Thermomechanical Phenomena in Electronic Systems Final ...€¦ · 1 Final Conference Program Thermomechanical Phenomena in Electronic Systems Final Conference Program May 30 - June

ITherm 2017, May 30 - June 2, 2017 Walt Disney World Swan & Dolphin Resort, Lake Buena Vista (Orlando), FL, USA

1 Final Conference Program

The Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems

Final Conference Program

May 30 - June 2, 2017

Walt Disney World Swan and Dolphin Resort, Orlando, USA



WELCOME LETTER On behalf of the Organizing Committee it is a great pleasure to welcome you to ITherm 2017, the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2017 is being held along with the 67th Electronic Components and Technology Conference (ECTC), a premier electronic packaging conference.

Our thanks go to many people for helping make ITherm 2017 happen. ITherm 2017 is packed with many activities, including 210 Technical Papers in 4 Technical Tracks; 3 Keynote Talks addressing the future of electronics cooling, electronic packaging, and research; 6 Technical Panel Sessions for a highly interactive engagement with experts; 6 Technology-Talk Sessions providing deep dive talks on high profile topics; 74 Student Posters as a highly interactive forum on the latest research; 18 Professional Development Courses including 3 with heavy thermal content; Vendor Exhibits and Gold/Silver Sponsor Stations. For ITherm 2017 we have interesting new activities, including 4 Invited Talks on scientific and technological trends, as well as international conference summaries from THERMINIC and EPTC, and 12 Invited Paper Presentations based on selection from outstanding papers. Another exciting development is that an ITherm Women & Diversity Chapter has been initiated in 2017. They have organized a panel on identifying opportunities for enhanced diversity in engineering and the science community. Furthermore, research art pieces will brighten-up the appearance of ITherm under the Art-in-Science umbrella.

Many thanks go to everyone who has contributed to the success of ITherm 2017. We recognize there is more work than any of us could ever hope to handle. Thus, taking time and contributing to ITherm over and above regular everyday responsibilities is highly appreciated. In particular, we would like to thank our Track Chairs, and Co-Chairs, session chairs/co-chairs, panel/invited talks organizers, and many others. Last, but not least, the support of our Executive Committee is highly appreciated. A complete list of key contributors is listed later in this program.

We have sought sponsorships to support expanded student participation with opportunities to present their work in oral and poster presentations, as well as other activities at ITherm. This year we have had tremendous sponsorship support from both industry and academia. Our thanks go out to each of this year's sponsors for the critical role their sponsorship provides to ITherm. Please stop by their exhibition booths, benefit from exchange of information, and thank them for their sponsorship.

Thank you for participating in the ITherm 2017 conference and making it possible by your attendance. We hope you will enjoy the conference. If this is not your first time attending ITherm, then welcome back and we hope you will establish new contacts and continue to expand your network of trust. Please help first-time attendees to meet others and generally make people feel at home here. Regardless of whether this is your first time with us or not, we will endeavor to have you come back again in the future. We hope that while you enjoy the wide variety of technical venues that ITherm 2017 offers, you can also take a little extra time to enjoy the uniqueness of Orlando and the Disney World Resort. ITherm 2018 will be held in San Diego, CA, on May 29 to June 1, 2018, and we hope that you mark your calendars to be there as well.

Best wishes,

Michael M. Ohadi, Ph.D. General Chair

Thomas Brunschwiler, Ph.D. Program Chair

Jeffrey C. Suhling, Ph.D. Vice Program Chair


Final Conference Program 2

TABLE OF CONTENTS Welcome Letter ---------------------------------------------- 1 General Information ---------------------------------------- 2 Conference Room Locations ------------------------------ 5 Conference Organization Committee ------------------ 6 Conference Executive Committee ---------------------- 8 Sponsors, Exhibitors, and Partners --------------------- 9 Professional Development Courses ------------------- 10 Last Year’s Best Papers (ITherm 2016) ---------------- 12 ITherm 2018 Announcement ---------------------------- 12 Women & Diversity Achievers Panel ------------------ 13 Student Poster & Networking Session ---------------- 14

Art-in-Science Exhibition --------------------------------- 14 Conference Keynotes -------------------------------------- 17 2017 ITherm Achievement Award --------------------- 20 Invited Talks -------------------------------------------------- 21 Invited Paper Presentations ----------------------------- 24 Tech-Talk Sessions------------------------------------------ 25 Panel Sessions ----------------------------------------------- 33 Paper Reviewers -------------------------------------------- 36 Program: Tracks, Sessions & Presentations --------- 39 Acknowledgement to Sponsors & Exhibitors ------- 63 Program Overview -------------- Rear of Outside Cover

GENERAL INFORMATION

REGISTRATION

Location: Walt Disney World Swan, Lobby /Convention Level, Swan Foyer

Opening hours:

Tuesday, May 30 3:30 PM – 5:30 PM

6:30 AM – 5:30 PM

7:00 AM – 5:30 PM

Wednesday, May 31

Thursday, June 1

Friday, June 2 7:00 AM – 12:00 Noon

Conference Registration Includes:

Admission to All Conference Sessions

Luncheons (Wednesday/Friday)

Electronic Copy of the Conference Proceedings

Speakers Breakfast on Day of Talk

Speakers: On the day of your talk, please attend the Speakers Breakfast in the Swan Room from 7:00-7:45 AM to meet your session chairs and go over session procedures.

MISCELLANEOUS INFORMATION

HOTEL AMENITIES

The Walt Disney World Swan and Dolphin Resort features:

Several Restaurants

24-Hour Convenience Store/Cafeteria

Coin-Operated Launderette

Two Business Centers

Complimentary Scheduled Transport to allWalt Disney World Theme Parks,Attractions and Disney Resorts

EMERGENCY SERVICES

Automated External Defibrillators (AEDs) are located at the Front Desks and Health Clubs, as well as with security. Several fire extinguishers are spread-out throughout the property, on stage and off, and a first aid kit can be brought by security at someone’s request. In the event of a medical emergency, dial “22” from any house phone located throughout the property and a first aid/CPR/AED trained security officer will arrive with a first aid kit and AED.

Fees (Onsite Registration) IEEE/ASME Member Fee Non-Member Fee Student Joint ITherm/ECTC Registration 1,100 USD 1,310 USD ITherm Registration 700 USD 800 USD 350 USD





COMMITTEE MEETINGS

ART IN SCIENCE EXHIBIT (SWAN FOYER) – HOW TO VOTE

Use the tickets in your registration envelope to cast your vote for your three favorite submissions. Each vote you cast will also serve as an entry into the raffle to win an exclusive Disney pin. Winners will be announced at the luncheon on Friday afternoon.

ITHERM EXECUTIVE COMMITTEE

The ITHERM Executive Committee meeting will take place in Parrot 2, on Wednesday May 31

st, from 7:00 to

8:00 PM. By invitation only.

ITHERM 2018 PROGRAM PLANNING

The ITHERM 2018 Program Planning meeting will take place in Mockingbird 1, on Thursday June 1

st, from 7:00

to 8:00 PM. Open to all current and future contributors.

ASME K-16 COMMITTEE

The ASME K-16 Committee meeting will take place in Macaw, on Wednesday May 31

st, from 7:00 to 8:00

PM. Open to Committee Members and to all interested in becoming involved in Committee activities.

ITHERM 2017 ORGANIZERS DINNER

The ITHERM Organizers Dinner will take place in Osprey, on Thursday June 1

st, from 8:00 to 10:00 PM. By

invitation only.

WOMEN & DIVERSITY COMMITTEE MEETING

The ITHERM Women & Diversity Committee meeting will take place in Parrot 2, on Wednesday May 31

st,

from 8:00 to 9:00 PM. Open to all.



CONFERENCE ROOM LOCATIONS

WALT DISNEY WORLD SWAN HOTEL

CONFERENCE FLOORPLAN

Convention Entrance

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Mockingbird

Macaw

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En

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2

1 2

Keynotes Tech-Talks

Panels Invited Talks

Sessions Meetings

BreakfastsLuncheons

Student Posters

Registration Exhibits

Coffee Breaks Art-in-Science

Swan Foyer

Parrot1

Swan

Osprey Ballroom



CONFERENCE ORGANIZATION COMMITTEE ORGANIZATION COMMITTEE

General Chair Michael Ohadi University of Maryland

Program Chair Thomas Brunschwiler IBM Research – Zurich

Vice Program Chair Jeffrey C. Suhling Auburn University

THERMAL MANAGEMENT I : COMPONENT LEVEL TRACK

Chair Justin Weibel Purdue University

Co-Chair Peter de Bock GE Global Research

Co-Chair Baris Dogruoz Cisco Systems, Inc.

THERMAL MANAGEMENT I I: SYSTEM LEVEL TRACK

Chair Vadim Gektin Huawei Technologies Co. Ltd.

Co-Chair Ashish Gupta Intel Corporation

Co-Chair Evelyn N. Wang Massachusetts Institute of Technology

Co-Chair Mehdi Saeidi Qualcomm Technologies, Inc.

EMERGING TECHNOLOGIES & FUNDAMENTALS TRACK

Chair Satish Kumar Georgia Institute of Technology

Co-Chair Amir H. Shooshtari University of Maryland

Co-Chair Amy Marconnet Purdue University

Co-Chair Banafsheh Barabadi Massachusetts Institute of Technology

MECHANICS & RELIABILITY TRACK

Chair Jin Yang Intel Corporation

Co-Chair Shi-Wei Ricky Lee Hong-Kong University of S&T

Co-Chair Kaushik Mysore AMD

Co-Chair Kaustubh Nagarkar GE Global Research

SPECIAL TECHNICAL CONTRIBUTIONS

Keynote Chair John Thome EPFL

Tech-Talk Chair Peter de Bock GE Global Research

Tech-Talk Co-Chair David H Altman Raytheon

Panels Chair Victor Chiriac Qualcomm Technologies, Inc.

Student Poster Chair Amir H. Shooshtari University of Maryland

Student Poster Co-Chair Milnes David IBM Corporation

Prof. Development Course Chair Jeffrey C. Suhling Auburn University

WOMEN & DIVERSITY CHAPTER (FOUNDING COMMITTEE)

Chair Cristina Amon University of Toronto

Co-Chair Yoonjin Won University of California, Irvine

Co-Chair Banafsheh Barabadi Massachusetts Institute of Technology

Co-Chair Farah Singer University of Maryland

Co-Chair Anahit Raygani NM2 Inc.

Co-Chair Damena Agonafer Washington University, St. Louis

http://won.eng.uci.edu/people.html





CONFERENCE ORGANIZATION COMMITTEE (Continued)

ADMINISTRATIVE

Administrative Assistant Damaris David ITherm

Sponsors Chair Joshua Gess Oregon State University

Sponsors Co-Chair Sandeep Tonapi Anveshak

Exhibitor Chair Joshua Gess Oregon State University

Treasurer Dustin Demetriou IBM Corporation

Hotel Liaison, A&V and F&B Pritish Parida IBM Research

COMMUNICATION

Paper Management Database Sandeep Tonapi Anveshak

Conference Proceedings Paul Wesling

Webmaster Shashank Thakur Anveshak

Webmaster Kedar Khire Anveshak

AWARD COMMITTEES

ITherm Achievement Award Chair Sushil Bhavnani Auburn University

ITherm Achievement Award Co-Chair Koneru Ramakrishna Cirrus Logic

Best Paper Award Chair Yogendra K. Joshi Georgia Institute of Technology

Best Paper Award Co-Chair Koneru Ramakrishna Cirrus Logic

ITherm would like to thank Susan Ansorge, Betsy Hutchinson, Jessica Ansorge, Heidi Ansorge, Hailey Wesling, and Katie Wesling for their help during the conference.

CONFERENCE EXECUTIVE COMMITTEE

The ITherm Executive Committee is made up of past ITherm General Chairs who are willing to assist the conference. It provides the leadership and continuity needed to carry forward the thrust of our Inter Society Conference.

Dereje Agonafer University of Texas at Arlington

Cristina H. Amon University of Toronto

Mehdi Asheghi Stanford University

Avram Bar-Cohen University of Maryland

Sushil H. Bhavnani Auburn University

Yogendra K. Joshi Georgia Institute of Technology

Gary B. Kromann Motorola

Alfonso Ortega Villanova University

Koneru Ramakrishna Cirrus Logic

Bahgat Sammakia State University of New York at Binghamton

Tom Lee Xilinx

Sandeep Tonapi Anveshak

Madhu Iyengar Google Inc.

Michael Ohadi University of Maryland



SPONSORS, EXHIBITORS, AND PARTNERS For more details on our ITherm 2017 Sponsors, Exhibitors, and Partners, please see http://ieee-itherm.net/itherm/conference/sponsors_and_exhibitors

GOLD SPONSORS

Intel Corporation

Binghamton University

University of Maryland

Dupont

SILVER SPONSORS

IBM Corporation

Huawei Technologies Co.

EXHIBITORS

Staubli North America

Innovative Research, LLC

Polyonics

PROGRAM SPONSORS

Microsanj

Lanyard Sponsor

Future Facilities

USB Proceedings

Sponsor

University of California - Irvine

Student Poster Session Sponsor

World Scientific

PARTNERS

Electronics Components and Technology Conference (USA)

Thermal Investigations of ICs and Systems (Europe)

Electronics Packaging Technology Conference

(Asia)

EPTC

http://ieee-itherm.net/itherm/conference/sponsors_and_exhibitors



PROFESSIONAL DEVELOPMENT COURSES All Professional Development Courses will be held on Tuesday, May 30 in the Dolphin Hotel Conference Center. The Morning (AM) Courses will be from 8:00 AM to 12:00 PM, and the Afternoon (PM) Courses will be from 1:15 PM to 5:15 PM. Separate registration (includes lunch) for the Tuesday PDC courses is required through the ECTC registration desk.

THERMAL FOCUS

PDC #06, Integrated Thermal Packaging and Reliability of Power Electronics (AM)

Course Leaders: Patrick McCluskey and Avi Bar-Cohen – University of Maryland

PDC #09, Thermo-Electric Coolers: Characterization, Reliability, and Modeling (AM)

Course Leader: Jaime Sanchez – Intel Corporation

PDC #18, Thermo-Electrical Co-Design for 3d Integration (PM)

Course Leaders: Ankur Srivastava - University of Maryland, Avram Bar-Cohen and Jim Wilson – Raytheon

RELATED TOPICS

PDC #01, Achieving High Reliability of Lead-Free Solder Joints – Materials Considerations (AM)

Course Leader: Ning-Cheng Lee – Indium Corporation

PDC #02, Wafer Level-Chip Scale Packaging (AM)

Course Leader: Luu Nguyen – Texas Instruments, Inc.

PDC #03, LED Packaging, System and Reliability Considerations (AM)

Course Leader: Xuejun Fan – Lamar University

PDC #04, Future of Packaging: Strategic Technologies, Manufacturing Infrastructure and Applications (AM)

Course Leader: Rao Tummala – Georgia Institute of Technology

PDC #05, Polymers and Nanocomposites for Electronic and Photonic Packaging (AM)

Course Leaders: C. P. Wong – Georgia Institute of Technology; Daniel Lu –Henkel Corporation

PDC #07, Fundamentals of Electrical Design and Fabrication Processes of Interposers, including their RDLs (AM)

Course Leaders: Ivan Ndip, Markus Wöhrmann, and Michael Töpper – Fraunhofer IZM

PDC #08, Introduction to Mechanics Based Quality and Reliability Assessment Methodology (AM)

Course Leaders: Shubhada Sahasrabudhe and Sandeep Sane – Intel Corporation

PDC #10, Flip Chip Fabrication and Interconnection (PM)

Course Leaders: Eric Perfecto – GLOBALFOUNDRIES; Shengmin Wen – Synaptics Inc.

PDC #11, Package Failure Analysis - Failure Mechanisms and Analytical Tools (PM)

Course Leaders: Rajen Dias – Amkor Technology and Deepak Goyal – Intel Corporation

PDC #12, 3D IC Integration and 3D IC Packaging (PM)

Course Leader: John Lau – ASM Pacific Technology Ltd.

PDC #13, Flexible Hybrid Technologies (PM)

Course Leader: Pradeep Lall – Auburn University

PDC #14, Polymers for Electronic Packaging (PM)

Course Leader: Jeffrey Gotro –InnoCentrix, LLC

PDC #15, Novel Interconnect and System Integration Technologies (PM)

Course Leader: Muhannad Bakir – Georgia Institute of Technology

PDC #16, Package Failure Mechanisms, Reliability and Solutions (PM)

Course Leader: Darvin Edwards –Edwards Enterprises

PDC #17, Ageing of Polymers and the Influence on Microelectronic Package Reliability (PM)

Course Leaders: Tanja Braun and Ole Hölck – Fraunhofer IZM





LAST YEAR’S BEST PAPERS (ITHERM 2016) EMERGING TECHNOLOGIES TRACK

BEST PAPER:

Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array

Kevin P. Drummond, Justin A. Weibel, Suresh V. Garimella, Doosan Back, David B. Janes, Michael D. Sinanis, and Dimitrios Peroulis (Purdue University)

HONORABLE MENTION:

Thermal-Mechanical Considerations During Thermal Solution Assembly of Bare-Die Packages

Je-Young Chang, Tannaz Harirchian, Shubhada Sahasrabudhe, Steve Klein, Frank Liang, Haowen Liu, Moss Weng, Mark Gallina, Marco A. Cartas-Ayala, Radha Muddu, Ashish Gupta (Intel Corporation)

MECHANICS TRACK

BEST PAPER:

Thermo-Mechanically and Electrically Induced Interfacial Incompatibility in 3D Packages with Through Silicon Vias

Hanry Yang, Lutz Meinshausen, Tae-Kyu Lee, Indranath Dutta

HONORABLE MENTION:

Estimation of Passivated Metal Stack Modulus through Simulations of Micro‐indentation

Tao Song, Ganesh Subbarayan, Hung-Yun Lin, and Siva Gurrum

THERMAL MANAGEMENT TRACK

BEST PAPER:

Review of Percolating and Neck-Based Underfills with Thermal Conductivities of up-to 3 W/m-K

Thomas Brunschwiler, Jonas Zürcher, Severin Zimmermann, Brian R. Burg, Gerd Schlottig, Xi Chen, Tuhin Sinha (IBM); Mario Baum, Christian Hofmann, Remi Pantou (Fraunhofer ENAS), Albert Achen (Lord Germany GmbH); Uwe Zschenderlein, Sridhar Kumar, Bernhard Wunderle (Technical University of Chemnitz); Marie Haupt, Florian Schindler-Saefkow (AMIC); Rahel Strässle (IBM)

HONORABLE MENTION:

A Dynamic Stochastic Optimization Control Model for Data Centers Based on Numerical Modeling

Hidetomo Sakaino (NTT Network Technology Labs) Thermal Analysis of Ethernet Connector in Power Applications with an Engineering Mechanics Approach

James Petroski (Design by Analysis Technical Consulting)

ITHERM 2018 ANNOUNCEMENT CALL FOR PAPERS

ITherm 2018 will be co-located with ECTC 2018 and take place on May 29 – June 1, 2018 at The Sheraton Hotel & Marina in San Diego, CA. Please visit http://ieee-itherm.net/ for more information and to submit an abstract. The abstract submission deadline is August 27, 2017.

http://ieee-itherm.net/



WOMEN & DIVERSITY ACHIEVERS PANEL TOPIC: ENHANCING PARTICIPATION OF WOMEN AND UNDERREPRESENTED MINORITIES IN ENGINEERING

Wednesday, May 31, 5:35-6:55 PM, Osprey ITherm 2017 is pleased to announce that the Women and Diversity Chapter will host its inaugural panel on “Women and Diversity Achievers” at this year’s conference. Through mentorship, networking and outreach, this newly created Chapter is also dedicated to encouraging women and underrepresented engineers and scientists with diverse backgrounds to follow their interests towards engineering careers in academia and industry. The Chapter welcomes participation from all ITherm members. In the first half of the panel discussion, the panelists will introduce some of the challenges faced by women, minorities and underrepresented groups, and strategies to overcome these challenges, as well as share their own career strategies to professional development and success. This will be followed by an interactive Q&A with the audience. After the panel session, a social and networking reception will be held. All ITherm and ECTC attendees are invited to join in on this engaging discussion and the reception afterwards. Chapter Chairwoman and Panel Moderator: Panel Co-moderator:

Cristina Amon University of Toronto

Samuel Graham Georgia Tech

Panelists:

Dereje Agonafer Lauren Boteler Jessica Shi Alfonso Ortega Natalie Rudolph

University of Texas Army Research Lab EPRI Villanova University University of WI Chapter Founding Committee:

Damena Agonafer Banafsheh Barabadi Anahit Raygani Farah Singer Yoonjin Won Washington Univ MIT NM

2 Inc. University of MD Univ of CA, Irvine



STUDENT POSTER & NETWORKING SESSION

THURSDAY, JUNE 1, 5:25 – 6:55 PM, SWAN

The Student Poster and Networking Session provides a great opportunity for students to present their research and interact with other conference attendees from industry and academia. In addition, interested students are able to distribute their resume and get connected to potential employers from industry. The event features a poster contest where the outstanding posters will be recognized by the conference. Evaluation of the posters is conducted in two rounds. The first round was conducted in advance of the conference and involves evaluation of the posters in electronic format. In the second round, on-site evaluations are performed of the student presentations during the poster session event. The posters are judged based on technical merit, clarity and self‐sufficiency of the content, originality of the work, visual presentation and impact of the poster display, and oral presentation at the poster session. A combination of the scores received in both rounds is used to select the winners. In addition, travel grants for the student poster presenters have been provided by the conference sponsors in the form of several nights of hotel accommodations at the conference hotel. All conference attendees are invited to attend the session and get involved in discussion with the next generation of thermal, reliability, and electronic packaging experts!

ART-IN-SCIENCE EXHIBITION

MAY 31 THROUGH JUNE 2, SWAN FOYER

The Art-in-Science exhibition, held for the first time this year, provides a fun opportunity for the ITHERM community to showcase the artistic side of their work. Authors share their joy and excitement through images and artwork produced during the course of scientific explorations and technical implementations, displaying heat and mass transfer, as well as thermo-mechanical phenomena. Entries will be judged on several criteria such as originality and creativity, aesthetics, visual impact and relevance. Conference attendees will vote for the best images over the duration of the conference using ballots provided in their conference package. Winners will be announced during the awards luncheon on Friday.







CONFERENCE KEYNOTES

K-1: FUTURE DIRECTIONS FOR STEM EDUCATION AND RESEARCH

Presenter: G. P. "Bud" Peterson, Georgia Institute of Technology Wednesday, May 31, 9:35-10:35 AM, Osprey Abstract: Changing expectations for higher education, combined with greater competition for resources, are creating a need to explore both immediate, and long-term sustainable solutions that address the effectiveness and costs associated with higher education. Here in the U.S., reductions in state support at public universities have resulted in increases in that portion of the costs that are passed on to our students, stimulating the national debate about student debt. Similar pressures exist for the funding agencies that support university-based research. As a result, it is imperative that we continue to explore and evaluate new, innovative approaches to higher education, in order to provide alternative educational models that reduce costs and improve the processes. Innovation can impact everything from the way we present material and interact with our students, to how we attract and educate tomorrow’s leaders, particularly in STEM fields. Recent advances in areas such as “flipped classrooms,” technology assisted learning - including the maturation of the Massive Open Online Course (MOOC’s) approach, and the use of artificial intelligence methodologies to assist in the teaching and learning process, are already having a significant impact on the way we educate and communicate with our students. These new innovative approaches, when coupled with continued collaborations and partnerships with industry, government and other institutions outside of our traditional universities, may provide a number of alternative solutions. G. P. “Bud” Peterson was appointed as the 11th president of Georgia Tech on April 1, 2009. Throughout his career, Dr. Peterson has played an active role in helping to establish the national education and research agendas, serving on numerous industry, government, and academic task forces and committees. As distinguished scientist, he was appointed in 2008 by President George W. Bush, and again in 2014 by President Barack Obama, to serve as a member of the National Science Board, which oversees the NSF and advises the President and Congress on national policy related to science and engineering research and education. He is a member of the Executive Committee of the board of directors of the Association of American Universities (AAU) and Chair of the Board of Governors of the NCAA. Peterson is a fellow of both the American Society of Mechanical Engineers (ASME) and the American Institute of Aeronautics and Astronautics (AIAA), and received the AIAA Distinguished Service Award in 2011. His research has focused on phase-change heat transfer in the cooling of electronic devices and spacecraft thermal control. He is widely published, authoring or co-authoring 16 books or book chapters, 230 refereed journal articles, and more than 150 conference publications. He also holds a total of 12 patents, with three others pending.



K-2: SCALABLE QUANTUM COMPUTING WITH SUPERCONDUCTING QUBITS

Presenter: Stefan Filipp, IBM Research – Zurich, Switzerland Thursday, June 1, 9:35-10:35 AM, Osprey Abstract: Quantum computers hold the promise for outperforming conventional computers in certain types of problems. Factorizing large numbers, searching unstructured data and solving constrained optimization problems can be tackled much more efficiently on a quantum computer as can the computation of energy spectra and dynamics of complex many-body physical systems such as molecules or condensed matter. However, its successful realization requires exquisite control of physical systems at the quantum level. In particular, superconducting quantum circuits are promising candidates for the realization of a large-scale quantum computer. In this presentation, I will introduce the basic concepts of quantum information processing and highlight recent developments at IBM towards a scalable quantum computing platform such as the demonstration of error-correction schemes and quantum simulation methods with superconducting quantum bits. I will further discuss technological challenges to meet the stringent requirements for controlling a large number of quantum bits without losses and decoherence. In particular, I will elaborate on challenges and solutions related to integrated chip designs, microwave packaging and optimized operation at cryogenic temperatures, to enable medium to large scale quantum computers in the future. Stefan Filipp is research staff member at IBM since 2014, currently working on a multi-qubit quantum processing platform based on superconducting circuits at IBM Research - Zurich. He received his degree in physics from the Vienna University of Technology, Austria, and the Uppsala University, Sweden for his theoretical work on bounds on quantum correlations and off-diagonal geometric phases. He completed his Ph.D. at the Vienna University of Technology in 2006 with his thesis on the experimental observation of geometric phases in neutron interferometry. For his work he was awarded the Victor-Hess Award of the Austrian Physical Society. He moved to ETH Zurich to work as Postdoc and later Senior Researcher on quantum computing with superconducting circuits. He has pioneered the investigation of noise effects on geometric phases with the detection of geometric dephasing channels and the first experimental observation of robust non-abelian geometric phases.

K-3: RECENT ADVANCES AND NEW TRENDS IN SEMICONDUCTOR PACKAGING

Presenter: John H. Lau, ASM Pacific Technology Ltd. Friday, June 2, 9:35-10:35 AM, Osprey Abstract: In this talk, recent advances in the several semiconductor packaging technologies will be presented including (1) flip chip technology such as wafer bumping and assembly; (2) fan-out wafer/panel-level packaging such as chip-first (die-down), chip-first (die-down), and chip-last (RDL-first); (3) 3D IC integration such as HMC (hybrid memory cube), HBM (high bandwidth memory), 3D IC/MEMS integration, and 3D IC/CIS integration; (4) embedded hybrid 3D integration such as the VCSEL, driver chip, and serializer in an optical polymer waveguide PCB; and (5) 2.5D IC integration and TSV-less interconnection such as CoWoS (chip on wafer on substrate), SLIT (silicon-less interconnect technology), and EMIB (embedded multi-die interconnect bridge). Emphasis is placed on the latest developments of these areas in the past few years, and their future trends will also be recommended. John Lau has been a senior technical advisor of ASM since 2014. Prior to that, he was an ITRI Fellow of Industrial Technology Research Institute for 4.5 years, a visiting professor at HKUST for 1 year, the Director of MMC Laboratory with IME Singapore for 2 years, and a Senior Scientist at Hewlett Packard/Agilent in California, US for more than 25 years. With more than 38 years of R&D and manufacturing experience, John has published more than 450 peer-reviewed papers, 30 issued and pending US patents, as well as 18 textbooks on flip chip technology, advanced MEMS packaging, and 3D IC integrations. John is a Fellow of IEEE and ASME. He was awarded the IEEE CPMT Award in 2013 for “for contributions to the literature in advanced solder materials, manufacturing for highly reliable electronic products, and education in advanced packaging.”





ITHERM ACHIEVEMENT AWARD (2017) AWARD LUNCHEON AND TALK, WEDNESDAY, MAY 31, 12:30 PM – 1:45 PM, SWAN

THERMAL ENERGY MANAGEMENT IN THE AGE OF CONNECTIVITY:

COOLING OF ELECTRONIC SYSTEMS FROM DEVICE TO DATA CENTER

Presented by Awardee Dr. Alfonso Ortega, Villanova University

Abstract: Many observers claim that we are in the midst of a “Fourth Industrial Revolution,” with a dominant aspect of that revolution being the notion that everyone and everything will eventually be “connected.” The fabric that connects billions of people (through mobile and wearable devices), things (Internet of Things) and services (Internet of Services) is composed of (1) the digital engines or factories that store and process data (Data Centers, the “cloud”) and (2) the wired and wireless network that transmits that data (the Internet). It is easy to overlook the silent third partner in this alliance of technologies which is (3) the energy infrastructure required to power both the digital engines and the network. In this talk, the thermodynamics of data centers will be discussed, starting with the environmentally problematic observation that almost all of the electrical power consumed by the “electronic engines” or servers in data centers is dissipated as heat, and that in many cases as much power is used to cool servers as to power them. Traditional technologies to thermally manage the heat using free air cooling or refrigerated air conditioning will be discussed and contrasted with more advanced methods including liquid cooling with both single and two-phase techniques. Innovative methods for delivering power to servers on the front end and capturing and re-using or converting waste heat on the back end will be analyzed.

Dr. Alfonso Ortega is the James R. Birle Professor of Energy Technology at Villanova University. He is the Director and founder of the Laboratory for Advanced Thermal and Fluid Systems, and is the Site Director for the NSF Center for Energy Smart Electronic Systems. He received his B.S. from The University of Texas-El Paso, and his M.S. and Ph.D. from Stanford University, all in Mechanical Engineering (ME). Dr. Ortega was on the faculty of the University of Arizona in Tucson until 2004. From 2004 to 2006, Dr. Ortega was the Program Director for Thermal Transport and Thermal Processing in the Chemical and Transport Systems Division of the NSF. Since 2006 he has been on the faculty of ME at Villanova University. From 2007-2012 he served as Associate Dean of the College of Engineering for Graduate Programs and Research. In 2012, he was named the inaugural Associate VP for Research and Graduate Programs at Villanova and served in that role until 2016.

Dr. Ortega expertise lies in the areas of thermal management of data centers and electronic systems, convective and conjugate heat transfer in complex flows, experimental measurements in the thermal sciences, and thermal management in energy systems. He has supervised over 40 M.S. and Ph.D. candidates to degree completion, 5 postdoctoral researchers, and more than 70 undergraduate research students. He is the author of over 200 journal and symposia papers, book chapters, and monographs. Dr. Ortega’s research has made important contributions in many areas including (i.) natural convection cooling of electronic systems, (ii.) forced convection in complex electronic packaging, (iii) modeling and experimental characterization of air-cooled heat sinks, (iv.) thermal modeling and measurements in electronic packaging, (v.) jet impingement heat transfer, (vi.) synthetic jet

heat transfer, (vii.) heat transfer in advanced liquid cooled mini- and micro-heat exchangers and cold plates, and (viii.) spray cooling and droplet impingement heat transfer and fluid dynamics. More recently also focused on the energy and thermal management of data centers with research in areas such as (ix.) modeling and measurements of complex air-flows in data center environments, (x.) dynamic on-demand thermal systems, and (xi.) single and two-phase liquid cooling, and (xii.) recovery and re-use of data center waste heat. Dr. Ortega is a Fellow of the ASME. He is the recipient of the NSF Presidential Young Investigator Award, the ASME Electronic Packaging Division Thermal Management Award, the SEMITHERM Significant Contributor Award, and the Harvey Rosten Award for Excellence. He has been an Associate Editor of the ASME Journal of Heat Transfer, Associate Editor of the ASME Journal of Electronic Packaging and Guest Associate Editor of the IEEE CPMT. He has chaired the ASME K16 Committee, the ASME Electronic and Photonic Packaging Division, the ASME/IEEE ITHERM Symposium, the IEEE SEMITHERM Symposium, and the ASME InterPACK Conference. He currently chairs the ASME Heat Transfer Division Honors and Awards Committee.



INVITED TALKS

I-3: TECHNOLOGY TRENDS (WED, MAY 31, 1:50 – 3:20 PM), OSPREY

INTEGRATED PHOTONIC NETWORKS FOR DATA CENTERS — OVERCOMING THE CHIP-SCALE I/O

PERFORMANCE BARRIERS

Speaker: Michael Haney, ARPA-e

Abstract: The interconnection networks within data centers are approaching performance limits that will require new cost-effective integrated photonic approaches, and associated packaging concepts, for chip-scale I/O and switching circuits. This talk will present a vision for achieving transformative data-center networks under the recently announced ENLITENED Program from the Advanced Research Projects Agency-Energy (ARPA-E).

Dr. Michael Haney serves as a Program Director at the Advanced Research Projects Agency-Energy (ARPA-E). He is on assignment from the University of Delaware, where he is a Professor of Electrical and Computer Engineering. Previous positions include Program Manager at the Defense Advanced Research Projects Agency (DARPA) and co-founder of Applied Photonics, Inc. He received his Ph.D. in Electrical Engineering from the California Institute of Technology, M.S. in Electrical Engineering from the University of Illinois at Urbana, and B.S. in Physics from University of Massachusetts, Amherst. Dr. Haney is a Fellow of The Optical Society of America.

THE JOURNEY TOWARD FLEXIBLE THERMAL SUPERCONDUCTORS

Speaker: Sung Jin Kim, KAIST

Abstract: This talk is intended to provide a perspective and review of a journey toward a flexible thermal superconductor, which can be bent or twisted, to control heat transfer in heat generating devices of various shapes. The thermal superconductor exploits recent advances in micro pulsating heat pipes, which consists of liquid-vapor slug-train units oscillating within a microchannel. It will have a thermal conductivity of 1000 W/mK, 2.5 times higher than copper, and 1000 times higher than current flexible materials, and a thickness of less than 1 mm. Compared to conventional pulsating heat pipes, micro pulsating heat pipes with hydraulic diameters of less than 1 mm have interesting features like orientation independent performance. In addition, several new ideas for thermal performance enhancement in the micro pulsating heat pipes will be suggested. This talk will conclude with an overview of ongoing research activities associated with a prestigious 9 year grant by Korea’s Creative Research Initiative to develop Flexible and Thin Thermal Superconductors.

Sung Jin Kim is a Professor in the Department of Mechanical Engineering at KAIST (Korea Advanced Institute of Science and Technology). Until joining KAIST in July 1997, he was a group leader of Thermal Engineering Center at the IBM Tucson Laboratory for 8 years. He received a Ph.D. degree in Mechanical Engineering from the Ohio State



University in 1989. For 5 years, his research group at KAIST held National Research Lab status. Recently, he was awarded a prestigious 9-year grant by Korea’s Creative Research Initiative to develop Flexible and Thin Thermal Superconductors. He is a member of Korean Academy of Science and Technology, a member of National Academy of Engineering of Korea, an ASME Fellow and has received Scientific Achievement Award from KSME, Excellent Teaching Awards from KAIST, two Invention Achievement Awards and five Author Recognition Awards from IBM. He edited a book entitled Air Cooling Technology for Electronic Equipment.

I-7: INTERCONTINENTAL CONFERENCE SUMMARIES (THURS, JUNE 1, 1:50 – 3:20 PM),

OSPREY

HIGHLIGHTS AND TRENDS FROM EPTC 2016

Speaker: Ranjan Rajoo, GLOBALFOUNDRIES

Abstract: The 19th Electronics Packaging Technology Conference (EPTC 2016) is an International conference organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. It was held at the Singapore from 30th Nov to 3rd Dec 2016. EPTC 2016 consists of technical program, professional development courses, and technology exhibition corner. 170 high quality technical papers will be presented in 35 oral sessions, 2 interactive sessions, 1 workshop & 18 invited talks. In my talk, I will cover some key lights of the presented papers which covers advanced packaging, interconnect technologies, wafer level packaging, materials, processing, assembly, manufacturing, quality, reliability, thermal, mechanical modelling and simulation.

Ranjan Rajoo is currently a Member of Technical staff, OSAT supply chain management / turnkey engineering with GLOBALFOUNDRIES. Prior to joining he was researcher with A-star Institute of Microelectronics (IME) for 15 years in Microsystem, Design & Simulation task. His area of research was 2.5D, 3DIC using TSVs, ultra-thin chip embedding and wafer level packaging. His expertise includes characterization of mechanical and moisture properties of electronics packaging materials. He has set up new & novel experimental techniques to characterize electronics packaging materials, assembly process interaction & accelerated reliability, drop, impact and vibration testing. He has authored and co-authored more than 60 papers in journal and international conferences. He received 2 outstanding papers in prestigious conferences. He has given invited talks in the area of lead free solder/ Halogen Free printed circuits boards. Currently, he holds 6 U.S patents and 2 patents have been commercialized. He is also a member of IEEE, CPMT and IMAPS societies. He was a General chair for IEEE EPTC 2016.

HIGHLIGHTS AND TRENDS FROM THERMINIC 2016

Speaker: Christopher Bailey, University of Greenwich

Abstract: THERMINIC is an IEEE-CPMT sponsored workshop related to thermal issues in electronic components and systems. The workshop is held every September in Europe. In 2016, the workshop was held in Budapest, Hungary, with over 120 attendees. This presentation will provide highlights from last year’s conference, particularly in the areas of power electronics, thermal interface materials, and LED’s where multi-domain modelling methodologies were demonstrated and the use of reduced order modelling techniques such as Delphi (compact models) and model order reduction methods were discussed.

Professor Chris Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He has published over 300 papers on Design and Simulation of electronic packaging and systems. He is a member of the Board of Governors for IEEE CPMT, VP for Conferences, and is the UK Chapter Chair for the IEEE CPMT and Reliability Societies. Chris was the General Chair for THERMINIC-2016, and in 2014 he organized the 20th anniversary event of THERMINIC in London, UK. Chris is also a regular attendee at other CPMT conferences which include EuroSIME (where he is chair of the multi-physics track) and ESTC (where he was General Chair in 2008).





INVITED PAPER PRESENTATIONS

TECHNICAL TRACK INVITED PAPER PRESENTATIONS

THERMAL - I: COMPONENT-LEVEL

Thermal Model for Embedded Two-Phase Liquid Cooled Microprocessor (p250) Pritish Parida (IBM Corporation) Wednesday, May 31, 11:00 AM Thermal Conductivity Measurements on Suspended Diamond Membranes Using Picosecond and Femtosecond Time-Domain Thermoreflectance (p383) Ramez Cheaito (Stanford University) Friday, June 2, 11:00 AM Integration of Micro-contact Enhanced Thermoelectric Cooler with a FEEDS Manifold-Microchannel System for Cooling of High Flux Electronics (p399) Sevket Umut Yuruker (University of Maryland) Friday, June 2, 11:30 AM

EMERGING TECHNOLOGIES & FUNDAMENTALS

Sub-Diffraction Thermoreflectance Thermal Imaging Using Image Reconstruction Edit (p403) Amirkoushyar Ziabari (Purdue University) Wednesday, May 31, 3:50 PM Hierarchical Biphilic Micro/nanostructures for a New Generation Phase-change Heat Sink with 1800 W/cm

2

CHF Limit (p204) Saeed Moghaddam (University of Florida) Thursday, June 1, 11:00 AM Design Considerations for a Miniaturized TIM Tester with Extremely High Measurement Resolution (p116) Ronald Warzoha (US Naval Academy) Thursday, June 1, 1:50 PM

THERMAL - II: SYSTEM-LEVEL

Effect of Subcooling, Flow Rate and Surface Characteristics on Flow Boiling Performance of High Performance Liquid Cooled Immersion Server Model (p196) Sriram Chandrasekaran (Auburn University) Wednesday, May 31, 3:50 PM High Voltage Stacked Diode Package with Integrated Thermal Management (p459) Lauren Boteler (US Army Research Laboratory) Thursday, June 1, 8:00 AM Modeling the Impact of Thermal Effects on Luminous Flux Maintenance for SSL Luminaires (p147) J. L. Davis (RTI International) Friday, June 2, 8:00 AM

MECHANICS & RELIABIL ITY

Modeling of Residual Strain on BGA-PCB Assemblies for Pad Cratering Control (p344) Qiming Zhang (Hong Kong University of Science and Technology) Wednesday, May 31, 11:00 AM Effect of Simultaneous High Temperature and Vibration on MEMS based Gyroscope and Accelerometer (p348) Pradeep Lall (Auburn University) Wednesday, May 31, 3:50 PM Non-destructive in-situ Monitoring of Delamination of Buried Interfaces by a Thermal Pixel (Thixel) Chip (p336) Bernhard Wunderle (TU Chemnitz) Thursday, June 1, 8:00 AM



TECH-TALK SESSIONS

TT-1: ADDITIVE MANUFACTURING IN HEAT TRANS (WED, MAY 31, 8:00-9:30 AM), OSPREY

Chair: Bill Gerstler, GE Global Research

STRATEGIC VISION FOR ADDITIVE MANUFACTURING APPLIED TO THERMAL APPLICATIONS

Speaker: Omar Abdelaziz, Oak Ridge National Laboratory (ORNL)

Abstract: Additive manufacturing (AM) has the potential to create a paradigm shift on how engineers handle thermal applications. Conventional manufacturing constraints are no longer true. Both metal and advanced polymer composite AM techniques are discussed. The use of support material with hollow-channels can be leveraged as an opportunity for improving the design of e.g. heat pipes. On the other hand, advanced composite AM allows for faster throughput and may become a cost-effective mean to develop custom made heat exchangers for different applications.

Dr. Omar Abdelaziz is a Senior Research Staff and Group Leader of the Building Equipment Research Group - part of Oak Ridge National Laboratory (ORNL) Building Technologies and Integration Center (BTRIC). Prior to that, he was a Senior Fellow at the U.S. Department of Energy Building Technologies Office (BTO). Dr. Abdelaziz has more ~ 100 publications, 1 book, 2 patents, and more than 30 invention disclosures. Dr. Abdelaziz is active member of ASHRAE.

ADDITIVE MANUFACTURING HEAT EXCHANGERS

Speaker: Alok Patel, Unison Industries

Abstract: Unison Industries develops next generation thermal management solutions for both GE and Non-GE applications in the aerospace market. They have invested in advanced material research and manufacturing technologies to develop, additively manufactured heat exchangers. Unison currently supplies conformal air-cooled oil coolers for airplane engines and additively manufactured heat exchanger. Additionally, Unison and GE have explored technologies which reduce weight, improve heat rejection, and durability, while reducing part count, mitigating heat signatures, and improved reliability at competitive cost.

Alok Patel is a product manager for Additive Heat Exchangers at Unison Industries. He has been a product manager at Unison Industries since 2014. Alok received his B.S. in Aerospace Engineering from Virginia Tech and his MBA from the Johnson Graduate School of Management at Cornell.

THE FUTURE OF 3D PRINTING TECHNOLOGY IN THERMAL MANAGEMENT SYSTEMS

Speaker: Dr. Mohammed T. Ababneh, Advanced Cooling Technologies (ACT)

Abstract: Direct Metal Laser Sintering (DMLS), is a process by which metal structures are made in a layer-by-layer sintering process that selectively melts powdered metal directly from 3D CAD models. Parts built using DMLS have excellent mechanical properties equivalent to wrought materials, high detail resolution, and exceptional surface quality. The metal powder is most often melted entirely to create a fully dense homogenous structure. This talk will discuss the future of 3D printing technology in thermal management systems and related devices.

Dr. Ababneh is a defense/aerospace R&D engineer at Advanced Cooling Technologies (ACT). Dr. Ababneh specializes in heat transfer, thermodynamics and fluid mechanics, and has experience in aerospace, electronics cooling, He has served as the principal investigator (PI) or project engineer on several NASA, AFRL and Army programs. Dr. Ababneh received his Ph.D. in Mechanical Engineering from University of Cincinnati in 2012.



TECH-TALK SESSIONS (Continued)

TT-3: LIQUID COOLING IN DATA CENTERS (WED, MAY 31, 1:50 – 3:20 PM), TOUCAN

Chair: Milnes David, IBM Corporation

LIQUID COOLING IT EQUIPMENT IN TODAY'S DATA CENTERS

Speaker: Michael Ellsworth, IBM

Abstract: Liquid cooling IT equipment in today’s data centers is done very differently than how it has historically been done. Liquids other than water are being used as coolants. Servers are being completely immersed in dielectric liquid filled racks. Two-phase dielectric liquid cooling continues to be explored and is moving closer and closer to adoption. Hi Jing, Even tried and true water cooling is being implemented very differently than it was in the past; it is not “your father’s water cooling.” You’ll also find liquid (water) cooling is not being done for the same reasons as it was done previously. This presentation will overview liquid cooling technologies that are in practice

today. The general benefits and detractors of liquid cooling vs. traditional air cooling as well as the benefits and pitfalls of the various liquid cooling technologies will be discussed. Categorization of the various liquid cooling implementations at all levels within the data center environment: module, system, rack, data center white space, data center facility, and outside ambient; will be provided. Finally, the relatively new ASHRAE liquid cooling operational classes (W1-W5) will be reviewed.

Mr. Michael Ellsworth, a Senior Technical Staff Member with IBM in Poughkeepsie, NY, where he is currently the Technical Manager of the Advanced Thermal Energy Efficiency Lab. While at IBM he has explored improved thermal management for applications ranging from laptops to high-end servers and has investigated thermal technologies encompassing air, water, and refrigeration. He is a member of ASHRAE and IEEE, and is a Fellow of ASME where he served on the Electronics and Photonics Packaging Division Executive Committee and has chaired the K-16 Committee on Heat Transfer in Electronic Equipment. He has authored or co-authored more than 40 technical papers and is a co-inventor on over 200 US patents.

LIQUID COOLING LOOPS - DESIGN CONSIDERATIONS

Speaker: Michael K. Patterson, Intel Corporation

Abstract: Liquid cooling loop design considerations will be reviewed. This will cover designs practices, water temperatures and its impact, material of construction, water quality, controls, velocity, reliability, loop size and scale implications. The design considerations for example for a gaming box are not at all the same as for an exascale HPC machine.

Dr. Michael K. Patterson is a Senior Principal Engineer in the Technical Computing Group - Systems Architecture & Pathfinding at the Intel Corporation, in Hillsboro, Oregon, where he works in the

power, thermal, and energy-efficient-performance areas of High Performance Computing. The work covers silicon level activity, through platform and rack-level solutions, and on up to interface with Data Center power and cooling technologies. He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont. His current technical interests include super-computer architecture, server power and thermal management technologies, and high density data center concepts. He has been with Intel for 23 years. He is a registered Professional Engineer. He is a Fellow of the ASME. He is a member of ASHRAE, and served as the Research Chair for ASHRAE TC9.9, Mission Critical Facilities. He also represents Intel in a number of Green Grid Activities, most notably as the first chair of the Data Center Technology and Strategy Working Group. Dr. Patterson has been certified by the US DOE as a DCEP. He is also on the leadership team of the EE HPC WG, currently serving as the Workshop and Conferences Co-Chair.






TT-5: TRANSIENT THERMAL MANAGEMENT (THURS, JUNE 1, 8:00 – 9:30 AM), OSPREY

Chair: Patrick Shamberger, Texas A&M University

FLASH BOILING AND TRANSIENT THERMAL SUBSYSTEMS

Speaker: Kaz Yazawa, Purdue University

Abstract: This talk highlights a transient method for the rapid adsorption of thermal energy by flash boiling, which is induced by the rapid depressurization of the working fluid. The aim of this flash boiling research is illustrated by the thermal management architecture in corresponding to the growing requirements of cooling of electronic systems and the highly transient load profiles.

Dr. Kazuaki Yazawa (Ph.D. Mech. Eng., Toyama Pref., 2006) joined Purdue University at Birck Nanotechnology Center in 2012 after nearly 30 years’ experience of industrial R&D at Sony Corporation (Tokyo, Japan). He has been involved more than two decades in thermal management for VAIO laptops and PlayStation3, during the early era of hierarchical time-response in thermal management. In 2014, he became the deputy director of the Center for Integrated Thermal Management of Aerospace Vehicles, involving five universities, the AFRL, and five leading industry members.

DESIGN OF THERMAL ENERGY STORAGE MATERIALS AND COMPOSITES

Speaker: Patrick Shamberger, Texas A&M University

Abstract: Transient thermal management applications require materials specifically tailored to absorb large pulses of transient heat. Here, we discuss the development of design criteria to guide materials development, as well as application of those criteria to multiple low melting point alloy and composite material systems.

Dr. Patrick Shamberger (Ph.D. Mat Sci Eng., Univ. Washington, 2010) has a background in functional inorganic materials, including interests in phase transformations, crystal

structure/property relationships, and thermodynamics. Currently, he is an assistant professor with the Department of Materials Science and Engineering at Texas A&M University. Prior to this, he served as a materials research engineer for the Air Force Research Lab in the Nanoelectronic Materials Branch (AFRL/RXAN) and Thermal Sciences and Materials Branch (AFRL/RXBT).

TRANSIENT THERMAL MANAGEMENT AT THE DEVICE SCALE

Speaker: Michael Barako, NG Next, Northrup Grumman Corporation

Abstract: Chip-level transient thermal management requires materials capable of absorbing extreme thermal power densities over timescales as large as seconds. Such "thermal capacitors" can be rationally designed using phase change material composites integrated directly into copper heat spreaders and located in close proximity to the active region of a heat generating device.

Dr. Michael Barako (Ph.D. Mech. Eng., Stanford, 2016) specializes in thermal transport phenomena in nano-architectured materials and composites. He is currently a research scientist in the NG Next Basic Research Laboratory at Northrop Grumman Aerospace Systems and leads a portfolio in extreme thermal transport. His work leverages rational design principles to create exotic multifunctional materials that exhibit emergent property combinations, including thermal interface materials, porous media for multiphase heat transfer, and high power density thermal storage.




TT-7: AEROSPACE THERMAL MANAGEMENT (THURS, JUNE 1, 1:50 – 3:20 PM), TOUCAN

Chair: Ross Wilcoxon, Rockwell Collins

CHALLENGES AND OPPORTUNITIES WITH THERMAL MANAGEMENT OF MILITARY RF SYSTEMS

Speaker: Jim Wilson, Raytheon

Abstract: Thermal design and management of RF systems encompasses high heat flux and dense packaging that requires advanced materials and analysis techniques. This is especially true for avionics systems that are weight constrained. This presentation will highlight some of the advances and current needs related to electronics cooling for RF systems. Current deficiencies and challenges with integrating local thermal management techniques into system level cooling architectures will also be highlighted. Relevant thermal facts and fairy tales from Jim’s previous

columns in Electronics Cooling magazine will also be covered.

Jim Wilson is a Senior Engineering Fellow in the Hardware Engineering Center of Raytheon Space and Airborne Systems in Dallas Texas. He has over 30 years of electronics cooling experience and has spent the majority of his career focused on thermal management of RF systems. Jim has 12 US patents and over 25 publications related to electronics cooling and was a technical editor for Electronics Cooling magazine.

ADVANCES IN ELECTRICALLY DRIVEN THERMAL MANAGEMENT

Speaker: Jeffrey R. Didion, NASA Goddard Space Flight Center

Abstract: Electrically Driven Thermal Management is a vibrant technology development initiative incorporating ISS based technology demonstrations. This presentation reviews i.) preliminary results from the Electrohydrodynamic (EHD) Long Term Flight Demonstration launched on STP-H5 payload in February 2017, ii.) advances in liquid phase flow distribution control, and iii.) development of the Electrically Driven Liquid Film Boiling Experiment under the NASA Microgravity Fluid Physics Program.

Jeff Didion is Thermal Researcher at NASA Goddard Space center and a technology leader in the field of electrohydrodynamic (EHD)-based thermal control. Jeff holds degrees in both Chemical and Mechanical Engineering from University of Notre Dame and The Catholic University of America.

OVERCOMING THERMAL MANAGEMENT CHALLENGES: NAVAIR NEEDS AND OPPORTUNITIES

Speaker: Venkatesan Manivannan, Naval Air Systems Command

Abstract: Thermal management is a major technical challenge that is pervasive across the full gamut of electrical power systems for power generation, power distribution and energy storage for both manned and unmanned aircraft systems. The operating temperature limits of the current silicon based devices are a concern, and preventing thermal runaway conditions directly related to the safety of the batteries is a major drawback. Wide-band gap electronic materials have the potential to overcome such thermal challenges. The talk will highlight the impact of such solutions

solving the thermal management challenges.

Dr. Manivannan is currently the science and technology program manager for electrical power systems within the Power and Energy Division at the Naval Air Systems Command. Dr. Mani transitioned to the government after a successful career at GE and academia. His work has contributed to more than 100 invention disclosures resulting in more than 40 US, European and World patents along with numerous publications and presentations.




TT-9: 3D THERMAL MANAGEMENT (FRI, JUNE 2, 8:00 – 9:30 AM), OSPREY

Chair: Timothy Chainer, IBM Research

THERMAL TECHNOLOGIES FOR 3D CHIP STACKS

Speaker: Avi Bar-Cohen, Raytheon Space and Airborne Systems

Abstract: Compact, 3D integration of computational and RF components provides significant advantages in SWaP and performance but at the expense of rapidly escalating heat density and loss of cooling access to individual chips and on-chip “hot spots.” Recent developments in embedded cooling, including the application of diamond substrates, on-chip thermoelectrics, and near-junction microfluidic cooling to cooling of MMICs and high performance logic chips, are presented and discussed. Future challenges & embedded cooling research needs will be described.

Dr. Avram Bar-Cohen is an Honorary Member of ASME and Life Fellow of IEEE, currently serving as a Principal Engineering Fellow at Raytheon Corporation. He is a former Editor-in-Chief of the IEEE CPMT Transactions, a CPMT Distinguished Lecturer, and a member of the Board of Governors of the CPMT Society. He completed his service as a Program Manager at DARPA and had earlier served as Department Chair at the University of Maryland.

CO-DESIGN MODELING FOR 3D CHIP STACKS

Speaker: Pritish Parida, IBM

Abstract: 3D chip stacking technology has the potential to enable increased system performance/value through close integration of heterogeneous systems. Enabling 3D with embedded cooling requires a close co-design to address the interdependencies of design constraints ranging from fabrication and technology to system micro-architecture. This talk will describe the combination of thermal, mechanical, electrical, and computational performance with embedded cooling. The evaluation incorporates a model-based co-design framework for understanding the trade-offs between the various parameters.

Dr. Pritish Parida is a Research Staff Member in the Subsystem Cooling and Integration group at the IBM Research. He addresses the thermal challenges in servers to achieve highly energy efficient thermal designs. He obtained his Ph.D. in Mech. Eng. from Virginia Tech in 2010. Dr. Parida has over 50 publications and holds over 20 patents.

DIE-LEVEL EMBEDDED COOLING & THERMAL ISOLATION IN 3D ICS & ELECTRICAL BENCHMARKING

Speaker: Muhannad Bakir, Georgia Institute of Technology

Abstract: In this talk, we present a die-level embedded microfluidic cooling approach with integrated TSVs and report the electrical parasitics of such TSVs up to 50GHz. Moreover, we discuss the concept of thermal-isolation using air-gaps in 3D ICs. The thermal challenges and electrical trade-offs in 2.5D ICs are also presented. Lastly, we report Deep Neural Network (DNN) benchmarks to highlight the impact of thermal limits on performance using active die.

Dr. Muhannad Bakir is a Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, and 2011 IEEE CPMT Society Outstanding Young Engineer Award. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer for a four-year term. Dr. Bakir is an Editor of IEEE Transactions on Electron Devices, and an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.






TT-11: GAN DEVICE COOLING (FRI, JUNE 2, 1:50 – 3:20 PM), TOUCAN

Chair: Dave Altman, Raytheon, Peter deBock, GE Global Research

THERMAL ENGINEERING CHALLENGES IN GAN ELECTRONICS

Speaker: Samuel Graham, Georgia Institute of Technology

Abstract: Wide bandgap electronics made from Gallium Nitride (GaN) can operate at high power densities which makes thermal management and device reliability a challenge. In this talk we will highlight new efforts to improve the thermal dissipation from GaN devices through the use of high thermal conductivity substrates as well as interface engineering. We will discuss new metrology techniques to measure vertical temperature gradients through devices (Raman Thermography), transient temperature rises with sub-micron resolution (Transient Thermo-Reflectance), and transient deformation in GaN HEMTs (Scanning Joule Expansion Microscopy).

Dr. Samuel Graham is the Neely Professor and Associate Chair for Research in the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. He leads the Electronics Manufacturing and Reliability Laboratory. He is a Fellow of ASME, a member of the Defense Science Study Group, Air Force Scientific Advisory Board, and the Engineering Sciences Research Foundation Advisory Board of Sandia National Laboratories.

ADVANCED THERMAL SOLUTIONS FOR GAN RF ELECTRONICS

Speaker: David Altman, Raytheon

Abstract: Gallium Nitride (GaN) Radio Frequency (RF) device technology is now well established. However, thermal limitations still prevent utilization of GaN’s full electromagnetic potential. This talk will discuss advancements in device-level and near-device packaging technologies. Particular attention will be paid to methods to integrate CVD diamond in close proximity to HEMT heat sources, and the application of microfluidic cooling in close proximity to the active region of the device. Lastly, we will illustrate the potential of these technologies in terms of their potential to increase GaN HEMT and MMIC performance and reliability.

David H. Altman is an Engineering Fellow at Raytheon Integrated Defense Systems. He holds BS and MS degrees from Rensselaer Polytechnic Institute and Boston University. David has authored over 20 peer reviewed technical publications and holds 10 US patents in fields of electronics cooling and thermal management.

NEAR-JUNCTION THERMAL MANAGEMENT TECHNIQUES

Speaker: Carl Creamer, BAE Systems

Abstract: Gallium Nitride is capable of reliable operation at areal power densities above the 3-4 Watts/mm

2 range. Advanced, near-junction thermal management techniques engineered to control

the higher associated heat flux are necessary. One approach is to incorporate high thermal conductivity diamond as the microstrip dielectric substrate combined with embedded single phase liquid cooling. This talk will focus on GaN on diamond devices including RF performance, infrared and Raman based thermal characterizations and embedded microchannel cooling.

Carl Creamer is a Technology Development Manager at BAE Systems in Nashua, NH. responsible for exploiting GaN and GaAs compound semiconductors. Carl has over thirty-five years combined professional experience in technical leadership of CRAD developments, program management of large space programs, and hands-on design of electronic systems for military, space and commercial applications.



PANEL SESSIONS

P-2: HEALTHCARE THERMAL MGMT. (WED, MAY 31, 11:00 AM – 12:30 PM), OSPREY

Moderators: Anandaroop Bhattacharya, IIT Kharagpur & Peter de Bock, GE

THERMAL MANAGEMENT OF HEALTHCARE DEVICES AND SYSTEMS

Abstract: Thermal Management is of critical importance in the design of healthcare equipment. Large scale systems like CT or MRI scanners, ultrasound probes, infant care systems (incubators and baby warmers), etc. present a plethora of cooling challenges that call for innovative thermal solutions. From passive cooling in ultrasound probes to liquid nitrogen in MR coils, the expanse in vast. If we add diagnostics, bio-reactors and other such microfluidic applications, it expands the scope even further. The objective of the panel discussion is to have experts from industry and academia discuss and apprise audience of the thermal (and mechanical) challenges in design and manufacturing of Healthcare devices and systems, and share some of the technology solutions that have been explored in the recent past to mitigate these challenges. Panelists: Prof. Satish Kandlikar (Rochester Institute of Tech.)

Dr. Adam Pautsch (GE Healthcare) Dr. Partha Gomadam (Medtronic) Dr. Marc Horner (ANSYS)

P-4: MICRO 2-PHASE LIQUID COOLING (WED, MAY 31, 3:50 – 5:20 PM), OSPREY

Moderator: John Thome, EPFL

MICRO-TWO-PHASE LIQUID COOLING SYSTEMS FOR ELECTRONICS

Abstract: Two-phase cooling is gaining traction in the cooling of electronics (IGBT's, CPU's, LED's, optical lasers, etc.). The panel will address special issues, questions and concerns regarding adoption of two-phase cooling systems. The panel will also cover some case studies on existing and pending applications and an overview of methods and simulators for designing of two-phase cold plates and their cooling systems (gravity-driven and pump-driven systems). The panel will furthermore address the pros/cons when choosing the best working fluid for applications. Panelists: Dr. Soheil Farshchian (Google, Inc.)

Dr. Mark Schultz (IBM Corporation/Watson) Dr. Jackson Marcinichen (EPFL)

Dr. Todd Salamon (Nokia/Bell Labs) Dr. Devdatta Kulkarni (Intel Corporation) Dr. Hitoshi Sakamoto (Huawei Co./Japan)



PANEL SESSIONS (Continued)

P-6: DATA CENTER THERMAL MGMT. (THURS, JUNE 1, 11:00 AM – 12:30 PM), OSPREY

Moderator: Yogendra Joshi, Georgia Institute of Technology

EMERGING TRENDS IN DATA CENTERS

Abstract: This panel will focus on emerging data center growth in the areas of high performance computing, and Internet-of-Things. State-of-the-art thermal management technologies in these areas will be explored, and future challenges identified. Topics to be discussed include recent developments in liquid cooling including pumped and non-pumped two-phase cooling systems, warm water cooling, oil Immersion cooling, and dynamically adaptive cold plates. Air cooling advances in modular data centers, and contamination and corrosion damage in data centers utilizing free air cooling will be explored. Performance metrics for data centers are crucial to guide future growth directions. Their role will be discussed. Panelists: Dr. Michael Patterson (Intel Corporation)

Mr. Mark Seymour (Future Facilities) Dr. Dustin Demetriou (IBM Corporation)

Dr. Yogendra Joshi (Georgia Tech) Prof. Al Ortega (Villanova University) Prof. Dereje Agonafer (Univ of Texas, Arlington)

P-8: MOBILE DEVICES THER/MECH CHALLENGES (THURS, JUNE 1, 3:50–5:20 PM), OSPREY

Moderator: Victor Chiriac, Qualcomm Technologies, Inc.

MOBILE DEVICE THERMAL / MECHANICAL CHALLENGES

Abstract: In the last 5-10 years, there has been a significant growth in computing platforms ranging from handhelds to servers. This growth led to increased concerns for thermal management of packaging and devices ranging from low to high form factors (mobile internet devices, smartphones, tablets, laptop computers, thin rack servers & blade servers and data centers). The majority of research today is CPU-centric whereas in the mobile/portable space, the device skin as well as the other components, which do not have dedicated thermal solutions, are equally challenging to cool. A panel of experts will discuss these aspects and will share their vision on the future of electronics thermal management and other advanced packaging solutions. Panelists: Prof. John Thome (EPFL Switzerland)

Dr. Rick Beyerle (Graftech Inc.) Prof. Sam Graham (Georgia Institute of Technology) Dr. Jaime Sanchez (Intel Corp.)



PANEL SESSIONS (Continued)

P-10: IOT THERMAL MANAGEMENT (FRI, JUNE 2, 11:00 AM – 12:30 PM), OSPREY

Moderators: Angel Qian (Huawei Technologies Co.) & Baris Dogruoz (Cisco Systems, Inc.)

DESIGN CHALLENGES IN INTERNET OF THINGS (IOT)

Abstract: The Internet of Things (IoT) is a system of interrelated computing devices, mechanical and digital machines, objects, people that are provided with unique identifiers and the ability to transfer data over a network. It has more direct contact with the end users. The panel will address special issues, questions and concerns regarding thermal design challenges, safety issues and ergonomic aspect of IoT. The panel will cover some case studies on current cellular phone designs and most updated safety analysis of smartphone industry. The panel will also show the method to predict the Multiphysics computational challenges in IoT modelling and show several applications/examples. The industry trend of new product forms of IoT and related challenge will also be discussed. Panelists: Dr. Angel Qian Han (Huawei Co.)

Dr. Mehdi Saeidi (Qualcomm Inc.) Dr. Baris Dogruoz (Cisco Systems, Inc.)

Dr. Troy Hayes (Exponent) Dr. Metin Ozen (Ozen Engineering)

P-11: NOVEL MATERIALS AND FABRICATION (FRI, JUNE 2, 1:50 – 3:20 PM), OSPREY

Moderator: Ali Khounsary, Illinois Institute of Technology

NOVEL MATERIALS AND FABRICATION METHODS ENABLING ADVANCED THERMAL MANAGEMENT

Abstract: Thermal management has been, and in all likelihood shall remain, one of the limiting factors and perhaps the main mechanical engineering challenge in the development of many advanced electronic systems. While the early and largely successful attempts at tackling some of the thermal management challenges focused on the heat transfer aspect, the critical and often decisive role of materials in the development of these systems is increasingly evident. The invited experts at this panel session will apprise the attendees of the significant role of materials and fabrication in thermal management, will examine some of the critical needs in this area, will provide an overview some of the recent progress and innovations, and discuss promises and challenges in development, characterization, and implementation of the new materials. Panelists: Dr. Lynn Davis (RTI International)

Dr. Craig Green (Carbice Corporation) Dr. Amy Marconnet (Purdue Univ.) Dr. Sandra Reisinger (Schunk Hoffmann Carbon Tech.)



PAPER REVIEWERS Aaron Wemhoff Doug Crane Jiantao Zheng Mike Manno Seyed Ali Moeini Aashutosh Mistry Douglas DeVoto Jie Gong Milnes David Shailesh Joshi Ajay Vadakkepatt Edvin Cetegen Jihoon Jeong Min Pei Shawn Canfield Ajit Vallabhaneni Elham Maghsoudi Jin Yang Ming Ke Shrikant Swaminathan Al Piggott Emil Rahim Joe Boswell M. Sadeghi Shyam Aravamudhan Alan Lyons Emily Cousineau John Fernandes Mohammed Ababneh Sihai Chen Ali Akbar Merrikh Enes Tamdogan Jose L. G. Hernandez Mohsen Ayoobi Solomon Adera Ali Kosar Eric Monier-Vinard Joseph Yourey Mustafa Koz Sreekant Narumanchi Allison Mahvi Evan Fleming Joshua Gess Nader Nikfar Srilakshmi Lingamneni Amir Shooshtari Farah Singer Joshua Major Nagesh Basavanhally Stephanie Allard Amy Fleischer Fehmi Najar Jun Oh Naveenan Thiagarajan Steven Dunford Amy Marconnet Feng He Jungho Kim Nazmiye Acikgoz Subhasis Mukherjee A. Bhattacharya Filippo Cataldo Jungwan Cho Nenad Miljkovic Sukesh Shenoy Andrew McNamara Francis Mutuku Jungwon Ahn Nicholas Haehn Sukwon Choi Ankit Kalani Francisco Blancas Justin Weibel Nicholas Neal Suraush Khambati Ankit Verma Frank Robinson Karumbu Meyyappan Omar Abdelaziz Sushil Bhavnani Ankur Jain Ganesh Subbarayan Kaushik Mysore Pablo Hidalgo Sushumna Iruvanti Anurag Goyal Gary Mandrusiak Kazuaki Yazawa Patrick Geoghegan Takashi Kodama Arash Naghib Lahouti Genevieve Martin Ke Chen Patrick Hopkins Tanya Liu Arkaparabha Sengupta Georges Pavlidis Kelly Lofgreen Paul Chiarot Tao Song Ashish Sinha Gilberto Moreno Kenneth C Marston Paul Karayacoubian Taravat Khadivi Autumn Pratt Gokul Shankaran Kerim Yapici Peng Want Thomas Bougher Avishek Guha Gopi Krishnan Kevin Bennion Pericles Kondos Todd Salamon Awni Qasaimeh Gregory Hohensee Kevin Drummond Peter Borgesen Tom Krupenkin Banafsheh Barabadi Guoping Xu Kimia Montazeri Peter De Bock Tuhin Sinha Baris Dogruoz Hadi Ghasemi K. Ramachandran Phil Tuma Vadim Gektin Berkin Uluutku Hai Wang Krishna Kota Philipp Hempel Vibhash Jha Betty Yeung Hannes Greve Krishna Tunga Poh-Seng Lee Vijay Subramanian B. Muralidharan Hanry Yang Kritika Upreti Pranav Dubey Vinod Srinivasan Bidzina Kekelia Hao Ma Kuan-Lin Lee Prasanna Raghavan Vivek Sahu Bladimir Alvarado Harish Ganapathy Kuan-Wei Chen Prashant Gupta Wei Chen Bo Qiu Hassan Azarkish Kyle Yazzie Pritish Parida Weidong Xie Bohan Yan Henry Coles Kyosung Choo Priyanka Tunuguntla Weihua Tang Brian Rush Hongfei Yan Lauren Boteler Quang Pham William Gerstler Bugra Kanargi Hongqing Zhang Leila Choobineh Rahul Gupta Woosung Park Carlos U. Gonzalez Valle Hongwen Zhang Liang Pan Rahul Kumar Xi Liu Carolyn Sheline Howard Pearlman Liang Yin Rajesh K. Neerukatti Xianghai Meng Chandan Roy Hua Bao Louis Michel Collin Ramez Cheaito Xiaojin Wei Chandradip Patel Husam Alissa Lucas Crowthers Raphael Mandel Xiulin Ruan Charles Reynolds Huseyin Bostanci Luis Rosales Ratnesh Tiwari Xuefei Hang Chi Zhang Hyoungsoon Lee Mahmoud Ibrahim Ravi Annapragada Xuhui Feng Chiara Falsetti Ilai Sher Man Prakash Gupta Reza Baghaei Lakeh Xun Mu Claire Kunkle Ilko Schmadlak Manoj Mahajan Reza Khiabani Yangying Zhu Cong Zhao Isaac Perez-Raya Marc Hodes Rick Beyerle Yingying Wang Craig Green Jackson Marcinichen Marcelo Delvalle Ridvan Sahan Yoonjin Won Damena Agonafer Jaeseon Lee Mark Hoffmeyer Rishi Raj Youmin Yu Daniel Juarez-Robles James Palko Mark North Robert Schoon Yuanchen Hu Daniel Preston James Petroski Martinus Arie Ronald Warzoha Yuvraj Singh Darin Sharar Jay Prakash Gupta Max Cioban Ryan Fleming Zhengmao Lu David Deisenroth Jayati Athavale Melika Roshandel Salih Erden Zhimin Wan David Shaddock Jeffrey Zitz Melika Roshandell Sami Alkharabsheh Zhiting Tian Debabrata Pal Jennifer Blackburn Michael Barako Sandeep Shantaram Dereje Agonafer Jeremy Rice Michael Demko Sangbeom Cho Dhruv Singh Jeroen Zaal Michael J. Ellsworth Jr Satish Kandlikar Dinesh Thanu Je-Young Chang M. Van Soestbergen Satish Kumar





39

DAY 1 SESSIONS: WEDNESDAY, MAY 31, 7:00 - 10:55 AM

7:00 AM Speakers Breakfast, Swan E-1: Emerging Materials and

Thermal Phenomenon I Macaw

TI-1: Single/Multi Chip Module & System in Package Mockingbird 1

Session Chairs: Sukwon Choi (Pennsylvania State University), Patrick Hopkins (University of Virginia), Elham Maghsoudi (NASA JPL)

Session Chairs: Vivek Sahu (Qualcomm Technologies, Inc.), Vibhash Jha (NXP Semiconductors), James Palko (Stanford University)

8:00 AM

Heat Transfer Performance of Water Based Nanofluids Containing Various Types of Metal Oxide Nanoparticles in an Air-Cooled Microchannel Heat Exchanger (p110) Murat Parlak (Aselsan Inc.); Ozge Osturk (Gebze Technical University), Umit Nazli Temel (Cumhuriyet University), Kerim Yapici (Suleyman Demirel University)

Investigation on Boundary Conditions Scenarios for Optimizing the Creation of DELPHI-Style Surrogate Thermal Models (p119) Eric Monier-Vinard, Valentin Bissuel, Bric Rogie, Olivier Daniel (Thales Corporate Engineering); Bric Rogie, Najib Laraqi (University of Paris Ouest)

8:15 AM

Evaluation of Breathable Enclosures for Thermal Management of Outdoor Electronics (p251) Zach Owens, Lindsey Gilman, Reeve Dunne, John McNulty, Abid Kemal (Exponent, Inc.)

Multi-Core Server Processors Thermal Analysis (p133) Guoping Xu (Qualcomm Technologies, Inc.)

8:30 AM

Towards Using Nanoelectrospray for Evaporative Heat Transfer Enhancement (p278) Joel Chapman, Peter Kottke, Andrei Fedorov (Georgia Institute of Technology)

QFN Reliability, Thermal Shock, Lead-free vs. SnPb, Microstructure (p270) Martin K Anselm (Rochester Institute of Technology); Reza Ghaffarian (Jet Propulsion Laboratory)

8:45 AM

Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay (p327) D. Kendig (Microsanj), G. Hohensee, W. Kuang (Western Digital), E. Pek (U of I at Urbana Champaign), K. Yazawa, A. Shakouri (Purdue University)

Comparison Between Thermal Simulations and Experimental Measurements on an Advanced Microelectronics Test-system (p338) Dimitrios Papaioannou, Andy Heinig (Fraunhofer Institute for Integrated Circuits)

9:00 AM

Experimental Considerations of CVD Diamond Film Measurements using Time Domain Thermoreflectance (p387) T. Bougher, L. Yates, Z. Cheng, B. Cola, S. Graham (Georgia Institute of Technology); R. Chaeito, A. Sood, M. Ashegi, K. Goodson (Stanford University)

A Novel Approach to Extract Effective Thermal Properties of Substrate in IC Packages (p393) Youmin Yu, Nader Nikfar (Qualcomm Technologies Inc.)

9:15 AM

Thorny Durian-inspired Enhanced Microscale Heat Transfer in Macro Geometry (p485) Aik Ling Goh, Kim Tiow Ooi (Nanyang Technological University)

9:35 AM

K-1 Keynote: Future Directions for STEM Education and Research G. P. "Bud" Peterson (Georgia Institute of Technology), Osprey

10:40 AM Refreshment Break, Swan Foyer

40

DAY 1 SESSIONS: WEDNESDAY, MAY 31, 7:00 - 10:55 AM

Speakers Breakfast, Swan TII-1: Automotive / RF Electronics / Power Electronics I Mockingbird 2

M-1: Mechanics in Assembly & Packaging Toucan

TT-1: Additive Manufacturing Heat Transfer Osprey

Session Chairs: Taravat Khadivi (Qualcomm Technologies, Inc.), Ankur Jain (University of Texas Arlington)

Session Chairs: Tuhin Sinha (IBM Corporation), Meriem Akin (IMPT)

Session Chairs: Bill Gerstler (GE Global Research)

Auxiliary Embedded Coolant Channels for Peltier Based Liquid Cooling Solution for High Power Components (p150) Yael David Shiloah, Omer Raz, Michael Laufer, Vladimir Menaker, Muhammad Ahmad (Intel Corp)

Failure Mechanisms of Boards in a Thin Wafer Level Chip Scale Package (p210) Pavan Rajmane, Hassaan Khan, Aniruddha Doiphode, Unique Rahangdale, Dereje Agonafer, Alok Lohia (University of Texas Arlington); Steven Kummerl, Luu Nguyen (Texas Instruments, Inc.)

Strategic Vision for Additive Manufacturing Applied to Thermal Applications Omar Abdelaziz Oak Ridge National Laboratory (ORNL)

Effect of Interior Geometry on Local Climate Inside an Electronic Device Enclosure (p340) Salil Joshy, Morten Jellesen, Rajan Ambat (Technical University of Denmark)

Comparison of the Effect of Elastic and Viscoelastic Modeling of PCBs on the Assessment of Board Level Reliability (p221) A. Misrak, A. Anaskure, A R Nazmus Sakib, A. Lohia, D. Agonafer (University of Texas Arlington)

Performance Study of Motorcycle Driving-Beam LED Headlight with Different Heat Sink Models and LED Pitch (p354) Ram Sundar R, NSV Sarveswara Sarma, (WiproTechnolgies)

Mechanical Characterization of RCC and FR4 Laminated PCBs and Assessment of their Board Level Reliability (p225) U. Rahangdale, AR Nazmus Sakib, M. Chaudhari, A. Misrak, C. Dave, D. Agonafer (UT Arlington); A. Lohia, S. Kummerl, L. Nguyen (Texas Instruments)

Additive Manufacturing Heat Exchangers Alok Patel (Unison Industries)

Radiation Heat Transfer Analysis of Spectrometer's Dewar Cooling Assembly (p376) Mayuri Kushare, Anshal Jhaveri, Atul Bhargav (Indian Institute of Technology Gandhinagar)

Damage Progression Study of 3D TSV Package during Reflow, Thermal Shocks and Thermal Cycling (p272) U. Rahangdale, P. Rajmane, A. Doiphode, A R Nazmus Sakib, A. Misrak, A. Lohia, D. Agonafer (UT Arlington)

Liquid Cooled System for Aircraft Power Electronics Cooling (p473) Debabrata Pal, Mark Severson (UTC Aerospace Systems)

Fiber Optic Conjugate-Stress Sensors for Prognostic Health Monitoring of Structures (p311) Jonathan Kordell, Miao Yu, Abhijit Dasgupta (University of Maryland)

The Future of 3D Printing Technology in Thermal Management Systems Mohammed T. Ababneh (Advanced Cooling Technologies)

Assessment of Reliability of Missile Fuze using Micro-CT Data Based Finite Element Technique and Digital Volume Correlation (p439) P. Lall, N. Kothari (Auburn University); J. Deep (USAF AFRL); R. Lowe (ARA Associates)

K-1 Keynote: Future Directions for STEM Education and Research G. P. "Bud" Peterson (Georgia Institute of Technology), Osprey

Refreshment Break, Swan Foyer

41

DAY 1 SESSIONS: WEDNESDAY, MAY 31, 11:00 – 1:45 PM

E-2: Thermal Experimental Methods

Macaw

TI-2: Embedded Microfluidic Cooling Mockingbird 1

Session Chairs: Hyoungsoon Lee (Chung-Ang University), Leila Choobineh (SUNY Polytechnic Institute)

Session Chairs: S. Narumanchi (National Renewable Energy Laboratory), A. Jain (UT Arlington) T. Khadivi (Qualcomm Technologies Inc.)

11:00 AM

Air Side Enhancement of Heat Transfer in an Additively Manufactured 1 kW Heat Exchanger for Dry Cooling Applications (p148) Martinus Adrian Arie, Amir Shooshtari, Michael Ohadi (University of Maryland)

Invited Paper Presentation Thermal Model for Embedded Two-Phase Liquid Cooled Microprocessor (p250) Pritish Parida, Arvind Srindhar, Augusto Vega, Mark Schultz, Ozgur Ozsun, Gerard McVicker, Gerard McVicker, Thomas Brunschwiler, Alper Buyuktosunoglu, Timothy Chainer (IBM); Michael Gaynes (Universal Instruments Corp)

11:15 AM

Implementations of CVD Diamond on GaN Device Layers: Optical Characterization of Wafer-scale Stress Uniformity (p197) Bobby Hancock, Mohammad Nazari, Jon Anderson, Edwin Piner, Mark Holtz (Texas State University)

11:30 AM

Curvature Induced Improvement in Mixing Performance (p328) J Lakshmi Balasubramaniam, Rerngchai Arayanarakool, Samuel Marshall, Bing Li, Heng Wang, Lee Poh-Seng, Peter CY Chen (National University of Singapore)

Microfluidic Two-Phase Cooling of a High Power Microprocessor - Part A: Design and Fabrication (p255) M. Schultz, P. Parida, O. Ozsun, Gerard McVicker, U. Drechsler, T. Chainer (IBM); M. Gaynes (Universal Instruments Corp)

11:45 AM

Thermal Conduction in Graphite Flake-Epoxy Composites using Infrared Microscopy (p419) R. Kantharaj, I. Srivastava, K. Thaker, A. Gaitonde, A. Bruce, J. Howarter, T. Fisher, A. Marconnet (Purdue University)

Microfluidic Two-Phase Cooling of a High Power Microprocessor - Part B: Test and Characterization (p257) M. Schultz, P. Parida, O. Ozsun, Gerard McVicker, U. Drechsler, T. Chainer (IBM); M. Gaynes (Universal Instruments Corp)

12:00 PM

Thermal Conductivity of Double-Wall Carbon Nanotube-Polyanaline Composites Measured by a Non-Contact Scanning Hot Probe Technique (p456) A. Wilson, T. Borca-Tasciuc (RPI); H. Wang, C. Yu (Texas A&M University)

Embedded Two-Phase Cooling of High Heat Flux Electronics on Silicon Carbide (SiC) using Thin Film Evaporation and Enhanced Delivery System (FEEDS) Manifold-Microchannel Cooler (p280) D. Bae, R. Mandel, S. Dessiatoun, M. Ohadi (University of Maryland); S. Rajgopal, S. Roberts, M. Mehregany (Case Western Reserve University)

12:15 PM

Physical and Thermal Characterization of CVD Diamond: A Bottoms-up Review (p457) Firooz Faili, Seajin Oh, Nicola Palmer, Seajin Oh, Daniel Twitchen (Element Six Technologies)

Thermal Performance of a Silicon-Interposer with Embedded Fluid Channels Enabling Dual-Side Heat Removal (p385) O. Ozsun, S. Paredes, G. Schlottig, U. Drechsler, R. Heller, T. Brunschwiler (IBM)

12:35 PM Luncheon & ITHERM Achievement Award Presentation Alfonso Ortega (Villanova University), Swan

42


TII-2: Data Center & Energy Efficiency - I Mockingbird 2

M-2: Modeling & Finite Element Technique Toucan

P-2: Healthcare Thermal Management Osprey

Session Chairs: Emil Rahim (GoPro), Sami Alkharabsheh (Binghamton University)

Session Chairs: Prasanna Raghavan (Intel Corporation), Sukwon Choi (Pennsylvania State University)

Moderators: Anandaroop Bhattacharya (IIT) Kharagpur & Peter de Bock (GE)

An Advanced Energy Efficient Rack Server Design (p233) Wei Pang, Chun Wang (Baidu); Nishi Ahuja, Jun Zhang, Alex Zhou, Peifeng Si, Youquan Song, Xiang Zhou (Intel Corp)

Invited Paper Presentation Modeling of Residual Strain on BGA-PCB Assemblies for Pad Cratering Control (p344) Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee (Hong Kong University of Science and Technology)

Thermal Management of Healthcare Devices and Systems Abstract: Thermal Management is of critical importance in the design of healthcare equipment. Large scale systems like CT or MRI scanners, ultrasound probes, infant care systems (incubators and baby warmers), etc. present a plethora of cooling challenges that call for innovative thermal solutions. From passive cooling in ultrasound probes to liquid nitrogen in MR coils, the expanse in vast. If we add diagnostics, bio-reactors and other such microfluidic applications, it expands the scope even further. The objective of the panel discussion is to have experts from industry and academia discuss and apprise audience of the thermal (and mechanical) challenges in design and manufacturing of Healthcare devices and systems, and share some of the technology solutions that have been explored in the recent past to mitigate these challenges. Panelists: Satish Kandlikar (Rochester Institute of Technology) Adam Pautsch (GE Healthcare) Partha Gomadam (Medtronic) Marc Horner (ANSYS)

Pressure Drop Analysis in Direct Liquid Cooled (DLC) Rack (p237) Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia (Binghamton University)

Rack Level Forecasting Model of Data Center (p334) Yogesh Fulpagare, Atul Bhargav (Indian Institute of Technology Gandhinagar); Yogendra Joshi (Georgia Institute of Technology)

Numerical Simulation for Optimizing the Design of a Commonly-used Fluid Distributor to Enhance Uniform Distribution and Reduce Dead Zones (p330) H. Wang, S. D. Marshall, R. Arayanarakool, L. Balasubramaniam, B. Li, P. S. Lee, P. C. Yu Chen (National University of Singapore)

A Data Centre Air Flow Model for Predicting Computer Server Inlet Temperatures (p346) Raymond Lloyd, Jer Hayes (IBM); Marek Rebow, Brian Norton (Dublin Institute of Technology)

FE Analyses and Power Cycling Tests on the Thermo-Mechanical Performance of Silver Sintered Power Semiconductors with Different Interconnection Technologies (p337) R. Dudek, R. Döring, A. Otto, S. Rzepka (Fraunhofer ENAS); S. Stegmeier, S. Kiefl (Siemens AG); A. Lunding (Philips Medical Systems DMC GmbH); R. Eisele (FH Kiel)

Cooling Solution for Computing and Storage Server (p355) NSV Sarveswara Sarma.A, Vishnu Das Ambali (Wipro Technologies)

Color Shift Analysis and Modeling of High Power pc-LED under High Temperature and High Humidity Environment (p440) Pradeep Lall, Hao Zhang (Auburn University); Lynn Davis (RTI International)

Power Consumption Minimization in Hybrid Cooled Server by Fan Reduction (p416) Md Malekkul Islam (Electronic Cooling Solutions Inc.); Uschas Chowdhury, Dereje Agonafer (University of Texas Arlington); Neha Inamdar (Atlas Copco Drilling Solutions)

Package-level Multiphysics Simulation of Cu-Al WB Corrosion under High Temperature/humidity Environmental Conditions (p446) Pradeep Lall, Yihua Luo (Auburn University); Luu Nguyen (Texas Instruments, Inc.)

Luncheon & ITHERM Achievement Award Presentation, Alfonso Ortega (Villanova University), Swan

Thermal Energy Management in the Age of Connectivity: Cooling of Electronic Systems from Device to Data Center

43


E-3: Fundamentals of Convection in Channels & Jets Macaw

TI-3: Microgap Cooling & Evaporation/Condensation Mockingbird 1

Session Chairs: Amir Shooshtari (University of Maryland), Kyosung Choo (Youngstown State University), Edvin Cetegen (Intel Corporation)

Session Chairs: Vibhash Jha (NXP Semiconductors), Shailesh Malla (Zodiac Aerospace), Baris Dogruoz (Cisco Systems, Inc.)

1:50 PM

The Influence of Nozzle-to-Plate Spacing on the Circular Hydraulic Jump of Water Jet Impingement (p117) Abdullah Kuraan, Kyosung Choo (Youngstown State University)

Gravity Effects in Microgap Flow Boiling (p191) Franklin Robinson (NASA Goddard Space Flight Center); Avram Bar-Cohen (University of Maryland)

2:05 PM

A Semi-Empirical Model for Two-Phase Heat Transfer from Arrays of Confined Impinging Jets (p129) Carolina Mira-Hernandez, Matthew Clark, Justin Weibel, Suresh Garimella (Purdue University)

Microgap Cooling of Via-enhanced Glass Interposers (p391) Michael Fish, Patrick McCluskey, Avram Bar-Cohen (University of Maryland)

2:20 PM

Microchannel Cooling Strategies for High Heat Flux (kW/cm2) Power Electronic Applications (p205) 98 Ki Wook Jung, Chirag Kharangate, James Palko, Mehdi Asheghi, Kenneth Goodson (Stanford University); Hyoungsoon Lee (Chung-Ang University); Feng Zhou, Ercan Dede (Toyota Research Institute of North America)

Single Phase Liquid Cooling of Hotspots in a Heterogeneous Pin-Fin-enhanced Microgap with Non-uniform Fin Array (p212) Yuanchen Hu, Thomas Sarvey, Muhannad Bakir, Yogendra Joshi (Georgia Institute of Technology)

2:35 PM

Investigation of Mass Transport in a Spiral Microfluidic Network with an Expansion Chamber (p296) Rerngchai Arayanarakool, Lakshmi Balasubramaniam, Samuel David Marshall, Heng Wang, Bing Li, Poh Seng Lee, Peter CY Chen (National University of Singapore)

High Heat Flux Evaporation from Nanoporous Silicon Membranes (p219) Jay Sircar, Daniel Hanks, Zhengmao Lu, Kevin Bagnall, Dion Antao, Banafsheh Barabadi, Evelyn Wang (Massachusetts Institute of Technology); Todd Salamon (Bell Labs Alcatel-Lucent); Shankar Narayanan (3Rensselaer Polytechnic Institute)

2:50 PM

Droplet Train Impinging onto a Solid Substrate Surface (p319) Fei Duan, Swapnil Dubey, Fook Hoong Choo, Fei Duan (Nanyang Technological University)

Thin-Film Evaporation from Micropillar Wicks in Ambient Environment (p228) Solomon Adera, Dion Antao, Rishi Raj, Evelyn Wang (Massachusetts Institute of Technology); Rishi Raj (Indian Institute of Technology Patna

3:05 PM Forced Convection Heat Transfer Enhancement in Heat Sink Channels using Aeroelastically Fluttering Reeds (p388) Thomas Crittenden, Sourabh Jha, Ari Glezer (Georgia Institute of Technology)

3:25 PM Refreshment Break, Swan Foyer

44


TII-3: Novel Technologies & CFD Techniques for Data Center Cooling

Mockingbird 2

I-3: Technology Trends Osprey

TT-3: Liquid Cooling in Data Centers Toucan

Session Chairs: Ross Wilcoxon (Rockwell Collins), Damena Agonafer (Washington University in Saint Louis)

Session Chairs: Prasanna Raghavan (Intel Corporation), Sukwon Choi (Pennsylvania State University)

Session Chair: Milnes David, (IBM)

Enhancing Rack Servers Air Cooling Capability with Extra System Inlet Airflow Through Air Ducts between Racks (p141) David Zhou, Ming Zhang, Chris Du (Intel Corporation)

Invited Talk Integrated Photonic Networks for Data Centers — Overcoming the Chip-scale I/O Performance Barriers Michael Haney (ARPA-e) Abstract: The interconnection networks within data centers are approaching performance limits that will require new cost-effective integrated photonic approaches, and associated packaging concepts, for chip-scale I/O and switching circuits. This talk will present a vision for achieving transformative data-center networks under the recently announced ENLITENED Program from the Advanced Research Projects Agency-Energy (ARPA-E).

Liquid Cooling IT Equipment in Today’s Data Centers Michael Ellsworth (IBM)

CPU Cooling with A Thermosiphon Loop with Tapered Manifold (OMM) (p195) Travis Emery, Aranya Chauhan, Emilio DelPlato, Satish Kandlikar (Rochester Institute of Technology)

Experiments on the Simultaneous Two-Phase Liquid Cooling of Multiple Simulated Servers at differing Vertical Rack Positions in Steady State (p290) Felipe Valenzuela, Alfonso Ortega, Gerard Jones, Amy Fleischer (Villanova University); Steve Schon (QuantaCool Corp); Russ Tipton (Vertiv)

Quasi-Steady Modeling of Data Center Heat Exchanger under Dynamic Conditions (p291) Marcelo Del Valle, Carol Caceres, Alfonso Ortega (Villanova University); Bahgat Sammakia, Kourosh Nemati (Binghamton University)

Invited Talk The Journey toward Flexible Thermal Superconductors Sung Jin Kim (KAIST) Abstract: This talk is intended to provide a perspective and review of a journey toward a flexible thermal superconductor, which can be bent, to control heat transfer in heat generating devices of various shapes. The thermal superconductor exploits recent advances in micro pulsating heat pipes. It will have a thermal conductivity of 1000 W/mK, 1000 times higher than current flexible materials. Compared to conventional pulsating heat pipes, micro pulsating heat pipes with hydraulic diameters of less than 1 mm have interesting features like orientation independent performance. This talk will conclude with an overview of ongoing research activities.

Liquid Cooling Loops – Design Considerations Michael K. Patterson (Intel)

Parametric Research on Air-cooling Characteristics using Wind Turbine in a Raised-floor Data Center (p324) Zhihang Song, Wentao Chen (Northeastern University)

Parametric Investigation of a Raised-floor Data Center Cooling Using a Reversible Fan System (p325) Zhihang Song, Jiasheng Dong (Northeastern University)


45


E-4: Thermal Numerical Methods I Macaw

TI-4: Vapor Chambers & Passive Cooling Mockingbird 1

Session Chairs: Farah Singer (University of Maryland), Ajit Vallabhaneni (Georgia Institute of Technology)

Session Chairs: Todd Salamon (Nokia Bell Labs), William Gerstler (GE Global Research)

3:50 PM

Invited Paper Presentation Sub-Diffraction Thermoreflectance Thermal Imaging using Image Reconstruction Edit (p403) Amirkoushyar Ziabari, Yi Xuan (Purdue University); Je-Hyeong Bahk (University of Cincinnati); Maryam Parsa, Peide Ye, Ali Shakouri (Purdue University)

Vapor Chamber with Thermal Diode and Switch Functions (p153) Feng Zhou, Yanghe Liu, Shailesh Joshi, Ercan Dede (Toyota Research Institute of North America); Xuemei Chen, Justin Weibel (Purdue University)

4:05 PM

Microfabricated Thin Silicon Vapor Chamber for Low Profile Thermal Management (p223) Jiaxing Liang, Muhannad Bakir, Yogendra Joshi, Yogendra Joshi (Georgia Institute of Technology)

4:20 PM

Thermal Transport in High Electron Mobility Transistors: A Boltzmann Transport Equation Study (p269) Ajit Vallabhaneni, ManPrakash Gupta, Satish Kumar (Georgia Institute of Technology)

An Area-Scalable Two-Layer Evaporator Wick Concept for High-Heat-Flux Vapor Chambers (p464) Srivathsan Sudhakar, Justin Weibel, Suresh Garimella (Purdue University)

4:35 PM

Analysis of Anisotropic Graphene Platelet Heat Spreaders to Reduce Hot Spot Temperature and Temperature Non-Uniformity (p405) Sohail R. Reddy, George S. Dulikravich, Yoel Rotterman (Florida International University)

Cooling of Power Electronics by Integrating Sintered Cu Particle Wick onto a Direct-bond Copper Substrate (p418) Waylon Puckett, Samuel Graham, Kenechi Agbim (Georgia Institute of Technology)

4:50 PM

A First-Principles Study of Phonon Transport Properties of Monolayer MoSe2 (p480) Zhequan Yan (Georgia Tech); Mina Yoon (Oak Ridge National Laboratory); Satish Kumar (Georgia Institute of Technology)

Synthesis and Thermal Characterization of Sodium Borosilicate/Carbon Nanofiber Composites (p279) Katherine Copenhaver, Jason Nadler, Michael Beckert (Georgia Tech Research Institute)

5:05 PM

Heat Confinement of Phase-Change Memory using Graphene (p483) Liang Chen, Rong Xue, Shuangtao Chen, Yu Hou (Xian Jiaotong University

5:25 PM Women & Diversity Achievers Panel & Reception, Osprey Moderators: Cristina Amon (University of Toronto), Samuel Graham (Georgia Tech)

46


TII-4: Immersion Cooling Mockingbird 2

M-4: Thermal-Mechanical Interaction in Microelectronics Package & System I Toucan

P-4: Micro 2-Phase Liquid Cooling Osprey

Session Chairs: Taravat Khadivi (Qualcomm Technologies Inc.), Ankur Jain (University of Texas Arlington)

Session Chairs: Krishna Tunga (IBM Corporation), Rajesh Kumar Neerukatti (Intel)

Moderator: John Thome (EPFL)

Invited Paper Presentation Effect of Subcooling, Flow Rate and Surface Characteristics on Flow Boiling Performance of High Performance Liquid Cooled Immersion Server Model (p196) Sriram Chandrasekaran, Sushil Bhavnani (Auburn University); Joshua Gess (Oregon State University)

Invited Paper Presentation Effect of Simultaneous High Temperature and Vibration on MEMS based Vibratory Gyroscope (p438) Pradeep Lall, Amrit Singh Abrol, Jeff Suhling (Auburn University); Lee Simpson, Jessica Glover, David Locker (US Army AMRDEC)

Micro-Two-Phase Liquid Cooling

Systems for Electronics

Abstract: Two-phase cooling is gaining

traction in the cooling of electronics

(IGBT's, CPU's, LED's, optical lasers,

etc.). The panel will address special

issues, questions and concerns

regarding adoption of two-phase

cooling systems. The panel will also

cover some case studies on existing and

pending applications and an overview of

methods and simulators for designing of

two-phase cold plates and their cooling

systems (gravity-driven and pump-

driven systems). The panel will

furthermore address the pros/cons

when choosing the best working fluid

for applications.

Panelists:

Soheil Farshchian

(Google, Inc.)

Mark Schultz

(IBM Research)

Jackson Marcinichen

(EPFL)

Todd Salamon

(Nokia/Bell Labs)

Devdatta Kulkarni

(Intel)

Hitoshi Sakamoto

(Huawei/Japan)

Feasibility Study of Two-Phase Immersion Cooling in Closed Electronic Device (p273) Mizuki Wada, Arihiro Matsunaga, Masaki Chiba, Kunihiko Ishihara, Minoru Yoshikawa, Mahiro Hachiya (NEC Corporation)

A Study of Moisture and Thermally Induced Die Stresses in Plastic Ball Grid Array Packages (p407) Quang Nguyen, Jordan Roberts, Jeff Suhling, Richard Jaeger (Auburn University)

Effect of Micropillar with Free-End on Heat Transfer (p425) Hanieh Tabkhi, Arash Nayebzadeh, Yingying Wang, Yoav Peles (University of Central Florida)

Experimental Characterization of Underfill Materials Exposed to Different Moisture Conditions (p408) Promod Chowdhury, Jeff Suhling, Pradeep Lall (Auburn University)

High Temperature Tensile and Creep Behavior of Lead Free Solders (p452) Mohammad Alam, Jeff Suhling, Pradeep Lall (Auburn University)

Women & Diversity Achievers Panel & Reception, Osprey Moderators: Cristina Amon (University of Toronto), Samuel Graham (Georgia Tech)

47

DAY 2 SESSIONS: THURSDAY, JUNE 1, 7:00 – 10:55 AM

7:00 AM Speakers Breakfast, Swan E-5: Emerging Materials & Thermal

Phenomenon II Macaw

TI-5: Hotspot & Impingement Cooling Mockingbird 1

Session Chairs:

Yoonjin Won (UC-Irvine), Hyoungsoon Lee (Chung-Ang University), Jungwan Cho (Stanford University)

Session Chairs: Michael J Ellsworth Jr (IBM Corporation), Poh-Seng Lee (National University of Singapore)

8:00 AM

Parametric Study of Liquid-Vapor Interface within a Woven Metallic Wire Mesh Screen (p173) Karthik Remella, Frank Gerner (University of Cincinnati)

Hot Spot Aware Microchannel Cooling Add-on for Microelectronic Chips in Mobile Devices (p198) L. M. Collin (Universite de Sherbrooke); J. P. Colonna (CEA-LETI); P. Coudrain (STMicroelectronics); M. R. S. Shirazy (Universite de Sherbrooke); S. Cheramy (CEA-LETI); A. Souifi (INSA Lyon); L. G Frechette (Universite de Sherbrooke)

8:15 AM

Thermo-Optical Properties of Packed Nanoparticle Thermal Interface Materials (p234) Anil Yuksel (University of Texas Austin); Jayathi Murthy (University of California Los Angeles); Eric Tervo, Baratunde Cola (Georgia Institute of Technology)

Cooling Potential of Vortex Tubes for Chip Hot Spot Cooling (p313) Kamal Sikka (IBM Corporation); Kevin Drummond (Purdue University)

8:30 AM

Direct Investigation of Microparticle Self-assembly to Improve the Robustness of Neck Formation in Thermal Underfills (p298) R. Staedler, L. Del Carro, J. Zuercher, G. Schlottig (IBM Research); A. Studart (ETH); Thomas Brunschwiler (IBM Research)

Hot Spot Removal in Power Electronics by means of Direct Liquid Jet Cooling (p363) Johannes Joerg, Silvano Taraborrelli, Enno Sabelberg, Reinhold Kneer, Rik W. DeDoncker, Wilko Rohlfs (RWTH-Aachen University)

8:45 AM

Additively Manufactured Copper Components and Composite Structures for Thermal Management Applications (p370) Farah Singer, David Deisenroth, David Hymas, Michael Ohadi (University of Maryland College Park)

An Ultra High Performance Heat Sink Using a Novel hybrid Impinging Microjet - Microchannel Structure (p410) R. Chen (Microfabrica Inc.); W. Tan (Moog Inc.); A. Robinson, R. Kempers, J. Colenbrander (Confluent Research); N. Bushnell (SimuTech Group)

9:00 AM

Conjugated Heat Transfer in Complex Channel-Substrate Configurations: Hybrid Solution with Total Integral Transformation and Single Domain Formulation (p435) J. L. Zanon Zotin (CEFET-RJ); D. Campos Knupp (State University of Rio de Janeiro); R. Cotta (National Commission of Nuclear Energy)

Computational Fluid Dynamics-Thermal Modeling of Solid State Relay Electronic Packaging with Nano Materials to Manage the Hot Spot (p428) Be-Nazir Khan (IXYS IC Divison)

9:15 AM

Toward Enhancing Thermal Conductivity of Polymer-based Thin Films for Microelectronics Cooling (p361) Hao Ma, Zhiting Tian (Virginia Polytechnic Institute and State University)

9:35 AM

K-2: Scalable quantum computing with superconducting qubits Stefan Filipp (IBM Research – Zurich, Switzerland), Osprey


48

DAY 2 SESSIONS: THURSDAY, JUNE 1, 7:00 – 10:55 AM

Speakers Breakfast, Swan TII-5: Automotive / RF Electronics / Power Electronics II Mockingbird 2

M-5: Applied Reliability Toucan

TT-5: Transient Thermal Management Osprey

Session Chairs: Yoonjin Won (UC- Irvine), Banafsheh Barabadi (Massachusetts Institute of Technology)

Session Chairs: Prashant Gupta (Intel Corporation), Jin Yang (Intel Corporation), Jie Gong (KLA-Tencor Corporation)

Session Chairs: Patrick Shamberger (Texas A&M University)

Invited Paper Presentation High Voltage Stacked Diode Package with Integrated Thermal Management (p459) Lauren Boteler, Miguel Hinojosa, Valerie Niemann (US Army Research Laboratory); Steven Miner (US Naval Academy); David Gonzalez Nino (US Army Research Laboratory)

Invited Paper Presentation Non-destructive in-situ Monitoring of Delamination of Buried Interfaces by a Thermal Pixel (Thixel) Chip (p336) Bernhard Wunderle, Daniel May (TU Chemnitz); Mohamad Abo Ras (Nanotest); Juergen Keller (AMIC)

Flash Boiling and Transient Thermal Subsystems Kaz Yazawa (Purdue University)

Comparison of Hot Spot Temperature Between Si and SiC Power MOSFET Using Electro-Thermal Analysis (p174) R. Kibushi (Tokyo University of Science Yamaguchi); T. Hatakeyama (Toyama Prefectural University); K. Yuki, N. Unno (Tokyo University of Science Yamaguchi); M. Ishizuka (Toyama Prefectural University)

Electro-Thermal Reliability Study of GaN High Electron Mobility Transistors (p231) Bikramjit Chatterjee, James Spencer Lundh, James Dallas (Pennsylvania State University); Hyungtak Kim (Hongik University); Sukwon Choi (Pennsylvania State University)

Design of Thermal Energy Storage Materials and Composites Patrick Shamberger (Texas A&M University)

Evaluation of High Thermal Conductivity Dielectric on the Temperature of PCB Components (p186) Ali Kalantarian, Meihua Jin, Jim Merkelbach, Jabir Yusufali (Advanced Micro Devices Inc.)

X-ray Micro-CT and DVC Based Analysis of Strains in Metallization of Flexible Electronics (p442) Pradeep Lall, Junchao Wei (Auburn University)

A Self-consistent Reduced Order Model for Current and Temperature in GaN HEMTs (p302) Man Prakash Gupta, Ajit Vallabhaneni, Satish Kumar (Georgia Institute of Technology)

Effectiveness of Potting Methods and Underfills on the Enhancement of Survivability of Fine Pitch Electronics at 25,000g Shock Loads (p443) Pradeep Lall, Kalyan Dornala (Auburn University); John Deep (USAF AFRL); Ryan Lowe (ARA Associates)

Transient Thermal Management at the Device Scale Michael Barako, NG Next (Northrup Grumman Corporation)

Study of Electromigration in Cu and Ag Wirebonds Operating at High Current in Extreme Environments (p444) Pradeep Lall, Shantanu Deshpande (Auburn University); Luu Nguyen (Texas Instruments, Inc.)

K-2 Keynote: Scalable quantum computing with superconducting qubits

Stefan Filipp (IBM Research – Zurich, Switzerland), Osprey


49

DAY 2 SESSIONS: THURSDAY, JUNE 1, 11:00 – 1:45 PM

E-6: Fundamentals on Boiling & Condensation

Macaw

TI-6: 3D Packaging & Embedded Cooling Mockingbird 1

Session Chairs: Session Chairs: Harish Ganapathy (Intel Corporation), Vibhash Jha (NXP Semiconductors)

Session Chairs: Ankur Jain (University of Texas Arlington), Sreekant Narumanchi (National Renewable Energy Laboratory)

11:00 AM

Invited Paper Presentation Hierarchical Biphilic Micro/Nanostructures for a New Generation Phase-Change Heat Sink with 1800 W/cm2 CHF Limit (p204) Saeed Moghaddam, Abdy Fazeli (University of Florida)

Three Dimensional Steady-State Temperature Prediction of Volumetric Heating Sources Embedded into Multi-Layer Electronic Board Substrate (p105) Brice Rogie, Eric Monier-Vinard, Valentin Bissuel, Olivier Daniel (Thales Corporate Engineering); Brice Rogie, Nhat-Minh Nguyen, Najib Laraqi (Paris Ouest University)

11:15 AM

Concepts for Embedded Cooling of Vertical Current Wide Band-Gap Semiconductor Devices (p157) Ercan Dede, Feng Zhou, Shailesh Joshi (Toyota Research Institute of North America)

11:30 AM

Rapid-Bubble-Growth Instability at the Onset of Microchannel Flow Boiling (p128) Todd Kingston, Justin Weibel, Suresh Garimella, Andrey Moskalenko (Purdue University)

Thermal Investigation of Silicon and Glass Interposer-Based Microelectronic Systems (p200) Leila Choobineh (SUNY Polytechnic Institute)

11:45 AM

Subcooled Boiling with Nano-Coating Heating Surface (p158) Noriyuki Unno, Xiang Yi Jia, Kazuhisa Yuki, Risako Kibushi, Shin-Ichi Satake, Koichi Suzuki (Tokyo University of Science)

Self-adaptive Microvalve Array for Energy Efficient Fluidic Cooling in Microelectronic Systems (p289) Hassan Azarkish, Louis-Michel Collin, Luc G Frechette (Universite de Sherbrooke); Jerome Barrau (University of Lleida); Perceval Coudrain (STMicroelectronics); Guillaume Savelli (CEA Liten)

12:00 PM

Two-phase Flow Regimes in a U-shaped Diabatic Manifolded-microgap Channel (p303) David Deisenroth, Michael Ohadi, Avram Bar-Cohen (University of Maryland)

Wide Temperature Range Operation of GaN HEMTs for Power Dense Energy Conversion (p367) Troy Beechner, Robert Mayo, John Bustamante (Mainstream Engineering)

12:15 PM

Micromesh-Covered Superhydrophobic Surfaces for Efficient Condensation Heat Transfer (p432) Rongfu Wen, Shanshan Xu, Ronggui Yang (University of Colorado Boulder)

A Systematic Experimental Investigation of Thermal Degradation Mechanisms in Lidded Flip-chip Packages: Effects of Thermal Aging and Cyclic Loading (p349) Tuhin Sinha, Jeffrey A Zitz (IBM Corporation)

12:35 PM Lunch on your own

50


TII-6: Data Center & Energy Efficiency II Mockingbird 2

M-6: Thermal-Mechanical Interaction in Microelectronics Package & System II Toucan

P-6: Data Center Thermal Management Osprey

Session Chairs:

Emil Rahim (GoPro), Sami Alkharabsheh (Binghamton University)

Session Chairs: Kaustubh Nagarkar (GE Global Research), Jin Yang (Intel Corporation)

Moderators: Yogendra Joshi (Georgia Institute of Technology)

Total Cost of Ownership Model for Data Center Technology Evaluation (p227) Yan Cui, Charles Ingalz, Tianyi Gao, Ali Heydari (Baidu USA)

Evolution of High Strain Rate and High Temperature Mechanical Properties of SAC305 with Long Term Storage up to 1-Year (p447) Pradeep Lall, Di Zhang, Jeff Suhling (Auburn University); David Locker (US Army AMRDEC)

Emerging Trends in Data Centers Abstract: This panel will focus on emerging data center growth in the areas of high performance computing, and Internet-of-Things. State-of-the-art thermal management technologies in these areas will be explored, and future challenges identified. Topics to be discussed include recent developments in liquid cooling including pumped and non-pumped two-phase cooling systems, warm water cooling, oil Immersion cooling, and dynamically adaptive cold plates. Air cooling advances in modular data centers, and contamination and corrosion damage in data centers utilizing free air cooling will be explored. Performance metrics for data centers are crucial to guide future growth directions. Their role will be discussed. Panelists: Dereje Agonafer (U. Texas, Arlington) Dustin Demetriou (IBM) Al Ortega (Villanova University) Michael Patterson (Intel) Mark Seymour (Future Facilities)

Meteorological Assessment and Implementation of an Air-Side Free-Cooling System for Data Centers in Chile (p380) Andres Diaz, Gisella Neves (Universidad Diego Portales); Luis Silva-Llanca (Universidad de la Serena); Marcelo Del Valle (Villanova University); Jose Cardemil (Universidad de Chile)

Degradation Mechanisms of Embedded Cooling Systems for High Heat Flux Power Electronics: Particle Erosion of Silicon and Silicon Carbide (p384) David Squiller, Ian Movius, Michael Ohadi, Patrick McCluskey (University of Maryland College Park)

Simulation and Experimental Analysis of Data Centers in Academic Campus (p474) Kyosung Choo (Youngstown State University); Michael Ohadi, David Cooper (University of Maryland)

Study on the Effect of Fixtures on Deformation and Warpage of the Double-Sided Flexible Printed Circuit Board Through Reflow Using DIC (p450) Pradeep Lall, Kartik Goyal (Auburn University)

Effect of EMCs on the High Current Reliability of Cu Wirebonds Operating in Harsh Environments. (p445) Pradeep Lall, Shantanu Deshpande, Yihua Luo (Auburn University); Luu Nguyen (Texas Instruments, Inc.)

A New Low-Cost, High Volume Technology for Hermetically Sealing Large Electronic Packages (p469) Thomas Salzer (Hermetric, Inc.)

Solder Joint Reliability in Isothermal Varying Load Cycling (p395) Sa’d Hamasha, Sinan Su, Francy John Akkara, Ahmad Dawahdeh (Auburn University); Peter Borgesen (Binghamton University); Awni Qasaimeh (Zebra Technologies)

Lunch on your own

51


E-7: Thermal Interface Materials & Phase Change Materials - I Macaw

TI-7: Single-Phase Liquid Cold Plates & Heat Exchangers Mockingbird 1

Session Chairs: Chirag Kharangate (Stanford University), Liang Pan (Purdue University)

Session Chairs: Mehmet Arik (Ozyegin University), Rajat Mittal (Qualcomm Technologies, Inc.)

1:50 PM

Invited Paper Presentation Design Considerations for a Miniaturized TIM Tester with Extremely High Measurement Resolution (p116) Ronald Warzoha, Andrew Smith, Ashim Bajwa (United States Naval Academy); Lauren Boteler (Army Research Laboratory)

Comparative Study of High Ambient Inlet Temperature Effects on the Performance of Air vs. Liquid Cooled IT Equipment (p214) M. Sahini, U. Chowdhury, A. Siddarth, T. Pradip, D. Agonafer (UT-Arlington); J. Metcalf (Cisco Systems, Inc.); S. Branton (Asetek, Inc.); R. Zeighami (Microsoft Corp.)

2:05 PM

Experimental Study of Design Parameter Influence on Thermal and Hydraulic Performance of Cold Plates (p248) Ilya TJollyn (Ghent University); Jan Bienstman (Flanders Make); Bernd Ameel, Michel de Paepe (Ghent University)

2:20 PM

Thermal and Mechanical Properties of Electrically Insulating Thermal Interface Materials (p179) Michael Demko, Joseph Yourey, Arnold Wong, Pui-Yan Lin, Gregory Blackman, Glenn Catlin, Mobin Yahyazadehfar (DuPont)

Corrosion in a Closed Loop Electronic Device Cooling System with Water as Coolant and Its Detection (p258) Choong-Un Kim (University of Texas Arlington); Je-Young Chang (Intel Corporation)

2:35 PM

Effect of Compressibility on Graphite TIM life across High Performance Computing Applications (p218) Mark Hoffmeyer, Phil Mann (IBM); Prashanth Subramanian, Rick Beyerle (Advanced Energy Technologies LLC)

A Study of Direct Liquid Cooling for High-density Chips and Accelerators (p259) Tianyi Gao, Shuai Shao, Yan Cui, Bryan Espiritu, Charles Ingalz, Hu Tang, Ali Heydari (Baidu USA)

2:50 PM

Effect of Boron Nitride (hBN) Filler on Thermal Properties of Underfill Epoxy (p366) Sara Abbasirazgaleh, Shyam Aravamudhan (North Carolina Agricultural and Technical State University)

Flow Optimizer Architecture Designs in High Powered Computing Coolant Chambers (p308) Prabhakar Subrahmanyam, Ying-Feng Pang, Amy Xia, Tong Chao, Ridvan Sahan, Muhammad Ahmad, Rahima Mohammed (Intel Corporation)

3:05 PM Investigation of the Mechanical Compliance of Highly Conductive and Durable Carbon Nanotube- Polymer Composite Thermal Interface Materials (p398) Leonardo Prinzi, Baratunde Cola, Craig Green, Alexander Prinzi (Carbice Nanotechnologies)

Heat Exchanger Improvement via Curved, Angular and Wavy Microfluidic Channels: A Comparison of Numerical and Experimental Results (p320) S.l Marshall, R. Arayanarakool, L. Balasubramaniam, B. Li, H. Wang, Poh-Seng Lee, P. Chen (National University of Singapore)

3:25 PM Refreshment Break, Swan Foyer

52


TII-7: Data Center System Analysis & Control Methodologies Mockingbird 2

I-7: Intercontinental Conference Summaries Osprey

TT-7: Aerospace Thermal Management Toucan

Session Chairs: Damena Agonafer (Washington University in Saint Louis)

Session Chair: Thomas Brunschwiler (IBM)

Session Chair: Ross Wilcoxon (Rockwell Collins)

NiyanTron - An Approach to Develop a Control System App for Data Center Cooling (p134) Varun Rahul, Anay Darekar, Dereje Agonafer, Ashwin Siddarth (University of Texas Arlington)

Invited Talk Highlights and Trends from EPTC 2016 Ranjan Rajoo (GLOBALFOUNDRIES) Abstract: The 19th Electronics Packaging Technology Conference (EPTC 2016) is an International conference organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. It was held at the Singapore from 30th Nov to 3rd Dec 2016. EPTC 2016 consists of technical program, professional development courses, and technology exhibition corner. 170 high quality technical papers will be presented in 35 oral sessions, 2 interactive sessions, 1 workshop & 18 invited talks. In my talk, I will cover some key lights of the presented papers which covers advanced packaging, interconnect technologies, wafer level packaging, materials, processing, assembly, manufacturing, quality, reliability, thermal, mechanical modelling and simulation.

Challenges and Opportunities with Thermal Management of Military RF Systems Jim Wilson (Raytheon)

Thermodynamic Analysis of Coupled Mechanical and Power Systems in Data Centers (p146) Faisal Ahmed, Aaron P. Wemhoff (Villanova University)

Worldwide Energy Analysis of Major Free Cooling Methods for Data Centers (p202) Ozan Gozcu, Berk Ozada, Muhammed Ugur Carfi, Hamza Salih Erden (Istanbul Technical University)

Advances in Electrically Driven Thermal Management Jeffrey R Didion (NASA Goddard Space Flight Center)

Power Variation Trend Prediction in Modern Datacenter (p208) Nishi Ahuja, Chuan Song, Yanbing Sun, Abishai Daniel, Ruhal Khanna, Xiang Zhou (Intel Corp); Xiaogang Sun, Tianyu Zhou, Lifer Zhang (Baidu)

Invited Talk Highlights and Trends from THERMINIC 2016 Christopher Bailey (University of Greenwich) Abstract: THERMINIC is an IEEE-CPMT sponsored workshop related to thermal issues in electronic components and systems. The workshop is held every September in Europe. In 2016, the workshop was held in Budapest, Hungary, with over 120 attendees. This presentation will provide highlights from last year’s conference, particularly in the areas of power electronics, thermal interface materials, and LED’s where multi-domain modelling methodologies were demonstrated and the use of reduced order modelling techniques such as Delphi (compact models) and model order reduction methods were discussed.

ROI and TCO Analysis of the First Production Level Installation of Adsorption Chillers in a Data Center (p306) Michael Ott, Torsten Wilde, Herbert Huber (Bavarian Academy of Sciences and Humanities)

Overcoming Thermal Management Challenges: NAVAIR Needs and Opportunities Venkatesan Manivannan (Naval Air Systems Command)


53


E-8: Thermal Numerical Methods II Macaw

TI-8A: Pulsating/Oscillating & Nonconventional Heat Pipes Mockingbird 1

Session Chairs: Bladimir Ramos Alvarado (Georgia Institute of Technology), Man Prakash Gupta (Ford, Inc.)

Session Chairs: William Gerstler (GE Global Research), Todd Salamon (Nokia Bell Labs), Peter de Bock (GE Global Research)

3:50 PM

Challenges in Micro-channel Heat Transfer Experiments: Insight on Conjugate Heat Transfer Effects (p112) Fuad Ismayilov, Yingying Wang, Yoav Peles (University of Central Florida)

A Study of Thermal Performance in Novel Radial Pulsating Heat-Pipe Systems (p138) Brian Kelly, Yoon Jo Kim (Washington State University Vancouver)

4:05 PM

Fast and Accurate Thermal Simulation of Smartphone amidst Dynamic Power Management using Reduced Order Modelling (p175) Palkesh Jain (Qualcomm India Pvt Ltd); Aniket Kulkarni, Sivasubramani Krishnaswamy, Shital Joshi, Ankit Adhiya (Ansys India); Mehdi Saeidi (Qualcomm Technologies, Inc.); Jared Harvest (Ansys)

Effect of Velocity Non-uniformity on Heat Transfer in Oscillating Flow (p471) Jaeyeong Jo, Sung Jin Kim (KAIST)

4:20 PM

A Compact Wall Model for CFD Simulations (p177) Zachary Pardey, James VanGilder, Christopher Healey (Schneider Electric)

A Polymer-Based Pulsating Heat Pipe: Fabrication and Investigation of Thermal Performance (p472) Jonghyun Lim, Sung Jin Kim (KAIST)

4:35 PM

Parametric Study of Spatially-Uniform Mini-Channel Heat Sinks using a Porous Media Modeling Approach (p220) John Podhiny, Alfonso Ortega (Villanova University)

Characterization of Microfluidic Operations Underlying an Electrowetting Heat Pipe (p242) Vaibhav Bahadur, Renee Hale (University of Texas Austin)

4:50 PM

Thermal Modeling of Single-phase and Two-phase 2D-chip Cooling using Microchannels (p377) C. Kharangate, T. Liu, K. W. Jung, M. Asheghi, K. Goodson (Stanford University); H. Lee (Chung-Ang University); M. Iyengar, C. Malone (Google, Inc.)

5:05 PM

Extending a Multi-Level Logi-Thermal Simulation Framework to a Mixed Signal Thermal Aware Simulation Environment Using SystemC-AMS (p466) Lazar Jani, Andras Poppe (Budapest University of Technology and Economics)

5:25 PM Student Poster & Networking Session Swan

54


TI-8B: Air Cooling, Fans, & Heat Exchangers Mockingbird 2

M-8: Solder Reliability Toucan

P-8: Mobile Devices Thermal/Mechanical Challenges Osprey

Session Chairs: Reza Khiabani (Google, Inc.), Prabhakar Subrahmanyam (Intel)

Session Chairs: Chandradip Patel (Schlumberger Technology Corporation), Vibhash Jha (NXP Semiconductors)

Moderator: Victor Chiriac (Qualcomm Technologies Inc.)

Numerical and Experimental Thermal Performance Analysis of Two Different Types of Air Cooled Electronic Chassis Developed for Military Aviation Platform (p109) Murat Parlak, Ahmet Soydan Akyol, Oguzhan Efe (Aselsan, Inc.)

Long Term Isothermal Aging Effects on the Cyclic Stress-Strain Behavior of Sn-Ag-Cu Solders (p404) Nianjun Fu, Jeff Suhling, Sa’d Hamasha, Pradeep Lall (Auburn University)

Mobile Device Thermal / Mechanical Challenges Abstract: In the last 5-10 years, there has been a significant growth in computing platforms ranging from handhelds to servers. This growth led to increased concerns for thermal management of packaging and devices ranging from low to high form factors (mobile internet devices, smartphones, tablets, laptop computers, thin rack servers & blade servers and data centers). The majority of research today is CPU-centric whereas in the mobile/portable space, the device skin as well as the other components, which do not have dedicated thermal solutions, are equally challenging to cool. A panel of experts will discuss these aspects and will share their vision on the future of electronics thermal management and other advanced packaging solutions. Panelists: Prof. John Thome, Professor (EPFL Switzerland) Rick Beyerle, Senior Research Scientist (Graftech Inc.) Prof. Sam Graham, Professor (Georgia Tech) Jaime Sanchez, Senior Research (Intel, Corp.)

Introduction of an Additively Manufactured Multi-Furcating Heat Exchanger (p137) William Gerstler, Daniel Erno (GE Global Research)

Reliability of Large I/O LGA and FCBGA Assemblies under Thermal Shock/Cycles and Aging: Comparison of HASL and ENEPIG PCB Finish (p277) Reza Ghaffarian (Jet Propulsion Laboratory)

Enhanced Air Side Heat Transfer in an Additively Manufactured Polymer Composite Heat Exchanger (p178) David Hymas, Farah Singer, Serguei Dessiatoun, Michael Ohadi (University of Maryland)

Evolution of the Cyclic Stress-Strain and Constitutive Behaviors of SAC305 Lead Free Solder During Fatigue Testing (p406) Nianjun Fu, Jeff Suhling, Sa’d Hamasha, Pradeep Lall (Auburn University)

An Experimental and Computational Investigation of a Thin Piezofan Cooler (p286) Baris Dogruoz (Cisco Systems, Inc.); Mehmet Arik, Shadi Parsa (Ozyegin University)

Solder Ball Reliability Assessment of WLCSP - Power Cycling Versus Thermal Cycling (p293) U. Rahangdale, B. Conjeevaram, A. Doiphode, P. Rajmane, A. Misrak, A. R. Sakib, D. Agonafer (UT- Arlington); L. Nguyen, A. Lohia, S. Kummerl, (Texas Instruments, Inc.)

Acoustic Analysis of an Axial Fan (p287) Hashim Waheed (Ozyegin University); Baris Dogruoz (Cisco Systems, Inc.); Mehmet Arik (Ozyegin University)

Evolution of the Cyclic Stress-Strain Behavior of Doped SAC Solder Materials Subjected to Isothermal Aging (p453) Md Chowdhury, Nianjun Fu, Jeff Suhling, Pradeep Lall (Auburn University)

Optimum Spacing of Vertical Parallel Plates for Combined Natural Convection and Radiation (p482) Hanry Issavi, Fred Barez (San Jose State University)

Student Poster & Networking Session Swan

55

DAY 3 SESSIONS: FRIDAY, JUNE 2, 7:00 – 10:55 AM

7:00 AM Speakers Breakfast, Swan E-9: Fundamentals of Thermal

Transport & Transistor Technology

Macaw

TI-9: Heat Pipes & Thermosyphons Mockingbird 1

Session Chairs: Banafsheh Barabadi (Massachusetts Institute of Technology), Solomon Adera (Massachusetts Institute of Technology)

Session Chairs: Mark North (Aavid Thermacore), Vivek Sahu (Qualcomm Technologies, Inc.)

8:00 AM

Molecular Dynamics Simulation of The Effect of The Solid Gas Interface Nanolayer On Enhanced Thermal Conductivity of Copper-CO2 Nanofluid (p182) Zeeshan Ahmed, Ajinkya Sarode, Pratik Basarkar, Atul Bhargav (IIT-Gandhinagar); Debjyoti Banerjee (Texas A & M University)

Heat Pipe Models in Thermal Design Software Including Realistic Representation of Thermal Resistance and Heat Transport Limit (p310) Sukhvinder Kang, Jan Visser, Shahin Oskouie (Aavid Thermalloy LLC)

8:15 AM

Integrated Temperature Mapping of Lateral Gallium Nitride Electronics (p232) James Spencer Lundh, Bikramjit Chatterjee, James Dallas, Sukwon Choi (Pennsylvania State University); Hyungtak Kim (Hongik University)

Two-Phase Thermosyphon for Electronics Cooling, Part 1: Pump-Driven Loop (p314) Todd Salamon (Nokia Bell Labs); Luca Amalfi, Nicolas Lamaison, Jackson Marcinichen, John Thome (LTCM-EPFL)

8:30 AM

Thermal Characterization of GaN Vertical p-i-n Diodes (p235) J. Dallas, J. Spencer Lundh, B. Chatterjee, S. Choi (Penn State University); G. Pavlidis, T-T. Kao, T. Detchprohm, R. Dupuis, S-C. Shen, M-H. Ji, S. Graham (Georgia Tech); J. Kim (LG Electronics)

Two-Phase Liquid Cooling System for Electronics, Part 2: Air-Cooled Condenser (p315) Luca Amalfi (LTCM-EPFL); Todd Salamon (Nokia Bell Labs); Nicolas Lamaison, Jackson Marcinichen, John Thome (LTCM-EPFL)

8:45 AM

Non-Diffusive Heat Transport in Twin Nanoheater Lines on Silicon (p427) Amirkoushyar Ziabari, Alex Shakouri, Yi Xuan, Yeerui Koh, Mengwei Si, Peide Ye, Ali Shakouri (Purdue University); Alex Shakouri (Microsanj LLC); Je-Hyeong Bahk (University of Cincinnati)

Two-Phase Thermosyphon for Electronics Cooling, Part 3: Ultra-Compact Liquid-Cooled Condenser (p316) Luca Amalfi (LTCM-EPFL); Todd Salamon (Nokia Bell Labs); Nicolas Lamaison, Jackson Marcinichen, John Thome (LTCM-EPFL)

9:00 AM

Experimental-Theoretical Thermal and Electrical Analyses of Insulated Gate Bipolar Transistors (IGBT) Power Module (p436) Philippe D. Egmont, Carolina P. Naveira-Cotta, Robson F. S. Dias, Christopher P. Tostado, Fernando P. Duda, Kelvin Chen (Federal University of Rio de Janeiro)

Two-Phase Thermosyphon for Electronics Cooling, Part 4: Modeling and Simulations (p317) Jackson Marcinichen, Luca Amalfi, Nicolas Lamaison (LTCM-EPFL); Todd Salamon (Nokia Bell Labs); John Thome (LTCM-EPFL)

9:15 AM

9:35 AM

K-3: Recent Advances and New Trends in Semiconductor Packaging John H. Lau, ASM Pacific Technology Ltd., Osprey


56

DAY 3 SESSIONS: FRIDAY, JUNE 2, 7:00 – 10:55 AM

Speakers Breakfast, Swan TII-9: LEDs Thermal Management

Mockingbird 2

M-9: Mechanics in Assembly & Packaging II Toucan

TT-9: 3D Thermal Management Osprey

Session Chairs: Xiaobing Luo (Huazhong University of Science and Technology), Guoping Xu, Ali Akbar Merrikh (Qualcomm, Inc.)

Session Chairs: S W Ricky Lee (Hong Kong University of Science and Technology), Kaushik Mysore (AMD)

Session Chair: Timothy Chainer (IBM Research)

Invited Paper Presentation Modeling the Impact of Thermal Effects on Luminous Flux Maintenance for SSL Luminaires (p417) J. L. Davis, Karmann Mills, Michael Lamvik, Curtis Perkins (RTI International)

Development, Testing, and Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces (p156) David L. Saums (DSA LLC); Tim Jensen (Indium Corporation of America)

Thermal Technologies for 3D Chip Stacks Avi Bar-Cohen (Raytheon Space and Airborne Systems)

Epoxy Molding Compound Effect on Fan-out Wafer Level Package Strength During Post-Mold Thermal Process (p365) Cheng Xu (Nanyang Technological University)

Investigation on Dip-transfer Phosphor Coating for Light-emitting Diodes: Experiments and VOF Simulations (p120) Xingjian Yu, Yupu Ma, Bofeng Shang, Bin Xie, Qi Chen, Xiaobing Luo (Huazhong University of Science and Technology)

Mechanical Behavior of Pressure-Sensitive Adhesives (PSAs) (p373) Hao Huang, Abhijit Dasgupta (University of Maryland); Ehsan Mirbagheri (Microsoft Corporation)

Co--Design Modeling for 3D Chip Stacks Pritish Parida (IBM Research)

Thermal Analysis of White Light-Emitting Diodes Structures with Hybrid Quantum Dots/Phosphor Layer (p140) Bin Xie, Xiaobing Luo (Huazhong University of Science and Technology)

Nanomechanical Characterization of IMCs Formed in SAC Solder Joints During Isothermal Aging (p454) Abdullah Fahim, Sudan Ahmed, Jeff Suhling, Pradeep Lall (Auburn University)

A Novel Cooling Method for LED Filament Bulb Using Ionic Wind (p167) Huai Zheng, Jie Liu, Sheng Liu (Wuhan University); Chunlin Xu, Jingcao Chu (Huazhong University of Science and Technology); Xiaoliang Zeng, Rong Sun (Shenzhen College of Advanced Technology)

Estimating the Yield Strength of Metal Films in ILD Stacks Using Optimization-based Inverse Finite Element Analysis (p477) Chun-Pei Chen, Ganesh Subbarayan (Purdue University); Hung-Yun Lin, Siva Gurrum (Texas Instruments, Inc.)

Die-Level Embedded Cooling & Thermal Isolation in 2.5D/3D ICs and Electrical Benchmarking Muhannad Bakir (Georgia Institute of Technology)

Impact of Junction Temperature over Forward Voltage Drop for Red, Blue, and Green High Power Light Emitting Diode Chips (p479) Ahmet Muslu, Burak Ozluk, Enes Tamdogan, Mehmet Arik (Ozyegin University)

K-3 Keynote: Recent Advances and New Trends in Semiconductor Packaging John H. Lau, ASM Pacific Technology Ltd., Osprey


57

DAY 3 SESSIONS: FRIDAY, JUNE 2, 11:00 – 1:45 PM

E-10: Nanotechnology Macaw

TI-10: Thermal Materials & Thermoelectrics Mockingbird 1

Session Chairs: Michael Barako (Northrop Grumman), Yaguo Wang (University of Texas Austin)

Session Chairs: S. Narumanchi (National Renewable Energy Laboratory), A. Jain (UT Arlington) T. Khadivi (Qualcomm, Inc.)

11:00 AM

Induced Clustering-enabled Thermal Transport Enhancement in Polymer Composites for Efficient Thermal Interface Materials (p166) Young-Kuk Kim (Korea Institute of Materials Science)

Invited Paper Presentation Thermal Conductivity Measurements on Suspended Diamond Membranes Using Picosecond and Femtosecond Time-Domain Thermoreflectance (p383) Ramez Cheaito, Aditya Sood, Mehdi Asheghi, Kenneth Goodson (Stanford University); Luke Yates, Thomas Bougher, Zhe Cheng, Samuel Graham (Georgia Institute of Technology)

11:15 AM

Role of Carbon Nanotube on the Interfacial Thermal Resistance: A Molecular Dynamics Approach (p169) Ajinkya Sarode, Zeeshan Ahmed, Pratik Basarkar, Atul Bhargav (Indian Institute of Technology Gandhinnagar); Debjyoti Banerjee (Texas A & M University)

11:30 AM

Predicting Phonon Thermal Transport in Strained Two-dimensional Materials: Graphene, Boron Nitride, and Molybdenum Disulfide (p180) Carlos Da Silva, Cristina Amon (University of Toronto)

Invited Paper Presentation Integration of Micro-contact Enhanced Thermoelectric Cooler with a FEEDS Manifold-Microchannel System for Cooling of High Flux Electronics (p399) Sevket Umut Yuruker, Daniel Bae, Raphael Mandel, Bao Yang, Patrick McCluskey, Avram Bar-Cohen, Michael Ohadi (University of Maryland)

11:45 AM

Investigation of Thermal Transport across Solid Interfaces with Randomly-Distributed Nanostructures (p368) Eungkyu Lee, Tengfei Luo (University of Notre Dame)

12:00 PM

The Role of Intermediate Layers in Thermal Transport across GaN/SiC Interfaces (p369) Taehee Yoo, Eungkyu Lee, Tengfei Luo (University of Notre Dame)

Thermoelectric Module for High Temperature Application (p300) Andreas Larsson (University College of Southeast Norway); Torleif A. Tollefsen (TEGma AS); Ole Martin Lovvik (SINTEF Materials and Chemistry); Knut E. Aasmundtveit (University College of Southeast Norway)

12:15 PM

Investigation of Aluminum Foams and Graphite Fillers for Improving the Thermal Conductivity of Paraffin Wax-based Phase Change Materials (p268) Javieradrian Ruiz, Yash Ganatra, Alex Bruce, John Howarter, Amy Marconnet (Purdue University)

Fast Thermal Modeling of Liquid, Thermoelectric, and Hybrid Cooling (p230) Fulya Kaplan, Sherief Reda, Ayse Coskun (Boston University)

12:35 PM

ITherm Awards and Recognitions Luncheon Swan

58


TII-10: LEDs / Battery Thermal Management Mockingbird 2

M-10: Solder Characterization & Modeling Toucan

P-10: IoT Thermal Management Osprey

Session Chairs: Ali Akbar Merrikh, Guoping Xu (Qualcomm), Xiaobing Luo (Huazhong University of Science and Technology)

Session Chairs: Liang Yin (GE Global Research), Leila Choobineh (SUNY Polytechnic Institute)

Moderators: Angel Qian (Huawei), Baris Dogruoz, (Cisco Systems Inc.)

Controlled Thermal Design of SLIM LED TV Systems (p249) Mustafa Caglar Ozaydin (VESTEL Electronics RD-Optics Design), Mehmet Arik (Ozyegin University)

The Anand Parameters of Aging Resistant Doped Solder Alloys (p400) Sudan Ahmed, Jeff Suhling, Pradeep Lall (Auburn University)

Design Challenges in Internet of Things (IoT) Abstract: The Internet of Things (IoT) is a system of interrelated computing devices, mechanical and digital machines, objects, people that are provided with unique identifiers and the ability to transfer data over a network. It has more direct contact with the end users. The panel will address special issues, questions and concerns regarding thermal design challenges, safety issues and ergonomic aspect of IoT. The panel will cover some case studies on current cellular phone designs and most updated safety analysis of smartphone industry. The panel will also show the method to predict the Multiphysics computational challenges in IoT modelling and show several applications/examples. The industry trend of new product forms of IoT and related challenge will also be discussed in this panel. Panelists: Mehdi Saeidi (Qualcomm, Inc.) Metin Ozen (Ozen Engineering) Baris Dogruoz, (Cisco Systems, Inc.) Troy Hayes (Exponent) Angel Qian Han (Huawei Device)

Cooling Strategy for LED Filament Bulb utilizing Thermal Radiation Cooling and Open Slots Enhancing Thermal Convection (p295) Linjuan Huang, Yuchou Shih, Frank Shi (University of California Irvine)

Elimination of Tin Whisker Growth by Indium Addition to Electroplated Tin Coatings in Electronic Packages (p246) Susmriti Das Mahapatra (Washington State University); Bhaskar Majumdar (New Mexico Tech); Indranath Dutta (Washington State University)

Experimental Characterization of Thermal Conductance across the Separator-Shell Interface in Dry Cylindrical Lithium Ion Batteries (p359) Aalok Gaitonde, Amulya Nimmagadda, Amy Marconnet (Purdue University)

Effect of Prolonged Storage on High Strain Rate Mechanical Properties of SAC105 at Operating Temperature up to 200 C (p448) Pradeep Lall, Vikas Yadav, Jeff Suhling (Auburn University); David Locker (US Army AMRDEC)

Effect of Electrode Properties on Performance of Miniaturized Vanadium Redox Flow Battery (p375) Nehakausar Pinjari, Brijesh Kumar, Atul Bhargav (Indian Institute of Technology Gandhinagar); Patrick Ruch (IBM Corporation)

High Strain Rate Mechanical Behavior of SAC-Q Solder (p449) Pradeep Lall, Vikas Yadav, Jeff Suhling (Auburn University); David Locker (US Army AMRDEC)

Lifetime Predictions for Dimmable Two-Channel Tuning White Luminaire Systems (p411) J. L. Davis (RTI International); T. Clark, A. Smith (Finelite, Inc.); K. Mills, C. Perkins (RTI International)

Improved Finite Element Modeling Strategies with Multipoint Constraints for BGA Packages Subjected to Thermal Cycling (p467) Chienchih Chen, Jeff Suhling, Pradeep Lall (Auburn University)

Numerical Study of Fluid Flow in Different Manifold Configurations for Vanadium Redox Flow Battery (p458) Matthew Law, Poh-Seng Lee (National University of Singapore); Ming Han, Ningping Chen, Lijun Liu (Temasek Polytechnic)

ITherm Awards and Recognitions Luncheon Swan

59


E-11: Thermal Interface Materials & Phase Change Materials - II Macaw

TI-11: Flow Boiling & Two-Phase Cold Plates Mockingbird 1

Session Chairs: Ronald Warzoha (United States Naval Academy), Zhiting Tian (Virginia Polytechnic Institute and State University)

Session Chairs: Satish Kandlikar (Rochester Institute of Technology), Anandaroop Bhattacharya (IIT Kharagpur)

1:50 PM

Reliability of Low Melt Alloys as Thermal Interface Materials (p164) Chandan Roy, Michael Hamilton, Roy Knight, Daniel Harris (Auburn University); R. Wayne Johnson (Tennessee Technological University)

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator (p114) Chiara Falsetti, Mirco Magnini, John Richard Thome (Ecole Polytechinque Federale de Lausanne)

2:05 PM

Structure of Diamond-Silicon Interfaces (p206) Jonathan Anderson, Bobby Hancock, Mohammad Nazari, Mark Holtz, Edwin Piner (Texas State University); Mark Goorsky (University of California Los Angeles)

Investigation of Spray Cooling Schemes for Dynamic Thermal Management (p245) Vishnu Vardhan Reddy Yata, Huseyin Bostanci (University of North Texas)

2:20 PM

Degradation Characterization of Thermal Interface Greases (p396) Douglas DeVoto, Joshua Major, Paul Paret (National Renewable Energy Laboratory); Gregory Blackman, Arnold Wong, Jeffrey Meth (DuPont)

Comparison of Near Source Two-Phase Flow Cooling of Power Electronics in Thermosiphon and Forced Convection Modes (p309) Fabio Battaglia, Farah Singer, Michael Ohadi (University of Maryland)

2:35 PM

Metallic Nanocomposites as Next-Generation Thermal Interface Materials (p463) Nirup Nagabandi, Cengiz Yegin, Jun Kyun Oh, Mustafa Akbulut (Texas A & M University); Xuhui Feng, Charlie King, Sreekant Narumanchi (National Renewable Energy Laboratory)

Flow Boiling Heat Transfer in Wettability Patterned Microchannels (p347) Bin Wang, Minghao He, Hongzhao Wang, Huihe Qiu (Hong Kong University of Science and Technology)

2:50 PM

Flow Boiling Performance in Smooth and Internally-Grooved Tube U-Bend Cold Plates (p382) Darin Sharar (US Army Research Laboratory); Spencer Argenna (Rochester Institute of Technology); Avram Bar-Cohen (University of Maryland College Park)

3:05 PM

60


TII-11: Mobile / Internet of Things Mockingbird 2

P-11: Novel Materials and Fabrication Osprey

TT-11: GaN Device Cooling Toucan

Session Chairs: Taravat Khadivi (Qualcomm Technologies, Inc.), Ankur Jain (University of Texas Arlington)

Session Chair: Ali Khounsary (Illinois Institute of Technology)

Session Chair: Dave Altman (Raytheon), Peter deBock (GE Global Research)

Modeling of Writable Thin Film Liquid Metal Phase Change Material for Electronics Cooling (p104) Ahmed Hamed, Sidy Ndao (University of Nebraska Lincoln

Novel Materials and Fabrication Methods enabling Advanced Thermal Management Abstract: Thermal management has been, and in all likelihood shall remain, one of the limiting factors and perhaps the main mechanical engineering challenge in the development of many advanced electronic systems. While the early and largely successful attempts at tackling some of the thermal management challenges focused on the heat transfer aspect, the critical and often decisive role of materials in the development of these systems is increasingly evident. The invited experts at this panel session will apprise the attendees of the significant role of materials and fabrication in thermal management, will examine some of the critical needs in this area, will provide an overview some of the recent progress and innovations, and discuss promises and challenges in development, characterization, and implementation of the new materials. Panelists: Dr. Lynn Davis (RTI International) Dr. Craig Green (Carbice Corporation) Dr. Amy Marconnet (Purdue Univ.) Dr. Sandra Reisinger (Schunk Hoffmann Carbon Technology AG)

Thermal Engineering Challenges in GaN Electronics Samuel Graham (Georgia Institute of Technology)

Technical Challenges and Novel Passive Cooling Technologies for Ultra-Thin Notebooks (p113) Quanming Li, Angel Han, Linfang Jin, Guo Yang, Yuping Hong, Jie Yang, Zhiguo Zhang (Huawei Technologies Co. Ltd.)

A Time-Stepping Analytical Model for 3D Transient Vapor Chamber Transport (p130) Gaurav Patankar, Justin Weibel, Suresh Garimella (Purdue University)

Advanced Thermal Solutions for GaN RF Electronics David Altman (Raytheon)

Development of Algorithms for Real-time Estimation of Smartphone Surface Temperature using Embedded Processor (p168) Masatoshi Ishii, Yoshiyasu Nakashima (Fujitsu Laboratories Ltd.)

Thermal & Solar Radiation Considerations for Simulation & Design of IoT Gateways for Outdoor Applications (p283) Sruti Chigullapalli, Jared Shipman (Intel Corporation)

Near-Junction Thermal Management Techniques Carl Creamer (BAE Systems)


61 Final Program




63 Final Program

THE ITHERM ORGANIZING COMMITTEE AND COMMUNITY GREATLY APPRECIATE THE

CONTRIBUTIONS FROM OUR SPONSORS

2017 ITHERM GOLD SPONSORS



THE ITHERM ORGANIZING COMMITTEE AND COMMUNITY GREATLY APPRECIATE THE

CONTRIBUTIONS FROM OUR SPONSORS

2017 ITHERM SILVER SPONSORS

2017 EXHIBITORS & PROGRAM SPONSORS

Exhibitors Program Sponsors

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Documents

Thermomechanical Phenomena in Electronic Systems Final ...€¦ · 1 Final Conference Program Thermomechanical Phenomena in Electronic Systems Final Conference Program May 30 - June