iWOW reserved current usage for on-board features and future expansion. Customer requires more than

100mA, please contact iWOW.

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5.3 Reliability Compliance

The TR-900 module on Development Starter Kit has complied with the following test cases.

S/N Type of test Conditions

1 Dry heat Temperature: +85°C ±2°C Test duration: 16h Humidity in the test chamber: < 50%

2 Humidity Test Temperature: +65°C RH: 95% Rate of temperature change: dT/dt >= ± 3°C/min Recovery time: 3 hours

3 Temperature change (shock)

Low temperature: -40°C ±2°C High temperature: +85°C ±2°C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100

4 Damp heat cyclic High temperature: +55°C ±2°C Low temperature: +25°C ±2°C Humidity: 93% ±3% Number of repetitions: 6 Test duration: 12h + 12h

5 Cold storage Test Ab, -40°C / 16 h Unpackaged equipment & power supply unconnected

6 Dry storage Test Bb, +85°C / 16 h Unpackaged equipment & power supply unconnected

7 Change of storage temperature

Test Nb, 5 cycles (3h @-20°C , 3°C/min, 3h @+55°C )

8 Sinusoidal vibration Test Fc: 5 to 9Hz : 3,5mm 9 to 150Hz : 1g scan : 1 octave / Min (10cycles/axe)

9 Vibration Frequency range: 10-20Hz; acceleration: 3.1mm amplitude Frequency range: 20-500Hz; acceleration: 5g Duration: 2h per axis = 10 cycles; 3 axes

10 Shock half-sinus Acceleration: 500g Shock duration: 1msec 1 shock per axis 6 positions (± x, y and z)

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6 General Recommendation

6.1 General RF Guide

Ensure the RF signals are routed with 50 ohm characteristic impedance. Calculation have to be carried out to

ensure that thickness of the trace is 50 ohm impedance and ensure impedance control for RF trace during PCB

manufacturing if necessary.

The choice of stripline or microstrip is dependent on the designer.

Ensure the RF traces are isolated from noisy signals (digital, bus, supply).

Note: Ensure that all unused pins of the module are shorted properly terminated (refer to Recommended

Connections When Not In Use).

6.2 General Layout Guideline

It is advisable to use a 4 layer PCB with minimum 1 layer of uniform ground plane as this will help to

eliminate any ESD or EMC interferences.

Stack-ups should also be planned carefully to ensure proper shielding of critical traces. (Decision

should be made on the number of signals layers and plane such as power, ground, analogue, digital

and RF).

Good PCB layout comes with good placement of components. EMI is usually caused by poor PCB

layout.

Identify all the critical parts of the components before layout. After which, routing of the traces will

be neater and less susceptible to interference.

The legs of the TR-900 module should be soldered onto the main ground.

All ground planes should be continuous. This provides better grounding and return path. Good ground

plane also helps in heat dissipation and provide good EMI shielding.

Ensure all ground planes are connected with multiple vias to reduce the impedance between the

ground plane.

All ground planes should have low impedances connections.

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Ensure the power supply lines to the pin connectors have low impedance.

Design the pin connectors with proper isolation between the RF signals and noisy traces.

Analogue and digital ground should be properly isolated.

Remove unnecessary unconnected copper fills.

Do not route any traces under the module. A ground plane is preferred underneath the module to

provide optimum shielding.

Use shortest possible traces. Use 45 degree turn instead of sharp corners as shown below.

Avoid running high speed digital traces next to analog traces.

Ground for decoupling capacitor should be short and close to main ground.

6.3 Firmware Upgrade

For firmware upgrade, there are two alternatives:

o For UART approach (recommended), application board need to provide for access to UART_TX

UART_RX, 1V8 and VBAT.

o For USB approach, application board need to provide for access to USB signals and VBAT.

Note: For both approaches, all relevant signals and RESET signal needs to be isolated from application

board effects.

6.4 Power Supply Guideline

Do not connect main power input directly to the module. Ensure the filtering components are in

place. Add a ferrite bead if necessary.

A low ESR capacitor, preferably tantalum of > 1mF, is to be placed as close as possible to the module’s

voltage supply input. Other filtering capacitors should also be placed nearby if necessary.

It may be necessary to place additional 33pF close to the module when there are RF interferences.

Power supply must be able to deliver high current because of the GSM/GPRS burst emission. To

achieve that, the traces must be sufficiently wide enough to support the current peak. It is

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recommended that pins 1,2,3,4 and 5 should all be routed into one big copper trace as the power

supply line as shown below.

If voltage drop during peak current is high, an audible 217Hz will be heard through the audio jack

during calls. This is known as TDMA noise.

In worst-case scenario, when voltage drops to below the minimum voltage rating, the module may

shut down.

Typical voltage drop should be less than 200mV with good PCB layout.

If no audio circuitries are required, typical voltage drop can be higher as long as it meets the minimum

voltage rating.

A good ground plane should be placed closed to power trace.

Use multiple vias to ensure good grounding on a multiple layer PCB board.

Use big vias size to connect between layers so as to reduce the impedances of the vias.

VB

att

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7 Incoming Inspection Criteria for TR-900 Module

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7.1 Logistics Inspection

a) Packaging correctness i. Model No and Label

Check that the TR-900 modules have labels pasted on them. These labels should display the

model number, IMEI and serial number.

ii. Quantity Ensure that the quantity is accurate.

iii. Status of packaging Check that the module is packed into box in a face up position as shown in the picture below.

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b) Physical Inspection i. 60 Pin Connector ii. Shield Cover iii. RF Receptacle

Note: Ensure that the following parts are intact and no visible physical damages.

c) Firmware Correctness i. Correct firmware loaded

You can check the firmware by typing ‘AT+CGMR’ when communicating with the modules.

8 Storage Conditions

The TR-900 modules can be stored under the following conditions:

Storage Temperature Range: -40° C to +85° C.

RF Receptacle

60-pin connector

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9 Packaging Information

Description: Conductive Box with Trays

Box Size: 344 x 230 x 68 (H)mm

Box Material: Single Wall – 275k/275k

Box Print: Conductive Ink Coating

Quantity: 150 pcs TR-900 modules

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10 Labeling Information

10.1 Module Box Label

The following information is labeled on the Module Box.

Model No. IMEI Range Firmware Qty Baud rate

10.2 Module Label

Please note that the module label displays the model number, barcode, IMEI, serial number, and place of

origin followed by the CE code and FCC ID.

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11 Caution Display – Handling

TR-900C is ESD sensitive (Voltage < 1kV) and require special ESD precautions typically applied to ESD sensitive

components.

It is recommended to use standard ESD precautions, as described in the following norm:

Always discharge before entering ESD area.

Operator handling the product should use a grounded wrist strap with good skin contact

Isolative footwear should also be worn to prevent static discharge flowing from body to ground.

Parts should be placed on approved static dissipative materials.

A static control workstation should be provided with ESD protective work surface and proper grounding.

Proper hand tools, ie.pliers, tweezers should be used when handling products.

Soldering iron should have the tip properly grounded.

Static control area should be made available for movements and transportation of product between 2

points.

Recommended humidity should be between 30% - 70%

Wear proper clothing and garments in an ESD environment.

For more information on ESD, please refer to ANSI/ESD S20.20

* Improper ESD control and poor handling will result in electrical failure and reliability problems

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12 Assembly Process

This section gives recommendations for the industrial assembly of the module on the application.

12.1 60 pin Connector Insertion Process Insert the module connector onto the application connector gently till you hear a click.

12.2 Soldering of legs The legs of the module should be soldered according to the following instructions:

The type and size of connection holes should be designed according to iWOW’s recommendation (see Appendix for mechanical drawing)

The quality of the soldering must be in accordance with the IPC-A-610 Rev-D

12.2.1 Hand soldering Please note the following instruction when performing hand soldering.

1. Assemble the module on the application 2. Make sure that a click is heard when inserting the 60-pin connector on TR-900 onto connector on

application board 3. Solder the 4 legs on the other side of the application board 4. Check with a scope the quality of the solder

12.3 RF connection There are three ways to interface an antenna to the RF connection of the module:

1. Connect the antenna to the module through the coaxial RF receptacle provided on the bottom side of the module

2. Connect the antenna to the module on the RF pad with a coaxial cable 3. Connect the antenna to the module on the RF pad with a spring contact

12.3.1 Connection via the coaxial RF receptacle A coaxial RF receptacle is provided on the bottom side of the module.

Supplier: Harwin Part number: UMCR-2250005R

The following are some options for cable assemblies compatible to the RF receptacle from Harwin:

UMCA-XXXXX-000

UMCA-XXXXX1-035

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12.3.2 Connection to the RF pad by soldering with a coaxial cable

The antenna can be connected to the module through a coaxial cable. The cable is connected to both the RF

pad and the Ground pad.

The cable is recommended to be soldered as described on the mechanical drawing on the following page.

Notes:

1 Always use a coaxial cable for connecting antenna to module.

2 Shielding of the coaxial cable must be done by soldering onto ground pad of module.

3 Coaxial cable should be as short as possible.

4 Soldering of coaxial cable should be done according to the recommended cable soldering specifications.

5 It is recommended to use XXXXX or RG178 coaxial cable or equivalent.

RF PAD

GROUND

PAD

Solder the shielding of the coaxial cable to the Ground Pad

Solder the core of the coaxial cable to the RF Pad

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12.3.3 Connection to the RF pad with a spring contact

The antenna can be connected to the module on the RF pad by using a spring contact as shown below.

There are no standard spring contacts available for the TR-900 module. As such, this solution requires a

specific part to be developed.

To Antenna

Contact on RF Pad

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13 Rework and Module Exchange Process

The following is the rework and module exchange process.

1. Locate the legs to unsolder 2. Set the temperature of the soldering station accordingly 3. With the use of solder wick and the soldering iron, remove the solder from the leg and soldering pad. 4. Repeat the procedure for each leg 5. Remove the module gently. 6. Check that the there is no solder left and that the pads are OK. 7. Clean the pads, if necessary, with soldering or solder wick. 8. To solder a new module, refer to Chapter 12.

Note: The temperature of the Iron must not exceed the 350oC over 3 seconds, to comply with Lead-Free

soldering. Recommendation of the solder paste manufacturer should be taken into consideration to ensure a proper

process.

http://pdf.iteksoft.com/modules.php?op=modload&name=Sections&file=index&req=viewarticle&artid=4

http://www.iteksoft.com/modules.php?op=modload&name=Sections&file=index&req=viewarticle&artid=4

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document. It may not be edited, copied or circulated without prior written agreement by iWOW Connections Pte Ltd. © 2011, 2012 iWOW

Connections Pte Ltd

57

15 SUPPORT/ CONTACT US

For distributor clients, please contact your respective distributor FAE.

For direct clients, please contact iWOW FAE (Technical Support Department) or email us at

[email protected].

For general enquiries please contact us at:

iWOW Connections Pte Ltd

1 Lorong 2 Toa Payoh, #04-01

Yellow Pages Building

Singapore 319637

Office: (65) 6748 8123

Fax : (65) 6748 2668

Email: [email protected]

Website: http://www.iWOW.com.sg

mailto:[email protected]

mailto:[email protected]

http://www.iwow.com.sg/