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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 32LH20R/25R 32LH20R/25R-LA/TAMODEL : 32LH22R 32LH22R-LB/TBMODEL : 32LH23UR 32LH23UR-TA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL60021510 (0906-REV01)
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
TROUBLE SHOOTING .......................................................................... 14
BLOCK DIAGRAM ................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SVC. SHEET ...............................................................................................
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument'sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC2) Relative Humidity : 65±10%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree LGD
3. Color Coordinates White Wx Typ 0.279 Typ LGD 32”(HD)
Wy -0.03 0.292 +0.03
RED Xr 0.636
Yr 0.335
Green Xg 0.291
Yg 0.613
Blue Xb 0.146
Yb 0.061
4. Contrast ratio 700:1 1000:1
5. Luminance Variation 1.3
4. Chroma& Brightness (Optical)4.1. LCD Module
the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid(1) LGD Module
- 7 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
(2) AUO Module
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 360 450 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree
3. Color Coordinates White Wx Typ 0.280 Typ AUO 32”(HD)
Wy -0.03 0.290 +0.03
RED Xr 0.640
Yr 0.330
Green Xg 0.280
Yg 0.600
Blue Xb 0.150
Yb 0.050
4. Contrast ratio 2400:1 3000:1
5. Luminance Variation 1.3
5. Component Video Input (Y, PB, PR)
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
- 8 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
NoSpecification Proposed
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
6. RGB(1) Analog PC, RGB- DTV -NOT SUPPORT
7. HDMI Input(1) PC -Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
(2) DTV Mode
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 9 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100~220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.(3) Download the EDID
- EDID datas are automatically download when adjustingthe Tool Option2
(4) ADC Calibration – RGB / Component(4) Check SW Version.
3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide(5) Preset CH information(6) Factoring Option Data input
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speedsetting : 350Khz~400Khz
4) Read and write bin file.Click “(1)Read” tab, and then load downloadfile(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below6) Click “(3)Run”.7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process
After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)
Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value Caution : Don’t Press “IN-STOP” key after completing thefunction inspection.
4.3. EDID D/L methodRecommend that don’t connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data
4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.
4.3.2. 2nd Method* Caution :
Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear “OK”, then compele.
4.3.3. RS-232C command Method(1) Command : AE 00 10
* Caution Don’t connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.
- 10 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
4.3.4. EDID data(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
4.4.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments
- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
- 11 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
OK
OK
4.5. Check SW Version(1) Method
1) Push In-star key on Adjust remote-controller.2) SW Version check
Check “SW VER : V3.xx” – LH20
5. PCB assembly adjustment method5.1. Input Area-Option
(1) Profile : Must be changed the Area option value becausebeing different of each Country’s Language andsignal Condition.
(2) Equipment : adjustment remote control.(3) Adjustment method
- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)
Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value.
* White Balance Adjustment- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)and decrease the others.
- Adjustment mode : Three modes – Cool / Medium / Warm- Required Equipment
1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2. Adjustment of White Balance: (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-White Balance Mode.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging
command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance(for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following
sequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter “0000” (Password)6) Select “3. W/B ADJUST”7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others11) When adjustment is completed, Enter “COPY ALL”.12) Exit adjustment mode using EXIT key on R/C.
- 12 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G. 2. x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
- 13 - LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Coordinate Mode
x y Temp uv∆
Cool 0.276±0.002 0.283±0.002 11,000K 0.000
Medium 0.285±0.002 0.293±0.002 9,300K 0.000
Warm 0.313±0.002 0.329±0.002 6,500K 0.003
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 5,2V of Power B/D
Check short of Main B/D or Change Power B/D
Pass
Check Output of IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001,IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source Cableand Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC100 Fail
Re-soldering or Change the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J104 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf IC300, IC301, JK302 Fail
Re-soldering or Change the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse.
Check The Input/OutputOf IC600.
Re-soldering or Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.Fail
Check The Speaker Wire.
Pass
Change The Source Input.Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101, JK201
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU500
Pass
Re-soldering or Change the defect part
Pass
Fail
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
LGE Internal Use OnlyCopyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
BLOCK DIAGRAM
RG
B_P
C
PC
_Au
dio
TV
(RF
)
CO
MP
1
HD
MI1
HD
MI2
RS
23
2
TX
23
2C
Dri
ver
ST
32
32
CT
x/R
x :
1
5V
pp
PC
_R/G
/B/H
S/V
S
PC
_Au
dio
_L/R
:70
0m
Vrm
s
MN
T_O
UT
: 1
Vp
p
SID
E_V
:1
Vp
p
SID
E_L
/SID
E_R
:50
0m
Vrm
s
DD
R2
(51
2M
B)
L_S
PK
_OU
T
R_S
PK
_OU
T
EE
PR
OM
24
C0
2
Co
mp
1_L
/R :5
00
mV
rms
TU
NE
R
AV
1_V
IN:
1V
pp
AV
11
_LIN
/RIN
:50
0m
Vrm
s
PW
MN
TP
31
00
L
MN
T_O
UT
MN
T_L
OU
T/R
OU
T: 5
00
mV
rms
AV
2(S
ide
AV
)
MA
IN S
CA
LE
R
TX
D /
RX
D :
5V
Dig
ita
l
CO
MP
1_Y
/Pb
/Pr: 1
/0.7
Vp
p
CO
MP
2_Y
/Pb
/Pr: 1
/0.7
Vp
p
IR HD
MI_
DA
TA
_1H
DM
I_D
AT
A_2
HD
MI1
_SC
L/S
DA
OU
T_E
_TX
_CL
K
OU
T_E
_TX
_EO
UT
_E_T
X_D
OU
T_E
_TX
_CO
UT
_E_T
X_B
OU
T_E
_TX
_AT
U_M
AIN
S I
F
CO
MP
1_Y
/Pb
/Pr
1/0
.7V
pp
AV
1_V
IN
PC
_Au
dio
_L/R
CO
MP
1_L
IN/R
IN
L_C
HR
_CH
LVDSconnector
TU
_MA
INS
UB
_SC
LS
DA
EE
PR
OM
24
C0
2
EE
PR
OM
24
C0
2
SIF
AV
1_L
IN/R
IN
MN
T_L
/R O
UT
AV
1
MN
T_O
UT
Co
mp
2_L
/R :5
00
mV
rms
CO
MP
2_Y
/Pb
/:
1/0
.7V
pp
CO
MP
2_L
IN/R
IN
CO
MP
2
OU
T_O
_TX
_CL
K
OU
T_O
_TX
_EO
UT
_O_T
X_D
OU
T_O
_TX
_CO
UT
_O_T
X_B
OU
T_O
_TX
_A
PC
_R/G
/B/H
S/V
S
HD
M2
_SC
L/S
DA
PC
_SC
L/S
DA
MN
T_V
OU
T
AV
2_V
IN
AV
2_L
IN/R
IN
IIS
_OU
T
US
B
US
B_D
N/P
N
AU
DIO
AM
P
HD
MI3
_SC
L/S
DA
EE
PR
OM
24
C0
2H
DM
I_D
AT
A_3
TM
DS
TM
DS
TM
DS
HD
MI3
US
BF
or
D/L
EE
PR
OM
(25
6K
)
Se
ria
l Fla
sh
(8M
Byt
e)
RG
B_P
C
PC
_Au
dio
TV
(RF
)
CO
MP
1
HD
MI1
HD
MI2
RS
23
2
TX
23
2C
Dri
ver
ST
32
32
C
±
PC
_R/G
/B/H
S/V
S
PC
_Au
dio
_L/R
:70
0m
Vrm
s
MN
T_O
UT
: 1
Vp
p
SID
E_V
:1
Vp
p
SID
E_L
/SID
E_R
:50
0m
Vrm
s
DD
R2
(51
2M
B)
EE
PR
OM
24
C0
2
Co
mp
1_L
/R :5
00
mV
rms
TU
NE
R
AV
1_V
IN:
1V
pp
AV
11
_LIN
/RIN
:50
0m
Vrm
s
PW
MN
TP
31
00
L
MN
T_O
UT
MN
T_L
OU
T/R
OU
T: 5
00
mV
rms
AV
2(S
ide
AV
)
MA
IN S
CA
LE
R
TX
D /
RX
D :
5V
Dig
ita
l
CO
MP
1_Y
/Pb
/Pr: 1
/0.7
Vp
p
CO
MP
2_Y
/Pb
/Pr: 1
/0.7
Vp
p
HD
MI_
DA
TA
_1H
DM
I_D
AT
A_2
_
OU
T_E
_TX
_CL
K±
OU
T_E
_TX
_±
OU
T_E
_TX
_±
OU
T_E
_TX
_C±
OU
T_E
_TX
_B±
OU
T_E
_TX
_A±
TU
_MA
IN
S I
F
CO
MP
1_Y
/Pb
/P:
1/0
.7V
pp
AV
1_V
IN
PC
_Au
dio
_L/R
CO
MP
1_L
IN/R
IN
L_C
HR
_CH
LVDSconnector
TU
_MA
IN/
EE
PR
OM
24
C0
2
EE
PR
OM
24
C0
2
SIF
AV
1_L
IN/R
IN
MN
T_L
/R O
UT
AV
1
MN
T_O
UT
Co
mp
2_L
/R :5
00
mV
rms
CO
MP
2_Y
/Pb
/Pr
1/0
.7V
pp
CO
MP
2_L
IN/R
IN
CO
MP
2
OU
T_O
_TX
_C±
OU
T_O
_TX
_E±
OU
T_O
_TX
_D±
OU
T_O
_TX
_C±
OU
T_O
_TX
_B±
OU
T_O
_TX
_A±
PC
_R/G
/B/H
S/V
S
PC
_SC
L/S
DA
PC
_SC
L/S
DA
MN
T_V
OU
T
AV
2_V
IN
AV
2_L
IN/R
IN
IIS
_OU
T
US
B
US
B_D
N/P
N
AU
DIO
AM
P
HD
MI3
_SC
L/S
DA
HD
MI3
_SC
L/S
DA
EE
PR
OM
24
C0
2H
DM
I_D
AT
A_3
TM
DS
TM
DS
TM
DS
HD
MI3
US
BF
or
D/L
EE
PR
OM
(25
6K
)
Se
ria
l Fla
sh
(8M
Byt
e)
- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
801
802
803
804
805
806
520
530
540
550
400
900
120
510
500
320
200T
200N
310
LV1
A2
A10
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
TH
E
SY
MB
OL
MA
RK
OF
TH
IS S
CH
EM
ET
IC D
IAG
RA
M IN
CO
RP
OR
AT
ES
SP
EC
IAL
FE
AT
UR
ES
IMP
OR
TA
NT
FO
R P
RO
TE
CT
ION
FR
OM
X-R
AD
IAT
ION
.F
ILR
E A
ND
ELE
CT
RIC
AL
SH
OC
K H
AZ
AR
DS
, WH
EN
SE
RV
ICIN
G IF
IS
ES
SE
NT
IAL
TH
AT
ON
LY M
AN
UF
AT
UR
ES
SP
EC
FIE
D P
AR
TS
BE
US
ED
FO
RT
HE
CR
ITIC
AL
CO
MP
ON
EN
TS
IN T
HE
S
YM
BO
L M
AR
K O
F T
HE
SC
HE
ME
TIC
.
CVBS
_LIN
MUT
E_LI
NE
AUDI
O_R
SD05
ZD10
0
100u
F16
VC1
02
SD05
ZD10
3
SD05
ZD10
5
MNT
_ROU
T
CVBS
_VIN
SPK_
R+_H
OTEL
RT1
C39
04-T
112
Q10
0
EB
C
SPK_
R-_H
OTEL
CVBS
_RIN
SD05
ZD10
4
10uF
16V
C101
MUT
E_LI
NE
SD05
ZD10
1
SD05
ZD10
2
MNT
_LOU
T
RT1
C39
04-T
112
Q10
1E
BC
MNT
_VOU
T
10uF
16V
C100
30V
NON_
HOTE
L_OP
T
D10
2
30V
NON_
HOTE
L_OP
T
D10
3
30V
D10
1
30V
ADUC
30S0
3010
L_AM
ODIO
DE
D10
0
30V
D10
4
30V
D10
5
COM
P2_Y
COM
P2_P
B
COM
P2_P
R
COM
P2_L
COM
P2_R
S_VI
DEO_
DET
SID
E_Y
SID
E_C
+3.3
V_M
ULT
I_M
ST
OPT
RE
AD
Y
C1
04
30V
D10
6
30V
D10
7
SD05
ZD10
6
SD05
ZD10
7
PS
J0
14
-01
JK1
01
S-V
IDE
O
GN
D6
1
C-L
UG
1
2C
-LU
G2
30
-SP
RIN
G
4C
-LU
G3
5C
-LU
G4
SH
IEL
D7
75R1
02
0HO
TEL_
OPT
R103
0HO
TEL_
OPT
R105
0NO
N_HO
TEL_
OPT
R106
0HO
TEL_
OPT
R101
75R109
75R108
75R107
220K
R104
12K
R118
12K
R117
12K
R119
12K
R120
10K
R113
10K
R115
10K
R116
220K
R100
220K
R111
220K
R112
75R110
75R122
S-V
IDE
O
75R121
S-V
IDE
O
10K
R1
23
100p
FRE
ADY
C103
10K
R114
PPJ2
26-0
1JK
100
9A[G
N]1P
_CAN
4A[G
N]O-
SPRI
NG_A
3A[G
N]CO
NTAC
T_A
9B[B
L]1P
_CA
N
8B[B
L]C-
LUG
_A
9C[R
D]1
P_CA
N_1
8C[R
D]C-
LUG_
A
9D[W
H]1P
_CAN
8D[W
H]C-
LUG_
A_1
9E[R
D]1
P_CA
N_2
4E[R
D]O
-SPR
ING
_A_1
3E[R
D]CO
NTAC
T_A_
1
9F[Y
L]2P
_CAN
4F[Y
L]O
-SPR
ING
_A
3F[Y
L]CO
NTAC
T_A
9G[W
H]2P
_CAN
8G[W
H]C-
LUG_
A_2
9H[R
D]2P
_CAN
4H[R
D]O
-SPR
ING
_A_2
3H[R
D]CO
NTAC
T_A_
2
5J
[YL
]O-S
PR
ING
_B
6J
[YL
]CO
NT
AC
T_B
7K[W
H]C
-LU
G_B
5L
[RD
]O-S
PR
ING
_B
6L
[RD
]CO
NT
AC
T_B
1 9
20
08
/1
2/1
6
INP
UT
1
MS
TA
R N
-EU
EA
X56
8569
04H
6 L
CD
ME
RC
UR
Y PO
P N
OIS
E
MNT_OUT
COMPONENT1
PO
P N
OIS
E
AV1
CO
MPO
NE
NT
1, A
V1,
MN
T_O
UT
[JA
CK
PA
CK
TY
PE D
] : J
K10
0
S-V
ID
EO
(C
hin
a M
od
el)
IN
PU
T1 : C
OM
PO
NE
NT
1, S
-V
ID
EO
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
USB_
DN
USB_
DP
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
SID
E_LI
N
SID
E_RI
N
5.6
BZ
D203
SIDE
_V
PP
J2
18
-01
JK2
01
5C[R
D]CO
NTAC
T
2C[R
D]U_
CAN
4C[R
D]O
_SPR
ING
2B[W
H]U_
CAN
3B[W
H]C_
LUG
2A[Y
L]U_
CAN
5A[Y
L]CO
NTAC
T
4A[Y
L]O
_SPR
ING
5.6
BZ
D202
USB DOWN STREAM
KJA-UB-4-0004
SID
E_U
SB
JK20
4 1 2 3 4 5
IR_O
UT
+3.3
V_M
ST
TXD
4.7K
R204
ST32
32CD
RIC
200
3C
1-
2V+
4C2
+
1C1
+
6V
-
5C
2-
7T2
OUT
8R2
IN9
R2OU
T
10T2
IN
11T1
IN
12R1
OUT
13R1
IN
14T1
OUT
15GN
D
16VC
C
4.7K
R205
RXD
KC
N-D
S-1-
0088
JK2
00
1 2 3 4 5
6 7 8 9 10
+3.3
V_M
ST
+5VS
T_M
ST
6630
TGA0
04K
KCN
-DS-
1-00
89
JK20
2
1RE
D
2GR
EEN
3BL
UE
4GN
D_1
5DD
C_GN
D
6RE
D_GN
D
7GR
EEN_
GND
8BL
UE_G
ND
9NC
10SY
NC_G
ND
11GN
D_2
12DD
C_DA
TA
13H_
SYNC
14V_
SYNC
15DD
C_CL
OCK
16SH
ILED
SD05
ZD20
0
DSUB
_SDA PC
_VS
SD05
ZD20
1
ENKMC2837-T112D211
A AC
C
PC_B
ENKMC2837-T112D210
A AC
C
PEJ0
24-0
1JK
203
6BT_
TERM
INAL
2
8SH
IELD
_PLA
TE
7BB_
TERM
INAL
2
5T_
SPRI
NG
4R_
SPRI
NG
7AB_
TERM
INAL
1
6AT_
TERM
INAL
1
3E_
SPRI
NG
DSUB
_SDAPC_A
UD_R
PC_G
DSUB
_SCL
CA
T24C
02W
I-G
T3
IC2
01
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8V
CC
ENKMC2837-T112D212
A AC
C
DDC_
WP
PC_H
S
PC_A
UD_L
+5V_
MUL
TI
DSUB
_SCL
PC_R
CDS3
C30G
TH30
VD
202
CDS3
C30G
TH30
VD
203
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D20
0
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D20
1
30V
D20
6
30V
D20
5
ADUC
30S0
3010
L_AM
ODIO
DE
30V
D20
4
ADUC
30S0
3010
L_AM
ODIO
DE 30
VD
209
30V
D2
08
RE
AD
Y30V
D2
07
RE
AD
Y
USB_
DL_N
USB_
DL_P
0
RE
AR
_USB
R2
29
0
RE
AR
_USB
R2
30
USB DOWN STREAM
UB01123-4HHS-4F
JK2
05
RE
AR
_USB
1 2 3 45
0.1u
FC2
03
0.1u
FC2
00
0.1u
FC2
01
0.1u
FC2
02
0.0
1u
FC
20
5
0.1
uF
C2
04
0.1
uF
C2
06
0.1
uF
C2
07
100
R202
100
R203
75R227
220K
R223
RE
AD
Y
220K
R222
RE
AD
Y
12K
R226
12K
R228
75R211
75R212
75R213
4.7K
R214
4.7K
R215
220K
R231
220K
R232
10K
R233
10K
R234
12K
R235
12K
R236
4.7K
R220
4.7KR2
21
100
R216
100
R217
100
R218
0.1u
FOC
P_RE
ADY
C208
MIC
2009
YM
6-TR
OC
P_RE
ADY
IC20
2
3EN
ABLE
2GN
D
4FA
ULT
/
1VI
N6
VOUT
5IL
IMIT
10uF
OCP_
READ
Y
C209
120O
HMOC
P_RE
ADY
L200
+5V_
USB
1K OCP_
READ
Y
R209
4.7K
OCP_
READ
Y
R210
0No
n_OC
PR2
37
10uF
6.3V
C210
USB_
DL_N
USB_
DL_P
68
R2
07
68
R2
08
68
pF
C2
13
68
pF
C2
11
4.7K
R219
RE
AD
Y
0R2
00
0R2
01
500
L201
22
0u
F16V
C2
12
10
0u
F16V
C2
14
KD
S226
D2
13
OC
P_R
EA
DY
AA
C
C
510
OCP_
READ
Y
R238
160
OCP_
READ
YR2
06
10K
R224
10K
R225IR_O
UT
2 9
INP
UT
2
MS
TA
R N
-EU
20
08
/1
2/1
6
IN
PU
T2
: P
C,R
S-2
32
C,S
ID
E A
V,U
SB
US
B
EA
X56
8569
04H
6 L
CD
ME
RC
UR
Y
Itís
pos
sibe
l to
27~
47oh
m
**
1
A D
es
ign
SID
E A
V
RS-
232C
(CI I
TEM
)
PC E
DID
PC PC S
OUND
Pin
to
Pin
wit
hE
AN
43
43
94
01
Clo
se
to
SID
E_
US
B
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TMDS
3_RX
2-
+5V_
HDM
I_2
TMDS
3_RX
C-
HPD_
MST
_2
TMDS
3_RX
0+
TMDS
2_RX
2-
CEC
TMDS
2_RX
C-
TMDS
2_RX
C+
TMDS
1_RX
C-
TMDS
2_RX
0+
TMDS
3_RX
0-
TMDS
3_RX
1+
TMDS
3_RX
C+
+5V_
HDM
I_2
HPD_
MST
_1
CEC
TMDS
1_RX
2+
TMDS
2_RX
1+
+5V_
MUL
TI
+5V_
HDM
I_1
TMDS
3_RX
2+
TMDS
2_RX
0-
TMDS
1_RX
1-
TMDS
2_RX
1-
TMDS
1_RX
2-
+5V_
HDM
I_3
TMDS
3_RX
1-
+5V_
MUL
TI+5
V_HD
MI_
3
+5V_
MUL
TI
+5V_
HDM
I_1
TMDS
1_RX
0-
TMDS
1_RX
1+
CEC
TMDS
1_RX
0+
TMDS
2_RX
2+
TMDS
1_RX
C+
HPD_
MST
_3
DDC_
SDA2
DDC_
SCL2
DDC_
SDA1
DDC_
SCL1
DDC_
SDA3
DDC_
SCL3
JP
30
4
JP
30
5
JP
30
1
JP
30
0
JP
30
2
JP
30
3
2SC3
875S
RT
1C
39
04
-T1
12
Q30
1
E
B
C
2SC3
875S
RT
1C
39
04
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12
Q30
0 E
B
C
2SC3
875S R
T1
C3
90
4-T
11
2
Q30
2 E
B
C
KJA
-ET-
0-00
32
JK30
3
14
NC
13
CE
C
5D
AT
A1_
SH
IEL
D
20
JAC
K_G
ND
12
CL
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11
CL
K_S
HIE
LD
2D
AT
A2_
SH
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D
19
HPD
18
+5V
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WE
R
10
CL
K+
4D
AT
A1+
1D
AT
A2+
17D
DC
/CE
C_G
ND
9D
AT
A0-
8D
AT
A0_
SH
IEL
D
3D
AT
A2-
16
SDA
7D
AT
A0+
6D
AT
A1-
15
SC
L
KD
S184
SD
300
A1
C
A2
KD
S184
SD
301
A1
C
A2
KD
S184
SD
302
A1
C
A2
CA
T24C
02W
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T3
IC3
01
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8V
CC
CA
T24C
02W
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T3
IC3
02
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8V
CC
CA
T24C
02W
I-G
T3
IC3
00
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8V
CC
DDC_
WP
DDC_
WP
DDC_
WP
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
BSS8
3CE
C_RE
ADY
Q30
3
SBD
GCE
C
+3.3
V_M
ST
CEC_
C
CDS3
C30G
TH30
VCE
C_RE
ADY
D30
4
MM
BD30
1LT1
G30
VCE
C_RE
ADY
D30
3
10K
R301
1KR303
0.0
1u
FC
30
0
10K
R300
1KR302
100
R329
1KR314
10K
R312
68K
CEC_
READ
Y
R315
0R313
100
R317
100
R318
100
R305
100
R304
0.0
1u
FC
30
1
100
R331
100
R306
100
R307
0.0
1u
FC
30
2
100
R327
10K
R308
10K
R310
10K
R309
10K
R311
10K
R319
10K
R320
QJ4
1193
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E1-7
FJK
301
1D
AT
A2+
2D
AT
A2_
SH
IEL
D
3D
AT
A2-
4D
AT
A1+
5D
AT
A1_
SH
IEL
D
6D
AT
A1-
7D
AT
A0+
8D
AT
A0_
SH
IEL
D
9D
AT
A0-
10
CL
K+
11
12
13
14
15
16
17
18
19 20
JAC
K_G
ND
21
.
22
QJ4
1193
-CFE
E1-7
FJK
302
1D
AT
A2+
2D
AT
A2_
SH
IEL
D
3D
AT
A2-
4D
AT
A1+
5D
AT
A1_
SH
IEL
D
6D
AT
A1-
7D
AT
A0+
8D
AT
A0_
SH
IEL
D
9D
AT
A0-
10
CL
K+
11
12
13
14
15
16
17
18
19 20
JAC
K_G
ND
21
.
22
56K
CEC_
READ
Y
R316
HD
MI
3 9
MS
TA
R N
-EU
20
08
/1
2/1
6
OP
TIO
N
SW
_H
PD
: U
SE
SW
HP
D (
Defau
lt)
MS
T_H
PD
: U
SE
MS
T H
PD
H6
LCD
ME
RC
UR
YE
AX
5685
6904
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TXCE
0+,T
XCE
0-,T
XCE
1+,T
XCE
1-,T
XCE
2+,T
XCE
2-,T
XCE
3+,T
XCE
3-,T
XCE
4+,T
XCE
4-,T
XCL
KE+
,TX
CLK
E-,T
XCL
KO
+,TX
CLK
O-,T
XCO
0+,T
XCO
0-,T
XCO
1+,T
XCO
1-,T
XCO
2+,T
XCO
2-,T
XCO
3+,T
XCO
3-,T
XCO
4+,T
XCO
4-
47pF
C403
22IR
-OU
TR4
30
470p
FC4
04N
ON
_1
9_
22
_2
6"
KEY1
ZD40
1
120o
hmL4
06N
ON
_1
9_
22
_2
6"
ZD40
2
+5VS
T_M
ST
ZD40
0
500-
ohm
L410
NO
N_1
9_22
_26"
IR_O
UT
+3.3
V_M
ULT
I_M
ST
10K
IR-O
UT
R429
2SC
3052
Q40
5
IR-O
UT
EB
C
500-
ohm
L411
NO
N_1
9_22
_26"
SUB_
SCL
120o
hmL4
02
KEY2
2SC
3052
Q40
4
IR-O
UT
EB
C
+5VS
T_M
ST
IR
SUB_
SDA
0.1u
FC4
08N
ON
_1
9_
22
_2
6"+3
.3V
_MST
+5VS
T_M
ST
0.1u
FC4
11N
ON
_1
9_
22
_2
6"
470p
FC4
12
NO
N_
19
_2
2_
26
"
120o
hmL4
03N
ON
_1
9_
22
_2
6"
+3.3
V_M
ULT
I_M
ST
+3.3
V_M
ULT
I_M
ST
+5V_
+12V
_LCD
0.1u
FC4
07RE
ADY
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
47uF 16V
C406
0.1u
F16
VC4
14N
ON
_19_
22_2
6"
+3.3
V_M
ST
KE
Y2
10
0p
F50V
C4
01
19
_2
2_
26
"
KE
Y1
10
0p
F50V
C4
00
19
_2
2_
26
"
+5V_
+12V
_LCD
TXCE
0+,T
XCE
0-,T
XCE
1+,T
XCE
1-,T
XCE
2+,T
XCE
2-,T
XCE
3+,T
XCE
3-,T
XCE
4+,T
XCE
4-,T
XCL
KE+
,TX
CLK
E-,T
XCL
KO
+,TX
CLK
O-,T
XCO
0+,T
XCO
0-,T
XCO
1+,T
XCO
1-,T
XCO
2+,T
XCO
2-,T
XCO
3+,T
XCO
3-,T
XCO
4+,T
XCO
4-
+5V_
+12V
_LCD
+3.3V
_MUL
TI_M
ST
OPC_
EN
E-DI
M
OPC_
OUT
10
0p
F50V
C4
05
19
_2
2_
26
"
SU
B_S
CL
10
0p
F50V
C4
02
19
_2
2_
26
"
12
50
7W
S-1
2L
P4
00
NO
N_
19
_2
2_
26
"
1S
CL
2SD
A
3G
ND
4K
EY
1
5K
EY
2
65V
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T
7G
ND
8W
AR
M_S
T(L
ED
_R
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IG)
9IR
10
GN
D
11
ST
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(LE
D_
B)
12
PO
WE
R_O
N(L
ED
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MA
LL
)
13
.
P4
05
19
_2
2_
26
"
1K
EY
1
2K
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2
3G
ND
45V
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T
5G
ND
6IR
7L
ED
_B
8L
ED
_R
9
.B
G1
60
8B
12
1F
L4
00
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
1
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
8
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
5
19
_2
2_
26
"
4.7K
R420
4.7K
R421
10K
IR-O
UT
R427
10K
IR-O
UT
R428
47K
IR-O
UT
R426
0R
41
7N
ON
_1
9_
22
_2
6"
0R
40
0 RE
AD
Y
0
R4
03
NO
N_
19
_2
2_
26
"
0R
41
3
RE
AD
Y
0R402
8BIT
or
52 s
harp
4.7K
10B
IT
R401
4.7K
JEID
A
R407
0R424
VESA
100
R409 R
EA
DY
0READ
YR4
05
0
OPC
_EN
AB
LE
R4
12
470
R435
OPC_
ENAB
LE
SM
AW
200-0
3
P4
04
19
_2
2_
26
"
1K
EY
1
2K
EY
2
3G
ND
120-
ohm
L404
120-
ohm
L407
NO
N_1
9_22
_26"
TF
05
-51
S
P4
01
1 2 3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
FF
10
00
1-3
0
P4
02
1 2 3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SM
W200-2
8C
P4
03
1 2 3 4 5 6 7 8 9 10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
LE
D_R
+3.3
V_M
ST
RT1
C39
04-T
112
Q40
0
OPC
_EN
AB
LE
EB
C1K
R411
OPC
_EN
AB
LE
10K
R404
19_2
2_26
"
2SC
3052
Q40
119
_22_
26"
EB
C+3.3
V_M
ULT
I_M
ST 10K
R410
19_2
2_26
"
10K
R414
19_2
2_26
"
2SC
3052
Q40
2
19_2
2_26
"E
BC+3
.3V
_MST
10K
R415
19_2
2_26
"
4.7K
R406
19_2
2_26
"
0RE
ADY
R416
0RE
ADY
R418
0N
ON
22/
27"
FHD
R419
0N
ON
22/
27"
FHD
R422
0N
ON
22/
27"
FHD
R423
0N
ON
22/
27"
FHD
R431
0N
ON
22/
27"
FHD
R425
TXCO
3+
TXCE
1+
TXCO
1+
TXCE
1-
TXCL
KO+
TXCO
2-
TXCO
2+
TXCO
1-
TX
CE
2+
TX
CE
2-
TX
CL
KE
+
TX
CL
KE
-
TX
CE
3+
TX
CE
3-
TX
CE
4+
TX
CE
4-
TX
CO
3-
TX
CO
4+
TX
CO
4-
TX
CL
KO
-
TX
CE
2-
TX
CE
2+
TX
CE
1-
TX
CE
1+
TX
CE
0-
TX
CE
0+
TX
CL
KE
+
TX
CL
KE
-
TX
CE
3+
TX
CE
3-
TX
CE
3-
TX
CE
3+
TX
CL
KE
-
TX
CL
KE
+
TX
CE
2-
TX
CE
2+
TX
CE
1-
TX
CE
1+
TX
CE
0-
TX
CE
0+
TXCE
0-
TXCE
0+
TXCO
0+
TXCO
0-
EA
X56
8569
04H
6 L
CD
ME
RC
UR
Y
LV
DS
,CT
R K
EY
4 9
MS
TA
R2
00
8/1
2/1
6
FH
D
X
R40
24.
7K10
BIT
(FH
D)
X8B
IT(H
D)
X X0
X
32 s
harp
R40
1
00 X52
sha
rp8B
IT(F
HD
)
CO
NT
RO
L K
EY
OPC
_EA
BL
E
OPC
_OU
TPU
T
Ex
tern
al
VB
R
PA
NE
L W
AF
ER
IR
(1
9/2
2/2
6")
(1
9/2
2/2
6"
)
HD
(1
9/2
2")
IR
(N
on
1
9/2
2/2
6)
CO
NT
RO
L K
EY
(N
on 1
9/2
2/2
6)
*8B
IT(F
HD
):22
/27"
HD
(2
6/3
2/3
7/4
2/4
7")
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
MA
IN_S
IF
0.01
uFC5
01
M_S
DA
27pF
C500
+5V_
TUNE
R
TV_M
AIN
M_S
CL
+5V_
TUNE
R
C5
04
RE
AD
Y
27pF
C502
10
uH
L5
02
RE
AD
Y
82
pF
C5
07
RE
AD
Y
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
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FO
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R506
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12
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01
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TU
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Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
0.1u
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44
0.1u
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37
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C651
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MUL
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W
0.1u
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05
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D
0.1u
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15
0.1u
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ULT
I_M
ST
0.1u
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43
DA
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0
EAP3
8319
001
L607
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0.1u
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17
0.1u
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001
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THE
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10uF
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10uF
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3.3
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12R608
12R611
12R610
12R638
4.7K
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4.7K
R623
3.3
R626
3.3
R625
100
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3.3K
R600
100 R676
100 R677
100 R678
100
R602
100
R603
0 R656HOTEL_OPT
0R6
73
12R658
12R653
12R621
12R654
4.7K
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4.7K
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3.3
R671
3.3
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NO
N_H
OT
EL
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R613
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R61
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13DV
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15 DVSS_2
16 DVDD
17 SDATA
18 WCK
19 BCK
20 SDA
21 SCL
22 MONITOR_0
23 MONITOR_1
24 MONITOR_2
25 FAULT
26 VDR2B
27 BST2B
28 PGND2B_1
29PG
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30OU
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31OU
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32PV
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40BS
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43VDR1B
44BST1B
45PGND1B_1
46PGND1B_2
47OUT1B_1
48OUT1B_2
49PVDD1B_1
50PVDD1B_2
51PVDD1A_1
52PVDD1A_2
53OUT1A_1
54OUT1A_2
55PGND1A_1
56PGND1A_2
MLB
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Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE
SY
MBO
L M
ARK
OF
THIS
SCH
EMET
IC D
IAG
RAM
INCO
RPO
RATE
SSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PRO
TECT
ION
FRO
M X
-RA
DIA
TIO
N.
FILR
E A
ND
ELE
CTRI
CAL
SHO
CK H
AZA
RDS,
WH
EN S
ERV
ICIN
G IF
IS
ESSE
NTI
AL
THA
T O
NLY
MA
NU
FATU
RES
SPEC
FIED
PA
RTS
BE U
SED
FO
RTH
E CR
ITIC
AL
COM
PON
ENTS
IN T
HE
SY
MBO
L M
ARK
OF
THE
SCH
EMET
IC.
MUL
TI_P
W_S
W
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59
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DR
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0
100 R825
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10 R841HDMI3_SIDE
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DDR2_CASZ
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COM
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10 R820HDMI3_SIDE
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59
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N
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100
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0.1u
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ST
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38
47R8
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47R8
36
470
R803
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47R8
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R857
47R8
30
47R8
7547
R876
100
R846
100
R847
100 R8039HDMI3_SIDE
100 R8040HDMI3_SIDE
4.7K
R863
4.7K
R864
10
0R
80
42
1KR
80
38
1KR
80
18
4.7K
R865
4.7K
R866
1K R867 1K R868
100R8021100R8022
100 R850
100 R849100 R895
0READY
R80170
READYR8016
0 R8033READY
0 R80340 R8035
10K
R8
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0
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R800
3
0.04
7uF
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0.04
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C827
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C825
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C847
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C845
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83
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4.7K
Non
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D
R80
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4.7K
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R89
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22R8
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0 R8260 R827
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71
RE
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12
0-o
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120-ohm
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12
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L8
02
2.2uF C8232.2uF C824
2.2uF C821
2.2uF C873
2.2uF C822
2.2uF C874
2.2uF C802
2.2uF C875
MST
99A8
8ML(
MAT
RIX
BASI
C)
IC80
0
1RX
BCKN
2RX
BCKP
3RX
B0N
4RX
B0P
5HO
TPLU
GB6
RXB1
N7
RXB1
P8
AVDD
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19
RXB2
N10
RXB2
P11
RXAC
KN12
RXAC
KP13
RXA0
N14
RXA0
P15
AVDD
_33_
216
RXA1
N17
RXA1
P18
GND_
119
RXA2
N20
RXA2
P21
HOTP
LUGA
22RE
XT23
VCLA
MP
24RE
FP25
REFM
26BI
N1P
27SO
GIN1
28GI
N1P
29RI
N1P
30BI
NM31
BIN
0P32
GINM
33GI
N0P
34SO
GIN0
35RI
NM36
RIN
0P37
AVDD
_33_
338
GND_
239
BIN
2P40
GIN2
P41
SOGI
N242
RIN
2P43
CVBS
644
CVBS
545
CVBS
446
CVBS
347
CVBS
248
CVBS
149
VCOM
150
CVBS
051
VCOM
052
AVDD
_33_
453
CVBS
OUT
54GN
D_3
55SI
F0P
56SI
F0M
57VD
DC_1
58AU
L559
AUR5
60AU
VRM
61AU
OUTL
262
AUOU
TR2
63AU
OUTL
164
AUOU
TR1 65AUL0
66AUR067AUL168AUR169AUL270AUR271AUL372AUR373AUCOM74AUL475AUR476GND_477AUVRP78AUVAG79AVDD_AU80GND_581VDDC_282DDCA_CK83DDCA_DA84DDCDA_CK85DDCDA_DA86DDCDB_CK87DDCDB_DA88GPIO2089VDDP_190VDDC_391UART2_RX92UART2_TX93DDCDC_CK94RXCCKN95RXCCKP96DDCDC_DA97RXC0N98RXC0P99GND_6100RXC1N101RXC1P102AVDD_DM103RXC2N104RXC2P105HOTPLUGC106USB1_DM107USB1_DP108SCK109SDI110SDO111SCZ112PWM0113PWM1114PWM2115PWM3116LVA4P117LVA4M118LVA3P119LVA3M120LVACKP121LVACKM122LVA2P123LVA2M124LVA1P125LVA1M126LVA0P127LVA0M128VDDP_2
129
LVB4
P13
0LV
B4M
131
LVB3
P13
2LV
B3M
133
LVBC
KP13
4LV
BCKM
135
LVB2
P13
6LV
B2M
137
LVB1
P13
8LV
B1M
139
LVB0
P14
0LV
B0M
141
AVDD
_LPL
L14
2GN
D_7
143
VDDC
_414
4GP
IO15
0/I2
C_OU
T_M
UTE
145
GPI
O15
1/I2
C_O
UT_
SD2
146
GPI
O15
2/I2
C_O
UT_
SD3
147
GND_
814
8G
PIO
5114
9G
PIO
5215
0G
PIO
5315
1G
PIO
5415
2G
PIO
5515
3G
PIO
5615
4G
PIO
5715
5G
PIO
5815
6VD
DP_3
157
VDDC
_515
8B_
MDA
TA[4
]15
9B_
MDA
TA[3
]16
0GN
D_9
161
B_M
DATA
[1]
162
B_M
DATA
[6]
163
AVDD
_DDR
_116
4B_
MDA
TA[1
1]16
5B_
MDA
TA[1
2]16
6GN
D_10
167
B_M
DATA
[9]
168
B_M
DATA
[14]
169
AVDD
_DDR
_217
0B_
DDR2
_DQM
[1]
171
B_DD
R2_D
QM[0
]17
2GN
D_11
173
B_DD
R2_D
QS[0
]17
4B_
DDR2
_DQS
B[0]
175
AVDD
_DDR
_317
6VD
DP_4
177
GND_
1217
8B_
DDR2
_DQS
[1]
179
B_DD
R2_D
QSB[
1]18
0AV
DD_D
DR_4
181
B_M
DATA
[15]
182
B_M
DATA
[8]
183
GND_
1318
4B_
MDA
TA[1
0]18
5B_
MDA
TA[1
3]18
6AV
DD_D
DR_5
187
B_M
DATA
[7]
188
B_M
DATA
[0]
189
B_M
DATA
[2]
190
B_M
DATA
[5]
191
B_M
CLK
192
B_M
CLKZ
193 GND_14194 AVDD_MEMPLL195 MVREF196 A_ODT197 A_RASZ198 A_CASZ199 A_MADR[0]200 A_MADR[2]201 A_MADR[4]202 GND_15203 A_MADR[6]204 A_MADR[8]205 A_MADR[11]206 A_WEZ207 A_BADR[1]208 A_BADR[0]209 A_MADR[1]210 A_MADR[10]211 AVDD_DDR_6212 A_MADR[5]213 A_MADR[9]214 A_MADR[12]215 A_MADR[7]216 A_MADR[3]217 A_MCLKE218 VDDC_6219 I2S_IN_WS/GPIO67220 I2S_IN_BCK/GPIO68221 I2S_IN_SD222 I2S_OUT_MCK223 I2S_OUT_WS224 VDDP_5225 GND_16226 VDDC_7227 I2S_OUT_BCK228 I2S_OUT_SD229 SPDIFO230 UART2_RX/I2CM_SDA231 UART2_TX/I2CM_SCK232 UART1_RX/GPIO86233 UART1_TX/GPIO87234 GND_17235 GND_18236 USB0_DM237 USB0_DP238 SAR0239 SAR1240 SAR2241 SAR3242 AVDD_MPLL243 XOUT244 XIN245 GPIO134246 GPIO135247 GPIO138248 GPIO139249 GPIO140250 IRIN251 HSYNC0252 VSYNC0253 HSYNC1254 VSYNC1255 CEC256 HWRESET
LG
E3767A
[M
ST
99A
88M
L(M
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ON
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SD
DIV
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RM
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IC
80
0-*
1
1R
XB
CK
N
2R
XB
CK
P
3R
XB
0N
4R
XB
0P
5H
OT
PL
UG
B
6R
XB
1N
7R
XB
1P
8A
VD
D_33_1
9R
XB
2N
10
RX
B2P
11
RX
AC
KN
12
RX
AC
KP
13
RX
A0N
14
RX
A0P
15
AV
DD
_33_2
16
RX
A1N
17
RX
A1P
18
GN
D_1
19
RX
A2N
20
RX
A2P
21
HO
TPL
UG
A
22
RE
XT
23
VC
LA
MP
24
RE
FP
25
REFM
26
BIN
1P
27
SO
GIN
1
28
GIN
1P
29
RIN
1P
30
BIN
M
31
BIN
0P
32
GIN
M
33
GIN
0P
34
SO
GIN
0
35
RIN
M
36
RIN
0P
37
AV
DD
_33_3
38
GN
D_2
39
BIN
2P
40
GIN
2P
41
SO
GIN
2
42
RIN
2P
43
CV
BS6
44
CV
BS5
45
CV
BS4
46
CV
BS3
47
CV
BS2
48
CV
BS1
49
VC
OM
1
50
CV
BS0
51
VC
OM
0
52
AV
DD
_33_4
53
CV
BSO
UT
54
GN
D_3
55
SIF
0P
56
SIF
0M
57
VD
DC
_1
58
AU
L5
59
AU
R5
60
AU
VRM
61
AU
OU
TL
2
62
AU
OU
TR
2
63
AU
OU
TL
1
64
AU
OU
TR
1
65 AUL0
66 AUR0
67 AUL1
68 AUR1
69 AUL2
70 AUR2
71 AUL3
72 AUR3
73 AUCOM
74 AUL4
75 AUR4
76 GND_4
77 AUVRP
78 AUVAG
79 AVDD_AU
80 GND_5
81 VDDC_2
82 DDCA_CK
83 DDCA_DA
84 DDCDA_CK
85 DDCDA_DA
86 DDCDB_CK
87 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
94 RXCCKN
95 RXCCKP
96 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
100 RXC1N
101 RXC1P
102 AVDD_DM
103 RXC2N
104 RXC2P
105 HOTPLUGC
106 USB1_DM
107 USB1_DP
108 SCK
109 SDI
110 SDO
111 SCZ
112 PWM0
113 PWM1
114 PWM2
115 PWM3
116 LVA4P
117 LVA4M
118 LVA3P
119 LVA3M
120 LVACKP
121 LVACKM
122 LVA2P
123 LVA2M
124 LVA1P
125 LVA1M
126 LVA0P
127 LVA0M
128 VDDP_2
12
9L
VB
4P1
30
LV
B4M
13
1L
VB
3P1
32
LV
B3M
13
3L
VB
CK
P1
34
LV
BC
KM
13
5L
VB
2P1
36
LV
B2M
13
7L
VB
1P1
38
LV
B1M
13
9L
VB
0P1
40
LV
B0M
14
1A
VD
D_L
PL
L1
42
GN
D_7
14
3V
DD
C_4
14
4G
PIO
150/I
2C
_O
UT
_M
UT
E1
45
GP
IO1
51
/I2
C_
OU
T_
SD
21
46
GP
IO1
52
/I2
C_
OU
T_
SD
31
47
GN
D_8
14
8G
PIO
51
14
9G
PIO
52
15
0G
PIO
53
15
1G
PIO
54
15
2G
PIO
55
15
3G
PIO
56
15
4G
PIO
57
15
5G
PIO
58
15
6V
DD
P_3
15
7V
DD
C_5
15
8B
_M
DA
TA
[4]
15
9B
_M
DA
TA
[3]
16
0G
ND
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61
B_M
DA
TA
[1]
16
2B
_M
DA
TA
[6]
16
3A
VD
D_D
DR
_11
64
B_M
DA
TA
[11]
16
5B
_M
DA
TA
[12]
16
6G
ND
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16
7B
_M
DA
TA
[9]
16
8B
_M
DA
TA
[14]
16
9A
VD
D_D
DR
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70
B_D
DR
2_D
QM
[1]
17
1B
_D
DR
2_D
QM
[0]
17
2G
ND
_11
17
3B
_D
DR
2_D
QS
[0]
17
4B
_D
DR
2_D
QS
B[0
]1
75
AV
DD
_DD
R_3
17
6V
DD
P_4
17
7G
ND
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17
8B
_D
DR
2_D
QS
[1]
17
9B
_D
DR
2_D
QS
B[1
]1
80
AV
DD
_DD
R_4
18
1B
_M
DA
TA
[15]
18
2B
_M
DA
TA
[8]
18
3G
ND
_13
18
4B
_M
DA
TA
[10]
18
5B
_M
DA
TA
[13]
18
6A
VD
D_D
DR
_51
87
B_M
DA
TA
[7]
18
8B
_M
DA
TA
[0]
18
9B
_M
DA
TA
[2]
19
0B
_M
DA
TA
[5]
19
1B
_MC
LK
19
2B
_MC
LK
Z
193GND_14194AVDD_MEMPLL195MVREF196A_ODT197A_RASZ198A_CASZ199A_MADR[0]200A_MADR[2]201A_MADR[4]202GND_15203A_MADR[6]204A_MADR[8]205A_MADR[11]206A_WEZ207A_BADR[1]208A_BADR[0]209A_MADR[1]210A_MADR[10]211AVDD_DDR_6212A_MADR[5]213A_MADR[9]214A_MADR[12]215A_MADR[7]216A_MADR[3]217A_MCLKE218VDDC_6219I2S_IN_WS/GPIO67220I2S_IN_BCK/GPIO68221I2S_IN_SD222I2S_OUT_MCK223I2S_OUT_WS224VDDP_5225GND_16226VDDC_7227I2S_OUT_BCK228I2S_OUT_SD229SPDIFO230UART2_RX/I2CM_SDA231UART2_TX/I2CM_SCK232UART1_RX/GPIO86233UART1_TX/GPIO87234GND_17235GND_18236USB0_DM237USB0_DP238SAR0239SAR1240SAR2241SAR3242AVDD_MPLL243XOUT244XIN245GPIO134246GPIO135247GPIO138248GPIO139249GPIO140250IRIN251HSYNC0252VSYNC0253HSYNC1254VSYNC1255CEC256HWRESET
3.3
KR
81
9
DSUB_SDA
LED_R
RT1
C39
04-T
112
Q80
5R
EA
DY
EB
CDD
C_W
P10
K
R828
RE
AD
Y
4.7K
R878
4.7K
R893
1KR8
61
0
R8
03
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ON
19
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2"
0 R8940 R899
2KR886
150
R885
1KR8
60
10K
R800
0
33K
R800
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ON
19
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2"
10K
R855
1KR853
100
R888
33K
R887
20K
R8
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6
19
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2_
26
"
20pF C817
20pF C816
DDR2_A[2]
DD
R2_D
[1]
DDR2_A[6]
GND
DD
R2_D
[5]
DDR2_A[10]
DD
R2_D
[0]
DD
R2_D
[10]
DDR2_A[12]
DD
R2_D
[14]
DDR2_A[0]
DD
R2_D
[6]
DDR2_A[5]
DD
R2_D
[3]
DDR2_A[4]
DD
R2_D
[4]
DD
R2_D
[12]
DDR2_A[9]
DD
R2_D
[11]
DDR2_A[8]
DD
R2_D
[8]
DD
R2_D
[7]
DD
R2_D
[15]
DD
R2_D
[9]
DDR2_A[3]
DD
R2_D
[13]
DDR2_A[11]
DD
R2_D
[2]
DDR2_A[1]
DDR2_A[7]
TXCE
4-TX
CE4+
TXCE
3-TX
CE3+
TXCL
KE-
TXCL
KE+
TXCE
2-TX
CE2+
TXCE
1-TX
CE1+
TXCE
0-TX
CE0+
TXCO
4-TX
CO4+
TXCO
3-TX
CO3+
TXCL
KO-
TXCL
KO+
TXCO
2-TX
CO2+
TXCO
1-TX
CO1+
TXCO
0-TX
CO0+
20
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Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
+1.8
V_D
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LGE Internal Use Only
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