Technologies - SPIE

LocationAlpexpoGrenoble, France

Conference24-26 April 2013

www.spie.org/mtcall Call for PapersSubmit your abstractby 5 November 2012

Technologies

- Bio-MEMS and Medical Microdevices

- Integrated Photonics: Materials, Devices, and Applications

- Nanotechnology - Smart Sensors, Actuators,

and MEMS - VLSI Circuits and

Systems

Advance your research by showcasing your results and collaborating with other leaders

Conference: 24–26 April 2013AlpexpoGrenoble, France

Call for Papers

+1 360 676 3290 · [email protected] · www.spie.org/mtcall 1

Plan to ParticipateYour input is crucial!Take this opportunity to submit your latest research work to the 6th SPIE Microtechnologies. Meet colleagues from academia and industrial research groups in the Savoy Alps (Alpes de Savoie) in France, plan to participate and share your latest ideas in technological fi elds essential for shaping of the new millennium.

Five exciting conferences in the fi eld of microtechnologies have been linked together. Take advantage of the synergies created by engineers, scientists, researchers, and managers working on various aspects of microtechnologies. The symposium presents a unique opportunity to hear about the latest advances in microtechnologies for smart sensors, energy harvesting and smart power, reconfi gurable hardware and architectures for multimedia and wireless communication, network on a chip, nano fabrication and self-assembly, hybrid nanosystems, biomedical applications and bioinspired vision chips, microfl uidics and lab on a chip, silicon and nano photonics, quantum communication, and many other cutting edge R&T results.

Exchange new ideas, address your shared concerns, and get access to information not yet published in these topical areas. Submit your abstract by 5 November 2012. If accepted, your paper will be permanently archived in the SPIE Digital Library, where it will be made available to others in the international scientifi c community who seek to learn, make discoveries, and innovate.

We welcome you to feel at home in Grenoble, France, attend the meeting and join your colleagues and friends for the most stimulating scientifi c symposium.

Symposium Chair:

Local Co-Chair:

Thomas BeckerEADS Deutschland GmbH

and nta Isny gGmbH (Germany)

Marc BellevilleCEA-Leti (France)

Christos TsamisNational Ctr. for Scientifi c

Research Demokritos (Greece)

Gerhard KrötzUniv. of Applied Sciences

in Kempten (Germany)

Managed by Europe

SPIE Europe Ltd., a subsidiary of SPIE, is a not-for-profi t UK-registered company serving SPIE constituents throughout Europe as an advocate and liaison to political and industry associations within the European optics and photonics community.

In addition to providing membership services, SPIE Europe Ltd. organises and manages internationally recognised conferences, education programmes, and technical exhibitions featuring emerging optics and photonics technologies.

SPIE Europe 2 Alexandra Gate · Ffordd Pengam, Cardiff, CF24 2SATel: +44 29 2089 4747 · Fax: +44 29 2089 [email protected]

Symposium Co-Chairs:

SPIE Microtechnologies 2013 Call for Papers2

Conferences

Submit your abstract by | 5 November 2012

EMT101 Smart Sensors, Actuators, and MEMS (Schmid) . . . . . . . . . . . . . . . . . 3

EMT102 VLSI Circuits and Systems (Riesgo) . 4

EMT103 Bio-MEMS and Medical Microdevices (Tserepi) . . . . . . . . . . . . 5

EMT104 Nanotechnology (Adelung). . . . . . . . . 6

EMT105 Integrated Photonics: Materials, Devices, and Applications (Fédéli) . . 7

Abstract Submission . . . . . . . . . . . . . . . . . . . . . . . . .8

General Information . . . . . . . . . . . . . . . . . . . . . . . . . .9

Become part of the world’s largest collection of optics and photonics research papers

Present at SPIE Microtechnologies- Dynamic- Diverse- Current- Collaborative

Publish in SPIE Proceedings- Timely- Relevant- Cited- Indexed

SPIEDigitalLibrary.org

The Future is Faster Present and publish. Online. Onsite. Real-time.

Submit your manuscript by 29 March 2013 and have it accessible at the conference as part of the registration package and published in the SPIE Digital Library – giving your audience the unique opportunity to access your paper while listening to your presentation. (Traditional print volumes and CDs are still available for order at additional cost.)


Call for PapersSmart Sensors, Actuators, and MEMS (EMT101)Conference Chair: Ulrich Schmid, Technische Univ. Wien (Austria)Cochairs: José Luis Sánchez de Rojas Aldavero, Univ. de Castilla-La Mancha (Spain); Monika Leester-Schaedel, Technische Univ. Braunschweig (Germany)Programme Committee: Ali Badar M. Alamin Dow, Univ. of Toronto (Canada); Eduard Arzt, Leibniz-Institut für Neue Materialien gGmbH (Germany); Fred Barlow, Univ. of Idaho (USA); Joan Bausells, Ctr. Nacional de Microelectrónica (Spain); Christian Bolzmacher, Commissariat à l’Énergie Atomique (France); Carles Cané, Ctr. Nacional de Microelectrónica (Spain); Viorel Dragoi, EV Group (Austria); Guido Faglia, Univ. degli Studi di Brescia (Italy); Georg E. Fantner, Ecole Polytechnique Fédérale de Lausanne (Switzerland); Carles Ferrer Ramis, Univ. Autònoma de Barcelona (Spain); Pavel J. Fiala, Brno Univ. of Technology (Czech Republic); Maximilian Fleischer, Siemens AG (Germany); Friedrich Franek, Technische Univ. Wien (Austria); Sören Fricke, Robert Bosch GmbH (Germany); Gerald Gerlach, Technische Univ. Dresden (Germany); Katia M. Grenier, Ctr. National de la Recherche Scientifi que (France); Moustapha Hafez, Commissariat à l’Énergie Atomique (France); Henning Heuer, Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren (Germany); Arno C. Hoogerwerf, Ctr. Suisse d’Electronique et de Microtechnique SA (Switzerland); Jacopo Iannacci, Fondazione Bruno Kessler (Italy); Enrique Iborra, Univ. Politécnica de Madrid (Spain); Bernhard Jakoby, Johannes Kepler Univ. Linz (Austria); Konrad Kasper, Infi neon Technologies AG (Germany); Roy Knechtel, X-FAB Semiconductor Foundries AG (Germany); Andreas Kugi, Technische Univ. Wien (Austria); Robert J. Lad, Univ. of Maine (USA); Jeong-Bong Lee, The Univ. of Texas at Dallas (USA); Michael Leitner, austriamicrosystems AG (Austria); Anita Lloyd Spetz, Linköping Univ. (Sweden); Dean P. Neikirk, The Univ. of Texas at Austin (USA); Sergio P. Pacheco, Freescale Semiconductor, Inc. (USA); Erwin Peiner, Technische Univ. Braunschweig (Germany); Thilo Sauter, Austrian Academy of Sciences (Austria); Gabriele Schrag, Technische Univ. München (Germany); Andreas Schütze, Univ. des Saarlandes (Germany); Pietro Siciliano, Istituto per la Microelettronica e Microsistemi (Italy); Christos Tsamis, National Ctr. for Scientifi c Research Demokritos (Greece); Gabriel Vanko, Slovak Academy of Sciences (Slovakia); Michael J. Vellekoop, Univ. Bremen (Germany); Jürgen Wöllenstein, Fraunhofer-Institut für Physikalische Messtechnik (Germany)

This biennial conference is the sixth in series following its successful launch in 2003. Due to the interdisciplinary spirit of the event a wide range of topics is covered related to the design, fabrication, packaging and system integration of MEMS and NEMS-based sensors and actuators applying smart approaches. Furthermore, basic as well as more application-oriented research topics are addressed, thus stimulating in a cooperative atmosphere the exchange between academia and industry. Topics include, but are not limited to:

• Material research: polymers, piezoelectric materials, nitrides, shape memory alloys, thermoelectric materials, other functional thin fi lm materials, optical thin fi lms, metallic thin fi lms

• Processes and fabrication technologies for MEMS: deposition techniques, lithography, self-alignment and masking techniques, etching and ablation techniques

• Functional surfaces: hydrophobic/hydrophilic functionalisation, tribological functions, anti-adhesion, biomimetic surfaces, gecko effect

• Modelling and simulation of Microsystems from packaged systems down to device level, CAD tools

• Physical sensors, mechanical sensors, oscillators, tactile sensing

• Optical MEMS (MOEMS), RF MEMS, millimeter/submillimeter-wave and infrared devices

• Chemical and biosensors, microfl uidic devices, lab-on-chip actuators, aeroMEMS, artifi cial muscles

• Energy harvesting, low power architectures, power management, autonomous sensor nodes

• Calibration, characterisation and testing techniques

• Reliability, nanotribology, failure analysis, degradation mechanisms, life time prediction

• System integration, packaging and assembly, electronic integration, substrate technologies, metallization systems, 3D integration techniques, RFID, man-machine interface

• Applications and markets.


MicrotechnologiesVLSI Circuits and Systems (EMT102)Conference Chair: Teresa Riesgo, Univ. Politécnica de Madrid (Spain)Cochair: Massimo Conti, Univ. Politecnica delle Marche (Italy)Programme Committee: Eduard Alarcon, Univ. Politècnica de Catalunya (Spain); Marco Caldari, Korg (Italy); João Canas Ferreira, Univ. do Porto (Portugal); Marcello Coppola, STMicroelectronics (France); Eduardo de la Torre-Arnanz, Univ. Politécnica de Madrid (Spain); Valerio Frascolla, Intel GmbH (Germany); Mohammed Ismail, Khalifa Univ. of Science, Technology and Research (United Arab Emirates); George Kornaros, Technological Education Institute of Crete (Greece); Jose Francisco Lopez Feliciano, Univ. de Las Palmas de Gran Canaria (Spain); Celia López-Ongil, Univ. Carlos III de Madrid (Spain); Mar Martinez, Univ. de Cantabria (Spain); Natividad Martinez, Reutlingen Univ. (Germany); Salvador Mir, TIMA Lab. (France); Pere L. Miribel-Català, Univ. de Barcelona (Spain); Simone Orcioni, Univ. Politecnica delle Marche (Italy); Ioannis Papaefstathiou, Technical Univ. of Crete (Greece); Jorge Portilla, Univ. Politécnica de Madrid (Spain); Franco Ripa, Korg (Italy); Ángel B. Rodríguez-Vázquez, Univ. de Sevilla (Spain); Ruben Salvador, Univ. Politécnica de Madrid (Spain); Sergio Saponara, Univ. di Pisa (Italy); Roberto Sarmiento Rodríguez, Univ. de Las Palmas de Gran Canaria (Spain); Ralf Seepold, Hochschule Konstanz (Germany); Walter Stechele, Technische Univ. München (Germany); Christian Stehno, CoSynth GmbH & Co. KG (Germany); Fabian Vargas, Pontifi cia Univ. do Rio Grande do Sul (Brazil); Alisson Vasconcelos de Brito, Univ. Federal da Paraíba (Brazil)

This conference will foster cross-fertilization by bringing together researchers from different as-pects of the VLSI area, from devices to systems, from design methods to applications, from basic technologies to emerging ones. Topics include, but are not limited to:

VLSI Systems• digital and analog signal processors and

cores; digital arithmetic; digital fi lters; memories; energy- and temperature-aware systems

Modeling and Simulation• system simulation; signal integrity; analog

and RF modeling and simulation; mixed-signal and multilevel simulation; device and block modeling; interconnect; packaging; power modeling; non-ideal scaling of device parasitics and supply/threshold voltages; process variation

CAD Tools and Design Methodologies• system level design; Verifi cation

methodologies; analog, RF- and mixed signal design; physical design; design languages; design for manufacturability; heterogeneous SoC integration; design of multicore systems, system of systems; system virtualization

Test• test generation; SoCs, MCMs, SiPS, boards,

heterogeneous systems; analog and mixed-signal test, RF testing; fault modeling and defect analysis; test metrics; on-line testing; design-for-testability; BIST; diagnosis and repair; industrial test case-studies; self-healing, self-diagnostics

Systems on Chip• FPGAs & reconfi gurable systems, SoPCs,

on-chip interconnects, networks on chip, platform-based design, reliability, many-cores; energy-on chip; adaptive chips

Analog Circuit Design• amplifi ers; continuous time and discrete-time

fi lters; data converters; nonlinear circuits; low-power and low-voltage circuit techniques; analog front-ends for RF

Circuits and Systems for Communications• transceiver architectures; switching; backplane

design; circuit design for wireless; RF design: antennas, power amplifi ers, digital radio; HW for wireless sensor networks

Multimedia Systems and Applications• image and video processing; architectures

for real-time multimedia-specifi c embedded systems; multimedia applications; adaptable multimedia; hyperspectral multimedia

Technology Directions• deep submicron; compound semiconductor

technologies and systems; emerging technologies; process integration; chip packaging; mixed systems; sensors and sensor interfaces; power devices

Emerging Technologies and Applications• 3D structures, SiP, dependable systems,

evolvable hardware, energy harvesting and storage for VLSI

• solid-state lighting, ICT for health, ageing well, inclusion and governance, smart energy grids, electro-mobility.


Call for Papers Bio-MEMS and Medical Microdevices (EMT103)Conference Chair: Aggeliki Tserepi, National Ctr. for Scientifi c Research Demokritos (Greece)Cochairs: Manuel Delgado-Restituto, Instituto de Microelectrónica de Sevilla (Spain); Eleni Makarona, National Ctr. for Scientifi c Research Demokritos (Greece)Programme Committee: Ryan C. Bailey, Univ. of Illinois at Urbana-Champaign (USA); Ricardo A. Carmona-Galán, IMSE-CNM (Spain); Gert Cauwenberghs, Univ. of California, San Diego (USA); Nikos Chronis, Univ. of Michigan (USA); Jens Ducree, Dublin City Univ. (Ireland); Artur Dybko, Warsaw Univ. of Technology (Poland); Laura M. Lechuga, Ctr. d’ Investigacions en Nanociència i Nanotecnologia (Spain); Konstantinos Misiakos, National Ctr. for Scientifi c Research Demokritos (Greece); Ioannis Raptis, National Ctr. for Scientifi c Research Demokritos (Greece); Niclas Roxhed, Royal Institute of Technology (Sweden); Ramón Ruiz-Merino, Univ. Politécnica de Cartagena (Spain); Josep Samitier Martí, Univ. de Barcelona (Spain); Winnie E. Svendsen, Technical Univ. of Denmark (Denmark); Sabeth Verpoorte, Univ. of Groningen (Netherlands); Fernando Vidal-Verdú, Univ. de Málaga (Spain); Jean-Louis Viovy, Institut Curie (France)

The development of a human-oriented intelligent environment, and, in particular, of medical micro-devices and micro-implants for patient monitoring, early disease diagnosis or illness control, smart drug delivery, individualized treatment, and other aids for citizens with health concerns, relies upon the evolution of micro- and nano-sensors, actua-tors, and microfl uidics, embedded in integrated Bio-MEMS and LoC devices. In this fi eld, a synergy covering applied physics, engineering, electronics, biochemistry, medicine and neuroscience, is the most promising approach in areas such as sensor array systems, bioinspired sensory processing, neural and cognition systems implementation, biomimetics, microfl uidics, biosensors, chips for genomics and proteomics and smart materials for medical applications.

This conference is intended to bring together experts in different disciplines, linked by the strong motivation of contributing to this multidisciplinary fi eld.

• Bio-MEMs technologies• Biomaterials• Biosensors (optical, electrical, mechanical, ...) • Microfl uidics• Readout electronics for biosensing systems • DNA and protein microarrays • Lab-on-chip, μTAS• Drug delivery microsystems• Implantable electronics• Neural Interfaces• Bio-inspired systems for medical applications• Wearable biomedical electronics• Wireless technology for medical devices• System integration and packaging

Critical DatesAbstract Due Date: 5 November 2012

Manuscript Due Date: 29 March 2013Please Note: Submissions imply the intent of at least one author to register, attend the conference, present the paper as scheduled, and submit a full-length manuscript for publication in the conference proceedings.


MicrotechnologiesNanotechnology (EMT104)Conference Chair: Rainer Adelung, Christian-Albrechts-Univ. zu Kiel (Germany)Cochair: Ion M. Tiginyanu, Academy of Sciences of Moldova (Moldova)Programme Committee: Mircea Dragoman, National Institute for Research and Development in Microtechnologies (Romania); Sergey V. Gaponenko, B.I. Stepanov Institute of Physics (Belarus); Jan Linnros, Royal Institute of Technology (Sweden); James Lloyd-Hughes, Univ. of Oxford (United Kingdom); Hidenori Mimura, Shizuoka Univ. (Japan); Hadis Morkoç, Virginia Commonwealth Univ. (USA); Kornelius Nielsch, Univ. Hamburg (Germany); Thierry Pauporté, Ecole Nationale Supérieure de Chimie de Paris (France); Andrei Sarua, Univ. of Bristol (United Kingdom); Marion A. Stevens-Kalceff, The Univ. of New South Wales (Australia); Anatoly V. Zayats, King’s College London (United Kingdom)

Solutions for energy storage problems, electronics, photonics, or health care are based on Nanotech-nology as an enabling technology. The conference aims towards bringing together scientists covering the full range from basic research to applications and from all disciplines of natural sciences and engineering dealing with nanotechnology. Special emphasis should be given on research, technolo-gies and techniques that address latest trends in electronics and energy, photonics, mechanics, and biomedicine as well as nanostructure fabrication and integration routes in general. The conference covers, but is not limited to the following areas of research:

Nanofabrication, Integration and Materials Novel bottom-up and top-down techniques and their combination like micro nano integration, self-assembly based fabrication techniques, template techniques or novel self-organization and assem-bling strategies, including 3D nanostructures and composites. Nanomaterials including nanopar-ticles, nanowires, nanotubes, nano-scale building blocks, and integration on chip.

Nanostructured Electrodes, Nanosensors, Nanoelectronics, and Energy Systems Electronics utilizing the high surface to volume ratio, new sensing approaches, battery electrodes, super capacitors, energy harvesting, graphene and other one-atom or few-atom-thick sheet materials, carbon nanotubes, molecular electronics, single (few) charge effects, spintronics, plasmonics, magnonics, phononics, electronics etc.

Nanophotonics Single and few photon sources/detectors, near-field optics, nanophotonics and plasmonics, optical properties of low-dimensional structures, including metallo-dielectric periodic or quasi-periodic structures, new concepts for waveguiding etc. considering also nanofabrication techniques.

NanomechanicsNEMS employing thin fi lms, nanowires, nanotubes, nanocrystals, ultrathin membranes, nanocom-posite materials, piezoelectric materials in NEMS applications, hierarchical structures and artifi cially fabricated systems.

Nano BiomedicineBioinspired nanotechnologies and nanomaterials, nanostructured materials in regenerative medicine, nanomaterials for drug delivery, sensing, diagnos-tics, imaging, etc. The focus of the contribution should be as well set on the nanoscopic aspects.


Call for Papers Integrated Photonics: Materials, Devices, and Applications (EMT105)Conference Chair: Jean-Marc Fédéli, CEA-LETI (France)Cochairs: Laurent Vivien, Institut d’Électronique Fondamentale (France); Meint K. Smit, Technische Univ. Eindhoven (Netherlands)Program Committee: Pavel Cheben, National Research Council Canada (Canada); Iñgo M. Fernandez, Univ. de Málaga (Spain); Patrice Féron, Ecole Nationale Supérieure des Sciences Appliquées et de Technologie (France); Norbert Grote, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany); Giovanni Isella, Lab. for Epitaxial Nanostructures on Silicon and Spintronics (Italy); Erich Kasper, Univ. Stuttgart (Germany); Andrea I. Melloni, Politecnico di Milano (Italy); Lorenzo Pavesi, Univ. degli Studi di Trento (Italy); Richard V. Penty, Univ. of Cambridge (United Kingdom); Andrew W. Poon, Hong Kong Univ. of Science and Technology (Hong Kong, China); Günther Roelkens, Univ. Gent (Belgium); Kazumi Wada, The Univ. of Tokyo (Japan)

Photonics is having a tremendous impact on hu-man beings and their environment, spanning a wide range of applications such as communica-tions, diagnostics, displays, ranging, sensing, and storage. Recent advances in the development of new integrated photonic materials, devices, sys-tems, and techniques, especially those related to microtechnologies and nanotechnologies suggest that, these areas will play an increasingly important role in the future. The aim of this conference will be to bring together research scientists and engineers, who work on the different aspects of this fascinating field--and thus to provide an interdisciplinary update and review of innovations in integrated photonic materials, devices, systems, and their applications. The scope of the conference will include microtechnological and nanotechnologi-cal manufacturing advances, as well as work on theoretical, numerical, and experimental tools that support and enable these innovations. The conference includes, but is not limited to, the following topics:

• All optical signal processing, advanced signal processing

• Displays in 2D and 3D • Optical MEMS• Integrated photonics, silicon photonics and

InP photonics • Plasmonic devices• Laser material synthesis and processing, laser-

induced fabrication of photonic materials • Photonic materials, devices, and systems for

communication, sensing, biomedicine and environment

• Linear lightwave circuits, planar lightwave circuits (PLCs), volumetric lightwave circuits (VLCs)

• Microcavities, microresonators, photonic atoms, and photonic molecules

• Microwave photonics • Nanophotonics, nanostructured materials,

devices, and systems • Organic, semiconductor, and hybrid photonic

materials, devices, and systems • Photonic bandgap materials, photonic crystal • THz photonics, longwave infrared optics (LIO).

Helping engineers and scientists stay current and competitive


Submission of Abstract

By submitting an abstract, I agree to the following conditions:An author or coauthor (including keynote, invited, oral, and poster presenters) will:• Register at the reduced author registration rate

(current SPIE Members receive an additional discount on the registration fee).

• Attend the meeting. • Make the presentation as scheduled in the

program. • Submit a full-length manuscript (6 pages mini-

mum) for publication in the SPIE Digital Library, Proceedings of SPIE, and CD-ROM compila-tions.

• Obtain funding for their registration fees, travel, and accommodations, independent of SPIE, through their sponsoring organizations.

• Ensure that all clearances, including government and company clearance, have been obtained to present and publish. If you are a DoD contractor in the USA, allow at least 60 days for clearance.

Submit an abstract and summary

Browse to locate the conference to which you are submitting at:

www.spie.org/mtcall

Once you choose a conference and click “submit an abstract”, you will be prompted to sign in to the MySPIE system. If you have a MySPIE account, sign in using your username and password. First-time us-ers of MySPIE can create a new account by clicking on the “create new account link”.• Please submit a 300-word text abstract for

technical review purposes that is suitable for publication. SPIE is authorized to circulate your abstract to conference committee members for review and selection purposes.

• Please also submit a 300-word text summary suitable for early release. If accepted, this sum-mary text will be published prior to the meeting in the online or printed programs promoting the conference.

• Only original material should be submitted. • Abstracts should contain enough detail to clearly

convey the approach and the results of the research.

• Commercial papers, papers with no new re-search/development content, and papers where supporting data or a technical description can-not be given for proprietary reasons will not be accepted for presentation in this conference.

• Please do not submit the same, or similar, ab-stracts to multiple conferences.

Review, Notifi cation, and Program Placement Information• To ensure a high-quality conference, all sub-

missions will be assessed by the Conference Chair/Editor for technical merit and suitability of content.

• Conference Chair/Editors reserve the right to reject for presentation any paper that does not meet content or presentation expectations.

• The contact author will receive notifi cation of acceptance and presentation details by e-mail no later than 18 January 2013.

• Final placement in an oral or poster session is subject to the Chairs’ discretion.

Proceedings of SPIE and SPIE Digital Library Information • Conference Chair/Editors may require manu-

script revision before approving publication and reserve the right to reject for publication any paper that does not meet acceptable standards for a scientifi c publication.

• Conference Chair/Editors’ decisions on whether to allow publication of a manuscript is fi nal.

• Manuscript instructions are available from the “Author/Presenter Information” link on the conference website.

• Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license.

• Only papers presented at the conference and received according to publication guidelines and timelines will be published in the conference Proceedings of SPIE and SPIE Digital Library.

• SPIE partners with relevant scientifi c databases to enable researchers to fi nd the papers in the Proceedings of SPIE easily. The databases that abstract and index these papers include Astrophysical Data System (ADS), Chemical Abstracts (relevant content), Compendex, CrossRef, Current Contents, DeepDyve, Google Scholar, Inspec, Portico, Scopus, SPIN, and Web of Science Conference Proceedings Cita-tion Index.

Critical DatesAbstract Due Date: 5 November 2012

Manuscript Due Date: 29 March 2013Please Note: Submissions imply the intent of at least one author to register, attend the conference, present the paper as scheduled, and submit a full-length manuscript for publication in the conference proceedings.

Grenoble is at the heart of the Rhône-Alps region in southeast France. Located near three Alpine mountain chains, it is a crossroads between northern and southern Europe.

Read the Call for Papers and take the fi rst step towards submitting an abstract today. The website has everything you need to know about the meeting—up-to-date call information, author and presenter instructions to develop a successful presentation and manuscript for publication in the Proceedings of SPIE and the SPIE Digital Library. Also fi nd information about hotel, travel, and registration.

www.spie.org/mtcallSubmit your abstract by 5 November 2012

Plan to attend SPIE Microtechnologies

2013 in Grenoble

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Technologies - SPIE