Nano Technology for Microelectronics Packaging

Karl-Friedrich Becker, Rolf Aschenbrenner

BECAP - TU Berlin / Fraunhofer IZM

Gustav-Meyer-Allee 25 / 13355 Berlinkarl-friedrich.becker@izm.fraunhofer.de

MINAEST-NET Partnering Workshop @ TU Berlin/FhG-IZM, Berlin, Germany - 22 April 2005

Hetero System Integration on Organic Substrate

DISPLAY

•IC

COILTAPE

R-NETBATTERY

SAW-Filter

OSCILLATOR

Base material with optimized mechanical, optical and electrical properties and geometrical functionality

Advanced thin film technology for RF integration (self assembly)

Self Assembly of Components

Module protection by planar encapsulation / functional layers

Transparent Encapsulation / Provide diffusion barriers for OLEDs

Low temperature inter-connection technology for low cost applications / for (bio-)sensors

Possible Applications for Nanotechnology within Electronic-Packaging

Sensor Devices with Nano Functionality

Nano Materials for Packaging – IZM Focus

Nano-Scale filler within encapsulant - IZM

Nano Filled Epoxy as SiP Base Material – Duromer with „Ceramic CTE“

Use of nanoscale filler particles to realize materials that allow high accuracy structuring in combination with e.g. LIGA mold inserts. Direct metallization yields CTE-matched duromer substrates (Duromer MID) with high accuracy µStructures for high precision 3D assembly of sensors/MEMS suited for security issues ...

Nano Fillers for (Opto-)Encapsulation

Use of nanoscale filler particles to realize encapsulant transparency while providing matched thermomechanical properties for optoelectronic packaging. Currently 20 wt% is a maximum for low viscosity liquid encapsulantsNano-Scale SiO2 filler within transparent

encapsulant – Courtesy Hanse Chemie

Solder Nanoparticles generated by ultrasonic dispersion method - IZM

Nano Scale Solder Particles for Fine Pitch Interconnects

Realization of Type 6 and 7 solder paste using ultrasonic dispersion in inert media – base material for fine pitch solder printing on Wafer or on organic substrate. Tm reduction due to nano size effect has been shown by Wronski et al 1967, Dick et al, 2002.

Interconnects for NanoSystems – Aims

Interconnect Targets:• Fine pitch

due to increasing no. of interconnects per die • Low profile

for improved high frequency performance • Low temperature potential

to allow heterogeneous integration with temp sensitive bio and polytronic devices

• Low cost potentialby WL processing and infrastructural embedding

Interconnect Challenges:• Planarity and Homogeneity of Fine Pitch Interconnects• Surface Effects Dominate Over Bulk Effects• Yield optimum combination of LowTemperature

Interconnection for Bio Packaging, Low Cost Packaging, ... and High Temperature Stability

• Low Profile Interconnects Need Stress CompensationeGrain

40 µm Flip Chip Pitch and 60 Wire Bond Pitch

Interconnection Technology from Micro to Nano

100 µm10 nm 100 nm 1 µm 10 µm 1000 µm

Solder Bump / Wire Bond

Nickel Bump / UT Solder Bump

NanoVelcro / NanoLawnSolder cap height: 1 µm

Ni-Bump: 3 µm /diam. 12 µmAl-pad opening: 8 µm

Interconnect Pitch

Com

plex

ity

Molecular Modeling

Continuum ApproachFEM Simulation

Potential for Low Temperature Interconnects /Reactive Interconnects

Nano-Reliability at IZMNano-Reliability at IZM

Nano- AnalyticsVerification of Nano-Structure, Nano-Deformation

Resolution Enhancement

ContinuumFE-SimulationStress and Strain Fields,Lifetime Prediction

MacroscopicMaterials TestingVerification of Bulk-Properties

Correlation

Parameters

NEW:

Nano-SimulationAb-Initio Calculation of Nano-Parameters for FE-Input, Homogenisation, Molecular Modeling

Correlation

Structure

NEW:

Nano-MaterialCompositionDesign: Matrix & Filler

Design Guide

Structure - Property Correlation by Combined Simulation & Experiment

Contact: B. WunderleDepartment Mechanical Reliability & Micro Materials

- Advanced Devices as carbon nano tubes, molecule transistors, -sensors, -actuators

- Effective Interconnection Technologies as thin, elastic, reactive interconnects, vertical and horizontal orientation, additive structure generation and low temperature interconnection technologies

- Improved Materials e.g. low cost thermal management, tailor made materials, super materials

- Cost Efficient Assembly zero-force, high precision component assembly, handling of smallest geometries, self-assembly resolving the handling issues of state of the art technology

- System Integration: Sensors, Actuators and MOEMS

Outlook - Nano Technology Potential for Packaging Applications