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Mobile Intel® Pentium® 4 Processor-M Datasheet

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  • Mobile Intel Pentium 4 Processor-MDatasheet

    June 2003

    Order Number: 250686-007

  • 2 Mobile Intel Pentium 4 Processor-M Datasheet

    Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Information contained herein supersedes previously published specifications on these devices from Intel.

    Actual system-level properties, such as skin temperature, are a function of various factors, including component placement, component power characteristics, system power and thermal management techniques, software application usage and general system design. Intel is not responsible for its customers' system designs, nor is Intel responsible for ensuring that its customers' products comply with all applicable laws and regulations. Intel provides this and other thermal design information for informational purposes only. System design is the sole responsibility of Intel's customers, and Intel's customers should not rely on any Intel-provided information as either an endorsement or recommendation of any particular system design characteristics.

    Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intels Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

    Intel may make changes to specifications and product descriptions at any time, without notice.

    Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

    The Mobile Intel Pentium 4 Processor-M may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

    Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

    Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725 or by visiting Intels Website at http://www.intel.com

    Copyright Intel Corporation 2000-2003.

    Intel, Pentium, Intel NetBurst, and SpeedStep are registered trademarks or trademarks of Intel Corporation and its subsidiaries in the United States and other countries.

    * Other brands and names are the property of their respective owners.

  • Contents1. Introduction.........................................................................................................................9

    1.1 Terminology.........................................................................................................111.2 References ..........................................................................................................11

    2. Electrical Specifications....................................................................................................132.1 System Bus and GTLREF...................................................................................132.2 Power and Ground Pins ......................................................................................132.3 Decoupling Guidelines ........................................................................................13

    2.3.1 VCC Decoupling .....................................................................................142.3.2 System Bus AGTL+ Decoupling.............................................................142.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................14

    2.4 Voltage Identification and Power Sequencing.....................................................152.4.1 Enhanced Intel SpeedStep Technology............................................162.4.2 Phase Lock Loop (PLL) Power and Filter...............................................172.4.3 Catastrophic Thermal Protection............................................................18

    2.5 Signal Terminations, Unused Pins and TESTHI[10:0] ........................................182.6 System Bus Signal Groups .................................................................................202.7 Asynchronous GTL+ Signals...............................................................................222.8 Test Access Port (TAP) Connection....................................................................222.9 System Bus Frequency Select Signals (BSEL[1:0])............................................222.10 Maximum Ratings................................................................................................232.11 Processor DC Specifications...............................................................................232.12 AGTL+ System Bus Specifications .....................................................................342.13 System Bus AC Specifications ............................................................................352.14 Processor AC Timing Waveforms .......................................................................40

    3. System Bus Signal Quality Specifications........................................................................513.1 System Bus Clock (BCLK) Signal Quality Specifications and Measurement

    Guidelines ...........................................................................................................513.2 System Bus Signal Quality Specifications and Measurement Guidelines...........523.3 System Bus Signal Quality Specifications and Measurement Guidelines...........55

    3.3.1 Overshoot/Undershoot Guidelines .........................................................553.3.2 Overshoot/Undershoot Magnitude .........................................................553.3.3 Overshoot/Undershoot Pulse Duration...................................................553.3.4 Activity Factor.........................................................................................563.3.5 Reading Overshoot/Undershoot Specification Tables............................563.3.6 Conformance Determination to Overshoot/Undershoot Specifications ..57

    4. Package Mechanical Specifications .................................................................................614.1 Processor Pin-Out ...............................................................................................64

    5. Pin Listing and Signal Definitions .....................................................................................675.1 Mobile Intel Pentium 4 Processor-M Pin Assignments........................................675.2 Alphabetical Signals Reference ..........................................................................81

    6. Thermal Specifications and Design Considerations.........................................................896.1 Thermal Specifications ........................................................................................90Mobile Intel Pentium 4 Processor-M Datasheet 3

  • Mobile Intel Pentium 4 Processor-M6.1.1 Thermal Diode........................................................................................ 906.1.2 Thermal Monitor ..................................................................................... 91

    7. Configuration and Low Power Features........................................................................... 937.1 Power-On Configuration Options ........................................................................ 937.2 Clock Control and Low Power States.................................................................. 93

    7.2.1 Normal State .......................................................................................... 937.2.2 AutoHALT Powerdown State ................................................................. 937.2.3 Stop-Grant State .................................................................................... 947.2.4 HALT/Grant Snoop State ....................................................................... 957.2.5 Sleep State............................................................................................. 957.2.6 Deep Sleep State ................................................................................... 957.2.7 Deeper Sleep State ................................................................................ 96

    7.3 Enhanced Intel SpeedStep Technology.............................................................. 96

    8. Debug Tools Specifications..............................................................................................978.1 Logic Analyzer Interface (LAI) ............................................................................ 97

    8.1.1 Mechanical Considerations .................................................................... 978.1.2 Electrical Considerations........................................................................ 974 Mobile Intel Pentium 4 Processor-M Datasheet

  • Figures1 VCCVID Pin Voltage and Current Requirements ................................................152 Typical VCCIOPLL, VCCA and VSS

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