Phased Array Olimpus

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Advanced Practical NDT Series

Advances in Phased Array

Ultrasonic Technology

Applications


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Advances in Phased ArrayUltrasonic Technology Applications


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Advanced Practical NDT Series

Advances inPhased Array UltrasonicTechnology Applications

Olympus NDT


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Advances in Phased Array Ultrasonic Technology Applications

Series coordinator: Nol Dub

Technical reviewer and adviser: Dr. Michael D. C. Moles (Olympus NDT)

Layout, graphics, editing, proofreading, and indexing: Technical Communications Service,Olympus NDT

Published by: Olympus NDT, 48 Woerd Avenue, Waltham, MA 02453, USA

Marketing and distribution: Olympus NDT

This guideline and the products and programs it describes are protected by the Copyright Act ofCanada, by laws of other countries, and by international treaties, and therefore may not be reproducedin whole or in part, whether for sale or not, without the prior written consent from Olympus NDT.Under copyright law, copying includes translation into another language or format.

The information contained in this document is subject to change or revision without notice.

R/D Tech part number: DUMG071A

2007 by Olympus NDTAll rights reserved. Published 2007.

Printed in Canada

ISBN 0-9735933-4-2

Notice

To the best of our knowledge, the information in this publication is accurate; however, the Publisherdoes not assume any responsibility or liability for the accuracy or completeness of, or consequencesarising from, such information. This book is intended for informational purposes only. Finaldetermination of the suitability of any information or product for use contemplated by any user, andthe manner of that use, is the sole responsibility of the user. The Publisher recommends that anyoneintending to rely on any recommendation of materials or procedures mentioned in this publicationshould satisfy himself or herself as to such suitability, and that he or she can meet all applicable safetyand health standards.

Trademarks

Olympus and the Olympus logo are registered trademarks of Olympus Corporation. R/D Tech, theR/D Tech logo, OmniScan, and PipeWIZARD are registered trademarks, and Innovation in NDT,Tomoscan, QuickScan, QuickView, Tomoscan FOCUS, TomoScan FOCUS LT, and TomoView aretrademarks of Olympus NDT Corporation in Canada, the United States, and/or other countries.AutoCAD is a registered trademark of Autodesk, Inc., in the USA and/or other countries. CANDU(CANada Deuterium Uranium) is a registered trademark of Atomic Energy of Canada Limited(AECL) in Canada and other countries. CompactFlash is a trademark of SanDisk Corporation, regis-tered in the United States and other countries. Cycolac and Lexan are registered trademarks of theGeneral Electric Company. Lexan is a registered trademark of General Electric Company. Hypertronicsis a trademark of Hypertronics Corporation. Imasonic is a registered trademark of Imasonic S.A.Inconel is a registered trademark of the Special Metals Corporation group of companies. Lucite is aregistered trademark of E.I. du Pont de Nemours and Company. Microsoft, Excel, Windows, and theWindows logo are registered trademarks of Microsoft Corporation in the United States and/or othercountries. Plexiglas is a registered trademark of Arkema. Polysulfone is a trademark of Union CarbideCorp. Profax is a trademark of Hercules, Inc. Rexolite is a registered trademark of C-Lec Plastics Inc.Zetec and UltraVision are registered trademarks of Zetec, Inc. Zircaloy is a trademark of Westing-house Electric Company, LLC. All other product names mentioned in this book may be trademarks orregistered trademarks of their respective owners and are hereby acknowledged.


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Table of Contents v

Table of Contents

Foreword .............................................................................................. xiii

Acknowledgements ............................................................................ xv

Introduction ............................................................................................ 11. Main Concepts of Phased Array Ultrasonic Technology ......... 5

1.1 Historical Development and Industrial Requirements .............................. 51.2 Principles ........................................................................................................... 71.3 Delay Laws, or Focal Laws ........................................................................... 141.4 Basic Scanning and Imaging ......................................................................... 181.5 Limitations and Further Development of Phased Array Ultrasonic

Technology ...................................................................................................... 22References to Chapter 1 ........................................................................................ 25

2. Scanning Patterns and Ultrasonic Views .................................. 292.1 Scanning Patterns ........................................................................................... 29

2.1.1 Linear Scan ........................................................................................... 302.1.2 Bidirectional Scan ................................................................................ 322.1.3 Unidirectional Scan ............................................................................. 322.1.4 Skewed Scan (for TomoView Software) ........................................ 332.1.5 Helicoidal Scan .................................................................................... 342.1.6 Spiral Scan ............................................................................................ 34

2.1.7 Beam Directions ................................................................................... 352.1.8 Other Scanning Patterns ..................................................................... 372.1.9 Time-Based Scanning .......................................................................... 39

2.2 Ultrasonic Views (Scans) ............................................................................... 392.2.1 A-Scan ................................................................................................... 412.2.2 B-Scan .................................................................................................... 432.2.3 C-Scan ................................................................................................... 442.2.4 D-Scan ................................................................................................... 442.2.5 S-Scan .................................................................................................... 452.2.6 Polar Views ........................................................................................... 47


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2.2.7 Strip Charts .......................................................................................... 482.2.8 Multiple Views and Layouts ............................................................. 482.2.9 Combined TOFD and Pulse Echo (PE) ............................................. 532.2.10 Combined Strip Charts ....................................................................... 532.2.11 R/D Tech TomoView Cube Views ..................................................... 54

References to Chapter 2 ........................................................................................ 56

3. Probes and Ultrasonic Field Formula ......................................... 593.1 Piezocomposite Materials ............................................................................. 59

3.1.1 Matching Layer and Cable Requirements ....................................... 603.1.2 Backing Material .................................................................................. 61

3.2 Piezocomposite Manufacture ....................................................................... 613.3 Types of Phased Array Probes for Industrial Applications ..................... 653.4 Linear Arrays .................................................................................................. 70

3.4.1 Active Aperture ................................................................................... 71

3.4.2 Effective Active Aperture ................................................................... 723.4.3 Minimum Active Aperture ................................................................ 723.4.4 Passive Aperture ................................................................................. 733.4.5 Minimum Passive Aperture ............................................................... 753.4.6 Elementary Pitch ................................................................................. 763.4.7 Element Gap ......................................................................................... 763.4.8 Element Width ..................................................................................... 763.4.9 Maximum Element Size ..................................................................... 763.4.10 Minimum Element Size ...................................................................... 763.4.11 Sweep Range ........................................................................................ 773.4.12 Steering Focus Power ......................................................................... 783.4.13 Gain Compensation ............................................................................ 793.4.14 Beam Length ........................................................................................ 803.4.15 Beam Width ......................................................................................... 803.4.16 Focal Depth .......................................................................................... 823.4.17 Depth of Field ...................................................................................... 833.4.18 Focal Range .......................................................................................... 843.4.19 Near-Surface Resolution .................................................................... 843.4.20 Far-Surface Resolution ....................................................................... 843.4.21 Axial Resolution .................................................................................. 853.4.22 Lateral Resolution ............................................................................... 863.4.23 Angular Resolution ............................................................................. 883.4.24 Main Lobe ............................................................................................ 893.4.25 Side Lobes ............................................................................................ 893.4.26 Grating Lobes ...................................................................................... 893.4.27 Beam Apodization .............................................................................. 903.4.28 Grating-Lobe Amplitude ................................................................... 90

3.5 Probe on a Wedge .......................................................................................... 923.5.1 Wedge Delay ........................................................................................ 92

3.5.2 Index-Point Length ............................................................................. 93


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3.5.3 Index-Point Migration ........................................................................ 943.6 Beam Deflection on the Wedge .................................................................... 95

3.6.1 Azimuthal Deflection ......................................................................... 953.6.2 Lateral Deflection ................................................................................ 953.6.3 Skew Deflection ................................................................................... 953.6.4 Active-Axis Offset ............................................................................... 973.6.5 Passive-Axis Offset .............................................................................. 973.6.6 Probe and Wedge on Curved Parts ................................................... 98

3.7 2-D Matrix Phased Array Probes ............................................................... 1013.8 Focal Law Calculator ................................................................................... 1033.9 Standard Array Probes ................................................................................ 1083.10 Other Array Features .................................................................................. 108

3.10.1 Sensitivity ........................................................................................... 1083.10.2 Impedance .......................................................................................... 1093.10.3 Cross Talk ........................................................................................... 109

3.10.4 Signal-to-Noise Ratio (SNR) ............................................................ 1093.10.5 Time-Frequency Response Features ............................................... 1093.11 Phased Array Simulation Software (PASS) ............................................. 1123.12 Probe Design ................................................................................................ 112

3.12.1 Physics Guidelines ............................................................................ 1133.12.2 Practical Guidelines .......................................................................... 1163.12.3 Probe Identification .......................................................................... 117

3.13 Probe Characterization and Tolerances ................................................... 1173.13.1 Probe Characterization ..................................................................... 1183.13.2 Tolerances ........................................................................................... 119

3.14 Industrial Phased Array Probes ................................................................ 1203.14.1 Olympus NDT Probes ...................................................................... 1213.14.2 Miniature and Subminiature Probes .............................................. 127

References to Chapter 3 ...................................................................................... 133

4. Instrument Features, Calibration, and Testing Methods ..... 1414.1 Instrument Performance ............................................................................. 141

4.1.1 Instrument Main Features ................................................................ 1414.2 Pulser-Receiver ............................................................................................. 142

4.2.1 Voltage ................................................................................................ 1424.2.2 Pulse Width ........................................................................................ 1444.2.3 Band-Pass Filters ............................................................................... 1444.2.4 Smoothing .......................................................................................... 145

4.3 Digitizer ......................................................................................................... 1464.3.1 Digitizing Frequency ........................................................................ 1464.3.2 Averaging ........................................................................................... 1484.3.3 Compression ...................................................................................... 1484.3.4 Recurrence or Repetition Rate (PRFPulse-Repetition

Frequency) .......................................................................................... 149

4.3.5 Acquisition Rate ................................................................................ 149


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4.3.6 Soft Gain ............................................................................................. 1524.3.7 Saturation ........................................................................................... 1534.3.8 Dynamic Depth Focusing (DDF) .................................................... 154

4.4 Instrument Calibration and Testing .......................................................... 1564.4.1 Electronic Calibration ....................................................................... 1564.4.2 Simplified Laboratory Testing ......................................................... 1614.4.3 User On-site Testing (User Level) ................................................... 1624.4.4 Tolerances on Instrument Features ................................................. 1654.4.5 Instrument Calibration and Testing Frequency ............................ 165


5. System Performance and Equipment Substitution ............... 1715.1 Calibration and Reference Blocks Used for System Evaluation ............ 171

5.1.1 Reference Blocks and Their Use for System PerformanceAssessment ......................................................................................... 175

5.1.2 Influence of Reference-Block Velocity on Crack Parameters ...... 1825.2 Influence of Probe Parameters on Detection and Sizing ........................ 1845.2.1 Influence of Damaged Elements on Detection, Crack Location, and

Height ................................................................................................. 1845.2.1.1 2-D (1.5-D) Matrix Probe (4 7) ........................................ 1845.2.1.2 1-D Linear Probe ................................................................. 185

5.2.2 Influence of Pitch Size on Beam Forming and CrackParameters .......................................................................................... 187

5.2.3 Influence of Wedge Velocity on Crack Parameters ...................... 1915.2.4 Influence of Wedge Angle on Crack Parameters .......................... 1935.2.5 Influence of First Element Height on Crack Parameters ............. 195

5.3 Optimization of System Performance ....................................................... 1975.4 Essential Variables, Equipment Substitution, and Practical

Tolerances ...................................................................................................... 2035.4.1 Essential Variables ............................................................................. 2035.4.2 Equipment Substitution and Practical Tolerances ........................ 208


6. PAUT Reliability and Its Contribution to Engineering Critical

Assessment .................................................................................... 2256.1 Living with Defects: Fitness-for-Purpose Concept and UltrasonicReliability ...................................................................................................... 225

6.2 PAUT Reliability for Crack Sizing ............................................................. 2346.3 PAUT Reliability for Crack Sizing on Bars ............................................... 2396.4 Comparing Phased Arrays with Conventional UT ................................. 2426.5 PAUT Reliability for Turbine Components .............................................. 2466.6 EPRI Performance Demonstration of PAUT on Safe Ends ISI Dissimilar

Metal Welds .................................................................................................. 2596.6.1 Automated Phased Array UT for Dissimilar Metal Welds ......... 259
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6.6.2 Dissimilar Metal-Weld Mock-ups ................................................... 2596.6.3 Examination for Circumferential Flaws ......................................... 260

6.6.3.1 Probe ..................................................................................... 2606.6.3.2 Electronic-Scan Pattern ...................................................... 2606.6.3.3 Mechanical-Scan Pattern .................................................... 260

6.6.4 Experimental Results on Depth and Length Sizing ofCircumferential Flaws ...................................................................... 262

6.6.5 Examination for Axial Flaws ........................................................... 2646.6.5.1 Probe ..................................................................................... 2646.6.5.2 Mechanical-Scan Pattern .................................................... 2646.6.5.3 Electronic-Scan Pattern ...................................................... 264

6.6.6 Experimental Results on Depth and Length Sizing of AxialFlaws ................................................................................................... 264

6.6.7 Summary ............................................................................................ 2666.7 Pipeline AUT Depth Sizing Based on Discrimination Zones ................ 266

6.7.1 Zone Discrimination ......................................................................... 2676.7.2 Calibration Blocks ............................................................................. 2686.7.3 Output Displays ................................................................................ 2696.7.4 Flaw Sizing ......................................................................................... 271

6.7.4.1 Simple-Zone Sizing ............................................................. 2716.7.4.2 Amplitude-Corrected Zone Sizing ................................... 2726.7.4.3 Amplitude-Corrected Zone Sizing with Overtrace

Allowance ............................................................................ 2726.7.4.4 Amplitude Zone Sizing with TOFD ................................. 2736.7.4.5 In Practice, How Does Pipeline AUT Sizing Work? ...... 273

6.7.5 Probability of Detection (POD) ....................................................... 2756.8 POD of Embedded Defects for PAUT on Aerospace Turbine-EngineComponents .................................................................................................. 2786.8.1 Development of POD within Aeronautics .................................... 2786.8.2 Inspection Needs for Aerospace Engine Materials ...................... 2806.8.3 Determining Inspection Reliability ................................................. 2806.8.4 POD Specimen Design ..................................................................... 282

6.8.4.1 POD Ring Specimen ........................................................... 2846.8.4.2 Synthetic Hard-Alpha Specimens .................................... 285

6.8.5 Phased Array POD Test Results ...................................................... 2866.8.5.1 Description of Ultrasonic Setup ........................................ 2866.8.5.2 Inspection Results: Wedding-Cake Specimen ................ 2876.8.5.3 Inspection Results: POD Ring Specimen with Spherical

Defects .................................................................................. 2896.8.5.4 Inspection Results: Synthetic Hard-Alpha Specimens .. 291

6.8.6 POD Analysis ..................................................................................... 2926.9 Phased Array Codes Status ........................................................................ 294

6.9.1 ASME .................................................................................................. 2956.9.2 ASTM .................................................................................................. 2966.9.3 API ....................................................................................................... 296


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6.9.4 AWS ..................................................................................................... 2966.9.5 Other Codes ....................................................................................... 297

6.10 PAUT Limitations and Summary ............................................................. 297References to Chapter 6 ...................................................................................... 304

7. Advanced Industrial Applications ........................................... 3157.1 Improved Horizontal Defect Sizing in Pipelines ..................................... 315

7.1.1 Improved Focusing for Thin-Wall Pipe ......................................... 3167.1.2 Modeling on Thin-Wall Pipe ........................................................... 3167.1.3 Thin-Wall Pipe Simulations with PASS ......................................... 317

7.1.3.1 Depth of Field ...................................................................... 3177.1.3.2 Width of Field ...................................................................... 3187.1.3.3 Thin-Wall Modeling Conclusions ..................................... 319

7.1.4 Evaluation of Cylindrically Focused Probe ................................... 3207.1.4.1 Experimental ....................................................................... 320

7.1.4.2 Wedge ................................................................................... 3207.1.4.3 Setups ................................................................................... 3207.1.5 Beam-Spread Results ........................................................................ 3217.1.6 Summary of Thin-Wall Focusing .................................................... 322

7.2 Improved Focusing for Thick-Wall Pipeline AUT .................................. 3227.2.1 Focusing Approaches on Thick-Wall Pipe ..................................... 3237.2.2 Modeling on Thick-Wall Pipe .......................................................... 3237.2.3 Thick-Wall Modeling Results Summary ........................................ 325

7.2.3.1 Array Pitch ........................................................................... 3257.2.3.2 Incident Angle ..................................................................... 3257.2.3.3 Focal Spot Size at Different Depths .................................. 3257.2.3.4 Aperture Size ....................................................................... 3257.2.3.5 Increasing the Number of Active Elements .................... 3267.2.3.6 Checking the Extreme Positions on the Array ................ 326

7.2.4 Thick-Wall General-Modeling Conclusions .................................. 3267.2.5 Instrumentation ................................................................................. 3277.2.6 Thick-Wall Pipe Experimental Results for 1.5-D Phased Array . 327

7.2.6.1 Calibration Standard .......................................................... 3277.2.6.2 1.5-D Phased Array and the Wedge ................................. 3287.2.6.3 Software ................................................................................ 328

7.2.7 Experimental Setup ........................................................................... 3287.2.7.1 Mechanics ............................................................................ 3287.2.7.2 Acoustics .............................................................................. 329

7.2.8 Beam-Spread Comparison between 1.5-D Array and 1-DArrays ................................................................................................. 330

7.2.9 Summary ............................................................................................ 3327.3 Qualification of Manual Phased Array UT for Piping ........................... 333

7.3.1 Background ........................................................................................ 3337.3.2 General Principles of the Phased Array Examination Method .. 334

7.3.3 Circumferential Flaws ...................................................................... 335


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7.3.4 Axial Flaws ......................................................................................... 3387.3.5 2-D Matrix Array Probes .................................................................. 3397.3.6 Calibration Blocks ............................................................................. 3407.3.7 Manual Pipe Scanner ........................................................................ 3407.3.8 Phased Array UT Equipment .......................................................... 3417.3.9 Phased Array UT Software .............................................................. 3427.3.10 Formal Nuclear Qualification ......................................................... 3437.3.11 Summary ............................................................................................ 344

7.4 Advanced Applications for Austenitic Steels Using TRL Probes ......... 3447.4.1 Inspecting Stainless-Steel Welds ..................................................... 3447.4.2 Piezocomposite TRL PA Principles and Design ........................... 345

7.4.2.1 Electroacoustical Design .................................................... 3477.4.2.2 Characterization and Checks ............................................ 350

7.4.3 Results on Industrial Application of Piezocomposite TRL PA for theInspection of Austenitic Steel .......................................................... 351

7.4.4 Examples of Applications ................................................................ 3527.4.4.1 Primary Circuit Nozzle ...................................................... 3527.4.4.2 Examination of Demethanizer Welds .............................. 358

7.4.5 Summary ............................................................................................ 3607.5 Low-Pressure Turbine Applications ......................................................... 360

7.5.1 PAUT Inspection of General ElectricType Disc-Blade RimAttachments ....................................................................................... 361

7.5.2 Inspection of GEC Alstom 900 MW Turbine Components ......... 3697.6 Design, Commissioning, and Production Performance of an Automated

PA System for Jet Engine Discs .................................................................. 386

7.6.1 Inspection-System Design Requirements ...................................... 3867.6.2 System Commissioning .................................................................... 3897.6.2.1 Implementation of Automated Phased Array Probe

Alignment ............................................................................ 3927.6.2.2 Automated Gain Calibration ............................................. 396

7.6.3 Performance of Industrial Systems ................................................. 3977.6.4 Aerospace POD Conclusions ........................................................... 401

7.7 Phased Array Volume Focusing Technique ............................................. 4047.7.1 Experimental Comparison between Volume Focusing and

Conventional Zone Focusing Techniques ...................................... 4057.7.2 Lateral Resolution Experiments ...................................................... 4077.7.3 Square Bar Inspections ..................................................................... 4097.7.4 Conclusions ........................................................................................ 413


Appendix A: OmniScan Calibration Techniques ........................ 417A.1 Calibration Philosophy ............................................................................... 417A.2 Calibrating OmniScan ................................................................................. 418

A.2.1 Step 1: Calibrating Sound Velocity ................................................. 418A.2.2 Step 2: Calibrating Wedge Delay .................................................... 419


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A.2.3 Step 3: Sensitivity Calibration ......................................................... 421A.2.4 Step 4: TCG (Time-Corrected Gain) ................................................ 422

A.3 Multiple-Skip Calibrations ......................................................................... 425References to Appendix A ................................................................................. 426

Appendix B: Procedures for Inspection of Welds ........................ 427B.1 Manual Inspection Procedures .................................................................. 427B.2 Codes and Calibration ................................................................................. 429

B.2.1 E-Scans ................................................................................................ 429B.2.2 S-Scans ................................................................................................ 430

B.3 Coverage ........................................................................................................ 433B.4 Scanning Procedures ................................................................................... 435B.5 S-Scan Data Interpretation .......................................................................... 435B.6 Summary of Manual and Semi-Automated Inspection Procedures0 ... 437References to Appendix B .................................................................................. 438

Appendix C: Unit Conversion ......................................................... 439

List of Figures ..................................................................................... 441

List of Tables ....................................................................................... 463

Index ..................................................................................................... 467


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Foreword xiii

Foreword

Why is Olympus NDT writing a third book on ultrasound phased array whenthe first book was published only two years ago?

There are many reasons. First, the last two years has seen an increased

interest in the technology and its real-world applications, which is evidenced by the hundreds of papers presented at recent conferences and articlespublished in trade journals. That, along with considerable advancements inhardware, software, and progress in code compliance, has resulted in widerindustry acceptance of the technology. Also, several companies now offerphased array instruments. Last, the authors have much new material as wellas previously unpublished data that they wanted to include in thisinformative third book.

Phased array has also found its way into many new markets and industries.

While many of the earlier applications originated in the nuclear industry, newapplications such as pipeline inspection, general weld integrity, in-servicecrack sizing, and aerospace fuselage inspection are becoming quite common.These applications have pushed phased array technology to new andimproved levels across the industrial spectrum: improved focusing,improved sizing, better inspections, and more challenging applications.

Code compliances are making progress also. Compared to the length of timetechniques such as TOFD (time-of-flight diffraction) became codified, phasedarray compliance has made rapid advancements, especially with ASME

(American Society of Mechanical Engineers). A new section ( 6.9) providesan update on phased array code development and its implementationworldwide. Because code development is an on-going process, please notethat this update will be dated by the time this book goes to press.

One other major requirement for phased arrays is training. Olympus NDTforesaw the need for general training several years ago and recruited well-known, innovative international training companies for the Olympus NDTTraining Academy. The Academy supplies equipment and basic coursematerial for the various training companies. In exchange, the training


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xiv Foreword

companies develop specialized courses and inspection techniques. Inaddition, these training companies work on code approvals with OlympusNDT. The Olympus NDT Web site (www.olympusndt.com) provides up-to-date course schedules and course descriptions, plus descriptions of thetraining companies we partner with.

As a growth technology, phased array technology offers great opportunitiesfor both now and the near future with significant advantages over manualultrasonics and radiography:

High speed Improved defect detection Better sizing 2-D imaging Full data storage No safety hazards No waste chemicals High repeatability

As we look into the future, new technological innovations and additionaladvances are sure to be a part of Olympus NDT. With these new advances,there is no doubt that additional books and guides will play a key roleensuring that we lead the phased array industry. Our vision is your future.

Toshihiko OkuboPresident and CEOOlympus NDT


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Acknowledgements xv

Acknowledgements

Technical Reviewers and Advisers

As before, collecting, writing, and editing a book as large as Advances inPhased Array Ultrasonic Technology Applications has proved a major effort.Contributions from many people in many countries and companies havehelped enormously.

In particular, our advisers:

Peter CiorauSenior Technical ExpertUT Phased Array Technology, Inspection and Maintenance ServicesOntario Power Generation, Canada

Nol DubFormerly V-P. of Business Development in R/D Tech and Olympus NDT

Michael MolesIndustry Manager, Olympus NDT

Major contributions and input from outside sources came from:

Vicki KrambUniversity of Dayton Research Institute (UDRI), Dayton, Ohio

Greg Selby and Doug MacDonaldEPRI, Charlotte, North Carolina, and Joint Research Center

Guy MaesZetec, Qubec

Michel DelaideVinotte International, Belgium

Mark DavisDavis NDE Inc., Birmingham, Alabama


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xvi Acknowledgements

Dominique BraconnierINDES-KJTD, Osaka, Japan

Other contributions came from Olympus NDTs associated companies:

Ed GinzelMaterials Research Institute, Waterloo, Ontario

Robert GinzelEclipse Scientific Products, Waterloo, Ontario

A special thanks to:

Wence DaksCAD WIRE, for his 3-D drawings

UDRI and the numerous collaborators

Olympus NDT Personnel

Olympus NDT wants to thank all those people who have assisted internallyin the development of hardware, software, and applications, which has madethe major advances observed in this book.

And of course, the editorial staff provided an essential contribution,

especially Franois-Charles Angers, Jean-Franois Cyr, Julia Frid, andRaymond Skilling.


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Introduction 1

Introduction

Advances in Phased Array Ultrasonic Technology Applications is published onlytwo years after our first book, Introduction to Phased Array UltrasonicTechnology Applications , and our booklet, Phased Array Technical Guidelines:Useful Formulas, Graphs, and Examples. All three books fill different needs.

Introduction to Phased Array Ultrasonic Technology Applications was designed asan entry-level book on phased arrays, with a wide spectrum of applications toillustrate the capability of the new technology.

The booklet Phased Array Technical Guidelines: Useful Formulas, Graphs, andExamples is much smaller, and is designed for the operator to carry in hispocket for in-service reference.

Advances in Phased Array Ultrasonic Technology Applications is exactly what itstitle saysa book on advanced applications. As such, the theory is moredeveloped, new illustrations are used, and several applications are describedin depth. Advances in Phased Array Ultrasonic Technology Applications gives in-depth descriptions of seven applications to the level of technical publication.Therefore, this new book will be most valuable to researchers and techniquedevelopers, though general phased array users should also benefit.

As phased array technology is used in a wide variety of industries, these newapplications address this fact. There are examples from nuclear, aerospace,pipelines, and general manufacturing. New topics, such as instrument

qualification, equipment checking, equipment substitution, and probe testingare also detailed and exemplified.

Phased array ultrasonic techniques show good reliability of the data muchneeded for engineering critical assessment. The new book has dedicated awhole chapter to this topic.

Because some people may only want to purchase the new book Advances inPhased Array Ultrasonic Technology Applications , and not previous OlympusNDT phased array publications, the new book necessarily must summarizesome of the basic theory behind industrial phased arrays.


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2 Introduction

Advances in Phased Array Ultrasonic Technology Applications includes thefollowing:

Chapter 1 introduces the history and basic physics behind industrialphased arrays. New illustrations make the concepts easier to understandon real components, and as a user-friendly life-assessment tool.

Chapter 2 defines scan patterns, again with new illustrations. Thischapter is brief because scanning is covered in the previous books:Introduction to Phased Array Ultrasonic Technology Applications and Phased Array Technical Guidelines: Useful Formulas, Graphs, and Examples.

Chapter 3 is on probes and ultrasonic formulas. While this material iscovered in the first two books, it is by necessity summarized here. Areformatted and re-illustrated chapter briefly summarizes the science.Extensive information regarding the depth of field, lateral resolution,

industrial probes, and miniature/subminiature probes are added. Chapter 4 is new material on instrument features, calibration, and testing

methods. The main thrust is on instrument performance. Some of theunique features of phased arrays (for example, dynamic depth focusing)are discussed. Methods for electronic checking and calibrationanessential feature of phased arraysare described.

Chapter 5 is a natural follow-on to chapter 4 on instrument performancenamely, how to substitute one piece of equipment with another. While

inspection codes use standard reflectors for calibration, chapter 5introduces an alternative approach using known defects and specificcalibration blocks. This chapter also investigates the effect on defectsizing from dead elements, and from inputting the wrong setupparameters.

Chapter 6 is new material on phased array reliability and its contributionto engineering critical assessment. Phased arrays role in reliablydetecting and sizing defects is defined, using the concepts of validation,redundancy, and diversity. Examples from several industries are used to

show the high-sizing accuracy achievable on in-service components suchas power generation headers, complex turbine roots, dissimilar metalwelds, gas pipeline girth welds, and critical aerospace components.

Chapter 7 gives in-depth descriptions of several applications: generalinspection of welds using manual and semi-automated phased arrays,improved focusing in gas pipeline weld inspections, inspection of low-pressure turbines, an automated system for aerospace componentinspections, and TRL-PA dual phased array probes for austenitic weldinspections.


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Introduction 3

The major emphasis on the role of phased arrays in fitness for purpose (orECA) in chapter 6 and the detailed descriptions of applications in chapter 7make this book significantly different from our previous book. This bookdefines phased arrays by their future role in inspection: a unique device,which can rapidly, reliably, repeatedly, detect and size defects to ensurestructural integrity, whether new or in-service.

Fabrice CancreCOOOlympus NDT


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4 Chapter Contents

Chapter Contents

1.1 Historical Development and Industrial Requirements .............................51.2 Principles .........................................................................................................71.3 Delay Laws, or Focal Laws .........................................................................141.4 Basic Scanning and Imaging .......................................................................181.5 Limitations and Further Development of Phased Array Ultrasonic

Technology ....................................................................................................22References to Chapter 1 ..........................................................................................25


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Main Concepts of Phased Array Ultrasonic Technology 5

1. Main Concepts of Phased Array UltrasonicTechnology

This chapter gives a brief history of industrial phased arrays, the principlespertaining to ultrasound, the concepts of time delays (or focal laws) for

phased arrays, and Olympus NDTs R/D Tech

phased array instruments.The advantages and some technical issues related to the implementation ofthis new technology are included in this chapter.

The symbols used in this book are defined in the Glossary of Introduction toPhased Array Ultrasonic Technology Applications.

1.1 Historical Development and Industrial Requirements

The development and application of ultrasonic phased arrays, as a stand-alone technology reached a mature status at the beginning of the twenty-firstcentury.

Phased array ultrasonic technology moved from the medical field 1 to theindustrial sector at the beginning of the 1980s. 2-3 By the mid-1980s,piezocomposite materials were developed and made available in order tomanufacture complex-shaped phased array probes. 4-11

By the beginning of the 1990s, phased array technology was incorporated as anew NDE (nondestructive evaluation) method in ultrasonic handbooks 12-13

and training manuals for engineers. 14 The majority of the applications from1985 to 1992 were related to nuclear pressure vessels (nozzles), large forgingshafts, and low-pressure turbine components.

New advances in piezocomposite technology, 15-16 micro-machining,microelectronics, and computing power (including simulation packages forprobe design and beam-component interaction), all contributed to therevolutionary development of phased array technology by the end of the


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6 Chapter 1

1990s. Functional software was also developed as computer capabilitiesincreased.

Phased array ultrasonic technology for nondestructive testing (NDT)applications was triggered by the following general and specific power-generation inspection requirements: 17-24

1. Decreased setup and inspection time (that is, increased productivity)2. Increased scanner reliability3. Increased access for difficult-to-reach pressurized water reactor / boiling

water reactor components (PWR/BWR)4. Decreased radiation exposure5. Quantitative, easy-to-interpret reporting requirements for fitness for

purpose (also called Engineering Critical AssessmentECA)6. Detection of randomly oriented cracks at different depths using the same

probe in a fixed position7. Improved signal-to-noise ratio (SNR) and sizing capability for dissimilar

metal welds and centrifugal-cast stainless-steel welds8. Detection and sizing of small stress-corrosion cracks (SCC) in turbine

components with complex geometry9. Increased accuracy in detection, sizing, location, and orientation of

critical defects, regardless of their orientation. This requirement dictatedmultiple focused beams with the ability to change their focal depth andsweep angle.

Other industries (such as aerospace, defense, petrochemical, and manufac-turing) required similar improvements, though specific requirements vary foreach industry application. 25-29

All these requirements center around several main characteristics of phasedarray ultrasonic technology: 30-31

1. Speed. The phased array technology allows electronic scanning, which istypically an order of magnitude faster than equivalent conventionalraster scanning.

2. Flexibility. A single phased array probe can cover a wide range ofapplications, unlike conventional ultrasonic probes.

3. Electronic setups. Setups are performed by simply loading a file andcalibrating. Different parameter sets are easily accommodated by pre-prepared files.

4. Small probe dimensions. For some applications, limited access is a majorissue, and one small phased array probe can provide the equivalent ofmultiple single-transducer probes.


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5. Complex inspections. Phased arrays can be programmed to inspectgeometrically complex components, such as automated welds or nozzles,with relative ease. Phased arrays can also be easily programmed toperform special scans, such as tandem, multiangle TOFD, multimode,and zone discrimination.

6. Reliable defect detection. Phased arrays can detect defects with an increasedsignal-to-noise ratio, using focused beams. Probability of detection (POD)is increased due to angular beam deflection (S-scan).

7. Imaging. Phased arrays offer new and unique imaging, such as S-scans,which permit easier interpretation and analysis.

Phased array ultrasonic technology has been developing for more than adecade. Starting in the early 1990s, R/D Tech implemented the concepts ofstandardization and transfer of the technology. Phased array ultrasonictechnology reached a commercially viable milestone by 1997 when the

transportable phased array instrument, Tomoscan FOCUS

, could beoperated in the field by a single person, and data could be transferred andremotely analyzed in real time.

The portable, battery-operated, phased array OmniScan instrument isanother quantum leap in the ultrasonic technology. This instrument bringsphased array capabilities to everyday inspections such as corrosion mapping,weld inspections, rapid crack sizing, imaging, and special applications.

1.2 PrinciplesUltrasonic waves are mechanical vibrations induced in an elastic medium(the test piece) by the piezocrystal probe excited by an electrical voltage.Typical frequencies of ultrasonic waves are in the range of 0.1 MHz to50 MHz. Most industrial applications require frequencies between 0.5 MHzand 15 MHz.

Conventional ultrasonic inspections use monocrystal probes with divergent beams. In some cases, dual-element probes or monocrystals with focusedlenses are used to reduce the dead zone and to increase the defect resolution.In all cases, the ultrasonic field propagates along an acoustic axis with a singlerefracted angle.

A single-angle scanning pattern has limited detection and sizing capabilityfor misoriented defects. Most of the good practice standards addsupplementary scans with an additional angle, generally 1015 degrees apart,to increase the probability of detection. Inspection problems become moredifficult if the component has a complex geometry and a large thickness,and/or the probe carrier has limited scanning access. In order to solve the


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8 Chapter 1

inspection requirements, a phased array multicrystal probe with focused beams activated by a dedicated piece of hardware might be required (seeFigure 1-1 ).

Figure 1-1 Example of application of phased array ultrasonic technology on a complexgeometry component. Left: monocrystal single-angle inspection requires multiangle scans and

probe movement; right: linear array probe can sweep the focused beam through theappropriate region of the component without probe movement.

Assume a monoblock crystal is cut into many identical elements, each with a

pitch much smaller than its length ( e


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Figure 1-2 Beam forming and time delay for pulsing and receiving multiple beams (samephase and amplitude).

The main components required for a basic scanning system with phasedarray instruments are presented in Figure 1-3 .

Figure 1-3 Basic components of a phased array system and their interconnectivity.

Acquisitionunit

Phased arrayunit

ProbesPulses

Incident wave front

Reflected wave front

Trigger

Acquisitionunit

Phased arrayunit

Flaw

Flaw

Echo signals

Emitting

Receiving

D e

l a y s a t r e c e p t i o n

Computer(with TomoView

software)

Test pieceinspected by

phased arrays

UT PA instrument(Tomoscan III PA)

Phased array probe

Motion ControlDrive Unit

(MCDU-02)

Scanner/manipulator


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10 Chapter 1

An example of photo-elastic visualization 32 of a wavefront is presented inFigure 1-4 . This visualization technique illustrates the constructive-destructive interference mentioned above.

Courtesy of Material Research Institute, Canada

Figure 1-4 Example of photo-elastic wave front visualization in a glass block for a linear arrayprobe of 7.5 MHz, 12-element probe with a pitch of 2 mm. The 40 refracted longitudinal waves

is followed by the shear wavefront at 24. 32

The main feature of phased array ultrasonic technology is the computer-

controlled excitation (amplitude and delay) of individual elements in amultielement probe. The excitation of piezocomposite elements can generate beams with defined parameters such as angle, focal distance, and focal spotsize through software.

To generate a beam in phase and with constructive interference, the multiplewavefronts must have the same global time-of-flight arrival at theinterference point, as illustrated in Figure 1-4 . This effect can only be achievedif the various active probe elements are pulsed at slightly different andcoordinated times. As shown in Figure 1-5 , the echo from the desired focal

point hits the various transducer elements with a computable time shift. Theecho signals received at each transducer element are time-shifted before beingsummed together. The resulting sum is an A-scan that emphasizes theresponse from the desired focal point and attenuates various other echoesfrom other points in the material.

At the reception , the signals arrive with different time-of-flight values, thenthey are time-shifted for each element, according to the receiving focallaw. All the signals from the individual elements are then summed


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together to form a single ultrasonic pulse that is sent to the acquisitioninstrument.The beam focusing principle for normal and angled incidences isillustrated in Figure 1-5 .

During transmission , the acquisition instrument sends a trigger signal to

the phased array instrument. The latter converts the signal into a highvoltage pulse with a preprogrammed width and time delay defined in thefocal laws. Each element receives only one pulse. The multielementsignals create a beam with a specific angle and focused at a specific depth.The beam hits the defect and bounces back, as is normal for ultrasonictesting.

Figure 1-5 Beam focusing principle for (a) normal and (b) angled incidences.

The delay value for each element depends on the aperture of the activephased array probe element, type of wave, refracted angle, and focal depth.Phased arrays do not change the physics of ultrasonics; they are merely amethod of generating and receiving.

There are three major computer-controlled beam scanning patterns (see alsochapters 24):

Electronic scanning (also called E-scans , and originally called linearscanning ): the same focal law and delay is multiplexed across a group ofactive elements (see Figure 1-6 ); scanning is performed at a constant angleand along the phased array probe length by a group of active elements,called a virtual probe aperture (VPA). This is equivalent to a conventionalultrasonic transducer performing a raster scan for corrosion mapping (seeFigure 1-7 ) or shear-wave inspection of a weld. If an angled wedge isused, the focal laws compensate for different time delays inside thewedge. Direct-contact linear array probes may also be used in electronicangle scanning. This setup is very useful for detecting sidewall lack offusion or inner-surface breaking cracks (see Figure 1-8 ).

Resulting wave surface

Delay [ns]

PA probe

Delay [ns]

PA probe


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12 Chapter 1

Figure 1-6 Left: electronic scanning principle for zero-degree scanning. In this case, the virtualprobe aperture consists of four elements. Focal law1 is active for elements 14, while focallaw5 is active for elements 58. Right: schematic for corrosion mapping with zero-degree

electronic scanning; VPA=5 elements, n =64 (see Figure 1-7 for ultrasonic display).

Figure 1-7 Example of corrosion detection and mapping in 3-D part with electronic scanning atzero degrees using a 10 MHz linear array probe of 64 elements, p =0.5mm.


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Figure 1-8 Example of electronic scanning with longitudinal waves for crack detection in aforging at 15degrees, 5 MHz probe, n =32, p =1.0mm.

Sectorial scanning (also called S-scans , azimuthal scanning , or angularscanning ): the beam is swept through an angular range for a specific focaldepth, using the same elements. Other sweep ranges with different focaldepths may be added; the angular sectors could have different sweepvalues (see Figure 1-9 ). The start-and-finish-angle range depends on

probe design, associated wedge, and the type of wave; the range isdictated by the laws of physics.

Figure 1-9 Left: principle of sectorial scan. Right: an example of ultrasonic data display involume-corrected sectorial scan (S-scan) detecting a group of stress-corrosion cracks

(range: 33 to58).


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14 Chapter 1

Dynamic depth focusing (also called DDF ): scanning is performed withdifferent focal depths (see Figure 1-10 ). In practice, a single transmittedfocused pulse is used, and refocusing is performed on reception for allprogrammed depths. Details about DDF are given in chapter 4.

Courtesy of Ontario Power Generation Inc., Canada

Figure 1-10 Left: principle of depth focusing. Middle: a stress-corrosion crack (SCC) tip sizingwith longitudinal waves of 12MHz at normal incidence using depth-focusing focal laws.

Right: macrographic comparison.

1.3 Delay Laws, or Focal Laws

In order to obtain constructive interference in the desired region of the testpiece, each individual element of the phased array virtual probe aperturemust be computer-controlled for a firing sequence using a focal law. (A focallaw is simply a file containing elements to be fired, amplitudes, time delays,etc.) The time delay on each element depends on inspection configuration,steering angle, wedge, probe type, just to mention some of the importantfactors.

An example of time-delay values in nanoseconds (10 -9 s = a millionth partfrom a second) for a 32-element linear array probe generating longitudinalwaves is presented in Figure 1-11 . In this image, the detection of side-drilledholes is performed with both negative ( left) and positive angles ( right ). Thedelay value for each element changes with the angle, as shown at the bottomof this figure.


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Figure 1-11 Example of delay value and shape for a sweep range of 90 (45 to +45). Thelinear phased array probe has 32elements and is programmed to generate longitudinal waves

to detect five side-drilled holes. The probe has no wedge and is in direct contact with the testpiece.

Direct-contact probe (no wedge) for normal beam. The focal law delay has aparabolic shape for depth focusing. The delay increases from the edges of theprobe towards the center. The delay will be doubled when the focal distanceis halved (see Figure 1-12 ). The element timing has a linear increase when theelement pitch increases (see Figure 1-13 ). For a sectorial (azimuthal) scanwithout a wedge, the delay on identical elements depends on the elementposition in the active aperture and on the generated angle (see Figure 1-14 ).

Figure 1-12 Delay values ( left) and depth scanning principles ( right) for a 32-element lineararray probe focusing at 15mm, 30 mm, and 60mm longitudinal waves.

0

20

40

60

80

100

120

140

0 4 8 12 16 20 24 28 32

Element number

T i m e

d e l a y

[ n s ]

F D = 15

F D = 30

F D = 60

F D = 15

F D = 30

F D = 60

a b


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16 Chapter 1

Figure 1-13 Delay dependence on pitch size for the same focal depth.

Figure 1-14 Left: an example of an element position and focal depth for a probe with nowedge (longitudinal waves between 15 and 60). Right: an example of delay dependence on

generated angle.

Probe on the wedge. If the phased array probe is on a wedge, the delay valuealso depends on wedge geometry and velocity, element position, andrefracted angle (see Figure 1-15 ).

The delay has a parabolic shape for the natural angle given by Snells law (45in Figure 1-16 ). For angles smaller than the natural angle provided by Snellslaw, the element delay increases from the back towards the front of the probe.For angles greater than the natural angle, the delay is higher for the back

1

1

1

F

F

F

p1

p2 > p1

p3 > p2

50

100

150

200

250

300

350

400

450

500

0.5 0.75 1 1.25 1.5

Element pitch [mm]

T i m e

d e l a y

[ n

s ]

L-waves - 5,920 m/sFocal depth = 20 mmLinear array n = 16 elementsDelay for element no. 1

Experimental setup

F2= 2 F1

F1

2

1

1

1 5 9 13 17 21 25 29Element number

0

200

400

600

800

1000

1200

1400

D e l a y

[ n s ]

60

45

30

15

LW-no wedge____F 1 = 15 mm_ _ _F 2= 30 mm


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elements, because the beam generated by the front elements follows a longerpath in the wedge, and thus the front elements have to be excited first.

Figure 1-15 Example of delay value and its shape for detecting three side-drilled holes withshear waves. The probe has 16elements and is placed on a 37 Plexiglas wedge (natural

angle 45 in steel).

Figure 1-16 Example of delay dependence on refracted angle and element position for aphased array probe on a 37 Plexiglas wedge ( H1 = 5mm).

Delay tolerances. In all the above cases, the delay value for each element must be accurately controlled. The minimum delay increment determines themaximum probe frequency that can be used according to the following ratio:

F 2 = 2 F 1

F 1

0

100

200

300

400

500

600

700

800

0 4 8 12 16 20 24 28 32

Element number

T i m e d e l a y [ n s ]

F15/60F30/60F15/45F30/45F15/30F30/30

45 degrees

60 degrees

30 degrees


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18 Chapter 1

[in microseconds, s] (1.1)

where:

n = number of elements f c = center frequency [in MHz]

The delay tolerances are between 0.5 ns and 2 ns, depending on hardwaredesign.

Other types of phased array probes (for example, matrix or conical) couldrequire advanced simulation for delay law values and for beam featureevaluation (see chapter 3).

1.4 Basic Scanning and Imaging

During a mechanical scan, data is collected based on the encoder position.The data is displayed in different views for interpretation.

Typically, phased arrays use multiple stacked A-scans (also called angularB-scans) with different angles, time of flight and time delays on each smallpiezocomposite crystal (or element) of the phased array probe.

The real-time information from the total number of A-scans, which are firedat a specific probe position, are displayed in a sectorial scan or S-scan , or in aelectronic B-scan (see chapter 2 for more details).

Both S-scans and electronic scans provide a global image and quickinformation about the component and possible discontinuities detected in theultrasonic range at all angles and positions (see Figure 1-17 ).


Figure 1-17 Detection of thermal fatigue cracks in counter-bore zone and plotting data into3-D specimen.

t delayn

f c----=


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Data plotting into the 2-D layout of the test piece, called corrected S-scans , ortrue-depth S-scans makes the interpretation and analysis of ultrasonic resultsstraightforward. S-scans offer the following benefits:

Image display during scanning True-depth representation 2-D volumetric reconstruction

Advanced imaging can be achieved using a combination of linear andsectorial scanning with multiple-angle scans during probe movement. S-scandisplays, in combination with other views (see chapter 2 for more details),lead to new types of defect imaging or recognition. Figure 1-18 illustrates thedetection of artificial defects and the comparison between the defectdimensions (including shape) and B-scan data after merging multiple anglesand positions.

Figure 1-18 Advanced imaging of artificial defects using merged data: defects and scanningpattern ( top); merged B-scan display ( bottom).

A combination of longitudinal wave and shear-wave scans can be very usefulfor detection and sizing with little probe movement (see Figure 1-19 ). In thissetup, the active aperture can be moved to optimize the detection and sizingangles.


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20 Chapter 1

Figure 1-19 Detection and sizing of misoriented defects using a combination of longitudinalwave(1) and shear-wave sectorial scans(2).

Cylindrical, elliptical, or spherical focused beams have a better signal-to-noiseratio (discrimination capability) and a narrower beam spread than divergent beams. Figure 1-20 illustrates the discrimination of cluster holes by acylindrical focused beam.

Figure 1-20 Discrimination (resolution) of cluster holes: (a) top view (C-scan); (b) side view(B-scan).

Real-time scanning can be combined with probe movement, and defectplotting into a 3-D drafting package (see Figure 1-21 ). This method offers:

High redundancy Defect location Accurate plotting Defect imaging

1

2

x

z

a

b


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High-quality reports for customers and regulators Good understanding of defect detection and sizing principles as well the

multibeam visualization for technician training


Figure 1-21 Example of advanced data plotting ( top) in a complex part ( middle) and a zoomedisometric cross section with sectorial scan ( bottom).35


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22 Chapter 1

1.5 Limitations and Further Development of Phased ArrayUltrasonic Technology

Phased array ultrasonic technology, beside the numerous advantagesmentioned at the beginning of this chapter, has specific issues listed in Table1-1 , which might limit the large-scale implementation of the technology. 33

Table 1-1 Limitations of phased array ultrasonic technology and Olympus NDTs approaches toovercome them.

Issue Specific details Olympus NDT approach

Equipment tooexpensive

Hardware is 10 to 20 times moreexpensive than conventional UT.

Expensive spare partsToo many software upgradescostly

Miniaturize the hardwaredesign, include similar featuresas conventional ultrasonics

Standardize the production line Price will drop to 28 times vs.

conventional UT. Limit software upgrades

Probes too expensivewith long lead delivery

Require simulation, compromisingthe featuresPrice 12 to 20 times moreexpensive than conventionalprobes

Issue a probe design guideline, anew book on PA probes andtheir applications

Standardize the probemanufacturing for welds,corrosion mapping, forgings,and pipelines

Probe price should decline to 3to 6 times the price ofconventional probes.

Requires very skilledoperators with

advanced ultrasonicknowledge

A multidisciplinary technique,with computer, mechanical,ultrasonic, and drafting skills

Manpower a big issue for large-scale inspectionsBasic training in phased array ismissing.

Set up training centers withdifferent degrees ofcertification/knowledge, andspecialized courses

Issue books in AdvancedPractical NDT Series related tophased array applications

Calibration is time-consuming and very

complex

Multiple calibrations are requiredfor probe and for the system;periodic checking of functionalitymust be routine, but is taking alarge amount of time.

Develop and include calibrationwizards for instrument, probe,and overall system

Develop devices and specificsetups for periodic checking ofsystem integrity

Standardize the calibrationprocedures


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Compared to the time-of-flight-diffraction (TOFD) method, phased arraytechnology is progressing rapidly because of the following features:

Use of the pulse-echo technique, similar to conventional ultrasonics Use of focused beams with an improved signal-to-noise ratio Data plotting in 2-D and 3-D is directly linked with the scanning

parameters and probe movement. Sectorial scan ultrasonic views are easily understood by operators,

regulators, and auditors. Defect visualization in multiple views using the redundancy of

information in S-scan, E-scans, and other displays offers a powerfulimaging tool.

Combining different inspection configurations in a single setup can beused to assess difficult-to-inspect components required by regulators.

Data analysis andplotting is time-

consuming

Redundancy of defect data makesthe interpretation/analysis timeconsuming.Numerous signals due to multipleA-scans could require analysis anddisposition.Data plotting in time-basedacquisition is time-consuming.

Develop auto-analysis tool based on specific features(amplitude, position in the gate,imaging, echo-dynamic pattern)

Develop 2-D and 3-D directacquisition and plottingcapability 34-35 (see Figure 1-21 and Figure 1-22 )

Use ray tracing and incorporatethe boundary conditions andmode-converted into analysistools

Method is notstandardized

Phased array techniques aredifficult to integrate into existingstandards due to the complexity ofthis technology.Standards are not available.Procedures are too specific.

Active participation in nationaland internationalstandardization committees(ASME, ASNT, API, FAA, ISO,IIW, EN, AWS, EPRI, NRC)

Simplify the procedure forcalibration

Create basic setups for existingcodes

Validate the system onopen/blind trials based onPerformance DemonstrationInitiatives 36-37

Create guidelines for equipmentsubstitution

Prepare generic procedures

Table 1-1 Limitations of phased array ultrasonic technology and Olympus NDTs approaches toovercome them. (Cont.)

Issue Specific details Olympus NDT approach


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24 Chapter 1

Figure 1-22 shows an example of the future potential of phased arrays with3-D imaging of defects.

Figure 1-22 Example of 3-D ultrasonic data visualization of a side-drilled hole on a sphere. 34

Olympus NDT is committed to bringing a user-friendly technology to the

market, providing real-time technical support, offering a variety of hands-ontraining via the Olympus NDT Training Academy, and releasing technicalinformation through conferences, seminars, workshops, and advancedtechnical books.

Olympus NDTs new line of products (OmniScan MX 8:16, 16:16, 16:128,32:32, 32:32128, TomoScan FOCUS LT 32:32, 32:32128, 64:128,QuickScan , Tomoscan III PA) is faster, better, and significantly cheaper. Theprice per unit is now affordable for a large number of small to mid-sizecompanies.


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34. Reilly D., J. Berlanger, and G. Maes. On the use of 3D ray-tracing and beamsimulation for the design of advanced UT phased array inspection techniques.Proceedings, 5th International Conference on NDE in Relation to Structural Integrity

for Nuclear and Pressurized Components , San Diego, USA, May 2006.35. Ciorau, P., W. Daks, and H. Smith. A contribution of reverse engineering of linear

defects and advanced phased array ultrasonic data plotting. EPRI. Proceedings,4th Phased Array Inspection Seminar , Miami, USA, Dec. 2005.

36. Maes, G., J. Berlanger, J. Landrum, and M. Dennis. Appendix VIII Qualificationof Manual Phased Array UT for Piping. 4th International NDE Conference inNuclear Ind. , London, UK, Dec. 2004.

37. Landrum, J. L., M. Dennis, D. MacDonald, and G. Selby. Qualification of aSingle-Probe Phased Array Technique for Piping. 4th International NDEConference in Nuclear Ind. , London, UK, Dec. 2004.


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Chapter Contents

2.1 Scanning Patterns .........................................................................................292.2 Ultrasonic Views (Scans) .............................................................................39References to Chapter 2 ..........................................................................................56


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Scanning Patterns and Ultrasonic Views 29

2. Scanning Patterns and Ultrasonic Views

This chapter describes automated ultrasonic-inspection (or scan) patterns andtypical ultrasonic data views in setup, acquisition, and analysis modescurrently used by R/D Tech systems. 113 Specific views used for calibrationsand probe FFT evaluation are detailed in chapter 3 and 4. These views canalso be found in Phased Array Technical Guidelines: Useful Formulas, Graphs, andExamples.14

2.1 Scanning Patterns

Reliable defect detection and sizing is based on scan patterns and specificfunctional combinations between the scanner and the phased array beam.

The inspection can be: automated: the probe carrier is moved by a motor-controlled drive unit; semi-automated: the probe carrier is moved by hand or by using a hand

scanner, but the movement is encoded and data collected; or manual (or time-based , sometimes called free running ): the phased array

probe is moved by hand and data is saved, based on acquisition time(s),or data is not saved.

The acquisition may be triggered by the encoder position, the internal clock,

or by an external signal.R/D Tech systems can provide the following inspection types: 110

Tomoscan III PA, Tomoscan FOCUS , TomoScan FOCUS LT :automated, semi-automated, manual

OmniScan PA: automated, semi-automated, manual

QuickScan PA, PipeWIZARD : automated (semi-automated forcalibration/mechanical settings)


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The probe carrier may be moved in any of the inspection sequences presentedin Table 2-1 .

2.1.1 Linear Scan

A linear scan is a one-axis scanning sequence using only one position encoder(either scan or index) to determine the position of the acquisition.

The linear scan is unidimensional and proceeds along a linear path. The only

settings that must be provided are the speed, the limits along the scan axis,and the spacing between acquisitions (which may depend on the encoderresolution).

Linear scans are frequently used for such applications as weld inspectionsand corrosion mapping. Linear scans with electronic scanning are typically anorder of magnitude faster than equivalent conventional ultrasonic rasterscans.

Figure 2-1 shows a typical raster scan ( left) and an equivalent linear scan

(right ). The linear scan saves time both at the nul zones where the rasterscanner changes direction, and during the scan, since phased arrays can pulsemuch faster than mechanical scanners can move.

Table 2-1 Scanning patterns for automated and semi-automated inspections.

Scanning pattern Numberof axes Remarks

Linear 1 All data is recorded in a single axial pass (see Figure 2-1 ).Bi-directional 2 Acquisition is performed in both scanning directions (see Figure

2-4).Unidirectional 2 Acquisition is performed in only one scanning direction; scanner

is moved back and forth on each scanning length (see Figure 2-4 ).Skewed/Angular 2 Similar to bidirectional, unidirectional, or linear with the main

axes skewed against the mechanical axes (see Figure 2-5 ).Helical 1 Acquisition is performed along a helicoidal path, that is, along

and around the cylinder (see Figure 2-6 ).Spiral 1 Acquisition is performed along a spiral path on a circular surface

(see Figure 2-7 ).Custom 16 Customized for multiaxis or component profile.


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Scanning Patterns and Ultrasonic Views 31

Figure 2-1 Raster scan pattern ( left) and equivalent linear scan pattern ( right).

During the linear scan, the phased array probe emits either an electronic scan,

an S-scan, or multiple scans. Depending on the setup and instrument, morethan one scan can be performed simultaneously. For example, Figure 2-2shows electronic scans at two angles in conformance with typical ASMEinspection requirements. Other scan patterns are possible, such as dualarrays, multiple S-scans, or combinations.

Figure 2-2 Typical dual-angle electronic scan pattern for welds with linear phased array andlinear scanning. Normally, one array is used for each side of the weld.

Linear scans are very useful for probe characterization over a reference blockwith side-drilled holes (see Figure 2-3 ).

Data CollectionStep

Nul ZonesRaster StepsNo Data Collection

Electronic scanning 45 SWand

Electronic scanning 60 SW


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Figure 2-3 Linear scan pattern for probe characterization.

2.1.2 Bidirectional Scan

In a bidirectional sequence , data acquisition is carried out in both the forwardand backward directions along the scan axis (see Figure 2-4 ).

2.1.3 Unidirectional Scan

In a unidirectional sequence , data acquisition is carried out in one direction onlyalong the scan axis (see Figure 2-4 ). The scanner is then stepped for anotherpass.

Figure 2-4Bidirectional ( left) and unidirectional ( right) raster scanning. The red line representsthe acquisition path.

XProbe Movement Axis

Probe

MOVEMENT WITH ACQUISITION

MOVEMENT WITHOUT ACQUISITION

PROBE

SCAN AXIS

BIDIRECTIONAL SCANNING

PROBE

SCAN AXIS

UNIDIRECTIONAL SCANNING

I N D E X A X I S

I N D E X A X I S


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