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DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information. Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology. MiCS-5524 SGX Sensortech DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information. Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology. Structure Analysis Report

SGX Sensortech - UPYUNew-doc.b0.upaiyun.com/FreeReport/MiCS-5524.pdf · Decap Image Rh1. Rs1. Rs2. Rh2. Rs: sensor resistance. Rh: heater resistance. 11. Market Analysis Package Overview

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Page 1: SGX Sensortech - UPYUNew-doc.b0.upaiyun.com/FreeReport/MiCS-5524.pdf · Decap Image Rh1. Rs1. Rs2. Rh2. Rs: sensor resistance. Rh: heater resistance. 11. Market Analysis Package Overview

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information.Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology.

MiCS-5524

SGX Sensortech

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trade mark or service marks of their respective owners. All analysis is done without participation, authorization, or endorsement of the manufacturer. Ewise Technology extends no warranties with respect to any information in this document, and shall bear no liability what so ever for the use of the information.Copyright © 2014, Ewise Technology. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Ewise Technology.

Structure Analysis Report

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MiCS-5524

The MiCS-5524 is a robust MEMS sensor for indoor carbon monoxide and natural gas

leakage detection; suitable also for indoor air quality monitoring; breath checker and

early fire detection.

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

更改为所做项目对应机器的规格参数描述文档 字体:微软雅黑12号

SGX Sensortech

SGX Sensortech Limited is a manufacturer and research company of sensors and detec

tors for Industrial Safety, Environmental Monitoring and Materials Analysis. It is headq

uartered in High Wycombe, United Kingdom with research and manufacturing sites in

High Wycombe and Chelmsford in the United Kingdom and Neuchatel in Switzerland.

SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

SGX Sensortech Product

Automotive & Indoor Air

Quality

Industrial Air Quality

X-ray detector

SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Manufacture Part number Type Package Gas Type Feature

SGX Sensortech MiCS-5524 Gas Sensor SMD7x5x2.25mm

CO/H2/VOC• 32mA heater current• Maximum heater power dissipation 88mW• For harsh environments

SGX Sensortech MiCS-5914 Gas Sensor SMD7x5x1.55mm NH3 • 30mA heater current

• High resistance to shocks and vibrations

Cambridge CMOS Sensors CCS801 Gas Sensor SMD

2x3x0.9mm CO/VOC• Ultra-low power consumption for battery

operated devices • High sensitivity and fast heating times

Micronas GAS 8616B Gas Sensor QFN206 ×8×1.4 mm

NO2/NH3/H2/VOC

• Two independent gas sensor units• Low cross-sensitivities• Low current consumption (<10 μA) • Long product life time (>10 years)

Gas Sensor in the Marketing

SGX Sensortech Introduction SGX Sensortech Products Sensor Comparison

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Part Number MiCS-5524

Manufacturer SGX Sensortech

Description CO/VOC Sensor IC

Package Type SMD

Package Size 7x5x2.25mm

Die Mark BF2b MICS 09

Die Size 1.86x1.67mm

Sensor Type Resistance

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Top Bottom Side Decap

Package top image

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Top Bottom Side Decap

Index Mark

Rs1

Rh1

Rh2

Rs2

Package bottom image

Rs: sensor resistance

Rh: heater resistance

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Top Bottom Side Decap

Side Image

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Top Bottom Side Decap

Decap Image

Rs1Rh1

Rh2Rs2

Rs: sensor resistance

Rh: heater resistance

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Sensor Photo Remove Cover

Sensor Top and SizeTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Sensor Bottom and Size

Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Sensor Mark Photo 1BF2b

Sensor Mark Photo 2MICS 09

Die Mark

Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Function Layout

RH1 RH2

RS2

RS1

Tungsten Oxide Sensor Resistor

Poly Heater Resistor

Sensor Photo Remove CoverTop Image ︱ Bottom Image ︱ Die Mark ︱ Functional Layout

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Remove CoverTop Image ︱ Sensor Center

Sensor Photo Remove Cover

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

SizeTop Image ︱ Sensor Center

Sensor Photo Remove Cover

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Silicon Substrate Poly Resistor Tungsten oxideGolden Pad

175µm

250µm

375µ

m

Die Cross-Section Diagram

Die Cross-Section Diagram Cut1 Cut2 Cut3

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Die Cross-Section Cut1

Die Cross-Section Diagram Cut1 Cut2 Cut3

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Poly Resistor

Silicon Oxide

Golden Wire

Silicon Oxide

Silicon Oxide

Poly Resistor

Die Cross-Section Cut2

Die Cross-Section Diagram Cut1 Cut2 Cut3

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

Die Cross-Section Cut3

Die Cross-Section Diagram Cut1 Cut2 Cut3

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Market Analysis Die Information Major Findings Package Overview

SGX SensortechMiCS-5524

Device Summary Structure Analysis

MiCS-5525 is CO/VOC sensor for harsh environments. The device

integrates resistor heater and resistor sensor(page 14).

The resistor heater is polysilicon resistor and resistor sensor material is

tungsten oxide(page 17).

Pad bonding line is Au(page 17).