1
)ATENT$ LIMITING THE LOSS OF TIN THROUGH OXIDATION IN TIN OR TIN ALLOY ELECTROPLATING BATH SOLUTIONS US 2003226759 (Shipley Co. LLC) Levy, P.R.; Brown, N.D. Solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, optionally a salt thereof, the acid selected from the group consisting of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combina- tion thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxi- dation of divalent tin ions. TIN PLATING METHOD US 2003226758 (Shipley Co LLC) Egli, A. Tin deposits with greatly reduced whisker forma- tion are claimed. PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZING US 2003226620 Viotto, E.; Barlow, A. PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOB HIGH PRODUCTIVITY CARBURIZING US 2003226619 Viotto, E.; Barlow, A.R. SELECTIVE NITRIDE: OXIDE ANiSOTROPIC ETCH PROCESS US 6656375 (IBM) Malinowski, J.C.; NG Hung, Y. ELECTROLYTIC BATH FOB THE ELECTRODEPOSlTION OF NOBLE METALS AND THEIR ALLOYS WO 2004001101 (Milano Politecnico) Bestetto, M.; CavalIotti, P.L. et al. Bath for the electrodeposition of noble metals, of their alloys, with or without tin. Bath comprises: noble metal sources; halides; stabilizing additives; thiourea; acids. SPUTTER TARGET MONITORING SYSTEM WO 2004001094 (Tosoh SMD Inc.) Wickersham, C.E., Jr.; Poole, J.E. ABRASION-RESISTANT MATERIAL COMPOSITE WIRE FOR ARC THERMAL SPRAYING WO 2004001089 (Ebara Corp.) Nakahama, S.; Nagasaka H. THERMOPLASTIC ELASTOMER BONDED DIRECTLY TO METAL SUBSTRATE WO 03106169 (Dow Global Technologies Inc.) Fox, R.; Peterson, C.E. RADIAL PULSED ARC DISCHARGE GUN FOR SYNTHESIZING NANOPOWDERS WO 03106094 (Nanotechnologies Inc.) Jackson, D.K,; Schrodel; K.A. a conventional fine metal powder, has a narrow par- ticle diameter distribution and is free of an impuri- ty, at a lower cost on a large scale with safety. METALLIZED PARTS MADE FROM PLASTIC MATERIAL WO 03105548 (Frarnatome Connectors Int.) Fares-Karam, A. TIN PLATING METHOD US 2003226758 (Shipley Co LLC) Egli, A. Tin deposits with greatly reduced whisker forma- tion are claimed. PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZING US 2003226620 Viotto, E.; Barlow, A. PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZlNG US 2003226619 Viotto, E.; Barlow, A.R. SELECTIVE NITRIDE: OXIDE ANISOTROPIC ETCH PROCESS US 6656375 (IBM) Malinowski, J.C.; NG Hung, Y. ELECTROLYTIC BATH FOR THE ELECTRODEPOSITION OF NOBLE MnALS AND THEIR ALLOYS WO 2004001101 (Milano Politecnico) Bestetto, M.; Cavallotti, P.L. et al. Bath for the electrodeposition of noble metals, of their alloys, with or without tin. Bath comprises: noble metal sources; halides; stabilizing additives; thiourea; acids. April 2004 71

Selective nitride: Oxide anisotropic etch process

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Page 1: Selective nitride: Oxide anisotropic etch process

)ATENT$

LIMITING THE LOSS OF TIN THROUGH OXIDATION IN TIN OR TIN ALLOY ELECTROPLATING BATH SOLUTIONS US 2003226759 (Shipley Co. LLC) Levy, P.R.; Brown, N.D. Solution for use in the electroplating of tin and tin alloys comprising a basis solution comprising an acid, opt ional ly a sal t thereof, the acid selected from the group consis t ing of fluoboric acid, an organic sulfonic acid, a mineral acid, or a combina- tion thereof; divalent tin ions; and an antioxidant comprising a hydroxy benzene sulfonic acid or salt thereof, in an amount effective to prevent the oxi- dation of divalent tin ions.

TIN PLATING METHOD US 2003226758 (Shipley Co LLC) Egli, A. Tin deposits with greatly reduced whisker forma- tion are claimed.

PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZING US 2003226620 Viotto, E.; Barlow, A.

PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOB HIGH PRODUCTIVITY CARBURIZING US 2003226619 Viotto, E.; Barlow, A.R.

SELECTIVE NITRIDE: OXIDE ANiSOTROPIC ETCH PROCESS US 6656375 (IBM) Malinowski, J.C.; NG Hung, Y.

ELECTROLYTIC BATH FOB THE ELECTRODEPOSlTION OF NOBLE METALS AND THEIR ALLOYS WO 2004001101 (Milano Politecnico) Bestetto, M.; CavalIotti, P.L. et al. Bath for the electrodeposition of noble metals, of their alloys, with or without tin. Bath comprises: noble metal sources; halides; stabilizing additives; thiourea; acids.

SPUTTER TARGET MONITORING SYSTEM WO 2004001094 (Tosoh SMD Inc.) Wickersham, C.E., Jr.; Poole, J.E.

ABRASION-RESISTANT MATERIAL COMPOSITE WIRE FOR ARC THERMAL SPRAYING WO 2004001089 (Ebara Corp.)

Nakahama, S.; Nagasaka H.

THERMOPLASTIC ELASTOMER BONDED DIRECTLY TO METAL SUBSTRATE WO 03106169 (Dow Global Technologies Inc.) Fox, R.; Peterson, C.E.

RADIAL PULSED ARC DISCHARGE GUN FOR SYNTHESIZING NANOPOWDERS WO 03106094 (Nanotechnologies Inc.) Jackson, D.K,; Schrodel; K.A. a conventional fine metal powder, has a narrow par- ticle diameter distribution and is free of an impuri- ty, at a lower cost on a large scale with safety.

METALLIZED PARTS MADE FROM PLASTIC MATERIAL WO 03105548 (Frarnatome Connectors Int.) Fares-Karam, A.

TIN PLATING METHOD US 2003226758 (Shipley Co LLC) Egli, A. Tin deposits with greatly reduced whisker forma- tion are claimed.

PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZING US 2003226620 Viotto, E.; Barlow, A.

PROCESS AND APPARATUS FOR PRODUCING ATMOSPHERES FOR HIGH PRODUCTIVITY CARBURIZlNG US 2003226619 Viotto, E.; Barlow, A.R.

SELECTIVE NITRIDE: OXIDE ANISOTROPIC ETCH PROCESS US 6656375 (IBM) Malinowski, J.C.; NG Hung, Y.

ELECTROLYTIC BATH FOR THE ELECTRODEPOSITION OF NOBLE MnALS AND THEIR ALLOYS WO 2004001101 (Milano Politecnico) Bestetto, M.; Cavallotti, P.L. et al. Bath for the electrodeposition of noble metals, of their alloys, with or without tin. Bath comprises: noble metal sources; halides; stabilizing additives; thiourea; acids.

April 2004 71