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9165050193270814thAveOaklandCA94606
OVERVIEWMydutiesentailsemiconductorprocessengineering,electricalengineering,computerprogrammingandfieldengineering.Ihavedevelopedhighvolumemanufacturingwaferdicingprocesses;contributedcost-savingelectronicandsoftwaredesignchanges;addedimprovementsandfixesinanewprogramminglanguage;updatedcompanyknowledgebasefornewproductsandsoftware;andtraveledforcapitalequipmentsale,training,andon-sitecustomerservice.Ioffertheinitiativetotakeonavarietyofchallengesandtheskilltocompletethemwithahighdegreeofsuccess.EXPERIENCEDynatex International: 05/14 – Present
i. Process Engineering • Lead laser processing engineer: wafer cleaving to produce atomically flat mirror facets of edge emitting lasers;
bar-to-chip dicing; InP, GaAs, GaN processes • Scribe and break of: laser diode; Vertical-Cavity Surface-Emitting Laser (VCSEL); photodiode; MEMS wafers • Development of high throughput and yield processes using Statistical Process Control (SPC), data analysis and
Failure Mode and Effects Analysis (FMEA) ii. Computer Programming • C# software development of User Interface (UI) for servo control; quality assurance (QA) testing; source control • Microcontroller scripting for servo monitoring and movement • Microsoft Office: Excel; Word; PowerPoint
iii. Electrical Engineering • Analog and digital noise reduction to improve tool performance Engineering Change Order (ECO) • Implemented hardware and software backwards compatibility • Testing via Design of Experiments (DOE)
iv. Field Engineering • International & domestic training and installation • Maintenance, repair and tuning of digital and analog servo systems EDUCATIONUniversityofCalifornia,LosAngeles(UCLA)B.S.ElectricalEngineering:SemiconductorDeviceFabricationandPhysics
i. Microfabrication: • Surface and Bulk Micromachining
§ Photolithography: positive and negative photoresist spin-coating and development § Wet chemical etching § Dry etching: plasma asher; reactive ion etch (RIE) § Metal deposition by electroplating and e-beam evaporation; sonication lift-off
• Soft Lithography of microfluidic channels ii. Nanofabrication • Quantum-Dot (QD) Solar Cells: GaSb QD’s in GaAs p-i-n junction
§ Research of increased infrared absorption in QDSC vs control cells § Testing & characterizing QD devices with probe station & LabView § Device simulation using PC1D and Silvaco software
• Nano-imprint Lithography for metal deposition patterning • Au Nanoparticle Self-Assembly synthesized through redox reaction; surfactant treatment for gene delivery • Electron Beam Lithography with modified SEM to write line widths of ~20 nm
iii. Device Simulation • CMOS and MOSFET simulation using TSUPREM4 and Medici with various doping profiles
iv. Characterization Techniques • Atomic Force Microscopy (AFM); Scanning Electron Microscopy (SEM); Confocal Microscopy
v. Additional Upper Level Coursework • Theory of photonic devices • Theory of plasma electronics • Introduction to quantum mechanics
