Signal Integrity Advantages of HDI Advantages of HDI ... · HDI's ADVANTAGES Signal Integrity Components Materials ... High Speed Optical Network for Multiple Airborne ... Õ5. 3G

Signal Integrity Signal Integrity Advantages of HDI Advantages of HDI

TechnologyTechnologyby

Happy Holden / Westwood/NanYa&

Dr. Eric Bogatin / GigaTest Labs

Copyright 2001 Westwood Associates

Overview

HDI Design & PerformanceShorter Interconnects

HDI Dielectrics

VIP & Surface Gnd Planes

Fine-pitch Components

Case Study on HDI Advantage

Dr. Eric Bogatin-GigaTest Labs


The Design Challenge for

High Performance

HDI's ADVANTAGES

Signal IntegrityComponentsMaterialsStackupAssembly

Lower CostsLower Costs Reduces Layers Higher Density At A Lower Cost

Reduces Size

Ease of Use For BGAs

Improved MechanicalsImproved Mechanicals

For Advanced PackagesFor Advanced Packages Required for Flip Chip

Higher Layout Efficiency

Essential for Chip Scale Packages

Faster Time To MarketFaster Time To Market

Performance ImprovementsPerformance Improvements

Improved Reliability

Product Miniturization

Increased Thermal Efficiency

Faster Layouts

Lower RFI / EMI Improved Signal Integrity

Increased Wiring Density


HDI features Signal quality

Cross talk

Switching Noise

EMI

Short interconnect lengths X X

Low dielectric constant X X

Small vias and small features X X

Vias in pads X

Fine lines and thin dielectric X X X

Support for fine-pitch components

X X

HDI Features and SI Problems

They Help Solve

Reduction of noiseReflectionsCrosstalkSimultaneous switchingEMI reductionImproved signal propagation and lower attenuation


New HDI Via Structures

Via-In-Pad

Coincident vias

Adjacent vias

Inset vias


before after

Via-In-Pad Area Reduction

40% reduction in area, 33% reduction in layers


before after

Via-In-Pad Area Reduction


HDI Material Options

Uni-directional Glass

Non-woven PTFE

Woven Glass

Reinforced Non-Reinforced

PhotoimageableNon-Photoimageable

Resin Coated

Cu-Foil

Dry film or Liquid Dielectric

Foil-based

Dry Film

Liquid Non-woven Aramid

Material Options by Reinforcement


Microvias-HDI's Primary Feature

3 mil blind via inPo lym ide·

drilled through copper/dielectric with UV-YAG

ITRI Project Sample

CO2 lasered cavity

Plasma via in RCC

Photodielectric via

CO2 lasered blind via


Advantages Planes on Outerlayers

conventional TH (pads and lines on OL):

power plane

component

pads on Outerlayer

ground plane

loop area is size of componentbreakout & stackup

power plane

loop area is size of component, pad and blind via

component

pads on Outerlayer

VIP, planes on Outerlayer:

ground plane

shielding for RFI (radio frequency interference) because of stripline structurecontrolled impedance on all signal layers possible→→you can put 1 signal layer or 2 perpendicular signal layers between 2 planesdecreased loop area→→improved RFI performance


Ground Loops:Thruvias Vs Microvias

Micro-via, outer layer ground/pads

Conventional inner layer ground


676 Pin, 1.0 mm pitch BGA

Support for Fine-Pitch

(d) IPC Type II stackup, 1 + N + 1 w/variable depth vias

232 Pin, 0.65 mm pitch BGA

384 Pin, 0.8mm Pitch BGA

(d) IPC Type II stackup, 1 + N + 1 w/ stacked vias and variable depth vias


PCB Paradigm Switch

Application: High Speed Optical Network for Multiple Airborne Computers, 10 Gb/sec

11.75" x 8.75" (2-up on panel)0.092", FR-4, controlled impedance18 Layer- 8 signal1410 parts10530 leads102 leads/sq.in6560 lin. inches17% layout eff. 8.3 in. per sq. in per layer5/5, 12,568 @ 13/25 (trace/space, holes/lands)

The "old" paradigm: Through-HolesSize:Thickness:Layer:No. of Components:No of Connections:Assy Density:Wiring Length:Layout efficiency:Design rules:

9.2" x 6.3" (4-up on panel)0.072", Low Dk and Dj, controlled impedance10 Layer (1+8+1)- 6 signal1621 parts12456 leads216 leads/sq.in6028 lin. inches42% layout eff. 18.6 in. per sq.in. per layer5/7, 13,000 @ 6/12 & 4356 @ 13/25 (trace/space, uvia/land & bur via/land

The "new" paradigm: Microvias - HDISize:Thickness:Layer:No. of Components:No of Connections:Assy Density:Wiring Length:Layout efficiency:Design Rules:


New 10 Layer HDI Multilayer

1+8+1, 0.062", 9.2" x 6.3"



Replaces a 18 Layer, 0.092", 11.0" x 8.0"



1. SMT/GND2. Sig_1/PWR3. Sig_24. PWR5. Sig_36. Sig_47. PWR8. Sig_59. Sig_6/PWR10. SMT/GND

35% smaller, 44% fewer layers, 33% thinner,10% more components , 25% shorter design time

AND 43% less expensive

9. PWR10. PWR11. GND

14. GND

Sig

1. SMT2.GND3. Sig _14. Sig _25. GND6. Sig _37. Sig _48. GND

12. Sig _513. Sig _6

15. Sig _716. _817. GND18. SMT

10 Layer1621 parts12456 leads216 leads/sq.in6028 lin. inches42% layout eff.

18 Layer1410 parts10530 leads120 leads/sq.in6560 lin. inches28% layout eff.


Additional Information

Copy of the paper and EMC slides are available on the IEEE Web site,

www.ieee.org/RMCEMC

or

my FTP Box

atftp://[email protected] (passwd:memory) [MS Internet Exployer]

ftp://user17:[email protected]/users/user17/ [Netscape]

see the "FTP Table of Contents.xls"

Documents

Signal Integrity Advantages of HDI Advantages of HDI ... · HDI's ADVANTAGES Signal Integrity Components Materials ... High Speed Optical Network for Multiple Airborne ... Õ5. 3G