PVD e MOCVD

Manuel José Andrade RomeroDilson Silva dos Santos

UFRJ-HydroQuebec

PVD e MOCVD

Figura 7. Esquema de: (a) a estrutura cristalina de γ'-Fe4N mostrando duas células unitárias [21]; (b) distribuição de fases dentro de um caso nitrided em aço e acompanhado concentração profundidade de azoto.

http://www.cimm.com.br/portal/material_didatico/6376-descricao-dos-processos-de-revestimento-por-adicao-de-camadas#.VijVE36rSM8

f

http://bookos-z1.org/s/?q=Physical+Vapor+Deposition+%28PVD%29+&t=0

PVD

http://bookos-z1.org/book/1011213/6d0689

http://bookos-z1.org/book/929091/b97005

http://bookos-z1.org/book/2094533/683982

http://bookos-z1.org/book/2250526/0bfec9

http://bookos-z1.org/book/1004284/be894e

http://bookos-z1.org/book/2094533/683982

http://bookos-z1.org/s/?q=Chemical+Vapor+Deposition&t=0

CVD

Basic principles of the MOCVD process

https://en.wikipedia.org/wiki/Metalorganic_vapour_phase_epitaxy


MOCVD reactor components

http://www.azonano.com/article.aspx?ArticleID=3427

Figure 1. Typical CVD Reactor.

Figure 2. General MOCVD mechanism.

http://wps.prenhall.com/wps/media/objects/3312/3391650/blb1205.html

Figure 12.35 A schematic illustration of a vacuum-deposition apparatus.

Figure 12.36 Schematic illustration of a sputtering apparatus The high voltage applied across the gas results in ionization of Ar atoms. The Ar+ ions are accelerated toward the negatively charged target. Upon impact they knock atoms of M from the surface. The M atoms travel in all directions with high kinetic energy, and some of them strike the substrate, forming a coating.

http://www.azom.com/article.aspx?ArticleID=11585

Figure 1. Close Coupled Showerhead® 55x2 inch

http://www.azom.com/article.aspx?ArticleID=11585

Figure 2. Planetary Reactor® 56x2 inch

http://www.emrl.de/r_m_6.html

Figure 1: Flow chart of the principle steps of the chemical solution deposition (CSD) method


Figure 1: Flow chart of the principle steps of the chemical solution deposition (CSD) method


Figure 2: MOCVD planetary reactor AIX-2600G3 from the Aixtron AG which can handle five 6 inch wafers simultaneously


Figure 2: MOCVD planetary reactor AIX-2600G3 from the Aixtron AG which can handle five 6 inch wafers simultaneously


Figure 2: Schematic sketch of sputtering tool and lift-off process


Figure 2: Schematic sketch of sputtering tool and lift-off process


COATINGS TECHNOLOGY HANDBOOK [Arthur_A._Tracton] (2006) Pag 234










Corrosion and corrosion control. an introduction to corrosion science and engineering R__Winston (2008) Pag 90






Handbook of chemical vapor depostion [i.e. deposition] (CVD) [Hugh_O_Pierson] (1999)Pag 89

http://www.princetonoptronics.com/technology/technology.php

Figure 2. Three common types of VCSEL diode laser structures: (a) a top-emitting structure with proton implantation to confine the current, (b) a selectively-oxidized top-emitting structure to confine the optical modes and/or the current, and (c) a mounted bottom-emitting selectively-oxidized structure.

http://graphene.nus.edu.sg/content/clean-room

Figure

http://www.aplusphysics.com/courses/honors/microe/processing.html

Figure

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PVD e MOCVD