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COMPLETE TEARDOWN WITH: Detailed Photos Precise Measurements Material Analysis Manufacturing Process Supply Chain Evaluation Manufacturing Cost Analysis Selling Price Estimation Advanced Driver Assistance Systems (ADAS) market is predicted to grow with an impressive CAGR of 19.2% from 2014 to 2020 according to Transparency Market Research. In this highly competitive market, Mobileye is currently the leader of Camera-based Advanced Driver Assistance Systems (ADAS). Mobileye EyeQ3® Automotive Vision-Based SoC Title: Mobileye IC Processor Pages: 55 Date: April 2015 Format: pdf + xls PRICE : Full report: EUR 2,490 Technology report: EUR 1,490 3 rd Generation Mobileye Processor For Vision Based Driver Assistance Systems This full Reverse Costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Mobileye EyeQ3® processor. Mobileye has products currently available in 160 car models from 18 original equipment manufacturers (OEM) including General Motors, Nissan, BMW and Honda. After releasing the EyeQ1® processor in 2007 and the EyeQ2® processor in 2010, Mobileye just launched in the fourth quarter of 2014 the EyeQ3® processor which offers 6 times the processing capability of the EyeQ2®. EyeQ3® supports now, in addition to the previous chips, full braking AEB, structure from motion functionalities, road profile reconstruction, debris detection, general object detection, and traffic light detection.

Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

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Page 1: Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

COMPLETE TEARDOWN WITH:

• Detailed Photos

• Precise Measurements

• Material Analysis

• Manufacturing Process

• Supply Chain Evaluation

• Manufacturing Cost Analysis

• Selling Price Estimation

Advanced Driver Assistance Systems (ADAS)market is predicted to grow with an impressiveCAGR of 19.2% from 2014 to 2020 according toTransparency Market Research. In this highlycompetitive market, Mobileye is currently theleader of Camera-based Advanced DriverAssistance Systems (ADAS).

Mobileye EyeQ3®Automotive Vision-Based SoC

Title: Mobileye IC ProcessorPages: 55Date: April 2015Format: pdf + xls

PRICE : Full report: EUR 2,490Technology report: EUR 1,490

3rd Generation Mobileye Processor For Vision Based Driver Assistance Systems

This full Reverse Costing study has been conducted to provide insight ontechnology data, manufacturing cost and selling price of the MobileyeEyeQ3® processor.

Mobileye has products currently available in 160 car models from 18original equipment manufacturers (OEM) including General Motors, Nissan,BMW and Honda.

After releasing the EyeQ1® processor in 2007 and the EyeQ2® processor in2010, Mobileye just launched in the fourth quarter of 2014 the EyeQ3®processor which offers 6 times the processing capability of the EyeQ2®.

EyeQ3® supports now, in addition to the previous chips, full braking AEB,structure from motion functionalities, road profile reconstruction, debrisdetection, general object detection, and traffic light detection.

Page 2: Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

Performed by

TABLE OF CONTENTS

Overview / Introduction

Mobileye Company Profile

Physical Analysis

• Physical Analysis Methodology

• Package

Package View & Dimensions

Package Opening

Package Cross-Section

• Die

Die View & Dimensions

Main Blocks Identification

Die Marking

Die Process

Die Cross-Section

Process Characteristics

Cost Analysis

• Hypotheses

Component Summary

Front-End Summary

Wafer Fabrication Unit

Back-End: Probe Test,

Bumping, Backgrinding &

Dicing

Back-End: Package Assembly

Back-End: Final Test

• Cost Analysis

Yields Synthesis

Unprobed Wafer Cost

Die Cost

Packaging Cost

Final Test Cost

Component Cost

Estimated Price Analysis

• Mobileye Financial Results

• Component Selling Price

ANALYSIS PERFORMED WITH OUR COSTING TOOL

Author:Sylvain Hallereau

Author (Lab):Yvon Le Goff

Biography: Sylvain is in charge of costing analyses for IC, Power and LEDs. He has significant experience in the modeling of manufacturing costs for electronics components.

Biography: Yvon is the laboratory manager. He has deep knowledge in chemical & physical technical analyses. He previously worked for 25 years in Atmel Nantes Laboratory.

IC Price+System Plus Consulting has developed a powerful costing tool to evaluate the production cost & selling price of any Integrated Circuit:- ASICs, - microcontrollers, - DSP, memories, - smartpower…

IC Price+ performs the necessary cost simulations to make strategic decisions.

A smart and powerful tool for: - marketing and purchasing

department.- Senior technologists and

project leaders

IC Price+

Page 3: Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

Freescale FXTH87Tire Pressure Monitoring Sensor

(TPMS)

Bosch SMI1306-Axis Automotive MEMS IMU

Apple iPhone 6 & 6 PlusRear & Front Camera Modules

The TPMS solution featuring the smallest footprint and lowest RF power consumption

Bosch’s first 6-Axis IMU for Automotive Application.

Discover the innovations in the camera modules of Iphone 6 & 6 Plus

Pages: 150Date: January 2015

Full report: EUR 2,990*

Pages: 175Date: March 2015

Full report: EUR 2,990*

Pages: 230Date: November 2014

Full report: EUR 3,490*

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RELATED REPORTS

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You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports.

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Each report provides at least a complete teardown of the device.See below, topics considers for 2015:

• MEMS & sensors (20 reports): • Gyros/Accelerometers/IMU, • Oscillators/RF switches,• Pressure/Microphones

• Power Electronics & Systems (10 reports): • GaN and SiC devices, • Inverters & modules

Each year, System Plus Consulting releases a comprehensive collection of new reverse engineering &costing analysis in various domains.

• Imaging and LEDs (5 reports): • Camera modules, • Infrared sensors and cameras,

LEDs

• Advanced Packaging (5 reports): • WLP, • TSV, • Embedded Devices…

Page 4: Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

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Page 5: Mobileye EyeQ3® Automotive Vision-Based SoC · Date: January 2015 Full report: EUR 2,990* Pages: 175 Date: March 2015 Full report: EUR 2,990* Pages: 230 Date: November 2014 Full

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