Passive component

Passive Electronic ComponentsLecture 1 Page 1 of 13

15-Mar-2012Typical Applications and History of Passive Components

Lecture Plan

1. Introduction.2. Passive electronic components. Definition.3. Short history of electronics and passives.4. Typical applications of passive components.5. Why all discrete passive components cannot be integrated in IC or in PCB.

1. Introduction1.1. About Vishay Intertechnology. Vishay Intertechnology is a Fortune 1,000 Company listed on the

New York Stock Exchange (VSH). It is one of the world's largest manufacturers of discrete semiconductors (diodes, rectifiers, transistors, optoelectronics, and selected integrated circuits) and passive electronic components (resistors, capacitors, inductors, and transducers). Vishay has plants in 16 countries employing over 25,000 people in the U.S.A., Mexico, Germany, Austria, the United Kingdom, France, Portugal, the Czech Republic, Hungary, Israel, Taiwan, India, China, the Philippines, and others. Vishay's list of customers includes such major manufacturers as AT&T, Alcatel, Bosch, Delco, Ford, IBM, Intel, Motorola, Qualcomm, Samsung, Siemens, Sony. In July 2010 Vishay Precision Group company spun off from Vishay Intertechnology. Vishay Precision Group deals with super precision foil resistors, strain sensors based on resistive foil technology, equipment for stress measurement and industrial weighing.

1.2. About the founder of Vishay Dr. Felix Zandman (1928-2011). Dr. Felix Zandman was Chairman and CEO of Vishay Intertechnology, Inc. (NYSE: VSH). In 1962, Dr. Zandman, with the financial help of the late Alfred P. Slaner, founded Vishay to develop and manufacture Dr. Zandman's invention - Bulk Metal Foil resistors. The Company was named after Dr. Zandman's and Mr. Slaner's ancestral village in Lithuania, in memory of family members who perished in the Holocaust.

Dr. Zandman holded a Ph.D. in Physics from the University of Paris, Sorbonne. He has received numerous honors throughout his life, including

The Musser Award for Excellence in Leadership, The Order of Merit for Research and Invention (France), The Distinguished Contribution Award from the American Society of Stress Analysis, The Franklin Institute Medal of Science, The Legion of Honor (France), EIA Medal of Honor. (The Electronic Industries Alliance is a trade organization that represents

the high technology community of the USA).

Dr. Zandman spoke Russian, Polish, Yiddish, German, Hebrew, French, and English. He has also published three textbooks and holds 39 patents. Dr. Zandman´s autobiography "Never the Last Journey", recounts his story from Holocaust victim to Chairman and CEO of a high-tech multinational corporation. (Zandman, Felix, Never the Last Journey. Schocken Books, New York: 1995). It was first issued in English and further was translated in other languages including Hebrew and Russian. The “The Final Victory“ film (" צחון הסופייהנ ") is the story of Dr. Felix Zandman, an incredible tale of how a small Jewish boy who survived the holocaust in a grave like shelter, pulled himself together and achieved a life of fame and success in business and scientific achievements. It may be found online in YouTube and many other sources (see for example http://learnmitzvot.com/showsubvideos.php?id=118 ).

http://learnmitzvot.com/showsubvideos.php?id=118


1.3. About the lecturer. Dr. Michael Belman is Research and Development Group Leader in Beer-Sheva plant of Vishay Israel Ltd. He graduated with honors from Department of Engineering Physics of Kharkov State Polytechnical University, Ukraine in 1974, received his Ph.D. from Riga Technical University, Latvia in 1986, and is with Vishay Israel Ltd. from 1991.

1.4. About the course.This course is intended to give the students an understanding of: Passive electronic components constructions, features, modern design, electrical, thermal, and

mechanical properties. Application of passive electronic components in the modern electronics (selection, mounting).

2. Characteristics of passive components. Definition: passive component is any electronic device that does not introduce gain or does not have directional functions. Passive components may be linear or non-linear.

Physical parameters of linear (in real life “almost liner”) passive components - resistors, capacitors, and inductors - do not depend significantly on voltage applied to their terminals or electrical current forced across them. It is not so when essentially non-linear components (varistors, thermistors, fuses) are concerned.

There is some "grey" area of interchangeability between active and passive components. For example:

The Field Effect Transistor (active component) may be used as a Voltage Controlled Resistor. Source and Drain will be “resistor” terminals, control voltage should be applied between Gate and Source terminals.

Variable Capacitance Diode or Varicap (active component) may replace metal plate variable

capacitor.

Incandescent bulb (that may be regarded as passive component) may serve as a current stabilizer.

It may be used as an Automatic Gain Control (AGC) element too. The classic example is a Wien bridge circuit in Audio Oscillator HP 200A developed by Bill Hewlett and Dave Packard in 1938.


Varistor (passive component) is commonly used as surge suppressor (Voltage Clamping Device). It acts very similar to symmetrical Zener diode.

Electrolytic capacitor (passive component) is semi-conductive and therefore may rectify

alternating current as a diode. Anyhow, the reverse voltage mode without current limitation may result in capacitor damage and commonly is not allowed.

Let us note that the equations that express conductance and capacitance of solid electrically conductive bodies through electric field, and their inductance through magnetic field look very similar:

(1)

G – conductance;R – resistance;I – current;V – voltage; – conductivity;

– electrical field;S – cross-section of resistive element;a, b – terminal points.

C – capacitance;q – charge; – Permittivity;

– Positive electrode surface; – Negative electrode surface.

L – coil inductance; – flux;

N – number of turns - permeability;

- magnetic field,( – magnetic induction);S – internal area of each turn;C – closed field line.


All the equations (1) include only geometric parameters and respective physical constant of the medium.

3. Historical excursus.

Inventions of principal passive components: Capacitor – 1745; Resistor – 1827; Inductor – 1831.

Evolution of electronic components (including passive components).It follows three directions:

Smaller size. Lower cost. Higher performance.

Let us compare for example radio sets manufactured in different times.

Crosley TRIRDYN REGULAR. Regenerative 3-tubes Reflex Receiver.　 The Crosley Radio Corporation,　(1925), $50, 54cm length

Regency TR-1

4 transistors Super-Heterodyne. Texas Instruments of Dallas, Texas and Industrial Development Engineering Associates (I.D.E.A.) of Indianapolis, Indiana. (1954), $50, 12.7 cm length


Smaller sizes and higher performance of newer radios is a commonplace. Price comparison is the following:

TRIRDYN REGULAR. Regenerative 3-tubes Reflex Receiver manufactured by Crosley Radio Corporation (USA). Price $50 in 1925 is approximately $617 in 2010.

The first 4-transistor AM radio TR-1 was manufactured by Regency. Its price was $50 in 1954 is approximately $401 in 2010.

Nowadays (2012) AM/FM portable radio + headphones price starts from about $3.

This progress has become possible as the result of perfection of electronic components (both active and passive). Let us consider a resistor for example.

22.5

6.5

6.3

0.6

1W resistors:

Axial leaded Chip

XIBOMAN AS-875

Mini FM Scan Radio. (2012), $3, 8.8 cm length



4. Applications of passive components.


Passive components occupy over 40% of the iPhone's PCB area 6).

Passive components consumption in some products. Car electronics – 3400 units. PC – 2178 units. LCD TV – 2100 units. Game console – 1020 units. Digital camera – 839 units. Cellular handset – 467 units. iPod – 230 units.

Processor TypeTransistors

on chip

External passives

count486 1.2M 124Pentium 3.2M 252Pentium II 7.5M 345Pentium III 28M 440Pentium 4 (Willamette) 42M 600

Passive components in analog circuit. There are: 1 active component (IC), 15 passive components (or 94%) in the typical amplifier circuit below:


Example of the modern mixed-mode integrated circuit: Bluetooth - Radio Modem based on Silicon Wave SiW1711 (see picture below).

Passive components Active components16 capacitors6 inductors1 resistor1 ceramic filter1 quartz resonator1 antenna

1 IC

Total: 26 (96%) Total: 1 (4%)


Some reasons of passive components count growth: Higher clock frequencies require impedance matching at the ends of transmission lines. Lower operating voltages require lower level of ripple voltage in power line and therefore

better filtering. Higher operating currents require higher capacitance of filtering capacitor. Commonly it

constitutes several capacitors distributed on PCB. Increasing number of analogue applications.

New issues related to passive components: Special passive components. Special resistors: current sense, sulfuration-proof,

pulse-proof. Special capacitors: X2Y, Z-chip, feed-through, double layer. Special inductors: common mode choke, ferrite bead, coupler, balun, power divider, antenna.

Surface-Mount Technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards. SMT changed the appearance of passive electronic components and in many cases enhanced their performance.

Environmental concerns. Lead-free components are being introduced. CFC elimination in assembly process.


5. Why all discrete passive components cannot be integrated in IC or in PCB.

Passive components count in PCB is growing despite the intuitive feeling that it has to drop as IC integration increases. Why cannot the inductors, capacitors, and filters be integrated into silicon of ICs and put on the Moore's Law?

Regardless of high cost of chip surface some modern ICs have on-die termination resistors which improve signal integrity at higher clock rates. Examples: DDR2 computer memory, Pentium 4 processor.

Pentium 4 processor P4 Celeron-D 310 Prescott processor comprises 125 millions of transistors and dissipates 73 W of thermal power. Termination resistors are provided on the processor silicon and are terminated to its core voltage (VCC) (but not for all the signals). Let us evaluate how many additional transistors may be placed on chip instead of single termination resistor. (We shall take into consideration dissipated power only).Suppose that:

Core voltage is 1.3 V; Transmission line and termination resistor impedance is 60 ; Digital signal in transmission line may be regarded as a periodic pulse train with a duty factor

t=1/2.

Impossibility to integrate all passives in ICs

Necessity of IC universalityLimited capabilities of

integrated passives Parameters of passives are

functions of their dimensions but silicon chip area is costly

OA (gain setting, offset nulling, bias current setting)

Digital IC (open-collector output, pull-up, pull-down)

Narrow span of nominal values

Mediocre precision and stability

Low power dissipationTimer (time constant setting)


R = 60 U = 1.3 VPtotal = 73 Wt = 1/2N = 125106

V2//W = V A/W = W/W = 1

N1 - ?

6. Integration in PCB. (Integrated passives). There is possibility to integrate passive components in PCB (see picture below). It is used more and more because saves PCB area. But only limited quantity of passives may be integrated because of:

poor performance of integrated passives, limited range of their values, higher PCB price.

References.

1. R. Klaiber, C. Lassen, “Critical issues in electronic packaging assembly. Part 1,” Circuits Assembly, December 1995, pp.30-33.

2. G. Smith, “Resistors and capacitors: a renaissance,” in Proc. CARTS 2000: 20th Capacitor and Resistor Technology Symposium, Huntington Beach, CA, March 2000, pp.1-6.

U

R


3. “Flat-chip resistors: a booming market for 2000,” Passive Component Industry, March/April 2000, pp.25-26.4. D. Zogbi, “Letter from the publisher,” Passive Component Industry, November/December 1999, p.4.5. “Tantalum capacitors: global trends in 2000,” Passive Component Industry, January/February 2000, pp.24-27.6. Jim Stratigos , Shrink the iPhone, http://www.electroiq.com/articles/ap/2008/08/executive-

viewpoint.html

http://www.electroiq.com/articles/ap/2008/08/executive-viewpoint.html

http://www.electroiq.com/articles/ap/2008/08/executive-viewpoint.html

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