Rail-to-Rail Input/Output, 10MHz Op Amps · Rail-to-Rail Input/Output, 10 MHz Op Amps. MCP6021/2/3/4 DS21685B-page 2 2003 Microchip Technology Inc. ... a stress rating only and functional

2003 Microchip Technology Inc. DS21685B-page 1

M MCP6021/2/3/4

Features• Rail-to-Rail Input/Output• Wide Bandwidth: 10 MHz (typ.)• Low Noise: 8.7 nV/√Hz, at 10 kHz (typ.)• Low Offset Voltage:

- Industrial Temperature: ±500 µV (max.)- Extended Temperature: ±250 µV (max.)

• Mid-Supply VREF: MCP6021 and MCP6023• Low Supply Current: 1 mA (typ.)• Total Harmonic Distortion: 0.00053% (typ., G = 1)• Unity Gain Stable• Power Supply Range: 2.5V to 5.5V• Temperature Range:

- Industrial: -40°C to +85°C- Extended: -40°C to +125°C

Typical Applications• Automotive• Driving A/D Converters• Multi-Pole Active Filters• Barcode Scanners• Audio Processing• Communications• DAC Buffer• Test Equipment• Medical Instrumentation

Available Tools• SPICE Macro Model (at www.microchip.com)• FilterLab® software (at www.microchip.com)

DescriptionThe MCP6021, MCP6022, MCP6023 and MCP6024from Microchip Technology Inc. are rail-to-rail input andoutput op amps with high performance. Keyspecifications include: wide bandwidth (10 MHz), lownoise (8.7 nV/√Hz), low input offset voltage and lowdistortion (0.00053% THD+N). These features makethese op amps well suited for applications requiringhigh performance and bandwidth. The MCP6023 alsooffers a chip select pin (CS) that gives power savingswhen the part is not in use.The single MCP6021, single MCP6023 and dualMCP6022 are available in standard 8-lead PDIP, SOICand TSSOP. The quad MCP6024 is offered in 14-leadPDIP, SOIC and TSSOP packages.The MCP6021/2/3/4 family is available in the Industrialand Extended temperature ranges. It has a powersupply range of 2.5V to 5.5V.

PACKAGE TYPESMCP6021

PDIP SOIC, TSSOP

1234

8765

NCVDDVOUTVREF

NCVIN–VIN+VSS

MCP6022PDIP SOIC, TSSOP

1234

8765

CSVDDVOUTVREF

NCVIN–VIN+VSS


1234

8765

VDDVOUTBVINB–VINB+

VOUTAVINA–VINA+

VSS


1234

VOUTDVIND–VIND+VSS

VOUTAVINA–VINA+

VDDVINC+VINC–VOUTC

567

VINB+VINB–

VOUTB

141312111098

Rail-to-Rail Input/Output, 10 MHz Op Amps

MCP6021/2/3/4

DS21685B-page 2 2003 Microchip Technology Inc.

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †VDD - VSS .........................................................................7.0VAll Inputs and Outputs..................... VSS - 0.3V to VDD + 0.3VDifference Input Voltage ....................................... |VDD - VSS|Output Short Circuit Current ..................................continuousCurrent at Input Pins ....................................................±2 mACurrent at Output and Supply Pins ............................±30 mAStorage Temperature ....................................-65°C to +150°CJunction Temperature..................................................+150°CESD Protection on all pins (HBM/MM) ................ ≥2 kV / 200V† Notice: Stresses above those listed under “MaximumRatings” may cause permanent damage to the device. This isa stress rating only and functional operation of the device atthose or any other conditions above those indicated in theoperational listings of this specification is not implied. Expo-sure to maximum rating conditions for extended periods mayaffect device reliability.

Pin Function Table

Name Function

VIN+, VINA+, VINB+, VINC+, VIND+ Non-inverting Inputs

VIN–, VINA–, VINB–, VINC–, VIND– Inverting Inputs

VDD Positive Power Supply

VSS Negative Power Supply

CS Chip Select

VREF Reference Voltage

VOUT, VOUTA, VOUTB, VOUTC, VOUTD

Outputs

NC No Internal Connection

DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2 and RL = 10 kΩ to VDD/2.

Parameters Sym Min Typ Max Units Conditions

Input OffsetInput Offset Voltage:

Industrial Temperature Parts VOS -500 — +500 µV VCM = 0VExtended Temperature Parts VOS -250 — +250 µV VCM = 0V, VDD = 5.0VExtended Temperature Parts VOS -2.5 — +2.5 mV VCM = 0V, VDD = 5.0V

TA = -40°C to +125°CInput Offset Voltage Temperature Drift ∆VOS/∆TA — ±3.5 — µV/°C TA = -40°C to +125°CPower Supply Rejection Ratio PSRR 74 90 — dB VCM = 0VInput Current and ImpedanceInput Bias Current IB — 1 — pA

Industrial Temperature Parts IB — 30 150 pA TA = +85°CExtended Temperature Parts IB — 640 5,000 pA TA = +125°C

Input Offset Current IOS — ±1 — pACommon-Mode Input Impedance ZCM — 1013||6 — Ω||pFDifferential Input Impedance ZDIFF — 1013||3 — Ω||pFCommon-ModeCommon-Mode Input Range VCMR VSS-0.3 — VDD+0.3 VCommon-Mode Rejection Ratio CMRR 74 90 — dB VDD = 5V, VCM = -0.3V to 5.3V

CMRR 70 85 — dB VDD = 5V, VCM = 3.0V to 5.3VCMRR 74 90 — dB VDD = 5V, VCM = -0.3V to 3.0V

Voltage Reference (MCP6021 and MCP6023 only)VREF Accuracy (VREF - VDD/2) ∆VREF -50 — +50 mVVREF Temperature Drift ∆VREF/∆T

A

— ±100 — µV/°C TA = -40°C to +125°C

Open Loop GainDC Open Loop Gain (Large Signal) AOL 90 110 — dB VCM = 0V,

VOUT = VSS+0.3V to VDD-0.3V


MCP6021/2/3/4

AC CHARACTERISTICS

MCP6023 CHIP SELECT (CS) CHARACTERISTICS

OutputMaximum Output Voltage Swing VOL, VOH VSS+15 — VDD-20 mV 0.5V output overdriveOutput Short Circuit Current ISC — ±30 — mAPower SupplySupply Voltage VS 2.5 — 5.5 VQuiescent Current per Amplifier IQ 0.5 1.0 1.35 mA IO = 0

Electrical Specifications: Unless otherwise indicated, TA = 25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, RL = 10 kΩ to VDD/2 and CL = 60 pF.


AC ResponseGain Bandwidth Product GBWP — 10 — MHzPhase Margin at Unity-Gain PM — 65 — ° G = 1Settling Time, 0.2% tSETTLE — 250 — ns G = 1, VOUT = 100 mVp-p

Slew Rate SR — 7.0 — V/µsTotal Harmonic Distortion Plus Noisef = 1 kHz, G = 1 THD+N — 0.00053 — % VOUT = 0.25V + 3.25V, BW = 22 kHzf = 1 kHz, G = 1, RL = 600Ω@1 KHz THD+N — 0.00064 — % VOUT = 0.25V + 3.25V, BW = 22 kHzf = 1 kHz, G = +1 V/V THD+N — 0.0014 — % VOUT = 4VP-P, VDD = 5.0V, BW = 22 kHzf = 1 kHz, G = +10 V/V THD+N — 0.0009 — % VOUT = 4VP-P, VDD = 5.0V, BW = 22 kHzf = 1 kHz, G = +100 V/V THD+N — 0.005 — % VOUT = 4VP-P, VDD = 5.0V, BW = 22 kHzNoiseInput Voltage Noise Eni — 2.9 — µVp-p f = 0.1 Hz to 10 HzInput Voltage Noise Density eni — 8.7 — nV/√Hz f = 10 kHzInput Current Noise Density ini — 3 — fA/√Hz f = 1 kHz

Electrical Specifications: Unless otherwise indicated, TA = 25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2, RL = 10 kΩ to VDD/2 and CL = 60 pF.


DC CharacteristicsCS Logic Threshold, Low VIL 0 — 0.2VDD V

CS Input Current, Low ICSL -1.0 0.01 — µA CS = VSS

CS Logic Threshold, High VIH 0.8VDD — VDD V

CS Input Current, High ICSH — 0.01 2.0 µA CS = VDD

CS Input High, GND Current ISS — 0.05 2.0 µA CS = VDD

Amplifier Output Leakage — — 0.01 — µA CS = VDD

TimingCS Low to Amplifier Output Turn-on Time

tON — 2 10 µs G = 1, VIN = VSS, CS = 0.2VDD to VOUT = 0.45VDD time

CS High to Amplifier Output High-Z Turn-off Time

tOFF — 0.01 — µs G = 1, VIN = VSS, CS = 0.8VDD to VOUT = 0.05VDD time

Hysteresis VHYST — 0.6 — V Internal Switch

DC CHARACTERISTICS (CONTINUED)Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2 and RL = 10 kΩ to VDD/2.


MCP6021/2/3/4


TEMPERATURE CHARACTERISTICS

FIGURE 1-1: Timing diagram for the CS pin on the MCP6023.

Electrical Specifications: Unless otherwise indicated, VDD = +2.5V to +5.5V and VSS = GND.

Parameters Symbol Min Typ Max Units Conditions

Temperature RangesIndustrial Temperature Range TA -40 — +85 °CExtended Temperature Range TA -40 — +125 °COperating Temperature Range TA -40 — +125 °C Note 1Storage Temperature Range TA -65 — +150 °CThermal Package ResistancesThermal Resistance, 8L-PDIP θJA — 85 — °C/WThermal Resistance, 8L-SOIC θJA — 163 — °C/WThermal Resistance, 8L-TSSOP θJA — 124 — °C/WThermal Resistance, 14L-PDIP θJA — 70 — °C/WThermal Resistance, 14L-SOIC θJA — 120 — °C/WThermal Resistance, 14L-TSSOP θJA — 100 — °C/W

Note 1: The industrial temperature devices operate over this extended temperature range, but with reduced performance. In any case, the internal junction temperature (TJ) must not exceed the absolute maximum specification of 150°C.

Hi-Z

tON

CS

tOFF

VOUT

50 nA (typ.)

Hi-Z

ISS

ICS 10 nA (typ.) 10 nA (typ.) 10 nA (typ.)

50 nA (typ.)1 mA (typ.)

Amplifier On


MCP6021/2/3/42.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, RL = 10 kΩ to VDD/2,VOUT ≈ VDD/2 and CL = 60 pF.

FIGURE 2-1: Input Offset Voltage, (Industrial Temperature Parts).

FIGURE 2-2: Input Offset Voltage, (Extended Temperature Parts).

FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 2.5V.

FIGURE 2-4: Input Offset Voltage Drift, (Industrial Temperature Parts).

FIGURE 2-5: Input Offset Voltage Drift, (Extended Temperature Parts).

FIGURE 2-6: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 5.5V.

Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0%2%4%6%8%

10%12%14%16%

-500

-400

-300

-200

-100 0

100

200

300

400

500

Input Offset Voltage (µV)

Perc

enta

ge o

f Occ

uran

ces 1192 Samples

TA = +25°CI-TempParts

0%2%4%6%8%

10%12%14%16%18%20%22%24%

-200

-160

-120 -80

-40 0 40 80 120

160

200

Input Offset Voltage (µV)

Perc

enta

ge o

f Occ

uran

ces 438 Samples

VDD = 5.0VVCM = 0VTA = +25°C

E-TempParts

-500

-400

-300

-200

-100

0

100

200

300

400

500

-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0

Common Mode Input Voltage (V)

Inp

ut

Off

set

Vo

ltag

e (

µV

) VDD = 2.5V-40°C

+25°C

+85°C

+125°C

0%1%2%3%4%5%6%7%8%9%

10%11%12%

-12

-10 -8 -6 -4 -2 0 2 4 6 8 10 12

Input Offset Voltage Drift (µV/°C)

Perc

enta

ge o

f Occ

uran

ces 1192 Samples

TA = -40°C to +85°CI-TempParts

0%2%4%6%8%

10%12%14%16%18%20%22%24%26%

-20

-16

-12 -8 -4 0 4 8 12 16 20

Input Offset Voltage Drift (µV/°C)

Perc

enta

ge o

f Occ

uran

ces 438 Samples

VCM = 0VTA = -40°C to +125°C

E-TempParts

-500

-400

-300

-200

-100

0

100

200

300

400

500

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0


Inp

ut

Off

set

Vo

ltag

e (

µV

) VDD = 5.5V -40°C

+25°C

+85°C

+125°C

MCP6021/2/3/4



FIGURE 2-7: Input Offset Voltage vs. Temperature.

FIGURE 2-8: Input Noise Voltage Density vs. Frequency.

FIGURE 2-9: Common Mode, Power Supply Rejection Ratios vs. Frequency.

FIGURE 2-10: Input Offset Voltage vs. Output Voltage.

FIGURE 2-11: Input Noise Voltage Density vs. Common Mode Input Voltage.

FIGURE 2-12: Common Mode, Power Supply Rejection Ratios vs. Temperature.

-300

-250

-200

-150

-100

-50

0

50

100

-50 -25 0 25 50 75 100 125

Ambient Temperature (°C)

Inp

ut

Off

set

Vo

ltag

e (

µV

)

VDD = 5.0V

VCM = 0V

1

10

100

1,000

1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06

Frequency (Hz)

Inp

ut

No

ise V

olt

ag

e D

en

sit

y

(nV

/H

z)

0.1 1 10 100 1k 10k 1M100k

20

30

40

50

60

70

80

90

100

1.E+02 1.E+03 1.E+04 1.E+05 1.E+06

Frequency (Hz)

CM

RR

, P

SR

R (

dB

)

PSRR-

PSRR+

CMRR

100 1k 10k 100k 1M

-200

-150

-100

-50

0

50

100

150

200

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Output Voltage (V)

Inp

ut

Off

set

Vo

ltag

e (

µV

)

VDD = 5.5V

VCM = VDD/2

VDD = 2.5V

0

2

4

6

8

10

12

14

16

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0


Inp

ut

No

ise V

olt

ag

e D

en

sit

y

(nV

/H

z)

f = 1 kHz

VDD = 5.0V

70

75

80

85

90

95

100

105

110

-50 -25 0 25 50 75 100 125


PS

RR

, C

MR

R (

dB

)

PSRR (VCM = 0V)

CMRR


MCP6021/2/3/4Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, RL = 10 kΩ to VDD/2,VOUT ≈ VDD/2 and CL = 60 pF.

FIGURE 2-13: Input Bias, Offset Currents vs. Common Mode Input Voltage.

FIGURE 2-14: Quiescent Current vs. Supply Voltage.

FIGURE 2-15: Output Short-Circuit Current vs. Supply Voltage.

FIGURE 2-16: Input Bias, Offset Currents vs. Temperature.

FIGURE 2-17: Quiescent Current vs. Temperature.

FIGURE 2-18: Open-Loop Gain, Phase vs. Frequency.

1

10

100

1,000

10,000

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5


Inp

ut

Bia

s, O

ffset

Cu

rren

ts (

pA

)

IB, TA = +125°CVDD = 5.5V

IOS, TA = +85°C

IOS, TA = +125°C

IB, TA = +85°C

0.00.10.20.30.40.50.60.70.80.91.01.11.2

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Power Supply Voltage (V)

Qu

iescen

t C

urr

en

t

(mA

/am

plifi

er)

+125°C

+85°C

+25°C

-40°C

0

5

10

15

20

25

30

35

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Supply Voltage (V)

Ou

tpu

t S

ho

rt C

ircu

it C

urr

en

t

(mA

)

+125°C

+85°C

+25°C

-40°C

1

10

100

1,000

10,000

25 35 45 55 65 75 85 95 105 115 125


Inp

ut

Bia

s, O

ffset

Cu

rren

ts (

pA

)

IB

VCM = VDD

VDD = 5.5V

IOS

0.00.10.20.30.40.50.60.70.80.91.01.11.2

-50 -25 0 25 50 75 100 125


Qu

iescen

t C

urr

en

t

(mA

/am

plifi

er)

VDD = 5.5V

VDD = 2.5V

VCM = VDD - 0.5V

-20-10

0102030405060708090

100110120

1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08

Frequency (Hz)

Op

en

-Lo

op

Gain

(d

B)

-210-195-180-165-150-135-120-105-90-75-60-45-30-150

Op

en

-Lo

op

Ph

ase (

°)

Gain

Phase

1 10010 1k 100k10k 1M 100M10M

MCP6021/2/3/4



FIGURE 2-19: DC Open-Loop Gain vs. Load Resistance.

FIGURE 2-20: Small Signal DC Open-Loop Gain vs. Output Voltage Headroom.

FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Temperature.

FIGURE 2-22: DC Open-Loop Gain vs. Temperature.

FIGURE 2-23: Gain Bandwidth Product, Phase Margin vs. Common Mode Input Voltage.

FIGURE 2-24: Gain Bandwidth Product, Phase Margin vs. Output Voltage.

80

90

100

110

120

130

1.E+02 1.E+03 1.E+04 1.E+05

Load Resistance ( )

DC

Op

en

-Lo

op

Gain

(d

B) VDD = 5.5V

VDD = 2.5V

100 1k 10k 100k

70

80

90

100

110

120

0.00 0.05 0.10 0.15 0.20 0.25 0.30

Output Voltage Headroom (V);

VDD - VOH or VOL - VSS

DC

Op

en

-Lo

op

Gain

(d

B) VCM = VDD/2

VDD = 2.5V

VDD = 5.5V

0

1

2

3

4

5

6

7

8

9

10

-50 -25 0 25 50 75 100 125


Gain

Ban

dw

idth

Pro

du

ct

(MH

z)

0

10

20

30

40

50

60

70

80

90

100

Ph

ase M

arg

in, G

= +

1 (

°)

GBWP, VDD = 5.5V

GBWP, VDD = 2.5V

PM, VDD = 2.5V

PM, VDD = 5.5V

90

95

100

105

110

115

120

-50 -25 0 25 50 75 100 125


DC

Op

en

-Lo

op

Gain

(d

B)

VDD = 5.5V

VDD = 2.5V

0

2

4

6

8

10

12

14

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0


Gain

Ban

dw

idth

Pro

du

ct

(MH

z)

0

15

30

45

60

75

90

105

Ph

ase M

arg

in, G

= +

1 (

°)Gain Bandwidth Product

Phase Margin, G = +1

VDD = 5.0V

0

2

4

6

8

10

12

14

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Output Voltage (V)

Gain

Ban

dw

idth

Pro

du

ct

(MH

z)

0

15

30

45

60

75

90

105

Ph

ase M

arg

in, G

= +

1 (

°)Gain Bandwidth Product

Phase Margin, G = +1

VDD = 5.0V

VCM = VDD/2



FIGURE 2-25: Slew Rate vs. Temperature.

FIGURE 2-26: Total Harmonic Distortion plus Noise vs. Output Voltage with f = 1 kHz.

FIGURE 2-27: The MCP6021/2/3/4 family shows no phase reversal under overdrive.

FIGURE 2-28: Maximum Output Voltage Swing vs. Frequency.

FIGURE 2-29: Total Harmonic Distortion plus Noise vs. Output Voltage with f = 20 kHz.

FIGURE 2-30: Channel-to-Channel Separation vs. Frequency (MCP6022 and MCP6024 only).

0

1

2

3

4

5

6

7

8

9

10

11

-50 -25 0 25 50 75 100 125


Sle

w R

ate

(V

/µs)

Falling, VDD = 2.5V

Rising, VDD = 2.5V

Falling, VDD = 5.5V

Rising, VDD = 5.5V

0.0001%

0.0010%

0.0100%

0.1000%

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0Output Voltage (VP-P)

TH

D+

N (

%)

f = 1 kHz

BWMeas = 22 kHz

VDD = 5.0V

G = +1 V/V

G = +10 V/V

G = +100 V/V

-1

0

1

2

3

4

5

6

0.0E+00 1.0E-05 2.0E-05 3.0E-05 4.0E-05 5.0E-05 6.0E-05 7.0E-05 8.0E-05 9.0E-05 1.0E-04

Time (10 µs/div)

Inp

ut,

Ou

tpu

t V

olt

ag

e (

V)

VDD = 5V

G = +1 V/V

VIN

VOUT

0.1

1

10

1.E+04 1.E+05 1.E+06 1.E+07

Frequency (Hz)

Maxim

um

Ou

tpu

t V

olt

ag

e

Sw

ing

(V

P-P

)

VDD = 5.5V

10k 100k 1M 10M

VDD = 2.5V

0.0001%

0.0010%

0.0100%

0.1000%

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Output Voltage (VP-P)

TH

D+

N (

%) G = +10 V/V

f = 20 kHz

BWMeas = 80 kHz

VDD = 5.0V

G = +1 V/V

G = +100 V/V

105

110

115

120

125

130

135

1.E+03 1.E+04 1.E+05 1.E+06

Frequency (Hz)

Ch

an

nel to

Ch

an

nel S

ep

ara

tio

n

(dB

)

1k 1M100k10k

G = +1 V/V

MCP6021/2/3/4



FIGURE 2-31: Output Voltage Headroom vs. Output Current.

FIGURE 2-32: Small-Signal Non-inverting Pulse Response.

FIGURE 2-33: Large-Signal Non-inverting Pulse Response.

FIGURE 2-34: Output Voltage Headroom vs. Temperature.

FIGURE 2-35: Small-Signal Inverting Pulse Response.

FIGURE 2-36: Large-Signal Inverting Pulse Response.

1

10

100

1,000

0.01 0.1 1 10

Output Current Magnitude (mA)

Ou

tpu

t V

olt

ag

e H

ead

roo

m;

VD

D-V

OH o

r V

OL-V

SS (

mV

)

VDD - VOH

VOL - VSS

-6.E-02

-5.E-02

-4.E-02

-3.E-02

-2.E-02

-1.E-02

0.E+00

1.E-02

2.E-02

3.E-02

4.E-02

5.E-02

6.E-02

0.E+00 2.E-07 4.E-07 6.E-07 8.E-07 1.E-06 1.E-06 1.E-06 2.E-06 2.E-06 2.E-06

Time (200 ns/div)

Ou

tpu

t V

olt

ag

e (

10 m

V/d

iv)

G = +1 V/V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.E+00 5.E-07 1.E-06 2.E-06 2.E-06 3.E-06 3.E-06 4.E-06 4.E-06 5.E-06 5.E-06

Time (500 ns/div)

Ou

tpu

t V

olt

ag

e (

V)

G = +1 V/V

0

1

2

3

4

5

6

7

8

9

10

-50 -25 0 25 50 75 100 125


Ou

tpu

t V

olt

ag

e H

ead

roo

m

VD

D-V

OH o

r V

OL-V

SS (

mV

)

VDD - VOH

VOL - VSS

-6.E-02

-5.E-02

-4.E-02

-3.E-02

-2.E-02

-1.E-02

0.E+00

1.E-02

2.E-02

3.E-02

4.E-02

5.E-02

6.E-02

0.E+00 2.E-07 4.E-07 6.E-07 8.E-07 1.E-06 1.E-06 1.E-06 2.E-06 2.E-06 2.E-06

Time (200 ns/div)

Ou

tpu

t V

olt

ag

e (

10 m

V/d

iv)

G = -1 V/V

RF = 1 k

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.E+00 5.E-07 1.E-06 2.E-06 2.E-06 3.E-06 3.E-06 4.E-06 4.E-06 5.E-06 5.E-06

Time (500 ns/div)

Ou

tpu

t V

olt

ag

e (

V)

G = -1 V/V

RF = 1 k



FIGURE 2-37: VREF Accuracy vs. Supply Voltage (MCP6021 and MCP6023 only).

FIGURE 2-38: Chip Select (CS) Hysteresis (MCP6023 only) with VDD = 2.5V.

FIGURE 2-39: Chip Select (CS) to Amplifier Output Response Time (MCP6023 only).

FIGURE 2-40: VREF Accuracy vs. Temperature (MCP6021 and MCP6023 only).

FIGURE 2-41: Chip Select (CS) Hysteresis (MCP6023 only) with VDD = 5.5V.

-50

-40

-30

-20

-10

0

10

20

30

40

50

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Power Supply Voltage (V)

VR

EF A

ccu

racy;

VR

EF-V

DD/2

(m

V)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.0 0.5 1.0 1.5 2.0 2.5

Chip Select Voltage (V)

Qu

iescen

t C

urr

en

t

(mA

/am

plifi

er)

Op Amp

shuts off here

Op Amp

turns on here

Hysteresis

VDD = 2.5V

G = +1 V/V

VIN = 1.25V

CS swept

low to high

CS swept

high to low

-0.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

0.0E+00 5.0E-06 1.0E-05 1.5E-05 2.0E-05 2.5E-05 3.0E-05 3.5E-05

Time (5 µs/div)

Ch

ip S

ele

ct

Vo

ltag

e,

Ou

tpu

t V

olt

ag

e (

V)

Output High-Z

VDD = 5.0V

G = +1 V/V

VIN = VSS

Output

on

Output

on

VOUT

CS Voltage

-50

-40

-30

-20

-10

0

10

20

30

40

50

-50 -25 0 25 50 75 100 125


VR

EF A

ccu

racy;

VR

EF-V

DD/2

(m

V)

VDD = 5.5V

VDD = 2.5V

Representative Part

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

Chip Select Voltage (V)

Qu

iescen

t C

urr

en

t

(mA

/am

plifi

er)

Op Amp

shuts off here

Op Amp

turns on here

Hysteresis

CS swept

high to lowCS swept

low to highVDD = 5.5V

G = +1 V/V

VIN = 2.75V

MCP6021/2/3/4


3.0 APPLICATIONS INFORMATIONThe MCP6021/2/3/4 family of operational amplifiersare fabricated on Microchip’s state-of-the-art CMOSprocess. They are unity-gain stable and suitable for awide range of general-purpose applications.

3.1 Rail-to-Rail InputThe MCP6021/2/3/4 amplifier family is designed to notexhibit phase inversion when the input pins exceed thesupply voltages. Figure 2-27 shows an input voltageexceeding both supplies with no resulting phaseinversion.

The input stage of the MCP6021/2/3/4 family of devicesuses two differential input stages in parallel; oneoperates at low common-mode input voltage (VCM),while the other operates at high VCM. With this topology,the device operates with VCM up to 0.3V past eithersupply rail (VSS - 0.3V to VDD + 0.3V) at 25°C. Theamplifier input behaves linearly as long as VCM is keptwithin the specified VCMR limits. The input offset voltageis measured at both VCM = VSS - 0.3V and VDD + 0.3Vto ensure proper operation.

Input voltages that exceed the input voltage range(VCMR) can cause excessive current to flow in or out ofthe input pins. Current beyond ±2 mA introducespossible reliability problems. Thus, applications thatexceed this rating must externally limit the input currentwith an input resistor (RIN), as shown in Figure 3-1.

FIGURE 3-1: RIN limits the current flow into an input pin.

3.2 Rail-to-Rail OutputThe Maximum Output Voltage Swing is the maximumswing possible under a particular output load.According to the specification table, the output canreach within 20 mV of either supply rail whenRL = 10 kΩ. See Figure 2-31 and Figure 2-34 for moreinformation concerning typical performance.

3.3 MCP6023 Chip Select (CS)The MCP6023 is a single amplifier with chip select(CS). When CS is high, the supply current is less than10 nA (typ) and travels from the CS pin to VSS, with theamplifier output being put into a high-impedance state.When CS is low, the amplifier is enabled. If CS is leftfloating, the amplifier will not operate properly.Figure 1-1 and Figure 2-39 show the output voltageand supply current response to a CS pulse.

3.4 MCP6021 and MCP6023 Reference Voltage

The single op amps (MCP6021 and MCP6023) havean internal mid-supply reference voltage connected tothe VREF pin (see Figure 3-2). The MCP6021 has CSinternally tied to VSS, which always keeps the op ampon and always provides a mid-supply reference. Withthe MCP6023, taking the CS pin high conserves powerby shutting down both the op amp and the VREFcircuitry. Taking the CS pin low turns on the op amp andVREF circuitry.

FIGURE 3-2: Simplified internal VREF circuit (MCP6021 and MCP6023 only).See Figure 3-3 for a non-inverting gain circuit using theinternal mid-supply reference. The DC-blockingcapacitor (CB) also reduces noise by coupling the opamp input to the source.

FIGURE 3-3: Non-inverting gain circuit using VREF (MCP6021 and MCP6023 only).

VIN

RINVOUTMCP602X

RIN ≥(Maximum expected VIN) - VDD

2 mA

RIN ≥VSS - (Minimum expected VIN)

2 mA

VDD

VSS

VREF

CS

50 kΩ

50 kΩ

(CS tied internally to VSS for MCP6021)

VIN

RG RF

VOUTCB VREF


MCP6021/2/3/4To use the internal mid-supply reference for aninverting gain circuit, connect the VREF pin to the non-inverting input, as shown in Figure 3-4. The capacitorCB helps reduce power supply noise on the output.

FIGURE 3-4: Inverting gain circuit using VREF (MCP6021 and MCP6023 only).If you don’t need the mid-supply reference, leave theVREF pin open.

3.5 Capacitive LoadsDriving large capacitive loads can cause stabilityproblems for voltage feedback op amps. As the loadcapacitance increases, the feedback loop’s phasemargin decreases, and the closed loop bandwidth isreduced. This produces gain-peaking in the frequencyresponse, with overshoot and ringing in the stepresponse.When driving large capacitive loads with these opamps (e.g., > 60 pF when G = +1), a small seriesresistor at the output (RISO in Figure 3-5) improves thefeedback loop’s phase margin (stability) by making theload resistive at higher frequencies. The bandwidth willbe generally lower than the bandwidth with nocapacitive load.

FIGURE 3-5: Output resistor RISO stabilizes large capacitive loads.Figure 3-6 gives recommended RISO values fordifferent capacitive laods and gains. The x-axis is thenormalized load capacitance (CL/GN), where GN is thecircuit’s noise gain. For non-inverting gains, GN and thegain are equal. For inverting gains, GN is 1+|Gain| (e.g.,-1 V/V gives GN = +2 V/V).

FIGURE 3-6: Recommended RISO values for capacitive loads.After selecting RISO for your circuit, double-check theresulting frequency response peaking and stepresponse overshoot. Evaluation on the bench andsimulations with the MCP6021/2/3/4 Spice macromodel are very helpful. Modify RISO’s value until theresponse is reasonable.

3.6 Supply BypassWith this family of operational amplifiers, the powersupply pin (VDD for single supply) should have a localbypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mmfor good, high-frequency performance. It also needs abulk capacitor (i.e., 1 µF or larger) within 100 mm toprovide large, slow currents. This bulk capacitor can beshared with other parts.

3.7 PCB Surface LeakageIn applications where low input bias current is critical,PCB (printed circuit board) surface-leakage effectsneed to be considered. Surface leakage is caused byhumidity, dust or other contamination on the board.Under low humidity conditions, a typical resistancebetween nearby traces is 1012Ω. A 5V difference wouldcause 5 pA of current to flow, which is greater than theMCP6021/2/3/4 family’s bias current at 25°C (1 pA,typ).The easiest way to reduce surface leakage is to use aguard ring around sensitive pins (or traces). The guardring is biased at the same voltage as the sensitive pin.An example of this type of layout is shown in Figure 3-7.

FIGURE 3-7: Example guard ring layout.

VIN

RG RFVOUT

VREF

CB

VIN

MCP602XRISO

VOUT

CL

10

100

1,000

10 100 1,000 10,000

Normalized Capacitance; CL/GN (pF)

Reco

mm

en

ded

RIS

O (

) GN +1

Guard Ring VIN– VIN+

MCP6021/2/3/4


1. Inverting (Figure 3-7) and TransimpedanceGain Amplifiers (convert current to voltage, suchas photo detectors).a. Connect the guard ring to the non-inverting

input pin (VIN+). This biases the guard ringto the same reference voltage as the opamp’s input (e.g., VDD/2 or ground).

b. Connect the inverting pin (VIN–) to the inputwith a wire that does not touch the PCBsurface.

2. Non-inverting Gain and Unity-Gain Buffer

a. Connect the guard ring to the inverting inputpin (VIN–); this biases the guard ring to thecommon mode input voltage.

b. Connect the non-inverting pin (VIN+) to theinput with a wire that does not touch thePCB surface.

3.8 High-Speed PCB LayoutDue to their speed capabilities, a little extra care in thePCB (Printed Circuit Board) layout can make asignificant difference in the performance of these opamps. Good PC board layout techniques will help youachieve the performance shown in the ElectricalCharacteristics and Typical Performance Curves, whilealso helping you minimize EMC (Electro-MagneticCompatibility) issues.

Use a solid ground plane and connect the bypass localcapacitor(s) to this plane with minimal length traces.This cuts down inductive and capacitive crosstalk.Separate digital from analog, low-speed from high-speed and low power from high power. This will reduceinterference.Keep sensitive traces short and straight. Separatingthem from interfering components and traces. This isespecially important for high-frequency (low rise-time)signals.Sometimes it helps to place guard traces next to victimtraces. They should be on both sides of the victimtrace, and as close as possible. Connect the guardtrace to ground plane at both ends, and in the middlefor long traces.Use coax cables (or low inductance wiring) to routesignal and power to and from the PCB.

3.9 Typical Applications

3.9.1 A/D CONVERTER DRIVER AND ANTI-ALIASING FILTER

Figure 3-8 shows a third-order Butterworth filter thatcan be used as an A/D converter driver. It has a band-width of 20 kHz and a reasonable step response. It willwork well for conversion rates of 80 ksps and greater (ithas 29 dB attenuation at 60 kHz).

FIGURE 3-8: A/D converter driver and anti-aliasing filter with a 20 kHz cutoff frequency.This filter can easily be adjusted to another bandwidthby multiplying all capacitors by the same factor.Alternatively, the resistors can all be scaled by anothercommon factor to adjust the bandwidth.

3.9.2 OPTICAL DETECTOR AMPLIFIERFigure 3-9 shows the MCP6021 op amp used as atransimpedance amplifier in a photo detector circuit.The photo detector looks like a capacitive currentsource, so the 100 kΩ resistor gains the input signal toa reasonable level. The 5.6 pF capacitor stabilizes thiscircuit and produces a flat frequency response with abandwidth of 370 kHz.

FIGURE 3-9: Transimpedance amplifier for an optical detector.

14.7 kΩ 33.2 kΩ

1.0 nF

100 pF

MCP602X8.45 kΩ

1.2 nF

PhotoDetector

100 pF

5.6 pF

100 kΩ

VDD/2

MCP6021


MCP6021/2/3/44.0 DESIGN TOOLSMicrochip provides the basic design tools needed forthe MCP6021/2/3/4 family of op amps.

4.1 SPICE Macro ModelThe latest SPICE macro model for the MCP6021/2/3/4op amps is available on our web site(www.microchip.com). This model is intended as aninitial design tool that works well in the op amp’s linearregion of operation at room temperature. See themodel file for information on its capabilities.

Bench testing is a very important part of any design andcannot be replaced with simulations. Also, simulationresults using this macro model need to be validated bycomparing them to the data sheet specs and plots.

4.2 FilterLab® SoftwareThe FilterLab® software is an innovative tool thatsimplifies analog active filter (using op amps) design.Available at no cost from our web site (at www.micro-chip.com), the FilterLab software active filter designtool provides full schematic diagrams of the filter circuitwith component values. It also outputs the filter circuitin SPICE format, which can be used with the MacroModel to simulate actual filter performance.

MCP6021/2/3/4


5.0 PACKAGING INFORMATION

5.1 Package Marking Information

XXXXXXXXXXXXXNNN

YYWW

8-Lead PDIP (300 mil) Example:

8-Lead SOIC (150 mil) Example:

XXXXXXXXXXXXYYWW

NNN

MCP6021I/P256

0331

MCP6021I/SN0331

256

8-Lead TSSOP Example:

XXXX

YWW

NNN

6021

E331

256

Legend: XX...X Customer specific information*Y Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line thus limiting the number of available charactersfor customer specific information.

* Standard device marking consists of Microchip part number, year code, week code, and traceabilitycode.


MCP6021/2/3/4Package Marking Information (Continued)

14-Lead PDIP (300 mil) (MCP6024) Example:

14-Lead TSSOP (MCP6024) Example:

14-Lead SOIC (150 mil) (MCP6024) Example:

XXXXXXXXXXXXXXXXXXXXXXXXXXXX

YYWWNNN

XXXXXXXXXX

YYWWNNN

XXXXXXYYWW

NNN

MCP6024-I/PXXXXXXXXXXXXXX

0331256

6024E0331

256

XXXXXXXXXXMCP6024ISL

0331256

XXXXXXXXXX

MCP6021/2/3/4


8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

B1

B

A1

A

L

A2

p

α

E

eB

β

c

E1

n

D

1

2

Units INCHES* MILLIMETERSDimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n 8 8Pitch p .100 2.54Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68Base to Seating Plane A1 .015 0.38Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60Overall Length D .360 .373 .385 9.14 9.46 9.78Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43Lead Thickness c .008 .012 .015 0.20 0.29 0.38Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78Lower Lead Width B .014 .018 .022 0.36 0.46 0.56Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92Mold Draft Angle Top α 5 10 15 5 10 15Mold Draft Angle Bottom β 5 10 15 5 10 15* Controlling Parameter

Notes:Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001Drawing No. C04-018

.010” (0.254mm) per side.

§ Significant Characteristic


MCP6021/2/3/48-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

Foot Angle φ 0 4 8 0 4 8

1512015120βMold Draft Angle Bottom1512015120αMold Draft Angle Top

0.510.420.33.020.017.013BLead Width0.250.230.20.010.009.008cLead Thickness

0.760.620.48.030.025.019LFoot Length0.510.380.25.020.015.010hChamfer Distance5.004.904.80.197.193.189DOverall Length3.993.913.71.157.154.146E1Molded Package Width6.206.025.79.244.237.228EOverall Width0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2Molded Package Thickness1.751.551.35.069.061.053AOverall Height

1.27.050pPitch88nNumber of Pins

MAXNOMMINMAXNOMMINDimension LimitsMILLIMETERSINCHES*Units

2

1

D

n

p

B

E

E1

h

Lβ

c

45°

φ

A2

α

A

A1

* Controlling Parameter

Notes:Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.JEDEC Equivalent: MS-012Drawing No. C04-057


MCP6021/2/3/4


8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)



0.700.600.50.028.024.020LFoot Length3.103.002.90.122.118.114DMolded Package Length4.504.404.30.177.173.169E1Molded Package Width6.506.386.25.256.251.246EOverall Width0.150.100.05.006.004.002A1Standoff §0.950.900.85.037.035.033A2Molded Package Thickness1.10.043AOverall Height


MAXNOMMINMAXNOMMINDimension LimitsMILLIMETERS*INCHESUnits

α

A2

A

A1

L

c

β

φ

1

2D

n

p

B

E

E1



Notes:Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side.JEDEC Equivalent: MO-153Drawing No. C04-086



MCP6021/2/3/414-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

n

D

1

2

eBβ

E

c

A

A1

B

B1

L

A2

p

α

Units INCHES* MILLIMETERSDimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n 14 14Pitch p .100 2.54Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68Base to Seating Plane A1 .015 0.38Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60Overall Length D .740 .750 .760 18.80 19.05 19.30Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43Lead Thickness c .008 .012 .015 0.20 0.29 0.38Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78Lower Lead Width B .014 .018 .022 0.36 0.46 0.56Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92Mold Draft Angle Top α 5 10 15 5 10 15

β 5 10 15 5 10 15Mold Draft Angle Bottom* Controlling Parameter



MCP6021/2/3/4


14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)




1.270.840.41.050.033.016LFoot Length0.510.380.25.020.015.010hChamfer Distance8.818.698.56.347.342.337DOverall Length3.993.903.81.157.154.150E1Molded Package Width6.205.995.79.244.236.228EOverall Width0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2Molded Package Thickness1.751.551.35.069.061.053AOverall Height


MAXNOMMINMAXNOMMINDimension LimitsMILLIMETERSINCHES*Units

2

1

D

p

nB

E

E1

h

L

c

β

45°

φ

α

A2A

A1





MCP6021/2/3/414-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

840840φFoot Angle



0.700.600.50.028.024.020LFoot Length5.105.004.90.201.197.193DMolded Package Length4.504.404.30.177.173.169E1Molded Package Width6.506.386.25.256.251.246EOverall Width0.150.100.05.006.004.002A1Standoff §0.950.900.85.037.035.033A2Molded Package Thickness1.10.043AOverall Height


MAXNOMMINMAXNOMMINDimension LimitsMILLIMETERS*INCHESUnits

Lβ

c

φ

2

1

D

nB

p

E1

E

α

A2A1

A


Notes:Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side.JEDEC Equivalent: MO-153Drawing No. C04-087


MCP6021/2/3/4


NOTES:


MCP6021/2/3/4PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

PART NO. X /XX

PackageTemperatureRange

Device

Device: MCP6021 CMOS Single Op Amp

MCP6021T CMOS Single Op Amp(Tape and Reel for SOIC, TSSOP)

MCP6022 CMOS Dual Op AmpMCP6022T CMOS Dual Op Amp

(Tape and Reel for SOIC and TSSOP)MCP6023 CMOS Single Op Amp w/ CS FunctionMCP6023T CMOS Single Op Amp w/ CS Function

(Tape and Reel for SOIC and TSSOP)MCP6024 CMOS Quad Op AmpMCP6024T CMOS Quad Op Amp

(Tape and Reel for SOIC and TSSOP)

Temperature Range: I = -40°C to +85°CE = -40×C to +125×C

Package: P = Plastic DIP (300 mil Body), 8-lead, 14-leadSN = Plastic SOIC (150mil Body), 8-leadSL = Plastic SOIC (150 mil Body), 14-leadST = Plastic TSSOP, 8-lead, 14-lead

Examples:a) MCP6021-I/P: Industrial temperature,

PDIP package.b) MCP6021-E/P: Extended temperature,

PDIP package.c) MCP6021-E/SN: Extended temperature,

SOIC package.

a) MCP6022-I/P: Industrial temperature,PDIP package.

b) MCP6022-E/P: Extended temperature,PDIP package.

c) MCP6022T-E/ST: Tape and Reel,Extended temperature,TSSOP package.

a) MCP6023-I/P: Industrial temperature, PDIP package.

b) MCP6023-E/P: Extended temperature, PDIP package.

c) MCP6023-E/SN: Extended temperature,SOIC package.

a) MCP6024-I/SL: Industrial temperature,SOIC package.

b) MCP6024-E/SL: Extended temperature,SOIC package.

c) MCP6024T-E/ST: Tape and Reel,Extended temperature,TSSOP package.

Data SheetsProducts supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-72773. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification SystemRegister on our web site (www.microchip.com/cn) to receive the most current information on our products.

MCP6021/2/3/4


NOTES:


Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as critical com-ponents in life support systems is not authorized except withexpress written approval by Microchip. No licenses are con-veyed, implicitly or otherwise, under any intellectual propertyrights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks ofMicrochip Technology Incorporated in the U.S.A. and othercountries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,SEEVAL and The Embedded Control Solutions Company areregistered trademarks of Microchip Technology Incorporatedin the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort,Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,SmartSensor, SmartShunt, SmartTel and Total Endurance aretrademarks of Microchip Technology Incorporated in theU.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service markof Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of theirrespective companies.

© 2003, Microchip Technology Incorporated, Printed in theU.S.A., All Rights Reserved.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.


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07/28/03

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Documents

Rail-to-Rail Input/Output, 10MHz Op Amps · Rail-to-Rail Input/Output, 10 MHz Op Amps. MCP6021/2/3/4 DS21685B-page 2 2003 Microchip Technology Inc. ... a stress rating only and functional