Inspur OCP Rack Scale Server SolutionNext-Generation Open Data Center Platforms

Product Brief

High Density OCP Compute Node: ON5163M51OU 3-node, for deep learning, data analytics

High Expansion OCP Compute Node: ON5283M52OU 3-node, for data acceleration, I/O expansion

I/O Balance OCP Compute Node:ON5273M52OU 3-node with 100Gb Ethernet support, for NFV application scenarios

Management: Converged

Redfish & OpenBMC

Energy Efficiency OCP Compute Node: ON5263M52OU 3-node, flexible design for multi-workload applications

OCP Storage JBOD: ON5266M534* hard drive 2OU JBOD with NVMe SSD/HDD support

OCP AI Node: ON5488M54OU AI resource pooling solution with 16* GPU for training, or 16* FPGA for inference

High Density (ON5163M5)

High Expansion (ON5283M5)

Energy Efficiency(ON5263M5)

I/O Balance(ON5273M5)

CPU 2 x Intel® Xeon® Scalable Processor, TDP up to 165W

Chipset Intel® C622

Memory 16 x DDR4 DIMM | Support RDIMM/LRDMM/NVDIMM

Internal Storage

Front: 1 x 3.5 HDD Front: 4 x2.5 HDD Front: 2 x2.5 HDD Front: NA.

2 x M.2 SATA/PCIe x4 1 x M.2 SATA/PCIe x4

Ethernet No integrated Ethernet port | OCP 2.0 Ethernet card optional

I/O Up to 2 PCIe x16 slot (FHFL) 3 PCIe x8 slot (HHFL) 2 PCIe x16 slot (FHFL) Up to 1PCIe x16 slot (FHHL)

Dimension 830mm (L) × 537mm (W) × 95.2mm (H) 842.2mm (L) × 536.8mm (W) × 47mm (H)

Inspur OCP Compute Family

Inspur’s OCP portfolio has added 4 new configurations of compute node based on the “San Jose” Motherboard, the first OCP-accepted motherboard based on the Intel® Xeon® Scalable processor.

High Density & Excellent Performance● 4 types of mixable high-density nodes optimized for

different application scenarios

Converged Architecture● One motherboard converts 4 types of compute node for

multiple applications

Open Computing for the Hyperscale Data Center

Inspur’s OCP Standard Rack Server solution is based on advanced computing, storage and GPU nodes, optimized software management and superior resource pooling.

On top of lowering cost and raising efficiency for data centers, this solution is designed also to address growing complexities in data centers related to AI/machine learning, big data and advanced analytics, and cloud computing applications.

Inspur OCP JBOD (ON5266M5)Expander IC PM 8054

Storage Internal: 34 x 3.5”HDD (Hot plug)

I/O 1 RJ45 management port

4 x4 uplink MiniSAS HD

Chassis 889mm (L) × 537mm (W) × 94.7mm (H)

Inspur OCP AI Node (ON5488M5)CPU ATOM C3000 64bit CPU (2 cores)

Memory Single channel, 1*DDR3 or DDR3L SODIMM

Storage 1 x SATADOM, 1 x SATA port

Ethernet Integrated Ethernet GBE port

I/O 16 standard PCIe x16 slot to support 16 GPU card

2 x USB2.0 1 x VGA 1 x COM

Chassis 889mm (L) × 537mm (W) × 94.7mm (H)

Inspur OCP JBOD

With 34* hard drives and NVMe SSD/HDD support, this high-density 2OU JBOD can be used as a storage expansion module for compute nodes or as a storage pool for the entire rack with a SAS switch.

Inspur OCP AI Computing Platform

This GPU resource pooling solution delivers the highest density and performance available for AI training and inference scenarios, plus flexible GPU typologies to meet different customer demands.

Management Software

This converged OpenBMC with Redfish solution is developed specifically for Inspur OCP-certified solutions, the world’s first server solutions with a Redfish OCP Baseline profile.

High Density● 2OU 34*HDDs, improve 13% storage capacity

Flexible Architecture ● Dual Separate Storage tray, 17 drives per tray● Each tray support SATA and SSD, maintain individually

Ultra-high GPU Density● 4OU 16*GPU for training, or 16*FPGA for Inference

Optimized Architecture for AI● Accelerated training process● Improved efficiency on system computation expansion

What we did:

● OpenBMC ported to OCP Compute Node● Redfish OCP Baseline for OCP Node, industry first to pass the

dmtf redfish plugfest ● Extensions for dbus interface: asset info, fan control, user

management

www.inspursystems.com

Inspur and the Inspur logo are trademarks or registered trademarks of Inspur. Intel, the Intel logo, Xeon and Xeon inside are registered trademarks of intel Corporation in the U.S. and other countries. Other company, product, and service names may be trademarks or service marks of others © 2018 Inspur Systems, Inc. All rights reserved.

Backed by our rich history of active involvement in open design communities like ODCC and OCP, we leverage our rack-scale and open platform design experience and integration capability to develop innovative full-stack solutions for the data center.

Through joint design manufacturing, our engineers establish close engagement with the customer to gain a thorough understanding of their needs and the requirements of the industry.

Inspur has the breadth and depth of engineering expertise and manufacturing capability to quickly develop any custom project from concept to final product.

Our experience in pushing the boundaries of technology lets us design complex hardware platforms that deliver extreme features in flexible configurations for a wide variety of applications.

Why Choose Inspur? Our Strengths as a Data Center Infrastructure Partner

Open platform design expertise JDM experience and philosophy

Expertise in “extreme” designProduct development capabilities