MAHATMA GANDHI- UNIVERSITY

SCHEME AND SYLLABI

FOR

M. Tech. DEGREE PROGRAMME

IN

APPLIED ELECTRONICS

(2013ADMISSION ONWARDS)

1

SCHEME AND SYLLABI FOR M. Tech. DEGREE

PROGRAMME IN APPLIED ELECTRONICS

SEMESTER - II

Sl.

No.

Course

No. Subject

Hrs / Week Evaluation Scheme (Marks)

Credits

(C) L T P

Sessional

ESE Total

TA CT Sub

Total

1 MECAE 201 System Design for Electromagnetic

Compatibility 3 1 0 25 25 50 100 150 4

2 MECAE 202 Analog and Data Conversion System

Design 3 1 0 25 25 50 100 150 4

3 MECAE 203 High Speed Digital System Design 3 1 0 25 25 50 100 150 4

4 MECAE 204 RF Micro Electronics 3 1 0 25 25 50 100 150 4

5 MECAE 205 Elective III 3 0 0 25 25 50 100 150 3

6 MECAE 206 Elective IV 3 0 0 25 25 50 100 150 3

7 MECAE 207 Electronic System Design Lab-II 0 0 3 25 25 50 100 150 2

8 MECAE 208 Seminar II 0 0 2 50 0 50 0 50 1

Total 18 4 5 225 175 400 700 1100 25

Elective III (MECAE 205) Elective IV (MECAE 206)

MECAE 205 1** Wireless Communication Systems MECAE 206 1* MIMO Communication Systems

MECAE 205 - 2 RF and Microwave Networks MECAE 206 - 2 RF Antenna Theory

MECAE 205 - 3 DSP System Design MECAE 206 - 3 Detection and Tracking Systems

MECAE 205 - 4 ASIC and SOC Design MECAE 206 - 4 Embedded Network Design

L Lecture, T Tutorial, P Practicals Assessment (Assignments, attendance, group discussion, Quiz, tutorials, seminars, etc.)

CT Class Test (Minimum of two tests to be conducted by the Institute)

ESE End Semester Examination to be conducted by the University

Electives: New Electives may be added by the department according to the needs of emerging

fields of technology. The name of the elective and its syllabus should be submitted to

the University before the course is offered.

*- Common with MECCE, MECCI, MECEC , ** Common with MAESP

2

MECAE 201 SYSTEM DESIGN FOR ELECTROMAGNETIC

COMPATIBILTY L T P C

3 1 0 4

Module 1: Introduction to Electromagnetic Compatibility

Aspects of EMC; electrical dimensions and waves; EMC units and specifications; EMC

requirements for electronic systems; radiated emissions and conducted emissions;

additional product requirements; advantages of EMC design.

Non ideal behaviour of components: wires; PCB lands; effect of component leads;

resistors; capacitors; inductors; ferromagnetic materials; ferrite beads; common-mode

chokes; electromechanical devices; mechanical switches.

Module 2: Cabling and Grounding

Cabling: capacitive coupling; effect of shield on capacitive coupling; inductive coupling;

effect of shield on magnetic coupling; shielding to prevent magnetic radiations; common

impedance shield coupling; shield transfer impedance; braided shields; spiral shields;

shield terminations; types of cables.

Grounding: ac power distribution safety grounds; signal grounds; equipment / system

grounding; ground loops; low and high frequency analysis of common-mode chokes;

single ground reference for a circuit.

Module 3: Balancing, Filtering and Shielding

Balancing and Filtering: power supply decoupling; decoupling filters; amplifier

decoupling; driving capacitive loads; high frequency filtering; system bandwidth;

modulation and coding.

Shielding: near fields and far fields; characteristic and wave impedance; shielding

effectiveness; absorption loss; reflection loss; composite absorption and reflection loss;

shielding with magnetic materials; grounding of shields.

Module 4: Digital Circuit Noise and Radiation

Frequency Vs. time domain; analog Vs. digital circuits; digital logic noise; internal noise

sources; digital circuit ground noise; power distribution; noise voltage; differential-mode

radiation; controlling differential-mode radiation; common-mode radiation; controlling

common-mode radiations.

3

Electrostatic Discharge: static generation; ESD models; static discharge; ESD protection

in system design; ESD Vs. EMC.

References:

1. Clayton R. Paul, Introduction to Electromagnetic Compatibility, 2nd Ed., Wiley India

Pvt. Ltd., 2011.

2. Henry W. Ott, Electromagnetic Compatibility Engineering, John Wiley and Sons

Inc., 2009.

3. Henry W. Ott, Noise Reduction Techniques in Electronic Systems, 2nd Ed., Wiley,

1998.

4. Prasad Kodali V., Engineering Electromagnetic Compatibility: Principles,

Measurements, Technologies and Computer Models, 2nd Ed., Wiley India Pvt. Ltd,

2010.

5. David Morgan, Handbook of EMC Testing and Measurements, IET Electrical

Measurement Series, 1994.

4

MECAE 202 ANALOG AND DATA CONVERSION SYSTEM

DESIGN L T P C

3 1 0 4

Module 1: MOS Switches and Switched Capacitor Circuits

General considerations; Sampling switches MOSFETs as switches, speed considerations,

precision considerations, charge injection cancellation; switched capacitor amplifiers

unity gain sampler / buffer, non inverting amplifier, precision multiply-by-two circuit;

switched capacitor integrator; switched capacitor common-mode feedback

Module 2: Comparators

Characterization of comparators; single pole comparators; two pole comparators;

improving the performance of comparators; comparators using hysteresis; discrete time

comparators; regenerative comparators; high speed comparators.

Module 3: Data Converter Fundamentals

Analog Vs Discrete time signals; converting analog signals to digital; Sample and Hold

circuits; SHA / THA performance parameters; Sample and Hold / Track and Hold

amplifiers; specifications of Digital-to-Analog converters; Specifications of Analog-to-

Digital converters; mixed signal layout issues; characteristics of op-amps used in data

converters.

Module 4: Data Converter Architecture

DAC architectures: Resistor-String DAC; Current-Steering DAC; Charge-Scaling DAC;

Cyclic DAC; Pipeline DAC.

ADC architectures: Flash ADC; Pipeline ADC; Integrating ADC; Successive

Approximation ADC; Oversampling ADC.

Implementation of DACs: R-2R topologies for DACs; current-mode and voltage-mode R-

2R DAC; wide-swing current-mode R-2R DAC.

References:

1. Behzad Razavi, Design of Analog CMOS Integrated Circuits, McGraw Hill Higher

Education, 2003.

2. Philip E. Allen & Douglas R. Holberg, CMOS Analog Circuit Design, 2nd Ed.,

Oxford University Press, 2009.

3. Franco S., Design with Operational Amplifiers and Analog Integrated Circuits, 3rd

Ed., McGraw Hill, 2002.

5

4. Jacob Baker R., CMOS: Circuit Design, Layout, and Simulation, Wiley, 2010.

5. David A. Johns & Ken Martin, Analog Integrated Circuit Design, Wiley India Pvt.

Ltd., 2008.

6

MECAE 203 HIGH SPEED DIGITAL SYSTEM DESIGN

L T P C

3 1 0 4

Module 1: Introduction to High Speed Digital Design

Frequency and time, Time and Distance; lumped vs distributed systems, kinds of

reactance, ordinary capacitance, ordinary inductance, mutual capacitance, mutual

inductance, power, speed

Module 2: Transmission lines

Transmission lines, problems in ordinary point to point wiring, infinite uniform

transmission line, ideal distortion less, lossless transmission line, lossy transmission line,

low loss transmission line, RC transmission line, skin effect, proximity effect, dielectric

loss

Module 3: Cross talk

High speed current follows the path of least inductance, crosstalk in solid ground planes,

crosstalk in slotted ground planes, crosstalk in cross hatched ground planes, crosstalk with

power and ground fingers, Guard traces, near end and far end crosstalk,

Module 4: Clock

Timing margin, clock skew, using low impedance drivers, using low impedance clock

distribution lines, source termination of multiple clock lines, controlling crosstalk on clock

lines, delay adjustments, clock jitter

References:

1. Howard Johnson & Martin Graham, High Speed Digital Design: A Handbook of

Black Magic, Prentice Hall, 1993.

2. Jan M. Rabaey, Anantha Chandrakasan & Borivoje Nikolic, Digital Integrated

Circuits: A Design Perspective, 2nd Ed. Pearson Education Asia, 2007.

3. K.C Chang, Digital Systems Design with VHDL and Synthesis: An Integrated

Approach, Wiley India ,2010.

4. William S. Dally & John W. Poulton, Digital Systems Engineering, Cambridge

University Press, 2008.

7

MECAE 204 RF MICROELECTRONICS L T P C

3 1 0 4

Module 1: Passive Components: Introduction, Inductors- printed inductors, wire

inductors resistors, capacitors, Monolithic capacitors, inter digital capacitors Via holes

and grounding.(No detailed analysis required)

Module 2: Lumped Element Circuits: Passive Circuits-filters, Hybrids and Couplers,

Power dividers/ Combiners, Matching Networks, Lumped Elements for biasing circuit

,Phase Shifters, Digital Attenuators.( No detailed analysis required)

Module 3: Microwave Integrated Circuit-fabrication technology

Introduction - Materials, Mask layout, Mask fabrication, Printed Circuit Boards- PCB

Fabrication, PCB Inductors. Microwave Printed Circuits - MPC fabrication. Hybrid

Integrated Circuits- Thin Film Technology, Thick film Technology- Coirfed Ceramic and

Glass ceramic Technology. MMIC Fabrication- Diffusion and Ion Implantation, Oxidation

and Film Deposition, Epitaxial Growth, Lithography, Etching and Photo Resist,

Deposition Methods, Steps Involved in the Fabrication of MOSFET, CMOS Fabrication,

Micromachining fabrication.

Module 4: Microstrip Overview

Introduction to Planar Transmission Line, Various types of planar transmission lines.

Analysis of Microstrip Lines: Method of Conformal Transformation, Variational method,

Numerical analysis. Losses in microstrip lines, Introduction to Slotline and Coupled

lines.

References:

1. Frank Ellinger, Radio Frequency Integrated Circuits and Technologies, Springer,

2007.

2. Inder Bahl, Lumped Elements for RF and Microwave Circuits, Artech House, 2003

3. Gupta K. C. & Amarjit Singh, Microwave Integrated Circuits" John Wiley & Sons,

1975.

4. Hoffman R. K., Handbook of Microwave Integrated Circuits, Artech House

Publishers, 1987.

5. I.D Robertson,C .Lucyszyn., RFIC and MMIC Design and Technology, The

Institution of Engineering and Technology,2001.

6. Leo G. Maloratsky, Passive RF & Microwave Integrated Circuits, Elsevier, 2004.

7. Joseph J. Carr, RF Components and Circuits, Newnes, 2002.

8

MECAE/MAESP 205 - 1 WIRELESS COMMUNICATION SYSTEMS L T P C

3 0 0 3

Module 1: Fading and Diversity

Wireless Channel Models: Path Loss and Shadowing Models, Statistical Fading Models,

Narrow Band and Wideband Fading Models.

Diversity: Time Diversity, Frequency and Space Diversity, Receive Diversity, Concept of

Diversity Branches and Signal Paths, Performance Gains; Combining Methods: Selective

Combining, Maximal Ratio Combining, Equal Gain Combining.

Module 2: Cellular Communication

Cellular Networks; Multiple Access: FDMA, TDMA, Spatial Reuse, Co-Channel

Interference Analysis, Hand-off, Erlang Capacity Analysis, Spectral Efficiency and Grade

of Service, Improving Capacity: Cell Splitting and Sectorization.

Module 3: Spread spectrum and CDMA

Motivation- Direct sequence spread spectrum- Frequency Hopping systems- Time

Hopping.- Anti-jamming- Pseudo Random (PN) sequence- Maximal length sequences-

Gold sequences- Generation of PN sequences.- Diversity in DS-SS systems- Rake

Receiver- Performance analysis. Spread Spectrum Multiple Access- CDMA Systems-

Interference Analysis for Broadcast and Multiple Access Channels- Capacity of cellular

CDMA networks- Reverse link power control- Hard and Soft hand off strategies.

Module 4: Fading Channel Capacity

Capacity of Wireless Channels- Capacity of flat and frequency selective fading channels-

Multiple Input Multiple output (MIMO) systems- Narrow band multiple antenna system

model- Parallel Decomposition of MIMO Channels- Capacity of MIMO Channels.

Cellular Wireless Communication Standards, Second generation cellular systems: GSM

specifications and Air Interface - specifications, IS 95 CDMA- 3G systems: UMTS &

CDMA 2000 standards and specifications

References:

1. Andrea Goldsmith, Wireless Communications, Cambridge University press, 2006.

9

2. Rappaport T. S., Wireless Communication, principles & practice, Prentice Hall of

India, 2002.

3. Simon Haykin & Michael Moher, Modern Wireless Communications, Person

Education, 2007.

4. Stuber G. L, Principles of Mobile Communications, 2nd Ed., Kluwer Academic

Publishers, 2001.

5. Andreas F .Molisch., Wireless Communication , 2nd Ed., John Wiley India,2012.

6. Peterson R. L, Ziemer R. E. & David E. Borth, Introduction to Spread Spectrum

Communication, Pearson Education, 1995.

7. Viterbi A. J., CDMA: Principles of Spread Spectrum, Addison Wesley, 1995.

10

MECAE 205 - 2 RF AND MICROWAVE NETWORK L T P C

3 0 0 3

Module1: Microwave Network Analysis

Equivalent Voltages and Currents, Concept of Impedance, Impedance description of

waveguide elements and circuits, One port circuits, Lossless one port termination.

Impedance and Admittance Matrices of Microwave Junctions, Even and odd properties of

impedance, N-port circuits, Symmetry of Impedance matrix. Two port junctions:

Scattering matrix formulation, Properties of Scattering matrix, Symmetry of scattering

matrix, Scattering matrix of Lossless junction. Scattering matrix of a two- port junction.

Transmission matrix representation; Voltage current matrix, wave amplitude matrix. S-

Matrix for E-Plane Tee Junction, S-Matrix for H-Plane Tee Junctions, Signal flow graph

Module 2: Analysis of Symmetrical Networks

Introduction, Magnitude Theorem For 2-Port Passive Lossless Circuits, Determinate

Theorem For 2-Port Passive Lossless Circuits, Simultaneous Conjugate Match Theorem

for A 2-Port Passive Lossless Circuit, Input and Output Matching Network Theorem,

Lumped-Element Matching Networks, Distributed-Element Matching Networks,

Bandwidth Considerations for Matching Networks,

Module 3: Power Dividers and Couplers

Basic properties of Dividers and Couplers; Three port junctions, Four port networks. T-

junction Power divider; lossless divider, resistive divider. Wilkinson Power Divider; Even

Odd mode analysis, N way Wilkinson power divider

Waveguide Directional Couplers: Bethe hole couplers, Design of multi hole couplers.

Quadrature hybrid Even and Odd mode Analysis. Coupled Line Directional Coupler:

Coupled Line theory, Design of Coupled Line Couplers. The Lange Coupler,1800 hybrid,

other couplers.

Module 4: Ferrimagnetic Components

Microwave Ferrites, Permeability Tensor, Wave Propagation in Ferrite Medium, Faraday

Rotation, Birefringence, Ferrite Loaded Waveguides, Ferrite Circulators, Isolators and

Phase Shifters.

11

References:

1. Robert E. Collin, Foundations for Microwave Engineering, 2nd Ed., McGraw Hill,

1992.

2. David M. Pozzar, Microwave Engineering, Wiley India, 2007.

3. Leo G Maloratsky, Passive RF & Microwave Integrated Circuits, Elsevier, 2004.

4. Hee-Ran Ahn, Asymmetric Passive Components in Microwave Integrated Circuits,

John Wiley & Sons, 2006.

5. M.L Edwards, Microwave & RF Circuits: Analysis, Design, Fabrication &

Measurement , Artech Book House 2001

6. Sorrentino R. & Bianchi G., Microwave and RF Engineering, John Wiley, 2010.

7. Joseph J. Carr, RF Components and Circuits , Newnes, 2002.

8. Guillermo Gonzalez, Microwave Transistor Amplifiers: Analysis and Design,

2nd

Ed., Prentice Hall, 1997.

9. Rajesh Mongia , Inder Bahl, Prakash Bhartia, RF Microwave Coupled Line

Circuits, Artech House Inc.

12

MECAE 205 - 3 DSP SYSTEM DESIGN L T P C

3 0 0 3

Module 1: Introduction

Need for Special Digital Signal Processors, Processor Trends: Von Newmann Vs. Harvard

Architecture, Architectures of Superscalar and VLIW Fixed and Floating Point Processors,

New Digital Signal Processing Hardware Trends, Selection of DS Processors.

Module 2: Typical DS Processor

Introduction to a Popular DSP from Texas Instruments (TMS330C6000 Series), CPU

Architecture, CPU Data Paths and Control, Internal Data / Program Memory. On Chip

Peripherals: Timers, Multi Channel Buffered Serial Ports, Extended Direct Memory

Access, Interrupts, Pipelining.

Module 3: Filter Design Techniques

Design Aspects: Introduction to the C6713 DSK, Code Composer Studio IDE, Matlab and

Basic Skills, Review of FIR Filtering: FIR Filter Design Techniques and Tools, Review of

IIR Filtering: IIR Filter Design Techniques and Tools, Sampling, Quantization and

Working with the AIC23 Codec, Writing Efficient Code: Optimizing Compiler, Effect of

Data Types and Memory Map: TMS320C6713 Assembly Language Programming:

Instructions Set And Addressing Modes, Linear Assembly.

Module 4: Current Trends

Current Trend in Digital Signal Processors: DSP Controllers, Architecture of

TMS320C28XX Series DSP and its Applications. Architecture Trends of Other Texas

Instruments DSP Processors, Analog Devices DS Processors: Introduction to Sharc / Tiger

Sharc / Blackfin Series, Other Major Vendors in the DSP Market and the Latest Trends.

References:

1. Online TI Materials for the TI C6713 DSK Board: http://www.ti.com

2. User's Manuals of Various Fixed and Floating Point DS Processors.

3. Naim Dahnoun, Digital Signal Processing Implementation Using the TMS320C6000

Processors, Prentice Hall, 2000.

4. Chassaing R., Digital Signal Processing and Applications With the C6713 and C6416

DSK, John Wiley & Sons, 2004.

13

5. Sen M. Kuo & Woon-Seng Gan, Digital Signal Processors: Architectures,

Implementations, and Applications, Pearson, 2005.

6. David J. De Fatta, Joseph G. Lucas & William S. Hodgkiss, Digital Signal

Processing: A System Design Approach, Wiley India, 2009.

7. Oppenheim A. V. & Schafer R. W., Discrete-Time Signal Processing, 2nd Ed.,

Prentice Hall, 1989.

8. John G. Proakis & Dimitris G. Manolakis, Digital Signal Processing: Principles,

Algorithms and Applications, 4th Ed., Pearson, 2007.

14

MECAE 205 - 4 ASIC AND SOC DESIGN L T P C

3 0 0 3

Module 1: Types of ASIC

Design Flow, Economics of Asics, ASIC Cell Libraries, CMOS Logic Cell Data Path

Logic Cells, I / O Cells, Cell Compilers.

Module 2: ASIC Library Design

Transistors as Resistors, Parasitic Capacitance, Logical Effort Programmable ASIC

Design Software: Design System, Logic Synthesis, Half Gate ASIC, ASIC Construction,

Floor Planning & Placement, Routing.

Module 3: System on Chip Design Process

A Canonical SoC Design, SoC Design Flow, Waterfall Vs. Spiral, Top-Down Vs.

Bottom-Up, Specification Requirements, Types of Specifications, System Design Process,

System Level Design Issues, Soft IP Vs. Hard IP, Design for Timing Closure, Logic

Design Issues, Physical Design Issues, Verification Strategy, On-Chip Buses and

Interfaces, Low Power, Manufacturing Test Strategies, MPSoCs, Techniques for

Designing MPSoCs.

Module 4: Soc Verification

Verification Technology Options, Verification Methodology, Verification Languages,

Verification Approaches, and Verification Plans. System Level Verification, Block Level

Verification, Hardware / Software Co-Verification, and Static Net List Verification.

References:

1. Michael John Sebastian Smith, Application Specific Integrated Circuits, Pearson

Education India, 2008.

2. Farzad Nekoogar , Faranak Nekoogar & Jeffrey Ebert, From ASICs to SOCs: A

Practical Approach, Prentice Hall, 2003.

15

Module I

Information Theoretic aspects of MIMO : Review of SISO fading communication

channels, MIMO channel models, Classical i.i.d. and extended channels, Frequency

selective and correlated channel models, Capacity of MIMO channels, Ergodic and outage

capacity, Capacity bounds and Influence of channel properties on the capacity.

Module II

MIMO Diversity and Spatial Multiplexing : Sources and types of diversity, analysis

under Rayleigh fading, Diversity and channel knowledge. Alamouti space time code,

MIMO spatial multiplexing. Space time receivers. ML, ZF, MMSE and Sphere decoding,

BLAST receivers and Diversity multiplexing trade-off.

Module III

Space Time Block Codes : Space time block codes on real and complex orthogonal

designs, Code design criteria for quasi-static channels (Rank, determinant and Euclidean

distance), Orthogonal designs, Generalized orthogonal designs, Quasi-orthogonal designs

and Performance analysis.

Module IV

Space Time Trellis Codes : Representation of STTC, shift register, generator matrix,

state-transition diagram, trellis diagram, Code construction, Delay diversity as a special

case of STTC and Performance analysis.

References:

1. David Tse and Pramod Viswanath, Fundamentals of Wireless Communication,

Cambridge University Press 2005

2. Hamid Jafarkhani, Space-Time Coding: Theory and Practice, Cambridge

University Press 2005

3. Paulraj, R. Nabar and D. Gore, Introduction to Space-Time Wireless

Communications, Cambridge University Press 2003

4. E.G. Larsson and P. Stoica, Space-Time Block Coding for Wireless

Communications, Cambridge University Press 2008

5. Ezio Biglieri, Robert Calderbank et al MIMO Wireless Communications

Cambridge University Press 2007

MECAE /CE/EC/CI206-1 MIMO COMUUNICATION

SYSTEMS

L T P C

3 0 0 3

16

MECAE 206 - 2 RF ANTENNA THEORY L T P C

3 0 0 3

Module 1: Microstrip Radiators

Introduction; Advantages and Limitations of Microstrip Antenna, Radiation Mechanism

of a Microstrip Antenna, Various Microstrip Antenna Configurations, Microstrip Patch

Antenna, Printed Dipole Antenna, Printed Slot Antenna, Feeding Techniques and

Modeling, Coaxial Feed / Probe Coupling, Microstrip (Coplanar) Feed, Proximity Coupled

Microstrip Feed, Aperture Coupled Microstrip Feed, Coplanar Waveguide Feed, Radiation

Fields.

Module 2: Rectangular Microstrip Antenna

Introduction; Models of Rectangular Patch Antenna, Transmission Line Model Analysis ,

Cavity Model Analysis, Design Considerations of Rectangular Patch Antenna, Substrate

Selection, Element Width and Length, Radiation Pattern and Radiation Resistance, Loss

Factor, Bandwidth, Radiation Efficiency, Feed Location and Polarization.

Module 3: Circular Microstrip Antenna

Introduction; Analysis of a Circular Disk Microstrip Antenna Using Cavity Model, Design

Considerations: Substrate Selection, Radiation Pattern, Quality Factor and Impedance

Bandwidth, Feed Point Location and Polarization.

Module 4: A. Broad Banding of Microstrip Antennas

Introduction; Effect of Substrate Parameters on Bandwidth, Selection of Suitable Patch

Shape, Selection of Suitable Feeding Technique, Aperture-Coupled Microstrip Antenna.

B. Compact Microstrip Antennas

Introduction; Use of a Shorted Patch with a Thin Dielectric Substrate, Use of a Meandered

Patch, Use of a Meandered Ground Plane, Use of a Planar Inverted-L Patch, Use of an

Inverted U-Shaped or Folded Patch.

References:

1. Bhartia P., Inder Bahl, Garg R. & Ittipiboon A., Microstrip Antenna Design

Handbook, Artech House Publishers, 2001.

2. Kin-Lu Wong, Compact and Broadband Microstrip Antennas, 1st Ed., Wiley-Inter

science, 2002.

17

3. Fang D.G., Antenna Theory and Microstrip Antennas, CRC Press, 2009.

4. Simon R. Saunders & Alejandro Aragon-Zavala, Antennas and Propagation for

Wireless Communication System, John Wiley & Sons, 2007.

5. Robert S Elliot., Antenna Theory and Design, John Wiley & Sons, 2006.

6. Constantine A Balanis., Modern Antenna Handbook, Wiley ,2011.

18

MECAE 206 - 3 DETECTION AND TRACKING SYSTEMS L T P C

3 0 0 3

Module 1: Reception in White Noise

Introduction, The Active Radar or Sonar Signal, Physical Interpretation, Passive Listening,

Optimum Reception in White Noise: Principle, Estimation of a Parameter, Simultaneous

Estimation of Several Parameters, Optimum Detection, Optimum Receiver, Optimum

Detector, The Ambiguity Function, Detection Performance.

Module 2: Reception in Colored Noise

Optimum Reception in Colored Noise, Receiver Structure, Application to Spurious Echoes

or Jammers, Stationary Colored Noise and Infinite Observation Time, Adaptive

Processing, Adaptive Filtering using a Transversal Filter, Adaptive Whitening, Sensor

Arrays, Space-time Processing, Passive Listening, MUSIC.

Module 3: Tracking

Modeling Detection and Tactical Decision Aids, Cumulative Probability of Detection,

Tracking Target Motion Analysis and Localization, Design and Evaluation of Sonars and

Radars.

Module 4: Digital Sonar System

Design of Digital Sonar: Implementation Method of Various Function of Digital Sonar,

System Simulation Technique in Digital Sonar Design, Examples of Typical Modern

Digital Sonar.

References:

1. Franois Le Chevalier, Principles of Radar and Sonar Signal Processing, Artech,

2002.

2. Richard P. Hodges, Underwater Acoustics: Analysis, Design and Performance of

Sonar, Wiley, 2010.

3. Li Qihu, Digital Sonar Design in Underwater Acoustics, Springer, 2011.

4. Samuel S. Blackman & Robert Popoli, Design and Analysis of Modern Tracking

Systems, Artech, 1999.

19

MAE 206 - 4 EMBEDDED NETWORK DESIGN L T P C

3 0 0 3

Module I

Embedded Networking Requirements: Introduction to Network for Embedded Systems,

Introduction to buses and protocols for embedded networking: CAN Bus, I2C, SPI, USB,

Ethernet protocol, TCP/IP Protocol, Internet connectivity over an Ethernet connection,

Wireless - Bluetooth, ZigBee standard.

Module II

Controller Area Network : CAN Overview, Introduction, CAN 2.0b Standard (covering

Physical Layer, Message Frame Formats, Bus Arbitration, Message Reception and

Filtering, Error Management), Selecting a CAN Controller, CAN Development Tools,

Evaluating system requirements choosing devices and tools, Configuring single devices,

Overall network configuration, Network simulation, Network Commissioning.

Module III

TCP/IP: TCP/IP: Introduction to TCP/IP: History, Architecture, Standards and

Applications, TCP/IP Architecture: Layering, Protocol Overview, Routers & Topology, IP

routing, TCP Architecture, UDP Architecture, Security Concepts.

ZigBee: Introduction, Comparison with Bluetooth, Short range wireless networking

classes, Zigbee & IEEE802.15.4 standard, Operating frequencies, data rate,

interoperability, Device types, Topologies, Communication basics, Association and

Disassociation, binding, Self-forming and self-healing characteristics, Networking Layer

functions, ZigBee gateway, Zigbee Metaphor.

Module IV: Programming for Embedded Systems

Pointers and Memory Mapping in Operating System: C Internals, RTOS: OS Basics.

Real Time OS Kernel Architecture, Scheduling Algorithms: Priority Based, Shortest Job

First, Round-Robin, FIFO. Task Synchronization: Mutual Exclusion, Semaphores.

Embedded Operating Systems, Mobile Operating Systems, Porting RTOS or EOS on a

Hardware Platform.

References:

1. Lyla B Das, Embedded Systems-An Integrated Approach, Pearson, 2012.

20

2. Olaf P Feiffer, Andrew Ayre & Christian Keyold, Embedded Networking with

CAN and CAN Open, Embedded System Academy 2005.

3. Marco Di Natale, Haibo Zeng, Paolo Giusto & Arakadeb Ghosal, Understanding

and Using the Controller Area Network ,Springer, 2012.

4. John Catsoulis, Designing Embedded Hardware, O'Reilly Media, Inc., 2002

5. NXP Semiconductors, I2C-bus Specification and User Manual , Rev. 5, October

2012. (Available at http://www.nxp.com/documents/user_manual/UM10204.pdf)

6. Motorola Inc., S12SPIV3/D:SPI Block Guide V03.06, Feb 2003, (Available at

http://www.ee.nmt.edu/~teare/ee308l/datasheets/S12SPIV3.pdf)

7. Dr. Sidnie Feit, TCP/IP : Architectures, Protocols and Implementations with IPv6

and IP Security, Tata McGraw Hill, Second Edition, 2008.

8. Martin W. Murhammer, Orcun Atakan, Stefan Bretz,Larry R. Pugh, Kazunari

Suzuki, David H. Wood, TCP/IP Tutorial and Technical Overview, International

Technical Support Organization-IBM, Sixth Edition ,October 1998.

9. Wayne Wolf, Computers as Components: Principles of Embedded Computing

System Design, Morgan Kaufman Publishers, 2008.

21

MECAE 207 ELECTRONIC SYSTEM DESIGN LAB -II L T P C

0 0 3 2

System simulation experiments based on the courses MECAE 201, MECAE 202,

MECAE 203, MECAE 204 and the elective courses opted by the student in the second

semester.

MECAE 208 SEMINAR II L T P C

0 0 2 1

Each student shall present a seminar on any topic of interest related to the core / elective

courses offered in the second semester of the M. Tech. Programme. He / she shall select

the topic based on the references from international journals of repute, preferably IEEE

journals. They should get the paper approved by the Programme Co-ordinator / Faculty

member in charge of the seminar and shall present it in the class. Every student shall

participate in the seminar. The students should undertake a detailed study on the topic and

submit a report at the end of the semester. Marks will be awarded based on the topic,

presentation, participation in the seminar and the report submitted.