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Elga Europe…living inside technology

www.elgaeurope.it

Using proven Cadence® Sigrity™ signal integrity (SI) and power integrity (PI) solutions for system-level verification and interface compliance, you can sign off with confidence and be Sigrity Sure!

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3PCB november 2013

▶ SUMMARY - NOVEMBER 2013

▶ INSERZIONISTI

IN COPERTINA

Elga Europe S.r.l. and Eternal

Chemical Co. Ltd are pleased to

announce they have reached an

agreement for the acquisition by

Eternal of a minority stake in the

corporate capital of Elga.

Eternal Chemical co. Ltd is

headquartered in Kaohsiung, Taiwan,

and is the world leader in dry fi lm

production, with 25 production lines

and a capacity of about 400 million

m2 per year.

Elga Europe S.r.l., which owns

the only dry fi lm production plant

operating in Europe, is based near

Milan, where its production plant,

R&D, technical assistance and

administration are located. Elga

Europe S.r.l. is the leading supplier

of dry fi lm for the European market

today.

Elga Europe S.r.l.Via della Merlata 820014 Nerviano – MilanoItalyinfo@elgaeurope.itwww.elgaeurope.it

Editorial ____________________________________________________ 5

Cover StoryItalian Excellence in Dry Film ___________________________________ 6di Dario Gozzi

Cover StoryMore Suprises in Store from WX Technology ______________________ 10di Edoardo Banfi

TraceabilityProduction Support Systems ___________________________________ 14di Piero Bianchi

Screen PrintingThe Basis of Production Processes _______________________________ 20di Dario Gozzi

Pick & PlaceSMT Assembly ______________________________________________ 28di Davide Oltolina

SolderingThe Art of Joining ___________________________________________ 36di Dario Gozzi

TestAccurate Quality Controls _____________________________________ 42di Davide Oltolina

LASERTECH ______________________ 19

MANCINI ENTERPRISE _____________ 33

MEG _____________________________ 35

MIRTEC _______________________ II cop.

OSAI _____________________________ 41

PACKTRONIC _____________________ 13

SMT HYBRID PACKAGING 2014 ____ 25

TECNOMETAL _____________________ 26

ZUKEN ___________________________ 47

AUREL ___________________________ 17

CABIOTEC _________________________ 4

CADENCE DESIGN SYSTEMS _ battente cop.

ELGA EUROPE _________________ I cop.

F.P.E. ___________________________ 9-23

I-TRONIK _________________________ 39

INVENTEC PERFORMANCE CHEMICALS ITALIA ________________ 27

ISCRA ________________________ III cop.

ITECO _________________________ 30-31

5PCB november 2013

▶ EDITORIAL

riccardo.busetto@ilsole24ore.com

Th e twentieth Productronica show is an important event. Not so much for the anniversary it marks as for its timing. Th is is a tricky moment for the economy in general and, above all, for the electronics manufacturing sector in Italy. With the strategic changes imposed by a world that no longer moves at yesterday’s pace, in which all the geographical and time barriers have disappeared and where there are no more end markets, an event like Productronica represents a defi nite turning point, a fi nal farewell to the old certainties and habits. I am not just putting forward a theory, this is the result of some important conclusions I have made: the Italian electronics market (and I stress Italian, although this applies to all national European markets) cannot and must not think of its future within its own national boundaries. If it wants to survive it must widen its horizons beyond the very tight limits of the nation’s geographical boundaries. Daily contact with a large number of companies and people in the sector point to a world which is not changing, but which has already changed fundamentally. Only a few small businesses that are fl exible, have consolidated know-how and experience, are able to change radically from one season to another and operate globally with a decisive presence only in certain sectors of the market, especially the international market, are able to stay alongside large companies with an international structure. We have all witnessed the collapse of the businesses that have partly written the history of the sector in recent years. And we have seen the birth of new enterprises created by people whose experience constitutes the backbone of the Italian electronics industry. Th is world has not collapsed since the recession, it has simply changed, and now it is more alive than ever before. Th e bilingual edition of the November issue of PCB Magazine is an attempt to promote this world, a vibrant world that needs to impress its products and its business strengths on the international market, but without ever forgetting its close ties to its own national territory.

Alive and Kicking

6 PCB november 2013

by Dario Gozzi

E lga Europe is a company at the forefront of research and production of dry fi lm and chemical specialities

for the PCB, chemical milling and other special applications in microelectronics.

The company has 9,700 m2 of covered space comprising offi ces, laboratories and plants, spread over a total area of 21,500 m2.

The two main plants are located in Nerviano (north-west of Milan), behind the main S33 Sempione road, while its two subsidiaries are in Switzerland and the United Kingdom.

▶ COVER STORY

Italian Excellence in Dry FilmElga Europe is a leading company in research and development of dry fi lm and production of chemical specialities for the PCB industry, for chemical milling and for other applications in micro-electronics

Elga Europe S.r.l. and Eternal Chemical Co. Ltd are pleased to announce they have reached an agreement for the acquisition by Eternal of a minority stake in the corporate capital of Elga.

Eternal Chemical co. Ltd is hea-dquartered in Kaohsiung, Taiwan and is the world leader in Dry Film production, with 25 production li-nes and a capacity of about 400 million m2 per year of dry fi lm.

Elga Europe S.r.l., which owns the only dry fi lm production plant operating in Europe, is based near Milan, where its production plant, R&D, technical assistance and ad-ministration are located. Elga Europe S.r.l. is the leading supplier of dry fi lm for the European mar-ket today.

Elga Europe S.r.l., the only producer of Dry Film Photoresist in Europe, is celebrating forty years in business and announces its Joint Venture with Eternal Chemical Co. Ltd, the world leader for Dry Film production

From 1973 to 1979, the company focused increasingly on chemical and electrolytic deposition processes in the PCB sector and became a landmark in this fi eld in Italy. This activity allowed the introduction of dry fi lm into the Italian market.

The company’s rapid success led to the foundation of the company Tok Italia (a joint venture with the Japanese fi rm Tokyo Ohka Kogyo) in 1996. Tok Italia’s mission is local production of dry fi lm and of a number of products for the semiconductor industry marketed by Elga Europe in Europe,

as well as photographic solder masks and chemical specialities. Most of the chemical products are for PCB production, such as those specifi cally for electrolytic deposition processes and all the auxiliary products for dry fi lm, such as developer, stripper and anti-foam solutions.

Since the beginning of 2006, an agreement with the Taiwan fi rm Chang Chun Plastics has allowed cutting and marketing in Europe of copper foil and a complete range of auxiliary materials.

The Nerviano plant carries out cutting of

7PCB november 2013

AM100DI 50 micron thickness

copper foil (in bobbins or sheets 12 to 105 microns thick) and all materials used in lamination of multilayers.

In 2010 Tokyo Ohka decided to leave the dry fi lm market and Elga Europe bought T.O.K. Japan’s shares in TOK Italia, completing its total incorporation in December.

In November 2013, during Productronica in Munich, the Milan fi rm will celebrate its fi rst forty years with the announcement of its new joint venture with Eternal, the most important producer of Dry Film Photo-Resist in the world.

R&D and Customer Service

Research and development is essential for a company wanting to serve a sector of a market as dynamic as the electronics one. Elga Europe has divided its resources into three distinct laboratories, each with specifi c missions and know-how, but designed to complement each other when necessary.

One laboratory deals with dry fi lm and solder masks, carrying out research and development of DFR products and solder masks, as well as their quality control. It is equipped with systems for simulating use of the product by the customer (laminator, exposure and developer), as well as scientifi c instruments such as HPLC, optical microscopes, dynamometers and FT-IR with micro ATRs.

A second laboratory deals with quality control of the developer solutions produced for the semiconductor industry. It has sophisticated instruments able to analyse metals in traces, such as GF-AAS, ICP-OES, ICP-MASSA. There is also an ionic tensiometer chromatographer, a titrator and UV-VIS spectrometer.

Last but by no means least, is the laboratory dedicated to customer service. Its mission is to provide after-sales assistance and support to customers, both for introducing new products into their processes, and offering help and support should any particular problems arise in tried and tested processes. The equipment of this laboratory includes optical microscopes and SEM, HPLC and AAS.

As far as production is concerned, Elga Europe operates along four different lines: dry fi lm, NMD developers, copper foil and chemical solutions.

The Nerviano plant produces chemical specialities, mostly for PCB production, such as those specifi cally for electrolytic deposition processes and surface pre-treatment of copper, both before Galvanic deposition and before lamination of the dry fi lm and/or solder mask, as well as all the auxiliary products for dry fi lm, such as developer, stripper and anti-foam solutions.

In a special clean room, the Nerviano plant also carries out cutting of copper foil in bobbins or sheets of 12, 18, 35, 50, 70 and 105 microns and of all the materials used in lamination of multilayers.

The production plants of Nerviano

8 PCB november 2013

SY 300 20 micron thickness

FP400 40 micron thickness (left) P50000 100 micron thickness (right)

The plant in Pogliano Milanese, which has a production capacity of 300 tons a month, produces the NMD and NMD-W developer using TMAH diluted in ultra-pure water.

The cycle includes a class 100 cleaning room for transferring the product into special drums.

The feather in the company’s cap and its core business is the plant for producing dry fi lm. Technologically advanced, with ISO 9001 and ISO 14000 certifi cation, it has a production capacity of 1.5 million square metres per month. The complete coating line is made up of mixers for preparing resist, the spreading head and a drying oven 70 m long. In the latter, continuous control of thickness and optical control of any defects is carried out. At the end of the line four cut and rewinding machines package the dry fi lm in rolls of different sizes, according to customers’ requests.

Products

Elga Europe produces a vast and complete range of dry fi lms, in thicknesses from 15 to 125 microns. The fi lms can meet the technological demands of all the production processes used in making PCBs, from chemical milling to electroforming, and for a number of applications for MEMS production.

In the multipurpose line (pattern plating, tenting, acid and alkaline etching and print and etch:

Ordyl Alpha 300The product offers high chemical

resistance to alkaline etching, up to 210 microns of copper, and to electrolytic plating of Ni/Au, up to 5 microns of gold

Ordyl AM 100Multipurpose dry fi lm, suitable for all

electrolytic plating processes (copper/tin, nickel/gold), tenting and acid and/or alkaline etching, with conventional UV or LDI exposure

Ordyl AR 200SMultipurpose dry fi lm, suitable for all

electrolytic plating processes (copper/tin, nickel/gold), tenting and acid and/or alkaline etching.

For the pattern-tenting and acid print & etch line:Ordyl Alpha 800Ordyl Alpha 900

Both are specifi c products for copper/tin plating, tenting and print & etch, with acid

etching and high strippability. The second can be used both for conventional UV exposure and Laser Direct Imaging.

Products for chemical milling:Ordyl NE 500Ordyl AF 200E

The fi rst is a specifi c dry fi lm for chemical milling of all the most commonly used materials, such as brass, copper, kovar and steel. It allows high resolution for achieving very small and precise layouts. The second is a specifi c dry fi lm for chemical milling of steel. As well as excellent adhesion, it offers high resistance to the etching solution, allowing etching of polished steel sheets with thicknesses over 0.8 mm.

Dry Film for Laser Direct Imaging

As the European market – the main market for Elga Europe – has moved towards highly technological PCB production in small to medium series (including prototyping), LDI

technology has spread rapidly. In the last ten years the company has paid particular attention to this technology, devoting a great deal of research to it. This has led to the development of a complete range of extremely stable LDI dry fi lms, with a wide range of possible applications, making them easy to use in normal manufacturing processes. Various types of LDI fi lm are available in thicknesses of 15 to 75 microns, including:

Ordyl AM 100DI – Multipurpose LDI dry fi lm suitable for all electrolytic plating processes (copper/tin, nickel/gold), tenting and acid and/alkaline etching. It provides excellent adhesion, allowing high yields even on very complex circuits with very fi ne layouts. It is particularly suitable in inner layer and outer layer production with tenting technology.

Ordyl Alpha 800DI – This product is specifi cally for copper/tin pattern plating lines. Its high strippability makes it particularly suitable for this application, where overplating can occur, which can make it diffi cult to remove the resist between the tracks during stripping of the dry fi lm. It can also be used for applications in tenting and print & etch with acid etching.

Ordyl Alpha 900NDI – This is the new LDI dry fi lm, an evolution of the ALPHA 800DI, which offers the advantage of greater UV sensitivity, which allows productivity of the laser machine to be increased.

Special Dry Films

Besides dry fi lms for PCBs, Elga Europe has developed a series of materials for specifi c applications for MEMS sectors and integrated circuit production. The three products are Ordyl SY 300, Ordyl P-50000 and Ordyl FP 400.

The fi rst is a permanent dry fi lm used in the production of MEMS and biochips. Thanks to its high thermal and dimensional stability, as well as high chemical resistance, it is commonly used for making microfl uidics, including biochip applications, which involve contact with human blood, as it is biocompatible. It can also be used for sealing between two surfaces of the same or different material, such as silicon, glass, polymide and metal wafers.

Ordyl P-50000 is the dry fi lm used for packaging integrated circuits, particularly for bumps and for electroforming applications. It is produced exclusively with thicknesses of 100 to 125 microns. Thanks to its particular formulation, perfectly vertical profi les can be obtained despite the marked thickness of the resist, allowing very accurate layouts to be created even on the Z axis.

Lastly, Ordyl FP 400 is the ultra-high resolution dry fi lm, for lines/spaces under 10 microns, with an aspect ratio of 1:2 (resolution/thickness ratio). It is widely used in microelectronics, where liquid photoresists cannot be used for technological reasons. It has recently been used for producing new generation prototypes of printed circuits, with tracks and insulation under 25 microns.

www.elgaeurope.it

10 PCB november 2013

More Surprises in Store from WX TechnologyNew systems, tools and accessories that extend the range of the Weller WX line even further are on the way. High-performing, yet simple and quick to use, with traceability for every function, these products allow printing or storing of the work schedule

by Edoardo Banfi

In the three years since the WX products were fi rst released onto the market, both sales results and technical and

commercial feedback from the market have been highly positive.

This is the only existing product line able to meet multiple regulations (MIL, DOD, ESD, ISO), as well as the demanding of all sectors, from the most technological (space, military, scientifi c, automotive, telecom and medical) to the electro-mechanical and wiring sectors, as well as service companies.

The WX series can remotely control soldering fume extraction systems (Weller Zero Smog 4V and 6V), adjusting them when necessary, interrupting the extraction fl ow when no tools are in use and indicating when to replace the fi lters. It can control the WHP

1000 and WHP3000 IR pre-heating units to reduce energy consumption to a minimum, eliminating wastage and avoiding frequent maintenance or premature wear and tear of sensors or heating elements. Lastly, connection to a PC enhances its potential and facilitates traceability of the work carried out. The Weller team mantains close contact with users, constantly monitoring their technology needs. This enables the whole WX platform to be improved with hardware and software modifi cations to meet their changing needs.

Why choose WX?

No other system guarantees such high safeguards for PCBs, their electronic

components (even the most sensitive) and the joints during soldering and desoldering, production or reworking.

The WX station adjusts its operation to match the requirements of the task being undertaken by applying the correct amount of thermal energy to the solder joint at all times. This ensures that the intermetallic layers of the joint are formed correctly and ovecomes the potentially serious risks associated with lead free solder alloys. Equally important, WX technology meets the IPC-J001 specifi cations and all ESD requirements. Also the tip potential equalisation allows hard or soft grounding to separate earth points, direct earth through the main supply of earth free options. A touch screen digital display shows all of the set process parameters that are controlled; set temperatures, actual temperature; power supplied and in the case of your dual output stations which tool is in operation. The desoldering version of the WX tool automatically controls the duration of the applied vacuum for the desoldering process. The above functionality allows the operator to work with confi dence and security. The right power rated tool operated at the correct temperature setting means the operator can work with minimum risk of damage to pcbs or components while using either tin-led or lead free alloys.

▶ COVER STORY

Fig. 1 - Hot-Gas new unit WXA2010

11PCB november 2013

Control of power supply in real time is essential for quality and safety. With the WX the operator can select the correct geometry of the tip and ensure the tool chosen has adequate power for the application in hand, unlike other solutions available on the market, which have preset working temperatures. On WX stations, the real working temperature of the soldering tip or of the desoldering nozzle is easily adjusted to the workload, particularly to the heating requirement of the soldering joints connected to the ground planes, to the tracks inside the multi-layer or the scattered surface ones.

When the power supply is too high, the soldering alloy appears to fl ow onto the joint immediately. However, it results in excessive heat drift and dangerous gradients on the joints, often over 30°C per second.

Control systems that do not control the thermal energy input to the joint cannot guarantee the quality of the solder joint. The risk is that the intermetallic layer may be too thin if insufficient thermal energy has been applied which will result in a dry joint causing early failure, or if an excess of energy is applied too thick, which will embrittle the joint, again causing failure.

More frequent occurrences are thermal shocks to components, delamination of the pads, with breakage of tracks outside and inside the multi-layer and, where lead-free alloys are used, probable cracking

and excessive voids inside the soldering meniscus. Systems with fi xed temperatures do not allow any intervention to correct the work parameters. Each assembled PCB is a world in itself, with particular thermal requirements that are sometimes very complex to reconcile. When they arrive at the manual soldering or rework stage, the PCBs have already been subjected to stressful heating cycles during production and need maximum care and attention. The risk of damage can be reduced to a minimum only by carrying out proper heating profi les.

Power impulses generated by control units with heating technologies other than Weller often allow rapid heating of the tip. However, they cannot prevent the tools from transmitting “interference”.

WX devices do not require calibration of temperatures, like all Weller electronic control units already used in industry (WSD, WD and WR) for that matter. This is possible because closed-loop control systems and noble materials are used for the measuring sensors (silver, platinum).

Calibration is possible, however, should it be required by the quality control procedures of the companies themselves, or for greater precision of the thermal verification systems used by the user. WX offers operators the certainty of maximum quality, and the only question posed is how far Weller can go in developing its technology.

This question is impossible to answer today, as this is just the beginning of a new era. Weller is certainly able to offer innovative solutions. Their search for solutions to the modern requirements of the electronics industry is continuous. Particular attention is paid to the best ideas put forward by the operators, which are then developed and put into practice by the Weller R&D team.

Reworking SMDs with hot gas WX

The powerful, accurate, reliable and economical WX platform has enabled further development of the range of products. In the next few days, at Productronica 2013, the hot gas WXA2 unit will be launched. It is equipped with a 200W WXHAP200 iron, able to supply a flow of gas up to a maximum of 18 litres per minute. The unit must be connected to an existing network of compressed air or nitrogen. Both the thermal stability and the power in the flows of gas make it much easier, quicker and safer to work on lead-free multi-layer PCBs and on larger components. This hot gas unit makes it possible to work on a very wide range of components and multi-layer circuits. Its thermal accuracy and its power, despite the small hot gas iron, makes soldering and desoldering faster, thereby guaranteeing safeguard of the assembled parts.

Fig. 2 - New Solder unit WXHAP200 set

Fig. 3 - New vertical unit for rework WXDV120

12 PCB november 2013

New Vertical 120W Desoldering Iron WXDV120

The new vertical 120 Watt desoldering iron, particularly suitable for applications on circuits with a high density of components, where high thermal power is required, will also be presented at Productronica 2013. It works with stable and accurate temperatures from 50 °C to 450 °C and gives higher quality in rework. Its heating time of just 30 seconds (from 100 to 350 °C) proves particularly useful in production. Its automatic standby function allows less wear and tear and less oxidation of the nozzles and reduces the generation of fumes when put back on its rest. The blue LED light on the handle indicates the tool’s status (ready to work, standby/heating, off). The Collector for the tin, a cardboard cartridge, is integrated into the hand tool and is quick and easy to replace. The operating parameters are stored separately from the control unit by means of memory inside the hand tool. The XDS desoldering nozzles have an extended suction tube to increase performance and minimize obstructions. They are also easy to replace, due to the new PDN tool specially devised to facilitate insertion and extraction from the cone-shaped opening. The desoldering iron is compatible with the WXD2 for all vertical and linear desoldering applications, where the usual working practices of the operators or specific circuit requirements make it necessary.

New XDS Nozzles

With the arrival of the WXDP120 and DSX120 series120 Watt desolderers in May 2012, new nozzles were introduced. They have a patented extended shaft and a bayonet fi tting with de-centred location, as in the DX family. This solution involves less cleaning and maintenance of the suction path of the desoldering head. Even if the alloy is removed before being completely molten, it will not resolidify in the suction path and therefore not cause frequent obstructions. If a lead breaks and blocks the suction path, replacing the desoldering nozzle will be suffi cient to resolve the problem. As with DX bayonet nozzles for 80 W desoldering irons, if the nozzle is changed when hot, it is inadvisable over tighten. A quarter of a turn is suffi cient to lock it fi rmly. A special version of the desoldering nozzles is available for prolonged use, with a shaft

insert in stainless steel. It is important to bear in mind that the new XDS desoldering nozzles are not compatible with the DSX80 and DSVX80 type 80W desoldering irons.

WX Accessories for Complete Versatility

The 120 Watt pre-heating plate WXHP120 for contact is powerful and has low voltage (24V) safety supply. The dimensions of the heated surface are 80 x 50 mm, while its actual dimensions are 150 x 120 x 6 mm maximum. Being very small, it can fi t any workbench. The four threaded holes (M4) in the heated surface are for fi xing support frames for PCBs. Temperatures can be regulated continuously from 50 °C to 200 °C and the temperature required for heating substrata showing signs of extensive thermal absorption (e.g. circuits for power LEDs) can also be supplied. It has a strong, metal structure and is ESD safe.

The platinum sensor and the closed-loop regulating circuit allow maximum accuracy in heat supply at high temperatures. Its integrated memory of parameters and traceability of thermal data make it the best choice for any lead-free application (compatible with WX 1, WX 2, WXD 2, WXA 2).

The new WXSB 200 crucible also has a low voltage (24 V) safety supply and Class 3 protection.

With its compact dimensions (150x120x65 mm), it is ideal for guaranteeing quality in pre-tinning wires and components, for removing protective materials (enameled wires) and in static soldering of components and PTH connectors. Its high power ensures fast heating time (10 minutes from 50 °C to 350 °C) and a uniform temperature throughout the crucible.

www.weller-tools.com

Hall A4 Stand 241

PCB b 2013

Fig. 4 - WXHP120 New preheating unit

Fig. 5 - New crucible WXSB200

AM100 condensa tutte le funzioni necessarie all’assemblaggio PCB. Studiata per soddisfare i medi volumi, se composta da più moduli è ideale anche per produzioni elevate. Con la garanzia della grande esperienza Panasonic.

SPG è la serigra ca ad alte prestazioni che ottimizza i costi di produzione e assicura una qualità elevata e costante.

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AM100la All-in-One

Tel: +39 039 928 1194info@packtronic.it - www.packtronic.it

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12-15 novembre • Hall A3, Booth 177

14 PCB november 2013

▶ TRACEABILITY

by Piero Bianchi

E lectronic companies operating both in the civil and professional sectors fi nd they are having to

face fi erce international competition, increasingly short product life-cycles, delivery terms reduced to a minimum and increasing personalization. All this is eroding the contribution margins, while increasingly higher standards of quality are being demanded.

A number of regulations have to be respected, from RoHS to IPC, and management, warehousing and process procedures must be activated. The systems available for this purpose range from backing ovens to closets for relative humidity control, to warehouses with automatic management of components according to FIFO.

Over the years the electronics industry has emphasized its sensitivity towards the problem of components sensitive to humidity (MSD) and their shortcomings in terms of reliability. It has created a classifi cation of the vulnerability of components and asked authorized personnel to take precautions in the various

stages of handling, storing and soldering. To get round this problem, dehumidifi ed closets are used for warehousing components. This family of dry cabinets enables relative humidity levels inside to be kept below 5%, as specifi ed in the IPC.

With the use of warehouses with automatic handling of components, an identifi cation code is associated with

the bobbins and with the components’ packaging and with the orders. They are usually intelligent warehouses, with dynamic positioning able to fi ll all the available slots. The software that handles its operation prepares the production kit completely automatically, on the basis of the order entered.

From the moment it is entered, the

Production Support SystemsMaking the workplace effi cient proves to be a winning strategy. Current market variables make it essential to meet required levels of effi ciency, reliability and fl exibility

15PCB november 2013

information of the whole process allows all sensitive data to be acquired and memorized through the bar codes or matrix data, from the substrata to components and consumer materials.

The choice is usually very wide and, depending on the code used, they can be codifi ed by a few hundred or thousand characters.

Traceability and Retraceability

Revolving around traceability is a whole series of requirements and interests linked to the need to guarantee safety or identify the risk factors, so that suitable measures can be taken to avoid the problem occurring again. Being able to reconstruct a product’s history means being able to verify retrospectively any causes of defects or problems that appear on site.

The purpose of a product’s retraceability is to enable its characteristics, constituent parts and the specific details of its production processes to be found, batch by batch. Traceability is a more or less detailed biography of the product; it includes not only its origins but also all

the stages the product has been through before leaving the factory.

Production traceability is one of the main requirements today in almost all electronic production processes. By gathering and handling the data, the objective is to govern the flow of information that accompanies the product all the way through the fabrication cycle. Through a sequence of identifications and recorded information, traceability constructs the history of a product, from its basic constituents to its final completion. Traceability therefore indicates all the actions undertaken to keep trace of all the elements that enter the factory and converge through the product cycle into the final product.

The main task is to establish which data have to be gathered, when and by whom, in a logical order, before, during and after the production process.

Traceability could thus be defined as a communication tool that gathers a certain type of information on what is being done, by whom, how and when. Its purpose is to enable anyone at any time to establish what, how and when something has been done.

Automation of Processes

In order to render processes economical, various degrees of automation are required, from standard modules to planning solutions for specific needs. There are various aspects to consider when speaking about production efficiency. It is not always sufficient to automatize, although this choice has profound implications on the final result. Sometimes it is necessary to consider the influence that not directly productive structures have on the process, giving flexibility, improving control, preventing any defects from arising.

Automation gives a set of hardware and software systems that commands and controls other machines, avoiding human intervention in the various production and control stages of the process. The development of automation is historically linked to big processes with few codes and high volumes. However, the increasing differentiation of production philosophies favours other fields of application, including sectors with a lot of codes and low volumes.

Automation makes up the backbone of the production system, but in order to generate added value it must respond efficiently to various requests. Besides optimization of production flows there must also be a reduction of defects. Mechanization of the line, which makes the flow and rhythm repetitive, must free the product from too much manual handling. A reduction in handling costs is also required, as one expert alone must be able to handle two or more lines. Essentially, production capacity must be increased without increasing the work force. Lastly, the facility to link various stages of working, control and testing with the features desired must be activated.

In their search for competitiveness, electronics companies rely on the flexibility of the lines, which derives from their automation among other things, in order to be able to meet any request.

Intelligent closets: for guaranteeing traceability and retraceability of components (Photo courtesy i-tronik)

16 PCB november 2013

Consistent workfl ows for electronics production

W ith its presence at the Productronica 2013 trade show, ASM Assembly

continues to solidify its position as a global innovation and technology leader in electronics manufacturing equipment.

Since experts believe that optimizing the overall production process harbors the greatest effi ciency reserves, the SIPLACE team is centering its show presence around role- and production-specifi c workfl ows.

The company therefore presents hardware, software and service innovations as fully integrated solutions that support and improve central processes in the areas of scheduling, NPI, production and optimization and make the jobs of schedulers, production managers and line operators easier.

At the center of attention are also the latest versions of the SIPLACE X, SIPLACE

SX, SIPLACE CA and SIPLACE Di placement platforms with their exceptional speed and fl exibility for NPI processes, high-volume runs and quick product changeovers. In addition, the SIPLACE team demonstrates that tools which will be needed for the “Industry 4.0” concept are already available today.

Besides the booth, the company will also take advantage of its proximity to the trade show grounds. Industry visitors can take shuttle buses directly from the Productronica to SIPLACE’s headquarters location to attend technology presentations covering the 03015 process from printing and inspection to placement to refl ow soldering. “With our SIPLACE X, SIPLACE SX, and SIPLACE Di placement platforms we set industry benchmarks in terms of speed, fl exibility and price-performance ratio. And with our SIPLACE CA we offer not only the placement machine with the highest precision, but also the fi rst high-precision platform that combines fl ip-chip, die attach and SMT processes for fl exible submodule production. Modern electronics production, however, requires not only powerful placement platforms, but support for all workfl ows on the factory fl oor,” says Gabriela Reckewerth, Director Global SIPLACE Marketing.

“We are the fi rst manufacturer to focus on this kind of support at the Productronica fair. We will show industry visitors how we build consistent, process-conforming solutions from our portfolio of hardware, software and services – for phases like scheduling, NPI and production, but also for roles like schedulers, operators or production managers.”

www.siplace.com

Hall A3 Booth 377At this year’s productronica the Munich-based SIPLACE team will present a unique and diverse array of hardware, software and service solutions

Gabriela Reckewerth, Director Global SIPLACE Marketing: “We are excited to look into the future of electronics production – together with our customers.”

Laser line

Screen printers

Laser lineLaser line

Automatic lines for the production of sensors, microelectronic circuits, solar cell. Automatic loading, screen printer with optical alignment, post-print inspection, furnace, automatic unloading.

Work cell for dispensing, ink-jet, spraying, pick&place, optical inspection, coating and other custom applications. Up to 5 axis, fast movements, repeatability < 5 microns.

Screen/stencil printer for SMT, thick lm, LTCC and solar cell. Optical alignment, high mechanical accuracy, resolution of 2 microns.

Roll-to-Roll lines for screen printing dispensing and ink-jet for exible foils.

AUREL AUTOMATION S.p.A. - Via Foro dei Tigli, 4 - 47015 Modigliana (FC)

Tel. 0546 94.11.24 - Fax 0546 94.16.60 - automation@aurelautomation.com

www.aurelautomation.com

Sensors line

Xcel line

Roll-to-Roll lines

Lasers for trimming,

marking, cutting.

18 PCB november 2013

The newest refl ow oven platform

B TU International is a global supplier and technology leader of advanced thermal processing

equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as  in the manufacturing of solar cells and nuclear fuel.

During productronica 2013 BTU, through it’s distributor EPP Electronic Production Partners GmbH, will exhibit its DYNAMO, the newest reflow oven platform specifically targeted for consumer electronics applications.

DYNAMO’s simplified configuration, delivers 24/7, with high uptime and reduced cost of ownership. With 8, 10, and 12 zone air or nitrogen models available, DYNAMO represents BTU

quality and reliability. New Convection Design delivers high efficiency through innovative thermal transfer. This allows for excellent temperature and gas flow uniformity across the chamber.

BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service

in the U.S.A., Asia and Europe.

www.btu.com

Hall A3, Booth 134

A UREL AUTOMATION S.p.A. produces since 1970 machines and automation systems for

electronic production in the areas of sensors, energy and electronic modules.

The wide proposal includes machines for thick fi lm technology, SMT, sensors, solar, fuel-cells, RFID, thick fi lm heaters.

The production program includes:

Machines and automation systems for electronic production

Screen/stencil printer for SMT, thick fi lm, LTCC, solar cells, etc. with high mechanical accuracy and vision system for automatic substrate alignment;Work cell: dispensing, ink-jet, spraying, pick&place, optical inspection, coating;Laser for ohmical and functional trimming of hybrid circuits and SMD. Marking, cutting, scribing;

Handling for electronic substrates: ceramic, PWB, glass, silicon, metals, fl exible;Ovens for drying, curing and soldering up to 600 °C.The company designs and manufactures automatic printing lines equipped with automatic loading and unloading stations, conveyor belts, substrate positioning and centering devices, optical inspection, temperature and humidity control for increased mechanical accuracy and superior printing results, SMEMA interface.

www.aurelautomation.com

Hall A2, Booth 481

20 PCB november 2013

▶ SCREEN PRINTING

by Dario Gozzi

T he type of screen printer chosen depends mainly on what products are to be manufactured and

on the budget available. Printing parameters are heavily influenced by the performances offered by stencils - generally produced by laser cutting - by soldering pad finishings, as well as by

the use of coated steel squeegees and cleaning systems inside the machine.

The most marked technological advancement has been in automatic systems. In an attempt to improve precision and repeatability, producers have aimed for a vision system, which, with its preliminary reading of the

fiducials, has become a particularly efficient inspection system. The cartridge printing heads and the metal squeegees (often with a coated edge) have an important impact on the printing quality. Also, the cleaning system of the stencil in the machine allows production of an entire batch of boards without any intervention by the operator. The soldering pastes undergo continuous improvements, both in chemical composition and in the quality of the powder (geometry and dimension). All this helps to give them better rheological features and, consequently, a better printing quality.

Screen Printing and Inspection

Screen printing is universally recognized as the most important step in the SMT assembly process. The errors introduced in this stage obviously have a domino effect on the other stages, with various repercussions on the final result. The cost of amending the error increases as the board passes along the assembly line. The more complex the assembly line becomes and the more added value accumulates, the higher the cost.

It is estimated that nearly 70% of possible errors in the production process can occur in the printing process. Another 15% are due to problems arising during reflow, and a further 15% to faulty placing. This analysis justifies the urgent

The high quality demanded in electronic devices infl uences the development of productions systems. This is particularly true for the most delicate stage of production: screen printing

The basis of production processes

21PCB november 2013

need to be able to control automatically all the factors that could potentially give rise to defects.

Statistics show that little more than 25% of SMT producers have adopted 100% post-print inspection. If a company’s budget allows for just one inspection system, it will almost ceratinly be an AOI at the end of the line. This solution could easily provide useful feedback on the whole process. However, it depends on whether the data have been analysed in real time, and does not avoid the problem of rework costs.

Attention should therefore be focussed on control inside the machine and – in real time - on the printing process. All the screen printers are equipped with a visual system that can carry out inspection of the deposits and of the stencil openings. Unlike an autonomous post-print inspection system, those present on most screen printers only carry out a 100% control at the expense of the cycle time of the process. In other cases, only certain portions of the board are inspected, those where the risk of defects is higher.

Many ways of achieving this aim have been explored, from expansion of the field of view to increasing the speed at which images are acquired, from speeding up the movement of the video camera with linear engines to reducing screen printing cycle time in favour of inspection cycle time.

The really innovative solution is to use a linear camera able to detect in one go all the information usually gathered by an AOI. Able to capture images of wide portions of board rapidly, the camera can adjust its own lighting to enable meticulous analysis of every detail. Among other things, it can also compensate for offset of the substratum in alignment procedures, and it can automatically recognize the incoming board.

The hardware is supported by powerful software for the automation and acceleration of the scheduling process, carried out through the description of the board and its features. The interactive graphic software reproduces the printed circuit on the monitor. Using a zoom function, the operator can then enlarge

the areas of interest on which the camera should be focussed.

Capturing a perfectly defined image of the board and stencil also

allows an alignment that overcomes the problems arising from any warping

of the board. Basically, there is no real innovation

in all this. It is a series of activities that improve what already exists, such as two-stage printers, double woven wire and double stencils. These features enable a cycle time of a few seconds to be reached. Such a work concept allows production changes without stopping the machine, an asynchronous process or parallel process on different codes.

Squeegees

During the screen printing process, the squeegee runs in direct contact with the laminate of the printer, made of stainless steel or nickel.

As it moves, both the blade and the laminate are subjected to wear from the pressure exerted by both these metallic parts, due to the running speed and to the chemical substances in the soldering pastes. This reduces the useful life span of the parts that come into contact, resulting in a series of costs from machine stoppage for maintenance to purchase of spare parts. Such results affect both

general production costs and the final quality of the process.

The use of treated squeegees leads to a lower friction coefficient between blade and frame. As a consequence, less heat develops during spreading of the soldering paste, increasing the average lifespan of blades and stencils. As far as quality is concerned, there is no scooping or scavenging, giving better consistency and accuracy of the volume deposited. Process quality and productivity are enhanced and maintenance and end-of-line rework costs are reduced.

22 PCB november 2013

E VS International will debut at productronica 2013 the newest system in its award-winning EVS

series, the EVS 500.EVS has produced a world fi rst with its

new world-leading technology. The new concept in dross recovery dispenses with air driven pistons and the chamber, teeth and pistons design.

The new patented technology inverts the solder / dross separation pot, and adds an innovative 180° rotating facility. As no teeth are used to separate the solder/dross, the ingot coming from the machine is very clean.

The EVS 500 has a small footprint, yet is fully automatic. Once the operator loads the machine, everything else works in an automatic mode. Additionally, the EVS 500 offers all of the same safeties and locking

A New Concept for Dross Recovery

systems of the larger EVS 8K/10K models.With the new EVS 500, EVS has managed

to drastically reduce the size, weight, complication and footprint, while improving

the tried and tested performance of the larger EVS systems.

EVS has continually improved the performance of the EVS units and the new EVS 500 is no exception. EVS is running at record recovery rates on its beta test production facilities with experienced users of the current range being pleasantly surprised by the improvements in recovery rates. With the new concept of improved performance plus the signifi cant reduction in price enabling everyone to enjoy the savings an EVS solder recovery system can offer.

www.solderrecovery.com

Hall A4, Stand 141/1

N ordson DAGE, a division of Nordson Corporation, are pleased to announce a

strategic partnership for distribution of their market leading X-ray systems in Italy and Malta.

“Cabiotec are the leading supplier of electronic assembly equipment in this region and have a long and successful relationship with our sister company in the Test and Inspection Group, Nordson YESTECH. This made them the perfect choice,” said Keith Bryant, Sales and Marketing Director.

Cabiotec have a well-deserved reputation for excellent sales, support and service. They have a very long history

Nordson DAGE Appoints Cabiotec as Its Distributor for X-ray Inspection Systems in Italy and Malta

of superb customer relationships with all of the major players and also the SMEs. Cabiotec are very well set up, with a

very informative Web site and a large demo facility that will further improve their business. Already they have a fully Nordson DAGE trained X-ray Engineer and they have received sales training, so will “hit the ground running.” Both parties are excited about the opportunities and as the market is picking up it is an ideal time to start this partnership.

www.cabiotec.it

Hall A2 Stand 438

FPE è una società italiana leader nella produzione di etichette professionali per i sistemi di identificazione.

Negli impianti di assemblaggio automatico dei PCB viene sempre più richiesto il monitoraggio della movimentazione dei pezzi nelle diverse fasi di processo. L’applicazione di un’etichetta su ogni PCB, all’inizio della linea, costituisce ancor oggi la soluzione più semplice ed economica per realizzare un sistema di rilevazioni dati.

L’etichetta assume una importanza fondamentale perché deve:

Range di temperatura: -40°... +537°C

I films di Polyimide bianco stampabili a trasferimento termico sono disponibili in tre spessori:

FPE offre oltre al Polyimide bianco, sei colori (rosa, giallo, arancio, blu, verde e viola

Tutti i materiali per alta temperatura in combinazioni con i nastri appropriati, sono approvati UL, MIL-STD-202G, MIL-STD-883E. Sono conformi alle Direttive RoHS e Reach.

ETICHETTE PER ALTA TEMPERATURA

24 PCB november 2013

Allegro Sigrity SI solution

Current density simulation of split plane on a PCB

H igh-tech companies developing complex chips, packages, and boards grapple with power

integrity (PI) and signal integrity (SI) issues arising from rapid increases in IC speed and data transmission rates combined with decreases in power-supply voltages and denser, smaller geometries.

At the same time, higher I/O counts, multiple stacked chips and packages, and greater electrical performance con-straints are making the physical designs for IC packages more complex. To ad-dress these issues, you need advanced power integrity and power-aware SI to-ols. This level of technology allows you to see the complete picture and achie-ve signoff-level verification through your analysis.

Breakthrough Cadence® solutions, based on patented and proprietary Sigrity™ technologies, can help you overcome these challenges.

Cadence now has industry-leading power and signal integrity technology from Sigrity.

The Cadence Sigrity technology targets complete power-delivery system analyses across chips, packages, and boards; system-level SI analysis, including simultaneous switching noise (SSN) analysis of high-speed

Cadence SI/PI Analysis – Sigrity

signal transmissions; and, modeling and analysis of single- and multi-chip packages, state-of-the-art 3D packages, and systems in packages (SiP).

Sigrity’s SI / PI analysis technology can be used to analyze design data from all popular PCB and IC package design tools. The Sigrity technology can be acquired

as standalone point tools as well as an Allegro® Sigrity base + options configuration that features seamless integration between design and analysis technology.

Advanced extraction and analysis technology suitable for analysis experts is available in an environment where changes to the physical design can be made and saved in the same design format created by design layout engineers. While layout engineers may not have expertise required to run advanced analysis tools, sharing the same environment used by analysis experts will allow them to run first-order analysis and help make decisions during the design process.

For final verification, the expert can call on the advanced options and confirm a design is ready for tapeout or, if necessary, experiment with design changes to optimize performance.

www.cadence.com

Partner ECWC13:

International Exhibition and Conferencefor System Integration in Micro Electronics

Nuremberg, Germany, 6 – 8 May 2014

Hosted by:

13th Electronic Circuits World Convention

Nuremberg, Germany, 7 – 9 May 2014

Two renowned events – one location:Make the most of the opportunities offered by this unique gathering.The latest information about market and technology trends, includingon the subjects supply chain management, global market trends,manufacturing, packaging technology and energy and resourceefficiency, is being presented at the 13th Electronic Circuits WorldConvention (ECWC13). At SMT Hybrid Packaging you will find outabout the latest developments along the entire process chain ofelectronics manufacturing.

The place to be!smt-exhibition.com

Organizer:

Connecting the worldecwc13.org

E verett Charles Technologies’ (ECT) is a manufacturer of electrical test products and services, including Pogo test contacts, semiconductor test products, bare-board

automatic test systems, and bare and loaded PCB test fi xtures. Through company representatives ECT will discuss, in occasion of the productronica 2013 event, innovative contact products, products from the fi xture service group and fi xture accessori-es, including:

Contact Products:- Edge;- Metrix;- LFRE;- High Current.

Fixture Accessories:

- VG Mass Interconnect Products;- LED Check;- Open Testing Products.

Fixture Service Group:- HP3070 ZOOM Fixture;- Genrad Medium Fixture with Vac Cover;- VGR-4 Receiver and Fixture;- VGR-12 Receiver Rackmount with new designed un-customi-

zed fi xture kit;- New Linear Gate.

www.ectinfo.com

Hall A1 Booth 567

ECT, Electrical Test Products and Services

26 PCB novembre 2013

Fabbricanti di circuiti stampatiFabbricanti di circuiti stampatiRubrica dedicata ai più importanti costruttori di PCB, provvista di singole

schede personalizzate e descrizioni dettagliate delle attività di ogni produttore di circuiti stampati. Vengono raccolte in questa sezione

aziende che operano su diverse tipologie di prodotti: dai monofaccia ai doppio strato, dai multistrato ai fessibili, dai rigidi-fl essibili ai più

avanzati prodotti della printed electronics.

Servizi: PROTOTIPI Mono e Doppia-Faccia in 24H, Multistrato in 48H, PRODUZIONI in 5-10 GG.Tecnologia: microforatura, fori ciechi e interrati, ne-line, ne-pitch, BGA.Materiali: FR-4, CEM, Termalglad (IMS), Te on, essibili (Kapton) e rigido- ex.

Finiture: H.A.L., E.N.I.G., Stagno chimico, Argento chimico, OSP, Oro elettrolitico (RoHS).Standard: IPC-A600G-Classe 2.Analisi di fattibilità per prodotti fuori standard.Omologazione UL: E155803Certi cazione ISO 9001:2000

Tecnometal - Tel. 02 90.96.99.35 - Fax 02 90.96.98.54 - commerciale@tecnometal-pcb.com

This is why GREENWAY, the fi rst Ecolabel in the chemistry fi eld, was launched in 2012;- the presence of our experts in more than

20 countries in order to provide technical solutions and meet the customers’needs.The know-how acquired in over 40 ye-

ars of experience, the exchange between experts from different countries and the ri-gorous laboratory tests optimise the com-pany’s performance. Moreover, all 10 bran-ches and all 7 production sites are certifi ed ISO 9001.

To better serve its markets, the com-pany is organised into three divisions: BU ELECTRONIC, BU SURFACE TECHNOLOGY and BU FINE CHEMICALS.

www.inventec.dehon.com

Hall A4 Booth 271

Inventing a sustainable future

I nventec, a Dehon Group company, was born from the merger of Promosol and Sotragal. It has served the industry for

over 40 years. Its mission is to fi nd sustaina-ble solutions through:- the technical performance of its products

and services for high-tech sectors (elec-

tronics, aerospace, medical, precision me-chanics);

- the protection of health and the environ-ment with the replacement of hazardous substances and the development of low risk alternatives before the regulations re-quire so.

INVENTARE UN FUTURO DURATURO CON I NOSTRI CLIENTI

Per questo motivo sviluppiamo nei nostri laboratori di ricerca test accurati e rigorosi in grado di assicurare la perfetta efficaciadei nostri prodotti.Oltre il 25% della forza lavoro di Inventecè dedicato a questa missione.Lo scambio continuo di opinioni tra gli esperti dei diversi paesi permette di creare prodotti innovativi con performance di alto livello.

L'innovazione rimane la chiave per il successo di Inventec!

Inventec, fusione del gruppo Promosol e Sotragal Dehon, serve l'industria manifatturiera da oltre 40 anni.Dispone di 10 filiali in Europa, Asia, America e 7 siti produttivi tutti certificati ISO 9001 attrezzati con laboratori di controllo.Per meglio servire i vari segmenti di mercato,l'azienda è organizzata in tre dipartimenti:

ELECTRONIC: prodotti destinati all'assemblaggio di componenti su circuiti stampati e alla pulizia degli stessi.

SURFACE TECHNOLOGY: prodotti destinatiai trattamenti di pulizia e protezione di superfici in mercati diversi (gioielleria di lusso, aerospaziale, micro meccanica,automobilistico, medico)

FINE CHEMICALS: una gamma di solventi e gas per la formulazione di aerosol, schiume poiluretaniche esterilizzazione di attrezzatura medicale. Stiamo inoltre sviluppando un'offerta per il recupero e il trattamentodi rifiuti (prodotti chimici e bombole di gas) secondo le vigenti normative europee.

Il punto di forza di Inventec è la decennale esperienza acquisita sul mercato: le performance tecniche dei nostri prodotti e i servizi per le industrie high tech (elettronica, aerospaziale,attrezzatura medicale, meccanica di precisione); la tutela della salute e dell'ambiente con lo sviluppo di soluzioni per controllare il rischio delle sostanzapericolose non sostituite fino ad oggi; la competenza dei nostri esperti in oltre 20 paesi per garantire l'applicazione della nostra tecnologia e delle soluzioni per soddisfare le esigenza dei clienti in termini di prestazioni. Per i nostri clienti la performance del prodotto e soprattutto il processo di lavorazione sono fondamentali.

INVENTEC PERFORMANCE CHEMICALS ITALIA S.R.L.Via Pusterla, 8

20013 - Magenta (MI)Tel 02/48401206 - Fax 02/48461341

Email: mnebbia@inventec.dehon.com Web: www.inventec.dehon.com

28 PCB november 2013

M any products for t e l e c o m m u n i c a t i o n s , information technology

and the automotive industry have been enhanced with increased functions and intense interaction between these functions. At the same time, there has also been an increased integration of the board and a reduction in size of the final device.

These changes in functions and dimensions have led to a miniaturization of the components and substratum, making it more difficult to choose the right pick & place.

What’s more, while there is increasing differentiation of products, they are released onto the market in less time. In the face of global competition, the most successful companies are those able to offer the best product, differentiated according to consumer bracket, with the most rapid innovation.

In such a scenario, flexible production systems are obviously an essential requirement. Miniaturization and flexibility therefore become the two key variables in surface mounting, together with the demand for a high level of precision. In addition, functions and solutions are enhanced in order to obtain

SMT AssemblyWhen the production scenario changes, assembly systems also change. A number of factors can determine the choice of a pick & place machine, such as variation in production targets, where the model “lots of codes and low volumes” has become common

by Davide Oltolina

▶ PICK & PLACE

greater productivity, while ensuring flexibility at the same time.

Effi ciency and Flexibility

Today pick & place machines are becoming increasingly modular. However, they can still produce at high rates, thanks to their very high placement speed. At the same time, the fl exibility offered by their different confi gurations guarantees excellent performances for high-mix solutions. System dimensions are reduced to save space and allow them to be installed

even in smaller machinery. Some models have an extremely compact platform – just one metre wide. As this limits the length of the line, it makes this type of machine particularly suitable where space is scarce. According to their make and model, pick & place machines can assemble a variable number of heads, reaching an assembly speed of 100,000 components per hour, according to IPC9850 standard. With single or double woven-wire, the systems can be adapted to a large number of production layouts. A versatile confi guration makes them suitable for a wide range of

applications, particularly for small- to medium-sized PCBs, such as those used for portable instrument goods. The new models are conceived not only with a view to reducing space, but also with the possibility of mounting a wide range of components onto the same platform. Systems for surface mounting odd-shape components, although heavy and large, are being offered increasingly often. With heads spanning up to 100 mm, components with a height of 45 mm and character size of up to 100 x 100 mm and weighing up to one kilogramme can be mounted. With these machines, power modules used both on electric and hybrid (P

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29PCB november 2013

vehicles, such as the voluminous insertion connectors, requiring considerable assembly pressure, or large shielding for telecommunications devices, can be assembled, for example.

Today, configuration time has become more important than overall placement time. Consequently, market demand is mainly for systems able to handle a large number of loaders, preferably intelligent loaders that can also be changed quickly, so as to drastically reduce machine set-up time.

Numerous solutions have been examined to allow rapid handling of machine set-up during the change of product code. One of these solutions is the tray-feeder for substituting the entire pallet of feeders in one operation. Another is the use of intelligent feeders, which, having interchangeable front and back sides, enable fast reconfiguration while the machine is operating. Solutions such as these make today’s machines considerably faster than previous generations.

For functional purposes, the

software for programming and handling the system has gradually acquired prime importance. In the form of an evolved graphic interface, its functions range from import of CAD data to line balancing. Among the most advanced functions is optical recognition of components, for developing the library. This leads to a notable reduction in programming time.

Why Intelligent Feeders?

Although the adoption of intelligent feeders requires greater investment initially, it enables accurate control in set-up, the most delicate stage, due to the high level of dexterity involved. Loading the reels of components onto the feeders and their subsequent positioning in the machine is an essentially manual operation.

This stage is therefore particularly susceptible to errors, especially if there is a particularly high number of components.

The machine can identify the feeder placed in each slot and alert the operator of any error, however slight. The use of smart feeders reduces the margin of error and, at the same time, simplifies the operator’s work, resulting in more efficient traceability and a more accurate inventory of the parts used.

One of the most common operations is the substitution of a finished roll of components. With intelligent feeders, the system detects the manoeuvre in operation and proceeds to move the grip onto the next component. It only

completes placement of the missing component when the new bobbin is correctly positioned. The feeders can be put in any location and the system will recognize and identify them. By equipping the pick & place with a bar code and the board with a series number, each production batch is made fully traceable, as the distinguishing data of the components can be matched with the PCB on which they are assembled. A whole series of statistical information can be downloaded by interfacing the system with a production management program. In this way the intelligent feeders can provide the quantity of components used and transmit the surplus.(P

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County-S EVO

County EVO

Since 15 years we produce the SMD motorized counter .These are the improvements made by the new line :

- (now is 220cps max, before was 100cps max)-- An easy to use (LCD display with 160x104 pixel)- (before was 400mm)- (Still in development)- , more durable and easy to adjust-- for printing on 57x51mm removable adhesive- able to store the last 500 counting data

County-SCounty-S EVO

Counting speed doubledBarcode reader input

graphical interfaceMaximum reels diameter is now 650mmEmpty Pocket CheckNew friction systemSelection of the operatorProfessional thermal printerDatalogger

Since 30 years we produce the manual counter for axial,radial and SMD .These are the improvements made by the new line :

-- for printing on 57x51mm removable adhesive- able to store the last 500 counting data

CountyCounty EVO

Barcode reader inputProfessional thermal printerDatalogger

31PCB november 2013

On the crest of a wave for 40 years

I teco Trading provides equipments and solutions for the Electronic Industry since 40 years, and is specialized in

component counters, ESD protection and equipment for the production, and solutions to problems caused by moisture in MSDs and PCBs.

COMPONENT COUNTERS

Professional counters for axial, radial and SMD taped components, and for the count of bulk components.

New models are now available:- Motorized counter for SMD (County-S

EVO)- Manual counter for axial, radial and SMD

(County-EVO)They represent a signifi cant step forward

in terms of performance, especially for the barcode reader option combined with a thermal printer option for printing on removable adhesives.

ESD LINE

A complete line of ESD protection: personal protection, storage, ionizers, consumables and instrumentation (test stations, surface resistity tester, megohmmeter ...)

MSD LINE

Lead-free soldering processes have increased considerably the problems caused by moisture in printed circuit boards and in MSD (Moisture Sensitive Devices). To solve these problems Iteco has developed a line of products for storage, packaging and baking the MSD components and PCBs.

The line includes dry cabinets (with optional baking at 40 °C), ovens for baking of PCBs and MSD components, professional sealers with and without vacuum for packaging of dry-pack, and thermo-hygrometers equipped with a data logger for a correct management of the Floor Life.

Ovens for baking with innovative indicator and humidity control that can ensure <5% RH for 40 °C <T <100 °C (Sahara Dry)

NEWS

Our full product catalog is available online at www.iteco.it and is printed in 6 languages (Italian, English, French, German, Spanish, Hungarian).

The evolution of Electronics and its continued dynamism are ironically represented by the cover of our new catalog 2014 distributed in preview at the show at Productronica.

These are the key changes or evolutions of our products:- Motorized counter for SMD (County-S EVO)- Manual counter for axial, radial and SMD

(County-EVO)- Ovens for baking with indicator and

humidity control that can ensure <5% RH for 40 °C <T <100 °C (Sahara Dry)

- Test station with fi ngerprint operator identifi cation (Test Station EVO)

- Calibration unit suitable for all of our test stations.

- Continuous Monitor to check the integrity of the operator and one ESD worksurface.

- New version of DryLogger, the thermo hygrometer with data logger and now with alarm.

- Our dry cabinets can now be equipped with rack trolleys and alarm module

- Carbon fi bre static dischargers to neutralize static electricity on fl at surfaces.

- Expanded our line of chairs with YOUNG chairs

- Detergents that cleans work surfaces and fl oors releasing a dissipative patina (ELECSTAT-G)

- ESD socks- ESD nitrile gloves

www.iteco.it

Hall A4 Booth 318

Motorized counter for SMD

32 PCB november 2013

Tab 1 - The structure of i-storage cube

Cell unit N° slot Capacity

7”

8 mm 1 122

12 mm 1 101 16 mm 1 81 24 mm 1 61 32 mm 1 41

15”

8 mm 2 122 12 mm 2 101 16 mm 2 81 24 mm 2 61 32 mm 2 41 44 mm 2 34 56 mm 2 28

T he new i-storage cube is made by the first module, named MASTER, i-storage cube. Each slot can be

configured to store 7”, 15” reels and/or boxes for other kind of components.

There is the possibility to add other modules, named SLAVE, with different configuration depending on customer request. The standard store capacity for Slave modules is 8 frontal and 8 rear slots, configurable depending on customer capacity request for number and dimension of reels. Each modules (Master and Slaves) can be featured on single slot in every moment, even after installation, making i-storage the unique internal and external automatic modular cabinet.

Operation

All materials to store into i-storage have to be previously labelled by the specific software and printer included, to be able to manage everything stored by an unique code. If already present on customer company a label, it can be included into the system by a little software’s customization.

After this step, all codes can be introduced into the storage simply

i-storage Cube. A new automatic modular cabinet with high capacity

inserting reels / trays on the racks. Once stored the components, it’s possible to manage the drawings simply inserting the component names.

By using recipes, software has the possibility to calculate the remaining quantity of components for each reel, and instruct the claw to pick-up reels (with FIFO rule) and put them into delivery racks with a determinate order (ex. the first reel on top is the first reel on left side of P&P).

Once first two racks are full (one for 7” reel and one for 15”) it’s possible take them out simply pulling them on a comfortable carrier by some guides, and bring it on producing lines.

As soon as two empty racks will be inserted into the storage, it will continue

to fill them with missing codes to finish the recipe. Drawing component’s options are manually selected by operator, and it would be possible to have on racks just one reel for each components for P&P, two or more if are used P&P with parallel spindles to manage as better as possible the double pick up simultaneously.

All these functions are made automatically by the storage, without anybody take care of it (excluded operation of changing delivery racks), so allow to prepare components necessary for the next recipe without keep someone blocked for this job; it can be easily managed by the same operator that is taking care of the production line with relevant amount of money spared by the company.

Everything is done in a hidden time (preparation of “B” recipe in the meantime that “A” recipe is under mounting) and errorless (everything is managed by barcodes). Even more, is avoided the possibility to insert wrong codes into the storage or to prepare the whole P&P and realize only at the end that components are not enough to finish all the job.

www.itronik.it

Hall A2 Booth 232

Yamaha Motor Intelligent MachineryJapan’s Leading SMT Supplier

ManciniEnterprise srlVia Fabio Filzi 71 20831 Seregno (MB) ITALIA

Tel.: (+39) 0362 1857466 Fax: (+39) 0362 1858362

info@ManciniEnterprise.com

12.–15. November 2013Yamaha Motor IM

Padiglione A3 Stand 323

Trusted Technology Partners:Yamaha Motor IM & Mancini Enterprise Fornitori SMT Nr. 1 in Italia

34 PCB november 2013

that ‘senses’ its own temperature and closely maintains its pre-set idle temperature for the life of the heater-tip.

The MX-500 retains dual port, switchable 40W operation in a new housing, while introducing numerous new features including: integrated power indication meter, user programmable PowerSave mode, ground fault interrupt, universal power supply and compatibility with existing MX-5200 products.

Metcal’s HCT2-120 Hot Air Pencil is a new addition to its offering of convection rework tools. It features a 120 watt ceramic heater and dual stage air pump.

www.metcal.com

Hall A4, Stand 221

New Metcal product family

T he new MX-500 Soldering and Rework System and HCT2-120 Hot Air Pencil will be displayed

for the first time at productronica 2013.Metcal’s updated MX-500 Soldering

and Rework System builds on the features

that make it an icon in the industry while adding features and updating its appearance with an exciting new look.

The system utilizes SmartHeat® Technology wherein each cartridge is equipped with a self-regulating heater

T he Lasertech’s SMT Division can pro-duce everything is needed for the silk screen printing process, frames

and stencils of all types and dimensions su-itable for the depositing of soldering stuff, conductive glue and the glue being used in the silk screen printing process.

We can produce the equipment for the “Rework” and “Reballing” operations, Squeegees and Doctor blade holders for all types of silk printing processes. Lasertech can produce stencils with different thicknes-ses (up to three levels of thickness) in order to optimize the volume of the Solder p aste on the different types of components.

Applications- All types of printed circuit boards

Workable materials- 302 - 304 stainless steel between 0.05

and 0.3 mm thick

A Company at your ServiceAcquisition of Chemical Machining spa

From May 2013, Lasertech group has ex-panded with the acquisition of Chemical Machining spa and therefore also of its brand Seritronics, by the way of this opera-tion Lasertech becomes one of the suppliers of Stencils and smd foils of greater impor-tance in the European market, thanks to production capacity due to its laser depart-ment with 8 machines, all of the latest gene-ration which allow to ensure the best quali-ty and the best delivery of the foils, as well as being all complete with dimensional con-trol and pertinent certifi cate of slots.

www.lasertechsrl.eu

Hall B2 Booth 114

35PCB november 2013

to access live and detailed shop-floor information directly from the integrated shop-floor, without the need for extensive interface development or inter-system dependencies.

One example of many potential innovations from this technology is the usage of material consumption and spoilage derived directly from all points of consumption, replacing the MRP “back-flush” operation, providing ERP with vital information needed for short-term planning and materia l inventory order management.

www.valor.com

Hall A3 Booth 443

New in Version 12

V alor Warehouse Management represents a first for the industry, as a supply-chain

extension enhancing ERP/MRP operation by providing inventory accuracy across all materials storage locations, and automated management of logistics operations, improving ERP response to demand changes and reducing inventory

costs. Valor Warehouse Management provides total material control over all warehouses, remote warehouses, managed shop-floor point of use stores, and shop-floor material WIP, featuring Lean automated “Kanban” and “Just In Time” technologies.

Valor Information Highway introduces a new pathway for enterprise systems

36 PCB november 2013

by Dario Gozzi

▶ SOLDERING

A selective soldering in action

For correct soldering, in wave soldering, as in refl ow or rework, it is important to get the thermal profi le right. Gauging the refl ow and cooling ramps correctly ensures reliable soldering joints

The Art of Joining

T he aim of the soldering process is to form the inter-metallic layer between the alloy and the metal of the pads

on the printed circuits, and between the alloy and the metal of the terminals on the component side. It is the intermetallic layer that gives the joint its mechanical resistance and electrical conduction. For correct formation of the joints, it is necessary to study the right thermal profi le for the PCB, for the technology used and the alloy used.

In refl ow, the different stages of the thermal profi le (pre-heat, soak, refl ow and cooling), by duration and gradient, depend as much on the type of PCB and its

components as on the type of paste.The thermal profi le is a time/temperature

interpolation. Thus accurate control of the temperatures, times and up and down gradients will be more accurate if certain expedients are followed. The area of contact between the active part of the thermocouple and the surface where temperature is to be measured must be as wide as possible, so as to have the best heat conduction. In order to have maximum response speed, the active area of the thermocouple must be as small as possible. This is to limit heat inertia, leading to delays, which gives a false reading. The diameter of the wire linking the

probe to the tool must be proportioned. If it is too large, it acts as a heat conductor, taking away part of the heat that should be concentrated on the active part of the probe, thus lowering the response time.

The most common source of error in temperature measurement is due to faulty joining of the thermocouple. In the presence of heat energy, the probe generates a difference in tension to the ends of the two different metals it is made of. This tension is proportionate to the temperature reached. Most thermocouples are J type, composed of an Fe (positive) wire and CuNi (negative), or – more frequently – they are K type, with a positive end in NiCr and a negative one in NiMnSiAI. Working temperatures exceed 1000 °C and measurement accuracy is 2.2 °C.

Convection Ovens and Vapour Phase

In a convection oven, the effi ciency of heat transfer depends on different variables, including volume of the fl ow towards the PCB, the speed of the jet, the confi guration of the oven and its heating elements. Effi ciency in heat transfer derives particularly from the impact of the fl ow, its volume and its speed. Other important factors are capacity to maintain an even distribution of the temperature over the whole PCB and accurate control of the fl ow and its temperature, guaranteeing repeatability over time. The size of the fl ow in relation to the distance it comes from determines

37PCB november 2013

Solder wave under inerted atmosphere

Refl ow oven hood

the BGA leads to stress during cooling that harms the soldering of the components. By reducing the slope of the down ramp of the temperature this stress can be relieved. The same problem is also encountered with PCBs with non homogenous masses on them. The dilemma is whether to have rapid cooling, which gives a fi ne grain size (with a high mechanical resistance of the joint), or to adopt a low cooling speed that minimizes stress. There is no guiding rule that gives a complete solution. With experience and common sense, rapid cooling will be chosen if there are only small components on the board, and slow cooling if there are also larger components. Above all, every care must be taken when taking the temperature. Two simple rules of physics, which always come into play in every thermal process, need to be considered here:1) in any point of the oven, if the temperature

is above that of the PCB, it will start to he-at up; in the same way, if the temperature of the oven is below that of the PCB, it will start to cool down;

2) the greater the thermal difference betwe-en the oven and the PCB, the greater the speed with which the PCB will change tem-perature. Rapid cooling requires a thermal barrier

between the refl ow zone and the cooling zone, fast convection of cold air and an effi cient cooling system of the cooling unit.

its angle of impact. It also determines the volume and speed towards the PCB. Heat transfer is highest when the angle of impact is equal to zero, and diminishes when it goes below 90°. It is nevertheless signifi cant that it is speed and not volume that determines heat transfer. For a high level of effi ciency in heat transfer, without dispersing the heat while the sides of the oven are heating up, correct design of the layout of the opening matrix (which generates the convective fl ow) is arguably the most important factor.

In vapour phase ovens, all these considerations are no longer valid, as PCBs are immersed in technical liquid, which transfers its latent heat to them. The thermal profi les are ultra-precise and they offer complete security in avoiding exposure of the PCBs to temperatures above those desired. In fact the maximum temperature reached is equal to boiling point of the liquid, which is known, fi xed (it can be selected in advance) and independent of the time the board remains in the vapour phase. For in the vapour phase, thermal masses, colour and fi nishings of components become non-infl uential.

Cooling

One of the most important aspects of thermal profi les is the “heat gradient

of cooling”. A number of studies have confi rmed that the cutting force of the SAC alloy is slightly below that of the SnPb eutectic system alloy, and that the fi ne grain size of the metal, obtained by inducing rapid cooling, can recover part of this force. It is well known that metallic material with a large grain size usually has a lower mechanical resistance than one with a fi ne grain size, obtained by rapid cooling. Large-size BGA, on the other hand, require rather slow cooling times. Using the SAC seems to make the balls more fragile. Thus the difference obtained from the different contraction between the PCB and

38 PCB november 2013

M IRTEC, “The Global Leader in Inspection Technology”, is exhibiting at productonica

its line of 3D AOI and SPI Inspection Systems. Company representatives will demonstrate the MV-9 Series 25 Mega Pixel 2D/3D AOI System, MV-9UP LED Inspection System with a 15 Mega Pixel camera and 6 μm Confocal-Sensor, MS-15 Series 25 Mega Pixel 3D SPI System, MV-7xi In-Line AOI System, and MV-3L Desktop AOI System.

The MV-9 2D/3D In-Line AOI Machine is configured with MIRTEC’s OMNI-VISION 3D Inspection Technology that combines MIRTEC’s exclusive 25 Mega Pixel 2D ISIS Vision System with the Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies. Fully configured, the new MIRTEC MV-9 machines also will feature four (4) Ten Mega Pixel Side-View Cameras in addition to the 25 Mega Pixel Top-Down Camera.

This new model can increase inspection times significantly when deploying standard requirement lenses. Alternatively, it can make production speeds whilst deploying the 7.7 μm lens for components such as 03015 chips. The MIRTEC systems also can be configured with the unique high speed data transfer technology CoaXPress.

The world’s highest specification 3D SPI system the MS-15 features 25 Mega Pixel Cameras with the most detailed 7.7 μm lens and the high-speed data transfer

A Global Leader in Inspection Technology

CoaXPress to ensure the fastest and most accurate SPI inspection, i n c o r p o r a t i n g Shadow-Free Dual Probe 3D as well as Laser Anti-Warpage.

MV-9UP is part of the MIRTEC family of LED Inspection Systems featuring a 15 Mega Pixel camera and 6 μm Confocal-Sensor.

MIRTEC’s MV-7xi In-Line AOI Machine, powerful yet simple to use, is configured with the exclusive 10 Mega Pixel ISIS Vision System. This revolutionary optics system is comprised of a 10 Mega Pixel Top Down camera and a Precision 13.4 Micron Telecentric Compound Lens. The system is configured with Four (4) Ten Mega

Pixel Side-View Cameras, a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system.

The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system. This system is configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. Also, it features the Intelli-Beam Laser System.

This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

www.mirtec.com

Hall A2 Booth 578

40 PCB november 2013

B esides launching DesignSpark Mechanical, RS further enhances customer online experience with

latest website upgradesOnly two months after RS Components

launched its powerful free, fast and easy-

New powerful toolsto-use 3D design software, DesignSpark Mechanical, the company announced a new further enhancement of its website to reduce the number of clicks customers need to perform, making it faster and easier for them to find and buy the

products that they want. DesignSpark Mechanical, which already registered over 50,000 downloads since its launch, is the new free 3D design tool RS developed with SpaceClaim to help engineers overcome all those barriers (like the prohibitive costs and the considerable investment in learning time associated with traditional softwares) that have always stopped potential users from adopting any kind of 3D CAD tool. Not only RS developed a software which is available for free, but the tool is so easy to use that engineers become fully conversant with the software within minutes, rather than the weeks or months required to become skilled with traditional 3D CAD tools.

Besides this, RS also announced that its eCommerce system has been further enhanced.

rswww.it

when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. The reliability of Nihon Superior’s SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fl uidity provides faster wetting and increased spreadability over SAC305, which is benefi cial in wave soldering and hand soldering applications as well as in refl ow. The company and its partner, Balver Zinn, continue to introduce new soldering products based upon its SN100C alloy.

www.nihonsuperior.co.jp/english

Hall A4, Stand 451

SN100C Lead-free Solder Alloy

N ihon Superior was founded in 1966 when it began marketing unique fl ux products imported

from the US. The company made its mark on society by gathering the most advanced

soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.

A turning point for the company came

FLEX PCB and rigid PCB up to 1.0 mmLaser depaneling 4-8-12 WVery High depaneling speed Very High accuracy cuttingNo mechanical stress on componentsSW compensation of the shape deformationsPCBs Automatic handling and sorting

FLEX PCB and rigid PCB up to 0.6 mmLaser depaneling 4-8 WHigh accuracy cuttingNo mechanical stress on componentsSW compensation of the shape deformations

Hall A3 - Stand No. 458München, 12-15 november

www.osai-as.it

42 PCB november 2013

▶ TEST

by Davide Oltolina

All inspection systems are able to some degree to detect defects originating in the different stages of assembly. What makes the difference is their ability to identify the source of the defects

Accurate Quality Controls

A wide assortment of components are used today in PCB production. They can vary from

the 0201 to the ultra-fine-pitch of the quad flat pack, from the large connector to the power component. The tendency in PCB design today is to use every available square millimetre of the surface, creating increasingly high-density PCBs. These still need to be inspected at the end of the line, and the economic and quality benefits of using an AOI are substantial, although not always immediately obvious without the experience needed to measure them and count them in terms the management can understand. Taking stock of one’s current process flow is the basis of the strategy for introducing the AOI system, considering the quality obtained in screen printing, the accuracy

of the placing and the level of defects coming out of the remelting oven.

The advanced process control reached by modern AOI, 3D/2D, X-ray and laser inspection systems

ensures feedback in real time on any defects found. Such systems come with highly developed electrical test platforms, able to find even the most well-hidden malfunctions. Using the right test or inspection system for a particular search enables accurate investigations to be carried out and, if both are used, to cover wider search areas.

An increasing number of companies have changed their production context, in order to optimize the flows of the different processes and optimize the distribution of the human potential that manages them.

Electrical test systems have integrated the process flow, leading to a definition of the quality of the process rather than the level of defects at the exit from the test stage. The information generated by the test device has been used to improve the process, converting product defects into information on defects of the process.

AOI systems and X-ray inspection systems, whose marked improvement in quality in recent years has put them at the top of the league of inspection tools, are also part of this new vision. The data collected at the different stages of production, with the aim of preventing any deviation – the cause of defects – in real time.

The advantages are twofold. Firstly, there are economic savings due to the prevention of defects, which avoids the need for rework, and due to optimization of the process flows. Secondly, a wealth of experience is acquired and put to good use, without being dispersed and divided up between the different sections.

Although knowledge cannot be counted among the tangible assets of the company, it is still an essential asset for preventing and reducing defects to the absolute minimum. It also avoids useless checks.

The Electrical Test

The best choice today in electrical tests are systems that possess specialized

43PCB november 2013

The test vertical architecture keep the board perfectly plane (courtesy SEICA)

Contemporary test of two boards (courtesy SEICA)

software and hardware architecture, but also offer the advantages of being open towards exterior equipment. One of the strong points of a modern ATE are the digital channels. When they are studied to respond to specific requirements, they are equipped with their own architecture. Speed, control power, handling of a complex range of data, complete timing flexibility and a wide range of tensions are other features to consider when adapting the system to specific requests. The serial digital test, with a wide range of protocols, usually comes with special equipment integrated into the architecture of the main system. An example is Boundary Scan technology. Other commercial equipment is integrated into the system’s architecture to provide analogue tests. For programming, the manual generation or guided simulation of a test program includes a link to the CAE database, to the sources of the external programs, and to any programs from other testers. The debug and the use of the test program include functions such as stopping at an error, cyclical test, conditioned omissions, changes in real time and, using probes, the possibility to find both analogue and digital signals on the nets that are inaccessibile to circuit being tested.

The Funcional Test

The functional test is still the main system for ensuring correct functioning of the product, once it has been placed in its operating environment. This system is indispensable every time criticality of the application or the cost/complexity ratio of the final product requires a high level of long-term reliability. The

functional test is extremely important for sectors (such as the military and aerospace) where long-lasting products are involved, and old and new devices coexist and continue to be tested.

The system is used to check a mixture of digital and analogue, memory and power circuits, which sometimes work in radiofrequencies and often require differentiated strategies and tests. The functional test includes control of a high number of critical functional circuits. It also includes control of the structural check or absence of hardware errors. It carries out complementary functions in the search for those errors not necessarily found in the previous test stages. All this requires a high number of analogue and digital stiumuli, which must be continually applied to the unit being tested, at the same time as monitoring of just as high a number of analogue and digital answers, with full control of their execution.

On this score, it is to be remarked that the increasing use of electronic products containing an auto-diagnosis, built-in self-test, reduces but does not eliminate the cost of the functional test.

44 PCB november 2013

A variation of Sono-Tek’s proven, versatile SonoFlux Servo system, the SonoFlux Servo Dual

Flux system presented at productronica 2013, was introduced in 2012 to enable customers to perform rapid process changeovers with dual flux capabilities for the ultimate flexibility in wave solder fluxing. A fluxing capability and user friendly control are standard for the SonoFlux Servo Dual Flux. This new system offers precision metered flow with dual flux delivery and features

Ultrasonic Spray Fluxing System

the following:- Full Windows-based control recipe-

driven control of flux 1 and flux 2

process parameters with recipe storage;- Automatic flux purge when switching

fluxes to eliminate cross contamination;- High precision flux delivery pump;- Compatible with all fluxes (aggressive

water soluble flux upgrade possible);- Selective area fluxing capability.

The company’s full line of SonoFlux spray fl uxers includes systems for selective wave soldering and stationary or reciprocating systems for selective area or full PCB coverage.

www.sprayfl uxing.com

Hall A4, Booth 141-3

A Plus of Innovations

T ime plays a key role in modern electronic production. At Productronica 2013 SEHO

will introduce the new product family SelectLine, a fully modular selective soldering system. Its revolutionary design convinces with high precision and a high degree of fl exibility – no change-over is required to dynamically process a variety of assemblies with short cycle times.

In the fl uxing area, the new creative axis fl uxer offers extra versatility. Multiple axes are used for parallel, even asymmetrical fl uxing to help reduce cycle times. Its high-precision micro-drop nozzles can be programmed completely independently. And of course, different fl uxes can be made available permanently to cover various process requirements without setup times. SelectLine preheating types and length can

be confi gured individually.The soldering area – the heart of

SelectLine – also scores highly thanks to its outstanding fl exibility. Several solder pots with different solder nozzles, either completely wetted or a directed solder fl ow to one side, can be integrated. They work in parallel and ensure maximum throughput. For small lot sizes and high mix of assemblies, different alloys can be processed without additional setup effort. A unique feature is the possibility to integrate an AOI system for solder joint inspections directly into the system – a big plus with regard to space and handling costs.

www.seho.de

Hall A4, Booth 578

45PCB november 2013

T ecnolab is manufacturing stencils and frames, delivering consumables, tools and organizing new products

for the electronic fi eld. A distribution activity of equipment is also an important business for our company.

We understand that each customer represents a world itself, with its peculiarities and unique features. For this reason our salesmen, thanks to their technical experience, try to come into your reality in order to understand your needs and suggest you the most suitable products for your company.

In our times, it’s more and more usual to use technology tools for our relationships. Yet we still believe in human relations. We believe, and our own experience is confi rming this, that a smile and a sincere handshake can still be a good business card, a fi rst step to lay

A Changing Company: already and not yet

the foundations for a lasting relationship of trust and confi dence. And most of the times this makes the difference.

In a world where everything is experienced

in real time, there’s no time to waste. We understand the need of “everything-and-now” which has become a constant in the customer / supplier relation. That’s why our commitment is to satisfy all your requests with high expertise and in the shortest possible time without sacrifi cing the quality aspect which is our main goal.

We like to defi ne Tecnolab “a changing company,” because we understand how important is to be abreast with the times, never stopping, always pursuing new goals. Already and not yet !

www.tecnolab-srl.it

Hall A2 Booth 520

capacity of 1100 reels, the ACS1100 is the optimum solution for anyone who needs to speed up warehouse management times in a small space.

All ACS intelligent static warehouses can be configured with the humidity control module. Additionally, with the AutoSMD Software, the systems can trace all component movements and automatically calculate the exposure time beyond the limits, notifying the operator and blocking the component if the maximum limit is exceeded.

www.storagesolutions.it

Hall A3, Booth 201

Storagesolution Systems to Debut New Software and ISM Model

S toragesolutions, a provider of automatic storage systems for the electronics industry and division of

ESSEGI SYSTEM SERVICE s.r.l., will highlight at productronica 2013 its ACS2000 and ACD1100 storage systems and launch the new ISM500 and THT/PTH software.

Designed for optimal management of large reels, the ACS2000 automatic warehouse, reels up to 15” and 24 mm in height, and JEDEC trays can be safely stored and managed with ease. The system features a patented multiple outlet, allowing the simultaneous extraction and insertion of up to 27 reels at a time. Additionally, the rapid outlet allows the extraction of a single reel in record time.

The ACS1100 intelligent automatic warehouse for SMD coils has been

specially designed to achieve optimal performance in regards storage capacity and total size. With a maximum total

46 PCB november 2013

V irtual Industries Inc., a supplier of manual vacuum handling solutions, announces that it

will display three new and advanced systems for part handling at Productronica 2013.

The Small Part Handling Kit for parts as small as 200 microns ( TV1000-SP8-BD-220) is a general purpose vacuum handling tool that plugs directly into 220 Volt 50/60 Hz. This compact unit will handle a wide variety of optics, ball lenses and SMT parts used in the industry today. Parts as small as

A New Line of Tefl on Vacuum Cups

0.008" (0.20 mm) are handled without damage.

Also on display, the WAFER-VAC system with 8" molded wafer tip (WV-9000-MW8-220) is a general purpose wafer

vacuum handling tool that plugs directly into 110 Volt 50/60 Hz. This compact unit will handle a wide variety of wafers, solar cells and other substrates.

The BULB-VAC with anti-wobble cone and 3/4" ESD vacuum cup (BVJ-075-AW-ESD) is designed for enhanced functionality when handling INTEL LGA CPU products.

This tool improves placement accuracy when picking processor chips from a shipping tray and placing into precision sockets.

www.virtual-ii.com

Hall B2 Booth 259

B orn in 1989, Tecnometal is a manufacturer of printed circuit boards and provider

of electronic services for industry. The

Reliable, Fast, Flexible…Is The “MADE In Italy” Electronics

company’s skills and know-how are built on a strong platform of reliability and professionalism, where the core is the service, meant as the corporate mission. Tecnometal reflects this attention to service, offering flexibility and reliability to its customers within the agreed terms of delivery. The comprehensive production, expressed in both sampling and mass production, and always updated technology, complete the work and business success. With a staff of 35 people, including 20 production workers, Tecnometal is today a reference for services and products “made in Italy”. The offer is completed by the production of its Asian partners, selected and monitored by Italian and local staff. The production and the related services are

the expression of corporate vision, which is represented by the slogan: three key points for a single service:

TMT - Tecnometal Time: the fi rst of the key points, namely the intimate Tecnometal’s philosophy as for lead-time, with great care in fulfi lling the agreed terms.

TM 24 - Tecnometal 24: the second of the key points, the fl agship service of sampling production within 24 hours.

Tecnometal Priority: last-born, commonly summarized as “the customer pays, the customer wants!” The “tailor-made” production service: the customer needs speedy production and Tecnometal is ready for it.

www.tecnometal-pcb.com

47PCB november 2013

Introducing CR-8000World’s 1st system-level multi-board

PCB design environment

For more information visit: http://www.zuken.com/PCBdesign-revolution

Three dimensions Two hands One environment

contrasts the UV-reactive conformal coating with the background material, clearly detecting the contours of the lacquer. the Viscom S3088 CCI ensures that electronics manufacturers reliably comply with the IPC-CC-830 directive for the qualification and performance of electrical insulating compounds for printed circuit boards.

The S3088 CCI system is immediately available worldwide.

www.viscom.de

Hall A2 Booth 177Hall B2 Booth 225

Conformal Coatings of Electronic Assemblies Inspection

T he new Viscom S3088 Conformal Coating Inspection (CCI) system inspects coatings quickly and

reliably for typical defects such as cracks, bad spots, layers that are too thin or too thick, smearing, impurities, or splashes. Transparent protective coatings contain UV fl uorescent indicators that emit visible light, allowing automatic optical inspection.

The Viscom S3088 CCI system features an 8M camera technology with four orthogonal cameras and also is

equipped with UV LEDs. Technologically, the S3088 CCI is

based on the successful Viscom S3088 system. It works with UV LEDs, which

48 PCB november 2013

System Planner is a system-level de-sign environment for initial planning and partitioning of electronics sy-

stems. It enables engineers to optimize form, fi t and function of single and multi-board sy-stems, maximizing design reuse and elimina-ting the need to reenter up-front planning da-ta into the design tools during detailed design. It is the starting point for con-cept and design creation, linking through to detai-led design, ena-bling engineers and designers to smoothly fl ow through the de-sign process reu-sing, sharing and synchronizing de-sign data.

CR8000 – System PlannerZuken’s System Planner is used at

the beginning of the design process where requirements are implemented in practical product designs. This is the stage where a product is configured and crucial design decisions are made such as how many boards are in the system and what functions are on each board.

The user can evaluate and optimize the system through logical, 2D physical, 3D geometrical, and parametric views, and even preplan board manufacturing aspects such as panel arrangement; steps that were once disconnected are now intelligently brought together in one view. System Planner feeds all of the design information into Zuken’s schematic, PCB layout and manufacturing tools, saving time and effort throughout the entire design process.

System Planner’s four main modules work together or standalone and may appear individually or simultaneously on your screen for real-time interaction with each other. When you change one view, the others automatically update.

www.zuken.com/it/products/pcb-design/cr-8000/resources/webinars/webinar-system-planner

H aving a look at AOI market it’s easy to realize loss of good solution dedicated for the

THT AOI pre and post solder wave. Very often has been used standard SMD AOI machines on THT inspection purpose with significant disadvantages on test stability, reliability and quality results. Inspections methods, illumination strategy and lenses necessary for a successful THT inspection are widely different from SMD designed AOI. The AOI manufacturer Goepel, distributed in Italy by Win-Tek, has faced

Opticon THT–Line for a “total coverage”

this gap in the market and created the Opticon THT-Line series ensuring one more time the goal of ‘Total Coverage’ slogan as one of the flags for the company. Opticon THT–Line series has been developed to handle PCBs on Carriers. Machines ‘flip free’ design is

flexible and configurable for Top and Bottom inspection as solution in PRE or POST solder process. On customer needs the AOI can be integrated in Solder Wave lines with carriage return systems inspecting TOP and Bottom without any board flip requirement. Opticon Series algorithms such as Easy-OCR , Color code recognition and THT solder joint (circular and elliptical shaped tests created for THT) are powerful tools available to enhance best benefits and inspection stability right on THT components.

www.win-tek.eu - www.goepel.com

Hall A1 Booth 239

49PCB november 2013

New 3D Dual lane AOIYSi-X 2D/3D X-ray Optical and Laser inspection New YSD

R esponding to increasing demands for high-end, flexible and integrated solutions

Yamaha Motor IM will debut three new solutions at Productronica 2013: 3D AOI , dual lane AOI and YSD high speed dispensing system.

Yamaha inspection portfolio will showcase YSi-12 and the unique YSi-X. In addition there will be a sneak preview of Yamaha’s new 3D-AOI and dual-lane AOI machines.

The introduction of the dual lane AOI will complete the integration of a full dual-lane solution with the YSP20 printer and YSM40 mounters.

The YSi-X is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards. Thanks to 2D/3D X-ray inspection function through newly and patented high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers.

Because of this hybrid capability eliminates the need for a separate optical inspection unit necessary in conventional lines, the new YSi-X also reduces overall investment for an SMT production line.

Innovation all along the line

In recent years, demand in the SMT market has become much more sophisticated and diverse in its calls for greater productivity.

To answer this demand the YSD is a high-speed, high-performance, multi-functional model that achieves major improvements in tact time and dispensing performance while providing many new functions such as non-contact dispensing and line dispensing for increased versatility.

The YSD is built on the proven hardware and software platform common to other Yamaha SMT equipment. Using the YSD together with Yamaha’s high-speed modular type surface mounters enables customers to configure an SMT line that has is very efficient in its use of floor space.

The YSD is an ideal cost-efficient machine for prototype production lines, delivering advantages such as eliminating stencil costs and lead-times, and the ability to adapt quickly to design changes.

Yamaha Motor IM is a subdivision of Yamaha Motor Corporation since 1984. Yamaha IM surface mounters are highly acclaimed in the market for their

“module concept” that enables them to keep pace with the trend toward smaller and more diverse electric/electronic parts mounted on circuit boards.

Yamaha Motor IM has created a strong business in the surface mounter industry with over 30.000 (2011) installed machines that enables design and engineering, manufacture, sales and service to be conducted in one comprehensive system.

Furthermore, the Company has used its core technologies in the areas of servo-motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers.

www.yamaha-motor-im.eu

Hall A3 Booth 323

Anno 27 - Numero 9 - novembre 2013

www.elettronicanews.it

PROPRIETARIO ED EDITORE: Il Sole 24 ORE S.p.A.

SEDE LEGALE: Via Monte Rosa, 91 - 20149 Milano

PRESIDENTE: Benito Benedini

AMMINISTRATORE DELEGATO: Donatella Treu

STAMPA: Faenza Industrie Grafi che S.r.l. - Faenza (RA)

Prezzo di una copia 5 euro (arretrati 7 euro).

Registrazione Tribunale di Milano n. 148 del 19/3/1994 ROC n. 6553 del 10 dicembre 2001

DIRETTORE RESPONSABILE: Pierantonio Palerma

CAPOREDAZIONE CENTRALE BUSINESS MEDIA: Claudio Bonomi, Patrick Fontana

REDAZIONE: Riccardo Busetto (Responsabile di Redazione), Massimiliano Luce

CONSULENTE TECNICO: Dario Gozzi

UFFICIO GRAFICO: Elisabetta Delfi ni (coordinatore), Elisabetta Buda, Patrizia Cavallotti, Elena Fusari, Laura Itolli, Silvia Lazzaretti, Luciano Martegani,

Cristina Negri, Diego Poletti, Luca Rovelli, Walter Tinelli

SEGRETERIA DI REDAZIONE BUSINESS MEDIA: Anna Alberti, Donatella Cavallo, Rita Galimberti,

Laura Marinoni Marabelli, Paola Melis, Elena Palazzolo, Katia Simeone, Caterina Zanni

COLLABORATORI: Edoardo Banfi , Piero Bianchi, Davide Oltolina

TRADUZIONI: Fiona Tupper-Carey

redazione.pcb@ilsole24ore.com

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UFFICIO TRAFFICO E PUBBLICITÀ: Tel. 02 3022.6060

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Il Sole 24 ORE S.p.A., Titolare del trattamento, tratta, con modalità connesse ai fini, i Suoi dati personali, liberamente conferiti al momento della sottoscrizione dell’abbonamento od acquisiti da elenchi conte-nenti dati personali relativi allo svolgimento di attività economiche ed equiparate per i quali si applica l’art. 24, comma 1, lett. d del D.Lgs n. 196/03, per inviarLe la rivista in abbonamento od in omaggio.Potrà esercitare i diritti dell’art. 7 del D.Lgs n. 196/03 (accesso, cancellazione, correzione, ecc.) rivol-gendosi al Responsabile del trattamento, che è il Direttore Generale dell’Area Professionale, presso Il Sole 24 ORE S.p.A., l’Ufficio Diffusione c/o la sede di via Carlo Pisacane, 1 - 20016 PERO (Milano). Gli articoli e le fotografie, anche se non pubblicati, non si restituiscono. Tutti i diritti sono riservati; nes-suna parte di questa pubblicazione può essere riprodotta, memorizzata o trasmessa in nessun modo o forma, sia essa elettronica, elettrostatica, fotocopia ciclostile, senza il permesso scritto dall’editore.L’elenco completo ed aggiornato di tutti i Responsabili del trattamento è disponibile presso l’Ufficio Privacy, Via Monte Rosa 91, 20149 Milano. I Suoi dati potranno essere trattati da incaricati preposti agli ordini, al marketing, al servizio clienti e all’amministrazione e potranno essere comunicati alle so-cietà di Gruppo 24 ORE per il perseguimento delle medesime finalità della raccolta, a società esterne per la spedizione della Rivista e per l’invio di nostro materiale promozionale.

Annuncio ai sensi dell’art 2 comma 2 del “Codice di deontologia relativo al trattamento dei dati

personali nell’esercizio della attività giornalistica”.

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DIRETTORE EDITORIALE BUSINESS MEDIA: Mattia Losi

Associato a:

T he fi rst Alpha® Academy Day has been held in Italy at the Prevent Lab facility, in Vergiate, Varese, Italy. The Prevent Lab’s dedicated Training room

hosted 30 attendees and the event provided Training and Presentations from both Alpha and Prevent Lab.With each bringing their knowledge and expertise to the programme it offered a unique mix of training and open discussion. The whole event was extremely well received and following on from this successful day others will be planned for 2014.

Topics and Presenters on the day were- Solder Paste Selection – Roberto Lavelli from Prevent Lab- Ionic Contamination – Fabio Mauri from Fernox- PCB Finishes – Roberto Lavelli from Prevent Lab- Low Silver Alloys, SACX – Donato Casati from Alpha- Tape and Reel Preforms – Donato Casati from Alpha- Low Melting Point Alloy – Sandro Crivellaro from Alpha.

www.alpha.alent.com

Hall A4 Stand 435

Alpha Academy Day Italy