Overview of Telecommunications Bonding & Grounding Systems

Electrical Entrance Facility

Telecommunications Entrance Facility (TEF)

TGBTGB

TGBTGB

12

3 4

5

7

7

7

6 Item# Description Part Number

1Telecommunications Grounding Busbar (TGB) GBI14220TGB

2Telecommunications Main Grounding Busbar (TMGB) GBI14420TGB

3Bonding Conductor for Telecommunications (BCT) #6 AWG up to #750 MCM

4Grounding Electrode Conductor #6 AWG up to #750 MCM

5Grounding Electrode System

Ultraweld connection toground conductor & ground rod

6 Grounding Equalizer (GE) #6 AWG up to #750 MCM

7Telecommunications Bonding Backbone (TBB) #6 AWG up to #750 MCM

Courtesy of

Telecommunications Room (TR)

Telecommunications Room (TR)

T

T

elecommunicationsRoom (TR)

Equipment Room (ER)

elecommunicationsRoom (TR)

607B201117BG

Sizing the Grounding Equalizer (GE)The GE shall be, as a minimum, the same size as the largest TBB.

#6 AWG up to #750 MCMTelecommunications Bonding Backbone (TBB).

#6 AWG up to #750 MCM Grounding Equalizer (GE).

#GBI14220TGBTelecommunications Grounding Busbar (TGB).

Courtesy of

# RGBV145872AEquipment Rack Grounding Busbar.

607B201127GESing

Equipment Rack Bonding

Example of three methods to bond equipment racks to ground.Courtesy of607B201138ERB

#6 AWG up to #750 MCM TEBC (TELECOMMUNICATION EQUIPMENT BONDING CONDUCTOR).

# CT4666 THRU CT4/04/0IRREVERSIBLE CRIMP CONNECTOR.

# UBC61411/410 THRU UBC63811/410UNIT BONDING CONDUCTOR (UBC)

# RGBV145872AVERTICALLY MOUNTED RACK GROUNDING BUSBAR.

INDIVIDUAL EQUIPMENT GROUNDING TERMINAL (TYPICAL EACH PIECE OF EQUIPMENT)

MINIMUM BENDING RADIUS MUST BE MAINTAINED ON ALL CONDUCTORS

TO TMGB / TGB#6 AWG up to #750MCM RACK BONDING CONDUCTORS ROUTED TO TMGB / TGB

# UBC61411/410 THRU UBC63811/410 INDIVIDUAL UNIT BONDING CONDUCTORS (UBC) FROM EACH PIECE OF EQUIPMENT TO THE RACK BONDING CONDUCTOR.

RACK BONDING CONDUCTOR EXTENDED TO BOTTOM OF RACK TO ACCOMMODATE FUTURE GROWTH

# RGBH14119.25TOP MOUNTED RACK GROUNDING BUSBAR.

Example “A” Example “B” Example “C”

Courtesy of607B201151GE

Grounding Equalizer (GE)When two or more TBB’s are used in a multistory building, the TBB’s shall be bonded together with a GE at the top floor and at a minimum of every third floor in between to

the lowest floor level.

Grounding Equalizer (GE)

TGB

Telecommunications Bonding Backbone (TBB)

Part # GBI14220TGBPart # GBI14220TGBPart # RGBV145872A

Part # RGBH14119.25

TGB